CN110418561B - Server machine case and mainboard ESD protective structure thereof - Google Patents
Server machine case and mainboard ESD protective structure thereof Download PDFInfo
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- CN110418561B CN110418561B CN201910526329.4A CN201910526329A CN110418561B CN 110418561 B CN110418561 B CN 110418561B CN 201910526329 A CN201910526329 A CN 201910526329A CN 110418561 B CN110418561 B CN 110418561B
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- mainboard
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- attraction surface
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- 230000001681 protective effect Effects 0.000 title description 2
- 229910052751 metal Inorganic materials 0.000 claims abstract description 89
- 239000002184 metal Substances 0.000 claims abstract description 89
- 229910052755 nonmetal Inorganic materials 0.000 claims abstract description 42
- 238000009434 installation Methods 0.000 claims description 5
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 3
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 230000003068 static effect Effects 0.000 abstract description 26
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 230000005611 electricity Effects 0.000 description 14
- 238000013461 design Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
- G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0067—Devices for protecting against damage from electrostatic discharge
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Elimination Of Static Electricity (AREA)
Abstract
The invention discloses a mainboard ESD protection structure, which comprises a mounting part arranged on a mainboard, a non-metal part arranged on the mounting part, and a metal protection part connected with a metal box body and positioned at the side edge of the non-metal part, wherein the metal protection part is provided with an electrostatic attraction surface with a preset width so as to guide the electrostatic discharge around the non-metal part to the electrostatic attraction surface. Because the static attraction surface on the metal protection part has enough width and surface area, when the static is released around the non-metal part, the static attraction surface almost completely covers the generation range of the static release, so that the static can be completely received and covered, the static can be smoothly guided to the metal box body and guided to the ground through the static attraction surface after the static is released, the static is prevented from missing or passing over the metal protection part, and the static is prevented from directly hitting the mainboard. The invention also discloses a server case, which has the beneficial effects as described above.
Description
Technical Field
The invention relates to the technical field of servers, in particular to a mainboard ESD protection structure. The invention also relates to a server case comprising the mainboard ESD protection structure.
Background
With the development of the electronic technology in China, more and more electronic devices have been widely used.
Servers are important components in electronic devices, and are devices that provide computing services. Since the server needs to respond to and process the service request, the server generally has the capability of assuming and securing the service. The server is divided into a file server, a database server, an application server, a WEB server and the like according to different service types provided by the server. The main components of the server include a processor, a hard disk, a memory, a system bus, etc., and are similar to a general-purpose computer architecture, but the server is required to have high processing capability, stability, reliability, security, expandability, manageability, etc., because it needs to provide highly reliable services.
In the big data era, a large number of IT devices are centrally placed in racks of a data center. These data centers include various types of servers, storage, switches, and a large number of cabinets and other infrastructure. Each type of IT equipment is composed of various hardware boards, such as a computing module, a memory module, a chassis, a fan module, and the like.
At present, ESD (electronic-static discharge) electrostatic interference is a problem which cannot be ignored by all IT products, and the anti-static design is a great importance for the design and development of the IT products. The main source of electrostatic interference is human electrostatic charge, which may generate a large electrostatic discharge when a human body touches the device, and when the electrostatic discharge acts on a metal part with good grounding, and the grounding of the metal part is well designed, the charge is guided to the ground. However, when acting on the non-metal components, air discharge is generated, and static electricity of the type is not directly introduced into the ground through the metal components, but is directly applied to the mainboard through coupling, so that great interference is generated on the mainboard. Air discharge can reach 15KV and even higher, and compared with contact discharge of metal parts, the air discharge is more harmful, and can easily cause product performance reduction and partial or complete loss of functions.
In the prior art, when a mechanism is designed, gaps of non-metal components (such as LED indicator lamps and the like) are small, and the metal contact surfaces on the periphery do not have a mandatory width requirement, so that the width of the metal contact surfaces of partial products is narrow, and charges are difficult to be guided and flow into a design GND (ground potential) completely through a metal chassis. When the electrostatic discharge intensity is very high, the charges are directly coupled to the mainboard through the gap with a high probability, interference is generated on the mainboard, and the performance of the product is reduced or even the function is partially or completely lost in serious cases.
Therefore, how to effectively prevent static electricity from being coupled and discharged to the motherboard through the non-metal component and prevent electrostatic interference to the motherboard is a technical problem faced by those skilled in the art.
Disclosure of Invention
The invention aims to provide a mainboard ESD protection structure which can effectively prevent static from being coupled and discharged to a mainboard through a non-metal component and prevent static interference to the mainboard. Another object of the present invention is to provide a server chassis.
In order to solve the above technical problems, the present invention provides a motherboard ESD protection structure, which includes an installation portion disposed on a motherboard, a non-metal component disposed on the installation portion, and a metal protection element connected to a metal box and located at a side of the non-metal component, wherein the metal protection element is provided with an electrostatic attraction surface with a predetermined width, so as to guide electrostatic discharge around the non-metal component to the electrostatic attraction surface.
Preferably, the metal shield is annular and is distributed on the circumferential outer side of the non-metal component.
Preferably, the metal protection part comprises a mounting cylinder which is vertically arranged on the surface of the metal box body and distributed around the non-metal component, and the electrostatic attraction surface is annular and is horizontally arranged on the outer wall of the top end of the mounting cylinder.
Preferably, the metal shield is rectangular and tangentially distributed to the sides of the non-metallic component.
Preferably, the metal guard is in particular a ferrous alloy plate or a titanium alloy plate.
Preferably, a plurality of hollowed lightening holes are uniformly formed in the metal protection piece.
Preferably, the width of the electrostatic attraction surface is 1-2 cm.
Preferably, the metal guard is detachably connected to the metal box by a fastener.
The invention also provides a server case, which comprises a metal case body and a mainboard ESD protection structure arranged in the metal case body, wherein the mainboard ESD protection structure is specifically the ESD protection structure of any one of the above parts.
The invention provides a mainboard ESD protection structure which mainly comprises a mounting part, a non-metal part and a metal protection part. The mounting part is arranged on the mainboard and is mainly used for mounting the non-metal component, the metal protection part is arranged on the metal chassis and is connected with the metal chassis, and meanwhile, the metal protection part is positioned at the side position of the non-metal component and keeps a preset distance with the non-metal component. The metal guard is provided with an electrostatic attraction surface having a predetermined width and a large surface area, and capable of guiding the electrostatic discharge around the non-metal component, transferring the electrostatic discharge to the metal casing, and finally guiding the electrostatic discharge to the ground. In this way, because the electrostatic attraction surface on the metal protection piece has enough width and surface area, when the static electricity is released around the nonmetal component, the electrostatic attraction surface almost completely covers the generation range of the static electricity release, so that the static electricity can be completely received and covered, the static electricity can be smoothly guided to the metal box body and guided to the ground through the electrostatic attraction surface after the static electricity is released, the static electricity is prevented from being missed or passing over the metal protection piece, and the static electricity is prevented from directly hitting the mainboard. In summary, the ESD protection structure for a motherboard provided by the present invention can effectively prevent static electricity from being coupled and discharged to the motherboard through the non-metal component, thereby preventing electrostatic interference to the motherboard.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic overall structure diagram of an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a metal shielding element.
Wherein, in fig. 1-2:
the structure comprises a main board-1, a mounting part-2, a non-metal part-3, a metal protection part-4, an electrostatic attraction surface-401, a mounting cylinder 402 and a lightening hole-5.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, fig. 1 is a schematic overall structure diagram of an embodiment of the present invention.
In an embodiment of the present invention, the ESD protection structure for a motherboard mainly includes a mounting portion 2, a non-metal component 3, and a metal protection component 4.
The mounting portion 2 is disposed on the main board 1 and is mainly used for mounting the non-metal component 3, and the metal shielding member 4 is disposed on the metal chassis and connected thereto, and meanwhile, the metal shielding member 4 is located at a side position of the non-metal component 3 and keeps a predetermined distance therefrom.
The metal guard 4 is provided with an electrostatic attraction surface 401, and the electrostatic attraction surface 401 has a predetermined width and a large surface area, and can guide the electrostatic discharge around the non-metal component 3, transmit the electrostatic discharge to the metal case, and finally guide the electrostatic discharge to the ground. In this way, since the electrostatic attraction surface 401 on the metal shield 4 has a sufficient width and surface area, when the electrostatic discharge is generated around the non-metal component 3, the electrostatic attraction surface 401 almost completely covers the generation range of the electrostatic discharge, and therefore, the electrostatic attraction surface 401 can completely receive and cover the part of the electrostatic discharge, so that the electrostatic discharge can be smoothly guided to the metal box through the electrostatic attraction surface 401 and guided to the ground, thereby preventing the electrostatic discharge from being missed or passing over the metal shield 4, and further preventing the electrostatic discharge from directly hitting the motherboard 1.
In summary, the ESD protection structure for a motherboard provided in this embodiment can effectively prevent static electricity from being coupled and discharged to the motherboard 1 through the non-metal component 3, and prevent electrostatic interference from being caused to the motherboard 1.
Fig. 2 is a schematic structural diagram of a metal shielding element, as shown in fig. 2.
In a preferred embodiment with respect to the metal shielding member 4, the metal shielding member 4 may be annular and circumferentially distributed at a position circumferentially outside the non-metal component 3. Specifically, the metal guard 4 further includes a mounting cylinder 402. The mounting tube 402 is vertically disposed on the surface of the metal box, and may be extended from the side wall of the metal box through a connecting plate, and the like, and the interior of the mounting tube is hollow, and may be circumferentially distributed around the non-metal component 3 (generally in a column shape) as an axis. The electrostatic attraction surface 401 may be in a circular ring shape extending circumferentially, and is horizontally disposed on the outer wall of the top end of the mounting cylinder 402, which is equivalent to being sleeved on the top end of the mounting cylinder 402. The level of the electrostatic attraction surface 402 is generally lower than that of the non-metallic component 3 by a certain distance, so that the electrostatic attraction surface 401 can be smoothly transferred to the surrounding electrostatic attraction surface along the discharge path during electrostatic discharge. With this arrangement, the electrostatic attraction surface 401 on the metal shielding element 4 can be spread like a sector circumference, the width thereof is the radial length thereof, and the coverage area thereof is the area of the ring. Ideally, the annular space around the non-metal component 3 is the occurrence range of static electricity discharge, so the annular metal shield 4 can completely cover and receive static electricity.
In another preferred embodiment of the metal shielding member 4, considering that the non-metal component 3 (such as an LED indicator light, etc.) is generally mounted at a corner on the main board 1, the mounting space around the non-metal component is limited, and the non-metal component is generally only present in one side space (the upper side in fig. 1) when operated by a human hand, therefore, to facilitate the mounting and reduce the space occupation of the metal shielding member 4 in the metal chassis, the metal shielding member 4 may also be rectangular, that is, long, with a predetermined length and a sufficient width, and may be attached to the side walls at two ends of the metal chassis and located at the side of the non-metal component 3 where the non-metal component is commonly operated. Meanwhile, the electrostatic attraction surface 401 may be connected to a free surface (on the upper side as shown in fig. 1) of one side of the metal protection member 4, and the two are combined to form an "L" shaped structure, so that when a human hand operates on a side of a common operation, the electrostatic attraction surface 401 can smoothly attract the electrostatic discharged from the space and guide the electrostatic to the metal case.
Generally, the width of the electrostatic attraction surface 401 disposed on the metal protection element 4 can reach 1-2 cm, and the width range of the size is large enough to completely cover the generation range of electrostatic discharge around the non-metal component 3, and avoid occupying extra installation space in the server.
To improve the static electricity absorbing ability and the structural strength of the metal guard 4, the metal guard 4 may be specifically an iron alloy plate or a titanium alloy plate. Of course, other types of conductive metal materials may be used.
In addition, in order to realize the lightweight design of the server, a plurality of hollowed lightening holes 5 are uniformly formed in the metal protection piece 4 in the embodiment. With this arrangement, the weight of the metal guard 4 can be reduced by opening the lightening holes 5, and the heat dissipation efficiency inside the server casing can be improved without damaging or slightly reducing the structural strength.
Furthermore, in order to facilitate the operations of mounting and dismounting the metal protection element 4 on the metal chassis, in this embodiment, the metal protection element 4 may be detachably connected to the metal box body by a plurality of fasteners. For example, the head and the tail of the metal protection element 4 may be connected with the side wall of the metal box by fasteners such as bolts, or may be detachably connected with other parts by adhesives.
The embodiment further provides a server chassis, which mainly includes a metal box and a motherboard ESD protection structure disposed in the metal box, wherein the metal box is grounded, and the main content of the motherboard ESD protection structure is the same as the related content, which is not described herein again.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (6)
1. The ESD protection structure for the mainboard is characterized by comprising a mounting part (2) arranged on the mainboard (1), a non-metal part (3) arranged on the mounting part (2), and a metal protection part (4) which is connected with a metal box body and is positioned at the side edge of the non-metal part (3), wherein an electrostatic attraction surface (401) with a preset width is arranged on the metal protection part (4) so as to guide the electrostatic discharge around the non-metal part (3) to the electrostatic attraction surface (401);
the metal protection piece (4) is annular and is distributed on the circumferential outer side of the non-metal component (3), the metal protection piece (4) comprises an installation cylinder (402) which is vertically arranged on the surface of the metal box body and is distributed around the non-metal component (3), and the electrostatic attraction surface (401) is annular and is horizontally arranged on the outer wall of the top end of the installation cylinder (402);
or the metal protection piece (4) is rectangular and is distributed on the side edge of the non-metal component (3) along the tangential direction.
2. Motherboard ESD protection structure according to claim 1, characterized in that the metal protection part (4) is in particular a ferrous alloy plate or a titanium alloy plate.
3. The ESD protection structure for main board according to claim 2, wherein the metal protection component (4) has a plurality of weight-reducing holes (5) formed therein.
4. The ESD protection structure for main board according to claim 3, wherein the width of the electrostatic attraction surface (401) is 1-2 cm.
5. Mainboard ESD protection structure according to claim 4, characterized in that the metal shield (4) is detachably connected to the metal case by means of fasteners.
6. A server case comprises a metal case body and a mainboard ESD protection structure arranged in the metal case body, and is characterized in that the mainboard ESD protection structure is specifically the ESD protection structure of any one of claims 1-5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910526329.4A CN110418561B (en) | 2019-06-18 | 2019-06-18 | Server machine case and mainboard ESD protective structure thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910526329.4A CN110418561B (en) | 2019-06-18 | 2019-06-18 | Server machine case and mainboard ESD protective structure thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110418561A CN110418561A (en) | 2019-11-05 |
| CN110418561B true CN110418561B (en) | 2020-10-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910526329.4A Active CN110418561B (en) | 2019-06-18 | 2019-06-18 | Server machine case and mainboard ESD protective structure thereof |
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| Country | Link |
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| CN (1) | CN110418561B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013234571A (en) * | 2013-08-28 | 2013-11-21 | Taruno Kazuo | Lifetime care system |
| CN205430747U (en) * | 2016-04-06 | 2016-08-03 | 浙江亿东环保科技有限公司 | Electrostatic protection device that LCD screen became invalid is sent to anion |
| CN108958409A (en) * | 2018-07-11 | 2018-12-07 | 孝感卓尔网络科技有限公司 | A kind of computer host box with anti-static function |
-
2019
- 2019-06-18 CN CN201910526329.4A patent/CN110418561B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013234571A (en) * | 2013-08-28 | 2013-11-21 | Taruno Kazuo | Lifetime care system |
| CN205430747U (en) * | 2016-04-06 | 2016-08-03 | 浙江亿东环保科技有限公司 | Electrostatic protection device that LCD screen became invalid is sent to anion |
| CN108958409A (en) * | 2018-07-11 | 2018-12-07 | 孝感卓尔网络科技有限公司 | A kind of computer host box with anti-static function |
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| Publication number | Publication date |
|---|---|
| CN110418561A (en) | 2019-11-05 |
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