CN110325917A

CN110325917A - The manufacturing method of photosensitive transfer printing material, the manufacturing method of circuit layout and touch panel

Info

Publication number: CN110325917A
Application number: CN201880012921.6A
Authority: CN
Inventors: 松田知树; 片山晃男; 山田悟; 两角一真; 藤本进二; 铃木正弥
Original assignee: Fujifilm Corp
Current assignee: Fujifilm Corp
Priority date: 2017-02-22
Filing date: 2018-02-07
Publication date: 2019-10-11
Also published as: WO2018155193A1; TW201840612A; JP6685461B2; TWI746802B; JPWO2018155193A1

Abstract

The present invention provides the manufacturing method of a kind of photosensitive transfer printing material and the circuit layout for using the photosensitive transfer printing material or the manufacturing method of touch panel, the photosensitive transfer printing material include temporary support；And photo-sensitive resin; it contains component of polymer and photoacid generator; in the component of polymer; comprising containing with acidic group in the form of acetal the polymer of the polymer of the Component units of protected group and the Component units with acidic group; the inorganic value I based on organic conceptional diagram of component of polymer is 0.55 or more and 0.65 or less divided by the average value of the I/O value of organic value O; the content of the Component units with acidic group of gross mass relative to component of polymer is 0.5 mass % or more and 15 mass % are hereinafter, the average value of glass transition temperature is 90 DEG C or less.

Description

The manufacture of photosensitive transfer printing material, the manufacturing method of circuit layout and touch panel Method

Technical field

This disclosure relates to the manufacturing method of a kind of photosensitive transfer printing material, circuit layout and the manufacturing method of touch panel.

Background technique

Have display device (organic EL display device and the liquid crystal display of touch panel in capacitive input device etc. Device etc.) in, the electrode pattern for being equivalent to the sensor of visible portions, periphery wiring part are internally provided in touch panel and are taken The conductive layer patterns such as wiring of wiring part out.

Usually when forming patterned layer, the operation quantity for obtaining required pattern form is few, therefore extensively It is desired across having using the layer to the photosensitive polymer combination for using photosensitive transfer printing material to be arranged on any substrate Pattern mask be exposed after the method developed.

For example, disclosing thick film chemical amplification positive photoresist in Japanese Unexamined Patent Publication 2015-194715 bulletin Composition, the thick film chemical amplification positive photosensitive polymer combination contain: (A) passes through activation light or the photograph of radioactive ray Penetrate the acid agent for generating acid；(B) increase the deliquescent resin to alkali by the effect of acid；And (S) organic solvent, it is above-mentioned (B) Increased to the deliquescent resin of alkali by acting on for acid comprising containing by containing containing (B-3)-SO₂Ring type group or containing interior The acrylic resin of Component units derived from the acrylate of the ring type group of ester, relative to above-mentioned thick film with chemical amplification type just The gross mass of resin component contained in type photosensitive polymer combination, the mass ratio of above-mentioned (B-3) acrylic resin are 70 Quality % or more, and it is used to form 10 μm of film thickness or more of thick film resist pattern.

Summary of the invention

The invention technical task to be solved

The one embodiment of the present invention project to be solved is, it is excellent and differentiate to provide a kind of lamination adaptability that can be obtained The excellent pattern of rate, and the excellent photosensitive transfer printing material of fissility of pattern.

Also, another embodiment of the present invention project to be solved is, provides a kind of use above-mentioned photosensitive transfer printing The manufacturing method of the circuit layout of material or the manufacturing method of touch panel.

For solving the means of technical task

Scheme for solving the above subject includes following manner.

A kind of photosensitive transfer printing material of 1 > of <, includes

Temporary support；And

Photo-sensitive resin, containing component of polymer and photoacid generator, in the component of polymer, comprising containing having acid Base polymer of the Component units of protected group and the Component units with acidic group in the form of acetal, component of polymer Inorganic value I based on organic conceptional diagram is 0.55 or more and 0.65 hereinafter, phase divided by the average value of the I/O value of organic value O Content for the Component units with acidic group of the gross mass of component of polymer be 0.5 mass % or more and 15 mass % with Under, the average value of glass transition temperature is 90 DEG C or less.

2 > of < photosensitive transfer printing material according to 1 > of <, wherein

The above-mentioned Component units with acidic group protected group in the form of acetal are to be constituted list by what following formula A was indicated Member.

[chemical formula 1]

In formula A, R³¹And R³²Separately indicate hydrogen atom, alkyl or aryl, R³¹And R³²In at least any one be Alkyl or aryl, R³³Indicate alkyl or aryl, R³¹Or R³²Optionally with R³³It connects and forms cyclic ether, R³⁴Indicate hydrogen atom or Methyl, X⁰Indicate the linking group of singly-bound or divalent.

3 > of < photosensitive transfer printing material according to 2 > of < 1 > or <, wherein total matter relative to component of polymer The content of the Component units with acidic group of amount relative to component of polymer gross mass for 1 mass % or more and 10 mass % with Under.

4 > of < photosensitive transfer printing material according to any one of 3 > of < 1 > to <, wherein above-mentioned with acidic group Acidic group contained in Component units is carboxyl.

5 > of < photosensitive transfer printing material according to any one of 4 > of < 1 > to <, wherein above-mentioned component of polymer Weight average molecular weight be 60,000 or less.

A kind of manufacturing method of circuit layout of 6 > of < includes: in the following order

On substrate, make the photosensitive transfer printing material as described in any one of 5 > of < 1 > to < with temporary support phase The outermost layer of anti-side is contacted with aforesaid substrate and the process that is bonded；

Pattern exposure is carried out to the above-mentioned photo-sensitive resin of the above-mentioned photosensitive transfer printing material after the process of above-mentioned fitting Process；

The process that pattern is formed to the photo-sensitive resin development after the process of above-mentioned exposure；And

The process that substrate in the region that above-mentioned pattern is not configured is etched.

A kind of manufacturing method of touch panel of 7 > of < includes: in the following order

Invention effect

According to an embodiment of the present invention, it is capable of providing and a kind of can be obtained that lamination adaptability is excellent and excellent in resolution Pattern, and the excellent photosensitive transfer printing material of fissility of pattern.

Also, another embodiment according to the present invention is capable of providing a kind of electricity using above-mentioned photosensitive transfer printing material The manufacturing method of road wiring or the manufacturing method of touch panel.

Detailed description of the invention

Fig. 1 is the skeleton diagram for indicating an example of the layer structure of photosensitive transfer printing material of the disclosure.

Fig. 2 is indicate to use the manufacturing method of the touch panel circuit layout of the photosensitive transfer printing material of the disclosure one The skeleton diagram of example.

Fig. 3 is the skeleton diagram for indicating pattern A.

Fig. 4 is the skeleton diagram for indicating pattern B.

Specific embodiment

Hereinafter, being illustrated to content of this disclosure.In addition, being described with reference to the accompanying drawings, but ellipsis sometimes.

Also, the numberical range for using "~" to indicate in the present specification indicates that the numerical value that will be recorded in the front and back of "~" is made The range being included for lower limit value and upper limit value.

Also, in the present specification, " (methyl) acrylic acid " indicates both acrylic acid and methacrylic acid or in which appoints One, " (methyl) acrylate " indicate both acrylate and methacrylate or in which any one.

In addition, in the present specification, in the case that there are multiple with the comparable substance of each ingredient in composition, as long as no Special to limit, the amount of each ingredient in composition refers to the total amount for the multiple substance being present in composition.

" process " word not only indicates independent process in the present specification, even if can not clearly distinguish with other processes In the case where, as long as can be realized the expected purpose of process, it is contained in this term.

In the label of group (atomic group) in the present specification, substitution and unsubstituted label are not indicated comprising not having The group of substituent group and group with substituent group.Such as " alkyl " is not only (unsubstituted comprising the alkyl without substituent group Alkyl), also comprising the alkyl (substituted alkyl) with substituent group.

Also, the chemical structural formula in this specification is recorded into the schematic arrangement formula that hydrogen atom is omitted sometimes.

In the disclosure, " quality % " is identical as the meaning of " weight % ", and " mass parts " are identical as the meaning of " parts by weight ".

Also, in the disclosure, the group of 2 or more preferred embodiments is combined into preferred mode.

(photosensitive transfer printing material)

The photosensitive transfer printing material of present embodiment includes temporary support；And photo-sensitive resin, it includes polymer Ingredient and photoacid generator, in the component of polymer, comprising containing the composition with acidic group protected group in the form of acetal The polymer of unit and the Component units with acidic group, the inorganic value I based on organic conceptional diagram of component of polymer is divided by having The average value of the I/O value of machine value O is 0.55 or more and 0.65 hereinafter, gross mass relative to component of polymer has acidic group Component units content be 0.5 mass % or more and 15 mass % hereinafter, the average value of glass transition temperature be 90 DEG C with Under.

Touch panel with etc. circuit layout in, be equivalent to the electrode pattern of the sensor in identification portion not with periphery taking-up portion The wiring of (periphery wiring part and taking-up wiring part) intersects, and is not necessarily based on the three-dimensional connection of bridge etc..Therefore, circuit layout In the technical field of manufacturing method, as having used the pattern forming method of previous photosensitive polymer combination, expect not Resist is formed to each desired pattern, and is formed with 1 resist to form the conductive layer including multiple patterns Circuit layout and omit process.

Also, it from the viewpoint of improving productivity etc., is preferably for example conveyed in a manner of roll-to-roll (Roll to Roll) While fitting be used to form the substrate and photosensitive transfer printing material of circuit layout, and be exposed, develop.

As photosensitive transfer printing material, from the viewpoint of precisely manufacturing finer pattern, preferred pattern shape At circuit layout resolution ratio it is higher.

Also, as photosensitive transfer printing material, from the high speed of energy saving and process from the viewpoint of, be preferably able to carry out The material of fitting based on low temperature.In particular, using the substrates such as heat labile resin film as in the case where substrate, more preferably can Carry out the material of the fitting based on low temperature.

Wherein, usually in the case where forming resist layer using photosensitive transfer printing material, resist layer is shown Resist pattern obtained from shadow is finally stripped after terminating etching etc..

Removing in the present invention be include complete in the phenomenon that substance being swollen in stripper strippingly removes and stripper The concept of fully dissolved and the two of removable phenomenon.

When the resist layer that removing is formed using photosensitive transfer printing material, such as use alkaline water system stripper.

The inventors of the present invention's discovery, the chemical amplification positive photoresist group of Japanese Unexamined Patent Publication 2015-194715 bulletin The fissility (hereinafter, also referred to as " fissility ") for closing resist pattern of the object based on stripper is insufficient.

Therefore, the inventors of the present invention further investigation as a result, it has been found that, photosensitive transfer printing material according to the present embodiment can There is provided it is a kind of can be obtained that lamination adaptability is excellent and the pattern of excellent in resolution, and the excellent photosensitive transfer printing of fissility of pattern Material.

Although the detailed mechanism for obtaining said effect is unknown, can infer as follows.

It is recorded in Japanese Unexamined Patent Publication 2015-194715 bulletin, the amount using acidic group contained in component of polymer is less And the lower hydrophobicity positive type photosensitive organic compound of the average value of the I/O value of component of polymer and the resist layer formed Due to being difficult to dissolve or be swollen in stripper (especially alkaline water system stripper), it is believed that fissility is lower.

Also, in order to improve the dissolubility to stripper, it is more using the amount of acidic group contained in component of polymer and In the case where the higher composition of average value of the I/O value of component of polymer, when being used to form the development of resist layer, also cause Developer solution swelling, it is believed that resolution ratio reduces.

In the photosensitive transfer printing material of present embodiment, the average value of the I/O value of component of polymer be 0.55 or more and 0.65 hereinafter, the Component units with acidic group of the gross mass relative to component of polymer content be 0.5 mass % or more and 15 mass % or less.

By the way that the content of the average value of the I/O value of component of polymer and the Component units with acidic group is set as above-mentioned model It encloses, inhibits the dissolution or swelling with developer solution when forming resist layer, and easily cause the dissolution or swelling with stripper, It is inferred that going out the pattern of excellent in resolution can be obtained, and the fissility of pattern is excellent.

In addition, in the photosensitive transfer printing material of present embodiment, the average value of the Tg by limiting component of polymer is inferred The excellent photosensitive transfer printing material of lamination adaptability can be obtained out.In the photosensitive transfer printing material of present embodiment, it is believed that even if In the case where being laminated at low temperature, it is also easy to get the excellent photosensitive transfer printing material of lamination adaptability.

Also, " low temperature " in above-mentioned lamination be preferably 120 DEG C hereinafter, more preferably 100 DEG C hereinafter, especially preferably 90 DEG C or less.The lower limit of temperature when lamination is not particularly limited, but preferably 40 DEG C or more, more preferably 60 DEG C or more.

Hereinafter, the photosensitive transfer printing material to present embodiment is described in detail.

Fig. 1 is diagrammatically denoted by an example of the layer structure of the photosensitive transfer printing material of present embodiment.It is shown in FIG. 1 photosensitive Temporary support 12, photo-sensitive resin 14 and cover film 16 are sequentially laminated in property transfer materials 100.Photo-sensitive resin 14 include component of polymer and photoacid generator, in the component of polymer, comprising containing having acidic group to be protected in the form of acetal Group Component units and the Component units with acidic group polymer, component of polymer based on the inorganic of organic conceptional diagram Property value I divided by the average value of the I/O value of organic value O be 0.55 or more and 0.65 hereinafter, total matter relative to component of polymer The content of the Component units with acidic group of amount is 0.5 mass % or more and 15 mass % hereinafter, glass transition temperature is put down Mean value is 90 DEG C or less.

Hereinafter, the constituent material etc. to the photosensitive transfer printing material of present embodiment is illustrated.In addition, about this implementation Above-mentioned composition in mode is sometimes referred to as follows in the present specification.

Sometimes will containing with acidic group in the form of acetal Component units of protected group and with the composition of acidic group The polymer of unit is known as " particular polymers ".

Above-mentioned photo-sensitive resin is the photo-sensitive resin of eurymeric, sometimes referred to as " positive-working photosensitive resin layer ".

< temporary support >

Temporary support is support photo-sensitive resin, and can be from the supporter of photo-sensitive resin removing.

The temporary support used in the present embodiment is from can be every when carrying out pattern exposure to photo-sensitive resin From the viewpoint of temporary support is exposed photo-sensitive resin, preferably there is translucency.

The transmissivity that the dominant wavelength of the light used in pattern exposure is indicated with translucency is 50% or more, is exposed from improving From the viewpoint of luminous sensitivity, the transmissivity of the dominant wavelength of the light used in pattern exposure preferably 60% or more, more preferably 70% or more.As the measuring method of transmissivity, it can enumerate and utilize Otsuka Electronics Co., Ltd. MCPD The method that Series is measured.

As temporary support, glass substrate, resin film, paper etc. can be enumerated, is considered from the viewpoints such as intensity and flexibility, especially Optimum resin membrane.As resin film, polyethylene terephthalate thin film, triacetate cellulose film, polystyrene can be enumerated Film, polycarbonate film etc..Wherein, particularly preferred biaxial stretch-formed polyethylene terephthalate thin film.

The thickness of temporary support is not particularly limited, and preferably 5 μm~200 μm of range is easy for processing, versatility etc. For aspect, more preferable 10 μm~150 μm of range, most preferably 15 μm~50 μm of range.

About temporary support, from as supporter intensity, with required by being bonded of circuit layout formation substrate The viewpoints such as required translucency consider in flexible, initial exposure process, are selected according to material.

Preferred embodiment about temporary support is for example 0017 section~the 0018 of Japanese Unexamined Patent Publication 2014-085643 bulletin On the books in section, the content of the bulletin is incorporated into this manual.

< photo-sensitive resin >

The photosensitive transfer printing material of present embodiment has the photo-sensitive resin being configured in temporary support.This implementation Photo-sensitive resin in mode includes component of polymer and photoacid generator, in the component of polymer, comprising containing having acidic group The polymer of the Component units of protected group and the Component units with acidic group in the form of acetal, the base of component of polymer In the inorganic value I of organic conceptional diagram divided by the average value of the I/O value of organic value O be 0.55 or more and 0.65 hereinafter, opposite In the content of the Component units with acidic group of the gross mass of component of polymer be 0.5 mass % or more and 15 mass % hereinafter, The average value of glass transition temperature is 90 DEG C or less.

Also, the photo-sensitive resin in present embodiment is positive-working photosensitive resin layer, and preferably chemical amplification type is being just Type photo-sensitive resin.

In the photoacid generators such as aftermentioned salt or oxime sulfonate compound, incudes active radioactive ray (activation light) and generate Acid play a role to the deprotection of the protected acidic group in above-mentioned particular polymers as catalyst, therefore with 1 light quantity The acid that the effect of son generates facilitates most deprotection reactions, quantum yield be more than 1 as such as 10 side for several times it is such big Value, as so-called chemical amplification as a result, high sensitivity can be obtained.

On the other hand, when having used two triazo-compound of quinone as the photoacid generator for incuding active radioactive ray, by by Secondary type photochemical reaction and generate carboxyl, quantum yield one is set to 1 hereinafter, but really not so in chemical amplification type.

(component of polymer)

Particular polymers-

The component of polymer of present embodiment includes containing the composition with acidic group protected group in the form of acetal Unit (hereinafter also referred to as " Component units a1 ") and Component units (hereinafter also referred to as " Component units a2 ") with acidic group Polymer (particular polymers), the inorganic value I based on organic conceptional diagram of component of polymer divided by organic value O I/O value Average value be 0.55 or more and 0.65 hereinafter, the Component units with acidic group of the gross mass relative to component of polymer contain Amount is 0.5 mass % or more and 15 mass % are hereinafter, the average value of glass transition temperature is 90 DEG C or less.

Particular polymers contained in photo-sensitive resin can be only one kind, or two or more.

It is above-mentioned specific by the effect of the acidic materials of the catalytic amount generated by exposure in above-mentioned particular polymers Acidic group in the polymer protected group in the form of acetal carries out deprotection reaction and becomes acidic group.The acidic group can be passed through And develop.

Above-mentioned component of polymer can also contain the polymer other than particular polymers.

Also, it is preferred that all polymer contained in above-mentioned component of polymer are respectively to include at least the composition with acidic group The polymer of unit.

Also, above-mentioned component of polymer can also contain polymer in addition to these.If without special narration, this reality The above-mentioned component of polymer applied in mode refers to the ingredient containing the other polymers being added as needed.In addition, aftermentioned increasing Even if mould agent, miscellaneous cyclic compound and with the comparable compound of surfactant be high-molecular compound, be also not included in above-mentioned In component of polymer.

Above-mentioned particular polymers are preferably the resin of addition polymerization type, more preferably have from (methyl) acrylic acid or its The polymer of the Component units of ester.Alternatively, it is also possible to have other than being originated from the Component units of (methyl) acrylic acid or its ester Component units, the Component units for example originating from styrene or the Component units from vinyl compound etc..

Hereinafter, being illustrated to the preferred embodiment of Component units a1 and Component units a2.

< < Component units a1 > >

Above-mentioned component of polymer contains comprising having acidic group Component units a1 of protected group in the form of acetal Polymer.Contain the polymer comprising Component units a1 by above-mentioned component of polymer, extremely highly sensitive sense can be set as Photosensitive resin layer.

As the acidic group in " the acidic group protected group in the form of acetal " in present embodiment, it is able to use known Group, be not particularly limited.As specific acidic group, carboxyl and phenolic hydroxyl group are preferably enumerated.It is able to use to pass through acid Be easier decompose acetal form (for example, as documented by formula A in the form of acetal protected ester group, tetrahydro pyrrole Mutter functional group, the acetals such as ester group or tetrahydrofuran ester group system) protect the groups of these acidic groups.

As above-mentioned Component units a1, examined from the viewpoint of the resolution ratio of sensitivity and available pattern when pattern formation Consider, the Component units (a) preferably indicated by following formula A.

[chemical formula 2]

In formula A, R³¹And R³²Separately indicate hydrogen atom, alkyl or aryl, R³¹And R³²In at least any one be alkane Base or aryl, R³³Indicate alkyl or aryl, R³¹Or R³²It can be with R³³It connects and forms cyclic ether, R³⁴Indicate hydrogen atom or methyl, X⁰ Indicate the linking group of singly-bound or divalent.

In formula A, work as R³¹Or R³²When for alkyl, preferably carbon atom number be 1~10 alkyl.Work as R³¹And R³²When for aryl, It is preferred that phenyl.R³¹And R³²Preferred hydrogen atom or the alkyl of carbon atom number 1~4 respectively.

In formula A, R³³Indicate alkyl or aryl, the preferably alkyl of carbon atom number 1~10, more preferable carbon atom number 1~6 Alkyl.R³³In alkyl and aryl can have substituent group.

In formula A, R³¹Or R³²It can be with R³³It connects and forms cyclic ether, preferably R³¹Or R³²With R³³It connects and is formed cyclic annular Ether.There is no particular limitation for the ring element number of cyclic ether, and preferably 5 or 6, more preferably 5.

In formula A, X⁰Indicate the linking group of singly-bound or divalent, preferably singly-bound or arlydene, more preferable singly-bound.Arlydene Also it can have substituent group.

In formula A, R³⁴It indicates hydrogen atom or methyl, considers from the Tg of particular polymers can be set as to lower viewpoint, Preferably hydrogen atom.

More specifically, the total content relative to Component units (a) contained in polymer, the R in formula A³⁴For hydrogen atom Component units be preferably 20 mass % or more.

In addition, in Component units (a), R in formula A³⁴For the content (content ratio: matter of the Component units of hydrogen atom Amount ratio) basis can be passed through¹³The intensity for the peak strength that C- NMR spectrum (NMR) measurement is calculated using conventional method is than coming Confirmed.

In the Component units (a) indicated with formula A, from the viewpoint of sensitivity when further increasing pattern formation, The Component units more preferably indicated with following formula A1.

[chemical formula 3]

In formula A1, R³⁴Indicate hydrogen atom or methyl, R³⁵~R⁴¹Separately indicate hydrogen atom or carbon atom number 1~4 Alkyl.

In formula A1, R³⁴It is preferred that hydrogen atom.

In formula A1, R³⁵~R⁴¹It is preferred that hydrogen atom.

As the preferred concrete example of the Component units (a) indicated by formula A, following Component units can be illustrated.In addition, R³⁴Table Show hydrogen atom or methyl.

[chemical formula 4]

Also, as above-mentioned Component units a1, from the viewpoint of the storage stability of photosensitive polymer combination, preferably The Component units (b) indicated by following formula B.

[chemical formula 5]

In formula B, R^B1And R^B2Separately indicate hydrogen atom, alkyl or aryl, R^B1And R^B2In at least any one be Alkyl or aryl, R^B3Indicate alkyl or aryl, R^B1Or R^B2It can be with R^B3It connects and forms cyclic ether, R^B4Indicate hydrogen atom or first Base, X^BIndicate the linking group of singly-bound or divalent, R^B12Indicate that substituent group, n indicate 0~4 integer.

In formula B, work as R^B1Or R^B2When for alkyl, preferably carbon atom number be 1~10 alkyl.Work as R^B1And R^B2When for aryl, It is preferred that phenyl.R^B1And R^B2It is respectively preferably the alkyl of hydrogen atom or carbon atom number 1~4.

In formula B, R^B3Indicate alkyl or aryl, the preferably alkyl of carbon atom number 1~10, more preferable carbon atom number 1~6 Alkyl.R^B3In alkyl and aryl can have substituent group.

In formula B, R^B1Or R^B2It can be with R^B3It connects and forms cyclic ether, preferably R^B1Or R^B2With R^B3It connects and is formed cyclic annular Ether.There is no particular limitation for the ring element number of cyclic ether, and preferably 5 or 6, more preferably 5.

In formula B, X^BIndicate the linking group of singly-bound or divalent, preferably singly-bound or alkylidene ,-C (=O) O- ,-C (=O) NR^N,-O- or their combination, more preferable singly-bound or-C (=O) O-.Alkylidene can be straight-chain and can have branch With cyclic structure, there can also be substituent group.The carbon atom number of alkylidene is preferably 1~10, and more preferable 1~4.Work as X^BComprising-C (=O) O- when, preferably carbon atom and and R contained in-C (=O) O-^B4The mode of the carbon atom Direct Bonding of bonding.Work as X^B Include-C (=O) NR^NWhen, preferably-C (=O) NR^NContained in carbon atom and and R^B4The side of the carbon atom Direct Bonding of bonding Formula.R^NIndicate alkyl or hydrogen atom, the preferably alkyl or hydrogen atom of carbon atom number 1~4, more preferable hydrogen atom.

It include R in formula B^B1~R^B3Group and X^BIt is preferred that each other in para-linkage.

In formula B, R^B12Indicate substituent group, optimizing alkyl or halogen atom.The carbon atom number of alkyl preferably 1~10, more preferably 1~4.

In formula B, the integer of n expression 0~4, preferably 0 or 1, more preferable 0.

In formula B, R^B4It indicates hydrogen atom or methyl, is examined from that the Tg of particular polymers can be set as more low viewpoint Consider, preferably hydrogen atom.

More specifically, the total content relative to Component units (a) contained in particular polymers, the R in formula B^B4For hydrogen The Component units of atom are preferably 20 mass % or more.

In addition, in Component units (a), R in formula B^B4For the content (content ratio: matter of the Component units of hydrogen atom Amount ratio) basis can be passed through¹³The intensity for the peak strength that C- NMR spectrum (NMR) measurement is calculated using conventional method is than coming Confirmed.

In the Component units (b) indicated with formula B, from the viewpoint of sensitivity when further increasing pattern formation, The Component units more preferably indicated with following formula B1.

[chemical formula 6]

In formula B1, R^B4Indicate hydrogen atom or methyl, R^B5~R^B11Separately indicate hydrogen atom or carbon atom number 1~ 4 alkyl, R^B12Indicate substituent group, X^BIndicate that the linking group of singly-bound or divalent, n indicate 0~4 integer.

In formula B1, X^BWith the X in above-mentioned formula B^BMeaning is identical, and preferred embodiment is also identical.

In formula B1, R^B4It is preferred that hydrogen atom.

In formula B1, R^B5~R^B11It is preferred that hydrogen atom.

In formula B1, R^B12Indicate substituent group, optimizing alkyl or halogen atom.The carbon atom number of alkyl preferably 1~10, it is more excellent Select 1~4.

In formula B1, the integer of n expression 0~4, preferably 0 or 1, more preferable 0.

As the preferred concrete example of the Component units (b) indicated by formula B, following Component units can be illustrated.In addition, R^B4Table Show hydrogen atom or methyl.

[chemical formula 7]

Component units a1 contained in particular polymers can be one kind, or two or more.

From the viewpoint of the excellent in resolution of pattern, the content of the Component units a1 in particular polymers is relative to specific The gross mass of polymer is preferably 10 mass % or more and 30 mass % hereinafter, more preferably 12 mass % or more and 28 mass % Hereinafter, further preferably 15 mass % or more and 25 mass % or less.

The content (content ratio: mass ratio) of Component units a1 in particular polymers can pass through basis¹³C-NMR measurement Confirmed using the intensity ratio of the peak strength of conventional method calculating.

Also, from the viewpoint of the resolution ratio of sensitivity and available pattern when pattern formation, particular polymers In by above-mentioned formula A indicate Component units content relative to the gross mass of particular polymers be preferably 10 mass % or more and 30 mass % hereinafter, more preferably 12 mass % or more and 28 mass % hereinafter, further preferably 15 mass % or more and 25 Quality % or less.

In addition, after all component of polymer are resolved into Component units (monomeric unit), the ratio phase of Component units a1 Gross mass for component of polymer be preferably 10 mass % or more and 30 mass % hereinafter, more preferably 12 mass % or more and 28 mass % are hereinafter, further preferably 15 mass % or more and 25 mass % or less.

< < Component units a2 > >

The particular polymers used in the present embodiment also contain the Component units a2 with acidic group.Component units a2 is It is the Component units of the acidic group without the group in the form of acetal comprising acidic group protected not in the form of acetal.Pass through spy Determining polymer includes Component units a2, and the sensitivity when pattern of particular polymers is formed is good, the development work after pattern exposure It is easy to be dissolved in alkaline-based developer in sequence, and can be realized the shortening of developing time.

Acidic group in this specification refers to that pKa is 12 proton dissociation groups below.Acidic group is usually used to be capable of forming Acidic group monomer incorporation particular polymers and as the Component units (Component units a2) with acidic group.From the sight for improving sensitivity Point considers that the pKa of acidic group preferably 10 is hereinafter, more preferable 6 or less.The pKa of acidic group is preferably -5 or more.

As acidic group possessed by Component units a2, the acidic group from carboxyl, the acidic group from sulfoamido, source can be illustrated Acidic group from sulfimide base, the acidic group from phosphonic acid base, from sulfonic acidic group, acidic group from phenolic hydroxyl group etc..Its In, it is preferably selected from at least one of the acidic group from carboxyl and the acidic group from phenolic hydroxyl group, more preferable carboxyl.

To the Component units with acidic group of particular polymers import can by make to have the monomer copolymerization of acidic group come It carries out.

The Component units with acidic group as Component units a2 preferably to the Component units for being originated from styrene or are originated from second The Component units of alkenyl compound replace the Component units of acidic group, the Component units for being originated from (methyl) acrylic acid etc..

As the concrete example of the monomer with acidic group, such as acrylic acid, methacrylic acid, hydroxy styrenes, carboxylic can be enumerated Base styrene, 2- acryloyl-oxyethyl phthalic acid, 2- acryloyl-oxyethyl hexahydrophthalic acid, 2- acryloyl-oxy Base ethyl-phthalic acid, 2- methacryloxyethyl-succinic acid, 2- methacryloxyethyl hexahydro neighbour benzene two Formic acid, 2- methacryloxyethyl-phthalic acid etc..

As the Component units a2 that particular polymers are included, examined from the more good viewpoint of sensitivity when pattern formation Consider, preferably the Component units with carboxyl and the Component units with phenolic hydroxyl group.

Monomer with the acidic group for being capable of forming Component units a2 is not limited to above-mentioned example.

Component units a2 contained in particular polymers can be only one kind, or two or more.

From the viewpoint of patternability, relative to the gross mass of particular polymers, the Component units (structure with acidic group At content preferably 0.1 mass of mass %~20 %, the more preferable 0.5 mass mass of %~15 %, further preferred 1 of unit a2) The mass of quality %~10 %.

The content (content ratio: mass ratio) of Component units a2 in particular polymers can pass through basis¹³C-NMR measurement Confirmed using the intensity ratio of the peak strength of conventional method calculating.

< < Component units a3 > >

Above-mentioned particular polymers can also be comprising having acidic group protected group in the form of acetal in addition to above-mentioned Other Component units (otherwise referred to as " Component units a3 " other than Component units and Component units with acidic group.).

As the monomer for forming other Component units, there is no particular restriction, such as can enumerate phenylethylene, (methyl) third Olefin(e) acid Arrcostab, (methyl) acrylic acid cyclic alkyl ester, (methyl) benzyl acrylate, unsaturated dicarboxylic diester, it is bicyclic not Saturated compounds, maleimide compound, unsaturated aromatic compound, conjugated diene based compound, unsaturated monocarboxylic, Unsaturated dicarboxylic, unsaturated dicarboxylic acid anhydride, group and other unsaturated compounds with aliphatic ring type skeleton.

Using other Component units, adjust in type and content at least any one, it is above-mentioned specific poly- thus, it is possible to adjust Close the various characteristics of object.In particular, other Component units are suitably used, thus, it is possible to be easy for the Tg of particular polymers to be adjusted to 90 DEG C or less.

Above-mentioned particular polymers can also contain two or more only containing other a kind of Component units.

About other Component units, specifically, can enumerate from styrene, t-butoxystyrene, methylbenzene second Alkene, hydroxy styrenes, α-methylstyrene, acetoxy-styrene, methoxy styrene, ethoxystyrene, chlorostyrene, Vinylbenzoic acid methyl esters, vinylbenzoic acid ethyl ester, 4-HBA (3- methacryloxypropyl) ester, (methyl) propylene Sour methyl esters, (methyl) ethyl acrylate, (methyl) n-propyl, (methyl) isopropyl acrylate, (methyl) acrylic acid 2- Hydroxy methacrylate, (methyl) acrylic acid 2- hydroxy propyl ester, (methyl) acrylic acid benzil, (methyl) dicyclopentanyl acrylate, (methyl) cyclohexyl acrylate, (methyl) isobomyl acrylate, acrylonitrile or ethylene glycol monoacylphosphine acetic acid esters list (methyl) third The Component units of olefin(e) acid ester etc..Furthermore it is possible to enumerate 0021 section~0024 Duan Zhongji of Japanese Unexamined Patent Publication 2004-264623 bulletin The compound of load.

Also, preferably have from the viewpoint of the electrical characteristics for improving available transfer materials as other Component units There are the group of aromatic rings or the group with aliphatic ring type skeleton.Specifically, styrene, tert-butoxy benzene second can be enumerated Alkene, methyl styrene, α-methylstyrene, (methyl) dicyclopentanyl acrylate, (methyl) acrylate esters, (methyl) third Olefin(e) acid isobornyl thiocyanoacetate and (methyl) acrylic acid benzil etc..Wherein, it as other Component units, preferably enumerates and is originated from The Component units of (methyl) cyclohexyl acrylate.

Also, as the monomer for forming other Component units, from the viewpoint of lamination adaptability and resolution ratio, preferably (methyl) alkyl acrylate, more preferable alkyl acrylate, the particularly preferably acrylic acid of the alkyl with carbon atom number 4~12 Arrcostab.Specifically, (methyl) methyl acrylate, (methyl) ethyl acrylate, (methyl) acrylic acid propyl, (first can be enumerated Base) n-butyl acrylate and (methyl) 2-EHA.

In addition, above-mentioned particular polymers preferably have the Component units indicated by following formula 2 as other Component units.

[chemical formula 8]

In formula 2, R^bIndicate hydrogen atom or methyl, R^cIndicate alkyl.

R from the viewpoint of lamination adaptability and resolution ratio, in formula 2^bPreferably hydrogen atom.

R from the viewpoint of lamination adaptability and resolution ratio, in formula 2^cThe preferably alkyl of carbon atom number 1~20, more The preferably alkyl of carbon atom number 2~12, the further preferably alkyl of carbon atom number 4~12, especially preferably carbon atom number 5 ~9 alkyl.

Also, R^cIn alkyl can be straight chain, it is possible to have branch, it is possible to have ring structure.

Relative to the gross mass of above-mentioned particular polymers, the content of Component units a3 preferably 85 mass % are hereinafter, more preferably 80 mass % are hereinafter, further preferred 75 mass % or less.Can be 0 mass % as lower limit value, preferably 1 mass % with On, more preferably 5 mass % or more, further preferably 10 mass % or more.

Also, from the viewpoint of lamination adaptability and resolution ratio, relative to the gross mass of above-mentioned particular polymers, by upper State content preferably 10 mass of mass %~85 %, more preferable 15 mass %~80 mass %, into one of the Component units of the expression of formula 2 Walk preferably 20 mass of mass %~75 %.

As the preference of the particular polymers in present embodiment, A-1~A-15 used in embodiment etc. can be enumerated, But it is not limited to these certainly.

The manufacturing method > > of < < particular polymers

The manufacturing method (synthetic method) of above-mentioned particular polymers is not particularly limited, if but enumerate an example, it can contain There is the polymerizable monomer for the Component units a1 for being used to form the protected group in the form of acetal with acidic group and is used to form The polymer monomer of Component units a2 with acidic group and then polymerism that is as needed and being used to form other Component units a3 In the organic solvent of monomer, synthesized by using polymerization initiator polymerization.Also, it also can be anti-by so-called macromolecule It should be synthesized.

Other polymers-

Above-mentioned photo-sensitive resin is as component of polymer, also may include not having other than above-mentioned particular polymers The polymer (otherwise referred to as " other polymers " of acidic group Component units a1 of protected group in the form of acetal.).On Photo-sensitive resin is stated comprising in the case where other polymers, in total polymer ingredient, the blending amount of other polymers is preferred For 50 mass % hereinafter, more preferably 30 mass % are hereinafter, further preferably 20 mass % or less.

Other polymers can only include one kind, also may include two or more.

The component of polymer of present embodiment is as other polymers, preferably also comprising the polymer with acidic group.

As acidic group, carboxyl is preferably enumerated.

As the polymer with acidic group, there is no particular restriction, is able to use known polymer, but it is preferable to use have The polymer (threadlike organic polymers) of linear acidic group.It, can be arbitrarily using known as this threadlike organic polymers Polymer.In order to carry out water development or weak base water development, preferably selecting in water or week-base water is soluble or swellability Threadlike organic polymers.Threadlike organic polymers serve not only as film forming agent, according to water, week-base water or organic solvent As developer purposes and select to use.For example, if being able to carry out water development using water dissolvable organic polymer.Make For this threadlike organic polymers, the free radical polyalcohol that there is carboxylic acid group in side chain, such as Japanese Unexamined Patent Application 59- can be enumerated No. 044615 bulletin, Japanese Patent Publication 54-034327 bulletin, Japanese Patent Publication 58-012577 bulletin, Japanese Patent Publication 54-025957 bulletin, Japanese Unexamined Patent Application 54-092723 bulletin bulletin, Japanese Unexamined Patent Application 59-053836 bulletin, Japan Even if described in tekiaki 59-071048 bulletin, with carboxyl monomer homopolymerization or copolymerization resin, make that there is acid anhydrides Monomer homopolymerization or copolymerization and anhydride unit is hydrolyzed or half-esterification or semi-amidation resin, by unsaturated monocarboxylic And acid anhydrides makes the epoxy acrylate etc. of epoxy resin modification.As the monomer with carboxyl, acrylic acid, metering system can be enumerated Acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, 4- carboxyl styrene etc. can enumerate maleic acid as the monomer with acid anhydrides Acid anhydride etc..

Also, in the same manner with the acid cellulose derivative in side chain with carboxyl.This has the polymerization of other hydroxyls Derivative of addition cyclic acid anhydride etc. is very useful in object.

Polymer with acidic group can also contain two or more individually containing one kind.

In the case that the photo-sensitive resin of present embodiment contains the polymer with acidic group, the polymer with acidic group Content there is no particular restriction, but the total solid content relative to photo-sensitive resin, the preferably 1 mass % of mass %~70, The more preferably 2 mass % of mass %~50, further preferably 5 mass of mass %~30 %.

Also, as other polymers, such as it is able to use polycarboxylated styrene, is also able to use commercially available SMA 1000P, SMA 2000P, SMA 3000P, SMA 1440F, SMA 17352P, SMA 2625P and SMA 3840F (more than, Sartomer Company, Inc system), ARUFON UC-3000, ARUFON UC-3510, ARUFON UC-3900, ARUFON UC-3910, ARUFON UC-3920 and ARUFON UC-3080 (more than, TOAGOSEI CO., LTD. system) and Joncryl 690, Joncryl 678, Joncryl 67 and Joncryl 586 (more than, BASF AG's system) etc..

The average value-of the I/O value of component of polymer

In the component of polymer used in the present embodiment, from the viewpoint of fissility, based on organic conceptional diagram Inorganic value I is preferably 0.55 or more and 0.65 hereinafter, 0.57 or more and 0.63 divided by the average value of the I/O value of organic value O Below.

Also, the I/O value of the particular polymers used in the present embodiment includes upper with the average value of above-mentioned I/O value The mode stated in range is suitably set, preferably 0.55 or more and 0.65 hereinafter, further preferably 0.57 or more and 0.63 or less.

About above-mentioned I/O value, organic conceptional diagram (first Tian Shansheng writes, three publish (1984) altogether)；KUMAMOTO PHARMACEUTICAL BULLETIN, No. 1, page 1~16 (1954)；Chemical field, volume 11, No. 10,719~ Page 725 (nineteen fifty-seven)；FRAGRANCE JOURNAL, No. 34, page 97~111 (1979 years)；FRAGRANCE JOURNAL, No. 50, page 79~82 (1981)；There is detailed description in equal documents.The concept of I/O value is by the property of compound It is divided into the inorganic nature group of the Organic group for showing covalent keyness and display ion keyness, and all organic compounds is determined Position be named as arbor, every 1 point in the orthogonal coordinates without arbor and show.

Contain I/O value when two or more polymer about component of polymer, it can be considered that being as described below.For example, In the case where component of polymer contains there are three types of polymer (1~polymer of polymer 3), by the I/O value of polymer 1 be set as A1, Mass fraction is set as M1, the I/O value of polymer 2 is set as A2, mass fraction is set as to M2, is set as the I/O value of polymer 3 A3, when mass fraction is set as M3, the I/O value Am of blending constituent can conclude that into as described below.

Am=A1 × M1+A2 × M2+A3 × M3

In addition, in the case where component of polymer only individually contains a kind of polymer, contained only a kind of polymer I/O value becomes the average value of the I/O value in component of polymer.

The average value-of the glass transition temperature of component of polymer

From the viewpoint of lamination adaptability, the glass transition temperature of the component of polymer used in the present embodiment (Tg) average value is 90 DEG C hereinafter, being preferably -20 DEG C~90 DEG C, more preferably 20 DEG C~90 DEG C, further preferably 20 DEG C ~60 DEG C, especially preferably 25 DEG C~45 DEG C.

Also, the Tg of the particular polymers used in the present embodiment is included in above range with the average value of above-mentioned Tg Interior mode is suitably set, preferably 0 DEG C or more and 90 DEG C hereinafter, more preferably 20 DEG C or more and 70 DEG C hereinafter, into one Preferably 20 DEG C or more and 50 DEG C or less of step.

The glass transition temperature of the resins such as the polymer in present embodiment is come using differential scanning calorimetry measurement (DSC) It is measured.

Specific measuring method is according to the method recorded in JIS K 7121 (1987) or JIS K 6240 (2011) It carries out.Glass transition temperature in this specification is able to use extrapolation glass transition start temperature (hereinafter, sometimes referred to as Tig)。

The measuring method of glass transition temperature is more specifically illustrated.

In the case where finding out glass transition temperature, the Tg of the polymer than anticipation it is low about 50 DEG C at a temperature of keep After stablizing to device, with heating speed: 20 DEG C/min, being heated to high about 30 DEG C of the temperature of the temperature terminated than glass transition Degree describes DTA curve or DSC curve.

Glass transition temperature Tg in glass transition start temperature (Tig) i.e. this specification of extrapolating is as DTA curve Or the song of straight line of the base line extension of the low temperature side in DSC curve to high temperature side and the change in ladder shape part in glass transition Line slope becomes the temperature of the intersection point of the tangent line drawn on maximum point and finds out.

As the method that the Tg of polymer is adjusted to above-mentioned preferred scope, such as according to the polymer for being set as target The mass ratio of the Tg of the homopolymer of each Component units and each Component units can control using FOX formula as guidance and be set as target The Tg of polymer.

About FOX formula,

For example, the Tg of the homopolymer of the 1st Component units contained in polymer is set as in the case where for 2 membered copolymers Tg1, is set as W1 for the mass fraction in the copolymer of the 1st Component units, and the Tg of the homopolymer of the 2nd Component units is set as Tg2, When mass fraction in the copolymer of 2nd Component units is set as W2, the copolymerization comprising the 1st Component units and the 2nd Component units The Tg0 (K) of object can be inferred according to following formula.

FOX formula: 1/Tg0=(W1/Tg1)+(W2/Tg2)

Also, in the case where for 3 yuan or more of n membered copolymer, by the homopolymer of the n-th Component units contained in polymer Tg be set as Tgn, when the mass fraction in the copolymer of the n-th Component units is set as Wn, as described above, can according to Following formula is inferred.

FOX formula: 1/Tg0=(W1/Tg1)+(W2/Tg2)+(W3/Tg3) ...+(Wn/Tgn)

Using above-mentioned FOX formula, the type and mass fraction of each Component units contained in copolymer are adjusted, so as to Obtain the copolymer with desired Tg.

Also, by adjusting the weight average molecular weight of polymer, the Tg of polymer can be also adjusted.

Also, as the method for separating above-mentioned particular polymers etc. from the above-mentioned photo-sensitive resin for measuring Tg etc., Preferably enumerating is dissolved in above-mentioned photo-sensitive resin after organic solvent, by reprecipitation method come isolated method.

Contain glass transition temperature when two or more polymer about component of polymer, can examine as follows Consider.For example, in the case where component of polymer polymer (1~polymer of polymer 3) containing there are three types of, by the glass of polymer 1 Change transition temperature and be set as Tg1 (K), mass fraction is set as M1, the glass transition temperature of polymer 2 is set as Tg2 (K), it will Mass fraction is set as M2, and the glass transition temperature of polymer 3 is set as Tg3 (K), when mass fraction is set as M3, is mixed into The glass transition temperature Tg m (K) divided can be inferred as following.

1/Tgm=1/Tg1 × M1+1/Tg2 × M2+1/Tg3 × M3

In addition, in the case that component of polymer only individually contains a kind of polymer, contained only a kind of Tg of polymer Average value as the Tg in component of polymer.

The weight average molecular weight-of component of polymer

The molecular weight of component of polymer in terms of polystyrene conversion weight average molecular weight (Mw) preferably 60,000 or less.Pass through The weight average molecular weight of above-mentioned polymer be 60,000 hereinafter, the melt viscosity of photo-sensitive resin is suppressed to it is lower, with it is upper State the fitting that can be realized under low temperature (such as 130 DEG C or less) when substrate fitting.

Also, the weight average molecular weight of above-mentioned component of polymer is preferably 2,000~60,000, more preferably 3,000~50, 000。

The weight average molecular weight of the particular polymers used in the present embodiment is with the Weight-average molecular of above-mentioned component of polymer Amount includes that mode within the above range is suitably set, and preferably 6,000 or more and 40,000 hereinafter, further preferably 10,000 or more and 30,000 or less.

In addition, the weight average molecular weight of the resins such as polymer in present embodiment by GPC (gel permeation chromatography) come Measurement.

When measuring weight average molecular weight by gel permeation chromatography (GPC), HLC (registration is able to use as measurement device Trade mark) -8220GPC (TOSOH CORPORATION system), it is able to use as tubing string by TSKgel (registered trademark) Super HZM-M (4.6mmID × 15cm, TOSOH CORPORATION system), Super HZ4000 (4.6mmID × 15cm, TOSOH CORPORATION system), Super HZ3000 (4.6mmID × 15cm, TOSOH CORPORATION system), Super HZ2000 The device of each series connection of (4.6mmID × 15cm, TOSOH CORPORATION system), is able to use as eluent THF (tetrahydrofuran).

Also, as determination condition, sample solution concentration can be set as to 0.2 mass %, flow velocity is set as 0.35ml/min, it will Sample injection rate is set as 10 μ l, and measuring temperature is set as 40 DEG C, and carry out using differential refractive index (RI) detector.

Calibration curve can using TOSOH CORPORATION " standard sample TSK standard, Polystyrene ": " F-40 ", " F-20 ", " F-4 ", " F-1 ", " A-5000 ", " A-2500 " and " A-1000 " this 7 samples Any of make.

The ratio between the number-average molecular weight and weight average molecular weight of above-mentioned particular polymers ingredient (dispersion degree) preferably 1.0~5.0, more It is preferred that 1.05~3.5.

The amount-of the acidic group of component of polymer

From the viewpoint of fissility, the content of the Component units with acidic group of the gross mass relative to component of polymer Gross mass relative to component of polymer be 0.5 mass % or more and 15 mass % hereinafter, more preferably 0.5 mass % or more and 12 mass % are hereinafter, further preferably 1 mass % or more and 10 mass % or less.

The content of the above-mentioned Component units with acidic group is that will be included in polymerization relative to the gross mass of component of polymer Component units with acidic group when all polymer in object ingredient resolve into Component units (monomeric unit) contain quality Ratio.

From the viewpoint of lamination adaptability, the above-mentioned photo-sensitive resin in present embodiment is relative to photoresist The gross mass of layer, preferably contains above-mentioned component of polymer with the ratio of 50 mass of mass %~99.9 %, more preferably with 70 matter The ratio of the amount mass of %~98 % contains.

Also, above-mentioned photo-sensitive resin is from the viewpoint of showing good adaptation relative to aforesaid substrate, relatively Above-mentioned particular polymers are preferably included with the ratio of 50 mass of mass %~99.9 % in the gross mass of photo-sensitive resin, it is more excellent It selects with the ratio of 70 mass of mass %~98 % and includes.

(photoacid generator)

Above-mentioned photo-sensitive resin contains photoacid generator.

As the photoacid generator used in the present embodiment be can by irradiation ultraviolet light, far ultraviolet, X-ray and Charged particle beam isoreactivity radioactive ray and generate acid compound.

As the photoacid generator used in the present embodiment, preferably induction wavelength 300nm or more, preferably wavelength The activation light of 300nm~450nm, and the compound of acid is generated, but be not restricted to the chemical structure.Even if also, for not The photoacid generator for directly incuding the activation light of wavelength 300nm or more, as long as to incude wavelength 300nm by and with sensitizer Above activation light simultaneously generates the compound of acid, then can be combined with sensitizer it is preferable to use.

As the photoacid generator that the photoacid generator used in the present embodiment, preferably generation pKa are 4 acid below, more It is preferred that generating the photoacid generator that pKa is 3 acid below, the photoacid generator that pKa is 2 acid below is particularly preferably generated.Under pKa There is no particular limitation for limit value, but is for example preferably -10.0 or more.

As photoacid generator, ionic photoacid generator and nonionic photoacid generator can be enumerated.

Also, as photoacid generator, from the viewpoint of sensitivity and resolution ratio, preferably comprise selected from by aftermentioned salt At least one compound of the group of compound and aftermentioned oxime sulfonate compound composition more preferably includes oxime sulfonate chemical combination Object.

As the example of nonionic photoacid generator, trichloromethyl s-triazine, diazomethane compound, acyl can be enumerated Imines sulfonate compound and oxime sulfonate compound etc..In these, examined from the viewpoint of sensitivity, resolution ratio and adaptation Consider, preferably photoacid generator is oxime sulfonate compound.It is two or more next that a kind of or combination can be used alone in these photoacid generators It uses.As trichloromethyl s-triazine and the concrete example of diazomethane derivative, Japanese Unexamined Patent Publication 2011- can be illustrated in The compound recorded in 0083 section of No. 221494 bulletins~0088 section.

It is the compound with oxime sulfonate structure as oxime sulfonate compound, preferably comprising is indicated with following formula (B1) Oxime sulfonate structure compound.

[chemical formula 9]

In formula (B1), R²¹Indicate alkyl or aryl, * indicates to be bonded position with other atoms or other groups.

Any group of compound comprising the oxime sulfonate structure indicated with formula (B1) can be substituted, R²¹In alkyl It can be straight-chain, can also have branched structure, can also have ring structure.The substituent group being allowed to is described below.

As R²¹Alkyl, the preferred straight-chain or branch-like alkyl of carbon atom number 1~10.R²¹Alkyl can be by carbon The aryl of atomicity 6~11, the alkoxy of carbon atom number 1~10, naphthenic base (include 7,7- dimethyl -2- oxo norborny Equal bridge connecteds alcyl, preferably bicyclic alkyl etc.) or halogen atom substitution.

As R²¹Aryl, the preferred aryl of carbon atom number 6~18, more preferable phenyl or naphthyl.R²¹Aryl can be chosen The alkyl of free carbon atom number 1~4, more than one group of the group of alkoxy and halogen atom composition replace.

Compound comprising the oxime sulfonate structure indicated with formula (B1) is preferably also at Japanese Unexamined Patent Publication 2014-085643 The oxime sulfonate compound recorded in 0078 section of bulletin~0111 section.

From the viewpoint of sensitivity, containing the compound by formula (B1) oxime sulfonate structure indicated preferably also under The compound that formula (B2) indicates.

[chemical formula 10]

In formula B2, whole haloalkyl or perhaloaryl, R are indicated²Indicate alkoxy, R³Indicate alkyl, aryl or perhalogeno Substituted alkyl.

In this specification, " whole haloalkyl " refers to that more than one hydrogen atom is taken by halogen atom as long as without other explanations The alkyl in generation, " perhaloaryl " refer to the aryl that more than one hydrogen atom is replaced by halogen atom as long as without other explanations.

As above-mentioned halogen atom, fluorine (F), chlorine (Cl), bromine (Br), iodine (I) etc., preferably fluorine atom can be enumerated.

In formula B2, R¹Preferably the whole haloalkyl of carbon atom number 1~12, carbon atom number 6~10 perhaloaryl, The more preferably whole haloalkyl of carbon atom number 1~12, the more preferably whole haloalkyl of carbon atom number 1~4, further preferably For-CF₃Base.

In formula B2, R²For alkoxy, the preferably alkoxy of carbon atom number 1~4, more preferably methoxyl group.

In formula B2, R³The preferably whole haloalkyl of carbon atom number 1~4 or the alkyl of carbon atom number 1~4, carbon atom The aryl of number 6~10.

As the preferred concrete example of the compound indicated by formula B2, following structures can be illustrated.

Wherein, these are not limited to by the compound that formula B2 is indicated.

[chemical formula 11]

As the example of ionic photoacid generator, Diaryl iodonium salt and triarylsulfonium salt compounds etc. can be enumerated Salt compound, quaternary ammonium salt etc..In these, preferred salt compound, particularly preferred triaryl matte salt and Diaryl iodonium Salt.

As ionic photoacid generator, also can it is preferable to use 0114 section of Japanese Unexamined Patent Publication 2014-085643 bulletin~ The ionic photoacid generator recorded in 0133 section.

Photoacid generator can be used alone, can also be simultaneously using two or more.

From the viewpoint of sensitivity and resolution ratio, the content of the photoacid generator in above-mentioned photo-sensitive resin is relative to upper The gross mass for stating photo-sensitive resin is preferably the 0.5 mass % of mass %~20, the more preferably 1 mass % of mass %~15, into One step is preferably 1 mass of mass %~10 %.

(solvent)

When forming above-mentioned photo-sensitive resin, preferably to the photonasty comprising component of polymer, photoacid generator and solvent Resin combination is coated dry and is formed.

More specifically, for above-mentioned photo-sensitive resin easy to form, above-mentioned photoresist is adjusted containing solvent The viscosity of composition is coated and dries to solvent-laden above-mentioned photosensitive polymer combination is wrapped, can be properly formed State photo-sensitive resin.

As solvent, ethylene glycol monoalkyl ether class, glycol dialkyl ether class, ethylene glycol monoalkyl ether acetic acid can be illustrated Esters, propylene-glycol monoalky lether class, propylene glycol dialkyl ether, propylene-glycol monoalky lether acetate esters, diethylene glycol dialkyl group Ethers, diethylene glycol monoalkyl ether acetate class, dipropylene glycol monoalkylether class, dipropylene glycol dialkyl ether, dipropylene glycol Monoalkyl ether acetate class, esters, ketone, amides and lactone etc..Also, it can also enumerate as the concrete example of solvent in day The solvent recorded in 0174 section of this special open 2011-221494 bulletin~0178 section, these contents are incorporated into this specification In.

Also, in above-mentioned solvent, benzyl ether, two hexyl ethers, ethyleneglycol monophenylether can further be added as needed Acetic acid esters, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, isophorone, caproic acid, octanoic acid, 1- octanol, 1 nonyl alcohol, benzylalcohol, benzene Methyl ether, benzyl acetate, ethyl benzoate, diethy-aceto oxalate, diethyl maleate, ethylene carbonate or propylene carbonate etc. are molten Agent.

One kind can be used only in solvent, also can be used two or more.

Solvent can be used alone, and more preferably use two kinds simultaneously.When using two or more solvents, preference As used propylene-glycol monoalky lether acetate esters and dialkyl ether simultaneously, using oxalic acid esters and diethylene glycol dioxane simultaneously Base ethers uses esters and butanediol alkylether acetates class simultaneously.

Also, as solvent, preferably 130 DEG C of boiling point 160 DEG C of solvent, boiling points more than or lower than 160 DEG C or more it is molten Agent or these mixture.

As 130 DEG C of the boiling point solvents more than or lower than 160 DEG C, propylene glycol methyl ether acetate (boiling point 146 can be illustrated DEG C), propylene glycol monoethyl ether acetate (158 DEG C of boiling point), propylene glycol methyl-n-butyl ether (155 DEG C of boiling point) and propylene glycol methyl-is just Propyl ether (131 DEG C of boiling point).

As 160 DEG C of boiling point or more of solvent, 3- ethoxyl ethyl propionate (170 DEG C of boiling point), diethylene glycol can be illustrated Methyl ether (176 DEG C of boiling point), propylene glycol monomethyl ether propionate (160 DEG C of boiling point), dipropylene glycol methyl ether acetic acid esters (boiling point 213 DEG C), 3- methoxyl group butyl ether acetic acid esters (171 DEG C of boiling point), diethylene glycol diethyl ether (189 DEG C of boiling point), diethylene glycol dimethyl ether (boiling Point 162 DEG C), propylene-glycol diacetate (190 DEG C of boiling point), diethylene glycol monoethyl ether acetic acid esters (220 DEG C of boiling point), dipropylene glycol two Methyl ether (175 DEG C of boiling point) and 1,3 butylene glycol diacetate esters (232 DEG C of boiling point).

The content of solvent when as the above-mentioned photosensitive polymer combination of coating, it is preferably total in photosensitive polymer combination Every 100 mass parts of solid component are 50 mass parts~1,900 mass parts, more preferably 100 mass parts~900 mass parts.

Also, the content of the solvent in above-mentioned photo-sensitive resin is preferred relative to the gross mass of above-mentioned photo-sensitive resin For 2 mass % hereinafter, more preferably 1 mass % is hereinafter, further preferably 0.5 mass % or less.

(other additives)

It, can in above-mentioned photo-sensitive resin in present embodiment other than above-mentioned particular polymers and photoacid generator It as needed include known additive.

Plasticizer-

Above-mentioned photo-sensitive resin can also contain plasticizer for the purpose of improving plasticity.

The weight average molecular weight of above-mentioned plasticizer is preferably smaller than the weight average molecular weight of above-mentioned particular polymers.

The weight average molecular weight of plasticizer is from the viewpoint of assigning plasticity, and preferably 500 more than and less than 10,000, more preferably 700 more than and less than 5,000, still more preferably 800 more than and less than 4,000.

There is no particular limitation as long as compound compatible and showing plasticity with above-mentioned particular polymers for plasticizer, from From the viewpoint of assigning plasticity, preferred plasticizer has alkylidene oxygroup in the molecule.Contained alkylene oxide in plasticizers Base preferably has following structures.

[chemical formula 12]

In above-mentioned formula, R is the alkylidene of carbon atom number 2~8, and n indicates that 1~50 integer, * indicate and other atoms It is bonded position.

In addition, for example, even if (being set as " compound X " for the compound with above-mentioned alkylidene oxygroup.), mixed compound X, photo-sensitive resin obtained from above-mentioned particular polymers and photoacid generator and the photoresist formed without compound X In the case that layer is not improved compared to plasticity, the plasticizer in present embodiment is not met.For example, the surface arbitrarily added is living Property agent usually therefore the plasticizer in this specification will not be met so that amount of the photo-sensitive resin with plasticity uses.

As plasticizer, such as the compound with following structures can be enumerated, but be not limited to these.

[chemical formula 13]

Using plasticizer, from the viewpoint of lamination adaptability, the content of plasticizer is relative to above-mentioned sense The gross mass of photosensitive resin layer is preferably the 1 mass % of mass %~50, more preferably 2 mass of mass %~20 %.

Above-mentioned photo-sensitive resin can only include a kind of plasticizer, also may include two or more.

Sensitizer-

Above-mentioned photo-sensitive resin can also include sensitizer.

Sensitizer absorbs active radioactive ray (activation light) and becomes Electron Excitation state.Increasing as Electron Excitation state Sense agent contacts with photoacid generator and generates the effects of electronics is mobile, energy is mobile and fever.Thus photoacid generator generates chemistry and becomes Change and decomposes and generate acid.

By containing sensitizer, exposure sensitivity can be improved.

As sensitizer be preferably selected from by anthracene derivant, acridone derivatives, thioxanthone derivates, coumarin derivative, The compound of the group of basicity styrene derivative and diphenylethyllene benzene derivative composition, more preferable anthracene derivant.

As anthracene derivant, preferably anthracene, 9,10- dibutoxy anthracene, 9,10-, bis- chrloroanthracene, 2- ethyl -9,10- dimethoxy Anthracene, 9- methylol anthracene, 9- bromine anthracene, 9- chrloroanthracene, 9,10- dibromoanthracene, 2- ethyl anthracene or 9,10- dimethoxy anthracene.

As above-mentioned sensitizer, 0139 section~0141 Duan Zhongji at International Publication No. 2015/093271 can be enumerated The compound of load.

The content of sensitizer is preferably the 0 mass % of mass %~10 relative to the gross mass of above-mentioned photo-sensitive resin, more Preferably 0.1 mass of mass %~10 %.

Alkali compounds-

Above-mentioned photo-sensitive resin preferably also contains alkali compounds.

As alkali compounds, can arbitrarily be selected from the alkali compounds used in the resist.Such as it can lift Aliphatic amine, aromatic amine, hetero ring type amine, season ammonium hydroxide and quaternary ammonium salt of carboxylic acid etc. out.As these concrete example, can lift The compound recorded in 0204 section~0207 section of Japanese Unexamined Patent Publication 2011-221494 bulletin out, these contents are incorporated into this In specification.

Specifically, as aliphatic amine, such as Trimethylamine, diethylamide, triethylamine, diη-propyl can be enumerated Amine, three n-propyl amine, two n-pentyl amine, three n-pentyl amine, diethanol amine, triethanolamine, dicyclohexylamine and dicyclohexyl first Amine etc..

As aromatic amine, such as aniline, benzylamine, n,N-Dimethylaniline and diphenylamines can be enumerated etc..

As hetero ring type amine, such as pyridine, 2- picoline, 4- picoline, 2- ethylpyridine, 4- hexyl pyrrole can be enumerated Pyridine, 2- phenylpyridine, 4- phenylpyridine, N- methyl 4-phenyl pyridine, 4-dimethylaminopyridine, imidazoles, benzimidazole, 4- first Base imidazoles, 2-Phenylbenzimidazole, 2,4,5- triphenylimidazolyl, nicotine, niacin, niacinamide, quinoline, 8- oxygen quinoline, pyrazine, pyrrole Seat, pyridazine, purine, pyrrolidines, piperidines, piperazine, morpholine, 4- methyl morpholine, 1,5- diazabicyclo [4.3.0] -5- nonene and 1,8- diazabicyclo [5.3.0] -7- endecatylene etc..

As season ammonium hydroxide, such as tetramethyl ammonium hydroxide, tetraethyl ammonium hydroxide, hydroxide tetra-n-butyl can be enumerated Four n-hexyl ammonium of ammonium and hydroxide etc..

As the quaternary ammonium salt of carboxylic acid, such as tetramethyl ammonium acetate, durol ammonium formate, tetra-n-butyl ammonium acetate can be enumerated And tetra-n-butyl ammonium benzoate etc..

Alkali compounds can be used alone, can also be simultaneously using two or more.

The content of alkali compounds is preferably 0.001 matter of mass %~5 relative to the gross mass of above-mentioned photo-sensitive resin Measure %, more preferably 0.005 mass of mass %~3 %.

Miscellaneous cyclic compound-

Above-mentioned photo-sensitive resin in present embodiment can include the compound containing miscellaneous cyclic compound.

There is no particular restriction for miscellaneous cyclic compound in present embodiment.Such as it can be added in intramolecular as described below Compound with epoxy group or oxetanylmethoxy, the miscellaneous cyclic compound containing alkoxy methyl, other various cyclic ethers, ring-type Containing acid plain monomer, cyclic amine, this nitrogen containing monomer of oxazoline group, be further able to addition silicon, sulphur, phosphorus etc. has ester (lactone) etc. The heterocyclic monomer etc. of d electronics.

When adding miscellaneous cyclic compound, the additive amount of the miscellaneous cyclic compound in above-mentioned photo-sensitive resin is relative to sense The gross mass of photosensitive resin layer is preferably the 0.01 mass % of mass %~50, more preferably the 0.1 mass % of mass %~10, into one Step is preferably 1 mass of mass %~5 %.If above range, then from the viewpoint of adaptation and etching patience, preferably.It is miscellaneous One kind can be used only in cyclic compound, also can be simultaneously using two or more.It is above-mentioned at the same time using in the case where two or more Preferred content refers to the total content of two or more miscellaneous cyclic compounds.

As the concrete example of the compound in the molecule with epoxy group, bisphenol A type epoxy resin, Bisphenol F can be enumerated Type epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin, aliphatic epoxy resin etc..

The compound with epoxy group can be bought as commercially available product in the molecule.Such as can enumerate JER828, JER1007, JER157S70 (Mitsubishi Chemical Corporation system), JER157S65 (Mitsubishi Chemical Holdings Co., Ltd. system) etc. and recorded in 0189 section of Japanese Unexamined Patent Publication 2011-221494 bulletin Commercially available product etc..

As other commercially available products, ADEKA RESIN EP-4000S, ADEKA RESIN EP-4003S, ADEKA can be enumerated RESIN EP-4010S, ADEKA RESIN EP-4011S (more than, ADEKA Corporation system), NC-2000, NC- 3000, NC-7300, XD-1000, EPPN-501, EPPN-502 (more than, ADEKA Corporation system), DENACOL EX- 611、EX-612、EX-614、EX-614B、EX-622、EX-512、EX-521、EX-411、EX-421、EX-313、EX-314、 EX-321、EX-211、EX-212、EX-810、EX-811、EX-850、EX-851、EX-821、EX-830、EX-832、EX-841、 EX-911、EX-941、EX-920、EX-931、EX-212L、EX-214L、EX-216L、EX-321L、EX-850L、DLC-201、 DLC-203、DLC-204、DLC-205、DLC-206、DLC-301、DLC-402、EX-111、EX-121、EX-141、EX-145、 EX-146, EX-147, EX-171, EX-192 (more than, Nagase ChemteX Corporation system), YH-300, YH-301, YH-302, YH-315, YH-324, YH-325 (more than, NIPPON STEEL&SUMIKIN CHEMICAL CO., LTD. system), CELLOXIDE 2021P、2081、2000、3000、EHPE3150、Epolead GT400、CELVENUS B0134、B0177 (Daicel Corporation system) etc..

The compound with epoxy group can be used alone in the molecule, can also be simultaneously using two or more.

In the molecule in the compound with epoxy group, it may be more preferable to enumerate bisphenol A type epoxy resin, bisphenol F type epoxy Resin, phenol novolak type epoxy resin and aliphatic epoxy resin can particularly preferably enumerate aliphatic epoxy resin.

As the concrete example of the compound in the molecule with oxetanylmethoxy, it is able to use Aron Oxetane OXT- 201, OXT-211, OXT-212, OXT-213, OXT-121, OXT-221, OX-SQ, PNOX (more than, TOAGOSEI CO., LTD. System).

Also, include oxetanylmethoxy compound preferably individually or be used in mixed way with the compound comprising epoxy group.

It is excellent from the viewpoint of elching resistant and line width stability about the photo-sensitive resin in present embodiment It is elected to be and contains the compound with epoxy group for miscellaneous cyclic compound.

Alkoxysilane compound containing trialkylsilyl group in molecular structure-

Above-mentioned photo-sensitive resin can contain alkoxysilane compound containing trialkylsilyl group in molecular structure.As alkoxysilane compound containing trialkylsilyl group in molecular structure, preferably Enumerate trialkoxy silane compound.

As alkoxysilane compound containing trialkylsilyl group in molecular structure, such as gamma-amino propyl trimethoxy silicane, gamma-amino propyl three can be enumerated Ethoxysilane, γ-glycidoxypropyl group alkoxy silane, γ-glycidoxypropyl group alkyl-dialkoxysilanes, γ- Methacryloxypropyl trialkoxy silane, γ-methacryloxypropyl alkyl-dialkoxysilanes, γ-chlorine third Base trialkoxy silane, γ-mercapto propyl trialkoxy silane, β-(3,4- expoxycyclohexyl) ethyltrialkoxysilanes, second Alkene trialkoxy silane.In these, more preferable γ-glycidoxypropyl group alkoxy silane or γ-methacryloxy Propyl trialkoxy silane, further preferred γ-glycidoxypropyl group alkoxy silane, particularly preferred 3- glycidoxy third Base trimethoxy silane.These can be used alone that a kind of or combination is two or more to be used.

Surfactant-

From the viewpoint of film thickness uniformity, preferably above-mentioned photo-sensitive resin contains surfactant.It is living as surface Property agent, be able to use any one of anionic system, cationic system, nonionic system or both sexes, but preferred surfactant is non- Ionic surface active agent.

As the example of nonionic surfactants, it is high that polyoxyethylene higher alkyl ether, polyoxyethylene can be enumerated Higher aliphatic acid diesters class, the organic silicon-type, fluorine system surfactant of grade alkyl phenyl ethers, polyoxyethylene glycol.Further, it is possible to Enumerate following KP (Shin-Etsu Chemical Co., Ltd. system), Polyflow (Kyoeisha Chemical Co., Ltd. System), EFTOP (Japan Electronic Monetary Claim Organization system), Megaface (registered trademark, DIC Corporation system), Fluorad (Sumitomo 3M corporation), AsahiGuard, Surflon (registered trademark, Asahi Glass Co., Ltd. system), PolyFox (OMNOVA SOLUTIONS INC. system) and SH-8400 (Dow Corning Toray Co., Ltd. system) etc. trade names each series.

Also, as surfactant, can by Component units A and Component units B comprising being indicated with following Formulas I -1, And the weight average molecular weight of the polystyrene conversion measured when by tetrahydrofuran (THF) as solvent by gel permeation chromatography (Mw) it is enumerated for 1,000 or more and 10,000 copolymers below as preference.

[chemical formula 14]

In formula (I-1), R⁴⁰¹And R⁴⁰³Separately indicate hydrogen atom or methyl, R⁴⁰²Indicate 1 or more carbon atom number and 4 straight-chain alkyl-subs below, R⁴⁰⁴Indicate hydrogen atom or the alkyl below of carbon atom number 1 or more and 4, L indicate carbon atom number 3 with Upper and 6 alkylidenes below, p and q be the quality percentage for indicating polymerization ratio, p expression 10 mass % or more and 80 mass % with Under numerical value, q indicates that 20 mass % or more and 90 mass % numerical value below, r indicate that 1 or more and 18 integers below, s indicate 1 or more and 10 integers below, * indicate the bonding position with other structures.

L is preferably the branched alkylidene indicated with following formula (I-2).R in formula (I-2)⁴⁰⁵Indicate 1 or more carbon atom number And 4 alkyl below, from compatibility and relative to the wetability in face is applied from the viewpoint of, preferred carbon atom number 1 or more and 3 Alkyl below, the alkyl of more preferable carbon atom number 2 or 3.The sum of p and q (p+q) are preferably p+q=100 i.e. 100 mass %.

[chemical formula 15]

The weight average molecular weight (Mw) of copolymer is more preferably 1,500 or more and 5,000 or less.

Additionally it is possible to use 0017 section of No. 4502784 bulletins of Japanese Patent No., Japanese Unexamined Patent Publication 2009-237362 The surfactant recorded in 0060 section of bulletin~0071 section.

Surfactant can be used alone, can also be simultaneously using two or more.

The content of surfactant is preferably 10 mass % hereinafter, more excellent relative to the gross mass of above-mentioned photo-sensitive resin It is selected as the 0.001 mass % of mass %~10, further preferably 0.01 mass of mass %~3 %.

Other compositions-

Photo-sensitive resin in present embodiment can also add metal oxide particle, antioxidant, dispersing agent, acid Multiplication agent, development accelerant, conducting fibre, colorant, hot radical polymerization initiator, thermal acid generator, ultraviolet absorbing agent, Additive known to antisettling agent of thickener, crosslinking agent and organic or inorganic etc..

The preferred embodiment of other compositions is recorded in 0165 section~the 0184 of Japanese Unexamined Patent Publication 2014-085643 bulletin respectively Section, the content of the bulletin are incorporated into this manual.

(thickness of photo-sensitive resin)

The thickness of above-mentioned photo-sensitive resin is preferably 0.5 μm~20 μm.If photo-sensitive resin with a thickness of 20 μm with Under, then the resolution ratio of pattern is good, if 0.5 μm or more, then from the viewpoint of pattern lines and it is preferred that.

As the thickness of photo-sensitive resin, more preferable 0.8 μm~15 μm, particularly preferred 1.0 μm~10 μm.

(forming method of photo-sensitive resin)

Each ingredient and solvent can be mixed with specified ratio and with arbitrary method, and carry out stirring and dissolving and prepare It is used to form the photosensitive polymer combination of photo-sensitive resin.For example, also each ingredient can be dissolved in solvent in advance respectively In after solution is made, obtained solution is mixed with specified ratio to prepare composition.Preparation as described above Composition can be also filtered with 0.2 μm of the filter etc. in aperture after use is provided.

Photosensitive polymer combination is coated on temporary support, and is made it dry, thus, it is possible to obtain in temporary support The photosensitive transfer printing material of present embodiment on body with photo-sensitive resin.

There is no particular limitation for coating method, can be in method known to slot coated, spin coating, curtain painting, ink-jet application etc. It is coated.

In addition, can also have the layer between the temporary support and other layers of other aftermentioned layers in temporary support Photosensitive resin coating layer in stack.

Other layer of > of <

The photosensitive transfer printing material of present embodiment also can have other than above-mentioned photo-sensitive resin layer (with Under, otherwise referred to as " other layers ").As other layers, contrast enhancing layer, middle layer, cover film, thermoplastic resin can be enumerated Rouge layer etc..

< contrast enhancing layer >

The photosensitive transfer printing material of present embodiment is other than above-mentioned photo-sensitive resin, additionally it is possible to have contrast increasing Strong layer.

Contrast enhancing layer (Contrast Enhancement Layer；CEL) before exposure to the absorption of exposure wavelength Greatly, but with being exposed it absorbs and gradually becomes smaller, as material (referred to as " the light achromicity pigment that gets higher of the transmissivity containing light Ingredient ") layer.As light achromicity pigment composition, it is known to diazonium salt, stilbene azoles (stilbazolium) salt, aryl nitrous Base salt etc..As overlay film forming component, phenolic aldehyde system resin etc. is used.

In addition, spend enhancement layer as a comparison, be able to use 0004 section of Japanese Unexamined Patent Publication 6-097065 bulletin~ 0051 section, 0012 section~0055 section of Japanese Unexamined Patent Publication 6-332167 bulletin, photopolymer handbook, photopolymerization forum compile, Check meeting (1989), light polymerization technique (Technology), hummock pine volume, THE NIKKAN KOGYO forever are adjusted in industry The material recorded in SHIMBUN, LTD. (1988).

< middle layer >

On the above-mentioned photo-sensitive resin, with coating multiple and ingredient when saving after coating is prevented to be mixed into mesh , middle layer can be set.

As middle layer, it is able to use in [0084]~[0087] section of Japanese Unexamined Patent Publication 2005-259138 bulletin and records Middle layer.As middle layer, preferably it is dispersed or dissolved in water or aqueous alkali.

As the material for middle layer, such as polyvinyl alcohol resin, polyvinylpyrrolidone system resin, fibre can be enumerated Tie up prime system resin, acrylamide resin, polyethylene oxide system resin, gelatin, vinyl ether-based resin, polyamide and they The resins such as copolymer.Wherein, the combination of particularly preferred polyvinyl alcohol and polyvinylpyrrolidone.

The > such as < thermoplastic resin layer, cover film

The photosensitive transfer printing material of present embodiment for example also can successively have temporary support, thermoplastic resin layer and Positive-working photosensitive resin layer.In addition, for the purpose of protecting photo-sensitive resin, it is possible to have cover film.

About the preferred embodiment of thermoplastic resin layer, 0189 section~the 0193 of Japanese Unexamined Patent Publication 2014-085643 bulletin It is on the books in section, about the preferred embodiment of other layers, in 0194 section~0196 section of Japanese Unexamined Patent Publication 2014-085643 bulletin On the books, the content of the bulletin is incorporated into this specification.

It, can be according in Japan when the photosensitive transfer printing material of present embodiment has other layer of thermoplastic resin layer etc. The production method of the photosensitive transfer printing material recorded in 0094 section of special open 2006-259138 bulletin~0098 section makes.

For example, production has the case where photosensitive transfer printing material of present embodiment of thermoplastic resin layer and middle layer Under, the lysate (thermoplastic resin layer coating fluid) dissolved with thermoplastic organic polymer and additive is coated on temporarily It on supporter, and makes it dry and is arranged after thermoplastic resin layer, will be added in the solvent of insoluble thermoplastic resin layer Resin and additive and the preparation solution (middle layer coating fluid) prepared is coated in obtained thermoplastic resin layer, and make it It dries and middle layer is laminated.The photosensitive polymer combination that will also use the solvent preparation of insoluble middle layer is coated on to be formed Middle layer on, make it dry and photo-sensitive resin be laminated, thus, it is possible to suitably make the photonasty of present embodiment turn Print material.

(manufacturing method of circuit layout)

1st embodiment of the manufacturing method of the circuit layout for the photosensitive transfer printing material for using present embodiment is carried out Explanation.

1st embodiment of the manufacturing method of circuit layout successively includes:

Make the outermost layer of the side opposite with temporary support of the photosensitive transfer printing material of present embodiment on substrate The process (bonding process) for contacting and being bonded with aforesaid substrate；

Pattern exposure is carried out to the above-mentioned photo-sensitive resin of the above-mentioned photosensitive transfer printing material after the process of above-mentioned fitting Process (exposure process)；

The process (developing procedure) of pattern is formed to the photo-sensitive resin development after the process of above-mentioned exposure；And

The process (etching work procedure) that substrate in the region that above-mentioned pattern is not configured is etched.

Substrate in 1st embodiment of the manufacturing method of circuit layout can be the substrates such as glass, silica, film This is as substrate, or the base of the random layers such as conductive layer is set as needed on the substrates such as glass, silica, film Plate.

According to the 1st embodiment of the manufacturing method of circuit layout, fine pattern can be formed in substrate surface.

2nd embodiment of the manufacturing method of circuit layout successively includes:

Multiple conductive layers with substrate and including constituent material the 1st conductive layer different from each other and the 2nd conductive layer, upper State on the surface of substrate with far from above-mentioned substrate surface sequence be laminated with i.e. above-mentioned 1st conductive layer of outermost surfaces layer and on On the substrate for stating the 2nd conductive layer, make the side opposite with temporary support of the photosensitive transfer printing material of present embodiment most The bonding process that outer layer is bonded with above-mentioned 1st conductive layer contact；

The above-mentioned temporary support of above-mentioned photosensitive transfer printing material after above-mentioned bonding process is to above-mentioned photonasty tree 1st exposure process of rouge layer progress pattern exposure；

After the above-mentioned temporary support of photo-sensitive resin removing after above-mentioned 1st exposure process, to above-mentioned 1st exposure Photo-sensitive resin after process carries out the 1st developing procedure that development forms the 1st pattern；

It is not configured in above-mentioned multiple conductive layers in the region of above-mentioned 1st pattern at least to above-mentioned 1st conductive layer and above-mentioned The 1st etching work procedure that 2nd conductive layer is etched；

Pattern exposure is carried out with the pattern different from above-mentioned 1st pattern to above-mentioned 1st pattern after above-mentioned 1st etching work procedure The 2nd exposure process；

Above-mentioned 1st pattern after above-mentioned 2nd exposure process is developed and is formed the 2nd developing procedure of the 2nd pattern；And

At least above-mentioned 1st conductive layer is lost in the above-mentioned multiple conductive layers being not configured in the region of above-mentioned 2nd pattern Carve the 2nd etching work procedure of processing.As above-mentioned 2nd embodiment, International Publication No. 2006/190405 can be referred to, this is interior Appearance is incorporated into this specification.

The manufacturing method of the circuit layout of present embodiment can be used as touch panel or touch panel display device The manufacturing method of circuit layout.

Hereinafter, being based on the 2nd embodiment, the detailed content of each process is illustrated.

< bonding process >

An example of bonding process is illustrated schematically in Fig. 2 (a).

Firstly, there is substrate 22 and 1st conductive layer 24 and 2nd different from each other comprising constituent material in bonding process Multiple conductive layers of conductive layer 26 are being laminated with outermost with the sequence on the surface far from substrate 22 on the surface of substrate 22 On the substrate (circuit layout, which is formed, uses substrate) 20 of superficial layer i.e. the 1st conductive layer 24 and the 2nd conductive layer 26, make this above-mentioned implementation The positive-working photosensitive resin layer 14 of the photosensitive transfer printing material 100 of mode is contacted with the 1st conductive layer 24 and is bonded.In addition, sometimes Being bonded for this circuit layout formation substrate and photosensitive transfer printing material referred to as " is transferred " or " lamination ".

The outermost layer of the side opposite with temporary support can be photo-sensitive resin, be also possible to sealing layer or ultraviolet Line absorption layer.

As shown in Figure 1, there is the case where cover film 16 on the positive-working photosensitive resin layer 14 of photosensitive transfer printing material 100 Under, after photosensitive transfer printing material 100 (positive-working photosensitive resin layer 14) removal cover film 16, make photosensitive transfer printing material 100 positive-working photosensitive resin layer 14 is contacted with the 1st conductive layer 24 and is bonded.

About the fitting (transfer) on the 1st conductive layer to photosensitive transfer printing material, preferably by photosensitive transfer printing material Positive-working photosensitive resin layer stresses to be laminated on the 1st conductive layer, is carried out based on the pressurization of roller etc. and heating.In fitting, energy Enough large-duty automatic cutting laminating machine (Auto-Cut can be mentioned using laminating machine, vacuum laminator and more ) etc. laminator laminating machine known to.

In the case where the substrate of circuit layout formation substrate is resin film, can also be pasted in roll-to-roll mode It closes.

(substrate)

Be laminated on substrate in the substrate of multiple conductive layers, preferred substrates be glass baseplate or film substrate, more preferably For film substrate.In the manufacturing method of the circuit layout of present embodiment, when for touch panel circuit layout, particularly preferably Substrate is flaky resin composition.

Also, preferred substrates are transparent.

The refractive index of substrate is preferably 1.50~1.52.

Substrate can be made of Mght-transmitting base materials such as glass baseplates, be able to use with Corning Incorporated Co., Ltd. gorilla glass (Gorilla Glass) is the strengthened glass etc. of representative.Also, it, can as aforementioned transparent substrate It is preferably used in Japanese Unexamined Patent Publication 2010-086684 bulletin, Japanese Unexamined Patent Publication 2010-152809 bulletin and Japanese Unexamined Patent Publication 2010- Material used in No. 257492 bulletins.

When using film substrate as substrate, substrate more preferably high using the not substrate of optical strain and transparency, Specific material can enumerate polyethylene terephthalate (polyethylene terephthalate；PET), poly- naphthalene diformazan Sour glycol ester, polycarbonate, triacetyl cellulose, cyclic olefin polymer.

(conductive layer)

As multiple conductive layers formed on the substrate, can enumerate in common circuit layout or touch panel wiring The arbitrary conductive layer used.

As the material of conductive layer, metal and metal oxide etc. can be enumerated.

As metal oxide, ITO (Indium Tin Oxide, tin indium oxide), IZO (Indium Zinc can be enumerated Oxide, indium zinc oxide), SiO₂Deng.As metal, Al, Zn, Cu, Fe, Ni, Cr, Mo etc. can be enumerated.

The manufacturing method of circuit layout about present embodiment, at least one conductive layer includes in preferably multiple conductive layers Metal oxide.

As conductive layer, it is preferably equivalent to the electricity of the sensor of the visible portions used in capacitance type touch panel The wiring in pole figure case or periphery taking-up portion.

(circuit layout, which is formed, uses substrate)

It is on the surface of the substrate with the substrate of conductive layer.Circuit is set as by being formed to conductive layer progress pattern Wiring.In the present example, the base of multiple conductive layers such as metal oxide or metal is preferably provided on the film substrates such as PET Plate.

< exposure process (the 1st exposure process) >

It is exposed process in the first embodiment described above, the 1st exposure process is carried out in above-mentioned 2nd embodiment.It will An example of exposure process (the 1st exposure process) is illustrated schematically in Fig. 2 (b).

In exposure process (the 1st exposure process), the temporary support 12 of the photosensitive transfer printing material after bonding process Pattern exposure is carried out to positive-working photosensitive resin layer 14.

It, can be by Japanese Unexamined Patent Publication as the example of exposure process, developing procedure and other processes in present embodiment The method of 0035 section of 2006-023696 bulletin~0051 section is suitably used in present embodiment.

For example, can enumerate the photosensitive transfer printing material 100 being configured on the 1st conductive layer 24 top (with the 1st conduction The opposite side in the side of 24 contact of layer) mask 30 of the configuration with specified pattern, later, across mask 30 above mask The method etc. being exposed using ultraviolet light.

The detailed configuration of pattern and specific size are not particularly limited in present embodiment.Having has through this reality The display quality of the display device (such as touch panel) of the input unit for the circuit layout that the mode of applying manufactures is improved, and And for reducing the aspect for taking out wiring occupied area as far as possible, at least part (especially electricity of touch panel of preferred pattern Pole figure case and take out wiring part) be 100 μm of filaments below, further preferably 70 μm or less.

It wherein, can be molten as long as position that photosensitive transfer printing material is exposed can be irradiated as the light source for exposure Solution then can be selected suitably and be used in the light (for example, 365nm, 405nm etc.) of the wavelength region of developer solution.Specifically, Ultrahigh pressure mercury lamp, high-pressure sodium lamp, metal halide lamp etc. can be enumerated.

As light exposure, usually 5mJ/cm²~200mJ/cm²Left and right, preferably 10mJ/cm²~100mJ/cm²Left and right.

Also, it is also preferred that carrying out for the purpose of improving the rectangularity of pattern, linearity and before development hot place after exposure Reason.Process by being referred to as so-called PEB (Post Exposure Bake, dry after exposure), when can reduce by exposing Pattern edge caused by the standing wave generated in photo-sensitive resin it is coarse.

In addition, pattern exposure can carry out temporary support after positive-working photosensitive resin layer removing, it can also be It is exposed before removing temporary support across temporary support, removes temporary support later.In order to prevent based on photosensitive Property contact of the resin layer with mask mask contamination and the influence that avoids the foreign matter for being adhered to mask from generating exposure, preferably do not shell It is exposed from temporary support.In addition, pattern exposure can be for across the exposure of mask, or laser etc. is utilized Digital exposure.

< developing procedure (the 1st developing procedure) >

Developing procedure is carried out in the first embodiment described above, and the 1st developing procedure is carried out in above-mentioned 2nd embodiment.It will An example of developing procedure (the 1st developing procedure) is illustrated schematically in Fig. 2 (c).

Positive-working photosensitive resin layer 14 in developing procedure (the 1st developing procedure), after exposure process (the 1st exposure process) After removing temporary support 12, developed to the positive-working photosensitive resin layer 14 after exposure process (the 1st exposure process) and Form the 1st pattern 14A.

Developing procedure (the 1st developing procedure) is developed by the positive-working photosensitive resin layer to pattern exposure to form figure Case (the 1st pattern).

The development of the positive-working photosensitive resin layer of pattern exposure is able to use developer solution to carry out.

As developer solution, there is no particular limitation as long as the exposed portion that can remove positive-working photosensitive resin layer, example As being able to use developer solution known to developer solution recorded in Japanese Unexamined Patent Publication 5-072724 bulletin etc..In addition, developer solution The exposure portion of photo-sensitive resin is preferably set to carry out the developer solution of lysotype development behavior.For example, it is preferable to 0.05mol/L The concentration of (liter)~5mol/L contains the developer solution of the aqueous alkali system of the compound of pKa=7~13.Developer solution can further contain There are organic solvent, the surfactant etc. that there is Combination with water.As in the present embodiment it is preferable to use developer solution, example The developer solution recorded in 0194 section of International Publication No. 2015/093271 can such as be enumerated.

As visualization way, there is no particular limitation, can be aobvious for sheathed dip-type developing, spray development, spray and rotation Shadow, immersion development etc. it is any.Here, spray development is illustrated, it will be after developer solution blowing to exposure by spray Positive-working photosensitive resin layer can remove exposed portion.Also, it is preferred that after development, detergent etc. is carried out by spraying Blowing, removes development residue while being wiped with brush etc..The liquid temperature of developer solution is preferably 20 DEG C~40 DEG C.

The pattern comprising positive-working photosensitive resin layer obtained from development is heated alternatively, it is also possible to have Baking process afterwards.

The heating dried afterwards preferably carries out in the environment of 8.1kPa~121.6kPa, more preferably 506.6kPa's or more It is carried out under environment.On the other hand, it is more preferably carried out under the environment of 1114.6kPa or less, particularly preferably in 101.3kPa or less In the environment of carry out.

The temperature dried afterwards is preferably 80 DEG C~250 DEG C, and more preferably 110 DEG C~170 DEG C, especially preferably 130 DEG C~ 150℃。

The time dried afterwards is preferably 1 minute~30 minutes, more preferably 2 minutes~10 minutes, especially preferably 2 minutes ~4 minutes.

Drying can carry out under air environment afterwards, can also carry out under nitrogen replacement environment.

Also the other processes such as post-exposure process be can have.

< etching work procedure (the 1st etching work procedure) >

It is etched process in the first embodiment described above, the 1st etching work procedure is carried out in above-mentioned 2nd embodiment.It will An example of etching work procedure (the 1st etching work procedure) is illustrated schematically in Fig. 2 (d).

In etching work procedure (the 1st etching work procedure), it is at least right in multiple conductive layers in the region of the 1st pattern 14A to be not configured 1st conductive layer 24 and the 2nd conductive layer 26 are etched.By etching, the 1st conductive layer 24A with identical patterns is formed And the 2nd conductive layer 26A.

The etching of conductive layer can be to record in 0048 section of Japanese Unexamined Patent Publication 2010-152155 bulletin~0054 section of grade Method, etching is applied based on method known to method of the dry-etchings such as known plasma etching etc..

For example, the wet etching impregnated in etching solution usually carried out can be enumerated as engraving method.It is lost in wet type Etching solution used in quarter properly selects the etching solution of acid type or alkaline type according to etch target.

As the etching solution of acid type, it is individually water-soluble that the acid ingredients such as hydrochloric acid, sulfuric acid, hydrofluoric acid, phosphoric acid can be illustrated The mixed aqueous solution etc. of the salt such as liquid, acid ingredient and iron chloride, ammonium fluoride, potassium permanganate.It is more that combination can be used in acid ingredient Ingredient made of kind acid ingredient.

As the etching solution of alkaline type, sodium hydroxide, potassium hydroxide, ammonia, organic amine, such as tetramethylphosphonihydroxide hydroxide can be exemplified The mixed aqueous solution of the salt such as aqueous solution, alkali composition and potassium permanganate of the individual alkali composition such as salt of organic amine as base ammonium Deng.Ingredient made of a variety of alkali compositions of combination can be used in alkali composition.

There is no particular limitation for the temperature of etching solution, but preferably 45 DEG C or less.It is used as etching in the present embodiment to cover 1st pattern of mould (etched pattern) preferably especially plays the etching solution of acidity and alkalinity in 45 DEG C of temperature regions below excellent Different patience.This prevents removing positive-working photosensitive resin layer in etching work procedure, there is no the portions of positive-working photosensitive resin layer Divide and optionally etches.

After etching work procedure, the pollution of production line in order to prevent can also carry out cleaning process and drying process as needed.It closes It is carried out in cleaning process, such as at normal temperature using pure water cleaning base plate 10 seconds~300 seconds, about drying process, example Such as use air blower, appropriate adjustment air blower pressure (0.1kg/cm²~5kg/cm²Left and right) it is dried.

The 2nd exposure process > of <

The 2nd exposure process is carried out in above-mentioned 2nd embodiment.An example of 2nd exposure process is illustrated schematically in Fig. 2 (e)。

After 1st etching work procedure, the 1st pattern 14A after the 1st etching work procedure is subjected to figure with the pattern different from the 1st pattern Case exposure.

In the 2nd exposure process, relative to the 1st pattern remained on the 1st conductive layer, to aftermentioned 2nd developing procedure In at least correspond to the 1st conductive layer the position of the part that should be removed be exposed.

In pattern exposure in 2nd exposure process, the figure of pattern Yu the mask 30 used in the 1st exposure process has been used The different mask 40 of case can be applicable in method identical with the pattern exposure in the 1st exposure process in addition to this.

The 2nd developing procedure > of <

The 2nd developing procedure is carried out in above-mentioned 2nd embodiment mode.An example of 2nd developing procedure is schematically shown In Fig. 2 (f).

In the 2nd developing procedure, is developed to the 1st pattern 14A after the 2nd exposure process and form the 2nd pattern 14B.

By development, the part being exposed in the 2nd exposure process in the 1st pattern can remove.

In addition, method identical with the development in the 1st developing procedure can be applicable in the 2nd developing procedure.

The 2nd etching work procedure > of <

The 2nd exposure process is carried out in above-mentioned 2nd embodiment.An example of 2nd etching work procedure is illustrated schematically in Fig. 2 (g) in.

In the 2nd etching work procedure, it is not configured in multiple conductive layers in the region of the 2nd pattern 14B at least to the 1st conductive layer 24A is etched.

In etching in 2nd etching work procedure, corresponding with the conductive layer that should be removed etching solution is selected by etching, remove this with Outside, method identical with the etching in the 1st etching work procedure can be applicable in.

In the 2nd etching work procedure, preferred as expected pattern is etched selectively to lead fewer than the 1st etching work procedure Electric layer.For example, as shown in Fig. 2, using only selectively the 1st conductive layer of etching in the region that positive-working photosensitive resin layer is not configured The etching solution of 24B is etched, and thus, it is possible to the pattern of the 1st conductive layer is set as different from the pattern of the 2nd conductive layer.

After terminating the 2nd etching work procedure, the circuit layout of conductive layer 24B, 26A including at least two patterns are formd.

< positive-working photosensitive resin layer removing step >

An example of positive-working photosensitive resin layer removing step is illustrated schematically in Fig. 2 (h).

After terminating the 2nd etching work procedure, a part on the 1st conductive layer 24B remains the 2nd pattern 14B.If not needing Positive-working photosensitive resin layer then removes all remaining positive-working photosensitive resin layer 14B.

As the method for removing remaining positive-working photosensitive resin layer, there is no particular restriction, can enumerate by drug The method for managing to remove.

As the minimizing technology of positive-working photosensitive resin layer, can enumerate for example at 30 DEG C~80 DEG C (preferably 50 DEG C~80 DEG C) Under 1 minute~30 minutes methods will be impregnated in stripper in stirring with the substrate of positive-working photosensitive resin layer etc..

As stripper, for example, can enumerate by the inorganic alkali composition such as sodium hydroxide, potassium hydroxide or primary amine, secondary amine, tertiary amine, The organic base compositions such as quaternary ammonium salt are dissolved in the removing in water, dimethyl sulfoxide, N-Methyl pyrrolidone or their mixed solution Liquid.Stripper can be used, removed by spray-on process, spray process, sheathed immersion method etc..

The manufacturing method of the circuit layout of present embodiment may include any other process.For example, following process can be enumerated, But it is not limited to these processes.

The process > of < bonding protective film

In above-mentioned 2nd embodiment mode, also have after the 1st etching work procedure before the 2nd exposure process, the 1st The process with the protective film (not shown) of translucency is pasted on pattern.

At this point, pattern exposure is carried out to the 1st pattern across protective film in the 2nd exposure process, after the 2nd exposure process, After the 1st pattern removing protective film, the 2nd developing procedure is preferably carried out.

The process > of < reduction luminous ray reflectivity

The manufacturing method of the circuit layout of present embodiment can be including carrying out one of multiple conductive layers on reduction substrate The process of the processing of part or all of luminous ray reflectivity.

As the processing for reducing luminous ray reflectivity, oxidation processes etc. can be enumerated.For example, carrying out oxidation processes to copper Copper oxide is made, to carry out melanism, thus, it is possible to reduce luminous ray reflectivity.

About the preferred embodiment for the processing for reducing luminous ray reflectivity, in Japanese Unexamined Patent Publication 2014-150118 bulletin 0041 section, 0042 section, 0048 section and 0058 Duan Zhongyou of 0017 section~0025 section and Japanese Unexamined Patent Publication 2013-206315 bulletin It records, the content of the bulletin is incorporated into this manual.

< forms the process > of new conductive layer on insulating film

The manufacturing method of the circuit layout of present embodiment, which is also preferably included in be formed by circuit layout, forms insulation The process of film and the process that new conductive layer is formed on insulating film.

By this structure, above-mentioned second electrode pattern and first electrode pattern can be made to insulate and be formed.

There is no particular limitation for the process of formation insulating film, can enumerate the known method for forming permanent film.Also, The photosensitive material with insulating properties can be used, form the insulating film of desired pattern by photoetching.

The process of new conductive layer is formed on insulating film, and there is no particular limitation.It can be used conductive photosensitive Property material, forms the new conductive layer of desired pattern by photoetching.

Also, with reference in the explanation of Fig. 2, have in the circuit layout formation substrate formation for having two conductive layers The case where circuit layout of 2 different patterns, is illustrated, but is suitable for the manufacturing method of the circuit layout of present embodiment The quantity of conductive layer of substrate be not limited to two layers, have three layers using conductive layer is folded more than circuit layout formation base Plate carries out the combination of 3 exposure process mentioned previously above, developing procedure and etching work procedure, thus can also lead 3 layers or more Electric layer is formed on respectively different circuit layout pattern.

Also, though it is not illustrated in Fig. 2, in the manufacturing method of the circuit layout of present embodiment, it is also preferred that substrate has The surface of both sides is respectively provided with multiple conductive layers, gradually or is formed simultaneously electricity to the conductive layer on the surface of the both sides for being formed in substrate Road.By this structure, the one of surface that can be formed in substrate forms the first conductive pattern, is formed on another surface The touch panel circuit layout of second conductive pattern.Also, it is also preferred that being formed in a manner of roll-to-roll from the two sides of substrate this The touch panel circuit layout of structure.

(circuit layout and circuit substrate)

The circuit layout of present embodiment is to be matched by the circuit of the manufacturing method manufacture of the circuit layout of present embodiment Line.

Present embodiment circuit substrate is the circuit of the manufacturing method manufacture with the circuit layout by present embodiment The substrate of wiring.

There is no particular limitation for the purposes of the circuit substrate of present embodiment, such as preferably touch panel electricity consumption roadbed Plate.

(input unit and display device)

As the device for the circuit layout that the manufacturing method having through the circuit layout of present embodiment manufactures, can enumerate Input unit.

Input unit in present embodiment is preferably capacitance type touch panel.

Display device in present embodiment is preferably provided with the input unit in present embodiment.It is aobvious in present embodiment Showing device is preferably the image display devices such as organic EL display device and liquid crystal display device.

(touch panel and touch panel display device and their manufacturing method)

The touch panel of present embodiment is the manufacturing method manufacture at least having through the circuit layout of present embodiment Circuit layout touch panel.Also, the touch panel of present embodiment preferably at least has transparent substrate, electrode and insulation Layer or protective layer.

The touch panel display device of present embodiment is the manufacture at least with the circuit layout by present embodiment The touch panel display device of the circuit layout of method manufacture, it is however preferred to have the touch panel of the touch panel of present embodiment Display device.

The touch panel of present embodiment or the manufacturing method of touch panel display device preferably include present embodiment The manufacturing method of circuit layout.

The touch panel of present embodiment or the manufacturing method of touch panel display device preferably successively include: to make to pass through sense The above-mentioned photosensitive layer for the photosensitive transfer printing material that the manufacturing method of photosensitiveness transfer materials obtains is contacted with aforesaid substrate and is bonded Process；The work of pattern exposure is carried out to the above-mentioned photosensitive layer of the above-mentioned photosensitive transfer printing material after the process of above-mentioned fitting Sequence；The process developed to the photosensitive layer after the process of above-mentioned exposure and form pattern；And to above-mentioned pattern is not configured The process that substrate in region is etched.The detailed content of each process with it is each in the manufacturing method of foregoing circuit wiring The detailed content meaning of process is identical, and preferred embodiment is also identical.

It, can as the detection method in the touch panel of present embodiment and the touch panel display device of present embodiment Think in mode known to resistive film mode, electrostatic capacitance method, ultrasonic wave mode, electromagnetic induction method and optical mode etc. It is any.Wherein, preferred electrostatic capacitance method.

As touch panel type, so-called inline type can be enumerated (such as in Japanese Unexamined Patent Application Publication 2012-517051 bulletin The type recorded in Fig. 5, Fig. 6, Fig. 7, Fig. 8), so-called outer insert-type (such as Figure 19 in Japanese Unexamined Patent Publication 2013-168125 bulletin The type of middle record, the type recorded in Fig. 1 and Fig. 5 of Japanese Unexamined Patent Publication 2012-089102 bulletin), OGS (One Glass Solution, monolithic glass touch-control) type, TOL (Touch-on-Lens, eyeglass touch-control) type is (such as in Japanese Unexamined Patent Publication 2013- The type recorded in Fig. 2 of No. 054727 bulletin), other structures (such as Fig. 6 in Japanese Unexamined Patent Publication 2013-164871 bulletin The type of middle record), various outer hung type (so-called GG, G1G2, GFF, GF2, GF1, G1F etc.).

As the touch panel of present embodiment and the touch panel display device of present embodiment, can be useful in " most New touch panel technologies " (on July 6th, 2009, Techno Times Co., Ltd. distribution), three paddy hero, two chief editor, " touch surface The technology and exploitation of plate ", CMC publish (2004,12), FPD International 2009Forum T-11 speech teaching material, Structure disclosed in Cypress Semiconductor Corporation application notes AN2292 etc..

Embodiment

Embodiment is enumerated below, and more specific description is carried out to embodiments of the present invention.Without departing from the ancestor of the disclosure Purport then can suitably change material, usage amount shown in following embodiment, ratio, process content and processing sequence etc..Therefore, The scope of the present disclosure is not limited to concrete example as shown below.In addition, limiting as long as no special, " part ", " % " are matter Measure benchmark.

(synthesis of component of polymer)

In following synthesis example, abbreviation respectively indicates following compound below.

ATHF:2- tetrahydrofuran base acrylate (composite)

MATHF:2- tetrahydrofuran methyl acrylate (composite)

ATHP: tetrahydro -2H- pyrans -2- base acrylate (Shin-Nakamura Chemical Co., Ltd. system)

MATHP: tetrahydro -2H- pyrans -2- methyl acrylate (Shin-Nakamura Chemical Co., Ltd. System)

MAEVE:1- ethoxyethyl methacrylates (Wako Pure Chemical Industries, Ltd. system)

ATB: tert. butylacrylate (Tokyo Chemical Industry Co., Ltd. system)

HS:4- hydroxy styrenes (composite)

CS:4- carboxyl styrene (Tokyo Chemical Industry Co., Ltd. system)

THFHS:4- (2- tetrahydrofuran base oxygroup) styrene (composite)

THFCS:4- (2- tetrahydrofuran base Epoxide carbonyl) styrene (composite)

The 2- tetrahydrofuran protective (composite) of THFMS: succinic acid 1- [2- (methacryloxy) ethyl]

AA: acrylic acid (Tokyo Chemical Industry Co., Ltd. system)

MAA: methacrylic acid (Tokyo Chemical Industry Co., Ltd. system)

EA: acrylic acid (Tokyo Chemical Industry Co., Ltd. system)

MMA: methyl methacrylate (Tokyo Chemical Industry Co., Ltd. system)

CHA: cyclohexyl acrylate (Tokyo Chemical Industry Co., Ltd. system)

CHMA: cyclohexyl methacrylate (Tokyo Chemical Industry Co., Ltd. system)

EHMA: 2-EHA (Tokyo Chemical Industry Co., Ltd. system)

BMA: n-butyl acrylate (Tokyo Chemical Industry Co., Ltd. system)

PGMEA: propylene glycol methyl ether acetate (SHOWA DENKO K.K. system)

V-601: dimethyl 2,2 '-azo bis- (2 Methylpropionic acid esters) (Wako Pure Chemical Industries, Ltd. it makes)

The synthesis > of < MATHF

Methacrylic acid (86.1 mass parts, 1.0 molar equivalents), hexane (86.1 mass parts) are added simultaneously in 3 mouthfuls of flasks It is cooled to 20 DEG C.Be added dropwise camphorsulfonic acid (0.00070 mass parts, 0.03 mM of equivalent), 2- dihydrofuran (70.1 mass parts, 1.0 molar equivalents) and after being stirred 1.5 hours at 20 DEG C ± 2 DEG C, it is warming up to 35 DEG C and has stirred 2 hours.On suction filter according to It is secondary sprawl KYOWARD200, KYOWARD 1000 (aluminium hydroxide adsorbent is Kyowa Chemical Industry Co., Ltd. make) after, filtering reacting liquid results in filtrate.After adding MEHQ (0.0012 mass parts) to obtained filtrate, It is concentrated under reduced pressure at 40 DEG C, has thus obtained methacrylic acid tetrahydro -2H- furans -2- base (MATHF) as colorless oil 156.2 mass parts (yield 98.0%).

The synthesis > of < ATHF

Acrylic acid (72.1 mass parts, 1.0 molar equivalents), hexane (72.1 mass parts) and cooling are added in 3 mouthfuls of flasks To 20 DEG C.Dropwise addition camphorsulfonic acid (0.00070 part, 0.03 mM of equivalent), (77.9 mass parts, 1.0 moles are worked as 2- dihydrofuran Amount) and after being stirred 1.5 hours at 20 DEG C ± 2 DEG C, it is warming up to 35 DEG C and has stirred 2 hours.It is successively sprawled on suction filter After KYOWARD 200, KYOWARD 1000 (being Kyowa Chemical Industry Co., Ltd. system), filtering reaction Liquid results in filtrate.After adding MEHQ (0.0012 mass parts) to obtained filtrate, it is concentrated under reduced pressure at 40 DEG C, by This has obtained 140.8 mass parts (yield 99.0%) of acrylic acid tetrahydro -2H- furans -2- base (ATHF) as colorless oil.

The synthesis > of < HS

Acetic acid 4- Ethenylbenzene (25.0 mass parts, 0.154 molar equivalent), ethyl acetate (34.2 matter are added in 3 mouthfuls of flasks Amount part) and it is cooled to 5 DEG C.28% methanol solution of sodium methylate (59.5 mass parts) is added dropwise to have stirred 2 hours later.Add acetic acid second Ester (100 mass parts), water (200 mass parts), ammonium chloride (33.0 mass parts) carry out liquid separation operation and extract organic layer.Successively Obtained organic layer is cleaned using saturated aqueous ammonium chloride, saturated brine, is concentrated under reduced pressure at 40 DEG C, thus 17.0 mass parts 4-Vinyl phenols (HS) (yield 91.9%) have been obtained as yellow oil.

The synthesis > of < THFHS

4-Vinyl phenol (120.2 mass parts, 1.0 molar equivalents), hexane (120.2 mass are added in 3 mouthfuls of flasks Part) and be cooled to 20 DEG C.Be added dropwise camphorsulfonic acid (0.00070 part, 0.03 mM of equivalent), 2- dihydrofuran (70.1 mass parts, 1.0 molar equivalents) after, it is warming up to 80 DEG C and stir within 5 hours.Successively sprawled on suction filter KYOWARD 200, After KYOWARD 1000 (being Kyowa Chemical Industry Co., Ltd. system), thus filtering reacting liquid obtains Filtrate.It after adding MEHQ (0.0019 mass parts) to obtained filtrate, is concentrated under reduced pressure at 40 DEG C, is thus used as colorless oil Shape object has obtained 185.0 mass parts (yield 97.3%) of 4- (2- tetrahydrofuran oxygroup) styrene (THFHS).

The synthesis > of < THFCS

4- carboxyl styrene (148.2 mass parts, 1.0 molar equivalents), hexane (148.2 mass are added in 3 mouthfuls of flasks Part) and be cooled to 20 DEG C.Camphorsulfonic acid (0.00070 mass parts, 0.03 mM of equivalent), 2- dihydrofuran (70.1 matter is added dropwise Measure part, 1.0 molar equivalents) and after being stirred 1.5 hours at 20 DEG C ± 2 DEG C, it is warming up to 35 DEG C and has stirred 2 hours.In suction strainer Successively sprawled on device KYOWARD200, KYOWARD 1000 (being Kyowa Chemical Industry Co., Ltd. system) it Afterwards, filtering reacting liquid results in filtrate.After adding MEHQ (0.0021 mass parts) to obtained filtrate, at 40 DEG C It is concentrated under reduced pressure, has thus obtained 212.3 mass of 4- (2- tetrahydrofuran oxygroup carbonyl) styrene (THFCS) as colorless oil Part (yield 97.3%).

The synthesis > of < THFMS

2- methylacryoyloxyethyl succinic acid (mono-2- (methacryloyloxy) ethyl is added in 3 mouthfuls of flasks Succinate) (230.2 mass parts, 1.0 molar equivalents), hexane (230.2 mass parts) and 20 DEG C are cooled to.Camphor sulphur is added dropwise Sour (0.00070 part, 0.03 mM of equivalent), 2- dihydrofuran (70.1 mass parts, 1.0 molar equivalents) and at 20 DEG C ± 2 DEG C After lower stirring 1.5 hours, it is warming up to 35 DEG C and has stirred 2 hours.KYOWARD200, KYOWARD are successively sprawled on suction filter After 1000 (being Kyowa Chemical Industry Co., Ltd. system), filtering reacting liquid results in filtrate.To After obtained filtrate addition MEHQ (0.0030 mass parts), it is concentrated under reduced pressure at 40 DEG C, is thus obtained as colorless oil The 2- tetrahydrofuran protective (THFMS, the compound of following structures) of succinic acid 1- [2- (methacryloxy) ethyl] 299.0 mass parts (yield 99.6%).

[chemical formula 16]

The synthesis > of < polymer A-1

PGMEA (75.0 mass parts) are added in 3 mouthfuls of flasks, are warming up to 90 DEG C in a nitrogen atmosphere.ATHF will be added to (40.0 mass parts), AA (0.5 mass parts), EA (15.0 mass parts), MMA (22.5 mass parts), CHMA (22.0 mass parts), V- 601 (3.7 mass parts), 3 mouthfuls of flasks of solution to the temperature range for maintaining 90 DEG C ± 2 DEG C of PGMEA (75.0 mass parts) are molten It has been added dropwise in liquid 2 hours.After completion of dropwise addition, is stirred 2 hours within the temperature range of 90 DEG C ± 2 DEG C, result in polymer A-1 (solid component concentration 40.0%).

The synthesis example > of < polymer A-2~A-28

As described in Table 1, the type and usage amount for changing monomer, about other conditions, in method identical with A-1 It is synthesized.The solid component concentration of polymer 40 mass % have been set as.In table 1, the usage amount of monomer is indicated with quality %.

In table 1, the record of "-" indicates not using the monomer.

Also, in table 1, I/O value, Tg and Mw are measured using the above method.

Hereinafter, indicating the preparation for being used for aftermentioned photosensitive polymer combination in detail, and recorded in aftermentioned table 2 Each ingredient.

< photoacid generator >

B-1: structure shown in following (for the compound recorded in 0227 section of Japanese Unexamined Patent Publication 2013-047765 bulletin, It is synthesized according to the method recorded in 0204 section)

[chemical formula 17]

B-2:PAG-103 (trade name, following compounds, BASF AG's system)

[chemical formula 18]

B-3: structure shown in following (according to the method recorded in 0160 section of International Publication No. 2014/020984 into Synthesis is gone.In addition, Ts indicates p-toluenesulfonyl.)

[chemical formula 19]

B-4:GSID-26-1, triarylsulfonium salt (BASF AG's system)

[chemical formula 20]

B-5: structure shown in following (is carried out according to the method recorded in page 103 of International Publication No. 2016/124493 Synthesis.)

[chemical formula 21]

< surfactant >

C-1: the compound of structure shown in following

[chemical formula 22]

< alkali compounds >

D-1: the compound (CMTU) of structure shown in following

D-2:2,4,5- triphenylimidazolyl (Tokyo Chemical Industry Co., Ltd. system)

D-3:1,5- diazabicyclo [4.3.0] -5- nonene (Tokyo Chemical Industry Co., Ltd. system)

[chemical formula 23]

< sensitizer >

DBA:9,10- dibutoxy anthracene (Kawasaki Kasei Chemicals Ltd. system)

(Examples 1 to 20 and comparative example 1~10)

The preparation > of < photosensitive transfer printing material

In Examples 1 to 20 and comparative example 1~10, as become solid component shown in following table 2 than, by polymer Ingredient, photoacid generator, alkali compounds, surfactant and other compositions dissolution are mixed in PGMEA (propylene glycol monomethyl ether second Acid esters), to become 10 mass % of solid component concentration, it is filtered by 0.2 μm of bore of polytetrafluoroethylene (PTFE) filter, To obtain photosensitive polymer combination.

It, should using slit-shaped nozzle about embodiment 1~18,20 and the photosensitive polymer combination of comparative example 1~10 Photosensitive polymer combination is coated on 50 μm of thickness of the polyethylene terephthalate as temporary support On (polyethylene terephthalate) film (hereinafter referred to as " PET (A) "), so that dry film thickness becomes 3.0 μ m.Later, it has been dried in 100 DEG C of convection oven (convection oven) 2 minutes, finally as cover film to poly- second Alkene film (Tredegar Co., Ltd. system, OSM-N) is crimped, to make photosensitive transfer printing material.

In addition, the full light fog degree of PET (A) is 0.19%.About Film Haze, Suga Test Instruments is used Co., Ltd. haze test machine HZ-2 determines the full light fog angle value (%) of substrate on the basis of JIS-K-7136.

About the photosensitive polymer combination of embodiment 19, in 30 μm of thickness of poly- terephthaldehyde for becoming temporary support On sour two ester film of second (hereinafter referred to as " PET (B) "), it is coated with using slit-shaped nozzle, so that dry film thickness becomes 3.0μm.Later, 2 minutes dry in 100 DEG C of convection oven, finally polyethylene film is crimped as cover film (Tredegar Corporation system, OSM-N), to make photosensitive transfer printing material.

In addition, the full light fog degree of PET (B) is measured as 0.35% by measuring method same as described above.

< performance evaluation >

Used in 188 μm of thickness of PET film with thickness 500nm using sputtering method made layers of copper with layers of copper Pet substrate.

< lamination adaptability evaluates >

The photosensitive transfer printing material made is cut into 50cm square, peels cover film off, with 90 DEG C of roll temperature, line pressure 3.0m/ minutes 0.8MPa, linear velocity laminations are laminated on the pet substrate with layers of copper.Visual valuation sense Photosensitive resin layer and layers of copper bubble-free or without warpage closely sealed area, pass through the closely sealed area/cutting of photo-sensitive resin The areas (%) of transfer materials finds out closely sealed area ratio.Area (%) is bigger, then lamination adaptability is more excellent.

(evaluation criteria)

Area (%) is 95% or more: 5

Area (%) is 90% more than and less than 95%:4

Area (%) is 85% more than and less than 90%:3

Area (%) is 80% more than and less than 85%:2

Area (%) is less than 80%:1

< resolution ratio evaluates >

The photosensitive transfer printing material made was being had with 3.0m/ minutes line pressure 0.8MPa, linear velocity laminations It is laminated on the pet substrate of layers of copper.In addition, the evaluation result of above-mentioned lamination adaptability is 4 or less at 90 DEG C of roll temperature In the case where, the evaluation result for being laminated roll temperature up to lamination adaptability is improved as 5 (area (%) they are 95% or more), thus Sample is made.

Temporary support is not removed and line and space pattern (line-and-space across 3 μm~20 μm of line width Pattern it after) (duty ratio (duty ratio) 1:1) mask is exposed photo-sensitive resin using ultrahigh pressure mercury lamp, puts Temporary support is removed after setting 1 hour to be developed.Development uses 28 DEG C of 1.0% aqueous sodium carbonate, aobvious to spray Shadow has carried out 30 seconds.When forming 20 μm of line and space pattern, using scanning electron microscope (SEM) to the residual of spatial portion Slag is evaluated, and the light exposure of absolutely not residue is set as most suitable light exposure.The line obtained by the most suitable amount of exposure with In space pattern, the pattern of highest resolution is set as to reach resolution ratio.Also, when judgement reaches resolution ratio, utilize sweep type Electron microscope (SEM) observes pattern, in the case where the sidewall portion of pattern generates biggish roughness, is set as failing to differentiate. It is smaller to reach resolution ratio, the pattern of excellent in resolution more can be obtained.

(evaluation criteria)

Less than 6 μm: 5

6 μm more than and less than 8 μm: 4.5

8 μm more than and less than 10 μm: 4

10 μm more than and less than 12 μm: 3.5

12 μm more than and less than 15 μm: 3

15 μm more than and less than 20 μm: 2

Fail to differentiate: 1

< fissility evaluates >

Under 3.0m/ minutes online pressure 0.8MPa, linear velocity laminations, to production on the pet substrate with layers of copper Photosensitive transfer printing material be laminated.In addition, being improved in the case where 90 DEG C of laminated adaptability of roll temperature are 4 situations below Lamination roll temperature is until lamination adaptability is determined as 5, to make sample.

Temporary support is not removed, is utilized across 3 μm~20 μm of line width of lines and space pattern (Duty ratio 1:1) mask super After high-pressure sodium lamp is exposed, temporary support is removed to develop after placing 1 hour.In development, 28 DEG C are used 1.0% aqueous sodium carbonate has been carried out 30 seconds with spray development.Then, using 25 DEG C of copper etchant solution (KANTO CHEMICAL CO., INC. Cu-02) etching in 60 seconds is carried out to layers of copper using infusion process after, use 25 DEG C of ITO erosion Carve the etching that liquid (KANTO CHEMICAL CO., INC. ITO-02) has carried out ITO layer using infusion process 60 seconds.About The material for failing resolution (being evaluated as 1) in the evaluation of above-mentioned resolution ratio, has carried out identical operation in copper and ITO etching solution.

Remaining photo-sensitive resin is removed using stripper.About removing, 50 DEG C of 10 mass % are used Sodium hydrate aqueous solution and carried out the removing based on infusion process.Photonasty tree is observed using scanning electron microscope (SEM) Rouge layer finds out the time that the photo-sensitive resin in layers of copper can completely remove.When judging fissility, splitting time was less than 70 seconds Clock is practical level, and preferably splitting time is short.

(evaluation criteria)

Splitting time is 20 seconds or less: 5

Splitting time is 20 seconds more than and less than 30 seconds: 4.5

Splitting time is 30 seconds more than and less than 40 seconds: 4

Splitting time is 40 seconds more than and less than 50 seconds: 3.5

Splitting time is 50 seconds more than and less than 70 seconds: 3

Splitting time is 70 seconds or more: 2

It can not remove: 1

Hereinafter, showing the result in table 2.

As shown in table 2, the photosensitive transfer printing material of present embodiment has obtained that lamination adaptability is excellent and excellent in resolution Pattern, and the pattern that the fissility that has obtained pattern is excellent.

In table 2, the record of "-" indicates not containing the compound.

Also, in table 2, I/O value, Tg and Mw are determined using the above method.

Also, such as the records such as " 60/40 " on column of " A-1/A-4 " on type column etc., additive amount expression is with A-1 respectively 60 mass parts, the additive amount that A-4 is 40 mass parts use.

(embodiment 101)

It is as the 2nd layer of conductive layer that tin indium oxide (ITO) is thick with 150nm using sputtering in 100 μ m-thick PET base materials It forms a film, copper is formed a film using vacuum vapour deposition with 200nm thickness as the 1st layer of conductive layer above, is thus made At circuit forming board.

Photosensitive transfer printing material 1 (line the pressure 0.8MPa, linear velocity 3.0m/ obtained in embodiment 1 has been laminated in layers of copper Min, 90 DEG C of roll temperature).

Temporary support is not removed and is used and is provided with shown in Fig. 3 along the structure for being unidirectionally connected with conductive layer pad Pattern (hereinafter also referred to " pattern A ".) photomask carried out contact patterns exposure.

In addition, solid line portion SL and grey portion G are light shielding part, the alignment of dotted line part DL virtual representation in pattern A shown in Fig. 3 Frame.

Temporary support is removed later, is developed, is washed to have obtained pattern A.Then copper etchant solution is used After (KANTO CHEMICAL CO., INC. Cu-02) etches layers of copper, ITO etching solution (KANTO is used CHEMICAL CO., INC. ITO-02) ITO layer is etched, it results in by copper (solid line portion SL) and ITO (ash Color portion G) substrate of pattern A is depicted together.

Then, pattern shown in Fig. 4 (hereinafter also referred to " pattern B " is provided with using with the state being aligned.) opening portion Photomask carried out pattern exposure, development, washing.

In addition, grey portion G is light shielding part, the frame of dotted line part DL virtual representation alignment in pattern B shown in Fig. 4.

Later, layers of copper is etched using Cu-02, using stripper (10 mass % sodium hydrate aqueous solution) to residual Photo-sensitive resin removed, to obtain circuit layout substrate.

Result in circuit layout substrate.Using microscope observed as a result, without removing and missing etc., for perfection Pattern.

(embodiment 102)

In 100 μ m-thick PET base materials, ITO is formed a film using sputtering with 150nm thickness as the 2nd layer of conductive layer, Copper is formed a film using vacuum vapour deposition with 200nm thickness as the 1st layer of conductive layer on it, circuit has thus been made and has been formed Substrate.

Temporary support is not removed and is used and is provided with shown in Fig. 3 along the structure for being unidirectionally connected with conductive layer pad The photomask of pattern A pattern exposure has been carried out to photo-sensitive resin.Temporary support is removed later, is developed, water It washes to have obtained pattern A.Then layers of copper is carried out using copper etchant solution (KANTO CHEMICAL CO., INC. Cu-02) After etching, ITO layer is etched using ITO etching solution (KANTO CHEMICAL CO., INC. ITO-02), thus To the substrate for depicting pattern A together by copper (solid line portion SL) and ITO (grey portion G).

Then, PET (A) protective layer has been pressed in remaining resistant upper layer.In this state, make in the state of alignment mark Pattern exposure is carried out with the photomask for the opening portion for being provided with pattern B shown in Fig. 4, develops and carries out after removing PET (A) Washing.

Later, copper wiring is etched using Cu-02, uses stripper (KANTO CHEMICAL CO., INC. system KP-301) remaining photo-sensitive resin is removed, to obtain circuit layout substrate.

Using microscope observed as a result, without removing and missing etc., be perfect pattern.

Symbol description

12- temporary support, 14- photo-sensitive resin, the 1st pattern of 14A-, the 2nd pattern of 14B-, 16- cover film, 20- electricity Road, which is formed, uses substrate, 22- substrate, the 1st conductive layer of 24-, the 1st conductive layer of 24A- (after the 1st etching work procedure), the 1st conductive layer of 24B- (after the 2nd etching work procedure), the 2nd conductive layer of 26-, the 2nd conductive layer of 26A- (after the 1st etching work procedure and the 2nd etching work procedure), 30- is covered Mould, 40- mask, 100- photosensitive transfer printing material, SL- solid line portion, G- grey portion, DL- dotted line part.

Claims

1. a kind of photosensitive transfer printing material, includes

Temporary support；And

Photo-sensitive resin, containing component of polymer and photoacid generator, in the component of polymer, comprising containing have acidic group with The Component units of the protected group of the form of acetal and the polymer of the Component units with carboxyl, component of polymer based on The inorganic value I of organic conceptional diagram divided by the I/O value of organic value O average value be 0.55 or more and 0.65 hereinafter, relative to The content of the Component units with acidic group of the gross mass of component of polymer is 0.5 mass % or more and 15 mass % are hereinafter, glass The average value of glass transition temperature is 90 DEG C or less.

2. photosensitive transfer printing material according to claim 1, wherein

The Component units with acidic group protected group in the form of acetal are the Component units indicated by following formula A,

In formula A, R³¹And R³²Separately indicate hydrogen atom, alkyl or aryl, R³¹And R³²In at least any one be alkyl Or aryl, R³³Indicate alkyl or aryl, R³¹Or R³²Optionally with R³³It connects and forms cyclic ether, R³⁴Indicate hydrogen atom or first Base, X⁰For singly-bound or the linking group of divalent.

3. photosensitive transfer printing material according to claim 1 or 2, wherein

Total matter of the content of the Component units with acidic group of gross mass relative to component of polymer relative to component of polymer Amount is 1 mass % or more and 10 mass % or less.

4. photosensitive transfer printing material according to any one of claim 1 to 3, wherein

Acidic group contained in the Component units with acidic group is carboxyl.

5. photosensitive transfer printing material according to any one of claim 1 to 4, wherein

The weight average molecular weight of the component of polymer is 60000 or less.

6. a kind of manufacturing method of circuit layout, includes: in the following order

On substrate, make one opposite with temporary support of photosensitive transfer printing material described in any one of claims 1 to 5 The outermost layer of side is contacted with the substrate and the process that is bonded；

The work of pattern exposure is carried out to the photo-sensitive resin of the photosensitive transfer printing material after the process of the fitting Sequence；

The process developed to the photo-sensitive resin after the process of the exposure and form pattern；And

The process that substrate in the region that the pattern is not configured is etched.

7. a kind of manufacturing method of touch panel, includes: in the following order