CN110415918A - Inductance element and filter - Google Patents
Inductance element and filter Download PDFInfo
- Publication number
- CN110415918A CN110415918A CN201810405564.1A CN201810405564A CN110415918A CN 110415918 A CN110415918 A CN 110415918A CN 201810405564 A CN201810405564 A CN 201810405564A CN 110415918 A CN110415918 A CN 110415918A
- Authority
- CN
- China
- Prior art keywords
- substrate
- wire
- pattern
- transmission line
- line layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 95
- 230000005540 biological transmission Effects 0.000 claims abstract description 83
- 230000004308 accommodation Effects 0.000 claims abstract description 37
- 238000004804 winding Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910001289 Manganese-zinc ferrite Inorganic materials 0.000 description 3
- JIYIUPFAJUGHNL-UHFFFAOYSA-N [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[Mn++].[Mn++].[Mn++].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Zn++].[Zn++] Chemical compound [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[Mn++].[Mn++].[Mn++].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Zn++].[Zn++] JIYIUPFAJUGHNL-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 229910001053 Nickel-zinc ferrite Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 230000002401 inhibitory effect Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 230000009916 joint effect Effects 0.000 description 2
- 239000011133 lead Substances 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
- 241001122767 Theaceae Species 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F17/06—Fixed inductances of the signal type with magnetic core with core substantially closed in itself, e.g. toroid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/26—Fastening parts of the core together; Fastening or mounting the core on casing or support
- H01F27/266—Fastening or mounting the core on casing or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0073—Printed inductances with a special conductive pattern, e.g. flat spiral
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F2017/0093—Common mode choke coil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2814—Printed windings with only part of the coil or of the winding in the printed circuit board, e.g. the remaining coil or winding sections can be made of wires or sheets
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
- H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
This application discloses a kind of inductance element and filters, the inductance element includes: substrate, magnetic core, transmission line layer and multiple conduct pieces, substrate is defined as central part and outer part by the annular accommodation groove on substrate, opens up multiple inside and outside via holes on central part and outer part respectively；Magnetic core is housed in annular accommodation groove；Substrate two sides are each provided with an at least transmission line layer, and each transmission line layer includes multiple wire patterns being connected across between inside and outside via hole；The multiple conduct pieces being arranged in internal and turned on outside hole are sequentially connected with wire pattern to form the wire loop around magnetic core；Wire pattern in same transmission line layer is divided into multiple groups line pattern, and the direction of routing of adjacent two wire pattern in every group is consistent.The wire loop formed on substrate around magnetic core filters out performance to common-mode signal to improve inductance element so that adjacent wires pattern direction of routing is consistent.
Description
Technical field
This application involves technical field of integrated circuits, more particularly to a kind of inductance element and filter.
Background technique
Common mode inductance is one using ferrite as the common mode interference suppression device of magnetic core, has for common-mode signal and inhibits
Effect, and almost do not work for difference mode signal.The working principle of common mode inductance is magnetic when flowing through common mode current in magnet ring
It is logical to be overlapped mutually, to have sizable inductance, inhibiting effect is played to common mode current, and when two coils flow through differential mode electricity
When stream, the magnetic flux in magnet ring is cancelled out each other, almost without inductance, so differential-mode current can pass through undampedly.Therefore, altogether
Mould inductance can effectively inhibit common mode interference signal in balanced circuit, and on the difference mode signal of route normal transmission without influence.
Two coils are wound on same iron core by current common mode inductance frequently with the mode of hand wound.But it is artificial
Coiling error is larger, it is extremely difficult to guarantee that common-mode signal is filtered out completely, and the consistency of common mode inductance is not high, product yield is low.
Summary of the invention
The application is electric in the prior art to solve mainly solving the technical problems that provide a kind of inductance element and filter
Sensing unit cannot completely filtering common mode signal and consistency it is not high, the low technical problem of yields.
In order to solve the above technical problems, the technical solution that the application uses is: providing a kind of inductance element, comprising:
Substrate offers annular accommodation groove thereon, by the substrate be defined as being located at the central part inside the annular accommodation groove with
And the outer part positioned at the annular accommodation groove periphery, it offers on the central part and internal is connected through the multiple of the substrate
Hole is offered through multiple turned on outside holes of the substrate on the outer part；Magnetic core is housed in the annular accommodation groove
It is interior；Transmission line layer, the opposite two sides of the substrate are each provided at least one transmission line layer, wherein each transmission line
Layer includes multiple wire patterns along the circumferentially-spaced arrangement of the annular accommodation groove, and each wire pattern is connected across correspondence
An inner via hole and a turned on outside hole between；With multiple conduct pieces, setting is in the internal conducting
In hole and the turned on outside hole, the wire pattern for being sequentially connected in all transmission line layers, and then formed around
The wire loop of the magnetic core transmission electric current；Wherein, all wire patterns in the same transmission line layer are divided into multiple groups
Line pattern, in line pattern described in every group, the direction of routing of adjacent two wire pattern is consistent.
In order to solve the above technical problems, another technical solution that the application uses is: providing a kind of filter, comprising:
At least one layer of substrate offers multiple annular accommodation grooves on each substrate；Each annular accommodation groove is by the base
Plate, which is divided into, encloses the central part set by the annular accommodation groove and around the outer part of the annular accommodation groove setting；Each institute
The multiple inner via holes offered on central part through the substrate are stated, and offers and runs through on each outer part
Multiple turned on outside holes of the substrate；Multiple magnetic cores are placed in the corresponding annular accommodation groove；Transmission line layer, it is each
The opposite two sides of the substrate are respectively arranged at least one transmission line layer；Each transmission line layer includes along the ring
Multiple wire patterns of the circumferentially-spaced arrangement of shape accommodation groove, each wire pattern are connected across the corresponding inside
Between via hole and a turned on outside hole；With multiple conduct pieces, setting is led in the inner via hole and the outside
In through-hole, all wire patterns in two transmission line layers for being sequentially connected on each substrate, in turn
Form the wire loop around each magnetic core transmission electric current；Wherein, in the transmission line layer of each described substrate the same side
All wire patterns be divided into multiple groups line pattern, in line pattern described in every group, the adjacent two wire pattern cabling
Direction is consistent；It is multiple central parts, the corresponding outer part and multiple magnetic cores on each substrate, more
A conduct piece, and constitute positioned at the transmission line layer of each substrate opposite sides according to the arrangement of default arranging rule
At least two inductance elements；On the same substrate, all inductance elements are mutually indepedent.
Having the beneficial effect that for above-described embodiment forms multiple wire patterns by the opposite sides in substrate, then in base
Via hole is opened up on plate, and conduct piece is set to be sequentially connected in the transmission line layer for being located at substrate opposite sides in via hole
Wire pattern, so as to form the wire loop around magnetic core transmission electric current.Adjacent wires pattern direction of routing is consistent, can
So that the phase in two wire loops is identical, to have very big inhibiting effect to common-mode signal, and then inductance is improved
Element filters out performance to common-mode signal.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the perspective view of the inductance element in one embodiment of the application；
Fig. 2 is the schematic cross-sectional view of inductance element in Fig. 1；
Fig. 3 is the schematic perspective view of substrate in Fig. 1；
Fig. 4 is the schematic top plan view of inductance element in Fig. 1；
Fig. 5 is the schematic top plan view of inductance element in another embodiment of the application；
Fig. 6 is the schematic cross-sectional view of inductance element in Fig. 5；
Fig. 7 is the schematic perspective view of another embodiment filter of the application；
Fig. 8 is the three-dimensional structure diagram of the substrate of filter in Fig. 7.
Specific embodiment
Below by the technical scheme in the embodiment of the application is clearly and completely described, it is clear that described implementation
Example is merely a part but not all of the embodiments of the present application.Based on the embodiment in the application, this field is common
Technical staff's every other embodiment obtained without making creative work belongs to the model of the application protection
It encloses.
In one aspect, the application provides a kind of inductance element 100.Also referring to Fig. 1 to Fig. 3, in the present embodiment,
The inductance element 100 is generally can include: substrate 10, insertion substrate 10 in magnetic core 20, positioned at the two of 10 opposite sides of substrate
A transmission line layer 30 and multiple conduct pieces 40.
Wherein, as shown in figure 3, in the present embodiment, substrate 10 may include central part 12 and be arranged around central part 12
Outer part 14.An annular accommodation groove 16 is formed between the central part 12 and outer part 14 of substrate 10, for accommodating (the figure of magnetic core 20
It is shown in 2).
In the present embodiment, central part 12 can be structure as a whole with outer part 14, i.e., by opening at the center of substrate 10
If annular accommodation groove 16 is to be divided into central part 12 and outer part 14 for the substrate 10.Certainly, in other embodiments, the central part
12 with outer part 14 can be separate structure, such as again pass through central part 12 after opening up round accommodation groove at 10 center of substrate
Such as the modes such as bonding are fixed in the circle accommodation groove, make to form the annular accommodation groove between the central part 12 and outer part 14
16, and central part 12 is flushed with the both ends of the surface of outer part 14.
With continued reference to Fig. 1-3, multiple inner via holes 13 through substrate 10 are offered on central part 12.Wherein, more
A inner via hole 13 is arranged adjacent to the lateral wall of the central part 12, and being circumferentially arranged along the central part 12.Accordingly, outside
It encloses and offers multiple turned on outside holes 15 through substrate 10 in portion 14, and multiple turned on outside holes 15 are in outer part 14
Side wall setting, it may be assumed that inner via hole 13 is arranged in the top ring of central part 12 around the top internal perisporium of the magnetic core 20, turned on outside
Hole 15 is arranged in the top ring of outer part 14 around the top peripheral wall of the magnetic core 20.
In the present embodiment, as shown in figure 4, inner via hole 13 is evenly distributed in central part 12.In the same plane,
The line of centres of all inner via holes 13 forms an annular trace 18, and the center at the center of the annular trace 18 and magnetic core 20
It is overlapped.Annular trace 18 can be circular ring shape track, or elliptical path or rectangular path etc. do not limit herein
It is fixed.
When magnetic core 20 is circular ring shape, the also rounded distribution of inner via hole 13.That is, the center of all inner via holes 13
Line forms circular trace, and the center of circle of the circular trace is overlapped with the center of circle of magnetic core 20.
In the present embodiment, the cross sectional shape of the annular accommodation groove 16 and the cross sectional shape of magnetic core 20 are substantially the same, so as to
It can be accommodated in annular accommodation groove 16 in magnetic core 20.Wherein, the cross-sectional shape of the annular accommodation groove 16 can be circular ring shape, side
Annular, ellipse etc..Accordingly, the shape of the magnetic core 20 can be circular ring shape, side's annular, ellipse etc..
In the present embodiment, toroidal core 20 can successively be folded by several annular flakes and be set, can also be by long narrow gold
Belong to material volume around forming, can also be sintered for several metal mixtures.The generation type of toroidal core 20 can there are many,
According to its material difference flexible choice, the application is not construed as limiting.
Magnetic core 20 can be iron core, can also be made of various magnetic metal tea oxides, for example, manganese-zinc ferrite and
Nickel-zinc ferrite etc..Wherein, manganese-zinc ferrite has high magnetic permeability and high magnetic flux density and more low-loss characteristic, nickel-zinc
Ferrite has the characteristics such as high unit area impedance and low magnetic permeability.It is original that magnetic core 20 in the present embodiment, which selects manganese-zinc ferrite,
Material, is formed using high temperature sintering.
With continued reference to Fig. 1-3, the transmission line layer 30 of the two sides opposite positioned at substrate 10 can be made of metal material.For
Formed the transmission line layer 30 metal material include but is not limited to copper, aluminium, iron, nickel, gold, silver, platinum family, chromium, magnesium, tungsten, molybdenum, lead,
Tin, indium, zinc or its any alloy etc..
Further, multiple conduct pieces 40, conduct piece can be set in inner via hole 13 and turned on outside hole 15
40 are electrically connected the transmission line layer 30 for being located at 10 two sides of substrate.
In the present embodiment, which can be metal layer.Referring to Fig. 2, can be for example, by being electroplated, coating
Mode forms conduct piece 40 on the inner wall in inner via hole 13 and turned on outside hole 15, thus will be located at 10 opposite sides of substrate
Transmission line layer 30 be electrically connected.The material of the metal layer include be not limited to copper, aluminium, iron, nickel, gold, silver, platinum family, chromium, magnesium, tungsten,
Molybdenum, lead, tin, indium, zinc or its alloy etc..
In another embodiment, the conduct piece 40 can be metal column, and with each inner via hole 13 or each outside
Diameter of the diameter of the corresponding metal column of via hole 15 less than or equal to inner via hole 13 or turned on outside hole 15 where it.
The material of the metal column is identical as the material of metal layer in a upper embodiment, and details are not described herein again.
In the present embodiment, leading in the metal material and inner via hole 13 and turned on outside hole 15 of transmission line layer 30
Identical material can be selected in the material of electric part 40.It, can be by regarding substrate 10 as cathode, and by substrate 10 for selecting copper
It is placed in the saline solution containing copper ion and is electroplated, transmission line layer 30 can be formed in 10 two sides of substrate, and simultaneously every
Conduct piece 40 is formed on one inner via hole 13 and each 15 inner wall of turned on outside hole.
In another embodiment, the conduct piece in the material Yu inner via hole 13 and turned on outside hole 15 of transmission line layer 30
Different materials also can be selected in 40 material.
With continued reference to Fig. 4 and Fig. 5, the transmission line layer 30 positioned at the every side of substrate 10 includes multiple wire patterns 32；Wherein,
Each wire pattern 32 is connected across between a corresponding inner via hole 13 and a turned on outside hole 15；Each wire pattern
32 one end is connect with the conduct piece 40 in inner via hole 13, and the other end is connect with the conduct piece 40 in turned on outside hole 15.
Therefore, the conduct piece 40 in the conduct piece 40 and turned on outside hole 15 in inner via hole 13 is sequentially connected with positioned at 10 two sides of substrate
Transmission line layer 30 on wire pattern 32, thus formed can around magnetic core 20 transmission electric current wire loop.
In the present embodiment, it can be etched to form above-mentioned multiple conducting wires by the transmission line layer 30 to 10 two sides of substrate
Pattern 32.For example, can be exposed, develop by the transmission line layer 30 of 10 two sides of substrate, obtain being located at 10 two sides of substrate
The protective film on 30 surface of transmission line layer.Then the protective film except position is arranged in wire pattern 32 to remove.Base will be located at later
The transmission line layer 30 of 10 two sides of plate is contacted with etching solution, so that etching solution is by the gold of the unprotected film covering position contacted
Belong to layer dissolution.After etching is completed, cleaning base plate 10 removes the etching solution on its surface, removes protective film then to get in place
Multiple wire patterns 32 in the transmission line layer 30 of 10 two sides of substrate.
In the present embodiment, the transmission line layer 30 with a thickness of 17~102 μm (microns).In one embodiment, in order to
Inductance element 100 is improved for the processing capacity of common-mode signal, so that greater number of conducting wire figure is arranged in transmission line layer 30
Case 32, the thickness of the transmission line layer 30 can be 17~34 μm.
And in other embodiments, in order to improve the conveyance capacity of transmission line layer 30, the thickness of the transmission line layer 30 may be used also
Think 40~100 μm.Optionally, transmission line layer 30 with a thickness of 65~80 μm, this is because when being lost to transmission line layer 30
It carves, when to form wire pattern 32, if thickness is excessive (be greater than 80 μm), and adjacent two leads in same transmission line layer 30
When spacing between line pattern 32 is smaller, it is not clean to may result in etching, two adjacent wire patterns 32 occurs and is connected, and causes
Short circuit；If thickness is too small (i.e. less than 40 μm), the current-carrying capability of wire pattern 32 can be reduced.
In the present embodiment, in same transmission line layer 30, all wire patterns 32 can be divided into multiple groups line pattern 34, In
In every group of line pattern 34, two neighboring 32 direction of routing of wire pattern is consistent, that is, between two wire patterns 32
It is consistent away from the direction of routing along a wherein wire pattern 32.As shown in figure 4, in the present embodiment, being located at 10 side of substrate
Transmission line layer 30 on all wire patterns 32 can be divided into 4 groups of line patterns 34, and include two in every group of line pattern 34
A wire pattern 32.In every group of line pattern 34, two 32 direction of routing of wire pattern are consistent.
Wherein, the spacing between two neighboring wire pattern 32 refers to adjacent two wire pattern 32 close to the outside of other side
The distance between edge.
As shown in figure 4, in the present embodiment, every group of line pattern 34 includes two wire patterns 32, and one of them is led
Line pattern 32 is used to form the first wire pattern, another wire pattern 32 is used to form the second wire pattern.Inside conducting
Conduct piece 40 in hole 13 and turned on outside hole 15 is sequentially connected with the first conducting wire in the transmission line layer 30 of 10 two sides of substrate
Pattern can form first coil.Conduct piece 40 in inner via hole 13 and turned on outside hole 15 is sequentially connected with positioned at substrate 10
The second wire pattern in the transmission line layer 30 of two sides can form the second coil.
Further, the first wire pattern in every group of line pattern 34 and the second wire pattern are along any conducting wire figure
The direction of routing of case 32 is consistent.In the present embodiment, as shown in figure 4, two adjacent first wire patterns and the second conducting wire figure
Distance of the spacing at 13 position of inner via hole between case is d1, and the distance at external 15 position of via hole is d2, by
It is consistent in the direction of routing of the first wire pattern and the second wire pattern, that is, the first wire pattern and the second wire pattern
Spacing be consistent along its direction of routing, therefore d1=d2.In the present embodiment, the first wire pattern and the second wire pattern
The distance between can be 50~180 μm.
In the present embodiment, 32 direction of routing of adjacent wires pattern is consistent.It is separately flowed into when in adjacent wires pattern 32
When common-mode signal, the inductance that common-mode signal generates is cancelled out each other, so that the common-mode signal in signal be filtered out, thus can be improved
Processing capacity of the inductance element for common-mode signal.
In the present embodiment, by space limited and filter for common-mode signal the joint effect for filtering out performance,
The ratio of the length of one coil and the length of the second coil can be 0.8-1.2.That is, the length of first coil and the second coil
The error of length should be ensured that error range is no more than 20%.For example, the length of first coil is the 1.2 of the length of the second coil
Times or the length of first coil be 0.8 times of length of the second coil.
Certainly, in other embodiments, the length of first coil and the length of the second coil can also be equal, due to every group
It include one first wire pattern and one second wire pattern, thus the quantity of the first wire pattern and second in line pattern 34
The quantity of wire pattern is equal, the equal length of the length of every one first wire pattern and every one second conducting wire.Again due to first
The direction of wire pattern and the second wire pattern cabling is consistent, and can be made in the first wire pattern and the second wire pattern
Common-mode signal phase it is identical, performance is filtered out for common-mode signal to improve inductance element 100.
In above-described embodiment, all wire patterns 32 are respectively positioned in the same transmission line layer 30 of 10 two sides of substrate.Certainly, In
In other embodiments, in order to increase the item number of wire pattern 32, it can be respectively set in the two sides of substrate 10 two or more
Transmission line layer 30.
As shown in Figure 5 and Figure 6, in the present embodiment, the opposite sides of substrate 10 is respectively arranged with two layers of transmission line layer, and
Multiple wire patterns 32 are distributed in every layer of transmission line layer.In each transmission line layer, all wire patterns 32 can be with shape
At multiple groups line pattern 34, the projection of every group of line pattern 34 on the substrate 10 can form a projection group.It is same positioned at substrate 10
The corresponding projection group of every group of wire pattern 32 in all transmission line layers of side is arranged alternately along the circumferential direction of magnetic core 20.
Such as in the examples shown in figure 5 and figure 6, it is illustrated by taking the transmission line layer of 10 side of substrate as an example.It is located at
Two layers of transmission line layer of 10 same layer of substrate is respectively first transmission line layer 33 and second transmission line layer 35.Positioned at first transmission line
The projection of every group of line pattern 34 on the substrate 10 on layer 33 forms the first projection group 36, on second transmission line layer 35
The projection of every group of line pattern 34 on the substrate 10 forms the second projection group 38.In the same side of substrate 10, the first projection group 36
It is arranged alternately with the second projection group 38 along the circumferential direction of magnetic core 20.That is, in the present embodiment, the first adjacent projection group 36 and
Line pattern 34 corresponding to two projection groups 38 be located on first transmission line layer 33 and second transmission line layer 35 on.Therefore,
Line pattern 34 corresponding to every two adjacent projection group is located in different transmission line layers.
On the other hand, the application also provides a kind of filter 200, please refers to Fig. 7 and Fig. 8, in the present embodiment, filter
200 generally include at least one layer of substrate 210.Wherein, the substrate 210 is the same as 10 (such as Fig. 1-3 of substrate introduced in above-described embodiment
It is shown), only the size of the substrate 210 is bigger, can accommodate multiple inductance elements 100.
Continue as shown in Figure 7 and Figure 8, to offer the multiple and one-to-one ring of each inductance element 100 over the substrate 210
Shape accommodation groove 216, it is each annular accommodation groove 216 by substrate 210 be divided by annular accommodation groove 216 enclose the central part 212 set with
And the outer part 214 around the setting of annular accommodation groove 216.The structure of each inductance element 100 ibid gives an account of the inductance element to continue
100, that is, include central part 212, outer part 214, the magnetic core (not shown) in embedded rings shape accommodation groove 216, be set in
Conduct piece (not shown) in portion's via hole 213 and turned on outside hole 215 and it is located at each 210 opposite sides of laminar substrate
Transmission line layer 230, these elements are identical as structure before, are no longer discussed in detail herein.Therefore, on every laminar substrate 210
Multiple central parts 212, corresponding outer part 214 and multiple magnetic cores, multiple conduct pieces, and to be located at every laminar substrate 210 opposite
The transmission line layer 230 of two sides is formed at least two inductance elements 100 arranged on same substrate 210 according to default arranging rule.
Wherein, all inductance elements 100 on same substrate 210 are mutually indepedent.
In one embodiment, refering to Fig. 7, which can only include a laminar substrate 210, and on the substrate 210
It is provided with 4 inductance elements 100.The form of 4 100 rectangular arrays of inductance element is arranged on same substrate 210, and 4
Inductance element 100 is mutually indepedent, each other without connection.Certainly, in other embodiments, multiple inductance elements 100 are gone back
For example, the form of annulus is taken to arrange, or radial array can be taken using other form arrangements over the substrate 210
Form, be not listed one by one herein.
Wherein, the wire pattern 232 in the transmission line layer 230 of 210 the same side of substrate can be divided into multiple groups line map
Case 234, multiple groups line pattern 234 are circumferentially arranged along magnetic core, and in every group of line pattern 234, adjacent two wire pattern
232 direction of routing are consistent, that is, the spacing between two wire patterns 32 is protected along the direction of routing of a wherein wire pattern 32
It holds consistent.
Wherein, the spacing between two neighboring wire pattern 32 refers to adjacent two wire pattern 32 close to the outside of other side
The distance between edge.
In the present embodiment, as shown in Figure 7 and Figure 8, every group of line pattern 234 includes two wire patterns 232, and wherein
One wire pattern 232 is used to form the first wire pattern, another wire pattern 232 is used to form the second wire pattern.
Conduct piece in inner via hole 213 and turned on outside hole 215 is sequentially connected in the transmission line layer 230 of 210 two sides of substrate
The first wire pattern can form first coil.Conduct piece in inner via hole 213 and turned on outside hole 215 is sequentially connected with
The second wire pattern in the transmission line layer 230 of 210 two sides of substrate can form the second coil.
Further, adjacent two wire patterns, 232 direction of routing is consistent, i.e., in every group of line pattern 234, first
Wire pattern and the second wire pattern direction of routing of any wire pattern 232 along line pattern 234 are consistent, that is,
The spacing of first wire pattern and the second wire pattern is consistent along its direction of routing.In the present embodiment, the first conducting wire figure
The distance between case and the second wire pattern can be 50~180 μm.
In the present embodiment, by space limited and filter 200 for common-mode signal the joint effect for filtering out performance,
The ratio of the length of first coil and the length of the second coil can be 0.8-1.2.That is, the length of first coil and the second coil
Length error should be ensured that error range be no more than 20%.For example, the length of first coil is the length of the second coil
The length of 1.2 times or first coil is 0.8 times of the length of the second coil.
Certainly, in other embodiments, the length of first coil and the length of the second coil can also be equal.Due to every group
It include one first wire pattern and one second wire pattern in line pattern 234, thus the quantity of the first wire pattern and the
The quantity of two wire patterns is equal, the equal length of the length of every one first wire pattern and every one second conducting wire.Again due to the
The direction of one wire pattern and the second wire pattern cabling is consistent, and can make the first wire pattern and the second wire pattern
In common-mode signal phase it is identical, performance is filtered out for common-mode signal to improve filter 200.
The foregoing is merely presently filed embodiments, are not intended to limit the scope of the patents of the application, all to utilize this
Equivalent structure or equivalent flow shift made by application specification and accompanying drawing content, it is relevant to be applied directly or indirectly in other
Technical field similarly includes in the scope of patent protection of the application.
Claims (10)
1. a kind of inductance element characterized by comprising
Substrate offers annular accommodation groove thereon, and the substrate is defined as to be located at the center inside the annular accommodation groove
Portion and outer part positioned at the annular accommodation groove periphery are offered through multiple inside of the substrate on the central part
Via hole is offered through multiple turned on outside holes of the substrate on the outer part；
Magnetic core is housed in the annular accommodation groove；
Transmission line layer, the opposite two sides of the substrate are each provided at least one transmission line layer, wherein each transmission line
Layer includes multiple wire patterns along the circumferentially-spaced arrangement of the annular accommodation groove, and each wire pattern is connected across correspondence
An inner via hole and a turned on outside hole between；With
Multiple conduct pieces are arranged in the inner via hole and the turned on outside hole, for being sequentially connected with all biographies
The wire pattern on defeated line layer, and then form the wire loop around magnetic core transmission electric current；
Wherein, all wire patterns in the same transmission line layer are divided into multiple groups line pattern, line map described in every group
In case, the direction of routing of adjacent two wire pattern is consistent.
2. inductance element according to claim 1, which is characterized in that the inner via hole is evenly distributed on the center
In portion, and the line of centres of all inner via holes forms an annular trace, the center of the annular trace and the magnetic
The center of core is overlapped.
3. inductance element according to claim 1, which is characterized in that the wire loop includes: first coil and second
Coil, the wire pattern for being used to form the first coil is the first wire pattern, is used to form second coil
The wire pattern is the second wire pattern；Line pattern described in every group includes first wire pattern and one described
Two wire patterns.
4. inductance element according to claim 3, which is characterized in that in line pattern described in every group, first conducting wire
The distance between pattern and second wire pattern are 50~180 μm.
5. inductance element according to claim 3, which is characterized in that the length of the first coil and second coil
Length ratio be 0.8-1.2.
6. inductance element according to claim 1, which is characterized in that the transmission line layer with a thickness of 17~102 μm.
7. inductance element according to claim 1, which is characterized in that the opposite two sides of the substrate are each provided with two institutes
Transmission line layer is stated, forms a projection group on the substrate positioned at wire pattern described in every group of described substrate the same side, every two
The corresponding line pattern of a adjacent projection group is located in different transmission line layers.
8. a kind of filter characterized by comprising
At least one layer of substrate offers multiple annular accommodation grooves on each substrate；Each annular accommodation groove is by institute
It states substrate and is divided into and the central part set is enclosed by the annular accommodation groove and around the outer part of the annular accommodation groove setting；Often
Multiple inner via holes through the substrate are offered on one central part, and are offered on each outer part
Through multiple turned on outside holes of the substrate；
Multiple magnetic cores are placed in the corresponding annular accommodation groove；
Transmission line layer, the opposite two sides of each substrate are respectively arranged at least one transmission line layer；Each transmission
Line layer includes multiple wire patterns along the circumferentially-spaced arrangement of the annular accommodation groove, and each wire pattern is connected across
Between a corresponding inner via hole and a turned on outside hole；With
Multiple conduct pieces are arranged in the inner via hole and the turned on outside hole, for being sequentially connected with each base
All wire patterns in two transmission line layers on plate, and then form the line around each magnetic core transmission electric current
Enclose circuit；
Wherein, all wire patterns in the transmission line layer of each described substrate the same side are divided into multiple groups line map
Case, in line pattern described in every group, the adjacent two wire pattern direction of routing is consistent；
Multiple central parts, the corresponding outer part and multiple magnetic cores on each substrate multiple described are led
Electric part, and at least two arranged according to default arranging rule are constituted positioned at the transmission line layer of each substrate opposite sides
A inductance element；On the same substrate, all inductance elements are mutually indepedent.
9. filter according to claim 8, which is characterized in that in line pattern described in every group, adjacent two conducting wire
The distance between pattern is 50~180 μm.
10. filter according to claim 8, which is characterized in that the wire loop packet of each magnetic core of winding
Include: first coil and the second coil, the wire pattern for being used to form the first coil is the first wire pattern, is used for shape
The wire pattern at second coil is the second wire pattern；Line pattern described in every group includes one described first leading
Line pattern and second wire pattern；The equal length of the length of the first coil and second coil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810405564.1A CN110415918A (en) | 2018-04-29 | 2018-04-29 | Inductance element and filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810405564.1A CN110415918A (en) | 2018-04-29 | 2018-04-29 | Inductance element and filter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110415918A true CN110415918A (en) | 2019-11-05 |
Family
ID=68357703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810405564.1A Pending CN110415918A (en) | 2018-04-29 | 2018-04-29 | Inductance element and filter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110415918A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111082772A (en) * | 2019-12-12 | 2020-04-28 | 广东工业大学 | Bulk acoustic wave filter based on magnetostrictive effect and manufacturing method thereof |
| CN114242421A (en) * | 2021-12-28 | 2022-03-25 | 横店集团东磁股份有限公司 | Thin film inductor and manufacturing method thereof |
| CN115440463A (en) * | 2021-06-04 | 2022-12-06 | 深南电路股份有限公司 | Electronic device and connector thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101553890A (en) * | 2006-11-14 | 2009-10-07 | 美商·帕斯脉冲工程有限公司 | Wire-less inductive devices and methods |
| CN204045316U (en) * | 2011-11-04 | 2014-12-24 | 株式会社村田制作所 | Common mode choke and high-frequency electron device |
| CN205122328U (en) * | 2015-11-10 | 2016-03-30 | 深圳市英威腾电气股份有限公司 | Common mode inductor |
| CN208141947U (en) * | 2018-04-29 | 2018-11-23 | 深南电路股份有限公司 | Inductance element and filter |
-
2018
- 2018-04-29 CN CN201810405564.1A patent/CN110415918A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101553890A (en) * | 2006-11-14 | 2009-10-07 | 美商·帕斯脉冲工程有限公司 | Wire-less inductive devices and methods |
| CN204045316U (en) * | 2011-11-04 | 2014-12-24 | 株式会社村田制作所 | Common mode choke and high-frequency electron device |
| CN204332583U (en) * | 2011-11-04 | 2015-05-13 | 株式会社村田制作所 | Common mode choke and high-frequency electron device |
| CN205122328U (en) * | 2015-11-10 | 2016-03-30 | 深圳市英威腾电气股份有限公司 | Common mode inductor |
| CN208141947U (en) * | 2018-04-29 | 2018-11-23 | 深南电路股份有限公司 | Inductance element and filter |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111082772A (en) * | 2019-12-12 | 2020-04-28 | 广东工业大学 | Bulk acoustic wave filter based on magnetostrictive effect and manufacturing method thereof |
| CN111082772B (en) * | 2019-12-12 | 2023-07-18 | 广东工业大学 | Bulk acoustic wave filter based on magnetostriction effect and manufacturing method thereof |
| CN115440463A (en) * | 2021-06-04 | 2022-12-06 | 深南电路股份有限公司 | Electronic device and connector thereof |
| CN114242421A (en) * | 2021-12-28 | 2022-03-25 | 横店集团东磁股份有限公司 | Thin film inductor and manufacturing method thereof |
| CN114242421B (en) * | 2021-12-28 | 2023-07-21 | 横店集团东磁股份有限公司 | Thin film inductor and manufacturing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208141947U (en) | Inductance element and filter | |
| JP7056016B2 (en) | Coil parts | |
| CN110415918A (en) | Inductance element and filter | |
| US8395472B2 (en) | Planar, monolithically integrated coil | |
| KR102385508B1 (en) | Common mode noise filter | |
| CN110400680A (en) | Coil component and its manufacturing method | |
| JP2010165953A (en) | Coil component and lc filter for differential transmission circuit using the same | |
| US20120056705A1 (en) | Layered inductor and manufacturing method thereof | |
| CN208141988U (en) | transformer and electromagnetic device | |
| KR20150105787A (en) | Chip electronic component and manufacturing method thereof | |
| CN110010328B (en) | Common mode filter | |
| CN110010327A (en) | Common-mode filter | |
| JP2018107299A (en) | Coil component and circuit board including the same | |
| CN109326421A (en) | A kind of MEMS endless solenoid inductor and its manufacturing method | |
| JP2011176165A (en) | Common mode noise filter | |
| JP2008109139A (en) | Coil having coil branches and microconductor having the same | |
| JP2007129291A (en) | Noise filter and noise filter circuit | |
| CN208637280U (en) | Integrated transformer and electronic device | |
| CN208141946U (en) | electromagnetic device and integrated transformer | |
| CN208570297U (en) | Transformer and electromagnetic device | |
| CN109219859A (en) | The manufacturing method of LC device and LC device | |
| JP2006024772A (en) | Common mode noise filter | |
| CN208637248U (en) | Electronic device, connector and its electromagnetic device | |
| CN208570296U (en) | Transformer and electromagnetic device | |
| CN109616279B (en) | Inductance element and filter |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |