CN110398463A - The illuminated inspection method of the nickel film of laser - Google Patents

The illuminated inspection method of the nickel film of laser Download PDF

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Publication number
CN110398463A
CN110398463A CN201910322926.5A CN201910322926A CN110398463A CN 110398463 A CN110398463 A CN 110398463A CN 201910322926 A CN201910322926 A CN 201910322926A CN 110398463 A CN110398463 A CN 110398463A
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nickel film
index
inspection method
color measuring
laser
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CN110398463B (en
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中岛佐知子
福西笃志
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Denso Corp
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Toyota Motor Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

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Abstract

Subject description discloses a kind of methods that the nickel film to illuminated laser is checked.The inspection method has: reduction process restores on the surface of the nickel film of illuminated laser in reducibility gas atmosphere；The surface of nickel film is heated to 250 DEG C or more after restoring process by heating process under nitrogen atmosphere；Color measuring process carries out color measuring to the surface of nickel film after heating process；And judgment step, based on the color measuring under color measuring process as a result, judging the state on the surface of nickel film.

Description

The illuminated inspection method of the nickel film of laser
Technical field
The inspection method for the nickel film that technology disclosed in this specification has been related to laser illuminated.
Background technique
A kind of manufacturing method of semiconductor device is disclosed in Japanese Unexamined Patent Publication 2017-191807 bulletin.The semiconductor The manufacturing method of device has the process that laser is irradiated to the nickel film for being set to conductor part.In the process of the irradiation laser, Small concaveconvex shape is formed on the nickel film of conductor part.According to Anchoring Effect, the small concaveconvex shape raising of nickel film is led The close property of body component and the sealing material contacted with the conductor part.
When irradiating laser to nickel film, need suitably to set machined parameters.If laser power, irradiation time etc add Work parameter is inappropriate, then small concaveconvex shape will not be properly formed on nickel film.In order to correctly set machined parameters, need Nickel film after illuminated laser is checked, thus the superiority and inferiority of machined parameters used in judging.Even if however, directly seeing Examine the small concaveconvex shape being formed on nickel film, it is also difficult to objectively judge its superiority and inferiority.Therefore, as a method, consider The size for the laser trace for being formed in nickel film is measured, and infers the machining state of nickel film based on this.However, it is necessary to respectively Measurement is formed in multiple laser traces of nickel film, needs the more time.As other methods, it is also considered that the water infiltration of nickel film Property is checked, and the machining state of nickel film is inferred based on this.However, due to needing to use water-soaked nickel film, so can not incite somebody to action Conductor part after inspection is used for product.
Summary of the invention
In view of the above subject, provide in the present specification a kind of nickel film for illuminated laser checked it is new Clever and useful technology.
Subject description discloses a kind of inspection methods that the nickel film to illuminated laser is checked.Inspection method tool Standby: reduction process restores on the surface of the nickel film of illuminated laser in reducibility gas atmosphere；Heating process, In After restoring process, the surface of nickel film is heated to 250 DEG C or more under nitrogen atmosphere；Color measuring process is right after heating process The surface of nickel film carries out color measuring；And judgment step, based on the color measuring in color measuring process as a result, judging nickel film Surface state.
In above-mentioned inspection method, the surface for the nickel film being reduced is heated to 250 DEG C or more under nitrogen atmosphere.This When, if being formed with small concaveconvex shape on the surface of nickel film, nitridation reaction is generated on the surface of nickel film, is generated on nickel film Nickel oxide.If generating nickel oxide on nickel film, the color on the surface of nickel film generates variation.On the other hand, if in nickel film The not formed small concaveconvex shape in surface is then unable to fully carry out nitridation reaction, it is difficult to cause the discoloration of nickel film.Therefore, at this After heating process, color measuring is carried out by surface to nickel film, the shape on the surface for the nickel film that can have judged laser illuminated State.It is not necessarily to carry out the test of the sizing, water logging lubricant nature of laser trace as a result, it will be able to implement the inspection of nickel film.
Detailed description of the invention
Fig. 1 is the schematic diagram for indicating laser irradiation process.
The top view of the nickel film 12 of Fig. 2 laser that has been illuminated.
Fig. 3 is process (the reduction process for indicating to restore the surface 12a of nickel film 12 in reducibility gas atmosphere S12 schematic diagram).
Fig. 4 is indicated the signal of the surface 12a of nickel film 12 process (heating process S14) heated under nitrogen atmosphere Figure.
Fig. 5 A is the top view of the nickel film 12 after heating process S14, indicates to generate nickel oxide and the surface 12a of nickel film 12 is produced Change the state of color.
Fig. 5 B is the top view of the nickel film 12 after heating process S14, indicates not carry out nitridation reaction and nickel film 12 sufficiently The taint-free state of surface 12a.
Fig. 6 is the figure for indicating the R value of surface 12a of the nickel film 12 changed in heating process S14 according to heating temperature Table.
Fig. 7 is the chart being illustrated to the process for the surface state for judging nickel film 12 based on R value.
Fig. 8 is the chart being illustrated to the process for the surface state for judging nickel film 12 based on B value.
Fig. 9 is the illuminated flow chart of the inspection method of the nickel film 12 of laser for indicating embodiment 1.
Specific embodiment
In an embodiment of this technology, the color measuring result in color measuring process can also include at least table Show the index of red color components.In this case, can also be judged in judgment step based on the index of the red color components is indicated The machining state of the state on the surface of nickel film, the nickel film for example carried out by laser irradiation.In this case, though being an example Son, but can also be judged as the nickel formed by laser irradiation when red color measuring result is lower than defined a reference value The machining state of film is bad.Inventor confirmed following fact: if being formed with small concaveconvex shape on the surface of nickel film, When carrying out color measuring to the surface of nickel film, indicate that the finger target value of red color components rises.Therefore, by based on indicate it is red at Point index judge the state on the surface of nickel film, the nickel film that objectively can have evaluated laser illuminated.
Instead of above description or on its basis, the color measuring result being also configured in color measuring process Including at least the index for indicating blue component.It in this case, can also be in judgment step, based on indicating the blue component Index come judge the surface of nickel film state, for example by laser irradiation formed nickel film machining state.In this case, though For an example, but, when the color measuring result of blue is more than defined a reference value, can also be judged as in judgment step Machining state by the nickel film of laser irradiation formation is bad.Inventor confirmed following fact: if being formed on the surface of nickel film There is small concaveconvex shape, then when the surface to nickel film carries out color measuring, indicates that the finger target value of blue component reduces.Cause This also can objectively be evaluated illuminated by judging the state on the surface of nickel film based on the index of blue component is indicated The nickel film of laser.
In an embodiment of this technology, can also in judgment step, based on indicate blue component index come Judge the cleannes of nickel film.Specifically, organising towards nickel film can also be judged based on the index of blue component is indicated Close the presence or absence of the attachment of object.It in this case, can also be more than regulation in the index for indicating blue component though being an example A reference value when, being judged as nickel film, there are the attachments of organic compound.If being attached with the pollutant of organic compound in nickel film, Nickel film becomes blue because of the chemical reaction of accompanying organic compound and nitride.Therefore, (in detail for the cleannes of nickel film It is the presence or absence of organic compound for thin), it can also be judged based on the index of blue component is indicated.
Hereinafter, representative and non-limiting concrete example of the invention is described in detail referring to attached drawing.This is in detail Explanation only merely in order to show the detailed way of preference for carrying out the present invention to those skilled in the art, not It is intended to limit the scope of protection of the present invention.In addition, in order to provide the reviewing party of the nickel film of the illuminated laser further improved Method, the addition technical characteristic of following discloses and invention can independently or together be used with other features, invention.
In addition, the combination of the feature disclosed in following detailed description of, process is not real under maximum magnitude intention Necessary to applying the present invention, it is intended merely to illustrate representative concrete example of the invention and record.Also, for upper State and the various features of following representational concrete examples and independent and dependent claims documented by itself each For a feature, providing addition of the invention and when useful embodiment, and do not have to according to the concrete example recorded here or The sequence that person enumerates is combined.
For all technical features documented by this specification and/or claims, independently of embodiment And/or the structure of technical characteristic documented by claim, it can be understood as the disclosure and power initial to application Benefit requires the restriction of documented specific item, it is intended that carries out disclosure individually and independently of one another.Also, about all numbers It is worth the record of range and group or group, it can be understood as specific documented by initial disclosure and claim to applying The restriction of item, it is intended that disclose these intermediate structures.
[embodiment]
It is illustrated referring to inspection method of the attached drawing to the present embodiment.In the inspection method, to illuminated laser Nickel film 12 is checked.The nickel film 12 to be irradiated with a laser is arranged on conductor part 10, for example, can by sputtering method etc. come It is formed.Conductor part 10 has roughly plate shape, and perhaps cubic shaped for example can be by copper, aluminium or other metals etc Conductor material is constituted.Although an example, conductor part 10 can come as the component of semiconductor device using and passing through Seal (such as resin) and semiconductor element integral packaging.
Here, before the explanation of inspection method, the laser for carrying out laser irradiation with initial reference to Fig. 1, Fig. 2 opposite direction nickel film 12 shines Process is penetrated to be illustrated.As shown in Figure 1, a part or overall exposure laser (figure in laser irradiation process, to nickel film 12 Arrow X-direction in 1).Though impulse laser unit side also can be used in nickel in laser irradiation process for an example It is scanned side on film 12 and discontinuously irradiates mottled laser.Arrow Y in Fig. 1 indicates the scanning direction of laser.Pass through this The laser irradiation of sample, to form small concaveconvex shape on nickel film 12.The small concaveconvex shape, which for example can be improved, leads The close property of body component 10 and seal.As shown in Fig. 2, if observing the nickel film 12 after laser irradiation process, in quilt It has irradiated and has been formed with multiple laser traces 14 on the nickel film 12 of laser.Though being an example, in the laser irradiation of the present embodiment In process, the laser trace 14 of round, about 70 microns of diameter dimension are formed.
It, can not be in nickel if the machined parameters of laser power, irradiation time etc are inappropriate in the laser irradiation process Small concaveconvex shape is properly formed on film 12.In order to correctly set machined parameters, need to the nickel after illuminated laser Film 12 is checked, thus the superiority and inferiority of machined parameters used in judging.About this point, according to the reviewing party of the present embodiment Method, the state for the nickel film 12 that objectively can have evaluated laser illuminated.Hereinafter, being carried out to the inspection method of the present embodiment detailed Explanation.
(embodiment 1) is said referring to inspection method of Fig. 3-Fig. 9 to the nickel film 12 of the illuminated laser of embodiment 1 It is bright.Here, in Fig. 6, Fig. 8, average value obtained from the color measuring for the nickel film 12 for repeating 30 times is depicted.Such as Fig. 9 Shown, inspection method has reduction process S12.In reduction process S12, by the surface 12a of nickel film 12 in reducibility gas atmosphere It is restored under enclosing.The oxide on the nickel film 12 generated in previous laser irradiation process is removed as a result,.Restore process There is no particular limitation for the specific mode of S12.As shown in figure 3, in the present embodiment, the conductor part of nickel film 12 will be formed with 10 configurations import reducibility gas into the chamber 16 in chamber 16.Reducibility gas can for example use hydrogen (H2).But It is that reducibility gas is not limited to hydrogen, carbon monoxide (CO), hydrogen sulfide (H can also be used2S), sulfur dioxide (SO2), two Nitrogen oxide (NO2) etc..Though being an example, in reduction process S12, it also can according to need and nickel film 12 heated.
As shown in figure 9, inspection method is also equipped with heating process S14.Heating process S14 is real after restoring process S12 It applies.In heating process S14, the surface 12a of nickel film 12 is heated under nitrogen atmosphere.At this point, if nickel film 12 table Face 12a forms small concaveconvex shape, then nitridation reaction is generated in the surface 12a of nickel film 12, to generate nitrogen on nickel film 12 Change nickel.If generating nickel oxide on nickel film 12, such as shown in Fig. 5 (A), the color of the surface 12a of nickel film 12 generates variation.With this Relatively, as shown in Fig. 5 (B), if cannot sufficiently carry out nitrogen in the not formed small concaveconvex shape of surface 12a of nickel film 12 Change reaction, it is difficult to cause the discoloration of nickel film 12.That is, if the machined parameters in laser irradiation process are inappropriate, in heating process The discoloration or pico- generate that nickel film 12 will not be generated in S14 change colour.
There is no particular limitation for the specific mode of heating process S14.In the present embodiment, as shown in figure 4, to being configured with Nitrogen is imported in the chamber 16 of conductor part 10, and the atmosphere in the chamber 16 is replaced into nitrogen.It, will after being sufficiently displaced from as nitrogen atmosphere The nickel film 12 of conductor part 10 is heated to defined heating temperature.In heating process S14, it is able to use and reduction process S12 Identical chamber 16, thus, it is possible to one even to implement reduction process S12 and heating process S14.But in heating process S14, The chamber different from the chamber 16 used in reduction process S12 can be used.The heating temperature of nickel film 12 in heating process S14 As long as degree is at 250 DEG C or more.More preferably the heating temperature of nickel film 12 can also be at 285 DEG C or more.Further preferably The heating temperature of nickel film 12 can also be at 300 DEG C or more.In the present embodiment, the heating temperature of nickel film 12 is set as 300 DEG C, and With the temperature for several minutes.
Here, the heating temperature referring to Fig. 6 to the nickel film 12 in heating process S14 and the pass of the discoloration generated in nickel film 12 System is illustrated.The horizontal axis of Fig. 6 indicates the heating temperature in heating process S14, and the longitudinal axis indicates the nickel film 12 after heating process S14 R value.R value is that the index of the brightness of red color components is indicated in RGB color measuring system.As shown in solid in Fig. 6, adding In the range of hot temperature is less than 250 DEG C, do not see that significant variation occurs for the R value of nickel film 12.On the other hand, in heating temperature For in 250 DEG C or more of ranges, heating temperature is higher, then the R value of nickel film 12 more increases.In particular, in heating temperature from 250 DEG C To in the range of 285 DEG C, R value relative to heating temperature rising and the large percentage that increases.Moreover, being more than in heating temperature In the range of 285 DEG C, the ratio that R value increases slows down, and in the range of more than 300 DEG C, the increase of R value becomes very small.
As described above, if in the surface 12a of nickel film 12, there are small concaveconvex shapes, in nickel in heating process S14 The surface 12a of film 12 generates nickel oxide, and the color of the surface 12a of nickel film 12 generates variation.About this point, according to Fig.6, Chart, if heating temperature at 250 DEG C or more, nickel film 12 surface 12a generate nickel oxide, this shows as the table of nickel film 12 The variation of the color of face 12a.Therefore, as long as the heating temperature in heating process S14 is at 250 DEG C or more.In particular, if making Heating temperature is at 285 DEG C or more or at 300 DEG C or more, then the color of the surface 12a of nickel film 12 generates in heating process S14 Large change.As a result, as described above, the heating temperature in heating process S14 can be 285 DEG C or more or 300 DEG C or more.This Outside, the drafting line of the dotted line in Fig. 6 and △ indicate the result for the case where reduction process S12 is omitted.Reduction work is being omitted In the case where sequence S12, even if making 300 DEG C of heating temperature or more in heating process S14, nickel oxide will not be generated, thus The color of the surface 12a of nickel film 12 will not generate substantial variations.
As shown in figure 9, inspection method is also equipped with color measuring process S16.Color measuring process S16 is in heating process Implement after S14.In color measuring process S16, color measuring is carried out to the surface 12a of nickel film 12.Though it is an example, But in color measuring process S16, the surface 12a of nickel film 12 is shot, according to the shooting image by the table of nickel film 12 Face 12a numeralization.That is, obtaining the index for indicating the color of surface 12a of nickel film 12.In the present embodiment, as expression color Index, obtain R value, G value defined in RGB colour system and B value.R value is to indicate the index of the brightness of red color components, G value is to indicate the index of the brightness of green components, and B value is to indicate the index of the brightness of blue component.But color measuring process The index obtained in S16 is not limited to the index of RGB colour system, for example, be also possible to L*a*b* colour system or The index of XYZ colour system or the like defined with other standards.In this case, it also can be used and above-mentioned colour system Corresponding color measuring device carries out color measuring.In addition, in color measuring process S16, as long as at least obtaining R value (or the other indexs for indicating red color components).
As shown in figure 9, inspection method is also equipped with the 1st judgment step S18.In the 1st judgment step S18, surveyed based on color The R value (index for indicating red color components) in process S16 is measured, the state of the surface 12a of nickel film 12 is judged, particularly passes through laser Irradiate the machining state of the nickel film 12 formed.As shown in fig. 7, the R value measured is bigger if machining state is good.It is another Aspect, when laser power is smaller or excessive, R value is smaller.This means that not formed in the surface 12a of nickel film 12 small Bumps, do not generate the variation (that is, generation of nickel oxide) of color in heating process S14.Therefore, a reference value as defined in being arranged S (R) can be judged as that the machining state of the nickel film 12 formed by laser irradiation is good when R value is more than a reference value S (R) (that is, being formed with small concaveconvex shape).On the other hand, when R value is lower than a reference value S (R), it can be judged as and be shone by laser The machining state for penetrating the nickel film 12 to be formed is bad (that is, not forming small concaveconvex shape).In this way, by (being indicated based on R value The index of red color components) come judge nickel film 12 surface 12a state, the nickel film that objectively can have evaluated laser illuminated 12。
In addition to this, as shown in figure 9, the inspection method of the present embodiment is also equipped with the 2nd judgment step S20.2nd judgment step As long as S20 is implemented after color measuring process S16, it doesn't matter and the sequence of the 1st judgment step S18.Work is judged the 2nd In sequence S20, based on the B value (index for indicating blue component) in color measuring process S16, judge the surface 12a's of nickel film 12 The cleannes of state, such as nickel film 12.Specifically, in the 2nd judgment step S20, organic compound court is judged based on B value The presence or absence of attachment to nickel film 12.Organic compound mentioned here for example indicate sebum, vinyl material demoulding ingredient with And adhesive composition of strip material etc..As shown in figure 8, B value compares if being attached with the pollutant of organic compound in nickel film 12 Greatly.This is because if being attached with the pollutant of organic compound, organic compound and nitrogen of the nickel film 12 because of attachment in nickel film 12 The chemical reaction of compound and become blue.Therefore, setting a reference value S (B) is judged as when B value is more than a reference value S (B) in nickel There are the attachments of organic compound for film 12.Therefore, for the cleannes of nickel film 12, (finger of blue component can be indicated based on B value Mark) judged.But the 2nd judgment step S20 is not necessarily required.In case of the present embodiment, for R value and B Value, can carry out color measuring, therefore also can additionally check the cleannes of nickel film 12 simultaneously.
In the inspection method of embodiment 1, the color measuring result in color measuring process S16, which includes at least, indicates red The index of ingredient.But technology disclosed in this specification is not limited to indicate the index of the red color components, as long as can incite somebody to action Pass through the number of colours value for the nickel film 12 that the nitridation reaction in heating process S14 is formed.By by the number of colours of nickel film 12 Value, the state of the surface 12a for the nickel film 12 that can have judged laser illuminated.It is not necessarily to carry out the size of laser trace 14 as a result, Measurement, the test of water logging lubricant nature, it will be able to implement the inspection of nickel film 12.But the index for carrying out color measuring can be changed to The various indexs for indicating other color components, are illustrated in another embodiment below.
(embodiment 2) is illustrated the inspection method of the nickel film 12 of the illuminated laser of embodiment 2.Embodiment 2 Inspection method is different in the following aspects relative to embodiment 1.Firstly, in color measuring process S16, to the surface of nickel film 12 12a carries out color measuring as including at least the index for indicating blue component.In addition, being based in the 1st judgment step S18 The index for indicating the blue component judges the state of the surface 12a of nickel film 12, for example by the nickel film 12 of laser irradiation formation Machining state.It is same as Example 1 in other processes, therefore the description thereof will be omitted.
In the color measuring process S16 of the present embodiment, after heating process S14, face is carried out to the surface 12a of nickel film 12 Color measurement.Although being described above, in color measuring process S16, the surface 12a of nickel film 12 is at least wrapped Include color measuring as the index for indicating blue component.Though being an example, in color measuring process S16, to nickel The surface 12a of film 12 is shot, and shoots image for the number of colours value of the surface 12a of nickel film 12 according to it.That is, obtaining expression The index of the color of the surface 12a of nickel film 12.In the present embodiment, it as the index for indicating color, obtains in RGB colour system Defined in R value, G value and B value.R value is to indicate the index of the brightness of red color components, and G value is to indicate the brightness of green components Index, B value is to indicate the index of the brightness of blue component.But obtained in the color measuring process S16 of the present embodiment Index is not limited to the index of RGB colour system, such as is also possible to L*a*b* colour system or XYZ colour system Or the like the index defined with other standards.In this case, it also can be used corresponding with above-mentioned colour system Color measuring device carries out color measuring.In addition, in color measuring process S16, as long as at least obtaining B value (or indicates Other indexs of blue component).
In the 1st judgment step S18 of the present embodiment, blue component (is indicated based on the B value in color measuring process S16 Index), judge the surface 12a of nickel film 12 state, particularly by laser irradiation formed nickel film 12 machining state.Such as Shown in Fig. 8, if machining state is good, the B value measured is smaller.On the other hand, when laser power is smaller or excessive, B value is bigger.This means that not forming small bumps in the surface 12a of nickel film 12, face is not generated in heating process S14 The variation (that is, generation of nickel oxide) of color.Therefore, a reference value S (B) as defined in being arranged, when B value is lower than a reference value S (B), energy Enough it is judged as that the machining state of the nickel film 12 formed by laser irradiation is good (that is, being formed with small concaveconvex shape).It is another Aspect can be judged as that the machining state of the nickel film 12 formed by laser irradiation is bad when B value is more than a reference value S (B) (that is, not formed small concaveconvex shape).In this way, by judging nickel film 12 based on B value (index for indicating blue component) The state of surface 12a, so as to the nickel film 12 for objectively having evaluated laser illuminated.

Claims (10)

1. a kind of inspection method, the nickel film of illuminated laser is checked, wherein
The inspection method has:
Process is restored, the surface of the nickel film of illuminated laser is restored in reducibility gas atmosphere；
The surface of the nickel film is heated to 250 DEG C or more after the reduction process by heating process in nitrogen atmosphere；
Color measuring process carries out color measuring to the surface of the nickel film after the heating process；And
Judgment step, based on the color measuring in the color measuring process as a result, judging the shape on the surface of the nickel film State.
2. inspection method according to claim 1, wherein
The color measuring result in the color measuring process includes at least the index for indicating red color components,
In the judgment step, the shape on the surface of the nickel film is judged based on the index of the red color components is indicated State.
3. inspection method according to claim 2, wherein
In the judgment step, the institute formed by the laser irradiation is judged based on the index of the red color components is indicated State the machining state of nickel film.
4. inspection method according to claim 3, wherein
In the judgment step, when the index for indicating the red color components is lower than defined a reference value, it is judged as and passes through institute The machining state for stating the nickel film of laser irradiation formation is bad.
5. inspection method according to any one of claims 1 to 4, wherein
The color measuring result in the color measuring process includes at least the index for indicating blue component,
In the judgment step, the shape on the surface of the nickel film is judged based on the index of the blue component is indicated State.
6. inspection method according to claim 5, wherein
In the judgment step, the institute formed by the laser irradiation is judged based on the index of the blue component is indicated State the machining state of nickel film.
7. inspection method according to claim 6, wherein
In the judgment step, when the index for indicating the blue component is more than defined a reference value, it is judged as and passes through institute The machining state for stating the nickel film of laser irradiation formation is bad.
8. the inspection method according to any one of claim 5~7, wherein
In the judgment step, the cleannes of the nickel film are judged based on the index of the blue component is indicated.
9. inspection method according to claim 8, wherein
In the judgment step, the attached of the organic compound of the nickel film is judged based on the index of the blue component is indicated The presence or absence of.
10. inspection method according to claim 9, wherein
In the judgment step, when the index for indicating the blue component is more than defined a reference value, it is judged as the nickel There are the attachments of the organic compound for film.
CN201910322926.5A 2018-04-24 2019-04-22 Method for inspecting nickel film irradiated with laser Active CN110398463B (en)

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US20190321918A1 (en) 2019-10-24

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