CN110418247B - Audio receiving chip and audio receiver - Google Patents
Audio receiving chip and audio receiver Download PDFInfo
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- CN110418247B CN110418247B CN201910687351.7A CN201910687351A CN110418247B CN 110418247 B CN110418247 B CN 110418247B CN 201910687351 A CN201910687351 A CN 201910687351A CN 110418247 B CN110418247 B CN 110418247B
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R3/00—Circuits for transducers, loudspeakers or microphones
- H04R3/12—Circuits for transducers, loudspeakers or microphones for distributing signals to two or more loudspeakers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2430/00—Signal processing covered by H04R, not provided for in its groups
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Abstract
The embodiment of the application provides an audio receiving chip and an audio receiver, wherein the audio receiving chip is configured in the audio receiver and comprises a front-end processing circuit, an input-output circuit and an audio merging circuit, the front-end processing circuit is respectively connected with an antenna, the input-output circuit and the audio merging circuit of the audio receiver, the input-output circuit is connected with the audio merging circuit, and the front-end processing circuit is used for demodulating a radio-frequency signal received by the antenna to obtain a first audio signal carried in the radio-frequency signal. The audio receiving chip can work in a master mode or a slave mode, can receive an audio signal of another audio receiving chip working in the slave mode when working in the master mode, and can combine and output two paths of audio signals.
Description
Technical Field
The application relates to the technical field of audio, in particular to an audio receiving chip and an audio receiver.
Background
The wireless microphone is often applied to occasions such as stage performance, KTV, teaching, speech and the like, and consists of a wireless microphone and a wireless receiver, in the actual use process, the signal is subjected to small-scale fading due to the multipath effect of a wireless channel, so that the wireless receiver is subjected to sound interruption, namely, the phenomenon of frequency drop is more obvious, particularly, the phenomenon of frequency drop is more obvious when the wireless microphone is used indoors, and the antenna diversity is a method for solving the problem of frequency drop. In the existing diversity scheme, two antennas are used to receive signals of the same wireless microphone respectively, two internal audio receiving chips are connected with one antenna respectively, a microcontroller (Micro Controller Unit, MCU) reads Received Signal Strength Indication (RSSI) signals output by the two audio receiving chips, a control Signal is generated according to the RSSI of the two audio receiving chips, and an audio analog switch selects an audio Signal of a certain audio receiving chip to output according to the control Signal.
Disclosure of Invention
An object of the embodiments of the present application is to provide an audio receiving chip and an audio receiver, in which an input/output circuit disposed on a chip is used to transmit an audio signal of one chip to another chip, and an MCU and an audio analog switch are not separately disposed, so that a peripheral circuit of the chip is simpler.
In a first aspect, an embodiment of the present application provides an audio receiving chip configured in an audio receiver, where the audio receiving chip includes a front-end processing circuit, an input/output circuit, and an audio combining circuit, the front-end processing circuit is connected to an antenna of the audio receiver, the input/output circuit, and the audio combining circuit, respectively, the input/output circuit is connected to the audio combining circuit, and the front-end processing circuit is configured to receive a radio frequency signal transmitted from the antenna and demodulate the radio frequency signal to obtain a first audio signal carried in the radio frequency signal; the audio receiving chip works in a master mode or a slave mode, when the audio receiving chip works in the master mode, the front-end processing circuit is used for outputting the first audio signal to the audio merging circuit, the input-output circuit is used for receiving a second audio signal transmitted by another audio receiving chip working in the slave mode and outputting the second audio signal to the audio merging circuit, and the audio merging circuit is used for merging and outputting the input audio signal; when the audio receiving chip works in a slave mode, the front-end processing circuit is used for outputting the first audio signal to another audio receiving chip working in a master mode through the input-output circuit.
The audio receiver can transmit the audio signal from one chip to another chip through the input and output circuit in the audio receiving chip, the audio receiving chip working in the main mode combines and outputs the audio signal obtained by the audio receiving chip and the audio signal transmitted by the other audio receiving chip, when the signals from the two chips are synthesized, the signal fading degree caused by multipath effect is reduced, thereby reducing the phenomena of mute and sound interruption, greatly eliminating the receiving dead zone of the audio receiver, simultaneously, the audio receiver does not need an audio analog switch, and does not need to use MCU to participate in output control, thereby leading the peripheral circuit of the audio receiving chip to be simpler, and simultaneously saving the implementation cost of the audio receiver.
In one possible implementation manner of the first aspect, the audio receiving chip further includes a framing circuit, a deframing circuit, and a delay circuit, the framing circuit is disposed between the front-end processing circuit and the input-output circuit, the deframing circuit is disposed between the input-output circuit and the audio combining circuit, and the delay circuit is disposed between the front-end processing circuit and the audio combining circuit; when the audio receiving chip works in a slave mode, the framing circuit is used for framing the first audio signal and outputting the framed signal to the input and output circuit; when the audio receiving chip works in the master mode, the input/output circuit is configured to receive a framed signal transmitted by another audio receiving chip working in the slave mode, and output the framed signal to the deframing circuit, the deframing circuit is configured to extract a second audio signal carried in the framed signal and output the second audio signal to the audio combining circuit, and the delay circuit is configured to perform delay processing on the first audio signal to compensate for a phase difference between the first audio signal and the second audio signal due to framing and deframing, and output the delayed first audio signal to the audio combining circuit.
In a possible implementation manner of the first aspect, when the audio receiving chip operates in the master mode, the front-end processing circuit is further configured to output a first indication signal representing a first audio signal strength to the audio combining circuit, and the input-output circuit is further configured to output a second indication signal representing a second audio signal strength to the audio combining circuit, and the audio combining circuit is configured to combine and output the input audio signals by:
Audio_out＝Audio_master*K1+Audio_slave*K2；
K1＝RSSI_master^4/(RSSI_master^4+RSSI_slave^4)；
K2＝RSSI_slave^4/(RSSI_master^4+RSSI_slave^4)；
wherein, Audio _ out is an Audio signal output by the Audio merging circuit, Audio _ master is a first Audio signal, Audio _ slave is a second Audio signal, RSSI _ master is a first indication signal, and RSSI _ slave is a second indication signal.
When the proportion combination mode is adopted, the energy of the two paths of audio signals is combined according to a certain proportion coefficient, so that the energy of the received useful signal is increased, and the noise is not obviously enhanced, so that the signal-to-noise ratio of the audio signals after combination and output can be improved, and the tone quality of audio output can be improved.
In a possible implementation manner of the first aspect, when the audio receiving chip operates in the master mode, the front-end processing circuit is further configured to output a first indication signal representing a first audio signal strength to the audio combining circuit, and the input-output circuit is further configured to output a second indication signal representing a second audio signal strength to the audio combining circuit, and the audio combining circuit is configured to combine and output the input audio signals by: and when the signal intensity represented by the first indication signal is greater than that represented by the second indication signal, outputting the first audio signal, otherwise, outputting the second audio signal.
When the selective combining mode is adopted, the audio combining circuit can track one path of signal with stronger signal in the two paths of audio signals and output the signal, so that when the radio frequency signal received by one antenna is weaker or the signal is interrupted, the signal can be switched to the signal received by the other antenna, and the phenomena of mute and sound interruption are prevented.
In a possible implementation manner of the first aspect, when the audio receiving chip operates in the master mode, the front-end processing circuit is further configured to output a first indication signal representing a strength of a first audio signal to the audio combining circuit, and the audio combining circuit is configured to combine and output the input audio signals by: and when the signal intensity represented by the first indication signal is greater than a preset threshold, outputting the first audio signal, otherwise, outputting the second audio signal.
The merging mode only needs the indication signal corresponding to the audio receiving chip working in the master mode, and does not need the audio receiving chip working in the slave mode to transmit the indication signal, so that the data volume transmitted between the two chips is reduced, and the transmission speed is accelerated.
In one possible implementation of the first aspect, the input-output circuit includes a GPIO pin disposed on the audio receiving chip, the GPIO pin configured as a bi-directional IO pin.
The bidirectional IO pin has the input and output functions at the same time, and when the audio receiving chip is configured in different modes, the GPIO pin can be correspondingly used as input or output IO to realize audio signal transmission with another chip.
In a second aspect, an embodiment of the present application provides an audio receiving chip configured in an audio receiver, where the audio receiving chip includes a front-end processing circuit, a framing circuit, and an input/output circuit, the front-end processing circuit is connected to an antenna of the audio receiver and the framing circuit, the framing circuit is connected to the input/output circuit, the front-end processing circuit is configured to receive a radio frequency signal transmitted from the antenna and demodulate the radio frequency signal to obtain a first audio signal carried in the radio frequency signal, and output the first audio signal to the framing circuit, and the framing circuit is configured to frame the first audio signal and output a framed signal to another audio receiving chip through the input/output circuit.
The audio receiving chip can transmit the obtained audio signal to another audio receiving chip through the input and output circuit, so that an audio analog switch is not needed in the diversity receiving process of the audio receiver, an MCU is not needed to participate in the output control of the audio signal, and the peripheral circuit of the audio receiving chip is simplified.
In a third aspect, an embodiment of the present application provides an audio receiving chip configured in an audio receiver, where the audio receiving chip includes a front-end processing circuit, an input-output circuit, a deframing circuit, a delay circuit, and an audio combining circuit, the front-end processing circuit is connected to an antenna of the audio receiver, the input-output circuit, and the delay circuit, the input-output circuit is connected to the deframing circuit, and the audio combining circuit is connected to the deframing circuit and the delay circuit, respectively; the front-end processing circuit is used for receiving the radio-frequency signal transmitted by the antenna and demodulating the radio-frequency signal to obtain a first audio signal carried in the radio-frequency signal, the input-output circuit is used for receiving the framed signal transmitted by another audio receiving chip, and outputs the framed signal to the deframing circuit, the deframing circuit is configured to extract a second audio signal carried in the framed signal and output the second audio signal to the audio combining circuit, the delay circuit is configured to perform delay processing on the first audio signal, to compensate for a phase difference between the first audio signal and the second audio signal due to framing and de-framing, and outputting the delayed first audio signal to the audio merging circuit, wherein the audio merging circuit is used for merging and outputting the input audio signal.
The audio receiving chip can receive the audio signal from another audio receiving chip through the input and output circuit, so that the audio signals of the two audio receiving chips can be directly obtained in the audio receiving chip, and the signals do not need to be output to a peripheral MCU and an audio analog switch, so that the peripheral circuit of the chip is simpler.
In a fourth aspect, an embodiment of the present application provides an audio receiver, including: two antennas; each audio receiving chip is used for receiving a radio-frequency signal transmitted by a corresponding antenna and demodulating the radio-frequency signal to obtain an audio signal carried in the radio-frequency signal, and one of the two audio receiving chips combines and outputs the obtained audio signal and an audio signal transmitted by the other audio receiving chip through an audio combining circuit; the audio output interface is used for outputting the audio signal output by the audio merging circuit; the two audio receiving chips are the audio receiving chips described in the first aspect or any one of the possible embodiments of the first aspect, wherein one audio receiving chip operates in a master mode and the other audio receiving chip operates in a slave mode.
In a fifth aspect, an embodiment of the present application provides an audio receiver, including: two antennas; each audio receiving chip is used for receiving a radio-frequency signal transmitted by a corresponding antenna and demodulating the radio-frequency signal to obtain an audio signal carried in the radio-frequency signal, and one of the two audio receiving chips combines and outputs the obtained audio signal and an audio signal transmitted by the other audio receiving chip through an audio combining circuit; the audio output interface is used for outputting the audio signal output by the audio merging circuit; the two audio receiving chips comprise an audio receiving chip of the second aspect and an audio receiving chip of the third aspect.
The two audio receivers provided by the above adopt two antennas and two audio receiving chips to receive and demodulate radio frequency signals, and the problem of audio drop of the receivers is solved in a diversity receiving mode.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.
Fig. 1 is a prior art diversity scheme;
fig. 2 is a schematic diagram of an audio receiving chip according to a first embodiment of the present application;
FIG. 3 is a schematic diagram of the operation of an audio receiver according to the present application;
fig. 4 is another schematic diagram of an audio receiving chip according to a first embodiment of the present application;
FIG. 5 is a diagram illustrating a frame structure during framing according to a first embodiment of the present application;
fig. 6 is a circuit structure diagram of an audio combining circuit according to a first embodiment of the present application;
fig. 7 is another circuit structure diagram of the audio combining circuit according to the first embodiment of the present application;
fig. 8 is a schematic diagram of an audio receiving chip according to a second embodiment of the present application;
fig. 9 is a schematic diagram of another audio receiving chip according to a second embodiment of the present application;
fig. 10 is a schematic diagram of an audio receiver according to a third embodiment of the present application.
Icon: 101-front-end processing circuitry; 102-input-output circuitry; 103-audio merging circuit; 104-framing circuit; 105-a deframing circuit; 106-a delay circuit; 201-a wireless microphone; 202-main receiving chip; 203-slave receiving chip; 301-an antenna; 302-an audio receiving chip; 303-audio output interface.
Detailed Description
The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures. Meanwhile, in the description of the present application, the terms "first", "second", and the like are used for distinguishing descriptions only and are not intended to indicate or imply relative importance, and the terms "include", or any other variations thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
In a wireless microphone system, a user usually holds a wireless microphone to work, for example, in scenes such as a concert and a large stage, the moving direction and speed of the user are arbitrary, signals transmitted by the wireless microphone are reflected and scattered by various nearby objects to form multipath propagation, so that signals reaching an antenna of an audio receiver are often superposed by a plurality of signals with different amplitudes and phases, thereby causing signal fading and frequency drop of the receiver. As shown in fig. 1, the existing diversity scheme for solving this problem needs to rely on the MCU and the audio analog switch outside the audio receiving chip to complete the tracking and selective output of the audio signal, so that the peripheral circuit of the chip is complicated.
First embodiment
Referring to fig. 2, the audio receiving chip includes a front-end processing circuit 101, an input/output circuit 102, and an audio combining circuit 103, where the front-end processing circuit 101 is connected to an antenna of the audio receiver, the input/output circuit 102, and the audio combining circuit 103, respectively, and the input/output circuit 102 is connected to the audio combining circuit 103. The antenna is configured to receive a radio frequency signal, and the front-end processing circuit 101 is configured to demodulate the radio frequency signal received by the antenna to obtain a first audio signal carried in the radio frequency signal. The audio receiving chip can be configured to operate in any one of a master mode and a slave mode, and when configured in different modes, the input-output circuit 102 and the audio combining circuit 103 operate in different manners.
When the audio receiving chip works in the master mode, the front-end processing circuit 101 outputs the obtained first audio signal to the audio merging circuit 103, and meanwhile, the input-output circuit 102 receives a second audio signal transmitted from another audio receiving chip working in the slave mode and outputs the second audio signal to the audio merging circuit 103, so that two paths of audio signals are input to the input end of the audio merging circuit 103, and finally, the audio merging circuit 103 merges and outputs the input two paths of audio signals according to a set logic; when the audio receiving chip operates in the slave mode, the front-end processing circuit 101 is configured to output the first audio signal to another audio receiving chip operating in the master mode through the input/output circuit 102, and an audio combining circuit in the other audio receiving chip combines and outputs the audio signals of the two chips.
The audio receiver in this embodiment may include two or more antennas, and two or more audio receiving chips, each of which is correspondingly connected to one antenna, and for convenience of description, two antennas and two audio receiving chips are provided in the audio receiver, which will be described below as an example, where one of the two audio receiving chips provided in the audio receiver is configured as a master mode, and the other is configured as a slave mode.
The operating principle of the audio receiver is shown in fig. 3, a main receiving chip 202 (i.e., an audio receiving chip operating in a main mode) and a slave receiving chip 203 (i.e., an audio receiving chip operating in a slave mode) respectively receive a radio frequency signal transmitted by a transmitter in a wireless microphone 201, after the radio frequency signal is obtained through demodulation, the slave receiving chip 203 transmits the audio signal to the main receiving chip 202 through an input/output circuit, the main receiving chip 202 combines and outputs two paths of audio signals, the audio signal combined and output by the main receiving chip 202 does not need to be sent to an MCU or an audio analog switch, and peripheral circuits of the chip are simplified.
The audio receiving chip can work in two modes, the configuration is flexible, the chip structures of the two modes in the audio receiver are the same, and uniform production and manufacturing are facilitated, so that the implementation cost of the chip can be saved.
Optionally, the Input/Output circuit may include a General Purpose Input/Output (GPIO) pin disposed on the audio receiving chip, the GPIO pin being configured as a bidirectional IO pin and having both Input and Output functions, and when the audio receiving chip is configured in different modes, the GPIO pin may be used as an Input or an Output IO correspondingly, so that the audio receiving chip utilizes the bidirectional GPIO pin to achieve audio signal transmission with another chip.
Optionally, referring to fig. 4, the audio receiving chip further includes a framing circuit 104, a deframing circuit 105, and a delay circuit 106, the framing circuit 104 is connected between the front-end processing circuit 101 and the input-output circuit 102, the deframing circuit 105 is connected between the input-output circuit 102 and the audio combining circuit 103, and the delay circuit 106 is connected between the front-end processing circuit 101 and the audio combining circuit 103, and when the chip is configured in different modes, the framing circuit 104, the deframing circuit 105, and the delay circuit 106 operate in different manners.
When the audio receiving chip operates in the slave mode, the framing circuit 104 is configured to pack and frame the audio signal and the frame header signal, and may further include other signals (such as an indication signal representing the strength of the audio signal) that need to be transmitted to another chip, and perform parallel-to-serial conversion on the framed signals, convert the framed signals into a path of digital signals and output the digital signals through a GPIO, that is, if a 20-bit digital signal is transmitted to another chip, the digital signal is not output through 20 GPIOs at the same time, but is output through a GPIO after being converted into a serial 1-bit signal, which of course may not be output in a serial manner in practical situations.
Illustratively, after framing the audio signal, the indication signal, and the frame header signal together, the frame structure formed may be as shown in fig. 5, wherein the frame header signal may be a Barker code as a header identification of each frame for serial data synchronization, and the indication signal may be an RSSI signal.
When the audio receiving chip operates in the master mode, the input/output circuit 102 is configured to receive a serial signal transmitted from another audio receiving chip operating in the slave mode, and output the serial signal to the deframing circuit 105; the de-framing circuit 105 is configured to extract a second audio signal carried in the serial signal, for example, the same header identifier is used to correlate with the received serial signal to find a start position of each frame, so as to recover a frame structure in the serial signal, so that an original audio signal and an indication signal can be recovered from a serial data stream according to a frame header and a frame length known in advance, and the recovered second audio signal is output to the audio combining circuit 103; the delay circuit 106 is mainly composed of a delay unit, and is configured to perform delay processing on the first audio signal to compensate for delay introduced by the framing and de-framing processes between the first audio signal and the second audio signal, so that the phases of the master audio signal and the slave audio signal are consistent, and audio combining is performed conveniently, and finally, the delayed first audio signal is output to the audio combining circuit 103.
Optionally, the audio combining circuit 103 implements a digital logic circuit to combine and output the two audio signals, and the combined output may include, but is not limited to, the following:
A. proportional combining
The front-end processing circuit outputs the first audio signal to the audio merging circuit and outputs a first indication signal (calculated by the front-end processing circuit) representing the strength of the first audio signal, and the input-output circuit outputs the second audio signal (i.e. the audio signal transmitted from the receiving chip) to the audio merging circuit and outputs a second indication signal (calculated by the front-end processing circuit from the receiving chip) representing the strength of the second audio signal.
The audio combining circuit is configured to combine and output the input audio signals by:
Audio_out＝Audio_master*K1+Audio_slave*K2；
K1＝RSSI_master^4/(RSSI_master^4+RSSI_slave^4)；
K2＝RSSI_slave^4/(RSSI_master^4+RSSI_slave^4)；
wherein, Audio _ out is an Audio signal output by the Audio merging circuit, Audio _ master is a first Audio signal, Audio _ slave is a second Audio signal, RSSI _ master is a first indication signal, RSSI _ slave is a second indication signal, and K1 and K2 are proportionality coefficients.
In specific implementation, the audio combining circuit may use logic devices such as digital multipliers and adders to implement proportional combining, and of course, specific parameters of K1 and K2 may not be limited to the examples given above, and may be adjusted according to actual needs. For example, fig. 6 and fig. 7 show a circuit diagram for implementing the proportional combining logic, where a1, a2, A3, a4, a5, a6, a7, and A8 are digital multipliers for multiplying two paths of data, B1 and B2 are digital adders for adding two paths of input data, and C1 is an inverse unit for inverting the input data. The audio combining circuit in this embodiment can be implemented with reference to fig. 6 and 7.
The energy of the two paths of audio signals can be combined according to a certain proportion coefficient by adopting a proportion combination mode, so that the energy of the received useful signals is increased, and the noise is not obviously enhanced, so that the signal-to-noise ratio of the audio signals after combination and output can be improved, and the tone quality of audio output can be improved.
B. Selection merge (1)
The front-end processing circuit outputs a first audio signal to the audio combining circuit and outputs a first indication signal representing the strength of the first audio signal, and the input-output circuit outputs a second audio signal to the audio combining circuit and outputs a second indication signal representing the strength of the second audio signal. The audio combining circuit is configured to combine and output the input audio signals by: and when the signal intensity represented by the first indicating signal is larger than that represented by the second indicating signal, outputting the first audio signal, otherwise, outputting the second audio signal.
When the selective combination mode is adopted, the audio combination circuit can track one path of signal with stronger signal in the two paths of audio signals and output the signal, so that when the radio frequency signal received by one antenna is weaker or the signal is interrupted, the signal can be switched to the signal received by the other antenna, and the phenomena of mute and sound interruption are prevented.
C. Selection merge (2)
The front-end processing circuit outputs a first audio signal to the audio combining circuit and outputs a first indication signal representing the strength of the first audio signal, and the input-output circuit outputs a second audio signal to the audio combining circuit. The audio combining circuit is configured to combine and output the input audio signals by: and when the signal intensity represented by the first indicating signal is greater than a preset threshold, outputting a first audio signal, otherwise, outputting a second audio signal.
The merging mode only needs to judge whether the signal strength represented by the indication signal obtained by the calculation of the main receiving chip is greater than a preset threshold to carry out selective output, and does not need to send the indication signal from the receiving chip, so that the data volume transmitted between the two chips is reduced, and the transmission speed is accelerated.
The indication Signal in the three merging schemes may be RSSI or Signal-to-noise ratio (SNR), and a higher SNR indicates that there are fewer noise in the audio Signal, which can reflect the energy and quality of the audio Signal. Therefore, the indication signal is not calculated in a unique manner as long as the intensity of the audio signal can be represented, and this embodiment is not limited thereto.
In a specific embodiment, the front-end processing circuit 101 includes a radio-frequency front-end circuit and a demodulation circuit, an input end of the radio-frequency front-end circuit is connected to an antenna, an input end of the demodulation circuit is connected to an output end of the radio-frequency front-end circuit, wherein the radio-frequency front-end circuit is configured to perform down-conversion and analog-to-digital conversion on a radio-frequency signal transmitted from the antenna, and the demodulation circuit is configured to demodulate a digital signal output by the radio-frequency front-end circuit.
The radio frequency front-end circuit may include a gain amplifier, an oscillator, a mixer, a filter, and an analog-to-digital converter, where the gain amplifier and the oscillator are respectively connected to the mixer, the filter, and the analog-to-digital converter are sequentially connected, the gain amplifier is configured to perform gain amplification processing on a radio frequency signal, the oscillator is configured to generate a local oscillation signal, the mixer is configured to mix the gain-amplified radio frequency signal with the local oscillation signal, so that a high-frequency radio frequency signal is down-converted to an intermediate frequency signal, the filter is configured to filter an output intermediate frequency signal, and the analog-to-digital converter is configured to perform analog-to-digital conversion on a filtered required intermediate frequency signal to obtain.
The demodulation circuit operates after the analog-to-digital converter, and demodulates the signal into digital demodulation by using any one of Amplitude Shift Keying (ASK) demodulation, Frequency Shift Keying (FSK) demodulation and Phase Shift Keying (PSK) demodulation, so that the demodulation circuit can be configured to support ASK demodulation, FSK demodulation or PSK demodulation, for example, if the transmitter in the wireless microphone uses ASK modulation, the received radio frequency signal is ASK radio frequency signal, and thus the demodulation circuit corresponds to ASK demodulation circuit. The digital signal output by the rf front-end circuit may obtain a digital baseband signal therein, i.e., an audio signal carried in the rf signal, through the demodulation circuit.
Optionally, the rf front-end circuit, the demodulation circuit, the framing circuit, the deframing circuit, and the audio combining circuit are all integrated in an audio receiving chip, and a bidirectional GPIO pin is disposed on the audio receiving chip to implement signal transmission with another audio receiving chip, so that a peripheral circuit of the audio receiving chip can be simplified, and meanwhile, after each circuit module is integrated inside the audio receiving chip, it is obvious that a volume occupied by the whole audio receiving chip is reduced to a certain extent compared with a volume occupied by an existing audio receiving chip, an MCU, and an audio analog switch.
In this embodiment, after the audio receiving chip shown in fig. 4 is configured as the main mode, the front-end processing circuit 101, the delay circuit 106, the deframing circuit 105 and the audio combining circuit 103 are correspondingly turned on, the framing circuit 104 is turned off, and GPIOs in the input-output circuit 102 are used for input, so as to receive audio signals from another audio receiving chip; after the slave mode is configured, the front-end processing circuit 101, the framing circuit 104, the deframing circuit 105, the delay circuit 106 and the audio combining circuit 103 are correspondingly turned on, and GPIOs in the input-output circuit 102 are used for outputting, so as to transmit audio signals to another audio receiving chip.
Each circuit module in the audio receiving chip is provided with a control port, and the control port can control the on or off of each circuit module. In one embodiment, the operating mode of the chip may be configured by another GPIO pin, for example, when the GPIO pin is set to high, the chip is configured to master mode, when the GPIO pin is set to low, the chip is configured to slave mode, and the audio receiving chip correspondingly turns on or off each circuit through each control port according to the circuit module required by the configured operating mode.
Second embodiment
Referring to fig. 8, the audio receiving chip in this embodiment includes a front-end processing circuit 101, a framing circuit 104, and an input/output circuit 102, where the front-end processing circuit 101 is connected to an antenna of the audio receiver and the framing circuit 104, respectively, and the framing circuit 104 is connected to the input/output circuit 102.
The audio receiving chip is different from the audio receiving chip provided in the first embodiment in that the circuit module not used in the slave mode is removed, and therefore, the working principle and the alternative implementation of each circuit module in the audio receiving chip can be referred to the description of the above embodiment.
The audio receiving chip reduces the circuit modules which are closed in the slave mode, so that the peripheral circuit of the chip is simplified, the circuit of the audio receiving chip is simpler, and the working mode of the chip does not need to be additionally configured.
In addition, the present embodiment also provides another audio receiving chip, referring to fig. 9, the audio receiving chip includes a front-end processing circuit 101, an input-output circuit 102, a deframing circuit 105, a delay circuit 106, and an audio combining circuit 103, the front-end processing circuit 101 is respectively connected to an antenna of the audio receiver, the input-output circuit 102, and the delay circuit 106, the input-output circuit 102 is connected to the deframing circuit 105, and the audio combining circuit 103 is respectively connected to the deframing circuit 105 and the delay circuit 106.
The audio receiving chip is different from the audio receiving chip provided in the first embodiment in that the framing circuit not used in the main mode is removed, and therefore, the working principle and the alternative implementation of each circuit module in the audio receiving chip can be referred to the description of the above embodiment.
The two audio receiving chips provided by the embodiment can be independently applied to the existing audio receiver, and can also be matched with each other in pairs to realize the diversity reception of the audio receiver, so that the frequency drop phenomenon of the audio receiver is solved.
Third embodiment
The present embodiment provides an audio receiver, and referring to fig. 10, the audio receiver includes two antennas 301; two audio receiving chips 302; and an audio output interface 303. Each audio receiving chip 302 is configured to receive a radio frequency signal transmitted from the corresponding antenna 301, demodulate the radio frequency signal, and obtain an audio signal carried in the radio frequency signal, and one of the two audio receiving chips combines and outputs the obtained audio signal and an audio signal transmitted from the other audio receiving chip through an audio combining circuit.
Alternatively, the audio signal output by the audio combining circuit may be a digital audio signal, and the output end of the audio combining circuit may be connected to a digital-to-analog converter, through which the digital audio signal is converted into an analog audio signal, and the analog audio signal may be output to the sound amplifying device through the audio output interface 303 and played by the sound amplifying device. Besides, the digital audio signal may also be directly output to the next-stage processing device through the audio output interface 303 for further processing.
In a possible implementation manner, the two audio receiving chips may be the audio receiving chips provided in the first embodiment, wherein one of the audio receiving chips operates in the master mode, and the other audio receiving chip operates in the slave mode, and after configuration is completed, signal transmission can be implemented between the two receiving chips.
In another possible implementation manner, the two audio receiving chips may be the audio receiving chips provided in the second embodiment, one of the audio receiving chips is the first audio receiving chip provided in the second embodiment, and the other audio receiving chip is the second audio receiving chip provided in the second embodiment, and the two audio receiving chips do not need to be configured in a working mode, and after the connection is completed, the two audio receiving chips can be matched with each other to realize signal transmission.
The audio receiver uses two antennas and two audio receiving chips, the two antennas can receive radio frequency signals transmitted by the same wireless microphone, two paths of audio signals are combined and output through an audio combining circuit inside the audio receiving chip, the frequency drop phenomenon caused by signal superposition and phase offset in multipath transmission can be greatly eliminated, in addition, when the audio combining circuit adopts a proportional combining mode, the signal to noise ratio of the audio signals output by the audio receiver can be improved, and the tone quality of audio output can be improved.
It should be understood that the audio receiver may further include more than two antennas and more than two audio receiving chips, which is only illustrated by way of example in this embodiment, and the number of antennas may be adjusted in practical situations.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present application should be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. An audio receiving chip is configured in an audio receiver, and the audio receiving chip includes a front-end processing circuit, an input-output circuit, and an audio combining circuit, where the front-end processing circuit is connected to an antenna of the audio receiver, the input-output circuit, and the audio combining circuit, respectively, the input-output circuit is connected to the audio combining circuit, and the front-end processing circuit is configured to receive a radio-frequency signal transmitted from the antenna and demodulate the radio-frequency signal to obtain a first audio signal carried in the radio-frequency signal;
the audio receiving chip works in a master mode or a slave mode, when the audio receiving chip works in the master mode, the front-end processing circuit is used for outputting the first audio signal to the audio merging circuit, the input-output circuit is used for receiving a second audio signal transmitted by another audio receiving chip working in the slave mode and outputting the second audio signal to the audio merging circuit, and the audio merging circuit is used for merging and outputting the input audio signal;
when the audio receiving chip works in a slave mode, the front-end processing circuit is used for outputting the first audio signal to another audio receiving chip working in a master mode through the input-output circuit.
2. The audio receiving chip of claim 1, further comprising a framing circuit disposed between the front-end processing circuit and the input-output circuit, a deframing circuit disposed between the input-output circuit and the audio combining circuit, and a delay circuit disposed between the front-end processing circuit and the audio combining circuit;
when the audio receiving chip works in a slave mode, the framing circuit is used for framing the first audio signal and outputting the framed signal to the input and output circuit;
when the audio receiving chip works in the master mode, the input/output circuit is configured to receive a framed signal transmitted by another audio receiving chip working in the slave mode, and output the framed signal to the deframing circuit, the deframing circuit is configured to extract a second audio signal carried in the framed signal and output the second audio signal to the audio combining circuit, and the delay circuit is configured to perform delay processing on the first audio signal to compensate for a phase difference between the first audio signal and the second audio signal due to framing and deframing, and output the delayed first audio signal to the audio combining circuit.
3. The chip of claim 1, wherein when the audio receiving chip operates in the master mode, the front-end processing circuit is further configured to output a first indication signal representing a first audio signal strength to the audio combining circuit, and the input-output circuit is further configured to output a second indication signal representing a second audio signal strength to the audio combining circuit, and the audio combining circuit is configured to combine and output the input audio signals by:
Audio_out＝Audio_master*K1+Audio_slave*K2；
K1＝RSSI_master∧4/(RSSI_master∧4+RSSI_slave∧4)；
K2＝RSSI_slave∧4/(RSSI_master∧4+RSSI_slave∧4)；
wherein, Audio _ out is an Audio signal output by the Audio merging circuit, Audio _ master is a first Audio signal, Audio _ slave is a second Audio signal, RSSI _ master is a first indication signal, and RSSI _ slave is a second indication signal.
4. The chip of claim 1, wherein when the audio receiving chip operates in the master mode, the front-end processing circuit is further configured to output a first indication signal representing a first audio signal strength to the audio combining circuit, and the input-output circuit is further configured to output a second indication signal representing a second audio signal strength to the audio combining circuit, and the audio combining circuit is configured to combine and output the input audio signals by:
and when the signal intensity represented by the first indication signal is greater than that represented by the second indication signal, outputting the first audio signal, otherwise, outputting the second audio signal.
5. The chip of claim 1, wherein when the audio receiving chip operates in the master mode, the front-end processing circuit is further configured to output a first indication signal representing a strength of a first audio signal to the audio combining circuit, and the audio combining circuit is configured to combine and output the input audio signals by:
and when the signal intensity represented by the first indication signal is greater than a preset threshold, outputting the first audio signal, otherwise, outputting the second audio signal.
6. The chip of any one of claims 1-5, wherein the input-output circuit comprises a GPIO pin disposed on the audio receiving chip, the GPIO pin configured as a bi-directional IO pin.
7. An audio receiving chip configured on an audio receiver, the audio receiving chip includes a front-end processing circuit, a framing circuit and an input-output circuit, the front-end processing circuit is respectively connected to an antenna of the audio receiver and the framing circuit, the framing circuit is connected to the input-output circuit, the front-end processing circuit is configured to receive a radio frequency signal transmitted from the antenna and demodulate the radio frequency signal to obtain a first audio signal carried in the radio frequency signal and output the first audio signal to the framing circuit, the framing circuit is configured to frame the first audio signal and output the framed signal to another audio receiving chip through the input-output circuit, so that the another audio receiving chip extracts the audio signal carried in the framed signal, and combining and outputting the extracted audio signal and the audio signal demodulated from the radio frequency signal received by the other audio receiving chip.
8. An audio receiving chip configured in an audio receiver, the audio receiving chip comprising a front-end processing circuit, an input-output circuit, a deframing circuit, a delay circuit and an audio combining circuit, the front-end processing circuit being connected to an antenna of the audio receiver, the input-output circuit and the delay circuit, respectively, the input-output circuit being connected to the deframing circuit, and the audio combining circuit being connected to the deframing circuit and the delay circuit, respectively;
the front-end processing circuit is used for receiving the radio-frequency signal transmitted by the antenna and demodulating the radio-frequency signal to obtain a first audio signal carried in the radio-frequency signal, the input-output circuit is used for receiving the framed signal transmitted by another audio receiving chip, and outputs the framed signal to the deframing circuit, the deframing circuit is configured to extract a second audio signal carried in the framed signal and output the second audio signal to the audio combining circuit, the delay circuit is configured to perform delay processing on the first audio signal, to compensate for a phase difference between the first audio signal and the second audio signal due to framing and de-framing, and outputting the delayed first audio signal to the audio merging circuit, wherein the audio merging circuit is used for merging and outputting the input audio signal.
9. An audio receiver, comprising:
two antennas;
each audio receiving chip is used for receiving a radio-frequency signal transmitted by a corresponding antenna and demodulating the radio-frequency signal to obtain an audio signal carried in the radio-frequency signal, and one of the two audio receiving chips combines and outputs the obtained audio signal and an audio signal transmitted by the other audio receiving chip through an audio combining circuit;
the audio output interface is used for outputting the audio signal output by the audio merging circuit;
the two audio receiving chips are the audio receiving chips according to any one of claims 1 to 6, wherein one audio receiving chip operates in a master mode and the other audio receiving chip operates in a slave mode.
10. An audio receiver, comprising:
two antennas;
each audio receiving chip is used for receiving a radio-frequency signal transmitted by a corresponding antenna and demodulating the radio-frequency signal to obtain an audio signal carried in the radio-frequency signal, and one of the two audio receiving chips combines and outputs the obtained audio signal and an audio signal transmitted by the other audio receiving chip through an audio combining circuit;
the audio output interface is used for outputting the audio signal output by the audio merging circuit;
the two audio receiving chips include an audio receiving chip according to claim 7 and an audio receiving chip according to claim 8.
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