CN110350099A - Display device, the method for manufacturing display device and glass stack - Google Patents
Display device, the method for manufacturing display device and glass stack Download PDFInfo
- Publication number
- CN110350099A CN110350099A CN201910270204.XA CN201910270204A CN110350099A CN 110350099 A CN110350099 A CN 110350099A CN 201910270204 A CN201910270204 A CN 201910270204A CN 110350099 A CN110350099 A CN 110350099A
- Authority
- CN
- China
- Prior art keywords
- coating
- frit
- package substrate
- display device
- light transmissive
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- Pending
Links
- 239000011521 glass Substances 0.000 title claims abstract description 92
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 252
- 239000011248 coating agent Substances 0.000 claims abstract description 204
- 238000000576 coating method Methods 0.000 claims abstract description 204
- 150000001875 compounds Chemical class 0.000 claims abstract description 34
- 239000000463 material Substances 0.000 claims description 41
- 239000000203 mixture Substances 0.000 claims description 36
- 239000011230 binding agent Substances 0.000 claims description 28
- 239000006059 cover glass Substances 0.000 claims description 20
- 238000005538 encapsulation Methods 0.000 claims description 12
- 239000011368 organic material Substances 0.000 claims description 10
- 239000011737 fluorine Substances 0.000 claims description 6
- 229910052731 fluorine Inorganic materials 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 4
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims 1
- 239000010410 layer Substances 0.000 description 115
- 239000011347 resin Substances 0.000 description 19
- 229920005989 resin Polymers 0.000 description 19
- 239000000945 filler Substances 0.000 description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 239000011241 protective layer Substances 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 230000013011 mating Effects 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010409 thin film Substances 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 230000003321 amplification Effects 0.000 description 5
- 238000003199 nucleic acid amplification method Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 4
- 238000010276 construction Methods 0.000 description 4
- GNTDGMZSJNCJKK-UHFFFAOYSA-N divanadium pentaoxide Chemical compound O=[V](=O)O[V](=O)=O GNTDGMZSJNCJKK-UHFFFAOYSA-N 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 150000003949 imides Chemical class 0.000 description 4
- 230000001771 impaired effect Effects 0.000 description 4
- 230000008595 infiltration Effects 0.000 description 4
- 238000001764 infiltration Methods 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- XHCLAFWTIXFWPH-UHFFFAOYSA-N [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] XHCLAFWTIXFWPH-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 230000003760 hair shine Effects 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- 239000002861 polymer material Substances 0.000 description 3
- 238000001338 self-assembly Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 229910001935 vanadium oxide Inorganic materials 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 230000005283 ground state Effects 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000004821 Contact adhesive Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910003978 SiClx Inorganic materials 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- 229910004286 SiNxOy Inorganic materials 0.000 description 1
- 229910020286 SiOxNy Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Inorganic materials [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 1
- CSSYLTMKCUORDA-UHFFFAOYSA-N barium(2+);oxygen(2-) Chemical compound [O-2].[Ba+2] CSSYLTMKCUORDA-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000006121 base glass Substances 0.000 description 1
- 229910000416 bismuth oxide Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 235000012771 pancakes Nutrition 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000027756 respiratory electron transport chain Effects 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/28—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
- C03C17/32—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material with synthetic or natural resins
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
- C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D123/00—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers
- C09D123/02—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
- C09D123/04—Homopolymers or copolymers of ethene
- C09D123/08—Copolymers of ethene
- C09D123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/30—Polarising elements
- G02B5/3025—Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
This application involves display device, the method for manufacture display device and glass to stack.Display device includes light transmissive substrate, package substrate, frit and first coating, wherein, light transmissive substrate includes base portion and the light-emitting component that is arranged on base portion, package substrate is arranged on light transmissive substrate, frit is around light-emitting component and is arranged between light transmissive substrate and package substrate, and first coating is arranged between package substrate and frit, and first coating includes having intramolecular *-(OCH2CH2)-OH structure compound, and first coating is at least partly contacted with frit.
Description
Cross reference to related applications
This application claims be submitted to the 10-2018-0039066 South Korea of Korean Intellectual Property Office on April 4th, 2018
The disclosure of the equity of patent application, the South Korea patent application is totally integrating herein by reference with it.
Technical field
This disclosure relates to which display device, the method for manufacturing display device and glass stack.
Background technique
With multimedia development, display device is become more and more important.Correspondingly, such as liquid crystal display is being developed
With the various display devices of organic light emitting diode display.
For example, organic light emitting display includes base portion and the organic illuminating element that is arranged on base portion.Organic illuminating element
The organic luminous layer that may include two comparative electrodes and be plugged between two comparative electrodes.From two electrodes provide electronics and
Hole can be recombined in organic luminous layer to generate exciton, and exciton generated can be transitted at them from excitation state
It shines when ground state.Damage of the organic luminous layer of organic illuminating element vulnerable to moisture or air.
As a kind of mode for the damage for inhibiting the organic luminous layer as caused by outside moisture or air, can include will be sealed
Fitted lining bottom is placed on the light transmissive substrate including light-emitting component and then uses frit material by light transmissive substrate and package substrate
Combined method.
There is limitations in terms of improving the bond strength between package substrate and frit.For example, working as from display device
It is external when applying impact, the mating surface between package substrate and frit may be damaged.If package substrate and frit
Between mating surface it is impaired, then moisture, air etc. may be allowed from external penetration, to reduce the durable of organic illuminating element
Property.
Summary of the invention
The display dress with the improved bond strength between package substrate and frit is provided in terms of the disclosure
It sets.
The method of manufacture display device is additionally provided in terms of the disclosure, uses this method to improve package substrate and glass
Bond strength between material.
The glass with improved bond strength is additionally provided in terms of the disclosure to stack.
However, the unlimited aspect documented in this article of the aspect of the disclosure.By referring to the disclosure given below
Detailed description, above and other aspect of the disclosure will become more disclosure person of an ordinary skill in the technical field
Obviously.
The embodiment of display device includes light transmissive substrate, package substrate, frit and first coating, wherein shine lining
Bottom includes base portion and the light-emitting component that is arranged on base portion, and package substrate is arranged on light transmissive substrate, and frit is around the member that shines
Part and it is arranged between light transmissive substrate and package substrate, first coating is arranged between package substrate and frit, and the
One coating includes having intramolecular *-(OCH2CH2)-OH structure compound, and first coating and frit are at least partly
Contact.
The embodiment that glass stacks includes the first glass workpiece, the second glass workpiece and coating, wherein the setting of the second glass workpiece
On the first glass workpiece, coating is plugged between the first glass workpiece and the second glass workpiece, coating and the first glass workpiece and the second glass
The contact of glass part, and coating includes having intramolecular *-(OCH2CH2)-OH structure compound.
The embodiment of method for manufacturing display device includes: to prepare light transmissive substrate, wherein light transmissive substrate include base portion and
Light-emitting component on base portion is set；Prepare package substrate, wherein painting is formed in at least part on the surface of package substrate
Layer, coating include having intramolecular *-(OCH2CH2)-OH structure compound；Glass is formed between light transmissive substrate and package substrate
Glass material, at least partly to contact with the coating of formation on the package substrate, frit is used for light transmissive substrate and package substrate
It is combined together.
Detailed description of the invention
Embodiment is described below in conjunction with the accompanying drawings, these and/or other aspects will become clear and more
It is readily appreciated that, in the accompanying drawings:
Fig. 1 is the perspective view according to the display device of embodiment；
Fig. 2 is the viewing area of the display device of Fig. 1 and the cross-sectional view of non-display area；
Fig. 3 is the enlarged cross-sectional view of the non-display area of the display device of Fig. 2；
Fig. 4 is the cross-sectional view according to the display device of embodiment；
Fig. 5 is the enlarged cross-sectional view of the non-display area of the display device of Fig. 4；
Fig. 6 is the cross-sectional view according to the display device of embodiment；
Fig. 7 is the enlarged cross-sectional view of the non-display area of the display device of Fig. 6；
Fig. 8 is the cross-sectional view according to the display device of embodiment；
Fig. 9 is the enlarged cross-sectional view of the non-display area of the display device of Fig. 8；
Figure 10 is the cross-sectional view according to the display device of embodiment；
Figure 11 is the enlarged cross-sectional view of the non-display area of the display device of Figure 10；
Figure 12 is the cross-sectional view according to the display device of embodiment；
Figure 13 is the enlarged cross-sectional view of the non-display area of the display device of Figure 12；And
Figure 14 to Figure 23 is the cross-sectional view for showing the method for the manufacture display device according to embodiment.
Specific embodiment
By referring to the features as discussed above of embodiment, can be more easily to understand the feature of present inventive concept with
And the method for realizing present inventive concept.However, present inventive concept can be embodied in many different forms, and should not be construed
To be limited to embodiment set forth herein.More precisely, thesing embodiments are provided so that the disclosure will be comprehensive
With concept that is complete, and will fully communicating present inventive concept to those skilled in the art, and present inventive concept will only
It is limited by the accompanying claims.Specification in the whole text, identical appended drawing reference refers to identical element.
Term used herein is the purpose merely for description particular implementation, and is not intended to structure of the present invention
The limitation of think of.Unless the context clearly dictates otherwise, otherwise as used herein singular " one (a) ", " one
(an) " it is also intended to " being somebody's turn to do (the) " including plural form.It should also be understood that when used in this manual, term " including
(comprise) " and/or " including (comprising) " indicate stated feature, entirety, step, operation, element and/or
The presence of component, but it is not excluded for one or more of the other feature, entirety, step, operation, element, component and/or its cluster
In the presence of or addition.
It should be understood that when element or layer be referred in another element or layer "upper", " being connected to " or " being attached to " another element
Or when layer, the element or layer can directly on another element or layer, be connected to or coupled to another element, or Jie may be present
In intermediate element or layer.On the contrary, when element is referred to as " direct " in another element or layer "upper", " being connected directly to " or " straight
Connect and be attached to " another element or when layer, then there is no elements or layer between.As used herein, term " and/
Or " include one or more of related listed item any and all combinations.
It should be understood that although term first, second etc. can be used to describe various elements herein, component, region, layer and/
Or part, but these elements, component, regions, layers, and/or portions should not be limited by these terms.These terms are only used to will
One element, component, region, layer or part are distinguished with another element, component, region, layer or part.Therefore, without departing substantially from
In the case where the introduction of present inventive concept, first element discussed below, first assembly, first area, first layer or first
Divide and is referred to alternatively as second element, the second component, second area, the second layer or second part.
As used in this article, first direction X indicates any one direction in plane, and second direction Y indicates plane
In the direction intersected with first direction X, and third direction Z indicates the direction vertical with the plane.Unless otherwise defined,
Otherwise " plane " refers to plane belonging to first direction X and second direction Y.
Hereinafter, embodiment is described with reference to the accompanying drawings.
Fig. 1 is the perspective view according to the display device 1 of embodiment.
It referring to Fig.1, may include viewing area DA and non-display area NA according to the display device of current embodiment 1.
Viewing area DA can be for by facilitating the region that substantial image is shown including multiple pixel PX.Such as institute herein
It uses, " pixel " refers to makes viewing area DA be divided into the single region shown for color, and a picture in the plan view
Element can be the single region for being limited to express the minimum unit of color independently of other pixels.That is, in pixel PX
Each of can uniquely show one of predetermined primary colors to realize that color is shown.The example of primary colors include red, green and
Blue.In the plan view, viewing area DA can be surrounded by non-display area NA.Non-display area NA is displayed without contribution to image, and
Element needed for the operation of display device 1 can be located in non-display area NA.
It now will be by carrying out more detailed retouch to according to the display device 1 of current embodiment referring additionally to Fig. 2
It states.Fig. 2 is the cross-sectional view of the viewing area DA and non-display area NA of the display device 1 of Fig. 1, shows and is provided with light-emitting component 150
Region and be provided with the region of frit 310.
Referring to Figures 1 and 2, display device 1 may include light transmissive substrate 100, package substrate 200 and by light transmissive substrate 100
With the combined frit 310 of package substrate 200, and it may also include and the surface of package substrate 200 is set at least
Lower coating 411 and upper coating 412 in a part.
Light transmissive substrate 100 may include base portion 110 and light-emitting component 150.Light transmissive substrate 100 may include can itself shine with
The light-emitting component 150 of light needed for image is shown is provided.For example, light transmissive substrate 100 can be to include being arranged in each pixel PX
Light-emitting component 150 display substrate.The light-emitting component 150 being separately positioned in pixel PX can shine independently of one another, thus
Realize that image is shown and color is shown.
Base portion 110 can be transparent or opaque insulating substrate or film.For example, base portion 110 may include glass material or stone
English material, or may include polymer material, such as polyimides, polycarbonate, polyethylene terephthalate or poly- third
Olefin(e) acid ester.
It may be provided with buffer layer 115 on the surface (upper surface in Fig. 2) of base portion 110.Buffer layer 115 can protect base portion
It 110 and prevents the dopants penetration of such as moisture or air and damages light-emitting component 150.In addition, buffer layer 115 can prevent base portion
110 is impaired during forming active layer 121 that will be explained hereinafter.Buffer layer 115 may be provided at viewing area DA and
On non-display area NA.Buffer layer 115 may include inorganic material, such as silicon nitride (SiNx), silica (SiOx) or silicon oxynitride
(SiNxOy、SiOxNy).In embodiments, buffer layer 115 can be omitted.
Thin film transistor (TFT) 120 and the first insulating layer 131 and second insulating layer 133 may be provided on buffer layer 115.
Thin film transistor (TFT) 120 can be driving transistor, be configured to by according to the signal control stream for being transferred to control terminal
The magnitude of current through the channel region in active layer 121 come control the light-emitting component 150 from specific pixel PX transmitting light quantity.Example
Such as, thin film transistor (TFT) 120 may include the active layer 121 to form channel, as the grid 123 of control terminal, as the leakage of input terminal
Pole 125 and source electrode 127 as output end.
Active layer 121 may be provided on buffer layer 115.Active layer 121 may include semiconductor material.For example, active layer 121
It may include polysilicon.In embodiments, active layer 121 may include monocrystalline silicon or amorphous silicon, or may include such as oxide
The non-silicon base semiconductor material of semiconductor.Active layer 121 can be partially electronically conductive.For example, active layer 121 may include drain region
The source region and, wherein drain region and source region pass through the channel region that is plugged between drain region and source region
It is separated from each other, and each of drain region and source region can have the electric conductivity bigger than channel region.
Grid 123 may be provided on active layer 121.Grid 123 can at least partly be weighed with the channel region of active layer 121
It is folded.Grid 123 may include the alloy of aluminium (Al), molybdenum (Mo), copper (Cu) or these materials.Though being not shown, grid
123 may be electrically connected to the output electrode of the switching transistor (not shown) of the ON/OFF of control specific pixel PX.
First insulating layer 131 can be plugged between active layer 121 and grid 123 so that active layer 121 and grid 123 that
This insulation.That is, the first insulating layer 131 can be gate insulating layer.First insulating layer 131 may be provided at viewing area DA and non-
On the NA of viewing area.First insulating layer 131 may include inorganic insulating material, such as silicon nitride, silica or silicon oxynitride.
Second insulating layer 133 may be provided on grid 123.Second insulating layer 133 can make grid 123 and be arranged in grid
Element insulating on 123.Second insulating layer 133 may be provided on viewing area DA and non-display area NA.In some embodiments,
Second insulating layer 133 can be the stepped construction of multiple insulating layers.Second insulating layer 133 may include inorganic insulating material, such as nitrogen
SiClx, silica or silicon oxynitride.
The through-hole at least partly exposing active layer 121 can be formed in first insulating layer 131 and second insulating layer 133.
For example, through-hole may pass through the first insulating layer 131 and second insulating layer 133, at least partly to expose the drain region of active layer 121
Domain and source region.
Drain electrode 125 and source electrode 127 may be provided in second insulating layer 133.Drain electrode 125 and source electrode 127 can be inserted respectively into
To be contacted with active layer 121 in through-hole.Although being not shown, drain electrode 125 may be electrically connected to drive voltage line and (not show
Out) to receive driving voltage, and source electrode 127 may be electrically connected to light-emitting component 150.
It may be provided with step difference compensation layer 140 on drain electrode 125 and source electrode 127.Step difference compensation layer 140 can be minimized by all
Such as thin film transistor (TFT) 120, switching transistor (not shown), the element of auxiliary electrode (not shown) and/or such as scan line, data
The step that line and the wiring (not shown) of drive voltage line are formed.That is, step difference compensation layer 140 can be planarization layer,
Planarization layer provides the space being steadily arranged for light-emitting component 150.The material of step difference compensation layer 140 is not limited especially
System, as long as it is with insulating property (properties) and planarization property.For example, step difference compensation layer 140 may include organic material or nothing
Machine material, such as acrylic resin, epoxy resin, imide resin, the more resins of card or ester resin.
Light-emitting component 150 may be provided on step difference compensation layer 140.Light-emitting component 150 may be provided in each pixel PX.
Include anode 151 and cathode 153 facing with each other and be plugged on anode 151 and cathode 153 for example, light-emitting component 150 can be
Between organic luminous layer 155 organic illuminating element.Light-emitting component 150 can material according to organic luminous layer 155 or stacking
Structure and emit blue and green light, feux rouges or white light.
Anode 151 may be provided on step difference compensation layer 140.Anode 151 can be via penetrating the logical of step difference compensation layer 140
Hole is electrically connected to source electrode 127.In Fig. 2 etc., the source electrode 127 of anode 151 and thin film transistor (TFT) 120 (that is, driving transistor) that
This is directly contacted, and is therefore connected to each other directly.However, the present disclosure is not limited to such case, and anode 151 and source electrode 127
It can be electrically connected by one or more thin film transistor (TFT) (not shown) or connection electrode (not shown).Anode 151 can exist for setting
There is the pixel electrode of independent driving signal in each pixel PX in the DA of viewing area and by transmission.Anode 151 can be transparent
The stepped construction of electrode, opaque electrode or transparent electrode and opaque electrode.The example of material for forming transparent electrode includes
Tin indium oxide (ITO), indium zinc oxide (IZO), zinc oxide and indium oxide.The example for forming the material of opaque electrode includes lithium
(Li), aluminium (Al), magnesium (Mg), silver-colored (Ag), nickel (Ni) and chromium (Cr).
Cathode 153 may be provided on anode 151.Cathode 153 can be in the case where not to distinguishing between pixel PX
Public electrode on multiple pixel PX or across multiple pixel PX is set.That is, being arranged in different pixel PX
A plurality of light-emitting elements 150 can share cathode 153 each other.As anode 151, cathode 153 can be transparent electrode, opaque electrode
Or the stepped construction of transparent electrode and opaque electrode.
Organic luminous layer 155 can be plugged between anode 151 and cathode 153.Organic luminous layer 155 can be by from anode
151 and the hole that receives of cathode 153 recombined with electronics to shine.For example, electrons and holes can be in organic light emission
It recombines in layer 155 to generate exciton, and exciton generated can shine when they transit to ground state from excitation state.
Organic luminous layer 155 may include the peak wavelength that can emit Ju You in the range of about 430nm to about 470nm
The material of blue phosphorescent or fluorescence can emit the green phosphorus with peak wavelength in the range of about 530nm to about 570nm
The material of light or fluorescence or can emit red phosphorescent with peak wavelength in the range of about 610nm to about 650nm or
The material of fluorescence.In Fig. 2 etc., organic luminous layer 155 is arranged in each pixel PX.However, the present disclosure is not limited to this feelings
Condition.In embodiments, organic luminous layer 155 may be provided on multiple pixel PX.That is, different pixel PX is arranged in
In at least some of a plurality of light-emitting elements 150 can share organic luminous layer 155 each other.
Although being not shown, between organic luminous layer 155 and anode 151 or organic luminous layer 155 and cathode
It may also be formed with such as hole of hole injection layer, hole transmission layer and hole blocking layer control auxiliary layer between 153 (not show
Out), the electronic control auxiliary layer (not shown) or charge of such as electron injecting layer, electron transfer layer and electronic barrier layer generate
Auxiliary layer (not shown), to improve the luminous efficiency of light-emitting component 150.
In some embodiments, it may be provided with pixel confining layer 160 on anode 151.Pixel confining layer 160 can shown
Each pixel PX is limited in area DA.Pixel confining layer 160 can have the opening on the surface of partially exposed anode 151.Namely
It says, in the plan view, at least part for the anode 151 that pixel confining layer 160 can have exposure to be arranged in each pixel PX
Opening.Above-mentioned organic luminous layer 155 and cathode 153 may be provided in pixel confining layer 160.Pixel confining layer 160 can wrap
Include organic material, such as acrylic resin, epoxy resin, imide resin or ester resin.
Light transmissive substrate 100 may also include the protective layer 170 being arranged on light-emitting component 150.Protective layer 170 can be directly arranged
On light-emitting component 150.For example, protective layer 170 can be set up directly on the cathode 153 of light-emitting component 150.Protective layer 170 can
Prevent dopants penetration and the damage of such as moisture or air together with the package substrate 200 and frit 310 that will be described later
Light-emitting component 150 prevents light-emitting component 150 to be damaged because of filler 510 containing organic material.That is, protective layer
170 can execute additional encapsulation function to light-emitting component 150.Protective layer 170 may be provided on multiple pixel PX.Protective layer 170
It may include inorganic material, such as silicon nitride, silica or silicon oxynitride.
Next, package substrate 200 will be described.Package substrate 200 may be provided on light transmissive substrate 100.Encapsulation
Substrate 200 may include the material that light-emitting component 150 can be prevented impaired because of the infiltration of moisture or air.For example, package substrate
200 may include glass material or quartz material.
In embodiments, the surface of package substrate 200 can be handled at least partially with fluorine.That is, fluorin radical (-
F) may be present on the surface of package substrate 200, specifically, fluorin radical (- F) may be present in package substrate 200 with will be rear
On the surface that the lower coating 411 and upper coating 412 of face description contact.In a non-limiting example, when package substrate 200 includes silicon
When base glass material, the fluorin radical for being bonded to silicon atom be may be present on the surface of package substrate 200.The table of package substrate 200
Fluorin radical on face can form secondary or physical bond/chemical bond with the compound in lower coating 411 and upper coating 412, to help to improve
Bond strength between package substrate 200 and frit 310.
Now by by referring additionally to Fig. 3 to according to the frit 310 of the display device 1 of current embodiment and under
Coating 411 and upper coating 412 are described in detail.As used in this article, term " frit " refers not only to powder shape
The glass material containing additive of formula, but also refer to by melting the glass material containing additive with curing powder form
The glass structure expected and formed.
Referring to figs. 1 to Fig. 3, frit 310 be may be provided between light transmissive substrate 100 and package substrate 200.Frit 310
It can be for for by light transmissive substrate 100 and the combined containment member of package substrate 200.Frit 310 can be to include glass
The glass frit of material.The transmissivity of frit 310 is smaller than the transmissivity of package substrate 200.
Frit 310 may be provided in non-display area NA and around a plurality of light-emitting elements 150.In the plan view, glass
It is similar but be not limited to the band of substantially quadrangle that material 310, which can shape,.Frit 310 can be configured to package substrate 200 together
Fully enclosed light-emitting component 150.Correspondingly, it can prevent light-emitting component 150 from damaging because of the infiltration of moisture or air.
In some embodiments, frit 310 can have inclined side surface.The lower width W of frit 3101(example
Such as, width W of the frit 310 on 100 side of light transmissive substrate1) the upper width W of frit 310 can be greater than2(for example, frit
The 310 width W on 200 side of package substrate2).Optionally, the lower width W1 of frit 310 is smaller than the upper of frit 310
The side surface of portion width W2 or frit 310 can not tilt, but can be substantially vertical.
The lower surface of frit 310 can connect with the first insulating layer 131 and/or second insulating layer 133 of light transmissive substrate 100
Touching.In figure 2 and figure 3, both frit 310 and the first insulating layer 131 of light transmissive substrate 100 and second insulating layer 133 connect
Touching.However, the present disclosure is not limited to such cases.In embodiments, frit 310 can not be contacted with the first insulating layer 131, can
It does not contact, or can be contacted with buffer layer 115 or base portion 110 with second insulating layer 133.In addition, the upper surface of frit 310 can be with
Lower coating 411 contacts.Lower coating 411 will be described later.
Frit 310 can be formed by fusing and curing glass feed composition or frit paste.For example, frit 310
It may include vanadium oxide, such as vanadic anhydride (V2O5).The content of vanadium oxide in frit 310 can be but be not limited to about 30mol%
To about 50mol%.In some embodiments, frit 310 may also include ceramic fillers.In embodiments, in addition to oxygen
Change other than vanadium, frit 310 may include barium monoxide, bismuth oxide, antimony oxide, borate, phosphate or borosilicate.
Lower coating 411 may be provided between frit 310 and package substrate 200.For example, lower coating 411 can be directly arranged
On the back surface of package substrate 200.Lower coating 411 can be contacted with frit 310 and package substrate 200.Lower coating 411 can have
Help improve the bond strength between frit 310 and package substrate 200.
Lower coating 411 can be the coating formed by the unimolecule with autoregistration property or self-assembly property.That is,
Lower coating 411 can be self-aligned layer.For example, lower coating 411 may be based on the self-aligned layer of the compound of polyethylene glycol.
In embodiments, lower coating 411 may include with intramolecular *-(OCH2CH2)nThe compound of-* structure is (wherein,
N is 1 to 200 natural number), and the coating that can be formed for the autoregistration by the above compound.For example, lower coating 411
In compound can have intramolecular *-(OCH2CH2)n- OH structure or intramolecular *-(OCH2CH2)-OH structure.More specific
In example, the compound in lower coating 411 can have R- (OCH2CH2)n- OH structure, wherein R can be with one or more hydroxyls
The C that group replaces1-C50Groups.Autoregistration compound with hydroxyl groups can be with the fluorin radical on the back surface of package substrate 200
Form secondary or physical bond/chemical bond.Lower coating 411 can have alkalinity.As used in this article, " alkalinity " indicates to have more than 7
PH.
Lower coating 411 may be provided on viewing area DA and non-display area NA.For example, lower coating 411 can be on third direction Z
It is Chong Die with the frit 310 in the light-emitting component 150 and non-display area NA in the DA of viewing area.In embodiments, lower coating 411
Thickness can be for approaches uniformity.The maximum gauge T of lower coating 4111It can be about 10 μm or smaller.Instantly the maximum of coating 411
Thickness T1It is about 10 μm or more hour, the compound in lower coating 411 can be stably maintained at autoregistration state.
In addition, upper coating 412 may be provided in the front surface of package substrate 200.For example, upper coating 412 can be directly arranged
In package substrate 200.Upper coating 412 can help to the first binder course 530 that improves package substrate 200 with will be described later
Between bond strength.Upper coating 412 may include compound identical with lower coating 411.For example, upper coating 412 can be to pass through
With intramolecular *-(OCH2CH2)n- OH structure or intramolecular *-(OCH2CH2)-OH structure above-mentioned compound autoregistration and
The self-aligned layer of formation.Autoregistration compound with hydroxyl groups can be formed with the fluorin radical in the front surface of package substrate 200
Secondary or physical bond/chemical bond.
Like that, upper coating 412 can have alkalinity to following coating 411.In addition, upper coating 412 may be provided at viewing area DA and
On non-display area NA, and can be Chong Die with light-emitting component 150 and frit 310 on third direction Z.The maximum of upper coating 412
Thickness can be but be not limited to about 10 μm or smaller.
In embodiments, filler 510 may be provided between package substrate 200 and light-emitting component 150.Filler 510
The step formed by light-emitting component 150 can be minimized, for example, the step formed by pixel confining layer 160.In addition, filler 510
Space between fillable package substrate 200 and light transmissive substrate 100.Since filler 510 minimizes package substrate 200 and shines
Step difference between substrate 100 and the space between package substrate 200 and light transmissive substrate 100 is filled, therefore display can be improved
The mechanical strength or durability of device 1.Filler 510 can at least partly with protective layer 170, lower coating 411 and frit 310
Contact.The material of filler 510 is not particularly limited, as long as it is the material with planarization property.For example, filler
510 may include organic material, such as acrylic resin, epoxy resin, imide resin or acrylate.
In embodiments, filler 510 can be not used or not be included in package substrate 200 and light-emitting component 150 it
Between, and package substrate 200 and light-emitting component 150 can be separated from each other.Sky between package substrate 200 and light-emitting component 150
Between can be by such as nitrogen (N2) inert gas filling.
In some embodiments, display device 1 may include the building blocks of function 600 being arranged in package substrate 200, setting
The shell 800 of cover glass 700, receiving light transmissive substrate 100 and package substrate 200 on building blocks of function 600 and setting are encapsulating
Pad component 900 on the side surface of substrate 200.
Building blocks of function 600 may be provided in the front surface of package substrate 200.Building blocks of function 600 can have polarization function or
Touch-sensing function.That is, building blocks of function 600 may include polarizer or touch sensitive elements.
Polarizer can be facilitated by stopping the transmission of the reflected light of exterior light or at least partly absorb reflected light
Outdoor visibility.Polarizer can be to convert incident light into the linear polarization of linearly polarized photon or convert incident light into circle
The circuit polarizer of polarised light.
In addition, touch sensitive elements, which can be sensed, is input to display device 1 by touch operation by the user of display device 1
Information.A part, writing pencil of user's body etc. can be used to execute touch operation.For example, touch sensitive elements can sense
In information input by user about whether have been carried out touch information, about touch location information, about touch press
The information of the size of power and about execute touch function at least one of the information of shape of object.
In some embodiments, building blocks of function 600 can be multiple layers of stepped construction.
First binder course 530 can be plugged between building blocks of function 600 and upper coating 412.First binder course 530 can be with function
The lower surface of component 600 and upper coating 412 contact.First binder course 530 may include as double faced adhesive tape optically clear adhesive,
The optical clear resin or contact adhesive of such as light-cured resin or thermosetting resin.Package substrate 200 and the first binder course
Upper coating 412 between 530 can help to improve the bond strength between package substrate 200 and the first binder course 530.
Cover glass 700 may be provided on building blocks of function 600.Cover glass 700 can form the upper surface of display device 1.Lid glass
Glass 700 can protect the element in display device 1, and form display device 1 makes the display surface that image is formed thereon, and can
Form the outside of display device 1.In some embodiments that building blocks of function 600 is touch sensitive elements, cover glass 700 can shape
At the touch-surface for the touch operation (that is, touch operation performed by the user) for carrying out user on it.Cover glass 700 may include
Material with high transparency and excellent in strength, such as glass material, sapphire material or polymer material.
Second binder course 550 can be plugged between cover glass 700 and building blocks of function 600.Second binder course 550 can be with lid glass
The lower surface of glass 700 and the upper surface contact of building blocks of function 600.As the first binder course 530, the second binder course 550 can be wrapped
Include the optical clear resin or pressure-sensitive viscous of the optically clear adhesive such as double faced adhesive tape, such as light-cured resin or thermosetting resin
Mixture.Second binder course 550 may include the material identical or different with the first binder course 530.
Shell 800 may be provided on the back surface of light transmissive substrate 100.Shell 800 can have inner space, light transmissive substrate
100 and/or package substrate 200 can store or be contained in the inner space.That is, shell 800 can for back-cover, backrest or
Bracket.For example, shell 800 may include cover light transmissive substrate 100 back surface bottom part 810 and from bottom part 810 to
Upper side section 830 outstanding, to cover the side surface of light transmissive substrate 100 and/or package substrate 200.The side section of shell 800
830 can protect the base portion of light transmissive substrate 100 by the base portion 110 and the side surface of package substrate 200 for covering light transmissive substrate 100
110 and package substrate 200.The side section 830 of shell 800 can pass through at least partly covering function component 600 and cover glass 700
Side surface come defencive function component 600 and cover glass 700.The bottom part 810 of shell 800 can be spaced apart with base portion 110, and
And the side section 830 of shell 800 can be spaced apart with the base portion 110 of light transmissive substrate 100, package substrate 200 and cover glass 700.So
And the present disclosure is not limited to such cases.The material of shell 800 is not particularly limited, as long as it is with excellent in strength and rigidity
Material.For example, shell 800 may include such as the polymer material of carbonate resin or such as aluminium, nickel or these metals
The metal material of alloy.
Pad component 900 may be provided on the side surface of package substrate 200.Pad component 900 may be provided at package substrate 200 with
Between the side section 830 of shell 800, to prevent package substrate 200 to be damaged because of shell 800.For example, when package substrate 200 becomes
When shape or external impact are applied to display device 1, pad component 900 can remain potted the distance between substrate 200 and shell 800 simultaneously
And absorb and at least partly impact, to minimize impaired.
Pad component 900 can cover the side surface of package substrate 200, and can be shaped like substantially four in the plan view
The band of side shape.Padding component 900 can be with package substrate 200, the first binder course 530, building blocks of function 600, the second binder course 550, lid
The contact of the side section 830 of glass 700 and/or shell 800.For example, pad component 900 may be coupled to package substrate 200, but can be with
Shell 800 separates.
Alignment package substrate 200, the side surface of building blocks of function 600 and cover glass 700 and guarantor are come by using pad component 900
The distance between package substrate 200 and shell 800 are held, light transmissive substrate 100, package substrate 200 and frit 310 can be protected to exempt from
It is influenced by external impact, and minimizes the width of the non-display area NA of display device 1.The material of component 900 is padded not by spy
It does not limit, is at least partly impacted as long as it can be absorbed.For example, pad component 900 may include organic material, such as acrylic acid
Resin, epoxy resin, imide resin or acrylate.
As described above, may include being arranged on the surface of package substrate 200 according to the display device 1 of current embodiment
Lower coating 411 and upper coating 412.
Specifically, the package substrate 200 including glass material, frit 310 and package substrate 200 and frit are plugged on
Lower coating 411 between 310 can form glass stacking.That is, being capable of providing according to the disclosure with the first glass workpiece
The glass of improved adhesiveness stacks between (for example, package substrate) and the second glass workpiece (for example, frit).Including having
Intramolecular *-(OCH2CH2)n- OH structure or intramolecular *-(OCH2CH2) the lower coating 411 of compound of-OH structure can help to
Improve the bond strength between the first glass workpiece (for example, package substrate) and the second glass workpiece (for example, frit).Therefore, root
Stacking according to the glass of current embodiment can express excellent bond strength.
In addition, including the package substrate 200 of glass material, the first binder course 530 including organic material and being plugged on envelope
Upper coating 412 between fitted lining bottom 200 and the first binder course 530 can form glass/resin stacking.That is, according to this public affairs
It opens, is capable of providing the glass/resin with the improved adhesiveness between glass and resin and stacks.Including with intramolecular *-
(OCH2CH2)n- OH structure or intramolecular *-(OCH2CH2)-OH structure compound upper coating 412 can help to improve encapsulation
Bond strength between substrate 200 and the first binder course 530.Therefore, glass/resin according to the present embodiment, which stacks, can express
Excellent bond strength out.
Hereinafter, other embodiment will be described.For the sake of simplicity, it will omit and according to above embodiment
Display device 1 the identical element of element description, and those skilled in the art will be expressly understood from attached drawing it is identical
Element.
Fig. 4 is to show the light-emitting component for being provided with display device 2 according to the cross-sectional view of the display device 2 of embodiment
150 viewing area and the non-display area for being provided with frit 310.Fig. 5 is that the amplification of the non-display area of the display device 2 of Fig. 4 is cutd open
View.
Referring to Fig. 4 and Fig. 5, filled according to the display device 2 of current embodiment and the display of the embodiment waited according to fig. 2
Set 1 the difference is that, further include the side coating 413 being arranged on the side surface of package substrate 200.
In embodiments, side coating 413 may be provided between package substrate 200 and pad component 900.For example, side coating
413 can be set up directly on the side surface of package substrate 200.Side coating 413 can help to improve package substrate 200 and pad component
Bond strength between 900.Side coating 413 may include compound identical with lower coating 411 and upper coating 412.For example, side applies
Layer 413 can be for by with intramolecular *-(OCH2CH2)n- OH structure or intramolecular *-(OCH2CH2)-OH structure above-mentioned chemical combination
The autoregistration of object and the self-aligned layer formed.Autoregistration compound with hydroxyl groups can on the side surface of package substrate 200
Fluorin radical formed secondary or physical bond/chemical bond.Between side coating 413 and lower coating 411 and side coating 413 and upper coating 412
Between macroscopic physical boundary can be substantially absent.
Like that, side coating 413 can have alkalinity for following coating 411 and upper coating 412.The maximum gauge of side coating 413 can
For but be not limited to about 10 μm or smaller.
In embodiments, side coating 413 may include the compound different from lower coating 411 and upper coating 412.
Pad component 900 may be provided on side coating 413.Padding component 900 can be with side coating 413, the first binder course 530, function
The contact of side section 830 of energy component 600, the second binder course 550, cover glass 700 and/or shell 800.
In the display device 2 according to current embodiment, package substrate 200 including organic material including glass material
The pad component 900 of material and the side coating 413 for being plugged on package substrate 200 and padding between component 900 can form glass/resin heap
It is folded.
Fig. 6 is to show the light-emitting component for being provided with display device 3 according to the cross-sectional view of the display device 3 of embodiment
150 viewing area and the non-display area for being provided with frit 330.Fig. 7 is that the amplification of the non-display area of the display device 3 of Fig. 6 is cutd open
View.
Referring to figure 6 and figure 7, it is filled according to the display device of current embodiment 3 and the display of the embodiment according to Fig. 4 etc.
2 are set the difference is that lower coating 431 is with partially different thickness.
Lower coating 431 can on third direction Z with the light-emitting component 150 in viewing area and the frit in non-display area
330 overlappings.In embodiments, the average thickness of the lower coating 431 Chong Die with light-emitting component 150 can be greater than and frit 330
The average thickness of the lower coating 431 of overlapping.For example, the first of the lower coating 431 Chong Die with the light-emitting component 150 in viewing area is thick
Spend T2It can be substantially homogeneous.First thickness T2It can be about 10 μm or smaller.
On the other hand, the thickness of the lower coating 431 Chong Die with the frit 330 in non-display area can be uneven for part
's.For example, the part Chong Die with frit 330 of lower coating 431 can have less than first thickness T2Second thickness T3.More
In specific example, the part of lower coating 431 contacted with frit 330 can have second thickness T3.Second thickness T3The upper limit
It can be about 5.0 μm, about 4.0 μm, about 3.0 μm, about 2.0 μm or about 1.0 μm.Therefore, inclined surface may be formed at lower coating 431
In a part on surface.
There can be part uneven according to the lower coating 431 of current embodiment contacted with the frit 330 of display device 3
Even thickness.Specifically, the lower coating 431 contacted with frit 330 can form relatively thin, so that lower coating 431 can be formed
The inclined surface in part, while there is intramolecular *-(OCH2CH2)n- OH structure or intramolecular *-(OCH2CH2)-OH structure change
Object is closed to be stably maintained in autoregistration state.The inclined surface of lower coating 431 can increase frit 330 and lower coating 431 it
Between combination interface area, to further improve the bond strength formed by frit 330.
In addition, the inclined surface of lower coating 431 can increase the road of the combination interface between frit 330 and lower coating 431
Electrical path length, to increase the length of the permeation pathway of the impurity of such as moisture or air.
In embodiments, side coating 413 can be omitted, and pads component 900 and can contact with package substrate 200.
Fig. 8 is to show the light-emitting component for being provided with display device 4 according to the cross-sectional view of the display device 4 of embodiment
150 viewing area and the non-display area for being provided with frit 340.Fig. 9 is that the amplification of the non-display area of the display device 4 of Fig. 8 is cutd open
View.
Referring to Fig. 8 and Fig. 9, filled according to the display device 4 of current embodiment and the display of the embodiment according to Fig. 4 etc.
2 are set the difference is that at least part of frit 340 is contacted with package substrate 200.
In embodiments, lower coating 441 can have the opening for the back surface at least partly exposing package substrate 200
441p.The opening 441p of lower coating 441 can form frit 340 by fusing and curing glass feed composition or frit paste
During formed, but the present disclosure is not limited to such cases.In irradiation laser to be formed in the embodiment of frit 340,
The opening 441p of lower coating 441 can pass through the type of laser, the position of laser spot, laser irradiation intensity or laser irradiation time
To control.
In addition, frit 340 can at least partly contact with lower coating 441 and can also be with the envelope by opening 441p exposure
Fitted lining bottom 200 contacts.For example, the substantial middle part of the upper surface of frit 340 can connect with package substrate 200 in the plan view
Touching.
On the other hand, the inner edge portion that is formed by the upper surface of frit 340 and inner surface 340a and by frit
Each of the outer edge part that 340 upper surface and outer surface 340b are formed can be contacted with lower coating 441.In plan view
In, when frit 340 is formed about light-emitting component 150, the inner surface 340a of frit 340 can be light-emitting component 150
Side surface on side, and the outer surface 340b of frit 340 can be the side surface opposite with inner surface 340a.
When from the external application impact of display device 4, stress can concentrate on the mating surface formed by frit 340
On, to damage mating surface.Specifically, because stress caused by external impact can mainly be transferred to the inward flange of frit 340
Part and outer edge part.However, the inner edge portion for being easiest to stress and damaging and peripheral portion due to frit 340
Divide and be formed as contacting with lower coating 441, therefore bond strength can be improved.In addition, due to 200 shape of frit 340 and package substrate
As partly contacting each other, therefore combination interface can be formed between frit 340 and package substrate 200, and can be effectively
Prevent the impurity of such as moisture or air from passing through the combination being formed between the frit 340 being in contact with each other and package substrate 200
The infiltration at interface.
In embodiments, side coating 413 can be omitted, and pads component 900 and can contact with package substrate 200.
Figure 10 is to show the light-emitting component for being provided with display device 5 according to the cross-sectional view of the display device 5 of embodiment
150 viewing area and the non-display area for being provided with frit 350.Figure 11 is the amplification of the non-display area of the display device 5 of Figure 10
Cross-sectional view.
0 and Figure 11 referring to Fig.1, the display of the embodiment according to the display device 5 of current embodiment and according to Fig. 4 etc.
Device 2 is the difference is that the outer edge part of frit 350 is contacted with package substrate 200.
In embodiments, in the plan view, lower coating 451 may be provided on the back surface of package substrate 200, but can
It is not arranged in the fringe region of the back surface of package substrate 200.Can during forming frit 350 to being not provided under
The region of coating 451 is controlled, but the present disclosure is not limited to such cases.The reality of frit 350 is formed in irradiation laser
It applies in mode, the region for being not provided with the lower coating 451 of frit 350 can be controlled for example, by laser irradiating position.
Frit 350 can at least partly contact with lower coating 451 and can also be with the encapsulation that is not covered by lower coating 451
Substrate 200 contacts.
The inner edge portion formed by the upper surface and inner surface 350a of frit 350 can be contacted with lower coating 451.Separately
On the one hand, by the outside table of the substantial middle part of the upper surface of frit 350, the upper surface of frit 350 and frit 350
The outer edge part that face 350b is formed can be contacted with package substrate 200.
When from the external application impact of display device 5, stress can concentrate on the mating surface formed by frit 350
On, to damage mating surface.Specifically, compared near the outer edge part of frit 350, mating surface is in frit
350 inner edge portion nearby opposite can be easier to be damaged.However, due in the display device 5 according to current embodiment
Inner edge portion is formed as contacting with lower coating 451, therefore can improve bond strength.In addition, due to frit 350 and encapsulation lining
Bottom 200 is formed as partly contacting each other, specifically, due to the outer edge part of frit 350 and the upper surface of frit 350
Center portion be formed as contacting with package substrate 200, therefore can be formed between frit 350 and package substrate 200 in conjunction with boundary
Face, and the impurity that such as moisture or air can be effectively prevented passes through the frit 350 for being formed in and being in contact with each other and serves as a contrast with encapsulation
The infiltration of combination interface between bottom 200.
In some embodiments, the average tilt angle θ of the inner surface 350a of frit 3501With frit 350
The average tilt angle θ of outer surface 350b2It can be different.For example, the average tilt of the inner surface 350a of frit 350
Angle, θ1With the average tilt angle θ of the outer surface 350b of frit 3502It can be 90 degree or smaller, but frit 350
Inner surface 350a average tilt angle θ1It is smaller than the average tilt angle θ of the outer surface 350b of frit 3502.?
In more specific example, the average tilt angle θ of the inner surface 350a of frit 3501It can be about 60 degree to about 80 degree, and
The average tilt angle θ of the outer surface 350b of frit 3502It can be about 65 degree to about 88 degree.The inner surface of frit 350
The tilt angle theta of 350a and outer surface 350b1And θ2It can be during fusing and curing glass feed composition or frit paste
It is controlled, but the present disclosure is not limited to such cases.In irradiation laser to be formed in the embodiment of frit 350, glass
The tilt angle theta of the inner surface 350a and outer surface 350b of material 3501And θ2It can be controlled for example, by laser irradiating position.
In embodiments, side coating 413 can be omitted, and pads component 900 and can contact with package substrate 200.
Figure 12 is to show the light-emitting component for being provided with display device 6 according to the cross-sectional view of the display device 6 of embodiment
150 viewing area and the non-display area for being provided with frit 360.Figure 13 is the amplification of the non-display area of the display device 6 of Figure 12
Cross-sectional view.
2 and Figure 13 referring to Fig.1, according to the display device 6 of current embodiment with according to the aobvious of the embodiment of Figure 10 etc.
Showing device 5 is the difference is that frit 360 has inclined surface, and the lower width W of frit 3601(for example, glass
Width W of the material 360 on 100 side of light transmissive substrate1) it is less than the upper width W of frit 3602(for example, frit 360 is served as a contrast in encapsulation
Width W on 200 side of bottom2)。
In embodiments, the average tilt angle θ of the inner surface 360a of frit 3601With the outside of frit 360
The average tilt angle θ of surface 360b2It can be different.For example, the average tilt angle of the inner surface 360a of frit 360
θ1With the average tilt angle θ of the outer surface 360b of frit 3602It can be 90 degree or bigger, but frit 360 is interior
The average tilt angle θ of side surface 360a1The average tilt angle θ of the outer surface 360b of frit 360 can be greater than2.Frit
The tilt angle theta of 360 inner surface 360a and outer surface 360b1And θ2It can be in fusing and curing glass feed composition or glass
Glass material is controlled during pasting, but the present disclosure is not limited to such cases.
In embodiments, side coating 413 can be omitted, and pads component 900 and can contact with package substrate 200.
Hereinafter, the method for the manufacture display device according to the disclosure will be described.Figure 14 is to show to Figure 23
According to the cross-sectional view of the method for the manufacture display device of embodiment.
Firstly, referring to Fig.1 4, preparation includes base portion 110, thin film transistor (TFT) 120, light-emitting component 150 and protective layer 170
Light transmissive substrate 100.Since the element of light transmissive substrate 100 is described above, its redundancy description is omitted.
Then, referring to Fig.1 5, it is handled with surface of the fluorine to package substrate 200.With fluorine to the first of package substrate 200
Surface (lower surface in Figure 15) and second surface (upper surface in Figure 15) are handled in the first table of package substrate 200
Fluorin radical (- F) is formed on face and second surface.In some embodiments, also can be used fluorine to the side surface of package substrate 200 into
Row processing.
Then, referring to Fig.1 6, preparing has the lower coating 411 and upper coating formed on at least a part of the surface thereof
412 package substrate 200.
In embodiments, preparation has the package substrate 200 of lower coating 411 and upper coating 412 can include: serves as a contrast in encapsulation
Lower coating 411 is formed on the first surface (lower surface in Figure 15) of the fluoro-containing group at bottom 200；In the fluorine-containing of package substrate 200
Upper coating 412 is formed on the second surface (upper surface in Figure 15) of group；And to lower coating 411 and upper coating 412
Package substrate 200 washed and dried.
Form lower coating 411 can include: autoregistration has autoregistration property or self assembly directly in package substrate 200
The individual molecule of matter.In embodiments, lower coating 411 can be for by with intramolecular *-(OCH2CH2)n- OH structure or molecule
Interior *-(OCH2CH2)-OH structure compound autoregistration and the coating that is formed.Since above compound is described above, because
This omits its redundancy description.
In addition, forming upper coating 412 can include: directly in package substrate 200 autoregistration have autoregistration property or from
Assemble the individual molecule of property.Upper coating 412 may include compound identical with lower coating 411, and therefore omit its redundancy
Description.In some embodiments, lower coating 411 and upper coating 412 can be synchronously imposed by single technique.
Washing and the dry package substrate 200 with lower coating 411 and upper coating 412 can include: using distilled water or go
Ionized water wash and washed package substrate 200 is dried using air knife to package substrate 200.Passing through water
During medium is washed, the lower coating 411 being substantially insoluble in and upper coating 412 can be made to stablize.That is, by
It is washed after coating 411 and upper coating 412 under in package substrate 200 being formed in package substrate 200, therefore under can making
Coating 411 and upper coating 412 are firmer.
Then, referring to Fig.1 7, glass frit compositions 310' and filler compositions 510' is set simultaneously on light transmissive substrate 100
It is heat-treated.
It can be the operation being applied to glass frit compositions 310' on light transmissive substrate 100 that glass frit compositions 310', which is arranged,.
Method of application is not particularly limited, still, for example, silk-screen printing can be used.Glass frit compositions 310' can be along light transmissive substrate
100 edge is arranged to the belt shape of substantially quadrangle.Glass frit compositions 310' may include vanadium oxide and further include pottery
Porcelain filler or organic material, and can be paste state or gel state.
The heat treatment of glass frit compositions 310' can be for by toasting with by paste state glass frit compositions 310'
Or the glass frit compositions 310' precuring of gel state is at the operation of solid state.Pass through the glass of heat treatment precuring or baking
Glass feed composition 310' can be temporarily fixed on light transmissive substrate 100 with substantially solid state.In this operation, frit group
The organic material closed in object 310' can be removed by deterioration, but the present disclosure is not limited to such cases.In addition, filler group
The heat treatment for closing object 510' can be for the cured operation of filler compositions 510' progress.Glass frit compositions 310' and filler
The heat treatment temperature of composition 510' can be about 300 DEG C to about 500 DEG C or about 350 DEG C to about 450 DEG C.In addition, can be in nitrogen atmosphere
Lower execution heat treatment operation.
In Figure 17, glass frit compositions 310' and filler compositions 510' are arranged on light transmissive substrate 100 and with hot
It is handled.However, the present disclosure is not limited to such cases.In embodiments, glass frit compositions 310' and/or filler group
Closing object 510' may be provided on package substrate (not shown).
In embodiments, the setting of filler compositions 510', and available such as nitrogen (N can be omitted2) inertia
Gas fills the space surrounded by light transmissive substrate 100, package substrate 200 and the frit 310 that will be described later.
Then, referring to Fig.1 8, frit 310 is formed between light transmissive substrate 100 and package substrate 200, is served as a contrast luminous
Bottom 100 is combined together with package substrate 200.In embodiments, frit 310 is formed can include: alignment light transmissive substrate 100
With package substrate 200；And frit 310 is formed by melting and solidifying thermally treated glass frit compositions 310'.
Light transmissive substrate 100 and package substrate 200 to will definitely be to be aligned to light transmissive substrate 100 and package substrate 200
So that the behaviour Chong Die with lower coating 411 and upper coating 412 by the glass frit compositions 310' of heat treatment precuring or baking
Make.
In addition, melting and solidifying thermally treated glass frit compositions 310' can include: being irradiated to laser L by heat
Manage the glass frit compositions 310' of precuring or baking.The laser L for being irradiated to thermally treated glass frit compositions 310' is fusible
Change glass frit compositions 310'.After with laser L irradiation the glass frit compositions 310' that melts can be cured or resolidification with
Form frit 310.Laser L sequentially can be irradiated to frit group via upper coating 412, package substrate 200 and lower coating 411
Close object 310'.
Frit 310 can connect with the first insulating layer 131 and second insulating layer 133 and lower coating 411 of light transmissive substrate 100
Touching is to form combination interface.As described above, the lower coating 411 between package substrate 200 and frit 310 can help to improve envelope
Bond strength between fitted lining bottom 200 and frit 310.
Laser L can have the wavelength of about 760nm to about 860nm or about 780nm to about 830nm.In glass frit compositions
310' is arranged in the substantially embodiment of the belt shape of quadrangle, and laser L can be faced along because of precuring or baking
When fixed glass frit compositions 310' shape it is mobile while be irradiated.The Energy distribution of laser L can have pancake
Shape, rather than Gaussian Profile, but the present disclosure is not limited to such cases.
In some embodiments, after light transmissive substrate 100 and package substrate 200 are combined together, encapsulation can be made to serve as a contrast
The side surface exposure at bottom 200.
Then, referring to Fig.1 9, side coating 413 is formed on the side surface of package substrate 200.Forming side coating 413 can wrap
Include: autoregistration has the individual molecule of autoregistration property or self-assembly property directly on the side surface of package substrate 200.Side applies
Layer 413 may include compound identical with lower coating 411 and upper coating 412, that is, have intramolecular *-(OCH2CH2)n- OH structure
Or intramolecular *-(OCH2CH2)-OH structure compound.Therefore, the redundancy description of the compound of side coating 413 is omitted.
In some embodiments, after forming side coating 413, the method for manufacturing display device may also include that part
Ground washing and dry combined light transmissive substrate 100 and package substrate 200.Washing and dry light transmissive substrate 100 and encapsulation
Substrate 200 can include: light transmissive substrate 100 and package substrate 200 are washed using distilled water or deionized water, and used
Light transmissive substrate 100 and package substrate 200 is dried in air knife.
Then, referring to Figure 20, building blocks of function 600 is formed in package substrate 200, and serve as a contrast in building blocks of function 600 and encapsulation
The first binder course 530 is planted between bottom 200.Since the first binder course 530 and building blocks of function 600 is described above, save
Slightly its redundancy description.
Then, referring to Figure 21, cover glass 700 is formed on building blocks of function 600, and in cover glass 700 and building blocks of function 600
Between plant the second binder course 550.Since the second binder course 550 and cover glass 700 is described above, its redundancy is omitted
Description.
Referring to Figure 22, pad component 900 is formed.Pad component 900 may be provided on the side surface of package substrate 200.For example, pad
Component 900 can be with side coating 413, the first binder course 530, building blocks of function 600, the second binder course 550 and at least portion of cover glass 700
Divide ground contact.Since pad component 900 is described above, its redundancy description is omitted.
Referring to Figure 23, light transmissive substrate 100 and package substrate 200 are inserted into shell 800.Since shell is described above
Body 800, therefore omit its redundancy description.
According to embodiment, the coating that can improve bond strength is plugged between package substrate or glass and frit,
To improve the bond strength between package substrate or glass and frit.Therefore, it is possible to provide with improved durability and can
By the display device of property.
However, the unlimited effect documented in this article of the effect of embodiment.By referring to claims, embodiment party
Above and other effect of formula will become more fully apparent embodiment person of an ordinary skill in the technical field.
Claims (20)
1. display device, comprising:
Light transmissive substrate, the light transmissive substrate include the light-emitting component of base portion and setting on the base portion；
Package substrate, the package substrate are arranged on the light transmissive substrate；
Frit, the frit around the light-emitting component and be arranged the light transmissive substrate and the package substrate it
Between；And
First coating, the first coating are arranged between the package substrate and the frit, and including with molecule
Interior *-(OCH2CH2)-OH structure compound, and at least partly contacted with the frit.
2. display device as described in claim 1, wherein the first coating be set up directly on the package substrate towards
On the first surface of the light transmissive substrate, and on the first surface of the package substrate contacted with the first coating
There are fluorin radical (- F).
3. display device as described in claim 1, wherein the first coating has alkalinity.
4. display device as described in claim 1, wherein the first coating is the self-aligned layer of the compound, and
The maximum gauge of the first coating is 10 μm or smaller.
5. display device as described in claim 1, wherein the first coating and the light-emitting component and the frit weight
It is folded.
6. display device as claimed in claim 5, wherein the average thickness of the first coating Chong Die with the light-emitting component
Degree is greater than the average thickness of the first coating Chong Die with the frit.
7. display device as described in claim 1, wherein at least part of the frit connects with the package substrate
Touching.
8. display device as claimed in claim 7, wherein in the plan view, the center portion of the upper surface of the frit
It is contacted with the package substrate.
9. display device as claimed in claim 8, wherein the frit has the side being located at where the light-emitting component
On inner surface and the outer surface opposite with the inner surface, wherein the upper surface and institute by the frit
The inner edge portion for stating inner surface formation is contacted with the first coating, and by the upper surface of the frit and institute
The outer edge part for stating outer surface formation is contacted with the package substrate.
10. display device as claimed in claim 9, wherein the frit is on the side where the light transmissive substrate
Width is of different size on the side where the package substrate with the frit, and the inside of the frit
The average tilt angle on surface and the average tilt angle of the outer surface of the frit are different.
11. display device as described in claim 1, further includes:
Second coating, the second coating are arranged on the second surface of the package substrate and are self-aligned layer, and described
Two surfaces deviate from the light transmissive substrate.
12. display device as claimed in claim 11, wherein the second coating is set up directly on the institute of the package substrate
It states on second surface, it is Chong Die with the light-emitting component and the frit, and including chemical combination identical with the first coating
Object.
13. display device as claimed in claim 11, further includes:
Building blocks of function, the building blocks of function are arranged in the second coating and including polarizer or touch sensitive elements；
And
Binder course, the binder course be arranged between the second coating and the building blocks of function and with the second coating and
The building blocks of function contact.
14. display device as claimed in claim 13, further includes:
Third coating, the third coating are set up directly on the side surface of the package substrate and are with intramolecular *-
(OCH2CH2)-OH structure compound self-aligned layer.
15. display device as claimed in claim 14, further includes:
Cover glass, the cover glass are arranged on the building blocks of function；
Shell, the shell, which accommodates the light transmissive substrate and the package substrate and has, covers the described of the package substrate
The sidewall sections of side surface；And
Component is padded, the pad component is arranged between the third coating and the sidewall sections of the shell and includes
Machine material,
Wherein, the pad component is contacted with the third coating, the binder course, the building blocks of function and the cover glass.
16. glass stacks, comprising:
First glass workpiece；
Second glass workpiece, second glass workpiece are arranged on first glass workpiece；And
Coating, the coating are plugged between first glass workpiece and second glass workpiece, with first glass workpiece and
The second glass workpiece contact, and including with intramolecular *-(OCH2CH2)-OH structure compound.
17. the method for manufacturing display device, which comprises
Light transmissive substrate is prepared, the light transmissive substrate includes the light-emitting component of base portion and setting on the base portion；
Package substrate is prepared, coating is formed in at least part on the surface of the package substrate, the coating includes having
Intramolecular *-(OCH2CH2)-OH structure compound；
Between the light transmissive substrate and the package substrate formed for by the light transmissive substrate in conjunction with the package substrate
Frit together, at least partly to be contacted with the coating being formed in the package substrate.
18. method as claimed in claim 17, wherein the coating includes:
First coating, the first coating are arranged on the first surface towards the light transmissive substrate of the package substrate；With
And
Second coating, the second coating be arranged in the package substrate on the second surface of the light transmissive substrate, with
And
Preparing the package substrate with the coating includes:
The first surface of the package substrate and the second surface are handled with fluorine；
By directly on the first surface of the package substrate compound described in autoregistration form the first coating；
By directly on the second surface of the package substrate compound described in autoregistration form the second coating；
And
The package substrate with the first coating and the second coating is washed and dried.
19. method as claimed in claim 17, wherein forming the frit includes:
Glass frit compositions are set on the light transmissive substrate；
The glass frit compositions are handled with heat；
It is directed at the package substrate, so that the thermally treated glass frit compositions overlap each other with the coating；And
The thermally treated frit is melted and solidified by irradiating laser to the thermally treated glass frit compositions
Composition,
Wherein, the coating includes:
First coating, the first coating are formed on the first surface towards the light transmissive substrate of the package substrate；With
And
Second coating, the second coating are formed on the second surface of the package substrate, and the second surface is away from described
Light transmissive substrate, and
Irradiating the laser includes:
The laser is irradiated so that the laser is sequentially applied through the second coating, the package substrate and described first
Layer.
20. method as claimed in claim 17, after forming the frit, further includes:
Third coating is formed on the side surface of the package substrate, wherein the third coating includes having intramolecular *-
(OCH2CH2)-OH structure compound；
Building blocks of function including polarizer or touch sensitive elements is placed on the lining of the encapsulation with the third coating
On bottom；
Cover glass is placed on the building blocks of function；And
On the third coating by include organic material pad component be positioned to the third coating, the building blocks of function and
The cover glass contact.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020180039066A KR102588308B1 (en) | 2018-04-04 | 2018-04-04 | Display device, manufacturing method of the same and glass stack |
| KR10-2018-0039066 | 2018-04-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110350099A true CN110350099A (en) | 2019-10-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910270204.XA Pending CN110350099A (en) | 2018-04-04 | 2019-04-04 | Display device, the method for manufacturing display device and glass stack |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US11114021B2 (en) |
| EP (1) | EP3550628B1 (en) |
| KR (1) | KR102588308B1 (en) |
| CN (1) | CN110350099A (en) |
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| US6887577B1 (en) * | 1999-08-16 | 2005-05-03 | Ht Troplast Ag | Compound safety glass and PVB foil for the production thereof |
| EP1814178A2 (en) * | 2006-01-25 | 2007-08-01 | Samsung SDI Co., Ltd. | Organic light-emitting display with frit seal and reinforcing structure bonded to frame |
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| WO2018038303A1 (en) * | 2016-08-24 | 2018-03-01 | 주식회사 베이스 | Organic light emitting display device and sealing method therefor |
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| US6808606B2 (en) * | 1999-05-03 | 2004-10-26 | Guardian Industries Corp. | Method of manufacturing window using ion beam milling of glass substrate(s) |
| TW517356B (en) * | 2001-10-09 | 2003-01-11 | Delta Optoelectronics Inc | Package structure of display device and its packaging method |
| KR100685812B1 (en) | 2005-01-05 | 2007-02-22 | 삼성에스디아이 주식회사 | OLED and fabricating method of the same |
| US8716850B2 (en) | 2007-05-18 | 2014-05-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| KR20090111151A (en) * | 2008-04-21 | 2009-10-26 | 삼성전자주식회사 | Organic light emitting display apparatus and method of manufacturing the same |
| MY159533A (en) | 2009-01-02 | 2017-01-13 | Univ Putra Malaysia | Porous bioceramic composition for bone repair |
| KR101084179B1 (en) * | 2009-12-28 | 2011-11-17 | 삼성모바일디스플레이주식회사 | Method for encapsulation of organic light emitting display device |
| KR102060061B1 (en) | 2013-04-29 | 2019-12-30 | 삼성디스플레이 주식회사 | Organic light emitting display apparatus and method of manufacturing the same |
| KR102561113B1 (en) * | 2015-08-13 | 2023-07-28 | 삼성디스플레이 주식회사 | Organic light emitting diode display device and manufacturing method thereof |
| CN107634155B (en) * | 2017-09-22 | 2019-02-22 | 京东方科技集团股份有限公司 | Packaging method, encapsulating structure and the display device of oled display substrate |
-
2018
- 2018-04-04 KR KR1020180039066A patent/KR102588308B1/en active IP Right Grant
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2019
- 2019-04-03 US US16/374,164 patent/US11114021B2/en active Active
- 2019-04-03 EP EP19167021.5A patent/EP3550628B1/en active Active
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6887577B1 (en) * | 1999-08-16 | 2005-05-03 | Ht Troplast Ag | Compound safety glass and PVB foil for the production thereof |
| EP1814178A2 (en) * | 2006-01-25 | 2007-08-01 | Samsung SDI Co., Ltd. | Organic light-emitting display with frit seal and reinforcing structure bonded to frame |
| US20090206739A1 (en) * | 2008-02-18 | 2009-08-20 | Samsung Electronics Co., Ltd. | Organic light-emitting diode display device and method of manufacturing the same |
| WO2018038303A1 (en) * | 2016-08-24 | 2018-03-01 | 주식회사 베이스 | Organic light emitting display device and sealing method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| US11114021B2 (en) | 2021-09-07 |
| KR102588308B1 (en) | 2023-10-12 |
| EP3550628A1 (en) | 2019-10-09 |
| KR20190116605A (en) | 2019-10-15 |
| US20190311671A1 (en) | 2019-10-10 |
| EP3550628B1 (en) | 2022-03-09 |
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