CN110398463A - The illuminated inspection method of the nickel film of laser - Google Patents
The illuminated inspection method of the nickel film of laser Download PDFInfo
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- CN110398463A CN110398463A CN201910322926.5A CN201910322926A CN110398463A CN 110398463 A CN110398463 A CN 110398463A CN 201910322926 A CN201910322926 A CN 201910322926A CN 110398463 A CN110398463 A CN 110398463A
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- nickel film
- index
- inspection method
- color measuring
- laser
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims abstract description 336
- 229910052759 nickel Inorganic materials 0.000 title claims abstract description 168
- 238000000034 method Methods 0.000 title claims abstract description 87
- 238000007689 inspection Methods 0.000 title claims abstract description 35
- 238000010438 heat treatment Methods 0.000 claims abstract description 51
- 230000008569 process Effects 0.000 claims abstract description 49
- 238000011946 reduction process Methods 0.000 claims abstract description 11
- 239000007789 gas Substances 0.000 claims abstract description 8
- 239000012299 nitrogen atmosphere Substances 0.000 claims abstract description 7
- 239000012298 atmosphere Substances 0.000 claims abstract description 6
- 238000003754 machining Methods 0.000 claims description 19
- 150000002894 organic compounds Chemical class 0.000 claims description 12
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000004020 conductor Substances 0.000 description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 229910000480 nickel oxide Inorganic materials 0.000 description 9
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 8
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- RAHZWNYVWXNFOC-UHFFFAOYSA-N Sulphur dioxide Chemical compound O=S=O RAHZWNYVWXNFOC-UHFFFAOYSA-N 0.000 description 4
- 238000002845 discoloration Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000003086 colorant Substances 0.000 description 3
- 239000003344 environmental pollutant Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 231100000719 pollutant Toxicity 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 229910002091 carbon monoxide Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 210000002374 sebum Anatomy 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- High Energy & Nuclear Physics (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- General Health & Medical Sciences (AREA)
- Pathology (AREA)
- Biochemistry (AREA)
- Analytical Chemistry (AREA)
- Immunology (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
Abstract
Subject description discloses a kind of methods that the nickel film to illuminated laser is checked.The inspection method has: reduction process restores on the surface of the nickel film of illuminated laser in reducibility gas atmosphere；The surface of nickel film is heated to 250 DEG C or more after restoring process by heating process under nitrogen atmosphere；Color measuring process carries out color measuring to the surface of nickel film after heating process；And judgment step, based on the color measuring under color measuring process as a result, judging the state on the surface of nickel film.
Description
Technical field
The inspection method for the nickel film that technology disclosed in this specification has been related to laser illuminated.
Background technique
A kind of manufacturing method of semiconductor device is disclosed in Japanese Unexamined Patent Publication 2017-191807 bulletin.The semiconductor
The manufacturing method of device has the process that laser is irradiated to the nickel film for being set to conductor part.In the process of the irradiation laser,
Small concaveconvex shape is formed on the nickel film of conductor part.According to Anchoring Effect, the small concaveconvex shape raising of nickel film is led
The close property of body component and the sealing material contacted with the conductor part.
When irradiating laser to nickel film, need suitably to set machined parameters.If laser power, irradiation time etc add
Work parameter is inappropriate, then small concaveconvex shape will not be properly formed on nickel film.In order to correctly set machined parameters, need
Nickel film after illuminated laser is checked, thus the superiority and inferiority of machined parameters used in judging.Even if however, directly seeing
Examine the small concaveconvex shape being formed on nickel film, it is also difficult to objectively judge its superiority and inferiority.Therefore, as a method, consider
The size for the laser trace for being formed in nickel film is measured, and infers the machining state of nickel film based on this.However, it is necessary to respectively
Measurement is formed in multiple laser traces of nickel film, needs the more time.As other methods, it is also considered that the water infiltration of nickel film
Property is checked, and the machining state of nickel film is inferred based on this.However, due to needing to use water-soaked nickel film, so can not incite somebody to action
Conductor part after inspection is used for product.
Summary of the invention
In view of the above subject, provide in the present specification a kind of nickel film for illuminated laser checked it is new
Clever and useful technology.
Subject description discloses a kind of inspection methods that the nickel film to illuminated laser is checked.Inspection method tool
Standby: reduction process restores on the surface of the nickel film of illuminated laser in reducibility gas atmosphere；Heating process, In
After restoring process, the surface of nickel film is heated to 250 DEG C or more under nitrogen atmosphere；Color measuring process is right after heating process
The surface of nickel film carries out color measuring；And judgment step, based on the color measuring in color measuring process as a result, judging nickel film
Surface state.
In above-mentioned inspection method, the surface for the nickel film being reduced is heated to 250 DEG C or more under nitrogen atmosphere.This
When, if being formed with small concaveconvex shape on the surface of nickel film, nitridation reaction is generated on the surface of nickel film, is generated on nickel film
Nickel oxide.If generating nickel oxide on nickel film, the color on the surface of nickel film generates variation.On the other hand, if in nickel film
The not formed small concaveconvex shape in surface is then unable to fully carry out nitridation reaction, it is difficult to cause the discoloration of nickel film.Therefore, at this
After heating process, color measuring is carried out by surface to nickel film, the shape on the surface for the nickel film that can have judged laser illuminated
State.It is not necessarily to carry out the test of the sizing, water logging lubricant nature of laser trace as a result, it will be able to implement the inspection of nickel film.
Detailed description of the invention
Fig. 1 is the schematic diagram for indicating laser irradiation process.
The top view of the nickel film 12 of Fig. 2 laser that has been illuminated.
Fig. 3 is process (the reduction process for indicating to restore the surface 12a of nickel film 12 in reducibility gas atmosphere
S12 schematic diagram).
Fig. 4 is indicated the signal of the surface 12a of nickel film 12 process (heating process S14) heated under nitrogen atmosphere
Figure.
Fig. 5 A is the top view of the nickel film 12 after heating process S14, indicates to generate nickel oxide and the surface 12a of nickel film 12 is produced
Change the state of color.
Fig. 5 B is the top view of the nickel film 12 after heating process S14, indicates not carry out nitridation reaction and nickel film 12 sufficiently
The taint-free state of surface 12a.
Fig. 6 is the figure for indicating the R value of surface 12a of the nickel film 12 changed in heating process S14 according to heating temperature
Table.
Fig. 7 is the chart being illustrated to the process for the surface state for judging nickel film 12 based on R value.
Fig. 8 is the chart being illustrated to the process for the surface state for judging nickel film 12 based on B value.
Fig. 9 is the illuminated flow chart of the inspection method of the nickel film 12 of laser for indicating embodiment 1.
Specific embodiment
In an embodiment of this technology, the color measuring result in color measuring process can also include at least table
Show the index of red color components.In this case, can also be judged in judgment step based on the index of the red color components is indicated
The machining state of the state on the surface of nickel film, the nickel film for example carried out by laser irradiation.In this case, though being an example
Son, but can also be judged as the nickel formed by laser irradiation when red color measuring result is lower than defined a reference value
The machining state of film is bad.Inventor confirmed following fact: if being formed with small concaveconvex shape on the surface of nickel film,
When carrying out color measuring to the surface of nickel film, indicate that the finger target value of red color components rises.Therefore, by based on indicate it is red at
Point index judge the state on the surface of nickel film, the nickel film that objectively can have evaluated laser illuminated.
Instead of above description or on its basis, the color measuring result being also configured in color measuring process
Including at least the index for indicating blue component.It in this case, can also be in judgment step, based on indicating the blue component
Index come judge the surface of nickel film state, for example by laser irradiation formed nickel film machining state.In this case, though
For an example, but, when the color measuring result of blue is more than defined a reference value, can also be judged as in judgment step
Machining state by the nickel film of laser irradiation formation is bad.Inventor confirmed following fact: if being formed on the surface of nickel film
There is small concaveconvex shape, then when the surface to nickel film carries out color measuring, indicates that the finger target value of blue component reduces.Cause
This also can objectively be evaluated illuminated by judging the state on the surface of nickel film based on the index of blue component is indicated
The nickel film of laser.
In an embodiment of this technology, can also in judgment step, based on indicate blue component index come
Judge the cleannes of nickel film.Specifically, organising towards nickel film can also be judged based on the index of blue component is indicated
Close the presence or absence of the attachment of object.It in this case, can also be more than regulation in the index for indicating blue component though being an example
A reference value when, being judged as nickel film, there are the attachments of organic compound.If being attached with the pollutant of organic compound in nickel film,
Nickel film becomes blue because of the chemical reaction of accompanying organic compound and nitride.Therefore, (in detail for the cleannes of nickel film
It is the presence or absence of organic compound for thin), it can also be judged based on the index of blue component is indicated.
Hereinafter, representative and non-limiting concrete example of the invention is described in detail referring to attached drawing.This is in detail
Explanation only merely in order to show the detailed way of preference for carrying out the present invention to those skilled in the art, not
It is intended to limit the scope of protection of the present invention.In addition, in order to provide the reviewing party of the nickel film of the illuminated laser further improved
Method, the addition technical characteristic of following discloses and invention can independently or together be used with other features, invention.
In addition, the combination of the feature disclosed in following detailed description of, process is not real under maximum magnitude intention
Necessary to applying the present invention, it is intended merely to illustrate representative concrete example of the invention and record.Also, for upper
State and the various features of following representational concrete examples and independent and dependent claims documented by itself each
For a feature, providing addition of the invention and when useful embodiment, and do not have to according to the concrete example recorded here or
The sequence that person enumerates is combined.
For all technical features documented by this specification and/or claims, independently of embodiment
And/or the structure of technical characteristic documented by claim, it can be understood as the disclosure and power initial to application
Benefit requires the restriction of documented specific item, it is intended that carries out disclosure individually and independently of one another.Also, about all numbers
It is worth the record of range and group or group, it can be understood as specific documented by initial disclosure and claim to applying
The restriction of item, it is intended that disclose these intermediate structures.
[embodiment]
It is illustrated referring to inspection method of the attached drawing to the present embodiment.In the inspection method, to illuminated laser
Nickel film 12 is checked.The nickel film 12 to be irradiated with a laser is arranged on conductor part 10, for example, can by sputtering method etc. come
It is formed.Conductor part 10 has roughly plate shape, and perhaps cubic shaped for example can be by copper, aluminium or other metals etc
Conductor material is constituted.Although an example, conductor part 10 can come as the component of semiconductor device using and passing through
Seal (such as resin) and semiconductor element integral packaging.
Here, before the explanation of inspection method, the laser for carrying out laser irradiation with initial reference to Fig. 1, Fig. 2 opposite direction nickel film 12 shines
Process is penetrated to be illustrated.As shown in Figure 1, a part or overall exposure laser (figure in laser irradiation process, to nickel film 12
Arrow X-direction in 1).Though impulse laser unit side also can be used in nickel in laser irradiation process for an example
It is scanned side on film 12 and discontinuously irradiates mottled laser.Arrow Y in Fig. 1 indicates the scanning direction of laser.Pass through this
The laser irradiation of sample, to form small concaveconvex shape on nickel film 12.The small concaveconvex shape, which for example can be improved, leads
The close property of body component 10 and seal.As shown in Fig. 2, if observing the nickel film 12 after laser irradiation process, in quilt
It has irradiated and has been formed with multiple laser traces 14 on the nickel film 12 of laser.Though being an example, in the laser irradiation of the present embodiment
In process, the laser trace 14 of round, about 70 microns of diameter dimension are formed.
It, can not be in nickel if the machined parameters of laser power, irradiation time etc are inappropriate in the laser irradiation process
Small concaveconvex shape is properly formed on film 12.In order to correctly set machined parameters, need to the nickel after illuminated laser
Film 12 is checked, thus the superiority and inferiority of machined parameters used in judging.About this point, according to the reviewing party of the present embodiment
Method, the state for the nickel film 12 that objectively can have evaluated laser illuminated.Hereinafter, being carried out to the inspection method of the present embodiment detailed
Explanation.
(embodiment 1) is said referring to inspection method of Fig. 3-Fig. 9 to the nickel film 12 of the illuminated laser of embodiment 1
It is bright.Here, in Fig. 6, Fig. 8, average value obtained from the color measuring for the nickel film 12 for repeating 30 times is depicted.Such as Fig. 9
Shown, inspection method has reduction process S12.In reduction process S12, by the surface 12a of nickel film 12 in reducibility gas atmosphere
It is restored under enclosing.The oxide on the nickel film 12 generated in previous laser irradiation process is removed as a result,.Restore process
There is no particular limitation for the specific mode of S12.As shown in figure 3, in the present embodiment, the conductor part of nickel film 12 will be formed with
10 configurations import reducibility gas into the chamber 16 in chamber 16.Reducibility gas can for example use hydrogen (H2).But
It is that reducibility gas is not limited to hydrogen, carbon monoxide (CO), hydrogen sulfide (H can also be used2S), sulfur dioxide (SO2), two
Nitrogen oxide (NO2) etc..Though being an example, in reduction process S12, it also can according to need and nickel film 12 heated.
As shown in figure 9, inspection method is also equipped with heating process S14.Heating process S14 is real after restoring process S12
It applies.In heating process S14, the surface 12a of nickel film 12 is heated under nitrogen atmosphere.At this point, if nickel film 12 table
Face 12a forms small concaveconvex shape, then nitridation reaction is generated in the surface 12a of nickel film 12, to generate nitrogen on nickel film 12
Change nickel.If generating nickel oxide on nickel film 12, such as shown in Fig. 5 (A), the color of the surface 12a of nickel film 12 generates variation.With this
Relatively, as shown in Fig. 5 (B), if cannot sufficiently carry out nitrogen in the not formed small concaveconvex shape of surface 12a of nickel film 12
Change reaction, it is difficult to cause the discoloration of nickel film 12.That is, if the machined parameters in laser irradiation process are inappropriate, in heating process
The discoloration or pico- generate that nickel film 12 will not be generated in S14 change colour.
There is no particular limitation for the specific mode of heating process S14.In the present embodiment, as shown in figure 4, to being configured with
Nitrogen is imported in the chamber 16 of conductor part 10, and the atmosphere in the chamber 16 is replaced into nitrogen.It, will after being sufficiently displaced from as nitrogen atmosphere
The nickel film 12 of conductor part 10 is heated to defined heating temperature.In heating process S14, it is able to use and reduction process S12
Identical chamber 16, thus, it is possible to one even to implement reduction process S12 and heating process S14.But in heating process S14,
The chamber different from the chamber 16 used in reduction process S12 can be used.The heating temperature of nickel film 12 in heating process S14
As long as degree is at 250 DEG C or more.More preferably the heating temperature of nickel film 12 can also be at 285 DEG C or more.Further preferably
The heating temperature of nickel film 12 can also be at 300 DEG C or more.In the present embodiment, the heating temperature of nickel film 12 is set as 300 DEG C, and
With the temperature for several minutes.
Here, the heating temperature referring to Fig. 6 to the nickel film 12 in heating process S14 and the pass of the discoloration generated in nickel film 12
System is illustrated.The horizontal axis of Fig. 6 indicates the heating temperature in heating process S14, and the longitudinal axis indicates the nickel film 12 after heating process S14
R value.R value is that the index of the brightness of red color components is indicated in RGB color measuring system.As shown in solid in Fig. 6, adding
In the range of hot temperature is less than 250 DEG C, do not see that significant variation occurs for the R value of nickel film 12.On the other hand, in heating temperature
For in 250 DEG C or more of ranges, heating temperature is higher, then the R value of nickel film 12 more increases.In particular, in heating temperature from 250 DEG C
To in the range of 285 DEG C, R value relative to heating temperature rising and the large percentage that increases.Moreover, being more than in heating temperature
In the range of 285 DEG C, the ratio that R value increases slows down, and in the range of more than 300 DEG C, the increase of R value becomes very small.
As described above, if in the surface 12a of nickel film 12, there are small concaveconvex shapes, in nickel in heating process S14
The surface 12a of film 12 generates nickel oxide, and the color of the surface 12a of nickel film 12 generates variation.About this point, according to Fig.6,
Chart, if heating temperature at 250 DEG C or more, nickel film 12 surface 12a generate nickel oxide, this shows as the table of nickel film 12
The variation of the color of face 12a.Therefore, as long as the heating temperature in heating process S14 is at 250 DEG C or more.In particular, if making
Heating temperature is at 285 DEG C or more or at 300 DEG C or more, then the color of the surface 12a of nickel film 12 generates in heating process S14
Large change.As a result, as described above, the heating temperature in heating process S14 can be 285 DEG C or more or 300 DEG C or more.This
Outside, the drafting line of the dotted line in Fig. 6 and △ indicate the result for the case where reduction process S12 is omitted.Reduction work is being omitted
In the case where sequence S12, even if making 300 DEG C of heating temperature or more in heating process S14, nickel oxide will not be generated, thus
The color of the surface 12a of nickel film 12 will not generate substantial variations.
As shown in figure 9, inspection method is also equipped with color measuring process S16.Color measuring process S16 is in heating process
Implement after S14.In color measuring process S16, color measuring is carried out to the surface 12a of nickel film 12.Though it is an example,
But in color measuring process S16, the surface 12a of nickel film 12 is shot, according to the shooting image by the table of nickel film 12
Face 12a numeralization.That is, obtaining the index for indicating the color of surface 12a of nickel film 12.In the present embodiment, as expression color
Index, obtain R value, G value defined in RGB colour system and B value.R value is to indicate the index of the brightness of red color components,
G value is to indicate the index of the brightness of green components, and B value is to indicate the index of the brightness of blue component.But color measuring process
The index obtained in S16 is not limited to the index of RGB colour system, for example, be also possible to L*a*b* colour system or
The index of XYZ colour system or the like defined with other standards.In this case, it also can be used and above-mentioned colour system
Corresponding color measuring device carries out color measuring.In addition, in color measuring process S16, as long as at least obtaining R value
(or the other indexs for indicating red color components).
As shown in figure 9, inspection method is also equipped with the 1st judgment step S18.In the 1st judgment step S18, surveyed based on color
The R value (index for indicating red color components) in process S16 is measured, the state of the surface 12a of nickel film 12 is judged, particularly passes through laser
Irradiate the machining state of the nickel film 12 formed.As shown in fig. 7, the R value measured is bigger if machining state is good.It is another
Aspect, when laser power is smaller or excessive, R value is smaller.This means that not formed in the surface 12a of nickel film 12 small
Bumps, do not generate the variation (that is, generation of nickel oxide) of color in heating process S14.Therefore, a reference value as defined in being arranged
S (R) can be judged as that the machining state of the nickel film 12 formed by laser irradiation is good when R value is more than a reference value S (R)
(that is, being formed with small concaveconvex shape).On the other hand, when R value is lower than a reference value S (R), it can be judged as and be shone by laser
The machining state for penetrating the nickel film 12 to be formed is bad (that is, not forming small concaveconvex shape).In this way, by (being indicated based on R value
The index of red color components) come judge nickel film 12 surface 12a state, the nickel film that objectively can have evaluated laser illuminated
12。
In addition to this, as shown in figure 9, the inspection method of the present embodiment is also equipped with the 2nd judgment step S20.2nd judgment step
As long as S20 is implemented after color measuring process S16, it doesn't matter and the sequence of the 1st judgment step S18.Work is judged the 2nd
In sequence S20, based on the B value (index for indicating blue component) in color measuring process S16, judge the surface 12a's of nickel film 12
The cleannes of state, such as nickel film 12.Specifically, in the 2nd judgment step S20, organic compound court is judged based on B value
The presence or absence of attachment to nickel film 12.Organic compound mentioned here for example indicate sebum, vinyl material demoulding ingredient with
And adhesive composition of strip material etc..As shown in figure 8, B value compares if being attached with the pollutant of organic compound in nickel film 12
Greatly.This is because if being attached with the pollutant of organic compound, organic compound and nitrogen of the nickel film 12 because of attachment in nickel film 12
The chemical reaction of compound and become blue.Therefore, setting a reference value S (B) is judged as when B value is more than a reference value S (B) in nickel
There are the attachments of organic compound for film 12.Therefore, for the cleannes of nickel film 12, (finger of blue component can be indicated based on B value
Mark) judged.But the 2nd judgment step S20 is not necessarily required.In case of the present embodiment, for R value and B
Value, can carry out color measuring, therefore also can additionally check the cleannes of nickel film 12 simultaneously.
In the inspection method of embodiment 1, the color measuring result in color measuring process S16, which includes at least, indicates red
The index of ingredient.But technology disclosed in this specification is not limited to indicate the index of the red color components, as long as can incite somebody to action
Pass through the number of colours value for the nickel film 12 that the nitridation reaction in heating process S14 is formed.By by the number of colours of nickel film 12
Value, the state of the surface 12a for the nickel film 12 that can have judged laser illuminated.It is not necessarily to carry out the size of laser trace 14 as a result,
Measurement, the test of water logging lubricant nature, it will be able to implement the inspection of nickel film 12.But the index for carrying out color measuring can be changed to
The various indexs for indicating other color components, are illustrated in another embodiment below.
(embodiment 2) is illustrated the inspection method of the nickel film 12 of the illuminated laser of embodiment 2.Embodiment 2
Inspection method is different in the following aspects relative to embodiment 1.Firstly, in color measuring process S16, to the surface of nickel film 12
12a carries out color measuring as including at least the index for indicating blue component.In addition, being based in the 1st judgment step S18
The index for indicating the blue component judges the state of the surface 12a of nickel film 12, for example by the nickel film 12 of laser irradiation formation
Machining state.It is same as Example 1 in other processes, therefore the description thereof will be omitted.
In the color measuring process S16 of the present embodiment, after heating process S14, face is carried out to the surface 12a of nickel film 12
Color measurement.Although being described above, in color measuring process S16, the surface 12a of nickel film 12 is at least wrapped
Include color measuring as the index for indicating blue component.Though being an example, in color measuring process S16, to nickel
The surface 12a of film 12 is shot, and shoots image for the number of colours value of the surface 12a of nickel film 12 according to it.That is, obtaining expression
The index of the color of the surface 12a of nickel film 12.In the present embodiment, it as the index for indicating color, obtains in RGB colour system
Defined in R value, G value and B value.R value is to indicate the index of the brightness of red color components, and G value is to indicate the brightness of green components
Index, B value is to indicate the index of the brightness of blue component.But obtained in the color measuring process S16 of the present embodiment
Index is not limited to the index of RGB colour system, such as is also possible to L*a*b* colour system or XYZ colour system
Or the like the index defined with other standards.In this case, it also can be used corresponding with above-mentioned colour system
Color measuring device carries out color measuring.In addition, in color measuring process S16, as long as at least obtaining B value (or indicates
Other indexs of blue component).
In the 1st judgment step S18 of the present embodiment, blue component (is indicated based on the B value in color measuring process S16
Index), judge the surface 12a of nickel film 12 state, particularly by laser irradiation formed nickel film 12 machining state.Such as
Shown in Fig. 8, if machining state is good, the B value measured is smaller.On the other hand, when laser power is smaller or excessive,
B value is bigger.This means that not forming small bumps in the surface 12a of nickel film 12, face is not generated in heating process S14
The variation (that is, generation of nickel oxide) of color.Therefore, a reference value S (B) as defined in being arranged, when B value is lower than a reference value S (B), energy
Enough it is judged as that the machining state of the nickel film 12 formed by laser irradiation is good (that is, being formed with small concaveconvex shape).It is another
Aspect can be judged as that the machining state of the nickel film 12 formed by laser irradiation is bad when B value is more than a reference value S (B)
(that is, not formed small concaveconvex shape).In this way, by judging nickel film 12 based on B value (index for indicating blue component)
The state of surface 12a, so as to the nickel film 12 for objectively having evaluated laser illuminated.
Claims (10)
1. a kind of inspection method, the nickel film of illuminated laser is checked, wherein
The inspection method has:
Process is restored, the surface of the nickel film of illuminated laser is restored in reducibility gas atmosphere；
The surface of the nickel film is heated to 250 DEG C or more after the reduction process by heating process in nitrogen atmosphere；
Color measuring process carries out color measuring to the surface of the nickel film after the heating process；And
Judgment step, based on the color measuring in the color measuring process as a result, judging the shape on the surface of the nickel film
State.
2. inspection method according to claim 1, wherein
The color measuring result in the color measuring process includes at least the index for indicating red color components,
In the judgment step, the shape on the surface of the nickel film is judged based on the index of the red color components is indicated
State.
3. inspection method according to claim 2, wherein
In the judgment step, the institute formed by the laser irradiation is judged based on the index of the red color components is indicated
State the machining state of nickel film.
4. inspection method according to claim 3, wherein
In the judgment step, when the index for indicating the red color components is lower than defined a reference value, it is judged as and passes through institute
The machining state for stating the nickel film of laser irradiation formation is bad.
5. inspection method according to any one of claims 1 to 4, wherein
The color measuring result in the color measuring process includes at least the index for indicating blue component,
In the judgment step, the shape on the surface of the nickel film is judged based on the index of the blue component is indicated
State.
6. inspection method according to claim 5, wherein
In the judgment step, the institute formed by the laser irradiation is judged based on the index of the blue component is indicated
State the machining state of nickel film.
7. inspection method according to claim 6, wherein
In the judgment step, when the index for indicating the blue component is more than defined a reference value, it is judged as and passes through institute
The machining state for stating the nickel film of laser irradiation formation is bad.
8. the inspection method according to any one of claim 5~7, wherein
In the judgment step, the cleannes of the nickel film are judged based on the index of the blue component is indicated.
9. inspection method according to claim 8, wherein
In the judgment step, the attached of the organic compound of the nickel film is judged based on the index of the blue component is indicated
The presence or absence of.
10. inspection method according to claim 9, wherein
In the judgment step, when the index for indicating the blue component is more than defined a reference value, it is judged as the nickel
There are the attachments of the organic compound for film.
Applications Claiming Priority (2)
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| JP2018-083037 | 2018-04-24 | ||
| JP2018083037A JP6988669B2 (en) | 2018-04-24 | 2018-04-24 | Inspecting method for laser-irradiated nickel film |
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| CN110398463B CN110398463B (en) | 2022-03-04 |
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|---|---|
| US (1) | US10828725B2 (en) |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06216485A (en) * | 1993-01-20 | 1994-08-05 | Hitachi Ltd | Formation of connecting conductor of ceramic wiring board |
| JP2007088211A (en) * | 2005-09-22 | 2007-04-05 | Toppan Printing Co Ltd | Lead frame and its manufacturing method |
| US20090202807A1 (en) * | 2006-06-22 | 2009-08-13 | National Kuniversity Corporation Kitami Institue Of Technology | Method for producing metal nitride film, oxide film, metal carbide film or composite film of them, and production apparatus therefor |
| CN102893140A (en) * | 2010-05-19 | 2013-01-23 | 夏普株式会社 | Die inspection method |
| WO2014193882A1 (en) * | 2013-05-28 | 2014-12-04 | Huf North American Automotive Parts Mfg. Corp. | Method for color marking metallic surfaces |
| CN107464762A (en) * | 2016-06-03 | 2017-12-12 | 株式会社迪思科 | The inspection method of machined object, check device, laser processing device, expanding unit |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61174280A (en) * | 1985-01-29 | 1986-08-05 | Inoue Japax Res Inc | Joining of members |
| JPS6236543A (en) * | 1985-08-12 | 1987-02-17 | Kawasaki Steel Corp | Purity measurement for steel plate surface |
| JPH01162584A (en) * | 1987-12-18 | 1989-06-27 | Kawasaki Steel Corp | Method and device for roughening roll |
| JPH06212451A (en) * | 1993-01-11 | 1994-08-02 | Osaka Prefecture | Method for ornamenting metallic surface |
| JPH10249556A (en) * | 1997-03-12 | 1998-09-22 | Mitsubishi Chem Corp | Texture device and texture working method |
| JP2008207563A (en) * | 2003-01-28 | 2008-09-11 | Iwakura Yosetsu Kogyosho:Kk | Collar marking method by laser |
| JP4331097B2 (en) * | 2004-12-10 | 2009-09-16 | 株式会社東芝 | Surface roughness measurement method and apparatus, and turbine deterioration diagnosis method |
| JP5936042B2 (en) | 2012-03-22 | 2016-06-15 | アイシン精機株式会社 | Semiconductor device and manufacturing method thereof |
| CN106670653A (en) * | 2015-11-11 | 2017-05-17 | 恩耐公司 | Rust free stainless steel engraving |
| JP2017191807A (en) | 2016-04-11 | 2017-10-19 | 三菱電機株式会社 | Power semiconductor device and manufacturing method of power semiconductor device |
-
2018
- 2018-04-24 JP JP2018083037A patent/JP6988669B2/en active Active
-
2019
- 2019-04-12 US US16/382,553 patent/US10828725B2/en active Active
- 2019-04-22 CN CN201910322926.5A patent/CN110398463B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06216485A (en) * | 1993-01-20 | 1994-08-05 | Hitachi Ltd | Formation of connecting conductor of ceramic wiring board |
| JP2007088211A (en) * | 2005-09-22 | 2007-04-05 | Toppan Printing Co Ltd | Lead frame and its manufacturing method |
| US20090202807A1 (en) * | 2006-06-22 | 2009-08-13 | National Kuniversity Corporation Kitami Institue Of Technology | Method for producing metal nitride film, oxide film, metal carbide film or composite film of them, and production apparatus therefor |
| CN102893140A (en) * | 2010-05-19 | 2013-01-23 | 夏普株式会社 | Die inspection method |
| WO2014193882A1 (en) * | 2013-05-28 | 2014-12-04 | Huf North American Automotive Parts Mfg. Corp. | Method for color marking metallic surfaces |
| CN107464762A (en) * | 2016-06-03 | 2017-12-12 | 株式会社迪思科 | The inspection method of machined object, check device, laser processing device, expanding unit |
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| Publication number | Publication date |
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| CN110398463B (en) | 2022-03-04 |
| US20190321918A1 (en) | 2019-10-24 |
| US10828725B2 (en) | 2020-11-10 |
| JP6988669B2 (en) | 2022-01-05 |
| JP2019190957A (en) | 2019-10-31 |
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