CN110387204A - The high hole rock Seepage Experiment sealant of nanoscale - Google Patents

The high hole rock Seepage Experiment sealant of nanoscale Download PDF

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Publication number
CN110387204A
CN110387204A CN201910621224.7A CN201910621224A CN110387204A CN 110387204 A CN110387204 A CN 110387204A CN 201910621224 A CN201910621224 A CN 201910621224A CN 110387204 A CN110387204 A CN 110387204A
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CN
China
Prior art keywords
mass parts
sealant
seepage experiment
high hole
nanoscale
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201910621224.7A
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Chinese (zh)
Inventor
关振良
姜鑫
谢丛姣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
China University of Geosciences
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China University of Geosciences
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Publication date
Application filed by China University of Geosciences filed Critical China University of Geosciences
Priority to CN201910621224.7A priority Critical patent/CN110387204A/en
Publication of CN110387204A publication Critical patent/CN110387204A/en
Withdrawn legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/04Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to rubbers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Sealing Material Composition (AREA)
  • Epoxy Resins (AREA)

Abstract

The present invention relates to the high hole rock Seepage Experiment sealants of nanoscale, the basic recipe forms (mass parts) are as follows: epoxy resin are as follows: 480-550 mass parts, diluent: 20-50 mass parts, toughener: 600-800 mass parts, curing agent: 70-160 mass parts, promotor: 8-20 mass parts, water absorbing agent: 5-20 mass parts, filler: 200-400 mass parts, thixotropic agent: 30-60 mass parts.The present invention is by glue made of the formula and preparation method, and in the Seepage Experiment for meter level rock sample, the sealant layer that one-piece casting is formed is better than conventional seals film in terms of intensity, tightness, durability degree;In addition, relative to conventional epoxies, while forming sealant layer, it is extremely low to the infiltration of sample well, hole, seam, meet the requirement of Seepage Experiment, meanwhile, the glue is after hardening, colloid can be seamless applying with common metal (such as iron, copper), common high molecular material, common rock-forming mineral (such as quartz, calcite), ensure that the leakproofness of system.

Description

The high hole rock Seepage Experiment sealant of nanoscale
Technical field
The present invention relates to the high hole rock Seepage Experiment technical field of meter level, the specially high hole rock Seepage Experiment of nanoscale is close Sealing.
Background technique
Seepage Experiment is that the important research means in Petroleum finance are usually prepared in traditional Seepage Experiment Centimetre to decimeter grade regular geometric shapes rock sample (as cylindrical), sealing film is pasted to rock sample side, at unencapsulated both ends Injection and outflow fluid.However, being studied in practice some, generally require to meter level, the rock of even more large scale is seeped Stream experiment, at this moment, Fluid pressure added by sample interior is higher, and experimental period is longer, and sealing area is bigger, conventional seals at this moment No matter film from the strength of materials, sealing joint degree, whole durability degree and scantling etc. all suffers from great challenge, In It is inconvenient in practical operation, test failure rate is high.
In this regard, the glue class using high strength after curing carries out one-piece casting to rock sample, formed in sample surfaces close Adhesive layer then can solve this problem, such as conventional epoxies class glue.In general, conventional epoxies class glue is pressing one After certainty ratio and process are prepared, the often process of experience " first thinning, then retrogradation ", still, for some holes, molten Rock that hole, crack are developed very much (as the carbonate rock after weathering or corrosion occurs), hole, hole, when being sewed with most It is high several centimeters reachable, if pouring above-mentioned traditional glue, it can be penetrated into after thinning in the hole, hole, seam of rock sample, change rock The porosity and permeability of script, leads to the failure of an experiment.
Summary of the invention
The purpose of the present invention is to provide the high hole rock Seepage Experiment sealants of nanoscale, to solve in above-mentioned background technique It is proposed in traditional Seepage Experiment, usually prepare centimetre to the regular geometric shapes rock sample of decimeter grade (as cylindrical), it is right Rock sample side patch sealing film injects and flows out fluid at unencapsulated both ends.However, being studied in practice some, often need Seepage Experiment is carried out to meter level, the even more rock of large scale, at this moment, Fluid pressure added by sample interior is higher, experiment week Phase is longer, and sealing area is bigger, conventional seals film at this moment, no matter from the strength of materials, sealing joint degree, whole durability degree and Scantling etc. all suffers from great challenge, is inconvenient in actual operation, the high problem of test failure rate.
To achieve the above object, the invention provides the following technical scheme: the high hole rock Seepage Experiment sealant of nanoscale, institute State basic recipe composition (mass parts) are as follows: epoxy resin are as follows: 480-550 mass parts, diluent: 20-50 mass parts, toughener: 600-800 mass parts, curing agent: 70-160 mass parts, promotor: 8-20 mass parts, water absorbing agent: 5-20 mass parts, filler: 200-400 mass parts, thixotropic agent: 30-60 mass parts.
Preferably, described to include the following steps;
A) epoxy resin, diluent and toughener are mixed,
B it) adds anabolica, promotor, water absorbing agent, thixotropic agent and packing agent to be mixed, get Dao Unit part heat cure Epoxy resin glue.
Preferably, the epoxy resin includes liquid epoxies and solid epoxy.
Preferably, the solid epoxy heating melting, and be stirred while heating melting, the stirring turns Speed is 15-25rpm, and the time being mixed is 10-30min.
Preferably, the step A) in, the revolving speed of the mixing is that mixing time described in l5-25rpm. is 10-30min。
Preferably, the step B) in, the mixing specifically:
It is 10-30min with the revolving speed of 15-25rpm point, then is started simultaneously after dispersing 10-30min with the revolving speed of 20-35rpm The high speed dispersion dish of revolving speed 25-35Hz disperse 10-30min.
Preferably, the toughener includes the liquid that there is the liquid rubber toughening agent of core Sales structure and cyclochloride resin to be modified Body nitrile rubber is fine, the liquid nitrile rubber of the liquid rubber toughening agent and epoxy resin modification with core Sales structure Mass ratio is (400-560): (150-240).
Preferably, the epoxy resin includes solid epoxy and liquid epoxies, the solid epoxy with The mass ratio of liquid epoxies is 1:(3-4).
Preferably, the T-- for the single-component thermosetting epoxy glue that the preparation method is prepared is removed from intensity >=8N, m.
Compared with prior art, beneficial effects of the present invention: by glue made of the formula and preparation method, it is being used for rice In the Seepage Experiment of grade rock sample, the sealant layer that one-piece casting is formed is better than in terms of intensity, tightness, durability degree Conventional seals film;In addition, relative to conventional epoxies, while forming sealant layer, to sample well, hole, seam infiltration Enter extremely low, meets the requirement of Seepage Experiment.Meanwhile the glue is after hardening, colloid can be with common metal (such as iron, copper Deng), common high molecular material (such as polypropylene, polyvinyl chloride), common rock-forming mineral (such as quartz, calcite) seamless paste It closes, ensure that the leakproofness of system.And glue is during cured, it, can be with molding die under 220-1000Pa pressure (common metal class, such as iron plate) is mutually separated in the case where not sticking together, while its frame strength can be supported and be maintained External form at that time.In addition, being colorless and transparent solid-state, facilitating look at the flowing of glue layer fluid after glue curing.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the high hole rock Seepage Experiment sealant of nanoscale of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other Embodiment shall fall within the protection scope of the present invention.
Referring to Fig. 1, the present invention provides technical solution: the high hole rock Seepage Experiment sealant of nanoscale, basic recipe group At (mass parts) are as follows: epoxy resin are as follows: 480-550 mass parts, diluent: 20-50 mass parts, toughener: 600-800 mass Part, curing agent: 70-160 mass parts, promotor: 8-20 mass parts, water absorbing agent: 5-20 mass parts, filler: 200-400 mass Part, thixotropic agent: 30-60 mass parts.
The working principle of the present embodiment: the high hole rock Seepage Experiment sealant of the nanoscale includes the following steps;
A) epoxy resin, diluent and toughener are mixed evenly,
B curing agent, promotor, water absorbing agent, thixotropic agent and filler) are added, is also stirred evenly, single-component thermosetting is obtained Epoxy glue.
C) before step A, solid epoxy is preferentially subjected to heating melting, is stirred simultaneously, speed of agitator is 8-12rpm, time 10-30min.
D it) obtains after melting epoxy resin, then coordinates to stir with diluent and toughener.The revolving speed of mixing is 15- 25rpm, time 10-30min.The fixed requirement of equipment when the present invention is to stirring.But in this experiment, in preferential use The planet dispensing machine of geology university, state (Wuhan) Resource Institute.
E) present invention disperses 10-20min with the revolving speed of 15-25rpm, then disperses 10-20min with the revolving speed of 30-35rpm Afterwards, starting high speed dispersion impeller carries out auxiliary mixing, and revolving speed 25-30Hz, is mixed equipment and high speed dispersion impeller carries out Material incorporation time is 10-20min.
F) in the present invention, single-component thermosetting epoxide-resin glue includes:
The epoxy resin of 480-550 mass parts;
The diluent of 20-50 mass parts;
The toughener of 600-800 mass parts, toughener include the liquid rubber toughening agent and ring chlorine with core Sales structure Resin modified liquid nitrile rubber is fine, the liquid fourth of liquid rubber toughening agent and epoxy resin modification with core Sales structure The mass ratio of fine rubber is (400-560): (150-240);
The curing agent of 70-160 mass parts;
The promotor of 8-20 mass parts;
The water absorbing agent of 5-20 mass parts;
The filler of 200-400 mass parts;
The thixotropic agent of 30-60 mass parts.
Although the present invention is described in detail referring to the foregoing embodiments, for those skilled in the art, It is still possible to modify the technical solutions described in the foregoing embodiments, or part of technical characteristic is carried out etc. With replacement, all within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in this Within the protection scope of invention.

Claims (9)

1. the high hole rock Seepage Experiment sealant of nanoscale, it is characterised in that: the basic recipe forms (mass parts) are as follows: epoxy Resin are as follows: 480-550 mass parts, diluent: 20-50 mass parts, toughener: 600-800 mass parts, curing agent: 70-160 matter Measure part, promotor: 8-20 mass parts, water absorbing agent: 5-20 mass parts, filler: 200-400 mass parts, thixotropic agent: 30-60 mass Part.
2. the preparation method of the high hole rock Seepage Experiment sealant of nanoscale according to claim 1, it is characterised in that: institute It states and includes the following steps;
A) epoxy resin, diluent and toughener are mixed,
B it) adds anabolica, promotor, water absorbing agent, thixotropic agent and packing agent to be mixed, get Dao Unit part heat cure epoxy Resin glue.
3. the high hole rock Seepage Experiment sealant of nanoscale according to claim 1, it is characterised in that: the epoxy resin Including liquid epoxies and solid epoxy.
4. the high hole rock Seepage Experiment sealant of nanoscale according to claim 3, it is characterised in that: the solids epoxy Resin heating melting, and being stirred while heating melting, the revolving speed of the stirring are 15-25rpm, and be mixed when Between be 10-30min.
5. the high hole rock Seepage Experiment sealant of nanoscale according to claim 2, it is characterised in that: the step A) In, the revolving speed of the mixing is that mixing time described in l5-25rpm. is 10-30min.
6. the high hole rock Seepage Experiment sealant of nanoscale according to claim 2, it is characterised in that: the step B) In, the mixing specifically:
It is 10-30min with the revolving speed of 15-25rpm point, then starts revolving speed simultaneously after dispersing 10-30min with the revolving speed of 20-35rpm The high speed dispersion dish of 25-35Hz disperse 10-30min.
7. the high hole rock Seepage Experiment sealant of nanoscale according to claim 1, it is characterised in that: the toughener packet It is fine to include the liquid nitrile rubber that liquid rubber toughening agent and cyclochloride resin with core Sales structure are modified, it is described that there is core Sales knot The mass ratio of the liquid nitrile rubber of the liquid rubber toughening agent and epoxy resin modification of structure is (400-560): (150- 240)。
8. the high hole rock Seepage Experiment sealant of nanoscale according to claim 1, it is characterised in that: the epoxy resin Including solid epoxy and liquid epoxies, the mass ratio of the solid epoxy and liquid epoxies is 1:(3- 4)。
9. the high hole rock Seepage Experiment sealant of nanoscale described in -8 according to claim 1, it is characterised in that: the preparation side The T-- for the single-component thermosetting epoxy glue that method is prepared is removed from intensity >=8N, m.
CN201910621224.7A 2019-07-10 2019-07-10 The high hole rock Seepage Experiment sealant of nanoscale Withdrawn CN110387204A (en)

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CN201910621224.7A CN110387204A (en) 2019-07-10 2019-07-10 The high hole rock Seepage Experiment sealant of nanoscale

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Application Number Priority Date Filing Date Title
CN201910621224.7A CN110387204A (en) 2019-07-10 2019-07-10 The high hole rock Seepage Experiment sealant of nanoscale

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102768174A (en) * 2011-05-06 2012-11-07 中国石油大学(北京) Experimental apparatus for determining permeability of raw coal and method thereof
CN204389353U (en) * 2015-01-30 2015-06-10 湖南科技大学 A kind of temperature-seepage coupling test test specimen packoff
CN108300390A (en) * 2017-01-13 2018-07-20 杭州之江新材料有限公司 A kind of single-component thermosetting epoxy glue and preparation method thereof
CN109651977A (en) * 2018-12-25 2019-04-19 杭州之江新材料有限公司 A kind of epoxy one-component structure glue and preparation method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102768174A (en) * 2011-05-06 2012-11-07 中国石油大学(北京) Experimental apparatus for determining permeability of raw coal and method thereof
CN204389353U (en) * 2015-01-30 2015-06-10 湖南科技大学 A kind of temperature-seepage coupling test test specimen packoff
CN108300390A (en) * 2017-01-13 2018-07-20 杭州之江新材料有限公司 A kind of single-component thermosetting epoxy glue and preparation method thereof
CN109651977A (en) * 2018-12-25 2019-04-19 杭州之江新材料有限公司 A kind of epoxy one-component structure glue and preparation method thereof

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Application publication date: 20191029