CN110327475B - Device and method for sterilizing and inhibiting bacteria of solid material - Google Patents

Device and method for sterilizing and inhibiting bacteria of solid material Download PDF

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Publication number
CN110327475B
CN110327475B CN201910676362.5A CN201910676362A CN110327475B CN 110327475 B CN110327475 B CN 110327475B CN 201910676362 A CN201910676362 A CN 201910676362A CN 110327475 B CN110327475 B CN 110327475B
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plasma
iodine
sterilizing
solid materials
inhibiting bacteria
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CN110327475A (en
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李传保
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Qilu Hospital of Shandong University
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Qilu Hospital of Shandong University
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    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61LMETHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
    • A61L2/00Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor
    • A61L2/02Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor using physical phenomena
    • A61L2/14Plasma, i.e. ionised gases
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61LMETHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
    • A61L2/00Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor
    • A61L2/16Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor using chemical substances
    • A61L2/20Gaseous substances, e.g. vapours
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0694Halides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/32Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating

Abstract

The invention relates to a device and a method for sterilizing and inhibiting bacteria of solid materials, which comprises a plasma cavity, wherein the middle section of the plasma cavity is an insulating section, the front section and the rear section on two sides of the insulating section are respectively connected with two poles of a high-voltage power supply through leads, the head of the plasma cavity is a plasma nozzle which is connected with the front section, and the rear section is provided with an ionized gas inlet; the one end of pipe stretches into the plasma cavity by the back end, and the one end that the pipe is located the plasma cavity is located the anterior segment. The iodine working medium is sputtered and deposited on the surface of the workpiece under the pushing of the plasma, so that a firm and uniform iodine film coating is formed, and an antibacterial layer capable of protecting the workpiece for a long time is formed.

Description

Device and method for sterilizing and inhibiting bacteria of solid material
Technical Field
The invention belongs to the technical field of solid material sterilization treatment, and particularly relates to a device and a method for sterilizing and inhibiting bacteria of a solid material.
Background
The information in this background section is only for enhancement of understanding of the general background of the invention and is not necessarily to be construed as an admission or any form of suggestion that this information forms the prior art that is already known to a person of ordinary skill in the art.
The sterilization method of the solid materials generally adopts the modes of thermal processing, irradiation and ultraviolet sterilization, the thermal processing is performed by far infrared heating, microwave heating and power-on heating, and sterilization is performed in a heating mode or an irradiation mode, so that the method is not necessarily applicable to different solid materials, some materials can be affected by irradiation or high temperature to cause defects, the sterilization modes can not perform relatively long-time sterilization and bacteriostasis on the materials, and the method can not be industrially applied in a large scale.
The existing liquid or gaseous sterilization modes such as ozone sterilization and iodine solution sterilization are not beneficial to industrial large-scale production and application, and the iodine solution is easy to rub off and cannot form long-time protection on solid materials.
Disclosure of Invention
In view of the above problems in the prior art, it is an object of the present invention to provide a device and a method for sterilizing and inhibiting bacteria of solid materials. The iodine working medium is introduced into the atmospheric plasma device, and the iodine working medium is sputtered and deposited on the surface of the workpiece by utilizing the atmospheric plasma to form a firm and uniform iodine film coating. The iodine film coating is firmly combined with the surface of the solid material, and is more favorable for long-time sterilization and bacteriostasis of the solid material.
In order to solve the technical problems, the technical scheme of the invention is as follows:
in a first aspect, a device for sterilizing and inhibiting bacteria of solid materials comprises,
the plasma chamber comprises a plasma chamber body, wherein the middle section of the plasma chamber body is an insulating section, the front section and the rear section on two sides of the insulating section are respectively connected with two poles of a high-voltage power supply through leads, the head of the plasma chamber body is a plasma nozzle, the plasma nozzle is connected with the front section, and the rear section is provided with an ionized gas inlet;
the one end of pipe stretches into the plasma cavity by the back end, and the one end that the pipe is located the plasma cavity is located the anterior segment.
The iodine working medium enters the interior of the plasma cavity through the conduit and directly enters the front section of the plasma cavity; one part of the plasma cavity consists of a front section, a middle section and a rear section, wherein the front section and the rear section are respectively connected with two poles of a high-voltage power supply, the middle part of the plasma cavity is separated by an insulating section, gas to be ionized enters from an ionized gas inlet, namely the gas enters from the rear section, is ionized by the rear section, is attracted by the opposite electric power of the front section to form higher speed, moves to the front section, iodine working medium directly enters the front section and meets the ionized gas, the plasma adsorbs the iodine working medium, and the iodine working medium is sprayed out of the plasma nozzle with the plasma nozzle to sputter and deposit on the surface of a workpiece below the plasma nozzle; the plasma is a uniform charged body, so the plasma carries the iodine working medium, an iodine film coating can be uniformly formed on the surface of the workpiece, and the bonding force between the iodine film coating and the surface of the workpiece is stronger through the high-speed sputtering deposition of the plasma, so that the workpiece can be protected for a longer time.
In some embodiments, the plasma chamber has a cylindrical configuration and the plasma showerhead has a conical configuration.
In some embodiments, the voltage of the high voltage power supply is 2-10 ten thousand volts; the rear section is connected with the positive electrode of the high-voltage power supply, and the front section is connected with the ground electrode of the high-voltage power supply.
In some embodiments, the conduit has a diameter 1/3-1/2 of the diameter of the plasma chamber. The diameter of the guide pipe influences the amount of the iodine working medium sprayed in unit time, if the diameter of the guide pipe is too large, the contact uniformity of the iodine working medium and the plasma can be weakened, and if the diameter of the guide pipe is too small, the iodine working medium carried by the plasma is too little, so that the sterilization is incomplete, and the formed iodine film coating is not uniform.
In a second aspect, a method for sterilizing and inhibiting bacteria of solid materials comprises the following specific steps:
introducing gas to be ionized into the plasma cavity; turning on a high-voltage power supply to generate plasma; the iodine working medium enters the plasma cavity through the conduit; the iodine working medium is sprayed out from the plasma nozzle under the push of the ionized gas, and an iodine film coating is formed on the surface of the workpiece.
In some embodiments, the iodine working fluid is elemental iodine or a compound of iodine; for example, the iodine compound is iodophor, iodine tincture, iodine water, iodine glycerol or a mixture of several of them; preferably, the iodine working medium is iodine simple substance steam; in some embodiments, the gas to be ionized is helium, argon, nitrogen, air, or a combination of several thereof.
In some embodiments, the flow rate of the iodine working fluid is 1-4 milligrams per second. In some embodiments, the flow rate of the gas to be ionized is 1000-. In some embodiments, the volume ratio of iodine working substance to gas to be ionized is 1.8-2.2 ppm.
According to the invention, the iodine working medium is crushed and sprayed by using the plasma, so that the using amount of iodine is small; the proportion of the iodine working medium and the plasma is in the range, the sprayed iodine working medium can be uniformly dispersed, and a firm iodine film can be formed on the surface of the workpiece after the sprayed iodine working medium reaches the surface of the workpiece.
In some embodiments, the voltage of the high voltage power supply is 2-10 ten thousand volts. In some embodiments, the distance between the plasma spray head and the workpiece is 1.8-2.2 cm. The distance between the plasma spray head and the workpiece influences the firmness of the formed iodine film.
In some embodiments, each workpiece is sprayed for 0.1 to 0.6 seconds, and the thickness of the iodine film on the surface of the workpiece is 0.5 to 1.2 microns. The thickness of the iodine film is related to the time of sputtering deposition, the effect of sterilizing and inhibiting bacteria on the surface of a workpiece can be achieved when the thickness reaches 0.5 micron generally, the effect of sterilizing and inhibiting bacteria for a long time can be achieved, and the effect of sterilizing and inhibiting bacteria for a long time cannot be achieved when the thickness of the iodine film is too thin.
In a third aspect, the above solid material sterilization and bacteriostasis device or the solid material sterilization and bacteriostasis method is applied to the sterilization and bacteriostasis of metal, organic or inorganic solid workpieces.
Preferably, the metal material is a medical instrument, and the organic material is a textile, paper, plastic or rubber film.
The device or the method for sterilizing and inhibiting bacteria of the solid material has wider target, and the principle is that an iodine film coating is formed on the surface of a workpiece, so that the device or the method can be applied to wider materials of the workpiece.
The invention has the beneficial effects that:
the iodine working medium of the invention is uniformly formed on the surface of a workpiece, has an iodine film coating with a certain thickness, has strong binding force and can protect the workpiece for a long time; compared with the method of directly coating the iodine film on the surface of a workpiece for sterilization, the iodine film can save more energy, and the iodine film coating sputtered by the device can uniformly cover the surface of the workpiece;
the device can control the thickness of the workpiece covered on the surface of the workpiece, thereby meeting different protection requirements; the operation is simple, and the work of disinfection and sterilization of the workpiece can be rapidly carried out. No pollution, is more beneficial to environmental protection compared with a chemical disinfection method, and has no harm to human body.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the invention and not to limit the invention.
FIG. 1 is a schematic structural diagram of a solid material sterilization and bacteriostasis device of the present invention;
the plasma processing device comprises a plasma cavity, an insulating section, a front section, a rear section, a high-voltage power supply, a wire, a plasma nozzle, an ionized gas inlet, a guide pipe and a workpiece, wherein the plasma cavity is 1, the insulating section is 2, the front section is 3, the rear section is 4, the high-voltage power supply is 5, the guide pipe is 6, the guide pipe is.
Detailed Description
It is to be understood that the following detailed description is exemplary and is intended to provide further explanation of the invention as claimed. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
The invention will be further illustrated by the following examples
Example 1
As shown in fig. 1, a device for sterilizing and inhibiting bacteria of solid materials.
The plasma chamber comprises a plasma chamber body, wherein the middle section of the plasma chamber body is an insulating section, the front section and the rear section on two sides of the insulating section are respectively connected with two poles of a high-voltage power supply through leads, the head of the plasma chamber body is a plasma nozzle, the plasma nozzle is connected with the front section, and the rear section is provided with an ionized gas inlet;
the one end of pipe stretches into the plasma cavity by the back end, and the one end that the pipe is located the plasma cavity is located the anterior segment.
The plasma cavity is a device for generating plasma, and the middle insulating section is a cavity body which is made of annular insulating materials similar to ceramics;
the plasma cavity is of a cylinder structure, and the plasma nozzle is of a conical cavity structure.
The plasma cavity is of a cylindrical structure, the middle of the plasma cavity is provided with an annular closed cavity insulation section, the front section and the rear section are isolated, and the front section and the rear section are both made of conductive materials. In the in-process of in-service use, can place the bacteriostatic device that disinfects of whole solid material in an insulating box, prevent high voltage power supply to external injury. Only the ejection port of the plasma shower head is aligned with the workpiece.
The voltage of the high-voltage power supply is 2-10 ten thousand volts; the rear section is connected with the positive electrode of the high-voltage power supply, and the front section is connected with the ground electrode of the high-voltage power supply.
The diameter of the conduit is 1/3-1/2 of the diameter of the plasma chamber.
Example 2
Introducing gas to be ionized (the flow rate is 1000 ml per second) into a plasma cavity; turning on a high-voltage power supply (10 ten thousand volts) to generate plasma; iodine simple substance (the flow rate is 2 milligrams per second) enters into the plasma cavity from the conduit; the iodine working medium is sprayed out of the plasma spray head under the push of ionized gas, the distance between the workpiece and the plasma spray head is 1.8 cm, and an iodine film coating is formed on the surface of the workpiece. The workpiece is a medical instrument made of metal, and the area of the medical instrument is 100 square centimeters. The time for spraying was 0.25 seconds. The thickness of the formed iodine film was 0.5 μm. The bacteriostatic duration can be 3 years.
Example 3
Introducing gas to be ionized (the flow rate is 2000 ml per second) into a plasma cavity; turning on a high-voltage power supply (10 ten thousand volts) to generate plasma; iodophors (flow rate 4 mg/sec) were introduced into the plasma chamber through the catheter; the iodine working medium is sprayed out of the plasma spray head under the pushing of ionized gas, the distance between the workpiece and the plasma spray head is 2 cm, and an iodine film coating is formed on the surface of the workpiece. The workpiece is a mask, and the size of the mask is (the area is 100 square centimeters). The time for spraying was 0.25 seconds. The thickness of the formed iodine film was 0.5 μm. The bacteriostatic duration can be 3 years.
Example 4
Introducing gas to be ionized (the flow rate is 1000 ml per second) into a plasma cavity; turning on a high-voltage power supply (2 ten thousand volts) to generate plasma; iodophors (flow rate 1 mg/sec) were introduced into the plasma chamber through the catheter; the iodine working medium is sprayed out of the plasma spray head under the push of ionized gas, the distance between the workpiece and the plasma spray head is 2.2 cm, and an iodine film coating is formed on the surface of the workpiece. The workpiece is paper, and the size of the paper is (the area is 100 square centimeters). The time for spraying was 0.5 seconds. The thickness of the formed iodine film was 0.8 μm. The bacteriostatic duration can be 5 years.
Comparative example 1
Different from the example 2, the distance between the workpiece and the plasma spray head is 5 cm, and the obtained iodine film coating has weak bonding degree with the workpiece. The sterilization and bacteriostasis time is reduced to half a year.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (15)

1. The utility model provides a solid material device that antibacterial that disinfects which characterized in that: comprises a plasma cavity and a conduit;
the middle section of the plasma cavity is an insulating section, the front section and the rear section on two sides of the insulating section are respectively connected with two poles of a high-voltage power supply through leads, the head of the plasma cavity is a plasma nozzle which is connected with the front section, and the rear section is provided with an ionized gas inlet;
one end of the guide pipe extends into the plasma cavity from the rear section, and one end of the guide pipe, which is positioned in the plasma cavity, is positioned in the front section;
the voltage of the high-voltage power supply is 2-10 ten thousand volts; the rear section is connected with the positive electrode of the high-voltage power supply, and the front section is connected with the ground electrode of the high-voltage power supply.
2. The solid material sterilization and bacteriostasis device according to claim 1, which is characterized in that: the plasma cavity is of a cylindrical structure, and the plasma nozzle is of a conical structure.
3. The solid material sterilization and bacteriostasis device according to claim 1, which is characterized in that: the diameter of the conduit is 1/3-1/2 of the diameter of the plasma chamber.
4. The method for sterilizing and inhibiting bacteria of solid materials of the device for sterilizing and inhibiting bacteria of solid materials according to claim 1, is characterized in that: the method comprises the following specific steps:
introducing gas to be ionized into the plasma cavity; turning on a high-voltage power supply to generate plasma; the iodine working medium enters the plasma cavity through the conduit; the iodine working medium is sprayed out from the plasma nozzle under the push of the ionized gas, and an iodine film coating is formed on the surface of the workpiece.
5. The method for sterilizing and inhibiting bacteria of solid materials according to claim 4, which is characterized in that: the gas to be ionized is helium, argon, nitrogen, air or a combination of several of the gases.
6. The method for sterilizing and inhibiting bacteria of solid materials according to claim 4, which is characterized in that: the flow rate of iodine working medium is 1-4 mg/s.
7. The method for sterilizing and inhibiting bacteria of solid materials according to claim 4, which is characterized in that: the flow rate of the gas to be ionized is 1000-.
8. The method for sterilizing and inhibiting bacteria of solid materials according to claim 4, which is characterized in that: the voltage of the high-voltage power supply is 2-10 ten thousand volts.
9. The method for sterilizing and inhibiting bacteria of solid materials according to claim 4, which is characterized in that: the iodine working medium is a compound of iodine simple substance and iodine.
10. The method for sterilizing and inhibiting bacteria of solid materials according to claim 9, which is characterized in that: the iodine working medium is iodine simple substance steam.
11. The method for sterilizing and inhibiting bacteria of solid materials according to claim 4, which is characterized in that: the volume ratio of iodine working medium in the gas to be ionized is 1.8-2.2 ppm.
12. The method for sterilizing and inhibiting bacteria of solid materials according to claim 4, which is characterized in that: the distance between the plasma nozzle and the workpiece is 1.8-2.2 cm.
13. The method for sterilizing and inhibiting bacteria of solid materials according to claim 4, which is characterized in that: the spraying time of each workpiece is 0.1-0.6 seconds, and the thickness of the iodine film on the surface of each workpiece is 0.5-1.2 microns.
14. The use of the apparatus for sterilization and bacteriostasis of solid materials according to any one of claims 1 to 3 or the method for sterilization and bacteriostasis of solid materials according to any one of claims 4 to 13 in the sterilization and bacteriostasis of solid workpieces made of metal, organic or inorganic materials.
15. Use according to claim 14, characterized in that: the metal material is medical apparatus and instruments, and the organic material is textile, paper, plastic or rubber film.
CN201910676362.5A 2019-07-25 2019-07-25 Device and method for sterilizing and inhibiting bacteria of solid material Active CN110327475B (en)

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CN1087129A (en) * 1992-11-16 1994-05-25 四川大学 Apparatus for sputtering and codeposition with multiple plasma beams
CN1606795A (en) * 2001-11-14 2005-04-13 应用材料有限公司 Magnet array in conjunction with rotating magnetron for plasma sputtering
CN1491753A (en) * 2002-10-23 2004-04-28 中国科学院化学研究所 Method for forming nano TiO2 light catalystic active agenbt coating on substrate
JP2009116337A (en) * 2008-11-26 2009-05-28 Konica Minolta Holdings Inc Polarizing plate
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