CN110337219B - Ionic wind heat dissipation device and method thereof - Google Patents
Ionic wind heat dissipation device and method thereof Download PDFInfo
- Publication number
- CN110337219B CN110337219B CN201910508392.5A CN201910508392A CN110337219B CN 110337219 B CN110337219 B CN 110337219B CN 201910508392 A CN201910508392 A CN 201910508392A CN 110337219 B CN110337219 B CN 110337219B
- Authority
- CN
- China
- Prior art keywords
- microstructure
- electrode
- ion wind
- voltage electrode
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
The device comprises a substrate and an ion wind generation module, wherein the substrate comprises an upper surface and a lower surface which is used for being attached to an object to be cooled; the ion wind generation module comprises at least one ion wind generation unit, the ion wind generation unit can be paved on the upper surface in a superposed mode, the ion wind generation unit comprises a microstructure high-voltage electrode and a microstructure grounding electrode, the bottom surface of the microstructure high-voltage electrode is paved on the upper surface in a flatwise mode, the microstructure high-voltage electrode is powered through a high-voltage power supply, the microstructure grounding electrode is grounded, the microstructure grounding electrode and the microstructure high-voltage electrode are arranged oppositely to form an ion air duct therebetween, the microstructure grounding electrode is located on the downstream side of the ion air duct relative to the microstructure high-voltage electrode, and the sizes of the bottom surfaces of the microstructure high-voltage electrode and the microstructure grounding electrode are far larger than those of.
Description
Technical Field
The invention relates to the technical field of electronic equipment heat dissipation, in particular to an ion wind heat dissipation device and a method thereof.
Background
With the development of the technology, the working capacity of electronic equipment is continuously improved, so that the heat generation is increased, but the miniaturization of the equipment scale greatly improves the power density of the electronic equipment, the cooling area is seriously reduced, and the high temperature has an important influence on the performance and the service life of an electronic device, so that the electronic cooling technology becomes an important factor for restricting the development of the electronic equipment.
The traditional heat dissipation mode is mainly a heat radiator combining a fan and a fin heat sink, and the fan is driven by the rotation of a motor to drive air and fins to exchange heat so as to achieve the heat dissipation effect. However, the mechanical heat dissipation method has the following disadvantages: firstly, noises are easy to generate, including pneumatic noise of air blown by a fan, electromagnetic noise of a motor, vibration noise of a structural part and the like, and the noises can cause certain influence on a user; secondly, a rotating part exists, and the reliability of the radiator is influenced due to abrasion in operation; thirdly, the heat dissipation effect is limited, if the heat dissipation effect is improved, the rotating speed of the fan is generally increased or the surface area of the fins is increased, but the increase of the rotating speed of the fan can increase heat generation and further influence the reliability of the heat generation, and the increase of the surface area of the fins can increase the volume and the manufacturing cost of the radiator; and fourthly, because the rotation component exists, the miniaturization cannot be realized, and the heat dissipation mode of the microelectronic device is still mainly a natural convection mode.
The above information disclosed in this background section is only for enhancement of understanding of the background of the invention and therefore it may contain information that does not form the prior art that is well known to those of ordinary skill in the art.
Disclosure of Invention
In view of the above problems, in order to change the existing heat dissipation method, the invention particularly adopts a microstructure type ion wind heat dissipation method which has a simple structure, is small and compact, has zero noise and good cooling effect to overcome the defects in the prior art and provide better heat dissipation effect.
The purpose of the invention is realized by the following technical scheme.
An ion wind heat dissipation device comprises a heat dissipation device,
the heat dissipation device comprises a substrate, a heat dissipation layer and a heat dissipation layer, wherein the substrate comprises an upper surface and a lower surface used for being attached to an object to be subjected to heat dissipation;
an ion wind generation module comprising at least one ion wind generation unit, the ion wind generation unit being overlappingly laid on the upper surface, the ion wind generation unit comprising,
a microstructure high voltage electrode, the bottom surface of which is tiled on the upper surface, the microstructure high voltage electrode is powered by a high voltage power supply,
the bottom surface of the microstructure grounding electrode is paved on the upper surface, the microstructure grounding electrode is grounded, the microstructure grounding electrode and the microstructure high-voltage electrode are oppositely arranged to form an ion air channel therebetween, the microstructure grounding electrode is located at the position of the downstream side of the ion air channel relative to the microstructure high-voltage electrode, and the sizes of the bottom surfaces of the microstructure high-voltage electrode and the microstructure grounding electrode are respectively far larger than those of other surfaces.
In the ion wind heat dissipation device, the microstructure high-voltage electrode is in a shape with a variable distance from the microstructure grounding electrode.
In the ion wind heat dissipation device, the distance between the microstructure grounding electrode of the ion wind generation unit and the microstructure high-voltage electrode is smaller than the distance between the adjacent ion wind generation units.
In the ion wind heat dissipation device, the distance between the microstructure grounding electrode and the microstructure high-voltage electrode which are oppositely arranged is 1-100 μm, and the size of the distance is negatively related to the wind speed of the ion wind channel.
In the ion wind heat dissipation device, the substrate is a plate-shaped structure made of an insulating material, and the upper surface is attached with a silicon layer which comprises an oxide layer.
In the ion wind heat dissipation device, the microstructure high-voltage electrode and/or the microstructure grounding electrode comprise any one of the following components and combinations thereof: metal chromium, metal copper, metal aluminum, metal titanium, metal nickel, metal silver, copper nickel alloy, indium tin oxide, and the microstructure high voltage electrode and/or the microstructure ground electrode are deposited on the upper surface of the substrate by physical vapor deposition or chemical vapor deposition.
In the ion wind heat dissipation device, the ion wind channel is close to and parallel to the upper surface.
In the ion wind heat dissipation device, the ion wind generation module comprises a plurality of ion wind generation units superposed on the upper surface, and the directions of ion wind channels generated by the ion wind generation units are consistent.
In the ion wind heat dissipation device, the microstructure high-voltage electrode and/or the microstructure grounding electrode are/is a layered electrode parallel to the upper surface.
According to another aspect of the present invention, a heat dissipation method of the ion wind heat dissipation device includes the steps of,
the lower surface of the substrate is attached to an object to be radiated,
based on the heat dissipation capacity of an object to be dissipated, the distribution of a preset number of ion wind generating units on the upper surface and the space size between the microstructure high-voltage electrode and the microstructure grounding electrode of the ion wind generating units are set,
the bottom surface of the microstructure high-voltage electrode is paved on the upper surface, the microstructure high-voltage electrode is powered by a high-voltage power supply, the bottom surface of the microstructure grounding electrode is paved on the upper surface, the microstructure grounding electrode is grounded, and the microstructure grounding electrode and the microstructure high-voltage electrode are oppositely arranged to form an ion air channel therebetween.
Compared with the prior art, the invention has the beneficial effects that:
1. the arrangement of the single-stage ion wind generating unit can be flexibly adjusted by a superposition mode so as to adapt to different working requirements, particularly to a small and compact environment;
2. simple structure and no noise in operation.
3. The volume is small, and the heat dissipation device can be used for heat dissipation of microelectronic devices.
The above description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly apparent, and to make the implementation of the content of the description possible for those skilled in the art, and to make the above and other objects, features and advantages of the present invention more obvious, the following description is given by way of example of the specific embodiments of the present invention.
Drawings
Various other advantages and benefits of the present invention will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. It is obvious that the drawings described below are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. Also, like parts are designated by like reference numerals throughout the drawings.
In the drawings:
FIG. 1 is a schematic structural view of an ion wind heat sink according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of an ion wind heat sink according to another embodiment of the present invention;
FIG. 3 is a schematic structural diagram of an ion wind heat sink according to another embodiment of the present invention;
FIG. 4 is a schematic structural diagram of an ion wind heat sink according to another embodiment of the present invention;
FIG. 5 is a schematic structural diagram of an ion wind heat sink according to another embodiment of the present invention;
fig. 6(a) to 6(b) are schematic structural views of an ion wind heat sink according to another embodiment of the present invention;
FIG. 7 is a schematic structural diagram of an ion wind heat sink according to another embodiment of the present invention;
FIG. 8 is a schematic structural diagram of an ion wind heat sink according to another embodiment of the present invention;
fig. 9 is a schematic step diagram of a heat dissipation method according to an embodiment of the invention.
The invention is further explained below with reference to the figures and examples.
Detailed Description
Specific embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While specific embodiments of the invention are shown in the drawings, it should be understood that the invention may be embodied in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
It should be noted that certain terms are used throughout the description and claims to refer to particular components. As one skilled in the art will appreciate, various names may be used to refer to a component. This specification and claims do not intend to distinguish between components that differ in name but not function. In the following description and in the claims, the terms "include" and "comprise" are used in an open-ended fashion, and thus should be interpreted to mean "include, but not limited to. The description which follows is a preferred embodiment of the invention, but is made for the purpose of illustrating the general principles of the invention and not for the purpose of limiting the scope of the invention. The scope of the present invention is defined by the appended claims.
For the purpose of facilitating understanding of the embodiments of the present invention, the following description will be made by taking specific embodiments as examples with reference to the accompanying drawings, and the drawings are not to be construed as limiting the embodiments of the present invention.
For better understanding, as shown in fig. 1 to 8, an ion wind heat dissipating apparatus includes,
the heat dissipation device comprises a substrate, a heat dissipation layer and a heat dissipation layer, wherein the substrate comprises an upper surface and a lower surface used for being attached to an object to be subjected to heat dissipation;
an ion wind generation module comprising at least one ion wind generation unit, the ion wind generation unit being overlappingly laid on the upper surface, the ion wind generation unit comprising,
a microstructure high voltage electrode, the bottom surface of which is tiled on the upper surface, the microstructure high voltage electrode is powered by a high voltage power supply,
the bottom surface of the microstructure grounding electrode is paved on the upper surface, the microstructure grounding electrode is grounded, the microstructure grounding electrode and the microstructure high-voltage electrode are oppositely arranged to form an ion air channel therebetween, the microstructure grounding electrode is located at the position of the downstream side of the ion air channel relative to the microstructure high-voltage electrode, and the sizes of the bottom surfaces of the microstructure high-voltage electrode and the microstructure grounding electrode are respectively far larger than those of other surfaces.
The invention generates ion wind through corona discharge to carry out convection heat dissipation on the substrate. According to the invention, the arrangement of the unipolar microstructure type ion wind generating unit can be flexibly adjusted in a superposition mode so as to adapt to different working requirements.
In a preferred embodiment of the ion wind heat dissipation device, the microstructure high-voltage electrode is in a shape with a variable distance from the microstructure ground electrode.
In a preferred embodiment of the ion wind heat dissipation device, a distance between a microstructure ground electrode of an ion wind generation unit and the microstructure high voltage electrode is smaller than a distance between adjacent ion wind generation units.
In a preferred embodiment of the ion wind heat dissipation device, the distance between the microstructure grounding electrode and the microstructure high-voltage electrode which are oppositely arranged is 1-100 μm, and the size of the distance is negatively related to the wind speed of the ion wind channel.
In a preferred embodiment of the ion wind heat sink, the substrate is a plate-shaped structure made of an insulating material, and the upper surface is attached with a silicon layer, which includes an oxide layer.
In a preferred embodiment of the ion wind heat dissipation device, the microstructure high voltage electrode and/or the microstructure ground electrode includes any one of the following components and combinations thereof: metal chromium, metal copper, metal aluminum, metal titanium, metal nickel, metal silver, copper nickel alloy, indium tin oxide, and the microstructure high voltage electrode and/or the microstructure ground electrode are deposited on the upper surface of the substrate by physical vapor deposition or chemical vapor deposition.
In a preferred embodiment of the ion wind heat sink, the ion wind channel is proximate to and parallel to the upper surface.
In a preferred embodiment of the ion wind heat sink, the ion wind generating module includes a plurality of ion wind generating units stacked on the upper surface, and the ion wind channels generated by the ion wind generating units have the same direction.
In a preferred embodiment of the ion wind heat dissipation device, the microstructure high-voltage electrode and/or the microstructure ground electrode are/is a layered electrode parallel to the upper surface.
For further understanding of the present invention, the technical solutions of the present disclosure will be described in detail below with reference to the accompanying drawings and examples. The drawings used in the following description are schematic drawings, and the dimensional ratios and the like in the drawings do not necessarily coincide with those in reality. In addition, in the following embodiment 2, the same reference numerals as those of the already described embodiment are used for the same or similar configurations as those of the already described embodiment, and illustration and description thereof may be omitted.
< embodiment 1 >
Fig. 1 is a perspective view schematically showing a microstructure-type ion wind heat sink 4 according to embodiment 1 of the present disclosure.
The micro-structure type ion wind heat dissipation device 4 comprises a micro-structure type ion wind generation module and a substrate 3; the micro-structural type ion wind generation module is formed by superposing a plurality of single-pole micro-structural type ion wind generation units.
The micro-structural type ion wind generation unit comprises a micro-structural high-voltage electrode 1 and a micro-structural grounding electrode 2.
When the microstructure type ion wind heat dissipation device 4 works, a high-voltage power supply supplies power to the microstructure high-voltage electrode 1, the microstructure grounding electrode 2 is grounded, and a strong electric field can be generated in the area between the microstructure high-voltage electrode 1 and the microstructure grounding electrode 2. Under the action of a strong electric field, air around the microstructure high-voltage electrode 1 is ionized into charged particles, the charged particles move towards the microstructure grounding electrode 2 under the action of the electric field, collide with neutral molecules in the moving process, transfer and transfer of charges and kinetic energy are generated, strong disturbance is generated on the flow of surrounding fluid, and therefore macroscopic gas motion is formed, and ionic wind is generated on the surface of the substrate 3 and the surface of the microstructure electrode.
The substrate 3 is formed in a flat plate shape having a constant thickness, for example, and has a 1 st main surface 3a and a 2 nd main surface 3b on the back surface thereof. The ion wind flows on the 1 st main surface 3a along the 1 st main surface 3a, and is convectively radiated. The 2 nd main surface 3b is bonded to the surface of an object to be cooled, and heat is dissipated by thermal conduction.
The substrate 3 is formed of an insulating material having a high thermal conductivity, such as silicon with an oxide layer attached to the surface.
The microstructure high-voltage electrode 1 and the microstructure grounding electrode 2 are both arranged on the 1 st main surface 3 a.
The microstructure high-voltage electrode 1 and the microstructure ground electrode 2 are formed in a layer shape (including a flat plate shape) having a constant thickness, for example. The planar shape of these electrodes may be an appropriate shape, and fig. 1 illustrates a case where a rectangle having sides parallel to the x direction and the y direction is used.
The microstructure high-voltage electrode 1 and the microstructure ground electrode 2 are formed of a conductive material such as a metal, and examples thereof include chromium, copper, aluminum, titanium, nickel, silver, a copper-nickel alloy, and Indium Tin Oxide (ITO). These electrodes may be deposited on the 1 st main face 3a of the substrate 3 by a physical vapor deposition technique or a chemical vapor deposition technique and formed by an appropriate micromachining process.
The dimensions and materials of the microstructure high-voltage electrode 1 and the microstructure ground electrode 2 may be the same as or different from each other.
The microstructure ground electrode 2 is located at a position downstream of the ion wind with respect to the microstructure high-voltage electrode 1.
The range of the electrode spacing of the single-pole micro-structural type ion wind generating unit is 1-100 mu m. The electrode spacing can be adjusted appropriately according to the space size and the heat dissipation requirement.
The distance between adjacent micro-structural type ion wind generating units is larger than the electrode distance in the micro-structural type ion wind generating units. When the microstructure type ion wind heat dissipation device 4 works, the electric field intensity in the microstructure type ion wind generation unit is larger than the electric field intensity between the adjacent microstructure type ion wind generation units, ion wind is generated in the microstructure type ion wind generation unit preferentially, and ion wind with the same direction is generated in the microstructure type ion wind heat dissipation device of the superposed multistage microstructure type ion wind generation unit.
The embodiment discloses the technical scheme of the invention, and the wind speed and the wind output of the microstructure type ionic wind heat dissipation device can be flexibly adjusted according to the heat dissipation requirement and the space condition by superposing the single-stage microstructure type ionic wind generation units in the wind output direction. For example: if the space is narrow, the microstructure type ion wind generating units with fewer stages can be arranged; if larger heat dissipation performance is required, the heat dissipation capacity of the substrate can be enhanced by reducing the electrode spacing of the single-pole micro-structure type ion wind generating unit and stacking more stages of micro-structure type ion wind generating units to improve the convection wind speed.
< embodiment 2 >
Fig. 2 is a perspective view schematically showing a microstructure-type ion wind heat sink 104 according to embodiment 2 of the present disclosure.
The microstructure-type ion wind heat sink 104 is different from the microstructure-type ion wind heat sink 4 of embodiment 1 only in the shape of the microstructure high voltage electrode. Specifically, the following is described.
The microstructure high-voltage electrode 101 is configured in a shape in which the distance from the microstructure ground electrode 2 changes. For example, the planar shape of the microstructure high voltage electrode 101 near the downstream side of the ion wind is saw-toothed, and thus the electrode pitch of the microstructure ion wind generating unit changes in the width direction (y direction).
In addition, the size and number of the saw-tooth structures of the microstructure high voltage electrode 101 can be adjusted according to the heat dissipation requirement.
As in embodiment 1, the shorter the distance between the microstructure high voltage electrode 101 and the microstructure ground electrode 2 is, the stronger the electric field between the microstructure high voltage electrode 101 and the microstructure ground electrode 2 is. As a result, the ion wind is accelerated more at a position near the top of the sawtooth electrode than at a position near the bottom of the sawtooth electrode.
As described above, according to embodiment 2, since the microstructure high-voltage electrode 101 is configured in a shape in which the distance from the microstructure ground electrode 2 is changed, it is possible to impart strength to the ion wind and change the distribution of the ion wind in the width direction (y direction) of the ion wind.
< embodiment 3 >
Fig. 3 is a perspective view schematically showing a microstructure-type ion wind heat sink 204 according to embodiment 3 of the present disclosure.
The microstructure-type ion wind heat sink 204 is different from the microstructure-type ion wind heat sink 4 of embodiment 1 only in the shapes of the microstructure high voltage electrode and the microstructure ground electrode. Specifically, the following is described.
The planar shapes of the microstructure high-voltage electrode 201 and the microstructure ground electrode 202 are formed into an arch shape. Further, the widths of the electrodes in the radial direction may be the same or may vary in the circumferential direction.
In addition, the widths of the microstructure high-voltage electrode 201 and the microstructure ground electrode 202 in the radial direction and the circumferential angles of the electrodes can be adjusted as appropriate according to the space size and the heat dissipation requirement.
As in embodiment 1, the high voltage power supply supplies power to the microstructure high voltage electrode 201, the microstructure ground electrode 202 is grounded, and a strong electric field is generated in the region between the microstructure high voltage electrode 201 and the microstructure ground electrode 202, so that an ion wind flowing radially and outwardly is generated on the first main surface 3a of the substrate 3 and the surface of the microstructure electrode.
As described above, according to embodiment 3, since the generated ion wind flows outward in the radial direction from the center of the circle, it is possible to perform more efficient heat dissipation at the center of the circle.
< embodiment 4 >
Fig. 4 is a perspective view schematically showing a microstructure-type ion wind heat sink 304 according to embodiment 4 of the present disclosure.
The microstructure-type ion wind heat sink 304 is different from the microstructure-type ion wind heat sink 4 of embodiment 1 only in the shape of the microstructure high voltage electrode. Specifically, the following is described.
The microstructure high-voltage electrode 301 is configured in a shape in which the distance from the microstructure ground electrode 2 changes. For example, the planar shape of the microstructure high voltage electrode 301 near the downstream side of the ion wind is finger-shaped, and thus the electrode pitch of the microstructure ion wind generating unit changes in the width direction (y direction).
In addition, the size and number of the finger electrodes can be adjusted according to the heat dissipation requirement.
As in embodiment 2, the ion wind is accelerated more at a position near the top of the finger electrode than at a position near the bottom of the finger electrode.
As described above, according to embodiment 4, as in embodiment 2, the intensity of the ion wind can be imparted and the distribution of the ion wind can be changed in the width direction (y direction) of the ion wind.
< embodiment 5 >
Fig. 5 is a perspective view schematically showing a microstructure-type ion wind heat sink 404 according to embodiment 5 of the present disclosure.
The microstructure-type ion wind heat sink 404 is different from the microstructure-type ion wind heat sink 4 of embodiment 1 only in the shapes of the microstructure high voltage electrode and the microstructure ground electrode. Specifically, the following is described.
The planar shapes of the microstructured high voltage electrode 401 and the microstructured ground electrode 402 are configured as fingers. The curvature of the end of the microstructured high voltage electrode 401 may be the same as or different from the curvature of the end of the microstructured ground electrode 402.
In addition, the electrodes are all finger-shaped electrodes, and compared with the micro-structured ion wind heat sinks according to embodiments 1 and 4, the micro-structured ion wind heat sink 404 has a more non-uniform electric field, and thus can generate ion wind with different distribution rules.
As in embodiment 1, the high voltage power supply supplies power to the microstructure high voltage electrode 401, the microstructure ground electrode 402 is grounded, and a strong electric field is generated in the region between the microstructure high voltage electrode 401 and the microstructure ground electrode 402, thereby generating ion wind in the same direction on the first main surface 3a of the substrate 3 and the microstructure electrode surface.
As described above, according to embodiment 5, since the microstructure high voltage electrode 401 and the microstructure ground electrode 402 both use finger electrodes, ion wind with different distribution laws can be generated.
< embodiment 6 >
Fig. 6(a) is a perspective view schematically showing a microstructure-type ion wind heat sink 504 according to embodiment 6 of the present disclosure, and fig. 6(b) is a top view schematically showing the microstructure-type ion wind heat sink 504 according to embodiment 6 of the present disclosure.
The microstructure-type ion wind heat sink 504 is different from the microstructure-type ion wind heat sink 4 of embodiment 1 only in the arrangement of the microstructure high voltage electrode and the microstructure ground electrode. Specifically, the following is described.
The microstructure high-voltage electrode 501 and the microstructure ground electrode 502 are arranged in a V shape at a certain angle with the length direction (x direction). The width of these electrodes may be the same or may vary in the width direction (y direction).
In addition, the angle can be properly adjusted according to the space size and the heat dissipation requirement.
As in embodiment 1, the high voltage power supply supplies power to the microstructure high voltage electrode 501, the microstructure ground electrode 502 is grounded, and a strong electric field is generated in the region between the microstructure high voltage electrode 501 and the microstructure ground electrode 502, so that an ion wind in a V-shaped arrangement is generated on the first main surface 3a of the substrate 3 and the surface of the microstructure electrode.
As described above, according to embodiment 6, since the microstructure high voltage electrode 501 and the microstructure ground electrode 502 are arranged in the V shape, ion wind arranged in the V shape can be generated, and the ion wind for heat exchange can flow out of the apparatus more quickly, so that heat can be dissipated more efficiently from the center.
< embodiment 7 >
Fig. 7 is a perspective view schematically showing a microstructure-type ion wind heat sink 604 according to embodiment 7 of the present disclosure.
The microstructure-type ion wind heat sink 604 is different from the microstructure-type ion wind heat sink 4 of embodiment 1 only in the shapes of the microstructure high voltage electrode and the microstructure ground electrode. Specifically, the following is described.
The planar shapes of the microstructure high-voltage electrode 601 and the microstructure ground electrode 602 are zigzag. The width of these electrodes may be the same or may vary in the width direction (y direction).
In addition, the sizes of the saw teeth of the microstructure high voltage electrode 601 and the microstructure ground electrode 602 may be the same or different.
In addition, the electrodes are all saw-tooth electrodes, and compared with the micro-structured ion wind heat sink according to embodiment 1, the micro-structured ion wind heat sink 604 has a more non-uniform electric field, and thus can generate ion wind with different distribution rules.
As in embodiment 2, the size and number of the zigzag structure of the electrode can be appropriately adjusted according to the heat dissipation requirement.
As in embodiment 1, the high voltage power supply supplies power to the microstructure high voltage electrode 601, the microstructure ground electrode 602 is grounded, and a strong electric field is generated in a region between the microstructure high voltage electrode 601 and the microstructure ground electrode 602, thereby generating an ion wind alternately changing in the width direction (y direction) on the first main surface 3a of the substrate 3 and the microstructure electrode surface.
As described above, according to embodiment 7, since the microstructure high voltage electrode 601 and the microstructure ground electrode 602 both use the saw-toothed electrodes, it is possible to generate ion wind having different distribution regularity and alternately changing in the width direction (y direction).
< embodiment 8 >
Fig. 8 is a perspective view schematically showing a microstructure-type ion wind heat sink 704 according to embodiment 8 of the present disclosure.
The microstructure-type ion wind heat sink 704 is different from the microstructure-type ion wind heat sink 4 of embodiment 1 only in the shapes of the microstructure high voltage electrode and the microstructure ground electrode. Specifically, the following is described.
The planar shapes of the microstructure high-voltage electrode 701 and the microstructure ground electrode 702 are formed in a wave shape. The width of these electrodes may be the same or may vary in the width direction (y direction).
In addition, the sizes of the wavy structures of the microstructure high-voltage electrode 701 and the microstructure ground electrode 702 may be the same or different.
In addition, the electrodes are all wave-shaped electrodes, and compared with the micro-structured ion wind heat sink according to embodiment 1, the micro-structured ion wind heat sink 604 has a more non-uniform electric field, so that ion wind with different distribution rules can be generated.
As in embodiment 2, the size and number of the wave structures of the electrodes may be appropriately adjusted according to the heat dissipation requirements.
As in embodiment 1, the high voltage power supply supplies power to the microstructure high voltage electrode 701, the microstructure ground electrode 702 is grounded, and a strong electric field is generated in a region between the microstructure high voltage electrode 701 and the microstructure ground electrode 702, thereby generating an ion wind periodically changing in the width direction (y direction) on the first main surface 3a of the substrate 3 and the microstructure electrode surface.
As described above, according to embodiment 8, since both the microstructure high voltage electrode 701 and the microstructure ground electrode 702 employ the wavy electrode, ion wind having different distribution laws and periodically changing in the width direction (y direction) can be generated.
As shown in fig. 9, a heat dissipation method of the ion wind heat dissipation device includes the following steps,
the lower surface of the substrate is attached to an object to be radiated,
based on the heat dissipation capacity of an object to be dissipated, the distribution of a preset number of ion wind generating units on the upper surface and the space size between the microstructure high-voltage electrode and the microstructure grounding electrode of the ion wind generating units are set,
the bottom surface of the microstructure high-voltage electrode is paved on the upper surface, the microstructure high-voltage electrode is powered by a high-voltage power supply, the bottom surface of the microstructure grounding electrode is paved on the upper surface, the microstructure grounding electrode is grounded, and the microstructure grounding electrode and the microstructure high-voltage electrode are oppositely arranged to form an ion air channel therebetween.
Industrial applicability
The ion wind heat dissipation device and the method thereof can be manufactured and used in the field of heat dissipation of tiny equipment.
The foregoing describes the general principles of the present application in conjunction with specific embodiments, however, it is noted that the advantages, effects, etc. mentioned in the present application are merely examples and are not limiting, and they should not be considered essential to the various embodiments of the present application. Furthermore, the foregoing disclosure of specific details is for the purpose of illustration and description and is not intended to be limiting, since the foregoing disclosure is not intended to be exhaustive or to limit the disclosure to the precise details disclosed.
The foregoing description has been presented for purposes of illustration and description. Furthermore, the description is not intended to limit embodiments of the application to the form disclosed herein. While a number of example aspects and embodiments have been discussed above, those of skill in the art will recognize certain variations, modifications, alterations, additions and sub-combinations thereof.
Claims (5)
1. An ion wind heat dissipation device, which comprises,
the heat dissipation device comprises a substrate, a heat dissipation layer and a heat dissipation layer, wherein the substrate comprises an upper surface and a lower surface used for being attached to an object to be subjected to heat dissipation;
an ion wind generation module comprising at least one ion wind generation unit, the ion wind generation unit being overlappingly laid on the upper surface, the ion wind generation unit comprising,
the bottom surface of the microstructure high-voltage electrode is paved on the upper surface, the microstructure high-voltage electrode is powered by a high-voltage power supply, the microstructure high-voltage electrode is in a shape of changing the distance between the microstructure high-voltage electrode and the microstructure grounding electrode,
the bottom surface of the microstructure grounding electrode is paved on the upper surface, the microstructure grounding electrode is grounded, the microstructure grounding electrode and the microstructure high-voltage electrode are oppositely arranged to form an ion air channel therebetween, the microstructure grounding electrode is located at the position of the downstream side of the ion air channel relative to the microstructure high-voltage electrode, the size of the bottom surface of the microstructure high-voltage electrode is far larger than the sizes of other surfaces of the microstructure grounding electrode, the size of the bottom surface of the microstructure grounding electrode is far larger than the sizes of other surfaces of the microstructure grounding electrode, the microstructure high-voltage electrode and/or the microstructure grounding electrode are/is respectively a layered electrode parallel to the upper surface, the ion air channel is close to and parallel to the upper surface, and the distance between the microstructure grounding electrode and the microstructure high-voltage electrode of the ion wind generating unit is, the sizes and materials of the microstructure high-voltage electrode and the microstructure grounding electrode are different from each other, the distance between the microstructure grounding electrode and the microstructure high-voltage electrode which are oppositely arranged is 1-100 mu m, and the size of the distance is negatively related to the wind speed of the ion air duct.
2. The ionic wind heat sink of claim 1, wherein the substrate is a plate-like structure made of an insulating material, and the upper surface is attached with a silicon layer, wherein the silicon layer comprises an oxide layer.
3. The ionic wind heat sink of claim 1, wherein the microstructured high voltage electrode and/or the microstructured ground electrode comprises any one of, and combinations of: metal chromium, metal copper, metal aluminum, metal titanium, metal nickel, metal silver, copper nickel alloy, indium tin oxide, and the microstructure high voltage electrode and/or the microstructure ground electrode are deposited on the upper surface of the substrate by physical vapor deposition or chemical vapor deposition.
4. The ionic wind heat sink according to claim 1, wherein the ionic wind generating module comprises a plurality of ionic wind generating units stacked on the upper surface, and the ionic wind generating units generate ionic wind channels with consistent directions.
5. A method for dissipating heat from an ion wind heat dissipating device according to any one of claims 1 to 4, comprising the steps of,
the lower surface of the substrate is attached to an object to be radiated,
based on the heat dissipation capacity of an object to be dissipated, the distribution of a preset number of ion wind generating units on the upper surface and the space size between the microstructure high-voltage electrode and the microstructure grounding electrode of the ion wind generating units are set,
the bottom surface of the microstructure high-voltage electrode is paved on the upper surface, the microstructure high-voltage electrode is powered by a high-voltage power supply, the bottom surface of the microstructure grounding electrode is paved on the upper surface, the microstructure grounding electrode is grounded, and the microstructure grounding electrode and the microstructure high-voltage electrode are oppositely arranged to form an ion air channel therebetween.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910508392.5A CN110337219B (en) | 2019-06-12 | 2019-06-12 | Ionic wind heat dissipation device and method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910508392.5A CN110337219B (en) | 2019-06-12 | 2019-06-12 | Ionic wind heat dissipation device and method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110337219A CN110337219A (en) | 2019-10-15 |
| CN110337219B true CN110337219B (en) | 2021-02-26 |
Family
ID=68140600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910508392.5A Active CN110337219B (en) | 2019-06-12 | 2019-06-12 | Ionic wind heat dissipation device and method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110337219B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112153853B (en) * | 2019-06-26 | 2023-03-14 | 中兴通讯股份有限公司 | Ionic wind heat dissipation device |
| CN114114878B (en) * | 2021-12-13 | 2023-06-09 | 维沃移动通信有限公司 | Dial structure and wearable equipment |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100616620B1 (en) * | 2004-09-22 | 2006-08-28 | 삼성전기주식회사 | Fanless, fanless, high efficient cooling device using ion wind |
| WO2011161992A1 (en) * | 2010-06-22 | 2011-12-29 | 京セラ株式会社 | Ion wind generating body, ion wind generating device and ion wind generating method |
| CN107660103B (en) * | 2017-09-14 | 2019-08-09 | 西安交通大学 | A kind of needle-ring type ion wind fin radiator |
-
2019
- 2019-06-12 CN CN201910508392.5A patent/CN110337219B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN110337219A (en) | 2019-10-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8411407B2 (en) | Reversible flow electrohydrodynamic fluid accelerator | |
| US8342234B2 (en) | Plasma-driven cooling heat sink | |
| CN110337219B (en) | Ionic wind heat dissipation device and method thereof | |
| JP5128656B2 (en) | Flow tube equipment | |
| US7661468B2 (en) | Electro-hydrodynamic gas flow cooling system | |
| US20100155025A1 (en) | Collector electrodes and ion collecting surfaces for electrohydrodynamic fluid accelerators | |
| US8508908B2 (en) | Electrohydrodynamic (EHD) fluid mover with field shaping feature at leading edge of collector electrodes | |
| US8488294B2 (en) | Ionic fluid flow accelerator | |
| US20100052540A1 (en) | Electrohydrodynamic fluid accelerator device with collector electrode exhibiting curved leading edge profile | |
| US20120000627A1 (en) | Electrostatic precipitator pre-filter for electrohydrodynamic fluid mover | |
| US20130340981A1 (en) | Electrohydrodynamic (ehd) air mover configuration with flow path expansion and/or spreading for improved ozone catalysis | |
| US20130056241A1 (en) | Emitter wire with layered cross-section | |
| US20120120542A1 (en) | Electronic system changeable to accommodate an ehd air mover or mechanical air mover | |
| US8545599B2 (en) | Electrohydrodynamic device components employing solid solutions | |
| US20110308775A1 (en) | Electrohydrodynamic device with flow heated ozone reducing material | |
| Ramadhan et al. | Numerical modelling of electrohydrodynamic airflow induced in a wire-to-grid channel | |
| EP2632601A2 (en) | Layered emitter structure for crack resistance | |
| JP2011511997A (en) | Auxiliary electrode for enhanced electrostatic discharge | |
| JP7236235B2 (en) | Cooling system | |
| CN113163678B (en) | Coupling cooling device based on ion wind and application method thereof | |
| Ramadhan et al. | Numerical analysis and optimization of miniature electrohydrodynamic air blowers | |
| JP5515099B2 (en) | Ion wind generator and gas pump | |
| Kim et al. | Fluid flow and heat transfer characteristics of corona wind in cross-cut finned channel | |
| CN115666071A (en) | Integrated ion wind heat dissipation device | |
| JP6671905B2 (en) | Dust collector and air conditioner |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |