CN110409658A - Hollow wall plate and its processing method - Google Patents
Hollow wall plate and its processing method Download PDFInfo
- Publication number
- CN110409658A CN110409658A CN201910776041.2A CN201910776041A CN110409658A CN 110409658 A CN110409658 A CN 110409658A CN 201910776041 A CN201910776041 A CN 201910776041A CN 110409658 A CN110409658 A CN 110409658A
- Authority
- CN
- China
- Prior art keywords
- upper substrate
- lower substrate
- floor
- wall plate
- hollow wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003672 processing method Methods 0.000 title claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 137
- 239000000463 material Substances 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 9
- 238000001125 extrusion Methods 0.000 claims description 9
- 238000005452 bending Methods 0.000 claims description 8
- 238000007493 shaping process Methods 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 1
- 230000000630 rising effect Effects 0.000 claims 1
- 238000009434 installation Methods 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000005253 cladding Methods 0.000 abstract description 4
- 239000012790 adhesive layer Substances 0.000 description 5
- 238000005034 decoration Methods 0.000 description 5
- 239000002033 PVDF binder Substances 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 3
- -1 Polyethylene Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/15—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor incorporating preformed parts or layers, e.g. extrusion moulding around inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C69/00—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
- B29C69/02—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore of moulding techniques only
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B2/00—Walls, e.g. partitions, for buildings; Wall construction with regard to insulation; Connections specially adapted to walls
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04C—STRUCTURAL ELEMENTS; BUILDING MATERIALS
- E04C2/00—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels
- E04C2/30—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by the shape or structure
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04C—STRUCTURAL ELEMENTS; BUILDING MATERIALS
- E04C2/00—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels
- E04C2/30—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by the shape or structure
- E04C2/34—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels characterised by the shape or structure composed of two or more spaced sheet-like parts
Abstract
The embodiment of the invention discloses a kind of Hollow wall plate and its processing methods, comprising: upper substrate, lower substrate and clad, the upper substrate has the facing being oppositely arranged and the back side, the clad is fitted on the facing, more floors are provided on the back side, the lower substrate is bonded with more floors respectively, and is oppositely arranged with the upper substrate, and the lower substrate is equal to clad to the thermal (temperature difference) stress of upper substrate to the thermal (temperature difference) stress of upper substrate.Enable to lower substrate that single side cladding wallboard can be overcome to be influenced caused problem on deformation by the temperature difference using the embodiment of the present invention, guarantee the smooth degree of wallboard, and all components only need to can simply be assembled in industrialized production, scene in factory, and structure is simple, weight is small, installation effectiveness can not only be improved, but also the technical requirements to installer can be reduced, reduces cost of labor, wallboard scene does not need to be bonded simultaneously, environment friendly and pollution-free.
Description
Technical field
The present invention relates to decorations technical fields, and in particular to a kind of Hollow wall plate and its processing method.
Background technique
Currently, occurring the integrated wall plate of a large amount of decorating film claddings in the market, since it is with simple installation, facing form
Multiplicity, it is detachable, meet assembled finishing and the advantages such as require, substantially increase the installation effectiveness and decorative effect of wallboard, and i.e.
Dress is used, and the vacant phase of no tradition finishing, has attracted many consumers.
Based on control cost reason, existing integrated wall plate uses single side to coat substantially, i.e., only wraps in the facing side of wallboard
Cover decorating film.Technical staff has found in the implementation of the present invention, due to the thermal linear expansion coefficient of decorating film and wallboard, bullet
Property modulus is inconsistent, in use, is influenced by the temperature difference, the thermal expansion and contraction degree of decorating film and wallboard is inconsistent, causes
Wallboard deformation, influences degree of plainness for wall surface.
Summary of the invention
In view of this, the embodiment of the present invention proposes a kind of Hollow wall plate and its processing method, to solve the above technical problems.
The embodiment of the present invention proposes a kind of Hollow wall plate comprising: upper substrate, lower substrate and clad, the upper substrate
With the facing and the back side being oppositely arranged, the clad is fitted on the facing, and more floors are provided on the back side,
The lower substrate is bonded with more floors respectively, and is oppositely arranged with the upper substrate, the temperature difference of the lower substrate to upper substrate
Stress is equal to clad to the thermal (temperature difference) stress of upper substrate.
Optionally, width direction of the more floors along the back side is arranged, and every floor is vertical with the back side, between adjacent floor
Away from equal.
Optionally, multiple and the one-to-one boss portion of floor, the floor and boss portion are provided on the lower substrate
It is fixedly connected.
Optionally, the floor positioned at upper substrate width direction two sides distinguishes left floor and right floor, is provided on right floor
Plugboard, left floor form the grafting with plugboard grafting with left lug boss corresponding with left floor on upper substrate, lower substrate
Slot.
It optionally, further include bending plate, bending plate includes transverse slat and riser connected vertically, transverse slat and the fixed company of upper substrate
It connects, and coplanar, riser and right floor is vertical with plugboard connect.
Optionally, the side that the side on the lower substrate where inserting groove is directed away from plugboard extends, and formation is used for
The fixed fixed plate with metope.
Optionally, the left lug boss is hollow, and the width of end face of the left lug boss towards upper substrate is equal to grafting
The sum of the groove depth of slot and the thickness of left floor.
Optionally, the lower substrate is provided with multiple function troughs, multiple function trough edges in the plate face of upper substrate
The width direction parallel arrangement of lower substrate, and the spacing of adjacent functional slot is equal.
Optionally, the upper substrate and lower substrate are the double-deck extrusion structure.
The embodiment of the present invention also provides a kind of processing method based on above-mentioned Hollow wall plate comprising: upper substrate is squeezed
After forming out, cooling and shaping；According to clad to the material of the thermal (temperature difference) stress configuration lower substrate of upper substrate, using the material upper
Extrusion molding obtains lower substrate, and cooling and shaping on the basis of substrate；Be sticked clad on the facing of upper substrate.
Hollow wall plate provided in an embodiment of the present invention and its processing method pass through setting upper substrate, lower substrate and clad,
And identical is set to the thermal (temperature difference) stress of upper substrate by thermal (temperature difference) stress and clad of the lower substrate to upper substrate, so that lower substrate
Single side cladding wallboard can be overcome to be influenced caused problem on deformation by the temperature difference, guarantee the smooth degree of wallboard, and all components
It only need to can simply be assembled in industrialized production, scene in factory, structure is simple, and weight is small, can not only improve installation
Efficiency, but also the technical requirements to installer can be reduced, cost of labor is reduced, while wallboard scene does not need to be bonded, ring
It protects pollution-free.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the Hollow wall plate of the embodiment of the present invention.
Fig. 2 is the partial enlarged view of A in Fig. 1.
Fig. 3 is the partial enlarged view of B in Fig. 1.
Fig. 4 is the installation diagram of the Hollow wall plate of the embodiment of the present invention.
Fig. 5 is the machining sketch chart of the Hollow wall plate of the embodiment of the present invention.
Specific embodiment
Below in conjunction with attached drawing and specific embodiment, technical solution of the present invention is described in detail.It is wherein identical
Components are presented with like reference characters.It should be noted that word "front", "rear" used in the following description, " left side ",
" right side ", "up" and "down" refer to that the direction in attached drawing, word "inner" and "outside" are referred respectively to towards or away from particular elements
The direction of geometric center.
Fig. 1 shows the structural schematic diagram of the Hollow wall plate of the embodiment of the present invention, as shown in Figure 1, the embodiment of the present invention mentions
The Hollow wall plate of confession comprising: upper substrate 2, lower substrate 3 and clad 1.
As shown in Fig. 2, there is the upper substrate 2 facing being oppositely arranged and the back side, the clad 1 to be fitted in the decorations
On face.
More floors 21 are provided on the back side.In the present embodiment, there is gap between adjacent floor 21.
The lower substrate 3 is bonded with more floors 21 respectively, and is oppositely arranged with the upper substrate 2, and the lower substrate 3 is right
The thermal (temperature difference) stress of upper substrate 2 is equal to clad 1 to the thermal (temperature difference) stress of upper substrate 2.
Wherein, the thermal (temperature difference) stress is in heating or cooling, and different materials expand with heat and contract with cold the stress to be formed.
Hollow wall plate in use, is affected by temperature, and Hollow wall plate can expand with heat and contract with cold.
Since lower substrate 3 is equal with thermal (temperature difference) stress of the clad 1 to upper substrate 2, lower substrate 3 answers the temperature difference of upper substrate 2
Power counteracts clad 1 to the thermal (temperature difference) stress of upper substrate 2, so that Hollow wall plate will not deform.
Hollow wall plate provided in an embodiment of the present invention is by setting upper substrate, lower substrate and clad, and by lower substrate
Thermal (temperature difference) stress and clad to upper substrate are set as equal to the thermal (temperature difference) stress of upper substrate, and lower substrate is enabled to overcome single side
Coating wallboard is influenced caused problem on deformation by the temperature difference, guarantees the smooth degree of wallboard, and all components can be in factory
Industrialized production, scene only need to simply be assembled, and structure is simple, and weight is small, can not only improve installation effectiveness, but also can
The technical requirements to installer are reduced, reduce cost of labor, while wallboard scene does not need to be bonded, it is environment friendly and pollution-free.
Further, width direction of the more floors 21 along the back side is arranged, and every floor 21 is vertical with the back side, adjacent rib
The spacing of plate 21 is equal, to facilitate the setting of floor 21, convenient for the processing and manufacturing of upper substrate 2.
Preferably, the multiple and one-to-one boss portion 31 of floor 21 is provided on the lower substrate 3, the floor 21
End face is fixedly connected with the end face of boss portion 31.
By the way that boss portion 31 is arranged, the connection of floor 21 Yu lower substrate 3 can be facilitated.
Further, upper substrate 2 and lower substrate 3 are the double-deck extrusion structure, can meet Same Part and be made of different materials,
The structure design of part has more more options.
In the present embodiment, the first extrusion molding of upper substrate 2, and after cooling and shaping, then on the basis of upper substrate 2 will under base
The setting of upper substrate 2 and lower substrate 3 can be completed in 3 extrusion molding of plate, cooling and shaping.
Optionally, as shown in Figure 3-4, the floor 21 positioned at 2 width direction two sides of upper substrate distinguishes left floor 21-1 and the right side
Floor 21-2.
Be provided with plugboard 5 on right floor 21-2, left floor 21-1 on upper substrate 2, lower substrate 3 with left floor 21-1 phase
Corresponding left lug boss 31-1 forms the inserting groove 4 with 5 grafting of plugboard.
By the way that plugboard 5 and inserting groove 4 are arranged on the two sides of Hollow wall plate width direction, adjacent hollow wallboard can be facilitated
Connection, improve decoration efficiency.
As shown in figure 4, Hollow wall plate 100 and Hollow wall plate 200 pass through plugboard 5 and 4 grafting of inserting groove.
Further, Hollow wall plate further includes bending plate 22.Bending plate 22 includes transverse slat connected vertically and riser.
Transverse slat is fixedly connected with upper substrate 2, and coplanar.Riser and right floor 21-2 is vertical with plugboard 5 connect.Bending
Plate 22 and right floor 21-2, plugboard 5 surround hollow region.
By the way that bending plate 22 is arranged, the intensity of plugboard 5 can be increased, so that grafting is better achieved.
As shown in Figure 1-3, clad 1 deviates from facing, the end face of 2 width direction of upper substrate, bending plate 22, plugboard 5
The plate face of lower substrate and the end face fitting of plugboard 5, preferably to improve decorative effect.
Preferably, the side that the side on the lower substrate 3 where inserting groove 4 is directed away from plugboard 5 extends, and is formed and is used
In the fixed plate 32 fixed with metope.Fixed plate 32 is fixed on metope by screw 6, to increase firmly installing for Hollow wall plate
Property.
Further, locating recesses 321 are provided in the fixed plate 32.By the way that locating recesses 321 are arranged, spiral shell can be facilitated
The installation of nail 6 improves decoration efficiency.
Preferably, as shown in Fig. 2, the left lug boss 31-1 is hollow, and the left lug boss 31-1 is towards upper substrate 2
The width of end face is equal to the groove depth of inserting groove 4 and the sum of the thickness of left floor 21-1, it is ensured that the depth of inserting groove 4, to protect
Demonstrate,prove the firm plug of plugboard 5 and inserting groove 4.
Further, the lower substrate 3 is provided with multiple function troughs 33 in the plate face of upper substrate 2.
For multiple function troughs 33 along the width direction parallel arrangement of lower substrate 3, the spacing of adjacent functional slot 33 is equal.
By the way that function trough 33 is arranged, it may not only facilitate the stress release of Hollow wall plate, can also increase between wallboard and metope
Air circulation.
In a specific embodiment, lower substrate 3 is recessed away from the plate face of upper substrate 2 towards the direction close to upper substrate 2,
Boss is formed in plate face of the lower substrate 3 towards upper substrate 2.
Corresponding three boss portions 31 on each boss, three boss portions 31 be located at projection width direction both ends and
On middle position.
In a specific embodiment, function trough 33 is isosceles trapezoid perpendicular to the cross section of length direction.Isosceles trapezoid
It is less than the width of the bottom far from upper substrate 2 close to the width at the upper bottom of upper substrate 2.
Further, clad 1 includes decorative layer and adhesive layer, and decorative layer is fitted in the decorations of upper substrate 2 by adhesive layer
On face, it is not only convenient for the fitting of clad 1, it is also ensured that the bonding fastness of clad 1.
In the present embodiment, decorative layer can be PVC (Polyvinyl chloride, polyvinyl chloride), PE
The decorative plastics films such as (Polyethylene, polyethylene), PVDF (polyvinylidene fluoride, polyvinylidene fluoride),
Adhesive layer can coat glue using PUR (polyurethane).
The embodiment of the present invention also provides a kind of processing method based on Hollow wall plate as described above, as shown in figure 5, it is wrapped
It includes:
After 2 extrusion molding of upper substrate, cooling and shaping；
According to clad 1 to the material of the thermal (temperature difference) stress configuration lower substrate 3 of upper substrate 2, using the material in upper substrate 2
On the basis of extrusion molding obtain lower substrate 3, and cooling and shaping；
It is equal to lower substrate 3 to the thermal (temperature difference) stress of upper substrate 2, by linear based on thermal (temperature difference) stress of the clad 1 to upper substrate 2
Thermal expansion coefficient, elasticity modulus and thickness conversion can obtain the proportion of various ingredients, according to proportion ingredient, obtain lower substrate 3
Material.Then, using the material, lower substrate 3 is squeezed out on the basis of upper substrate 2.
In the present embodiment, the linear expansion coefficient of the lower substrate 3 is greater than the linear expansion coefficient of upper substrate 2, not only
Facilitate extrusion molding, and also ensures lower substrate 3 to the temperature difference pressure of upper substrate 2.
Be sticked clad 1 on the facing of upper substrate 2.
It is first coated with adhesive layer on the facing of upper substrate 2, then clad 1 is fitted on adhesive layer again.
Hollow wall plate processing method provided in an embodiment of the present invention passes through setting upper substrate, lower substrate and clad, and
Identical is set to the thermal (temperature difference) stress of upper substrate by thermal (temperature difference) stress and clad of the lower substrate to upper substrate, enables lower substrate
Overcome single side cladding wallboard to be influenced caused problem on deformation by the temperature difference, guarantees the smooth degree of wallboard, and all components
The industrialized production in factory, scene only need to simply be assembled, and structure is simple, and weight is small, can not only improve installation effectiveness,
But also technical requirements to installer can be reduced, cost of labor is reduced, while wallboard scene does not need to be bonded, environmental protection is without dirt
Dye.
More than, technical solution of the present invention is described in detail in conjunction with specific embodiments, described specific implementation
Example is used to help understand thought of the invention.The derivation that those skilled in the art make on the basis of the specific embodiment of the invention
It is also belonged within the scope of the present invention with modification.
Claims (10)
1. a kind of Hollow wall plate characterized by comprising upper substrate, lower substrate and clad, the upper substrate have opposite set
The facing set and the back side, the clad are fitted on the facing, and more floors, the lower substrate are provided on the back side
It is bonded with more floors, and is oppositely arranged with the upper substrate respectively, the lower substrate is equal to packet to the thermal (temperature difference) stress of upper substrate
Thermal (temperature difference) stress of the coating to upper substrate.
2. Hollow wall plate as described in claim 1, which is characterized in that width direction of the more floors along the back side is arranged, and every
Floor is vertical with the back side, and the spacing of adjacent floor is equal.
3. Hollow wall plate as claimed in claim 2, which is characterized in that be provided on the lower substrate multiple a pair of with floor one
The boss portion answered, the floor are fixedly connected with boss portion.
4. Hollow wall plate as claimed in claim 3, which is characterized in that the floor positioned at upper substrate width direction two sides is left respectively
Floor and right floor are provided with plugboard on right floor, and left floor and a left side corresponding with left floor on upper substrate, lower substrate are convex
The portion of rising forms the inserting groove with plugboard grafting.
5. Hollow wall plate as claimed in claim 4, which is characterized in that further include bending plate, bending plate includes connected vertically
Transverse slat and riser, transverse slat are fixedly connected with upper substrate, and coplanar, riser and right floor is vertical with plugboard connect.
6. Hollow wall plate as claimed in claim 4, which is characterized in that the side on the lower substrate where inserting groove is towards far
Side from plugboard extends, and is formed for the fixed plate fixed with metope.
7. Hollow wall plate as claimed in claim 6, which is characterized in that the left lug boss is hollow, and the left lug boss court
It is equal to the sum of groove depth and the thickness of left floor of inserting groove to the width of the end face of upper substrate.
8. Hollow wall plate as described in claim 1, which is characterized in that the lower substrate is provided in the plate face of upper substrate
Multiple function troughs, multiple function troughs are along the width direction parallel arrangement of lower substrate, and the spacing of adjacent functional slot is equal.
9. Hollow wall plate a method as claimed in any one of claims 1-8, which is characterized in that the upper substrate and lower substrate squeeze out to be double-deck
Structure.
10. a kind of processing method based on any Hollow wall plate of claim 1-9 characterized by comprising
After upper substrate extrusion molding, cooling and shaping；
According to clad to the material of the thermal (temperature difference) stress configuration lower substrate of upper substrate, squeezed on the basis of upper substrate using the material
Molding obtains lower substrate, and cooling and shaping out；
Be sticked clad on the facing of upper substrate.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910776041.2A CN110409658A (en) | 2019-08-22 | 2019-08-22 | Hollow wall plate and its processing method |
| SG11202008823RA SG11202008823RA (en) | 2019-08-22 | 2020-01-03 | Hollow wallboard and processing method thereof |
| PCT/CN2020/070167 WO2021031508A1 (en) | 2019-08-22 | 2020-01-03 | Hollow wall panel and machining method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910776041.2A CN110409658A (en) | 2019-08-22 | 2019-08-22 | Hollow wall plate and its processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110409658A true CN110409658A (en) | 2019-11-05 |
Family
ID=68368434
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910776041.2A Pending CN110409658A (en) | 2019-08-22 | 2019-08-22 | Hollow wall plate and its processing method |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN110409658A (en) |
| SG (1) | SG11202008823RA (en) |
| WO (1) | WO2021031508A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021031508A1 (en) * | 2019-08-22 | 2021-02-25 | 浙江亚厦装饰股份有限公司 | Hollow wall panel and machining method therefor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201581575U (en) * | 2009-11-11 | 2010-09-15 | 张建卫 | Novel heat-preservation sound-insulation decorative aluminum plastic corrugated composite board |
| CN103628652A (en) * | 2013-11-06 | 2014-03-12 | 安徽圣源橡塑科技有限公司 | Functional co-extrusion composite alloy material floor-heating floor and manufacturing method thereof |
| CN211114212U (en) * | 2019-08-22 | 2020-07-28 | 浙江亚厦装饰股份有限公司 | Hollow wall board |
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|---|---|---|---|---|
| CN1563625A (en) * | 2004-04-06 | 2005-01-12 | 高祥灿 | New type anti checking wallboard in lightweight and erection method |
| KR20100086667A (en) * | 2009-01-23 | 2010-08-02 | 김치성 | Interior materials and method of manufacturing the same |
| CN202969697U (en) * | 2012-10-25 | 2013-06-05 | 湖北科翼建筑科技研究有限公司 | Thin-walled section steel composite wallboard |
| CN104294999A (en) * | 2014-10-31 | 2015-01-21 | 吴铁锋 | Integrated bathroom prefabricated panel |
| CN204370682U (en) * | 2014-12-11 | 2015-06-03 | 江苏旭华圣洛迪建材有限公司 | A kind of Wood plastic wall board of resistance to deformation |
| CN104557126A (en) * | 2015-01-28 | 2015-04-29 | 吉林市祺祥墙体材料有限公司 | Prefabrication method of temperature-changed-shrinkage resistant inner partition plate for building |
| CN107060248A (en) * | 2017-03-10 | 2017-08-18 | 周珊 | A kind of prefabricated outer wall panel ornamental surface heat insulation is integrally formed the preparation method of heat preserving exterior wall |
| CN110409658A (en) * | 2019-08-22 | 2019-11-05 | 浙江亚厦装饰股份有限公司 | Hollow wall plate and its processing method |
-
2019
- 2019-08-22 CN CN201910776041.2A patent/CN110409658A/en active Pending
-
2020
- 2020-01-03 SG SG11202008823RA patent/SG11202008823RA/en unknown
- 2020-01-03 WO PCT/CN2020/070167 patent/WO2021031508A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201581575U (en) * | 2009-11-11 | 2010-09-15 | 张建卫 | Novel heat-preservation sound-insulation decorative aluminum plastic corrugated composite board |
| CN103628652A (en) * | 2013-11-06 | 2014-03-12 | 安徽圣源橡塑科技有限公司 | Functional co-extrusion composite alloy material floor-heating floor and manufacturing method thereof |
| CN211114212U (en) * | 2019-08-22 | 2020-07-28 | 浙江亚厦装饰股份有限公司 | Hollow wall board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021031508A1 (en) * | 2019-08-22 | 2021-02-25 | 浙江亚厦装饰股份有限公司 | Hollow wall panel and machining method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| SG11202008823RA (en) | 2021-03-30 |
| WO2021031508A1 (en) | 2021-02-25 |
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