CN110388991A - A kind of dynamic heat flux sensor collecting thermoelectrical potential effect - Google Patents
A kind of dynamic heat flux sensor collecting thermoelectrical potential effect Download PDFInfo
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- CN110388991A CN110388991A CN201910789938.9A CN201910789938A CN110388991A CN 110388991 A CN110388991 A CN 110388991A CN 201910789938 A CN201910789938 A CN 201910789938A CN 110388991 A CN110388991 A CN 110388991A
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- 230000004907 flux Effects 0.000 title claims abstract description 19
- 230000003334 potential effect Effects 0.000 title claims abstract description 15
- 229910001120 nichrome Inorganic materials 0.000 claims abstract description 44
- 239000002470 thermal conductor Substances 0.000 claims abstract description 44
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910052628 phlogopite Inorganic materials 0.000 claims abstract description 19
- 229910021484 silicon-nickel alloy Inorganic materials 0.000 claims abstract description 18
- 239000010946 fine silver Substances 0.000 claims abstract description 11
- 238000009413 insulation Methods 0.000 claims description 18
- 239000011230 binding agent Substances 0.000 claims description 11
- 239000003822 epoxy resin Substances 0.000 claims description 11
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 11
- 229920000647 polyepoxide Polymers 0.000 claims description 11
- 238000003466 welding Methods 0.000 claims description 8
- 238000005266 casting Methods 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 229910018487 Ni—Cr Inorganic materials 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 claims description 2
- 230000005619 thermoelectricity Effects 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 claims 1
- 229920006332 epoxy adhesive Polymers 0.000 claims 1
- 238000012360 testing method Methods 0.000 abstract description 18
- 230000008901 benefit Effects 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 4
- 230000004044 response Effects 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000001727 in vivo Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 description 3
- 238000004088 simulation Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 239000010431 corundum Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K17/00—Measuring quantity of heat
- G01K17/06—Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device
- G01K17/08—Measuring quantity of heat conveyed by flowing media, e.g. in heating systems e.g. the quantity of heat in a transporting medium, delivered to or consumed in an expenditure device based upon measurement of temperature difference or of a temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
- G01K7/04—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples the object to be measured not forming one of the thermoelectric materials
- G01K7/06—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples the object to be measured not forming one of the thermoelectric materials the thermoelectric materials being arranged one within the other with the junction at one end exposed to the object, e.g. sheathed type
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Combustion & Propulsion (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The invention discloses a kind of dynamic heat flux sensors for collecting thermoelectrical potential effect, comprising: T-type package casing body is connected with the heat sink body in T-type tail portion thereon, the T-type package casing body and T-type tail portion is heat sink is provided with receiving cavity in vivo；Nichrome thermal conductor is located in receiving cavity and one end is connected with phlogopite collet, has receiving opening in the nichrome thermal conductor；Alundum tube is fixed in receiving opening；Dew type single nickel silicon alloy silk is held, is fixed in alundum tube, and end face is flushed with nichrome thermal conductor front end face；Fine silver plunger is located at the outlet port of receiving opening, and is connected with end dew type single nickel silicon alloy silk head.The dynamic heat flux sensor of collection thermoelectrical potential effect of the invention have processing with assembly technology is simple, production cost is low, quality easy to accomplish control, improve sensor thermal response speed, testing precision and extension the validity test time the advantages of.
Description
Technical field
The invention belongs to hypersonic device ground solar heat protection experimental technique and flight test testing fields, and in particular to Yi Zhongji
The dynamic heat flux sensor of thermoelectrical potential effect.
Background technique
Hypersonic aircraft can form height in aircraft surface in endoatmosphere flight, with surrounding air interaction
Warm boundary layer applies huge aerothermal load to the structure of aircraft, material, seriously affects structure safety and the longevity of aircraft
Life.In order to which Effective selection, assessment and identification aircraft heat insulation material and the anti-thermal characteristics of structure, arc tunnel and electro-arc heater are normal
It as important Aerodynamic Heating and thermal protection ground simulation test platform, is required according to orbital simulation, generally requires simulation heat flow
The Aerodynamic Heating environment of state variation；In addition, during the test of hypersonic aircraft test flight, due to being related to reentry trajectory
The factors such as parameter real-time change, aircraft boundary layer transition and attitude of flight vehicle variation influence, and also result in calorimetric surface of position
Face the pneumatic heating process of dynamic, it is therefore desirable to develop a kind of heat flow transducer for testing dynamic heat flux.Currently, the anti-heat test in ground
Middle dynamic heat flux is counted frequently with water cooling Gordon, and test flight environment is then tentatively added using based on micro electronic mechanical system (MEMS)
The thermoelectric pile thermal resistance laminar heat flow transducer of work.These dynamic heat flux sensor structures are complicated, and processing cost is high, affect extensively
Using.The present invention is directed to above situation, proposes a kind of new structural dynamic heat flux sensor.
Summary of the invention
It is excellent it is an object of the invention to solve at least the above problems and/or defect, and provide at least to will be described later
Point.
In order to realize these purposes and other advantages according to the present invention, a kind of Dynamic Thermal for collecting thermoelectrical potential effect is provided
Flow sensor, comprising:
T-type package casing body is internally provided with and accommodates cavity I, sets on the outer wall of the T-type package casing body small end
It is equipped with screw thread I；
Phlogopite heat insulation loop is fixedly connected on T-type package casing body compared with big end by High temperature epoxy resins binder
It accommodates in cavity I, the phlogopite heat insulation loop is hollow circular phlogopite heat insulation loop, and the side of phlogopite heat insulation loop bottom surface
Through-hole is offered on edge；
T-type tail portion is heat sink body is internally provided with and accommodates cavity II, and the relatively big end of the T-type package casing body, which is located at, to be held
It receives in cavity II, and the phlogopite heat insulation loop is mutually not in contact with each other with the heat sink body in T-type tail portion, the T-type tail portion is heat sink body and T-type
Package casing body is detachably connected, and the heat sink body in T-type tail portion is compared with being provided with threaded hole II, the screw thread on the side wall of big end
The screw to match with threaded hole II is provided in the II of hole；
Nichrome thermal conductor, setting are accommodating in cavity I, and the center of the nichrome thermal conductor is provided with appearance
It receives through-hole, is arranged fluted on the side wall of nichrome thermal conductor bottom, nichrome thermal conductor bottom is fixed to be connected
It connects in phlogopite heat insulation loop, the end on nichrome thermal conductor top and the end face of T-type package casing body small end are neat
It is flat；
K-type thermocouple wire, one end passes through groove and is fixedly welded in nichrome thermal conductor surface, and the K-type
The part of thermocouple wire in the grooves is fixed in groove by High temperature epoxy resins binder, and the other end passes through T-type tail portion
The receiving cavity II of heat sink body small end, positioned at the outside of the heat sink body in T-type tail portion；
Single hole alundum tube is fixed on the receiving opening at nichrome thermal conductor center by High temperature epoxy resins binder
It is interior, and the outlet port of the threshold value receiving opening on single hole alundum tube top has certain spacing；
Dew type single nickel silicon alloy silk is held, part of it is arranged in single hole alundum tube and by smearing in alundum tube rear end
High temperature epoxy resins binder is fixed, the end and nichrome thermal conductor top of end dew type single nickel silicon alloy silk one end
End face, the other end pass through the receiving cavity II across the heat sink body small end in T-type tail portion, positioned at the outer of the heat sink body in T-type tail portion
Portion；
Fine silver plunger, by casting or melting welding welding in the end on single hole alundum tube top and the outlet position of receiving opening
It sets in the spacing to be formed, and the fine silver plunger is connected with the head of end dew type single nickel silicon alloy silk.
Preferably, the heat sink body in T-type tail portion and T-type package casing body detachable connection method are as follows: the T-type tail portion
Heat sink body is compared with the inner wall of big end and the T-type package casing body compared with being provided with the screw thread III being mutually matched on the outer wall of big end.
Preferably, the heat sink body in T-type tail portion is compared with the inner wall of big end and the T-type package casing body compared on big end outer wall
The screw thread III being mutually matched be standard M12 screw thread.
Preferably, the screw thread I on the T-type package casing body small end outer wall is standard M6 external screw thread, the T-type tail
Screw and threaded hole II on portion the is heat sink larger end side wall of body are standard M2 fastening screw and tapped through hole.
Preferably, the nichrome thermal conductor be the diameter of top and bottom end be respectively Φ 3mm and Φ 6mm, it is total
The tubular structure of long 15mm, the internal diameter of the receiving opening of nichrome thermal conductor center are Φ 1mm.
Preferably, the outer diameter of the single hole alundum tube is Φ 1mm, and internal diameter is Φ 0.5mm；Single hole alundum tube top
End at a distance from nichrome thermal conductor receiving opening outlet port be 0.3mm.
Preferably, the outer diameter of the end dew type single nickel silicon alloy silk is Φ 0.3mm.
Preferably, the K-type thermocouple wire is welded at position of the nichrome thermal conductor apart from top end face 11mm.
The present invention is include at least the following beneficial effects:
The present invention is suitable for arc tunnel, Arc-jet test environment and flight test environmental model surface Dynamic Thermal
Current test, the processing of this heat flow transducer are controlled with simple, at low cost, the easy to accomplish quality of assembly technology, are improved sensor heat and are rung
The advantages of answering speed, testing precision and extending the validity test time.And heat flow transducer thermal conductor directly select it is resistant to high temperature
Nichrome forms thermoelectricity in sensor front end face by the end dew type single nickel silicon alloy silk that corundum casing electrical isolation separates and couples
Point, therefore the heat flow transducer ontology is both that thermal conductor also has K-type hot thermocouple electrical effect effect；In addition, after thermal conductor
A pair of of K-type thermocouple wire is welded at end, also has the function of as the approximate boundary temperature test criteria of linear dynamic thermal conductor.
Further advantage, target and feature of the invention will be partially reflected by the following instructions, and part will also be by this
The research and practice of invention and be understood by the person skilled in the art.
Detailed description of the invention:
Fig. 1 is apparatus structure sectional view provided by the invention；
Fig. 2 is nichrome thermal conductor sectional view provided by the invention；
Fig. 3 is nichrome thermal conductor top view provided by the invention；
Fig. 4 is dynamic heat flux sensor response time testing result provided by the invention.
Specific embodiment:
Present invention will be described in further detail below with reference to the accompanying drawings, to enable those skilled in the art referring to specification text
Word can be implemented accordingly.
It should be appreciated that such as " having ", "comprising" and " comprising " term used herein do not allot one or more
The presence or addition of a other elements or combinations thereof.
A kind of dynamic heat flux sensor of the collection thermoelectrical potential effect shown picture 1-4, comprising:
T-type package casing body 1 is internally provided with and accommodates cavity I11, the outer wall of 1 small end of T-type package casing body
On be provided with screw thread I13；
Phlogopite heat insulation loop 3 is fixedly connected on T-type package casing body compared with big end by High temperature epoxy resins binder 4
Receiving cavity I11 in, the phlogopite heat insulation loop 3 is hollow circular phlogopite heat insulation loop, and 3 bottom of phlogopite heat insulation loop
Through-hole 31 is offered on the edge in face；
T-type tail portion is heat sink body 5 is internally provided with and accommodates cavity II 51, the relatively big end position of the T-type package casing body 1
In accommodating in cavity II 51, and the phlogopite heat insulation loop 3 is not in contact with each other with heat sink 5 phase of body in T-type tail portion, and the tail portion is heat sink
Body 5 is detachably connected with T-type package casing body 1, and the heat sink body 5 in the T-type tail portion is compared with being provided with threaded hole on the side wall of big end
The screw 12 to match with screw thread II 14 is provided in II 14, the threaded hole II 14；
Nichrome thermal conductor 21, setting are accommodating in cavity I11, the center of the nichrome thermal conductor 21
It is provided with receiving opening 22, is arranged fluted 222 on the side wall of 21 bottom 221 of nichrome thermal conductor, the nichrome
Thermal conductor bottom 221 is fixedly connected in phlogopite heat insulation loop 3, and the end on 21 top of nichrome thermal conductor and T-type seal
The end face of 1 small end of casing body；
K-type thermocouple wire 26, one end pass through groove 222 and are fixedly welded on 211 in 21 surface of nichrome thermal conductor,
And the K-type thermocouple wire 26 is located at the part in groove 222 and is fixed in groove 222 by High temperature epoxy resins binder 4,
The other end passes through the receiving cavity II 51 of heat sink 5 small end of body in T-type tail portion, positioned at the outside of the heat sink body 5 in T-type tail portion；
Single hole alundum tube 23 is fixed on the appearance at 21 center of nichrome thermal conductor by High temperature epoxy resins binder 4
Receive in through-hole 22, and the outlet port of the threshold value receiving opening 22 on 23 top of single hole alundum tube have it is certain between
Away from；
Dew type single nickel silicon alloy silk 24 is held, part of it is arranged in single hole alundum tube 23 and by single hole alundum tube
23 rear ends are smeared High temperature epoxy resins binder 4 and are fixed, the end of described 24 one end of end dew type single nickel silicon alloy silk and nickel chromium triangle
21 top end face of alloy thermal conductor, the other end pass through the receiving cavity II 51 of heat sink 5 small end of body in T-type tail portion, are located at T
The outside of type tail portion is heat sink body 5；
Fine silver plunger 25, end and receiving opening 22 by casting or melting welding welding on 23 top of single hole alundum tube
In the spacing that outlet port is formed, and the fine silver plunger 25 is connected with the head of end dew type single nickel silicon alloy silk 24.
In this technical solution, be provided on the outer wall by 1 small end of T-type package casing body screw thread I13 with
Model to be measured is fixedly linked, then measures, and can guarantee that contact is close；By the way of casting or melting welding, by fine silver welding
On 24 connector of dew type single nickel silicon alloy silk of end, forms fine silver plunger 25 and be fused into the nichrome thermal conductor 21 of surrounding
One, to guarantee that heat carrier and thermocouple have good connection, it is ensured that nichrome thermal conductor 21 and single nickel silicon alloy
Heat transfer is good between silk 24, and thermal contact resistance can be effectively reduced, and improves thermal response speed and reduces difficulty of processing；It can be formed simultaneously
Surface thermocouple contact realizes heat flow transducer front surface temperature test.
In the above-mentioned technical solutions, the heat sink body 5 in the T-type tail portion and 1 detachable connection method of T-type package casing body are as follows:
The heat sink body 5 in T-type tail portion is compared with the inner wall of big end and the T-type package casing body 1 compared with being provided with mutual on the outer wall of big end
The screw thread III 52 matched.In this way, convenient for assembly and disassembly, reduces the difficulty of production.
In the above-mentioned technical solutions, the heat sink body 5 in the T-type tail portion compared with the inner wall of big end and the T-type package casing body 1 compared with
The screw thread III 52 being mutually matched on big end outer wall is standard M12 screw thread.
In the above-mentioned technical solutions, the screw thread I13 on the 1 small end outer wall of T-type package casing body is the outer spiral shell of standard M6
Line, screw 12 and threaded hole II14 on the larger end side wall of the heat sink body 5 in T-type tail portion are that standard M2 fastening screw and screw thread are logical
Hole.In this way, the standard thread on package casing, for sensor to be threadedly secured to model to be measured, even
It connects closely, guarantees that contact is good between the two, and convenient disassembly, can be improved efficiency；Screw thread is set on the heat sink body in T-type tail portion
Package casing can be held out against by screw, package casing is avoided to rotate by through-hole and fastening screw.
In the above-mentioned technical solutions, the nichrome thermal conductor 21 is respectively Φ 3mm for the diameter of top and bottom end
With the tubular structure of Φ 6mm, overall length 15mm, the internal diameter of the receiving opening of 21 center of nichrome thermal conductor
For Φ 1mm.
In the above-mentioned technical solutions, the outer diameter of the single hole alundum tube 23 is Φ 1mm, and internal diameter is Φ 0.5mm；The single hole
The end on 23 top of alundum tube is 0.3mm at a distance from 21 receiving opening of nichrome thermal conductor, 22 outlet port.Using this
Mode is reserved a certain distance in nichrome thermal conductor receiving opening exit position, for the installation of fine silver plunger, is guaranteed
Fine silver plunger contacts closely with end dew type single nickel silicon alloy silk.
In the above-mentioned technical solutions, the outer diameter of the end dew type single nickel silicon alloy silk 24 is Φ 0.3mm.
In the above-mentioned technical solutions, the K-type thermocouple wire 26 is welded on nichrome thermal conductor 21 apart from top end face
At the position of 11mm.In this way, K-type thermocouple wire is welded in nichrome heat transfer body wall, use can be increased
Service life keeps the contact of solder joint closer, solder joint is avoided to fall off.
Although the embodiments of the present invention have been disclosed as above, but its is not only in the description and the implementation listed
With it can be fully applied to various fields suitable for the present invention, for those skilled in the art, can be easily
Realize other modification, therefore without departing from the general concept defined in the claims and the equivalent scope, the present invention is simultaneously unlimited
In specific details and legend shown and described herein.
Claims (8)
1. a kind of dynamic heat flux sensor for collecting thermoelectrical potential effect characterized by comprising
T-type package casing body is internally provided with and accommodates cavity I, is provided on the outer wall of the T-type package casing body small end
Screw thread I；
Phlogopite heat insulation loop is fixedly connected on receiving of the T-type package casing body compared with big end by High temperature epoxy resins binder
In cavity I, the phlogopite heat insulation loop is hollow circular phlogopite heat insulation loop, and on the edge of phlogopite heat insulation loop bottom surface
Offer through-hole；
T-type tail portion is heat sink body is internally provided with and accommodates cavity II, the relatively big end of the T-type package casing body be located at accommodate it is logical
In chamber II, and the phlogopite heat insulation loop is mutually not in contact with each other with the heat sink body in T-type tail portion, and the heat sink body in T-type tail portion and T-type encapsulate
Outer housing is detachably connected, and the heat sink body in T-type tail portion is compared with being provided with threaded hole II, the threaded hole II on the side wall of big end
Inside it is provided with the screw to match with threaded hole II；
Nichrome thermal conductor, setting are accommodating in cavity I, and it is logical that the center of the nichrome thermal conductor is provided with receiving
Hole, is arranged on the side wall of nichrome thermal conductor bottom fluted, and nichrome thermal conductor bottom is fixedly connected on
In phlogopite heat insulation loop, the end on nichrome thermal conductor top and the end face of T-type package casing body small end；
K-type thermocouple wire, one end passes through groove and is fixedly welded in nichrome thermal conductor surface, and the K-type thermoelectricity
The part of thermo wires in the grooves is fixed in groove by High temperature epoxy resins binder, and it is heat sink that the other end passes through T-type tail portion
The receiving cavity II of body small end, positioned at the outside of the heat sink body in T-type tail portion；
Single hole alundum tube is fixed in the receiving opening at nichrome thermal conductor center by High temperature epoxy resins binder,
And the outlet port of the threshold value receiving opening on single hole alundum tube top has certain spacing；
Dew type single nickel silicon alloy silk is held, part of it is arranged in single hole alundum tube and by smearing high temperature in alundum tube rear end
Epoxy adhesive is fixed, the end and nichrome thermal conductor top end face of end dew type single nickel silicon alloy silk one end
It flushes, the other end passes through the receiving cavity II across the heat sink body small end in T-type tail portion, positioned at the outside of the heat sink body in T-type tail portion；
Fine silver plunger, by casting or melting welding welding in the end on single hole alundum tube top and the outlet port shape of receiving opening
At spacing in, and the fine silver plunger with end dew type single nickel silicon alloy silk head be connected.
2. the dynamic heat flux sensor of collection thermoelectrical potential effect as described in claim 1, which is characterized in that the T-type tail portion heat
Heavy body and T-type package casing body detachable connection method are as follows: the heat sink body in T-type tail portion is sealed compared with the inner wall of big end and the T-type
Casing body is compared with being provided with the screw thread III being mutually matched on the outer wall of big end.
3. the dynamic heat flux sensor of collection thermoelectrical potential effect as claimed in claim 2, which is characterized in that the T-type tail portion heat
Heavy body is standard M12 spiral shell compared with the screw thread III being mutually matched on big end outer wall compared with the inner wall of big end and the T-type package casing body
Line.
4. the dynamic heat flux sensor of collection thermoelectrical potential effect as described in claim 1, which is characterized in that the T-type encapsulation is outer
Screw thread I on shell small end outer wall is standard M6 external screw thread, screw and spiral shell on the larger end side wall of the heat sink body in T-type tail portion
Pit II is standard M2 fastening screw and tapped through hole.
5. the dynamic heat flux sensor of collection thermoelectrical potential effect as described in claim 1, which is characterized in that the nichrome
Thermal conductor is that the diameter of top and bottom end is respectively the tubular structure of Φ 3mm and Φ 6mm, overall length 15mm, the nickel chromium triangle
The internal diameter of the receiving opening of alloy thermal conductor center is Φ 1mm.
6. the dynamic heat flux sensor of collection thermoelectrical potential effect as described in claim 1, which is characterized in that the single hole alundum tube
Outer diameter be Φ 1mm, internal diameter be Φ 0.5mm；The end on single hole alundum tube top and nichrome thermal conductor receiving opening
The distance of outlet port is 0.3mm.
7. the dynamic heat flux sensor of collection thermoelectrical potential effect as described in claim 1, which is characterized in that the end dew type single
The outer diameter of nickel silicon alloy silk is Φ 0.3mm.
8. the dynamic heat flux sensor of collection thermoelectrical potential effect as described in claim 1, which is characterized in that the K-type thermocouple
Silk is welded at position of the nichrome thermal conductor apart from top end face 11mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910789938.9A CN110388991B (en) | 2019-08-26 | 2019-08-26 | Dynamic heat flow sensor integrating thermoelectric effect |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910789938.9A CN110388991B (en) | 2019-08-26 | 2019-08-26 | Dynamic heat flow sensor integrating thermoelectric effect |
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| CN110388991A true CN110388991A (en) | 2019-10-29 |
| CN110388991B CN110388991B (en) | 2024-07-12 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111707706A (en) * | 2020-06-04 | 2020-09-25 | 西安交通大学 | Heat flux density measuring device with thermal radiation shield and method |
| CN111947882A (en) * | 2020-09-14 | 2020-11-17 | 中国空气动力研究与发展中心超高速空气动力研究所 | Transient heat flow sensor and testing method thereof |
| CN112816103A (en) * | 2021-02-05 | 2021-05-18 | 中国空气动力研究与发展中心超高速空气动力研究所 | Hot wall heat flow sensor and testing method thereof |
| CN113551810A (en) * | 2021-07-21 | 2021-10-26 | 中国空气动力研究与发展中心超高速空气动力研究所 | Water-cooling dynamic heat flow sensor |
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| CN111707706A (en) * | 2020-06-04 | 2020-09-25 | 西安交通大学 | Heat flux density measuring device with thermal radiation shield and method |
| CN111707706B (en) * | 2020-06-04 | 2021-11-30 | 西安交通大学 | Heat flux density measuring device with thermal radiation shield and method |
| CN111947882A (en) * | 2020-09-14 | 2020-11-17 | 中国空气动力研究与发展中心超高速空气动力研究所 | Transient heat flow sensor and testing method thereof |
| CN111947882B (en) * | 2020-09-14 | 2024-03-29 | 中国空气动力研究与发展中心超高速空气动力研究所 | Transient heat flow sensor and test method thereof |
| CN112816103A (en) * | 2021-02-05 | 2021-05-18 | 中国空气动力研究与发展中心超高速空气动力研究所 | Hot wall heat flow sensor and testing method thereof |
| CN112816103B (en) * | 2021-02-05 | 2024-04-26 | 中国空气动力研究与发展中心超高速空气动力研究所 | Hot wall heat flow sensor and testing method thereof |
| CN113551810A (en) * | 2021-07-21 | 2021-10-26 | 中国空气动力研究与发展中心超高速空气动力研究所 | Water-cooling dynamic heat flow sensor |
| CN113551810B (en) * | 2021-07-21 | 2023-08-18 | 中国空气动力研究与发展中心超高速空气动力研究所 | Water-cooling dynamic heat flow sensor |
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