CN110402032B - Equipment for preprocessing circuit board by utilizing heat conductivity - Google Patents
Equipment for preprocessing circuit board by utilizing heat conductivity Download PDFInfo
- Publication number
- CN110402032B CN110402032B CN201910756428.1A CN201910756428A CN110402032B CN 110402032 B CN110402032 B CN 110402032B CN 201910756428 A CN201910756428 A CN 201910756428A CN 110402032 B CN110402032 B CN 110402032B
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- CN
- China
- Prior art keywords
- tin
- circuit board
- drill bit
- movably connected
- shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention relates to the technical field of circuit board processing, and discloses equipment for preprocessing a circuit board by utilizing heat conductivity, which comprises a support frame, wherein the interior of the support frame is movably connected with a tin liquid tank through a telescopic rod, the interior of the tin liquid tank is fixedly connected with a shell, the interior of the shell is movably connected with a drill bit, the surface of the shell is provided with inflow ports at two sides of the drill bit, the lower part of the inflow port is movably connected with a tin injection mechanism, the tin injection mechanism comprises a spring, and can generate a cyclone with the drill bit as the center while rotating, the cyclone can drain liquid tin in the tin liquid tank through a liquid flow channel in a screw rod, in addition, certain heat is generated due to friction of the cyclone and the liquid tin, the drained liquid tin flows to the periphery of a drilled hole of the circuit board, and can not be solidified within short time under the action of heat generated by friction, so that an instrument to be installed can be adhered to the surface of the circuit board, thereby reached and punched the completion and carried out welded effect simultaneously.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a device for preprocessing a circuit board by utilizing heat conductivity.
Background
The circuit board has the name: the ceramic circuit board and the alumina ceramic circuit board make the circuit miniaturized and visualized, and play an important role in the batch production of fixed circuits and the optimization of the layout of electrical appliances.
Because the basic part of many electronic equipment all uses the circuit board, consequently, need to accomplish work in the cooperation of other miniature instrument of circuit board surface mounting, the installation of some miniature instrument needs to punch on the circuit board surface, and need carry out welded fastening after punching the completion, because the circuit board is accurate part, punch and the welding all need use special apparatus to accomplish, and in the equipment that has now, to punch and weld the substep and go on, because circuit board surface circuit is too much, the location needs the accuracy when punching, if secondary movement can influence the accuracy of its locating hole, lead to the phenomenon of welding dislocation, consequently, an equipment that utilizes the thermal conductivity to carry out preprocessing to the circuit board takes place.
Disclosure of Invention
In order to achieve the purpose of welding while completing punching, the invention provides the following technical scheme: the utility model provides an utilize heat conductivity to carry out equipment of preprocessing to circuit board, includes the support frame, there is the tin cistern inside of support frame through telescopic link swing joint, and the inside fixedly connected with casing in tin cistern, the inside swing joint of casing have the drill bit, and the surface of casing just is located the both sides of drill bit and has seted up the inflow inlet, and the lower part swing joint of inflow inlet annotates tin mechanism, annotate tin mechanism and include the spring, the one end swing joint that the inflow inlet was kept away from to the spring has the screw rod, and the surperficial swing joint of screw rod has the dovetail groove, drill bit and the junction fixedly connected with air current groove of annotating tin mechanism.
The invention has the beneficial effects that:
1. through the work of drill bit, drill hole to the circuit board of placing on the base, the telescopic link moves down and drives tin cistern and the same downstream of casing, when the drill bit contacts with the circuit board surface, the drill bit is extruded and the downstream, and annotate the screw rod in the tin mechanism and stretch out the casing diapire under the compression stroke of spring, the drill bit is rotatory to punch at circuit board surface friction, can produce one in the time of the rotation and use the drill bit to punch as the whirlwind of center, this whirlwind gets off the liquid tin drainage in the tin cistern through the liquid flow channel in the screw rod, in addition because of both frictions produce certain heat, the liquid tin that the drainage got off flows around the circuit board is drilled, under the effect of heat of friction, can not solidify in the short time, borrow this time can be with treating the instrument bonding on the circuit board surface of installing, thereby the effect of welding when having reached the completion of punching.
2. When tin liquid is drained to the surface of the circuit board through the tin injection mechanism, the drill bit rotates and simultaneously generates cyclone which takes the drill bit as the center, the wind power forms reciprocating circular airflow in the inflow layer in the airflow groove, and the airflow circulation simultaneously sucks impurity dust generated during drilling to the impurity storage layer through the airflow groove, so that the effect of removing the dust generated during drilling is achieved.
Preferably, the inside of support frame just is located the below fixedly connected with base of annotating the tin mechanism, and the fixed surface of base is connected with places the platform.
Preferably, the screw is internally provided with a liquid flow channel.
Preferably, the air flow groove comprises an inflow layer, and the lower part of the inflow layer is fixedly connected with a impurity storage layer.
Preferably, the upper part of the trapezoidal groove is fixedly connected with the molten tin bath.
Preferably, the upper end of the liquid flow channel is movably connected with the trapezoidal groove.
Preferably, the opening size of the inflow layer is smaller than that of the impurity storage layer.
Preferably, the compression stroke of the spring is less than the length of the drill bit.
Drawings
FIG. 1 is a front cross-sectional view of the support frame structure of the present invention;
FIG. 2 is a front cross-sectional view of the housing construction of the present invention;
FIG. 3 is a schematic view of a trapezoidal groove structure of the present invention;
FIG. 4 is a schematic view of the tin injection mechanism of the present invention during tin injection;
FIG. 5 is a schematic view of the screw structure of the present invention as it is extended;
FIG. 6 is a partial cross-sectional view of the flow channel structure of the present invention.
In the figure: 1-a support frame, 2-a telescopic rod, 3-a tin liquid groove, 4-a shell, 5-a drill bit, 6-an inflow port, 7-a tin injection mechanism, 8-a spring, 9-a screw, 10-a trapezoidal groove, 11-an airflow groove, 12-a base, 13-a placing table, 14-a liquid flow channel, 15-an inflow layer and 16-a impurity storage layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, an apparatus for preprocessing a circuit board by using thermal conductivity includes a support frame 1, a tin liquid tank 3 movably connected to the inside of the support frame 1 through a telescopic rod 2, a housing 4 fixedly connected to the inside of the tin liquid tank 3, a drill bit 5 movably connected to the inside of the housing 4, inflow ports 6 formed on the surface of the housing 4 and located at two sides of the drill bit 5, a tin injection mechanism 7 movably connected to the lower portion of the inflow port 6, a base 12 fixedly connected to the inside of the support frame 1 and located below the tin injection mechanism 7, a placing table 13 fixedly connected to the surface of the base 12, the tin injection mechanism 7 including a spring 8, a compression stroke of the spring 8 being smaller than the length of the drill bit 5, a screw 9 movably connected to one end of the spring 8 far from the inflow port 6, a liquid flow channel 14 formed inside the screw 9, and a trapezoidal groove 10 movably connected to the upper end of the liquid flow channel 14, the surface of the screw 9 is movably connected with a trapezoidal groove 10, the upper part of the trapezoidal groove 10 is fixedly connected with the molten tin bath 3, the joint of the drill 5 and the tin injection mechanism 7 is fixedly connected with an airflow groove 11, the airflow groove 11 comprises an inflow layer 15, the lower part of the inflow layer 15 is fixedly connected with an impurity storage layer 16, and the opening size of the inflow layer 15 is smaller than that of the impurity storage layer 16.
When the tin soldering machine is used, the driving part is started to enable the telescopic rod 2 to move downwards to drive the tin liquid groove 3 and the shell 4 to move downwards together, the drill bit 5 is started to work to drill a circuit board placed on the base 12, when the drill bit 5 is in contact with the surface of the circuit board, the drill bit 5 moves downwards due to extrusion, the screw 9 in the tin injection mechanism 7 extends out of the bottom wall of the shell 4 under the compression stroke of the spring 8, the drill bit 5 rotates to perform friction drilling on the surface of the circuit board, and a cyclone which takes the drill bit 5 as the center is generated during rotation, the cyclone drains liquid tin in the tin liquid groove 3 into the trapezoidal groove 10 through the flow inlet 6 through the flow channel 14 in the screw 9, and the tin liquid in the trapezoidal groove 10 flows into the screw 9 due to the connection of the surface of the trapezoidal groove 10 and the flow channel 14 in the screw 9, and generates certain heat due to friction of the two, and the drained liquid tin flows to the periphery of the circuit board by the screw 9, under the effect of frictional heat, the dust-free solder paste can not be solidified within a short time, so that an instrument to be mounted can be adhered to the surface of a circuit board within the time, the effect of welding while drilling is finished is achieved, the drill bit 5 rotates and simultaneously generates a cyclone which takes the drill bit 5 as the center, the wind power can form a reciprocating circulating airflow on the inflow layer 15 in the airflow groove 11, and the airflow circulating and simultaneously can suck impurity dust generated during drilling into the impurity storage layer 16 through the airflow groove 11, so that the effect of removing the dust generated during drilling is achieved.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be able to cover the technical scope of the present invention and the equivalent alternatives or modifications according to the technical solution and the inventive concept of the present invention within the technical scope of the present invention.
Claims (6)
1. An equipment for preprocessing circuit board by utilizing heat conductivity comprises a support frame (1), and is characterized in that: the tin bath tank (3) is movably connected inside the support frame (1) through a telescopic rod (2), a shell (4) is fixedly connected inside the tin bath tank (3), a drill bit (5) is movably connected inside the shell (4), inflow ports (6) are formed in the surface of the shell (4) and located on two sides of the drill bit (5), and a tin injection mechanism (7) is movably connected to the lower portions of the inflow ports (6);
the tin injection mechanism (7) comprises a spring (8), one end, far away from the inflow port (6), of the spring (8) is movably connected with a screw (9), the surface of the screw (9) is movably connected with a trapezoidal groove (10), the joint of the drill bit (5) and the tin injection mechanism (7) is fixedly connected with an airflow groove (11), a liquid flow channel (14) is formed in the screw (9), and the upper end of the liquid flow channel (14) is movably connected with the trapezoidal groove (10);
the telescopic rod (2) moves downwards to drive the tin liquid tank (3) and the shell (4) to move downwards together, the drill bit (5) is started to work to drill a circuit board placed on the base (12), when the drill bit (5) is in contact with the surface of the circuit board, the drill bit (5) moves downwards due to extrusion, the screw rod (9) in the tin injection mechanism (7) stretches out of the bottom wall of the shell (4) under the compression stroke of the spring (8), the drill bit (5) rotates to perform friction punching on the surface of the circuit board, a cyclone which takes the drill bit (5) as the center is generated during rotation, and the cyclone drains liquid tin in the tin liquid tank (3) into the trapezoidal groove (10) through the flow inlet (6) through the liquid flow channel (14) in the screw rod (9).
2. An apparatus for pre-processing a circuit board using thermal conductivity as claimed in claim 1, wherein: the tin filling machine is characterized in that a base (12) is fixedly connected to the inner portion of the support frame (1) and located below the tin filling mechanism (7), and a placing table (13) is fixedly connected to the surface of the base (12).
3. An apparatus for pre-processing a circuit board using thermal conductivity as claimed in claim 1, wherein: the airflow groove (11) comprises an inflow layer (15), and the lower part of the inflow layer (15) is fixedly connected with a sundry storage layer (16);
the drill bit (5) rotates and simultaneously generates a cyclone with the drill bit (5) as the center, the wind force forms a reciprocating circular airflow in the inflow layer (15) in the airflow groove (11), and the airflow circulates and simultaneously sucks impurity and dust generated during drilling into the impurity storage layer (16) through the airflow groove (11).
4. An apparatus for pre-processing a circuit board using thermal conductivity as claimed in claim 1, wherein: the upper part of the trapezoidal groove (10) is fixedly connected with the tin liquor groove (3).
5. An apparatus for pre-processing a circuit board using thermal conductivity as claimed in claim 3, wherein: the opening size of the inflow layer (15) is smaller than that of the impurity storage layer (16).
6. An apparatus for pre-processing a circuit board using thermal conductivity as claimed in claim 1, wherein: the compression stroke of the spring (8) is smaller than the length of the drill bit (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910756428.1A CN110402032B (en) | 2019-08-16 | 2019-08-16 | Equipment for preprocessing circuit board by utilizing heat conductivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910756428.1A CN110402032B (en) | 2019-08-16 | 2019-08-16 | Equipment for preprocessing circuit board by utilizing heat conductivity |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110402032A CN110402032A (en) | 2019-11-01 |
| CN110402032B true CN110402032B (en) | 2022-03-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910756428.1A Active CN110402032B (en) | 2019-08-16 | 2019-08-16 | Equipment for preprocessing circuit board by utilizing heat conductivity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110402032B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5065932A (en) * | 1990-09-24 | 1991-11-19 | International Business Machines Corporation | Solder placement nozzle with inert cover gas and inert gas bleed |
| CN204975604U (en) * | 2015-06-24 | 2016-01-20 | 天津同鑫泰科技有限公司 | Full -automatic LED lamp plate melts tin stove welding set |
| CN207638987U (en) * | 2017-07-19 | 2018-07-20 | 江西凯强实业有限公司 | A kind of modular circuit board mounting structure |
| CN208047016U (en) * | 2018-03-09 | 2018-11-02 | 浙江海澄德畅机械有限公司 | A kind of circuit boring process equipment |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4340249A1 (en) * | 1993-11-26 | 1995-06-01 | Schmoll Gmbh Maschinen | Apparatus for controlling boring depth in multilayer PCB |
-
2019
- 2019-08-16 CN CN201910756428.1A patent/CN110402032B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5065932A (en) * | 1990-09-24 | 1991-11-19 | International Business Machines Corporation | Solder placement nozzle with inert cover gas and inert gas bleed |
| CN204975604U (en) * | 2015-06-24 | 2016-01-20 | 天津同鑫泰科技有限公司 | Full -automatic LED lamp plate melts tin stove welding set |
| CN207638987U (en) * | 2017-07-19 | 2018-07-20 | 江西凯强实业有限公司 | A kind of modular circuit board mounting structure |
| CN208047016U (en) * | 2018-03-09 | 2018-11-02 | 浙江海澄德畅机械有限公司 | A kind of circuit boring process equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110402032A (en) | 2019-11-01 |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20220301 Address after: No.2, Pingqiao Industrial Park, Pingqiao District, Xinyang City, Henan Province Applicant after: Henan topai Technology Co.,Ltd. Applicant after: Peng Ming Address before: 457001 yard 277, Zhongyuan Road, Hualong District, Puyang City, Henan Province Applicant before: Kong Lingfei |
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