CN110387531A - Be vapor-deposited cooling device - Google Patents
Be vapor-deposited cooling device Download PDFInfo
- Publication number
- CN110387531A CN110387531A CN201810350546.8A CN201810350546A CN110387531A CN 110387531 A CN110387531 A CN 110387531A CN 201810350546 A CN201810350546 A CN 201810350546A CN 110387531 A CN110387531 A CN 110387531A
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- China
- Prior art keywords
- fluid injection
- carrier
- coolant liquid
- injection component
- vacuum deposition
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- 238000001816 cooling Methods 0.000 title claims abstract description 35
- 239000007788 liquid Substances 0.000 claims abstract description 85
- 238000002347 injection Methods 0.000 claims abstract description 84
- 239000007924 injection Substances 0.000 claims abstract description 84
- 239000012530 fluid Substances 0.000 claims abstract description 76
- 239000002826 coolant Substances 0.000 claims abstract description 74
- 238000001771 vacuum deposition Methods 0.000 claims abstract description 56
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 238000007740 vapor deposition Methods 0.000 claims abstract description 26
- 238000000151 deposition Methods 0.000 claims abstract description 19
- 230000008021 deposition Effects 0.000 claims abstract description 16
- 239000012808 vapor phase Substances 0.000 claims abstract description 8
- 230000007246 mechanism Effects 0.000 claims abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 45
- 230000003028 elevating effect Effects 0.000 claims description 24
- 238000007789 sealing Methods 0.000 claims description 20
- 239000012809 cooling fluid Substances 0.000 claims description 7
- 238000003780 insertion Methods 0.000 abstract description 6
- 230000037431 insertion Effects 0.000 abstract description 6
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 239000012071 phase Substances 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 13
- 230000008569 process Effects 0.000 description 8
- 238000005240 physical vapour deposition Methods 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 239000013013 elastic material Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000000284 resting effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The present invention relates to gas phase deposition technology fields, disclose a kind of vapor deposition cooling device, comprising: coolant liquid injecting mechanism and lifting device；Coolant liquid injecting mechanism includes: fluid injection component and inlet tube；Fluid injection component is arranged in vacuum deposition area, and when carrier residence is in vacuum deposition area, fluid injection component is moved up and down under the driving of lifting device in the coolant liquid receiving area of insertion carrier inside, injects coolant liquid；The inlet tube protruded into the vacuum deposition area from outside and with the fluid injection members, in order to inject coolant liquid into the coolant liquid receiving area from outside by the fluid injection component；Inlet tube protruded into vacuum deposition area from outside and with fluid injection members, in order to inject coolant liquid into coolant liquid receiving area from outside by fluid injection component.Vapor deposition cooling device of the invention can be realized the cooling heat dissipation of substrate in online vapor phase growing apparatus, and structure is simple and convenient to operate, and radiating efficiency is high.
Description
Technical field
The present invention relates to gas phase deposition technology fields, more particularly to a kind of vapor deposition cooling device.
Background technique
Physical vapour deposition (PVD) (PVD), which refers to, realizes that substance shifts using physical process, and atom or molecule are transferred to by source
Process on substrate surface, effect can make certain energy (intensity height, wearability, thermal diffusivity, rotproofness etc.) that have specific characteristics
Particle is sprayed on the lower parent of performance, so that parent has better performance, is commonly applied to semiconductor and field of solar energy
In.
Physical vapour deposition (PVD) frequently with method are as follows: be evaporated in vacuo, sputtering and ion plating etc..Above several vapor deposition sides
Method is to carry out film deposition, including two kinds of depositional modes to substrate in vacuum environment using sputter cathode or evaporation source: batch
Secondary formula deposition (Batch PVD) and online deposition (in line PVD).Batch depositing operation be loaded with the support plate of substrate into
The film for entering the opposite progress certain time for resting on sputter cathode or evaporation source after vacuum cavity deposits, when film deposition is completed
Afterwards, support plate leaves cavity, and entire technical process is intermittent；And online depositing operation is that multiple support plates for being loaded with substrate connect
Into processing chamber, plated film on one side while advance, entire technical process is continuous.
In different PVD process, some need heating, some then needs temperature as low as possible, sputter cathode and vapor deposition
Source can generate a large amount of heat, for requiring the technique of low temperature, then need to support plate and substrate cooling, however, online deposition
In technique, film deposition process carries out under vacuum conditions, and support plate and substrate continuously move, it is difficult to right by heat
The mode of stream or heat transfer radiates, and currently used is that the mode of heat radiation radiates, but radiating efficiency is lower.
Summary of the invention
(1) technical problems to be solved
The purpose of the present invention is to solve the prior arts for continuous under vacuum conditions in online depositing operation
The substrate of movement is difficult to the problem to be radiated and radiating efficiency is low.
(2) technical solution
In order to solve the above technical problem, the present invention provides a kind of vapor deposition cooling devices, are applied to online gas phase
On precipitation equipment, the online vapor phase growing apparatus includes: vacuum deposition area and carrier；The carrier can carry substrate motion
Film deposition is carried out in the vacuum deposition area, comprising: coolant liquid injecting mechanism and lifting device；The coolant liquid implanter
Structure includes: fluid injection component and inlet tube；
The fluid injection component is arranged in the vacuum deposition area, when the carrier residence is in the vacuum deposition area
When, the fluid injection component moves up and down the coolant liquid receiving area for being inserted into the carrier inside under the driving of the lifting device
It is interior, inject coolant liquid；The inlet tube protruded into the vacuum deposition area from outside and with the fluid injection members, in order to
Coolant liquid is injected into the coolant liquid receiving area from outside by the fluid injection component.
Further, further includes: water outlet part and outlet tube；
The side of the carrier is arranged in the fluid injection component, and the other side of the carrier is arranged in the water outlet part；
The water outlet part is arranged in the vacuum deposition area, when the carrier residence is in the vacuum deposition area
When, the water outlet part moves up and down the coolant liquid receiving area for being inserted into the carrier inside under the driving of the lifting device
It is interior, so that coolant liquid flows out the carrier；
The outlet tube is protruded into the vacuum deposition area from outside and is connected to the water outlet part, in order to will be described
Coolant liquid in coolant liquid receiving area is flowed out by water outlet part.
Further, the fluid injection component and/or water outlet part include: plug；The carrier is equipped with and the coolant liquid
The liquid-inlet and/or liquid outlet of receiving area connection, the carrier is located at the liquid-inlet and/or liquid outlet is equipped with
Casing；When the carrier residence is in the vacuum deposition area, the plug of the fluid injection component and/or water outlet part is described
Under the driving of lifting device with the mutual fitting of casing of the fluid injection component and/or water outlet part.
Further, the liquid-inlet of the carrier and/or liquid outlet are blocked by rubber film.
Further, further includes: cooling fluid supply device, feeder and three-way valve；The inlet tube, coolant liquid supply
It answers device to pass through three-way valve respectively with feeder to be connected to.
Further, the inlet tube and/or outlet tube are hose.
Further, the lifting device includes: elevating lever and sealing shroud；
It protrudes into the vacuum deposition area and can move up and down at the top of the elevating lever；
The sealing shroud, which is set on the elevating lever, is connected sealing with the vacuum deposition area.
Further, the lifting device further include: the top of the elevating lever is arranged in lifter plate, the lifter plate,
The fluid injection component and/or water outlet part are fixed on the lifter plate.
Further, the sealing shroud is elastic seal cartridge.
Further, the sealing shroud is bellows, and the first end of the bellows blocks, the second of the bellows
End is connected to the vacuum deposition area；The bottom of the elevating lever is connect with the first end of the bellows, with the bellows
It moves up and down；The fluid injection component and/or water outlet part are fixed on the lifter plate.
(3) beneficial effect
A kind of vapor deposition cooling device provided by the invention, it is cold by being arranged in the carrier for delivering substrate to be deposited
But liquid receiving area, realizes the cooling heat dissipation of substrate, while the inlet tube by being connected to outside is to being in vacuum deposition area
Fluid injection component supplies coolant liquid, and so that fluid injection component is docked insertion with the coolant liquid receiving area of carrier under the driving of lifting device
Or detach, coolant liquid is injected to the carrier of continuous moving under vacuum conditions to realize, is realized in online vapor phase growing apparatus
The cooling heat dissipation of substrate, cooling device structure of the invention are simple and convenient to operate, and radiating efficiency is high.
Detailed description of the invention
Fig. 1 is a kind of overall schematic of vapor deposition cooling device of the invention；
Fig. 2 is the attachment structure schematic diagram of inlet tube and cooling fluid supply device and feeder in Fig. 1；
Fig. 3 is carrier structure schematic diagram in Fig. 1.
Specific embodiment
With reference to the accompanying drawings and examples, specific embodiments of the present invention will be described in further detail.Following instance
For illustrating the present invention, but it is not intended to limit the scope of the invention.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected；It can be directly connected, can also can be indirectly connected through an intermediary
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
Concrete meaning in invention.
Fig. 1 gives a kind of structural schematic diagram of vapor deposition cooling device of the invention.It is provided in an embodiment of the present invention
A kind of vapor deposition cooling device can be applied and need to be particularly suitable for the device to radiate in vacuum environment any
In the online vapor phase growing apparatus carried out cooling heat to the substrate being in vacuum reaction room.The online vapor deposition dress
It sets and generally includes: vacuum deposition area 101 and carrier 102；The carrier 102 can carry substrate 103 and move to the vacuum deposition
Film deposition is carried out in area 101.The reaction chamber of online vapor phase growing apparatus forms the environment of high vacuum by vacuum pump, very
It is equipped with sedimentary origin (sputter cathode or evaporation source) in empty crystallizing field 101, carrier 102 is deposited in reaction chamber indoor moving to film
Substrate 103 be placed on the surface of carrier 102, carrier 102 carries substrate 103 and moves forward in reaction chamber, true when reaching
Stop when empty crystallizing field 101, the sedimentary origin for being now placed in 102 top of carrier carries out film deposition to substrate 103.Substrate 103 exists
A large amount of heat can be generated during deposition, need to carry out radiating treatment to it.The vapor deposition cooling device of the present embodiment can
Radiating treatment is carried out to the substrate 103 of place under vacuum conditions.
As shown in Figure 1, the vapor deposition cooling device includes: coolant liquid injecting mechanism 1 and lifting device 13, the cooling
Liquid injecting mechanism 1 includes: fluid injection component 11 and inlet tube 12.
The fluid injection component 11 is arranged in the vacuum deposition area 101, sinks when the carrier 102 rests on the vacuum
When in product area 101, the fluid injection component 11 is moved up and down under the driving of the lifting device 13 inside the insertion carrier 102
Coolant liquid receiving area 102a in, inject coolant liquid；The inlet tube 12 protruded into the vacuum deposition area 101 from outside and with
The fluid injection component 11 is connected to, in order to inject from outside by the fluid injection component 11 into the coolant liquid receiving area 102a
Coolant liquid.
Wherein, as shown in figure 3, coolant liquid receiving area 102a is equipped with inside carrier 102, for injecting coolant liquid, coolant liquid
The volume size of receiving area 102a can be arranged with the shape of carrier 102, for example carrier 102 can be plate, can carry multiple
Substrate 103, correspondingly, coolant liquid receiving area 102a are rectangular cavity, the substrate that can be carried on coolant carrier 102 simultaneously
103, the embodiment of the present invention is not construed as limiting the shape of coolant liquid receiving area 102a and carrier 102.The length of carrier 102 can with to
Film deposition substrate 103 quantity and set, the present invention implementation this is also not construed as limiting.
Fluid injection component 11 is equipped with inlet, can be inserted into or detaches 102 inside of carrier and be connected to coolant liquid receiving area 102a, when
When being inserted into the coolant liquid receiving area 102a inside carrier 102, coolant liquid is injected into it, is completed when 103 film of substrate deposits
Afterwards, stop injection coolant liquid, fluid injection component 11 detaches carrier 102, and carrier 102, which carries substrate 103, to be continued to be moved along under entrance
A process.Fluid injection component 11 is located in vacuum deposition area 101, may be provided at close to the top of 102 motion profile of carrier, lower section or
Side, the embodiment of the present invention are preferably provided at the lower section of 102 motion profile of carrier.Fluid injection component 11 can for waterway pipe connector or
Injection needle, present invention implementation are not construed as limiting this.
Since fluid injection component 11 is located under vacuum environment, when externally to being passed through coolant liquid in the fluid injection component 11, need
Guide wire is used as by setting inlet tube 12, the note in vacuum deposition area 101 with fluid injection component 11 is protruded into 12 one end of inlet tube
Entrance connection, the other end are in the outside in vacuum deposition area 101, for being connected to external cooling fluid supply device, externally to
Coolant liquid is passed through in fluid injection component 11, inlet tube 12 can be hose or the sufficiently long pipeline of length.
Lifting device 13 moves to vacuum for controlling moving up and down for fluid injection component 11, when carrier 102 carries substrate 103
When below the sedimentary origin of crystallizing field 101, lifting device 13 controls fluid injection component 11 and moves up, the inlet pair of fluid injection component 11
Coolant liquid receiving area 102a inside quasi- insertion carrier 102, coolant liquid is injected into it, after the completion of 103 film of substrate deposition,
Stop injection coolant liquid, lifting device 13 controls fluid injection component 11 and moves down, and fluid injection component 11 detaches carrier 102, carrier 102
Substrate 103 is carried to continue to be moved along into next process.Lifting device 13 can be lifting device commonly used in the art, need
Bright, in when moving up and down of fluid injection component 11 of control, the part-structure of lifting device 13 is located in vacuum deposition area 101,
Part-structure needs to be sealed processing between lifting device 13 and vacuum deposition area 101 outside vacuum deposition area 101,
The mode of the encapsulation process can be being arranged a nut cap made of elastic material, lid outside the elevating lever of lifting device 13
Cap connect sealing with vacuum deposition area 101 and realizes, but is not limited to the structure.
A kind of vapor deposition cooling device provided in an embodiment of the present invention, by the load for delivering substrate 103 to be deposited
Coolant liquid receiving area 102a is set in body 102, substrate 103 is carried out cooling heat, by the inlet tube 12 that is connected to outside to
The fluid injection component 11 being in vacuum deposition area 101 supplies coolant liquid, and makes fluid injection component 11 under the driving of lifting device 13
Insertion is docked with the coolant liquid receiving area 102a of carrier 102 or is detached, to realize under vacuum conditions to the load of continuous moving
Coolant liquid is injected in body 102, realizes the cooling heat dissipation of substrate 103 in online vapor phase growing apparatus, cooling device knot of the invention
Structure is simple and convenient to operate, and radiating efficiency is high.
In order to further increase radiating efficiency, it is contemplated that move to vacuum deposition area 101 when carrier 102 carries substrate 103
Sedimentary origin below carry out film deposition when, fluid injection component 11 to carrier 102 inside coolant liquid receiving area 102a injection recycle
The coolant liquid of replacement, content based on the above embodiment, as a kind of alternative embodiment, the cooling dress of the vapor deposition of the present embodiment
It sets, further includes: water outlet part 14 and outlet tube 15；The side of the carrier 102, the water outlet is arranged in the fluid injection component 11
The other side of the carrier 102 is arranged in component 14；The water outlet part 14 is arranged in the vacuum deposition area 101, works as institute
When stating carrier 102 and resting in the vacuum deposition area 101, the water outlet part 14 under the driving of the lifting device 13 on
In coolant liquid receiving area 102a inside the lower mobile insertion carrier 102, so that coolant liquid flows out inside the carrier 102
Coolant liquid receiving area 102a；The outlet tube 15 protruded into the vacuum deposition area 101 from outside and with the water outlet part 14
Connection, in order to flow out the coolant liquid in the coolant liquid receiving area 102a by water outlet part 14.
Specifically, water outlet part 14 and fluid injection component 11 may be designed to identical structure, equally, outlet tube 15 and inlet tube
12 may be designed to identical structure, and outlet tube 15 can be not construed as limiting this for hose or the sufficiently long pipeline of length, the present embodiment.
Water outlet part 14 and fluid injection component 11 are separately positioned on the two sides of carrier 102, specifically may be provided at the both side ends of carrier 102,
The coolant liquid injected in the 102a of coolant liquid receiving area can be discharged by water outlet part 14 and inlet tube 12, it can be achieved that in carrier 102
The coolant liquid in portion, which recycles, to be substituted, and the radiating efficiency of substrate 103 is further increased.
When fluid injection component 11 is inserted into carrier 102, it will usually consider first to open up water inlet on carrier 102, in order to anti-
The problem of only being leaked when to injection coolant liquid inside carrier 102 from water inlet, content based on the above embodiment, as
A kind of alternative embodiment, the fluid injection component 11 and/or water outlet part 14 include: plug；The carrier 102 be equipped with it is described cold
But the liquid-inlet and/or liquid outlet of liquid receiving area 102a connection, the carrier 102 are located at the liquid-inlet and/or liquid
Body exit is equipped with casing 311；When the carrier 102 rests in the vacuum deposition area 101, the fluid injection component 11
And/or the plug of water outlet part 14 under the driving of the lifting device 13 with the fluid injection component 11 and/or water outlet part 14
The mutual fitting of casing 311.
Wherein, the structure of fluid injection component 11 and water outlet part 14 may be the same or different, when fluid injection component 11 and outlet part
When the structure of part 14 is identical, for ease of illustration of the structure of the two, by taking fluid injection component 11 as an example, fluid injection component 11 includes plug, is inserted
Head can be injection head known to this field, and carrier 102 is equipped with liquid-inlet, be arranged casing 311 outside the liquid-inlet, plug with
Casing 311 is interference fitted grafting, and when carrier 102 rests in vacuum deposition area 101, the plug of fluid injection component 11 is filled in lifting
It sets under 13 driving with the mutual fitting of the casing of fluid injection component 11 311, realizes interference fit grafting, liquid-inlet is sealed, from
And it solves the problems, such as to leak when to injection coolant liquid inside carrier 102 from water inlet.
In addition, also rubber can be arranged at the liquid-inlet of carrier 102 before fluid injection component 11 is inserted into 102 inside of carrier
Glue blocking film is mentioned full of coolant liquid in forward bearer 102, blend rubber blocking film blocks before moving to vacuum deposition area 101；When
When carrier 102 is rested in vacuum deposition area 101, the plug of fluid injection component 11 is inserted by rubber blocking film, plays better seal
Effect.The structure of water outlet part 14 is identical as the structure of fluid injection component 11, and details are not described herein, but the present embodiment does not limit this
It is fixed.
In view of fluid injection component 11 and/or water outlet part 14 are inserted into from the bottom of carrier 102, then after detaching, in carrier 102
Coolant liquid can be flowed out from liquid-inlet and/or liquid outlet there is a situation where leaking, content based on the above embodiment, as
A kind of alternative embodiment, as shown in Fig. 2, the vapor deposition cooling device of the present embodiment, further includes: cooling fluid supply device 2 supplies
Device of air 3 and three-way valve 4；The inlet tube 12, cooling fluid supply device 2 and feeder 3 are connected by three-way valve 4 respectively
It is logical.After the completion of 103 film of substrate deposition, feeder 3 is passed through gas into inlet tube 12 by three-way valve 4, gas by
Fluid injection component 11 enters inside carrier 102, and the coolant liquid in the 102a of coolant liquid receiving area is blown out, then is controlled by lifting device 13
Fluid injection component 11 and/water outlet part 14 processed detach carrier 102, can prevent coolant liquid from leaking.
Content based on the above embodiment, as a kind of alternative embodiment, the lifting device 13 includes: elevating lever 131
With sealing shroud 132；
The top of the elevating lever 131 is protruded into the vacuum deposition area 101 and can be moved up and down；
The sealing shroud 132, which is set on the elevating lever 131, is connected sealing with the vacuum deposition area 101.
Specifically, the bottom of elevating lever 131 is located at outside vacuum deposition area 101, can by skilled person will appreciate that
Lifting drive driving moves up and down.Sealing shroud 132 is set on the elevating lever 131 to be connected with vacuum deposition area 101, close
Seal vacuum deposition area 101.Fluid injection component 11 and water outlet part 14 may be provided on elevating lever 131 and driven up and down by elevating lever 131
Mobile, sealing shroud 132 is for sealing the place that elevating lever 131 protrudes into vacuum deposition area 101.
It is inserted into carrier 102 in order to facilitate fluid injection component 11 and/or water outlet part 14, lifting device 13 further include: lifting
The top of the elevating lever 131 is arranged in plate 133, the lifter plate 133, and the fluid injection component 11 and/or water outlet part 14 are solid
It is scheduled on the lifter plate 133.The settable connection injection part 11 and inlet tube 12 inside the side of lifter plate 133
Feed pathway, equally, the feed liquor that the connection water outlet part 14 and outlet tube 15 are also set up inside the side of lifter plate 133 are logical
Road.
Sealing shroud 132 can be elastic seal cartridge, be made of elastic material, scalable, be fixed on elevating lever 131,
Elastic deformation occurs with the movement of elevating lever 131, elastic seal cartridge can play better seal effect.
Sealing shroud 132 can also use bellows, and the first end of the bellows blocks, the second end of the bellows with
The vacuum deposition area 101 is connected to；The bottom of the elevating lever 131 is connect with the first end of the bellows, with the ripple
Pipe moves up and down；The fluid injection component 11 and/or water outlet part 14 are fixed on the lifter plate 133.Bellows can both play
The effect of sealing, but can play the role of lifting driving, can manually push bellows drive elevating lever 131 on move down
Dynamic, structure is simpler, more convenient operation.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of vapor deposition cooling device is applied on online vapor phase growing apparatus, the online vapor phase growing apparatus
It include: vacuum deposition area and carrier；The carrier can carry progress film deposition in substrate motion to the vacuum deposition area,
It is characterized in that, comprising: coolant liquid injecting mechanism and lifting device；The coolant liquid injecting mechanism includes: fluid injection component and feed liquor
Pipe；
The fluid injection component is arranged in the vacuum deposition area, when the carrier residence is in the vacuum deposition area, institute
It states fluid injection component and is moved up and down under the driving of the lifting device and is inserted into the coolant liquid receiving area of the carrier inside, injected
Coolant liquid；The inlet tube protruded into the vacuum deposition area from outside and with the fluid injection members, in order to from outside
Coolant liquid is injected into the coolant liquid receiving area by the fluid injection component.
2. vapor deposition cooling device as described in claim 1, which is characterized in that further include: water outlet part and outlet tube；
The side of the carrier is arranged in the fluid injection component, and the other side of the carrier is arranged in the water outlet part；
The water outlet part is arranged in the vacuum deposition area, when the carrier residence is in the vacuum deposition area, institute
It states water outlet part and is moved up and down under the driving of the lifting device and is inserted into the coolant liquid receiving area of the carrier inside, so that
Coolant liquid flows out the carrier；
The outlet tube is protruded into the vacuum deposition area from outside and is connected to the water outlet part, in order to by the cooling
Coolant liquid in liquid receiving area is flowed out by water outlet part.
3. vapor deposition cooling device as claimed in claim 2, which is characterized in that the fluid injection component and/or water outlet part
It include: plug；The carrier is equipped with the liquid-inlet and/or liquid outlet being connected to the coolant liquid receiving area, the carrier
Casing is equipped with positioned at the liquid-inlet and/or liquid outlet；When the carrier residence is in the vacuum deposition area, institute
State the plug of fluid injection component and/or water outlet part under the driving of the lifting device with the fluid injection component and/or outlet part
The mutual fitting of the casing of part.
4. vapor deposition cooling device as claimed in claim 3, which is characterized in that the liquid-inlet and/or liquid of the carrier
Body outlet is blocked by rubber film.
5. vapor deposition cooling device as claimed in claim 2, which is characterized in that further include: cooling fluid supply device, gas supply
Device and three-way valve；The inlet tube, cooling fluid supply device pass through three-way valve with feeder respectively and are connected to.
6. vapor deposition cooling device as claimed in claim 2, which is characterized in that the inlet tube and/or outlet tube are soft
Pipe.
7. such as the described in any item vapor deposition cooling devices of claim 2-6, which is characterized in that the lifting device includes:
Elevating lever and sealing shroud；
It protrudes into the vacuum deposition area and can move up and down at the top of the elevating lever；
The sealing shroud, which is set on the elevating lever, is connected sealing with the vacuum deposition area.
8. vapor deposition cooling device as claimed in claim 7, which is characterized in that the lifting device further include: lifter plate,
The top of the elevating lever is arranged in the lifter plate, and the fluid injection component and/or water outlet part are fixed on the lifter plate.
9. vapor deposition cooling device as claimed in claim 7, which is characterized in that the sealing shroud is elastic seal cartridge.
10. vapor deposition cooling device as claimed in claim 8, which is characterized in that the sealing shroud is bellows, the wave
The first end of line pipe blocks, and the second end of the bellows is connected to the vacuum deposition area；The bottom of the elevating lever and institute
The first end connection for stating bellows, moves up and down with the bellows；The fluid injection component and/or water outlet part are fixed on described
On lifter plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810350546.8A CN110387531A (en) | 2018-04-18 | 2018-04-18 | Be vapor-deposited cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810350546.8A CN110387531A (en) | 2018-04-18 | 2018-04-18 | Be vapor-deposited cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110387531A true CN110387531A (en) | 2019-10-29 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009156147A (en) * | 2007-12-26 | 2009-07-16 | Toyo Eng Works Ltd | Device for replacing engine coolant |
| US20160068946A1 (en) * | 2013-05-27 | 2016-03-10 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Deposition device and deposition method using same |
| CN208234986U (en) * | 2018-04-18 | 2018-12-14 | 北京创昱科技有限公司 | Be vapor-deposited cooling device |
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- 2018-04-18 CN CN201810350546.8A patent/CN110387531A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009156147A (en) * | 2007-12-26 | 2009-07-16 | Toyo Eng Works Ltd | Device for replacing engine coolant |
| US20160068946A1 (en) * | 2013-05-27 | 2016-03-10 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Deposition device and deposition method using same |
| CN208234986U (en) * | 2018-04-18 | 2018-12-14 | 北京创昱科技有限公司 | Be vapor-deposited cooling device |
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