CN110418998A - Liquid crystal display, the method and projection display equipment for manufacturing liquid crystal display - Google Patents

Liquid crystal display, the method and projection display equipment for manufacturing liquid crystal display Download PDF

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Publication number
CN110418998A
CN110418998A CN201880017379.3A CN201880017379A CN110418998A CN 110418998 A CN110418998 A CN 110418998A CN 201880017379 A CN201880017379 A CN 201880017379A CN 110418998 A CN110418998 A CN 110418998A
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liquid crystal
layer
oxide layer
substrate
crystal display
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CN201880017379.3A
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CN110418998B (en
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八木宽雄
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Sony Corp
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Sony Corp
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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1337Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers

Abstract

Liquid crystal display in accordance with one embodiment of the present disclosure is provided with a pair of of substrate, is arranged as facing with each other;Liquid crystal layer is arranged in this between substrate;Inorganic oxide layer, be arranged in liquid crystal layer and this between at least one substrate in substrate;Silane coupling layer is arranged between liquid crystal layer and inorganic oxide layer;And metal oxide layer, it is arranged between inorganic oxide layer and silane coupling layer.

Description

Liquid crystal display, the method and projection display equipment for manufacturing liquid crystal display
Technical field
This disclosure relates to it is a kind of for such as liquid crystal display of projection liquid crystal projector, manufacture the liquid crystal display Method and projection display equipment including the liquid crystal display.
Background technique
Liquid crystal apparatus for projection liquid crystal projector requires high reliability.In order to improve the reliability of liquid crystal apparatus, lead to It is effective for crossing using alignment films (inorganic alignment film) the Lai Tigao light resistance for including inorganic material.However, for example, inorganic alignment The silica for including in film has very strong hygroscopicity, and wet inorganic alignment film leads to occur leakage current in pixel.
In order to solve this problem, for example, it includes making inorganic take using silane coupled material that patent document 1, which discloses one kind, The liquid crystal cells of surface treatment are subjected to film.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent application discloses No. 2010-170036
Summary of the invention
Incidentally, from the perspective of reliability, the moisture resistance of liquid crystal apparatus (liquid crystal display) is needed to be improved.
Be intended to provide it is a kind of allow to improve moisture resistance liquid crystal display, manufacture liquid crystal display method, with And projection display equipment.
Liquid crystal display according to embodiment of the present disclosure includes: a pair of of substrate, opposite to each other;Liquid crystal layer, insertion This between substrate;Inorganic oxide layer, be inserted in liquid crystal layer and this between at least one substrate in substrate;Silane is even Join layer, is inserted between liquid crystal layer and inorganic oxide layer;And metal oxide layer, it is inserted in inorganic oxide layer and silane Between coupling layer.
Method according to the manufacture liquid crystal display of embodiment of the present disclosure includes: at this at least one in substrate Inorganic oxide layer is formed on a substrate;Metal oxide layer is formed on inorganic oxide layer;The shape on metal oxide layer At silane coupling layer;Be by a substrate and another substrate arranged it is relative to each other, gap is therebetween;And it is formed in gap Liquid crystal layer.
Projection display equipment according to embodiment of the present disclosure includes: light source;It is set according to the liquid crystal display of embodiment Standby includes light of the modulation from light source and the pixel region for emitting light corresponding with picture;And it is defeated based on liquid crystal display The projecting lens of light projection picture out.
In the liquid crystal display according to embodiment of the present disclosure, the manufacture liquid crystal according to embodiment of the present disclosure Show the method for equipment and according in the projection display equipment of embodiment of the present disclosure, metal oxide layer is arranged in inorganic oxygen In compound layer, inorganic oxide layer is arranged at least one substrate in a pair of of substrate relative to each other, and liquid crystal layer is between this To between substrate, then silane coupling layer is arranged on metal oxide layer.Inorganic oxide is set up directly on silane coupling layer It is compared on the surface of nitride layer, this can form stronger key between inorganic oxide layer and silane coupling layer.
According to the liquid crystal display of embodiment of the present disclosure, the liquid crystal display of manufacture embodiment of the present disclosure Method and embodiment of the present disclosure projection display equipment, silane coupling layer by metal oxide layer be arranged inorganic On oxide skin(coating), inorganic oxide layer is arranged at least one substrate in a pair of substrate relative to each other, liquid crystal layer between This is between substrate.This can form strong bond between inorganic oxide layer and silane coupling layer.Change it is, therefore, possible to provide having The liquid crystal display of kind moisture resistance and projection display equipment including liquid crystal display.
It it should be noted that said effect needs not be restrictive, and may include any effect described in the disclosure.
Detailed description of the invention
Fig. 1 is the schematic sectional view according to the configuration of the liquid crystal display of embodiment of the present disclosure.
Fig. 2 is to show the flow chart of the sequence of the step in the method for liquid crystal display shown in manufacture Fig. 1.
Fig. 3 A is schematic sectional view of the description manufacture according to the method for the liquid crystal display of the disclosure.
The schematic sectional view for the step of Fig. 3 B is after Fig. 3 A.
The schematic sectional view for the step of Fig. 3 C is after Fig. 3 B.
The schematic sectional view for the step of Fig. 3 D is after Fig. 3 C.
Fig. 4 is that the illustrative of the stacked structure of alignment films, metal oxide layer shown in Fig. 1 and silane coupling layer is shown Figure.
Fig. 5 is the schematic sectional view according to the configuration of the liquid crystal display of the variation example of the disclosure.
Fig. 6 is shown including the example according to the overall arrangement of the projection display equipment of the liquid crystal display of the disclosure.
Fig. 7 is shown including another reality according to the overall arrangement of the projection display equipment of the liquid crystal display of the disclosure Example.
Specific embodiment
Hereinafter, embodiment of the present disclosure is described in detail with reference to the accompanying drawings.Being described below is only the specific of the disclosure The example and disclosure should not be limited to following implemented.In addition, the present disclosure is not limited to the arrangement of each component shown in the accompanying drawings, Size, space proportion etc..It should be noted that providing description in the following order.
1, the embodiment (example of liquid crystal display, wherein silane coupling layer is arranged on alignment films, metal oxygen Compound layer is therebetween)
The configuration of 1-1, liquid crystal display
1-2, the method for manufacturing liquid crystal display
1-3, operation and effect
2, variation example (example of reflective liquid crystal display device)
3, application examples
4, operation example
<1, embodiment>
(configuration of 1-1, liquid crystal display)
Fig. 1 is schematically shown according to the liquid crystal display (liquid crystal display 1) of embodiment of the present disclosure Cross-sectional configurations.For example, liquid crystal display 1 is used as projection display equipment (the Projection Display dress of all projectors as described below 3 are set, referring to Fig. 6) liquid crystal light valve (for example, light modulation device 141R).For example, liquid crystal display 1 has following configuration: as Opposite to each other, liquid crystal layer 30 is therebetween for plain circuit substrate 11 and counter substrate 21, alignment films 12 and 22 (inorganic oxide layer), Metal oxide layer 13 and 23 and silane coupling layer 14 and 24 are between pixel circuit substrate 11 and liquid crystal layer 30 and opposed base It is stacked in this order between plate 21 and liquid crystal layer 30 from respective substrate-side (pixel circuit substrate 11 and counter substrate 21).
E.g., including the pixel circuit layer of transistor is arranged in pixel circuit substrate 11 with transparent substrates liquid crystal layers 30 In opposite surface side, and for example, pixel electrode is arranged on pixel circuit layer for each pixel (had both been not shown pixel electricity Road floor, is also not shown pixel electrode).Pixel electrode is electrically coupled to transistor, and the setting of alignment films 12 is on the pixel electrode.Though It is so not shown, for example, the surface opposite with liquid crystal layer 30 that polarization plates are bonded to the substrate of composition pixel circuit substrate 11 is opposite Surface.It is placed (outside it should be noted that peripheral circuit used to drive pixels is formed in the outer of the pixel region of pixel circuit substrate 11 Enclose region (not shown)).
For example, although it is not shown, the counterelectrode that all pixels share counter substrate 21 is set with transparent substrates In the opposite surface side of liquid crystal layer 30.Alignment films 22 are arranged on a counter electrode.Although it is not shown, for example, polarization plates are bonded to group At the opposite surface in the surface opposite with liquid crystal layer 30 of the substrate of counter substrate 21.
For example, composition pixel circuit substrate 11 and the corresponding substrate of counter substrate 21 are respectively by including quartz, glass etc. Light transmission transparent substrate configuration.It should be noted that pixel circuit substrate 11 may be not necessarily transparent substrate.Pixel circuit substrate 11 Can have this configuration: pixel circuit and reflector are arranged on the substrate including silicon etc..For example, pixel electrode and counterelectrode It may include the conductive material of light transmission.The specific example of this material includes tin indium oxide (ITO).For example, polarization plates include poly- second Enol (PVA), iodine (I) compound molecule is adsorbed and is orientated in polyvinyl alcohol.
For example, alignment films 12 and alignment films 22 respectively include inorganic material, such as silica (SiO2), diamond-like and Aluminium oxide (Al2O3) film.For example, the film thickness that alignment films 12 and alignment films 22 are preferably respectively 50 μm to 250 μm with range.
Metal oxide layer 13 and metal oxide layer 23 be used to respectively between alignment films 12 and silane coupling layer 14 and Strong bond (for example, covalent bond) is formed between alignment films 22 and silane coupling layer 24.Specifically, metal oxide layer 13 and metal oxygen Compound layer 23 is bonded to the hydroxyl (- OH) in the surface of corresponding alignment films 12 and 22, is generated on the surface than 12 He of alignment films The more active hydroxyl of corresponding hydroxyl in 22, reacts hydroxyl with silane coupling agent, and even in alignment films 12 and silane Key is formed between alignment films 22 and silane coupling layer 24 between connection layer 14, corresponding metal oxide layer 13 and 23 is located at it Between.Metal oxide layer 13 and metal oxide layer 23 respectively include translucent material.The specific example of translucent material includes metal Oxide, such as aluminium oxide (Al2O3), hafnium oxide (HfO2), zirconium oxide (ZrO2) and tantalum oxide (Ta2O5).Metal oxide layer 13 preferably have for example, 5nm film thickness below.More specifically, the film thickness ranges preferably from an atomic layer to ten Atomic layer.One reason is to maintain the roughness on the surface of alignment films 12 and alignment films 22.For example, this metal oxide layer 13 It is preferred that being formed by atomic layer deposition (ALD) method.For alignment films 12, for example, SiO2Through inclined deposition in a manner of column It is stacked on pixel circuit substrate 11, and since its surface shape leads to that LC tilt is presented, however its details is described below. ALD method allows to be formed the metal oxide layer 13 with very small film thickness, therefore is easier to maintain the table of alignment films 12 Face shape.Therefore, in the case where executing tropism control using another method, metal oxide layer 13 may have big film thickness Degree.It should be noted that the film quality of metal oxide layer 13 and metal oxide layer 23 is not particularly limited, and it can have example Such as, the defect of such as pin hole.
Silane coupling layer 14 and silane coupling layer 24 are used to improve respectively the moisture resistance of alignment films 12 and alignment films 22.Silane Coupling layer 14 and silane coupling layer 24 respectively include the silane coupled material being orientated.The example of silane coupled material includes following The compound that general formula (1) indicates.Silane coupling layer 14 and silane coupling layer 24 pass through metal oxide layer 13 and metal oxygen respectively Compound layer 23 and alignment films 12 and alignment films 22 form covalent bond.Silane coupling layer 14 and silane coupling layer 24 respectively include one The film of molecular layer, and for example, even if the film in a molecular layer is not covered with metal oxide layer 13 and metal oxide It also effectively works in the case where the whole surface of each of layer 23.On the contrary, silane coupling layer 14 and silane coupling layer 24 are intended to become uneven when being formed as thicker.Therefore, it is desirable to each in silane coupling layer 14 and silane coupling layer 24 A thickness that is formed as is up to several molecular layers or less.Specifically, for example, thickness is preferably 5nm or less.
X is methoxyl group (- OCH3), ethyoxyl (- OC2H5), chlorine atom (Cl) and amino (- NH2Any one of);B and C Each of be individually methoxyl group (- OCH3), ethyoxyl (- OC2H5), chlorine atom (Cl) and amino (- NH2) in any Kind, or respectively with any one of alkyl, alkenyl and the alkoxy of one to three carbon atom;And A is that respectively have 6 To any one of the alkyl, alkenyl and alkoxy of 20 carbon atoms, except the carbochain both ends of composition alkyl, alkenyl and alkoxy Carbon atom other than the base that is substituted with an oxygen of carbon atom, or at least one or more hydrogen of composition alkyl, alkenyl and alkoxy The base that atom is substituted with halogen atoms.
For example, liquid crystal layer 30 may include various types of liquid crystal, such as vertically oriented (VA) liquid crystal, twisted-nematic (TN) liquid Brilliant or plane conversion (IPS) liquid crystal, and for example shown with normally black mode or Chang Bai (NW) mode.For example, liquid crystal layer 30 It is sealed using thermosetting sealing material or UV solidification sealing material, for by the side of pixel circuit substrate 11 and counter substrate 21 engagement sides are together.The sealing material of liquid crystal display is commercially available to be used for liquid crystal display.As for liquid crystal layer 30, pixel 11 side of circuit substrate and 21 side of counter substrate are bonded together using sealing material, are then poured into liquid crystal, and utilize such as UV Curing sealant encapsulated liquid crystals.Alternatively, for example, liquid crystal layer 30 can be formed by formula injection method (ODF) processing of dripping.
(1-2, the method for manufacturing liquid crystal display)
For example, liquid crystal display 1 according to the present embodiment can manufacture as described below.Fig. 2 shows manufacture liquid crystals Show the process of the step in the method for equipment 1.Fig. 3 A to Fig. 3 D schematically shows the liquid crystal display 1 in each step Section.
Firstly, forming alignment films on pixel circuit substrate 11 for example, by inclined deposition as shown in fig. 3a 12, for example, being each pixel setting transistor and pixel electrode (step S101) on pixel circuit substrate 11.Specifically, shape At with for example, film thickness is the SiO of 100nm2Film, the film are horizontally arranged to be with such as 40 ° to 70 ° of angle tilt 0°。
Next, forming metal oxide layer 13 (step S102) in alignment films 12 as shown in figure 3b.Specifically Ground, for example, forming the Al with such as five atomic layers in alignment films 12 for example, by ALD method2O3Film.It should be noted that metal Oxide skin(coating) 13 is preferably formed by ALD method.However, it is, for example, possible to use chemical vapor deposition (CVD) method or sputters Form metal oxide layer 13.In order to keep the surface shape of alignment films 12, metal oxide layer 13 is preferably thin.However, As long as preparing another tropism control method, metal oxide layer 13 is without being limited thereto.
Next, the surface of metal oxide layer 13 is subjected to silane coupled processing (step as shown in fig. 3 c S103).Specifically, for example, under normal pressure or decompression, stacking on metal oxide layer 13 as steam includes there are six tools Or more the alkyl chain of carbon atom silane coupled material.At this point, silane coupled material reactive group (for example, in general formula (1) X) be chlorine atom, amino etc. in the case where, reaction terminates.In the case where reactive group is methoxyl group, ethyoxyl etc., water is introduced Steam is then reacted on the surface of metal oxide layer 13 with hydroxyl with causing to hydrolyze.In this way, in metal oxygen Silane coupling layer 14 is formed in compound layer 13.
Next, pixel circuit substrate 11 and counter substrate 21 are bonded together, and gap is located at as shown in fig. 3d (step S104) therebetween.Specifically, laying out pixel circuits substrate 11 and the counter substrate 21 formed using similar approach, to allow Opposite to each other, alignment films 12, metal oxide layer 13 and silane coupling layer 14 press this for silane coupling layer 14 and silane coupling layer 24 Sequence is stacked on pixel circuit substrate 11.Then, for example, apply UV solidification sealing material with except pixel circuit substrate 11 with it is right It sets except the entrance around substrate 21, pixel circuit substrate 11 and counter substrate 21 is bonded together, and irradiated using UV Sealing material solidifies sealing material.
Next, liquid crystal is injected in the gap between pixel circuit substrate 11 and counter substrate 21, liquid crystal layer 30 is formed. Finally, sealant is applied to entrance, and using UV irradiation sealant come curing sealant.In this way, it obtains in Fig. 1 The liquid crystal display 1 shown.
(1-3, operation and effect)
As described above, having attempted the light resistance for the liquid crystal apparatus for improving the projector for high reliability request.In order to change Kind light resistance, what is generally used using the so-called inorganic alignment film replacement for including inorganic material includes such as with pendant alkyl group Polyimides organic polymer alignment films.However, for example, the SiO for including in inorganic alignment film2With very strong moisture absorption Property, and wet inorganic alignment film leads to occur leakage current in pixel.
Therefore, in recent years, inorganic alignment film is made to be subjected to surface by using the silane coupled material with liquid crystal aligning It handles to attempt to realize moisture resistance and orientation.However, silane coupled material and the hydroxyl on the surface of inorganic alignment film react Activity is low, so that being difficult to form strong bond with the surface of inorganic alignment film.
In order to solve this problem, it as the method for forming strong bond with the surface of inoranic membrane, has researched and developed in gas phase that silane is even Connection material is adhered to inoranic membrane, subsequent hydrolysising silane conjugated material, and further execute heat so that the hydrolysate of heating with The method that hydroxyl on inoranic membrane is subjected to dehydrating condensation.However, the condensation reaction with the hydroxyl on inoranic membrane must be in high temperature item It is carried out under part.There are problems that high temperature causes silane coupled material before reactions from inorganic membrane desorption.
Therefore, liquid crystal display 1 according to the present embodiment has following configuration: pixel circuit substrate 11 and opposed base Opposite to each other, liquid crystal layer 30 is therebetween for plate 21, and alignment films 12 are arranged on pixel circuit substrate 11, for example, metal aoxidizes Nitride layer 13 is arranged on alignment films 12, and silane coupling layer 14 is arranged by metal oxide layer 13.By metal oxide Layer 13, which is arranged in alignment films 12, improves reactivity of the hydroxyl on the surface of alignment films 12.As shown in figure 4, passing through metal oxygen The metallic atom for including in compound layer 13, in the hydroxyl of alignment films 12 and reacting for the silane coupled material in silane coupling layer 14 Strong bond (for example, covalent bond) is formed between base.
As described above, according to the present embodiment, metal oxide layer 13, which is arranged in, is set to a pair for example, relative to each other Alignment films 12 on pixel circuit substrate 11 in substrate (pixel circuit substrate 11 and counter substrate 21) with it is silane coupled Between layer 14, liquid crystal layer 30 is therebetween.Therefore, the silicon for including in the hydroxyl on the surface of alignment films 12 and silane coupling layer 14 The reactive group of alkane conjugated material forms covalent bond by the metallic atom of metal oxide layer 13.Therefore, liquid crystal can be improved Show the moisture resistance of equipment 1.This makes it possible to inhibit the pixel of alignment films 12 to occur leakage current in the middle.
It should be noted that present embodiment provides following instance: metal oxide layer 13 and the setting of metal oxide layer 23 are dividing It is not arranged in the alignment films 12 and alignment films 22 on 21 side of 11 side of pixel circuit substrate and counter substrate.However, with typical case Liquid crystal display compare, only wherein in an alignment films be arranged metal oxide layer make it possible to improve liquid crystal display The moisture resistance of equipment 1.In this case, metal oxide layer is preferably provided on 11 side of pixel circuit substrate.
In addition, making it easier to keep orientation using ALD method formation metal oxide layer 13 and metal oxide layer 23 The respective inclination of film 12 and alignment films 22.
Next, the variation example of the description disclosure.It should be noted that benefit is denoted with the same reference numerals and according to above-mentioned implementation The similar component of component of the liquid crystal display 1 of mode, and its description is saved in appropriate circumstances.
<2, variation example>
Fig. 5 schematically shows cutting for the liquid crystal display (liquid crystal display 2) of the variation example according to the disclosure The example of face configuration.For example, liquid crystal display 2 is used as the projection display equipment (projection of all projectors as described below etc. Display device 4, referring to Fig. 7) liquid crystal light valve.Liquid crystal display 2 includes for example, reflector 41 relative to each other and opposed base Liquid crystal layer 30 between plate 21.Dielectric layer 42, metal oxide layer 43 and silane coupling layer 14 are in reflector 41 and liquid crystal layer 30 Between stacked gradually from 41 side of reflector.Similar with above embodiment, alignment films 22, metal oxide layer 23 and silane are even Connection layer 24 stacks gradually between counter substrate 21 and liquid crystal layer 30 from 21 side of counter substrate.
For example, reflector 41 includes light reflecting material, such as aluminium (Al).
Dielectric layer 42 includes dielectric material.The specific example of dielectric material includes SiO2
For example, metal oxide layer 43 is used for by improving using with the difference in the refractive index of dielectric layer 42 along surface S1 Direction be incident on the reflectivity of the light on liquid crystal display 2.Metal oxide layer 43 is by using with than dielectric layer 42 The material of bigger refractive index is formed.It is similar with according to the metal oxide layer 13 and metal oxide layer 23 of above embodiment, The specific example of material with larger refractive index includes metal oxide, such as aluminium oxide (Al2O3), hafnium oxide (HfO2), oxygen Change zirconium (ZrO2) and tantalum oxide (Ta2O5).It should be noted that the film thickness of each of metal oxide layer 43 and dielectric layer 42 Optimum value is according to wavelength shift.Therefore, film thickness is arranged according to purpose.
For example, can be manufactured as described below according to the liquid crystal display 2 of this variation example.Firstly, for example, CVD method is used In for example, on reflector 41 formed for example, with a thickness of 75nm SiO2Film, to form dielectric layer 42.Next, for example, CVD method is used to for example form the HfO for example with a thickness of 74nm on dielectric layer 422Film, to form metal oxide layer 43. Then, similar with above embodiment, silane coupled processing is carried out on the surface of metal oxide layer 43 to aoxidize in metal Silane coupling layer 14 is formed in nitride layer 43.Hereafter, reflector 41 and counter substrate 21 are arranged as allowing silane coupling layer 14 and silicon Alkane coupling layer 24 is relative to each other.It stacks in counter substrate 21 and is formed using the method similar with above embodiment in this order Alignment films 22, metal oxide layer 23 and silane coupling layer 24.It is bonded in silane coupling layer 14 and silane coupling layer 24 Together, after gap is therebetween, liquid crystal is by injection gap to form liquid crystal layer.In this way, liquid shown in Fig. 5 is obtained Crystal display device 2.
As described above, being arranged as optical thin film together with dielectric layer 42 according to the metal oxide layer 43 of this variation example.Cause This, can be by utilizing the refraction between dielectric layer 42 and metal oxide layer 43 according to the liquid crystal display 2 of this variation example Rate difference improves the reflectivity that (for example, 4%) is incident on the light on liquid crystal display 2 along the direction of surface S1.In addition, according to This variation example, can be while keeping the intensity of the key between inorganic oxide layer (dielectric layer 42) and silane coupling layer 14 more Simply manufacture reflective liquid crystal display device 2.It should be noted that 21 side of counter substrate has and above-mentioned implementation according to this variation example The similar configuration of those of mode.Therefore, the liquid crystal on 21 side of counter substrate is oriented while keeping its gradient.
<3, application examples>
(application examples 1)
Fig. 6 is shown including the projection display equipment (Projection Display according to the liquid crystal display 1 of embodiment of the present disclosure Device 3) configuration example.For example, projection display equipment 3 includes light source 110 (light source), lamp optical system in this order 120, image forming part 140 and projection optical system 150.Projection display equipment 3 is by being based on image signal modulation and combining The light (illumination light) exported from the light source 110 of each of RGB color generates image light, and image is incident upon screen and (is not shown On out).Projection display equipment 3 is so-called three transmission-type light tune using for red, blue and the various colors of green Control equipment 141R, 141G and 141B show the three pieces transmission-type projector of color image.Light modulation device 141R, 141G and 141B corresponds to liquid crystal display 1.
The transmitting of light source 110 includes the white light of feux rouges (R), blue light (B) and green light (G) needed for display color image.Light source 110 include such as halogen lamp, metal halide lamp, xenon lamp.Alternatively, it is, for example, possible to use such as semiconductor lasers The solid light source of device (LD) or light emitting diode (LED).In addition, the list for the transmitting white light that light source 110 is not limited to the described above A light source (white light source portion).For example, light source 110 may include the light source portion of three types: green band shine green light source portion, In the blue-light source portion that blue wave band shines and in the red light source portion that red band shines.
For example, lamp optical system 120 includes integrator devices 121, polarization transforming devices 122 and collector lens 123. Integrator devices 121 include first fly's-eye lens 121A and the second fly's-eye lens 121B.First fly's-eye lens 121A includes multiple The microlens of two-dimensional arrangements.Second fly's-eye lens 121B include it is multiple be arranged as with include in first fly's-eye lens 121A it is aobvious The corresponding microlens of lenticule.
The light (directional light) on integrator devices 121 is incident on by the micro- of first fly's-eye lens 121A from light source 110 Mirror is divided into multiple luminous fluxes, and the corresponding microlens for including in the second fly's-eye lens 121B is allowed to form image.Second compound eye Corresponding microlens in lens 121B plays secondary light source, and will have multiple collimated light beams of matching brightness as Incident light is applied to polarization transforming devices 122.
Integrator devices 121 have on the whole will be from the incident light cloth applied to polarization transforming devices 122 of light source 110 It is set to the function of brightness uniformity distribution.
Polarization transforming devices 122 have the function of keeping the polarization state by the equal incident light of integrator devices 121 balanced.Partially Vibration conversion equipment 122 waits outputs transmitting light for example, by the lens 65 being arranged on the light emitting side of light source 110.Emitting light includes Blue light B, green light G and feux rouges R.
Lamp optical system 120 further includes dichroscope 124, dichroscope 125, reflecting mirror 126, reflecting mirror 127, reflection Mirror 128, relay lens 129, relay lens 130, field lens 131R, field lens 131G, field lens 131B, light modulation device 141R, 141G, 141B and dichroic prism 142.Light modulation device 141R, 141G, 141B and dichroic prism 142 play image The effect of forming portion 140.
Dichroscope 124 and dichroscope 125, which have, selectively to be reflected the colourama of predetermined wavelength range and transmits it The property of the light of its wave-length coverage.For example, dichroscope 124 selectively reflects feux rouges R.Dichroscope 125 is selectively anti- Penetrate the green light G passed through in the green light G and blue light B that dichroscope 124 transmits.Remaining blue light B is saturating by dichroscope 125 It penetrates.In this way, it is divided into multiple column of colour with different colours from the light (white light Lw) that light source 110 emits.
Separated feux rouges R is reflected by reflecting mirror 126, and field lens 131R is passed through, thus parallelization, and subsequently into being used for Modulate the light modulation device 141R of feux rouges.Green light G passes through field lens 131G, thus parallelization, and subsequently into green for modulating The light modulation device 141G of light.Blue light B passes through relay lens 129, is reflected by reflecting mirror 127, also extends through relay lens 130, quilt Reflecting mirror 128 reflects.The blue light B reflected by reflecting mirror 128 passes through field lens 131B, thus parallelization, and subsequently into being used for Modulate the light modulation device 141B of blue light B.
Light modulation device 141R, 141G and 141B are respectively electrically coupled to the image that unshowned offer includes image information The signal source (for example, PC) of signal.The picture signal of the various colors of light modulation device 141R, 141G and 141B based on offer The incident light of each pixel is modulated, and generates red image, green image and blue image respectively.The various colors modulated Light beam (being formed by image) enter dichroic prism 142 and be combined.Dichroic prism 142 is overlapped and combines from three sides To the light beam of incident various colors, then combined light beam is exported towards projection optical system 150.
Projection optical system 150 includes multiple lens 151 etc., and will be applied to by the combined light of dichroic prism 142 Unshowned screen.This allows to show full-colour image.
(application examples 2)
Fig. 7 is shown including according to the projection display equipment of the liquid crystal display 2 of the variation example of the disclosure, (Projection Display is filled The example for setting configuration 4).Projection display equipment 4 successively includes such as light source 110, lamp optical system 210, image forming part 220 and projection optical system 230.Projection display equipment 4 is exported based on image signal modulation from the light source 110 of corresponding RGB color Light (illumination light) simultaneously combines brewed light beam, therefore generates image light, and image is incident upon on screen section (not shown).Projection Display device 4 be it is so-called using three reflecting light modulating equipment 222R of red, blue and the various colors of green, 222G and 222B shows the three pieces reflection-type projector of color image.Light modulation device 222R, 222G and 222B correspond to liquid Crystal display device 2.
It is similar with above application examples 1, light source 110 transmitting include display color image needed for feux rouges (R), blue light (B) and The white light of green light (G).Light source 110 includes such as halogen lamp, metal halide lamp, xenon lamp.It alternatively, for example, can be with Use such as semiconductor laser (LD) or the solid light source of light emitting diode (LED).In addition, light source 110 is not limited to as above The single source (white light source portion) of the transmitting white light.For example, light source 110 may include the light source portion of three types: in green The luminous green light source portion of wave band, in the blue-light source portion that blue wave band shines and in the red light source portion that red band shines.
Lamp optical system 210 since by include the position of close to sources 110 for example, fly's-eye lens 211 (211A and 211B), polarization transforming devices 212, lens 213, dichroscope 214A and 214B, reflective mirror 215A and 215B, lens 216A and 216B, dichroscope 217 and polarization plates 218A to 218C.
Fly's-eye lens 211 (211A and 211B) makes the illuminance distribution of the white light from light source 110.Polarization transforming devices 212 for being aligned the polarization axle of incident beam in a predetermined direction.For example, the light in addition to p-polarization light is converted to p-polarization light. Lens 213 assemble the light from polarization transforming devices 212 towards dichroscope 214A and 214B.Dichroscope 214A and 214B It respectively selectively reflects the light of predetermined wavelength range and selectively transmits the light of other wave-length coverages.For example, dichroic Mirror 214A mainly reflects feux rouges on the direction of reflective mirror 215A.In addition, dichroscope 214B is mainly in the side of reflective mirror 215B Reflection blue light upwards.Therefore, green light passes principally through dichroscope 214A and 214B, and towards the reflective of image forming part 220 Polarization plates 221C advances.Light (mainly feux rouges) from dichroscope 214A is reflected towards lens 216A by reflective mirror 215A, and And the light (mainly blue light) from dichroscope 214B is reflected towards lens 216B by reflective mirror 215B.Lens 216A transmission comes from The light (mainly feux rouges) of reflective mirror 215A, and light is converged into dichroscope 217.Lens 216B transmission comes from reflective mirror 215B Light (mainly blue light), and light is converged into dichroscope 217.Dichroscope 217 selectively reflects green light and selects Transmit to property the light of other wave-length coverages.In this example, dichroscope 217 transmits red in the light from lens 216A Light component.In the case where the light from lens 216A includes green component, green component is reflected towards polarization plates 218C.Polarization Plate 218A to 218C respectively includes the polarizer with polarization axle in a predetermined direction.For example, in light in polarization transforming devices In the case where being converted into p-polarization light in 212, polarization plates 218A to 218C respectively transmits p-polarization light and reflects s polarised light.
Image forming part 220 include reflection type polarization plate 221A to 221C, reflecting light modulating equipment 222A to 222C and Dichroic prism 223.
Reflection type polarization plate 221A to 221C is transmitted respectively with inclined with the polarised light from polarization plates 218A to 218C The light (for example, p-polarization light) of the identical polarization axle of vibration axis, and reflect the polarization axle having in addition to the polarization axle of p-polarization light Light (s polarised light).Specifically, reflection type polarization plate 221A is transmitted on the direction of reflecting light modulating equipment 222A carrys out self-bias The p-polarization feux rouges of vibration plate 218A.Reflection type polarization plate 221B is transmitted on the direction of reflecting light modulating equipment 222C carrys out self-bias The p-polarization blue light of vibration plate 218B.Reflection type polarization plate 221C is transmitted on the direction of reflecting light modulating equipment 222C carrys out self-bias The p-polarization green light of vibration plate 218C.In addition, across dichroscope 214A and 214B and inclined into the p of reflection type polarization plate 221C Vibration green light passes through reflection type polarization plate 221C as former state, and enters dichroic prism 223.In addition, reflection type polarization plate 221A is anti- The s polarized red beam from reflecting light modulating equipment 222A is penetrated, so that s polarized red beam enters dichroic prism 223.It is reflective inclined Vibration plate 221B reflects the s polarized blue light from reflecting light modulating equipment 222C, so that s polarized blue light enters dichroic prism 223.Reflection type polarization plate 221C reflects the s polarized green light from reflecting light modulating equipment 222C, so that s polarized green light enters Dichroic prism 223.
Reflecting light modulating equipment 222A to 222C executes spatial modulation to feux rouges, blue light and green light respectively.
Dichroic prism 223 combines the green light of incident feux rouges, incident blue light and incidence, and by combination Light is exported towards projection optical system 230.
Projection optical system 230 includes lens L232 to L236 and reflecting mirror M231.Projection optical system 230 is amplified from figure As the light that forming portion 220 exports, the light projection that will amplify is on screen etc..
<4, operation example>
As described below, manufacture various samples (for example, experimental example 1 to 5) as according to the liquid crystal display of the disclosure and its Comparative example, and variation of the contact angle on substrate surface before and after heat treatment is assessed, heat treatment is in silane idol It is carried out after connection processing.
(experimental example 1)
Firstly, by SiO2It is stacked on substrate by inclined deposition, (corresponds to alignment films 12 to form inorganic oxide layer With 22 or dielectric layer 42).Then, substrate is heated to 220 DEG C in ALD unit, is alternatively introduced into trimethyl aluminium (TMA;Precursor And water (H 1)2O;Precursor 2), to form the Al for being used as metal oxide layer on inorganic oxide layer2O3Film.TMA and H2O's It is primary to introduce the film thickness for being set as single cycle, and the circulating repetition five times, therefore obtaining 0.6nm.Next, substrate is added Hereafter heat introduces the steam of positive decyl trimethoxy silane as silane coupled material to 80 DEG C under normal pressure.By substrate Steam is exposed to 30 minutes so that silane coupled material is attached to the surface of substrate.Then, it is small to expose the substrate to water vapour one When, to promote the hydrolysis of silane coupled material, and hereafter heating simultaneously dry substrate 30 minutes at 100 DEG C, obtain experimental example 1 Sample.
(experimental example 2)
In experimental example 2, TMA and H is introduced in addition to executing2The Al of the circulation 40 times film thicknesses with formation with 5nm of O2O3 Except film, the method perparation of specimen similar with experimental example 1 is used.
(experimental example 3)
In experimental example 3, TMA and H is introduced in addition to executing2Circulation 160 times of O are to form the film thickness with 20nm Al2O3Except film, the method perparation of specimen similar with experimental example 1 is used.
(experimental example 4)
In experimental example 4, in addition to using four (ethylmethylamino) hafniums (IV) (TEMAH) as precursor 1, and executes and draw Enter TEMAH and H2The HfO of the circulation 7 times film thicknesses with formation with 0.6nm of O2Except film, the side similar with experimental example 1 is used The method perparation of specimen.
(experimental example 5)
Experimental example 5 is the comparative example of experimental example 1 to 4.In experimental example 5, SiO is stacked on substrate by inclined deposition2 To form inorganic oxide layer.Then, using the method similar with those of experimental example 1 and on the surface of inorganic oxide layer The upper silane coupled processing of progress carrys out the perparation of specimen, without providing metal oxide layer.
For each of above-mentioned experimental example 1 to 5, the contact angle of the purified water on substrate surface is measured, followed by 200 DEG C Hereafter six hours of lower heating measure the contact angle of the purified water on substrate surface again.Table 1 lists the heating of experimental example 1 to 5 The manufacturing condition and measurement result of the contact angle of the purified water on substrate surface before and after the processing.
In metal oxide layer (Al2O3Film or HfO2Film) it is arranged in the experimental example 1 to 4 on inorganic oxide layer, only The contact angle for changing water is 77 ° (experimental examples 1), 72 ° (experimental example 2), 82 ° (experimental examples 3) and 81 ° of (experiments before heat treatment Example 4).At the same time, in the experimental example 5 of not set metal oxide layer, as low as 45 ° of contact angle.In addition, after heat treatment Each contact angle be 72 ° (experimental examples 1), 74 ° (experimental example 2), 77 ° (experimental example 3), 75 ° (experimental examples 4) and 4 ° of (experimental examples 4).In each of experimental example 1 to 4, variation of the contact angle before and after heat treatment is very small, the thickness with metal oxide layer It is unrelated.At the same time, big variation is observed in experimental example 4.One conceivable the reason is that nothing in experimental example 1 to 4 Metal oxide layer is provided between machine oxide skin(coating) and silane coupling layer to be caused between inorganic oxide layer and silane coupling layer Key becomes strong, to obtain more stable surface.
In addition, manufacture substrate by various processing similar with those of experimental example 1 to 4, and by substrate and experimental example 1 to 5 counterpart substrate engagement.Liquid crystal is injected in the gap between substrate, and observes picture quality.Therefore, in experimental example 1,2 and In each of 4, good vertical orientation is presented in liquid crystal molecule.In TMA and H2The introducing circulation of O executes 160 experimental examples 3 In, vertical orientation is presented in liquid crystal molecule, without any inclination.From the result it is understood that forming thick metal oxide layer (In In the embodiment, 20nm or more) in the case where, it needs using except SiO2Inclined deposition other than method execute liquid crystal molecule Tropism control.
Reference implementation mode, variation example and operation example describe the disclosure above.However, the present disclosure is not limited thereto, and It can modify in various ways.For example, being not limited to retouch in the above-described embodiment according to the projection display equipment of the disclosure The configuration stated, and can be applied to modulate the light from light source by liquid crystal display and show picture using projecting lens Various types of display devices.
In addition, can also be by using for example, light reflecting material be electric for pixel according to the liquid crystal display 1 of the disclosure The configuration for the substrate for including in base board 11 or pixel electrode fills to be used as the display of reflective projection described in above application examples 2 Set 4 liquid crystal light valve.
It should be noted that content of this disclosure can configure it is as follows.
[1]
A kind of liquid crystal display, comprising:
A pair of substrate relative to each other;
Liquid crystal layer is inserted in this between substrate;
Inorganic oxide layer, be inserted in liquid crystal layer and this between at least one substrate in substrate;
Silane coupling layer is inserted between liquid crystal layer and inorganic oxide layer;And
Metal oxide layer is inserted between inorganic oxide layer and silane coupling layer.
[2]
The liquid crystal display according to [1], wherein silane coupling layer passes through metal oxide layer and inorganic oxide Layer forms covalent bond.
[3]
According to liquid crystal display described in [1] or [2], wherein in metal oxide layer, be stacked with and be respectively equal to One atomic layer to ten atomic layers metal oxide molecule.
[4]
The liquid crystal display according to any one of [1] to [3], wherein metal oxide layer has 5nm or less Film thickness.
[5]
The liquid crystal display according to any one of [1] to [4], wherein metal oxide layer uses light transmission material Material is formed.
[6]
The liquid crystal display according to [5], wherein translucent material includes aluminium oxide (Al2O3), hafnium oxide (HfO3)、 Zirconium oxide (ZrO2) and tantalum oxide (Ta2O5Any one of).
[7]
The liquid crystal display according to any one of [1] to [6], wherein silane coupling layer uses following general formula (1) the silane coupled material indicated is formed:
[changing 1]
(X indicates methoxyl group (- OCH3), ethyoxyl (- OC2H5), chlorine atom (Cl) and amino (- NH2) in any Kind,
B and C respectively individually indicates methoxyl group (- OCH3), ethyoxyl (- OC2H5), chlorine atom (Cl) and amino (- NH2) Any one of, or respectively with any one of alkyl, alkenyl and the alkoxy of one to three carbon atom, and
A indicates any one of alkyl, alkenyl and alkoxy respectively with 6 to 20 carbon atoms, or except configuration The base that carbon atom other than the carbon atom at the carbochain both ends of alkyl, alkenyl and alkoxy is substituted with an oxygen, or configuration alkyl, The base that at least one or more of alkenyl and alkoxy hydrogen atom are substituted with halogen atoms.)
[8]
The liquid crystal display according to any one of [1] to [7], wherein inorganic oxide layer includes alignment films.
[9]
The liquid crystal display according to any one of [1] to [8], wherein
This includes the pixel circuit substrate and pair opposite with pixel circuit substrate for being provided with multiple pixel electrodes to substrate Substrate is set, and
Metal oxide layer is arranged in pixel circuit substrate-side.
[10]
A method of manufacture liquid crystal display, which comprises
Inorganic oxide layer is formed at least one substrate in a pair of of substrate;
Metal oxide layer is formed on inorganic oxide layer;
Silane coupling layer is formed on metal oxide layer;
Arrange that a substrate and another substrate are relative to each other, gap is therebetween;And
Liquid crystal layer is formed in gap.
[11]
The method of liquid crystal display is manufactured according to [10], wherein forming metal oxide layer includes passing through original Sublayer deposition method is formed.
[12]
A kind of projection display equipment, comprising:
Light source;
Liquid crystal display, including light of the modulation from light source and output corresponds to the pixel region of the light of picture;With And
Projecting lens, based on the light projection picture exported by liquid crystal display,
Liquid crystal display, comprising:
A pair of substrate relative to each other,
Liquid crystal layer, is inserted in this between substrate,
Inorganic oxide layer, be inserted in liquid crystal layer and this between at least one in substrate,
Silane coupling layer is inserted between liquid crystal layer and inorganic oxide layer, and
Metal oxide layer is inserted between inorganic oxide layer and silane coupling layer.
This application claims the Japanese earlier patent application 2017- that Japanese Patent Office is submitted on March 17th, 2017 No. 052515 equity, entire contents are engaged in this article by citation.
It will be apparent to a skilled person that can be made according to design requirement and other factors various changes, combination, Sub-portfolio and change, as long as they are in the range of appended claims or its equivalent.

Claims (12)

1. a kind of liquid crystal display, comprising:
A pair of of substrate, opposite to each other;
Liquid crystal layer is inserted between the pair of substrate;
Inorganic oxide layer is inserted between at least one substrate in the liquid crystal layer and the pair of substrate;
Silane coupling layer is inserted between the liquid crystal layer and the inorganic oxide layer;And
Metal oxide layer is inserted between the inorganic oxide layer and the silane coupling layer.
2. liquid crystal display according to claim 1, wherein the silane coupling layer is via the metal oxide layer Covalent bond is formed with the inorganic oxide layer.
3. liquid crystal display according to claim 1, wherein in the metal oxide layer, be stacked with an original Sublayer to ten atomic layers metal oxide molecule.
4. liquid crystal display according to claim 1, wherein the metal oxide layer has 5nm film thickness below Degree.
5. liquid crystal display according to claim 1, wherein the metal oxide layer is formed using translucent material.
6. liquid crystal display according to claim 5, wherein the translucent material includes aluminium oxide (Al2O3), oxidation Hafnium (HfO3), zirconium oxide (ZrO2) and tantalum oxide (Ta2O5Any one of).
7. liquid crystal display according to claim 1, wherein the silane coupling layer is indicated using following general formula (1) Silane coupled material formed:
[changing 1]
(X indicates methoxyl group (- OCH3), ethyoxyl (- OC2H5), chlorine atom (Cl) and amino (- NH2Any one of),
B and C respectively individually indicates methoxyl group (- OCH3), ethyoxyl (- OC2H5), chlorine atom (Cl) and amino (- NH2) in It is any, or respectively individually indicate respectively with any in the alkyl of one to three carbon atom, alkenyl and alkoxy Kind, and
A indicates any one of alkyl, alkenyl and alkoxy respectively with 6 to 20 carbon atoms, or except described in configuration The base that carbon atom other than the carbon atom at the carbochain both ends of alkyl, the alkenyl and the alkoxy is substituted with an oxygen, Huo Zhepei At least one of hydrogen atom of the alkyl, the alkenyl and the alkoxy or multiple hydrogen atoms are set by halogen atom Substituted base.)
8. liquid crystal display according to claim 1, wherein the inorganic oxide layer includes alignment films.
9. liquid crystal display according to claim 1, wherein
The pair of substrate includes being provided with the pixel circuit substrate of multiple pixel electrodes and opposite with the pixel circuit substrate Counter substrate, and
The metal oxide layer is arranged in the pixel circuit substrate-side.
10. a kind of method for manufacturing liquid crystal display, which comprises
Inorganic oxide layer is formed at least one substrate in a pair of of substrate;
Metal oxide layer is formed on the inorganic oxide layer;
Silane coupling layer is formed on the metal oxide layer;
It sets one substrate and another substrate to opposite to each other, gap is therebetween;And
Liquid crystal layer is formed in the gap.
11. the method for manufacture liquid crystal display according to claim 10, wherein form the metal oxide layer packet It includes and is formed by Atomic layer deposition method.
12. a kind of projection display equipment, comprising:
Light source;
Liquid crystal display, including light of the modulation from light source and output corresponds to the pixel region of the light of picture;And
Projecting lens projects the picture based on the light exported by the liquid crystal display,
The liquid crystal display includes:
A pair of of substrate, opposite to each other,
Liquid crystal layer is inserted between the pair of substrate,
Inorganic oxide layer is inserted between at least one substrate in the liquid crystal layer and the pair of substrate,
Silane coupling layer is inserted between the liquid crystal layer and the inorganic oxide layer, and
Metal oxide layer is inserted between the inorganic oxide layer and the silane coupling layer.
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