CN110330919A - A kind of UV visbreaking glue - Google Patents
A kind of UV visbreaking glue Download PDFInfo
- Publication number
- CN110330919A CN110330919A CN201910592315.2A CN201910592315A CN110330919A CN 110330919 A CN110330919 A CN 110330919A CN 201910592315 A CN201910592315 A CN 201910592315A CN 110330919 A CN110330919 A CN 110330919A
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- China
- Prior art keywords
- polyacrylate
- photosensitive group
- group
- photosensitive
- visbreaking
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/10—Epoxy resins modified by unsaturated compounds
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention belongs to wafer cutting technique fields, and in particular to a kind of UV visbreaking glue, including photosensitive group and polyacrylate, the photosensitive group and polyacrylate introduce the photosensitive group on polyacrylate backbone chain under the conditions of light, heat and initiator；Photosensitive group is introduced directly on polyacrylate backbone chain, without the subsequent multifunctional resin of addition, its peeling force can be reduced to 23gf/25mm or less from original 1600gf/25rm after UV illumination, it is pollution-free, noresidue, 150 DEG C of hours of high temperature resistant very easily workpiece can be detached from from adhesive tape therefore after use simultaneously.
Description
Technical field
The invention belongs to wafer cutting technique fields, and in particular to a kind of UV visbreaking glue.
Background technique
Semiconductor is the critical component of household digital product and electronic device.Large scale integrated circuit manufacture and partly lead
In the manufacture process of body device, essential basic material is semiconductor chip.Semiconductor chip is with monocrystalline silicon piece
It is process, monocrystalline silicon piece abbreviation wafer.Wafer material is cut, grinding when, need with a kind of special
Protective film is adhesively fixed.After completion of processing, then the wafer coupons processed are completely exfoliated from fixed glue film, no
Influence wafer material itself.Crystal (ambetti) is applied to the daily lifes such as lamps and lanterns, dress ornament, and optical glass is applied to optics instrument
Device is also required to also need protective film in process by cutting and grinding and be fixed, after processing is completed easily removing again.
The UV visbreaking glue of technique protection is cut and picked on domestic market for wafer mostly with Japan, based on Taiwan, it is domestic
UV visbreaking glue is also several to be promoted in research and development, performance not yet complete stability.And (such as hand is protected for high-performance tempering glass system journey
Machine glass etc.) and the protection of the laser engravings technique such as mobile phone metal back cover be all that guarantor is pasted with green adhesive tape or golden finger adhesive tape
It protects, needs in processing procedure by 120 DEG C or more special process a few minutes, this has very high choose to protective film high temperature resistance
War.After high temperature, adhesive layer can soften for green adhesive tape or golden finger adhesive tape, can be preferably abundant with protected object body surface face
Contact, thus greatly increases adhesive tape to the bonding force in protected object body surface face, also increases the removing of adhesive tape later period
Difficulty and possibility in later period removing due to bonding force is excessive caused by slight residue glue the problems such as.And current industry is used for
When the UV visbreaking protective film of silicon wafer process protection can satisfy later period removing after UV illumination, the characteristics of bonding force becomes smaller and it is light
The easily peelable performance got off.But the UV visbreaking protective film non-refractory, if after high temperature, although after UV lamp when the later period removes
Illumination bonding force becomes smaller, but still the small molecule that can have adhesive layer can remain protected object body surface face.
Application No. is 201210589842.6 Chinese patents to disclose a kind of Anti-static wafer cutting film for being easy to pick,
Some problems of traditional silicon wafer process protection, but unresolved high temperature resistance are overcome, high-performance tempering glass system is unable to satisfy
Journey and the protection of the laser engraving technique of metallic mobile phone rear cover；Application No. is 201420369939.0 Chinese patents to disclose one kind
The structural schematic diagram of UV visbreaking film and traditional adhesive tape schematic diagram are similar, do not solve the actual performance demand of UV visbreaking glue；Shen
Number a kind of two-component UV curing visbreaking glue please be disclosed for 201510590693.9 Chinese patent, also only solve visbreaking glue
High peeling force before UV illumination, after UV illumination the problem of low stripping force, and does not solve high temperature resistance；Application No. is
201520242283.0 Chinese patent discloses a kind of novel UV cutting film with antistatic, and specific method is in PET base
Material surface layer coats one layer of antistatic layer, also the unpractical high temperature resistance for solving UV visbreaking glue；Between this, Publication No.
The Chinese patent of CN105778806A discloses a kind of heat resistant type UV visbreaking glue composition and the UV visbreaking of the composition preparation is protected
Cuticula.The composition is made of the raw material of following mass percent: polyfunctionality oligomer or polyfunctional monomer or combinations thereof
Object 1%~25%, solvent type fire resistant polypropylene acid esters pressure-sensitive adhesive 30%~50%, crosslinking agent A 0.5%~1.5%,
Photoinitiator 0.3%~1.5%, solvent 35%~60%.Heat resistant type UV visbreaking protective film includes substrate (10), is coated on institute
State the priming coat of substrate surface, coated in the UV visbreaking glue-line and release film on the priming coat, it is heat-resisting prepared by the invention
Type UV visbreaking protective film is resistant to 120 DEG C of high temperature, and with peeling force before UV illumination, peeling force is low after big, UV illumination and does not stay residue glue
The advantages of, but resin and rubber master batch mixing are poor, are easy to be precipitated, and raw materials for production are various.
Summary of the invention
The present invention provides a kind of UV visbreaking glue, to solve the problems mentioned in the above background technology.
To achieve the above object, the invention provides the following technical scheme: a kind of UV visbreaking glue, including photosensitive group and poly- third
Olefin(e) acid ester, the mass ratio of the photosensitive group and polyacrylate are as follows: 10-20%:80-90%, the photosensitive group and poly- third
Olefin(e) acid ester introduces the photosensitive group on polyacrylate backbone chain under the conditions of light, heat and initiator.
Preferably, the photosensitive group includes mass ratio are as follows: the photoinitiator of the photosensitive resin of 50-70% and 1-5% with
And 25-50% activity diluting monomer.
Preferably, the photosensitive resin uses polyacrylate.
Preferably, the activity diluting monomer is the monomer with isocyanate functional group, by its band isocyanate functional group
Monomer be grafted on acrylate base epoxy, use is maleic anhydride modified, preparation have light-initiated group aqueous third
Olefin(e) acid ester group epoxy resin.
Preferably, the maleic anhydride is photoinitiator.
Compared with prior art, the beneficial effects of the present invention are:
Photosensitive group is introduced directly on polyacrylate backbone chain, without the subsequent multifunctional resin of addition, through UV light
25gf/25mm can be reduced to from original 1600gf/25rm according to its rear peeling force hereinafter, pollution-free, noresidue, while can high temperature resistant
A 150C ° of hour, therefore after use, very easily workpiece can be detached from from adhesive tape.
Detailed description of the invention
Attached drawing is used to provide further understanding of the present invention, and constitutes part of specification, with reality of the invention
It applies example to be used to explain the present invention together, not be construed as limiting the invention.In the accompanying drawings:
Fig. 1 is the structural diagram of the present invention.
In figure: 1, polyacrylate backbone chain；2, photosensitive group.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Embodiment 1
Referring to Fig. 1, the present invention is the following technical schemes are provided: a kind of UV visbreaking glue, including photosensitive group and polyacrylic acid
Ester, the mass ratio of the photosensitive group and polyacrylate are as follows: 10%:90%, the photosensitive group and polyacrylate light,
Under the conditions of heat and initiator, it is introduced into the photosensitive group on polyacrylate backbone chain.
In the present embodiment, photosensitive group 2 is introduced directly on polyacrylate backbone chain 1, without the subsequent more officials of addition
Can resin, its peeling force can be reduced to 25gf/25mm from original 1600gf/25rm hereinafter, pollution-free, without residual after UV illumination
It stays, while can very easily can be detached from workpiece from adhesive tape, this subtracts therefore after use 150 DEG C of hours of high temperature resistant
Viscose glue greatly increases adhesive tape to the bonding force in protected object body surface face, and the later period, by the irradiation of UV, peeling force is from original
1600gf/25rm is reduced to 25gf/25mm hereinafter, also just reducing the difficulty of adhesive tape later period removing, when avoiding later period removing
The problems such as slight residue glue caused by due to bonding force is excessive, and the UV visbreaking protective film high temperature resistant, it can make under the high temperature conditions
With.
Specifically, the photosensitive group includes mass ratio are as follows: 50% photosensitive resin and 1% photoinitiator and 49%
Its monomer with isocyanate functional group is grafted on acrylate base epoxy, uses maleic acid by activity diluting monomer
Anhydride modification, preparation have the water-and acrylate-based epoxy resin of light-initiated group, avoid in light week and use process
The residual and migration problem of small molecular.
Specifically, the photosensitive resin uses polyacrylate, polyacrylate can form good luster and water-fast film, glue
It closes securely, is not easy to peel off, flexible and flexible at room temperature, good weatherability, polyacrylate is adhesive, can be used as pressure-sensitive
Adhesive and thermal sensitivity adhesive.
Embodiment 2
Referring to Fig. 1, the present invention is the following technical schemes are provided: a kind of UV visbreaking glue, including photosensitive group and polyacrylic acid
Ester, the mass ratio of the photosensitive group and polyacrylate are as follows: 15%:85%, the photosensitive group and polyacrylate light,
Under the conditions of heat and initiator, it is introduced into the photosensitive group on polyacrylate backbone chain.
In the present embodiment, photosensitive group 2 is introduced directly on polyacrylate backbone chain 1, without the subsequent more officials of addition
Can resin, its peeling force can be reduced to 22gf/25mm from original 1600gf/25rm hereinafter, pollution-free, without residual after UV illumination
It stays, while can very easily can be detached from workpiece from adhesive tape, this subtracts therefore after use 150 DEG C of hours of high temperature resistant
Viscose glue greatly increases adhesive tape to the bonding force in protected object body surface face, and the later period, by the irradiation of UV, peeling force is from original
1600gf/25rm is reduced to 22gf/25mm hereinafter, also just reducing the difficulty of adhesive tape later period removing, when avoiding later period removing
The problems such as slight residue glue caused by due to bonding force is excessive, and the UV visbreaking protective film high temperature resistant, it can make under the high temperature conditions
With.
Specifically, the photosensitive group includes mass ratio are as follows: 65% photosensitive resin and 4% photoinitiator and 31%
Its monomer with isocyanate functional group is grafted on acrylate base epoxy, uses maleic acid by activity diluting monomer
Anhydride modification, preparation have the water-and acrylate-based epoxy resin of light-initiated group, avoid in light week and use process
The residual and migration problem of small molecular.
Specifically, the photosensitive resin uses polyacrylate, polyacrylate can form good luster and water-fast film, glue
It closes securely, is not easy to peel off, flexible and flexible at room temperature, good weatherability, polyacrylate is adhesive, can be used as pressure-sensitive
Adhesive and thermal sensitivity adhesive.
Embodiment 3
Referring to Fig. 1, the present invention is the following technical schemes are provided: a kind of UV visbreaking glue, including photosensitive group and polyacrylic acid
Ester, the mass ratio of the photosensitive group and polyacrylate are as follows: 20%:80%, the photosensitive group and polyacrylate light,
Under the conditions of heat and initiator, it is introduced into the photosensitive group on polyacrylate backbone chain.
In the present embodiment, photosensitive group 2 is introduced directly on polyacrylate backbone chain 1, without the subsequent more officials of addition
Can resin, its peeling force can be reduced to 20gf/25mm from original 1600gf/25rm hereinafter, pollution-free, without residual after UV illumination
It stays, while can very easily can be detached from workpiece from adhesive tape, this subtracts therefore after use 150 DEG C of hours of high temperature resistant
Viscose glue greatly increases adhesive tape to the bonding force in protected object body surface face, and the later period, by the irradiation of UV, peeling force is from original
1600gf/25rm is reduced to 20gf/25mm hereinafter, also just reducing the difficulty of adhesive tape later period removing, when avoiding later period removing
The problems such as slight residue glue caused by due to bonding force is excessive, and the UV visbreaking protective film high temperature resistant, it can make under the high temperature conditions
With.
Specifically, the photosensitive group includes mass ratio are as follows: 70% photosensitive resin and 5% photoinitiator and 25%
Its monomer with isocyanate functional group is grafted on acrylate base epoxy, uses maleic acid by activity diluting monomer
Anhydride modification, preparation have the water-and acrylate-based epoxy resin of light-initiated group, avoid in light week and use process
The residual and migration problem of small molecular.
Specifically, the photosensitive resin uses polyacrylate, polyacrylate can form good luster and water-fast film, glue
It closes securely, is not easy to peel off, flexible and flexible at room temperature, good weatherability, polyacrylate is adhesive, can be used as pressure-sensitive
Adhesive and thermal sensitivity adhesive.
Finally, it should be noted that the foregoing is only a preferred embodiment of the present invention, it is not intended to restrict the invention,
Although the present invention is described in detail referring to the foregoing embodiments, for those skilled in the art, still may be used
To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features.
All within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in of the invention
Within protection scope.
Claims (5)
1. a kind of UV visbreaking glue, it is characterised in that: including photosensitive group and polyacrylate, the photosensitive group and polyacrylic acid
The mass ratio of ester are as follows: 10-20%:80-90%, the photosensitive group and polyacrylate make under the conditions of light, heat and initiator
The photosensitive group is introduced on polyacrylate backbone chain.
2. a kind of UV visbreaking glue according to claim 1, it is characterised in that: the photosensitive group includes mass ratio are as follows: 50-
70% photosensitive resin and the photoinitiator of 1-5% and 25-50% activity diluting monomer.
3. a kind of UV visbreaking glue according to claim 2, it is characterised in that: the photosensitive resin uses polyacrylate.
4. a kind of UV visbreaking glue according to claim 1, it is characterised in that: the activity diluting monomer is band isocyanic acid function
The monomer of energy group, its monomer with isocyanate functional group is grafted on acrylate base epoxy, maleic acid is used
Anhydride modification, preparation have the water-and acrylate-based epoxy resin of light-initiated group.
5. a kind of UV visbreaking glue according to claim 4, it is characterised in that: the maleic anhydride is photoinitiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910592315.2A CN110330919A (en) | 2019-07-03 | 2019-07-03 | A kind of UV visbreaking glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910592315.2A CN110330919A (en) | 2019-07-03 | 2019-07-03 | A kind of UV visbreaking glue |
Publications (1)
| Publication Number | Publication Date |
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| CN110330919A true CN110330919A (en) | 2019-10-15 |
Family
ID=68143849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910592315.2A Pending CN110330919A (en) | 2019-07-03 | 2019-07-03 | A kind of UV visbreaking glue |
Country Status (1)
| Country | Link |
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| CN (1) | CN110330919A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111518496A (en) * | 2020-03-27 | 2020-08-11 | 顺德职业技术学院 | Epoxy resin liquid mixture and UV (ultraviolet) delayed curing solid adhesive film prepared from same |
| CN113745155A (en) * | 2021-08-26 | 2021-12-03 | Tcl华星光电技术有限公司 | Preparation method of display panel and display panel |
| CN115305043A (en) * | 2022-08-08 | 2022-11-08 | 江苏氢导智能装备有限公司 | Heat-resistant UV (ultraviolet) viscosity reducing glue and application thereof in preparation of fuel cell |
| CN115873511A (en) * | 2022-12-20 | 2023-03-31 | 广州鹿山新材料股份有限公司 | Solvent-free UV viscosity-reducing composition and preparation method and application thereof |
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| CN115305043A (en) * | 2022-08-08 | 2022-11-08 | 江苏氢导智能装备有限公司 | Heat-resistant UV (ultraviolet) viscosity reducing glue and application thereof in preparation of fuel cell |
| CN115873511A (en) * | 2022-12-20 | 2023-03-31 | 广州鹿山新材料股份有限公司 | Solvent-free UV viscosity-reducing composition and preparation method and application thereof |
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