CN110350293A - On-chip antenna and radar system - Google Patents
On-chip antenna and radar system Download PDFInfo
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- CN110350293A CN110350293A CN201910561458.7A CN201910561458A CN110350293A CN 110350293 A CN110350293 A CN 110350293A CN 201910561458 A CN201910561458 A CN 201910561458A CN 110350293 A CN110350293 A CN 110350293A
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- 229910052751 metal Inorganic materials 0.000 claims description 198
- 239000002184 metal Substances 0.000 claims description 194
- 238000012545 processing Methods 0.000 claims description 32
- 230000005855 radiation Effects 0.000 claims description 14
- 239000010408 film Substances 0.000 claims 3
- 239000010409 thin film Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 18
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Details Of Aerials (AREA)
Abstract
The present invention provides a kind of on-chip antenna and radar system, on-chip antenna are integrated in chip structure, and hair is integrated in chip structure and receives unit；On-chip antenna includes at least two metalworks extended parallel to each other, mutually insulated between each metalwork；And each metalwork is received unit with hair respectively and is connect, with reception and/or electromagnetic signals.On-chip antenna provided by the invention, area occupied is small, while meeting antenna performance, the size of IC system is made to be able to satisfy the demand of people.
Description
Technical Field
The invention relates to the technical field of electromagnetic wave signal transmitting and receiving, in particular to an on-chip antenna and a radar system.
Background
With the development of semiconductor process technology, people put higher and higher requirements on the size of integrated circuit systems.
However, the conventional antenna and the integrated circuit chip are generally separated from each other, which may result in a large occupied area of the whole system, and may result in a size of the integrated circuit system that cannot meet the requirements of people.
Disclosure of Invention
The invention provides an on-chip antenna and a radar system, wherein the occupied area of the on-chip antenna is smaller, and the size of an integrated circuit system can meet the requirements of people while the performance of the antenna is met.
In a first aspect, the present invention provides an on-chip antenna, which is integrated in a chip structure, wherein a transceiver unit is integrated in the chip structure;
the on-chip antenna comprises at least two metal pieces extending in parallel, and the metal pieces are insulated from each other; and
the metal pieces are respectively connected with the transmitting and receiving units so as to receive and/or transmit electromagnetic wave signals.
As an optional mode, the on-chip antenna provided by the present invention further includes a terminal adjusting load unit integrated in the chip structure;
each metal piece is connected to the transmitting and receiving unit through the terminal adjusting load unit;
the terminal adjusting load unit is used for adjusting the radiation efficiency of electromagnetic wave signals received and/or transmitted by the on-chip antenna;
and/or
At least part of the metal piece and the top metal layer of the chip structure are arranged in the same layer.
As an alternative mode, the chip structure of the on-chip antenna provided by the invention has a plurality of stacked films;
the projections of the metal pieces in the film stacking direction at least partially overlap.
As an optional mode, in the on-chip antenna provided by the present invention, the at least two metal pieces include a first metal piece and a second metal piece, and the second metal piece includes at least one metal layer unit;
the metal layer unit and the first metal piece are positioned in the same layer of film; or,
at least part of the metal layer unit and the first metal piece are positioned in different layers of films.
As an optional mode, in the on-chip antenna provided by the present invention, the second metal piece includes at least two metal layer units;
the first metal piece is positioned in the area defined by each metal layer unit.
As an optional mode, in the on-chip antenna provided by the present invention, the metal layer units are insulated from each other and extend in parallel;
the on-chip antenna also comprises bridging lines, and the metal layer units positioned on different layers are connected through the bridging lines; and
the bridging lines are used for keeping equipotential among all the metal layer units.
As an optional mode, in the on-chip antenna provided by the present invention, each metal element is prepared in synchronization with the metal layer in the chip structure on the same layer.
As an optional mode, in the on-chip antenna provided by the present invention, the electromagnetic wave signal is a millimeter wave signal.
In a second aspect, the present invention provides a radar system, including a transceiver module, a processing module, and at least one above-mentioned on-chip antenna;
the on-chip antenna is connected with the processing module through the transmitting and receiving module.
As an optional mode, in the radar system provided by the present invention, the transmitting and receiving module, the processing module and the on-chip antenna are integrated in the same chip structure; and/or
The transmitting and receiving module comprises a transmitting unit and a receiving unit, the processing module comprises a signal processing unit and a data processing unit, the radar system further comprises a clock source, and the number of the on-chip antennas is at least two;
the clock source is respectively connected with the transmitting unit and the receiving unit, and the transmitting unit and the receiving unit are respectively connected with different on-chip antennas; the data processing unit is connected with the receiving unit through the signal processing unit.
According to the on-chip antenna and the radar system, the on-chip antenna is integrated in the chip structure, so that the occupied area of the on-chip antenna is reduced, the on-chip antenna is provided with at least two metal pieces which are insulated from each other, the metal pieces extend in parallel, a radiation field is formed between the adjacent metal pieces, electromagnetic wave signals can be effectively radiated to the outside of the chip structure, the performance of the antenna is met, and meanwhile the size of the integrated circuit system can meet the requirements of people.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an on-chip antenna according to an embodiment of the present invention;
fig. 2 is an equivalent circuit diagram of a terminal adjusting load unit in an on-chip antenna according to an embodiment of the present invention;
fig. 3 is a schematic diagram illustrating an arrangement manner of first metal pieces in the on-chip antenna according to the embodiment of the present invention;
fig. 4 is a schematic diagram illustrating an arrangement manner of second metal pieces in the on-chip antenna according to the embodiment of the present invention;
fig. 5 is a schematic diagram illustrating an arrangement manner of third metal pieces in the on-chip antenna according to the embodiment of the present invention
Fig. 6 is a schematic diagram illustrating an arrangement manner of fourth metal pieces in the on-chip antenna according to the embodiment of the present invention;
FIG. 7 is a schematic structural diagram of a first metal element in an on-chip antenna according to an embodiment of the present invention;
FIG. 8 is a schematic structural diagram of a second metal element in an on-chip antenna according to an embodiment of the present invention;
fig. 9 is a schematic structural diagram of a radar system according to an embodiment of the present invention.
Description of reference numerals:
10-an on-chip antenna; 11-a metal piece; 111-a first metal piece; 112-a second metal piece; 1121-metal layer unit; 20-chip architecture; 21-a film; 30-a transmitting and receiving unit; 40-terminal regulation load unit; 50-bridge threads; 60-a transmitting and receiving module; 61-a transmitting unit; 62-a receiving unit; 70-a processing module; 71-a signal processing unit; 72-a data processing unit; 80-clock source.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning a fixed connection, an indirect connection through intervening media, a connection between two elements, or an interaction between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
The terms "first," "second," "third," "fourth," and the like in the description and in the claims of the present application and in the drawings described above, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein.
Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Fig. 1 is a schematic structural diagram of an on-chip antenna according to an embodiment of the present invention. Referring to fig. 1, an embodiment of the present invention provides an on-chip antenna 10, where the on-chip antenna 10 is integrated in a chip structure 20, and the chip structure 20 is integrated with a transceiver unit 30.
The on-chip antenna 10 comprises at least two metal pieces 11 extending in parallel, and the metal pieces 11 are insulated from each other; and
the metal pieces 11 are respectively connected with the transceiver unit 30 to receive and/or transmit electromagnetic wave signals.
In a specific implementation, the area where the on-chip antenna 10 is integrated in the chip structure 20 is different from the other device areas in the chip structure 20, so as to avoid the on-chip antenna 10 and the other devices in the chip structure 20 from affecting each other.
Specifically, the transmitting and receiving unit 30 may include a transmitter and a receiver, both of which are connected to each metal piece 11, the metal piece 11 is used as an antenna, the transmitter transmits an electromagnetic wave signal to the outside of the chip structure 20 through the metal piece 11, the electromagnetic wave signal is reflected when encountering an obstacle to form an echo signal, and the metal piece 11 receives the echo signal and transmits the echo signal to the receiver in the chip structure 20.
In the specific implementation, the material of the metal component 11 is comprehensively selected according to the application occasion of the antenna, the antenna form and the like, and generally copper or aluminum is used, which is not limited in this embodiment.
According to the on-chip antenna 10 provided by the embodiment of the invention, the on-chip antenna 10 is integrated in the chip structure 20, so that the occupied area of the on-chip antenna is reduced, the on-chip antenna 10 is provided with at least two mutually insulated metal pieces 11, the metal pieces 11 extend in parallel, a radiation field is formed between the adjacent metal pieces 11, an electromagnetic wave signal can be effectively radiated to the outside of the chip structure 20, and the size of an integrated circuit system can meet the requirements of people while the performance of the antenna is met.
On the basis of the above-mentioned embodiment, in order to achieve the desired radiation efficiency of the antenna, in the present embodiment, the on-chip antenna 10 further includes a terminal adjusting load unit 40 integrated in the chip structure 20, and each metal piece 11 is connected to the transceiver unit 30 through the terminal adjusting load unit 40, wherein the terminal adjusting load unit 40 is used for adjusting the radiation efficiency of the electromagnetic wave signals received and/or transmitted by the on-chip antenna 10.
According to the on-chip antenna 10 provided by the embodiment of the invention, the terminal adjusting load unit 40 is arranged between the metal piece 11 and the transmitting and receiving unit 30, each metal piece 11 is connected to the transmitting and receiving unit 30 through the terminal adjusting load unit 40, and the terminal adjusting load unit 40 is used for adjusting the radiation efficiency of electromagnetic wave signals received and/or transmitted by the on-chip antenna 10, so that the antenna achieves ideal radiation efficiency.
Fig. 2 is an equivalent circuit diagram of a terminal adjusting load unit in an on-chip antenna according to an embodiment of the present invention. Referring to fig. 2, the termination adjusting load unit 40 may be a termination connected to each metal piece 11 for adjusting the radiation efficiency of the electromagnetic wave signals received and/or transmitted by the on-chip antenna 10, and the equivalent complex impedance of the termination adjusting load unit 40 may be represented by formula (one);
z ═ R + jX, formula (one)
In the formula (I), Z is equivalent complex impedance, R is resistance, X is capacitance or inductance, and j is an imaginary factor.
In a specific implementation, the termination adjusting load unit 40 may be removed, i.e., the equivalent complex impedance Z is infinite, forming an "open termination".
The metal pieces 11 may also be directly connected together by a low-resistance metal (e.g., a wire), i.e., the equivalent complex impedance Z is zero, so as to form a "short-circuit termination".
The on-chip antenna 10 provided by the embodiment of the invention comprises at least two metal pieces 11 extending in parallel, wherein the metal pieces 11 are insulated from each other, and the metal pieces 11 can be arranged in various different ways. The various possible arrangements of the metal pieces 11 are explained in detail below by means of different embodiments.
Fig. 3 is a schematic diagram illustrating an arrangement manner of first metal pieces in the on-chip antenna according to the embodiment of the present invention. Referring to fig. 1 and 3, in the present embodiment, the chip structure 20 has a film 21 stacked in multiple layers, and projections of the metal members 11 in the stacking direction of the film 21 at least partially overlap. In other words, the metal pieces 11 are stacked in the stacking direction along the multilayer film 21.
Specifically, the metal pieces 11 are arranged in layers, the metal pieces 11 are provided with a plurality of layers, each metal piece 11 is respectively formed in the films 21 of different layers, and the films 21 are used as insulating layers between the metal pieces 11, so that the metal pieces 11 are mutually insulated.
In a specific implementation, one metal piece 11 is disposed in each layer of film 21, the metal pieces 11 are parallel to each other, projections of the metal pieces 11 in the stacking direction of the multilayer films 21 may partially overlap, and projections of the metal pieces 11 in the stacking direction of the multilayer films 21 may completely overlap, and the metal pieces are arranged along the up-down direction shown in fig. 3. Therefore, the stability of the antenna is good, and the anti-interference capability of the antenna is improved.
It should be noted that the number of the metal pieces 11 may be two, the number of the metal pieces 11 may be three, four, or more than four, the sizes and the shapes of the metal pieces 11 are the same, or may be different, and the projections of the metal pieces 11 in the stacking direction of the multilayer films 21 at least partially overlap, which is not limited herein in this embodiment.
As shown in fig. 3, the metal pieces 11 have the same size and shape, and the projections of the metal pieces 11 in the stacking direction of the multilayer films 21 are all overlapped. Therefore, the stability of the antenna is best, and the anti-interference capability of the antenna is strong.
In actual operation, the length of the antenna is the same as the length of the wavelength of the electromagnetic wave signals emitted by the antenna by orders of magnitude, and the distance between the antennas is far smaller than the length of the antenna. In other words, after the length of the antenna is determined, the wavelength length of the electromagnetic wave signal emitted by the antenna is fixed correspondingly. And due to the number of layers of the film 21 in the chip structure 20, the metal members 11 cannot be stacked in the stacking direction of the multilayer film 21 without limitation.
Thus, in some embodiments, the metal pieces 11 may also be formed side by side and in the same layer of film 21 and/or different layers of film 21.
Fig. 4 is a schematic diagram illustrating an arrangement manner of second metal pieces in the on-chip antenna according to the embodiment of the present invention. Referring to fig. 4, in the present embodiment, the at least two metal parts 11 include a first metal part 111 and a second metal part 112, the second metal part 112 includes four metal layer units 1121, and the metal layer units 1121 are insulated from each other and extend in parallel.
The two metal layer units 1121 are rectangular flat plate-shaped units 1121, the remaining two metal layer units 1121 are elongated strip-shaped units, the two rectangular flat plate-shaped units 1121 are parallel to each other and are located in different layers of films 21, the two elongated strip-shaped units 1121 are located in the same layer of film 21 between the two rectangular flat plate-shaped units 1121, and the two elongated strip-shaped units 1121 are located in the same plane.
The on-chip antenna 10 further includes a bridging line 50, the metal layer units 1121 located at different layers are connected by the bridging line 50, and the bridging line 50 is used for keeping the metal layer units 1121 at equal potential. Specifically, the metal layer units 1121 in the films 21 of adjacent layers are connected by the bridge lines 50, so that the metal layer units 1121 are connected to each other to form a whole.
The first metal part 111 is located between the two metal layer units 1121 and located in the same plane as the two metal layer units 1121, so that the first metal part 111 is located in an enclosed area defined by the four metal layer units 1121.
Specifically, the two metal layer units 1121 in the shape of a rectangular flat plate have the same size, and projections of the two metal layer units 1121 in the stacking direction of the multilayer films 21 are all overlapped, the two metal layer units 1121 in the shape of an elongated strip have the same size, and are aligned end to end, distances between the metal layer units 1121 located in adjacent films 21 are the same, and the first metal part 111 is located at the center of an area defined by the four metal layer units 1121. Therefore, the symmetry of the antenna can be maintained, and the antenna structure can be more stable.
The arrangement mode of metal parts 11 in this embodiment can form closed electric field, has better anti-interference performance and radiation directionality, can also avoid causing electromagnetic interference to other devices simultaneously. In addition, compared to the antenna structure formed by stacking the metal elements 11 shown in the embodiment of fig. 3, the resistance values between the metal units 1121 are relatively close, so that the reliability of the antenna for transmitting and receiving electromagnetic wave signals can be improved.
Fig. 5 is a schematic diagram illustrating an arrangement manner of third metal elements in the on-chip antenna according to the embodiment of the present invention. Referring to fig. 5, on the basis of the embodiment shown in fig. 4, the second metal part 112 of this embodiment includes five metal layer units 1121.
Specifically, in this embodiment, compared to the embodiment in fig. 4, one metal layer unit 1121 is added, and the added metal layer unit 1121 is disposed on the same layer as the metal layer unit 1121 in the uppermost film 21 in fig. 4, and the sum of the areas of two metal layer units 1121 in the uppermost film 21 is smaller than the area of one metal layer unit 1121 in the lowermost film 21, so that a gap is formed between two metal layer units 1121 in the uppermost film 21, and the gap is located above the first metal part 111, so that the first metal part 111 is located in an unsealed area defined by five metal layer units 1121.
The effect of the arrangement of the metal pieces 11 in this embodiment is the same as that of the metal pieces 11 in the embodiment of fig. 4, and the description thereof is omitted here.
Fig. 6 is a schematic diagram illustrating an arrangement manner of fourth metal pieces in the on-chip antenna according to the embodiment of the present invention. Referring to fig. 6, in the embodiment, the second metal part 112 includes two metal layer units 1121, the first metal part 111 is located between the two metal layer units 1121, the first metal part 111 and the two metal layer units 1121 are located in the same layer of metal film 21, and the first metal part 111 and the two metal layer units 1121 extend parallel to each other and are located in the same plane.
The first metal part 111 is located at the middle position of the two metal layer units 1121, in other words, the distances between the first metal part 111 and the two metal layer units 1121 are equal.
The two metal layer units 1121 form a whole and together form a radiation field with the first metal part 111. Thus, the symmetry of the antenna is maintained, the environments on the two sides of the first metal piece 111 in the middle are the same, and the antenna structure is more stable.
The amplitude and the phase of the current flowing through the two metal layer units 1121 are equal, and both have opposite phase relation with the current in the first metal piece 111.
The arrangement mode of metal parts 11 in this embodiment can form closed electric field, has better anti-interference performance and radiation directionality, can also avoid causing electromagnetic interference to other devices simultaneously. In addition, compared to the embodiments shown in fig. 3 to fig. 5, the resistance values of the metal elements 1121 are the closest, and the reliability of the antenna for transmitting and receiving electromagnetic wave signals is the best.
It should be noted that the number and the position of the metal pieces 11 are only for illustration, and the metal pieces 11 may also be in other structures and forms, and are not limited herein.
In the above embodiment, the second metal part 112 includes a plurality of metal layer units 1121, and the second metal part 112 may have a plurality of layers, that is, each metal layer unit 1121 is located in different layers of films 21, in a specific implementation, the uppermost metal layer unit 1121 is located in the same layer as the top metal layer in the chip structure 20, and the thickness of the uppermost metal layer unit 1121 is the same as the thickness of the top metal layer in the chip structure 20; the second metal part 112 may also have a layer, where the layer of the second metal part 112 has at least one metal layer unit 1121, and each metal layer unit 1121 is disposed in the same layer as the top metal layer in the chip structure 20, and has the same thickness as the top metal layer in the chip structure 20. Since the thickness of the top metal layer in the chip structure 20 is greater than the thickness of the other metal layers in the chip structure 20, the metal layer unit 1121 with a thicker thickness is selected, so that the metal piece 11 has the best effect of transmitting and receiving electromagnetic wave signals.
When the metal piece 11 is manufactured, each metal piece 11 and the metal layer in the chip structure 20 on the same layer are manufactured synchronously, so that the manufacture of the metal piece 11 is completed while the chip structure 20 is manufactured, the process flow is simplified, and the manufacturing efficiency is improved.
The length of the antenna is in the order of magnitude of the length of the wavelength of the electromagnetic wave signal emitted by the antenna, so that the antenna can be integrated at any suitable position of the chip structure 20, such as the edge, corner or center of the chip structure 20.
FIG. 7 is a schematic structural diagram of a first metal element in an on-chip antenna according to an embodiment of the present invention; fig. 8 is a schematic structural diagram of a second-shaped metal element in an on-chip antenna according to an embodiment of the present invention. The shape of the antenna can be adjusted and the metallic piece 11 can extend along a straight line, a broken line or a curved line. For example, a plurality of bent straight lines of each metal part 11 or a plurality of curved lines of each metal part 11, the radiation direction of the antenna can be adjusted by changing the trace shape of each metal part 11.
For example, referring to fig. 3, each metal piece 11 extends in a straight line. As shown in fig. 7, each metal piece 11 extends along a fold line. As shown in fig. 8, each metal piece 11 extends along a curve.
It should be noted that the shape of the metal piece 11 is only for illustration, and the metal piece 11 may also be in other shapes, which is not limited herein.
On the basis of the above embodiment, optionally, in the on-chip antenna 10 provided in the embodiment of the present invention, the electromagnetic wave signal is a millimeter wave signal.
Specifically, the millimeter wave refers to electromagnetic waves in a frequency domain (with a wavelength of 1-10 mm) of 30-300 GHz. The wavelength of the millimeter wave is between the centimeter wave and the light wave, so the millimeter wave has the advantages of microwave guidance and photoelectric guidance.
On the basis of the above embodiment, optionally, in the on-chip antenna 10 provided in the embodiment of the present invention, at least one layer of film 21 is spaced between the metal layer units 1121 of different layers. The size of the interval between the metal pieces 11 can be adjusted according to the requirement.
Fig. 9 is a schematic structural diagram of a radar system according to an embodiment of the present invention. Referring to fig. 9, an embodiment of the present invention provides a radar system, which includes a transceiver module 60, a processing module 70, and at least one on-chip antenna 10 provided in any of the above embodiments.
Specifically, the on-chip antenna 10 is connected to the processing module 70 through the transceiver module 60.
The transceiver module 60 transmits and/or receives electromagnetic wave signals through the on-chip antenna 10, and the processing module 70 processes the received electromagnetic wave signals for radar detection of the target object, such as obtaining speed, distance, and orientation of the target object relative to the radar system, and imaging detection.
The specific structure, function and operation principle of the on-chip antenna 10 have been described in detail in the foregoing embodiments, and are not described herein again.
In a specific implementation, the transceiver module 60 includes a transmitting unit 61 and a receiving unit 62, the processing module 70 includes a signal processing unit 71 and a data processing unit 72, the radar system further includes two clock sources 80, the number of the on-chip antennas 10 is two, the clock sources 80 are respectively connected to the transmitting unit 61 and the receiving unit 62, the transmitting unit 61 is connected to the first on-chip antenna 10, and the receiving unit 62 is connected to the second on-chip antenna 10.
The transmitting unit 61 transmits an electromagnetic wave signal through the first on-chip antenna 10, the receiving unit 62 receives an electromagnetic wave signal through the second on-chip antenna 10, the clock source 80 is used for providing a reference frequency, and specifically, the clock source 80 has a phase-locked loop therein, and the phase-locked loop is used for providing a reference frequency.
The working principle of the radar system is as follows: the clock source 80 is provided with a phase-locked loop for providing a reference frequency, the transmitting unit 61 transmits a main wave signal through the first on-chip antenna 10 serving as a transmitting antenna based on the reference frequency, the receiving unit 62 receives an echo signal reflected by a target object by using the second on-chip antenna 10 serving as a receiving antenna, and performs down-conversion processing based on the reference frequency of the clock source 80 to generate and output an intermediate frequency signal to the signal processing unit 71, and the signal processing unit 71 performs analog-to-digital conversion on the intermediate frequency signal; the data processing unit 72 is configured to perform signal processing on the digital signal output by the signal processing unit 71.
In the above embodiment, the number of the on-chip antennas 10 in the radar system is two, and the antenna transmits only one signal. The number of the on-chip antennas 10 in the radar system may be six, two on-chip antennas 10 are used as transmitting antennas, and the remaining four on-chip antennas 10 are used as receiving antennas, so as to form an antenna of 2T 4R. The number of on-chip antennas 10 in the radar system may also be eight, with four on-chip antennas 10 acting as transmit antennas and the remaining four on-chip antennas 10 acting as receive antennas, forming a 4T4R antenna. The present embodiment is not limited herein.
Further, in the radar system provided by the embodiment of the present invention, the transceiver module 60, the processing module 70 and the on-chip antenna 10 are integrated in the same chip structure 20. In this way, the volume of the radar system can be reduced.
It is understood that the radar system may further include other conventional components for implementing the functions of the radar system, which are not described herein.
Specifically, the radar system provided by the embodiment of the invention can be applied to the fields of automatic driving, intelligent robots, traffic monitoring, security inspection, intelligent home furnishing and the like.
According to the radar system provided by the embodiment of the invention, the on-chip antenna 10 is arranged, the on-chip antenna 10 is integrated in the chip structure 20, the occupied area of the on-chip antenna is reduced, the on-chip antenna 10 is provided with at least two metal pieces 11 which are insulated from each other, the metal pieces 11 extend in parallel, and a radiation field is formed between the adjacent metal pieces 11, so that electromagnetic wave signals can be effectively radiated to the outside of the chip structure 20, and the size of the integrated circuit system can meet the requirements of people while the performance of the antenna is met.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. An on-chip antenna is characterized in that the on-chip antenna is integrated in a chip structure, and a transmitting and receiving unit is integrated in the chip structure;
the on-chip antenna comprises at least two metal pieces extending in parallel, and the metal pieces are insulated from each other; and
and each metal piece is respectively connected with the transmitting and receiving unit so as to receive and/or transmit electromagnetic wave signals.
2. The on-chip antenna of claim 1, further comprising a termination adjustment load cell integrated into the chip structure;
each metal piece is connected to the transmitting and receiving unit through the terminal adjusting load unit;
the terminal adjusting load unit is used for adjusting the radiation efficiency of the electromagnetic wave signals received and/or transmitted by the on-chip antenna; and/or
At least part of the metal piece and the top metal layer of the chip structure are arranged on the same layer.
3. An on-chip antenna according to claim 1, wherein the chip structure has a plurality of stacked thin films;
the projections of the metal pieces in the film stacking direction at least partially overlap.
4. An on-chip antenna according to claim 3, wherein said at least two metallic pieces comprise a first metallic piece and a second metallic piece, said second metallic piece comprising at least one metallic layer element;
the metal layer unit and the first metal piece are positioned in the film on the same layer; or,
at least part of the metal layer unit and the first metal piece are positioned in the films of different layers.
5. An on-chip antenna according to claim 4, wherein the second metallic element comprises at least two metallic layer elements;
the first metal piece is positioned in the area defined by each metal layer unit.
6. An on-chip antenna according to claim 5 wherein each of said metal layer elements is insulated from each other and extends in parallel;
the on-chip antenna also comprises bridging lines, and the metal layer units positioned on different layers are connected through the bridging lines; and
the bridging lines are used for keeping equipotential among the metal layer units.
7. An on-chip antenna according to any of claims 2 to 6, wherein each of the metallic members is fabricated in synchronization with the metallic layers in the chip structures of its same layer.
8. An on-chip antenna according to claim 1, wherein each of said metallic members extends along a straight line, a broken line or a curved line; and/or
The electromagnetic wave signal is a millimeter wave signal.
9. A radar system comprising a transceiving module, a processing module and at least one on-chip antenna according to any of claims 1 to 8;
the on-chip antenna is connected with the processing module through the transmitting and receiving module.
10. The radar system of claim 9, wherein the transceiver module, the processing module, and the on-chip antenna are integrated in the same chip structure; and/or
The transmitting and receiving module comprises a transmitting unit and a receiving unit, the processing module comprises a signal processing unit and a data processing unit, the radar system further comprises a clock source, and the number of the on-chip antennas is at least two;
the clock source is respectively connected with the transmitting unit and the receiving unit; the transmitting unit and the receiving unit are respectively connected with different on-chip antennas; the data processing unit is connected with the receiving unit through the signal processing unit.
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| CN201910561458.7A CN110350293A (en) | 2019-06-26 | 2019-06-26 | On-chip antenna and radar system |
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