CN110318071A - Heavy metal collection system and application thereof - Google Patents
Heavy metal collection system and application thereof Download PDFInfo
- Publication number
- CN110318071A CN110318071A CN201810261858.1A CN201810261858A CN110318071A CN 110318071 A CN110318071 A CN 110318071A CN 201810261858 A CN201810261858 A CN 201810261858A CN 110318071 A CN110318071 A CN 110318071A
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- heavy metal
- semiconductor material
- collection system
- electrolyte
- waste water
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C7/00—Constructional parts, or assemblies thereof, of cells; Servicing or operating of cells
- C25C7/02—Electrodes; Connections thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Abstract
The present invention proposes a kind of heavy metal collection system and application thereof, can be applied in existing any waste water treatment system.This heavy metal collection system is in only including: that the reactive tank for filling electrolyte, an at least conductor, semiconductor material, an at least metal reducing electrode and a light source provide unit on composition.When using heavy metal collection system of the invention, the waste water containing heavy metal ion need to only be injected among electrolyte, then enable light source provide unit and generate light beam to irradiate semiconductor material.The more electrons and holes released can be provided an oxidizing force and a reducing power by the electronics electricity hole inside semiconductor material by so operation, so that the heavy metal ion in waste water restores on the metal reducing electrode becomes a metal film.
Description
Technical field
Technical field of the present invention about water prevention and cure of pollution and wastewater treatment, espespecially can be applied to existing waste water treatment system
Interior a kind of heavy metal collection system and application thereof.
Background technique
Printed circuit board (Printed Circuit Board, PCB) is that various electronic product, electrical installation and household electrical appliances are set
Standby indispensable important spare part.With continuing to introduce new for electronic product, electrical installation and household appliance, printing electricity
The processing procedure of road plate also and then becomes complicated；Also, a variety of raw materials have been used in the manufacturing process of printed circuit board, including have been contained
Copper base material, acidic etching liquid, alkaline etching liquid and organic solvent etc..Meanwhile plating is also often applied with Treatment of Metal Surface
In the processing procedure of printed circuit board.As one can imagine specially the factory of production printed circuit board inherently generates a large amount of Industry Waste
Water.Also, research data is pointed out among the industrial wastewater often containing heavy metals such as nickel, copper, zinc, cadmium, lead, iron, tin.
Currently, the processing method of the heavy metal contained by existing removal industrial wastewater includes: the precipitation method, reduction method, suction
Attached method, ion-exchange, membrane separation process and electrochemical process.Hydroxide precipitation method is more commonly used chemical precipitation processing skill
Art is that alkali is added in the waste water containing heavy metal to be neutralized, so that metal ion is generated hydroxide not soluble in water and sink
It forms sediment.However, starting because having its optimum PH range in various heavy metal ion Precipitations, Tai Gao or too low pH value can all influence
The treatment effeciency of hydroxide precipitation method.On the other hand, when handling waste water using reduction method, it must first put into reducing agent and enter waste water
It is interior, valence heavy metal ions are reduced into the low price heavy metal ion of micro- poison；Then, from waste water by way of alkalization precipitating
In remove removing heavy metals.Common reducing agent includes: ferrous sulfate, sodium hydrogensulfite, sodium pyrosulfite, sodium sulfite, titanium dioxide
Sulphur, iron filings etc..
Furthermore absorption method is the heavy metal in the unique texture Adsorption waste water using adsorbent, common adsorbent
Active charcoal, bentonite, zeolite, flyash.Actual wastewater treatment data point out that absorption method has many defects, comprising: throw
Provide that larger, processing cost is high, sludge yield is big, discharges with treated shipwreck with stably reaching standard.In addition, ion-exchange treatment
Method is to be come out the Extraction of Heavy Metals in waste water using ion exchange resin and extractant appropriate.However, ion exchange resin
Manufacture is complicated and high cost becomes the most important practice application disadvantage of ion-exchange treatment method.
On the other hand, electrodialysis technology is one kind of membrane separation process, by its application processing metal plating waste water, after processing
Waste water can recycle use.Containing Cu2+、Ni2+、Zn2+、Cr6+The waste water of equal metal ions is all suitable for electricity consumption dialysis treatment.It uses
When electrodialysis system handles various waste water, the amberplex in system may cause film table because of the effect of chemical reaction
The problems such as face fouling and damage, influence treatment effect.Finishing (High Voltage
Electrocagulation System) be a new generation electro-chemical water processing equipment, in water chromium, zinc, nickel, copper, cadmium,
The substances such as cyanide have significant treatment effect.But electrochemical process it is maximum the disadvantage is that wastewater treatment higher cost.
Generally speaking, the processing method of the heavy metal contained by existing removal industrial wastewater all has high disposal cost
Major defect, while these processing methods also can not be directly from recycling heavy metal in waste water.In view of this, the inventor of this case
System is strongly subject to study and composition, and researches and develops finally and complete a kind of heavy metal collection system and application thereof of the invention.
Summary of the invention
The processing method of heavy metal contained by existing removal industrial wastewater all has the major defect of high disposal cost,
These processing methods also can not be directly from recycling heavy metal in waste water simultaneously.In view of this, it is a primary object of the present invention to
It proposes a kind of heavy metal collection system, can be applied in existing any waste water treatment system.Also, this heavy metal returns
Receiving apparatus is in only including: the reactive tank for filling electrolyte EL, at least a conductor, semiconductor material, at least a metal on composition
Reducing electrode and a light source provide unit.When using heavy metal collection system of the invention, only need will containing heavy metal from
Among the waste water injection electrolyte of son, then enables light source provide unit and generate light beam to irradiate semiconductor material.So operation, by half
The electronics electricity hole of conductor material internal can provide an oxidizing force and a reducing power to the more electrons and holes released, so that useless
Heavy metal ion in water restores on the metal reducing electrode becomes a metal film.
In order to reach the main purpose of aforementioned present invention, inventor provides an implementation of the heavy metal collection system
Example, comprising:
One reactive tank is equipped with an electrolyte；
An at least conductor is placed among the electrolyte；
Semiconductor material is overlying on the surface of the conductor；
An at least metal reducing electrode, is placed among the electrolyte, and is electrically connected the conductor；And
One light source provides unit, to issue a light beam to irradiate the semiconductor material；
Wherein, the waste water containing heavy metal ion injects among the electrolyte, and irradiates the semiconductor material with the light beam
Material is so that the semiconductor material generates polyelectron electric hole pair；
Wherein, more electronics of those electronics electricity holes pair are moved to the metal reducing electrode, and those electricity via the conductor
More electric holes of sub- electric hole pair are moved to the surface of the semiconductor material；
Wherein, those electric holes and those electronics provide an oxidizing force and a reducing power respectively, so that the huge sum of money in the waste water
Belong to ion to be restored on the metal reducing electrode as a metal film.
Detailed description of the invention
Fig. 1 is a kind of schematic perspective view of the first embodiment of display heavy metal collection system of the invention；
Fig. 2 is the side sectional view for showing reactive tank；
Fig. 3 is the schematic perspective view of the second embodiment of display heavy metal collection system of the invention；
Fig. 4 provides the schematic perspective view of unit, optical transmission unit and semiconductor material for display light source；
Fig. 5 is the side sectional view for showing reactive tank；
Fig. 6 is the schematic perspective view of the 3rd embodiment of display heavy metal collection system of the invention；
Fig. 7 is the schematic architectural diagram of the fourth embodiment of display heavy metal collection system of the invention；
Fig. 8 is the practical striograph for the metal reducing electrode that display surface is covered with metal film；And
Fig. 9 is the X-ray diffraction diagram for showing metal film.
Wherein appended drawing reference are as follows:
1 heavy metal collection system
11 reactive tanks
12 conductors
13 semiconductor materials
14 metal reducing electrodes
15 light sources provide unit
EL electrolyte
16 optical transmission units
17 storage of waste water units
17a electrolyte supply unit
17b reaction accelerator feed unit
18 first supply units
The second supply unit of 18a
18b third supply unit
E- electronics
Specific embodiment
In order to more clearly describe a kind of heavy metal collection system and application thereof proposed by the invention, will match below
Schema is closed, presently preferred embodiments of the present invention is elaborated.
First embodiment
A kind of main application of heavy metal collection system of the invention is to be applied to existing any wastewater treatment
Among system, so that the waste water treatment system has the function of that high efficiency recycles heavy metal.Fig. 1 shows an a kind of huge sum of money of the invention
Belong to the schematic perspective view of the first embodiment of recyclable device.As shown in Figure 1, heavy metal collection system 1 of the invention includes: one
Reactive tank 11, at least a conductor 12, semiconductor material 13, at least a metal reducing electrode 14 and a light source provide unit
15；Wherein, which is equipped with an electrolyte EL, and the conductor 12 is placed among electrolyte EL.
It must illustrate, although Fig. 1 shows that the reactive tank 11 is a square groove, not with this limited reactions
The state sample implementation of slot 11.When application or implementing the present invention, reactive tank 11 is also possible to have two paraboloidal column shapes anti-
Answer slot or elliptic cylindrical shape shaped reaction slot.On the other hand, this at least a conductor 12 is placed among electrolyte EL, and the semiconductor material
Material 13 is overlying on the surface of the conductor 12.In the present invention, the semiconductor material 13 can be oxide semiconductor material, vulcanization
Object semiconductor material, selenide semiconductor material, gallium based compound or silicon systems compound, and it is thin with multiple particles or one
The form of film is overlying on the surface of the conductor 12.The exemplary materials of the semiconductor material 13 arrange among following table (1).
Table (1)
Upper table (1) only lists the exemplary materials of the semiconductor material 13, but technical characteristic notably of the invention is not
It is to limit the application of the certain material of semiconductor material 13.In particular, the semiconductor material 13 is also possible to oxide half
Wantonly two among conductor material, sulfide semiconductor material, selenide semiconductor material, gallium based compound and silicon systems compound
Person or more than combination or appoint both or above compound, such as: TiO2/ ZnS compound (composite) is to aoxidize
The combination of object semiconductor material and sulfide semiconductor material, and Ag-Sn-S/ZnSe compound is sulfide semiconductor material
With the combination of selenide semiconductor material.
Unceasingly refering to fig. 1, and please refer to the side sectional view of reactive tank shown by Fig. 2.Such as Fig. 1 and Fig. 2 institute
Show, which is placed among electrolyte EL and is electrically connected the conductor 12, and the light source provides list
Member 15 is to issue a light beam to irradiate the semiconductor material 13.When using heavy metal collection system 1 of the invention, it can be used
Artificial light sources or natural light are as light source offer unit 15.Then, the waste water containing heavy metal ion is injected into electrolyte
It among EL, then enables light source provide unit 15 and generates light beam to irradiate semiconductor material 13, mode makes the semiconductor material whereby
13 generate polyelectron electric hole pair.It so operates, then more electronics e of those electronics electricity holes pair-It will be moved to via conductor 12
The metal reducing electrode 14, and more electric holes of those electronics electricity holes pair are moved to the surface of semiconductor material 13.It is worth explanation
, those electric holes and those electronics e-An oxidizing force and a reducing power can be provided in electrolyte EL, so that the weight in waste water
Metal ion restores on the metal reducing electrode 14 becomes a metal film.
As shown in Fig. 2, multiple light sources can be provided in order to enable the semiconductor material 13 in reactive tank 11 sufficiently receive illumination
Unit 15 (such as: ultraviolet lamp tube) it is placed in reactive tank 11, make it around the semiconductor material 13.Particularly, the present invention is simultaneously
It enables and is formed with Ohmic contact (Ohmiccontact) between conductor 12 and semiconductor material 13, it is therefore intended that so that conductor 12 can be with
As electronics e-A transmission channel, enable electronics e-Metal reducing electrode 14 can be successfully moved to.It is worth noting that in
A power supply device, one group of solar battery or a battery can be added between conductor 12 and metal reducing electrode 14
Help speed up electronics e-Metal reducing electrode 14 can be moved to.Further, it is necessary to it is specifically intended that the if semiconductor selected
Material 13 is N-type semiconductor, then work function (work function) must be used to be higher than the fermi level of semiconductor material 13
The metal material of (Fermi level) is as the conductor 12.Therefore, the present invention is not specially limited the manufacture material of conductor 12
Material, can be copper, silver, gold, platinum, tin indium oxide (Indium Tin Oxide, ITO), tin oxide (SnO2), zinc oxide
(ZnO), the combination or combination more than above-mentioned the two of above-mentioned the two.
It should be noted that if the metal material selected not formed between conductor 12 and semiconductor material 13 well
Ohmic contact, that is, the work function of metal materialEqual to or less than the work function of semiconductor material 13This
In the case of, it is necessary to it tries every possible means to enable the work function difference of the two the smaller the better.Same reason, if the semiconductor material 13 selected is P
Type semiconductor, then the corresponding metal material selected must enable the Schottky energy barrier being formed between conductor 12 and semiconductor material 13
The lower (Schottky barrier) the better.On the other hand, the engineer for being familiar with electroplating system design or operation should be understood that gold
Belong to reducing electrode 14 to generally have to lower oxidation reduction overpotential (Redox over-potential), and its common manufacture
Material includes: platinum (Pt), palladium (Pd), gold (Au), ruthenium (Ru), nickel (Ni), iron (Fe), platinum series compound, ruthenium based compound, nickel system
Compound, transparent conductive material, the combination of above-mentioned the two, combination more than above-mentioned the two, above-mentioned the two compound,
Or compound more than above-mentioned the two.Also, in order to increase the response area of metal reducing electrode 14, metal can be restored electricity
The design of pole 14 reticulates, and so can promote the huge sum of money in waste water and belongs on the metal reducing electrode 14 and forms a film.
Second embodiment
Unceasingly refering to Fig. 3, for the schematic perspective view of the second embodiment of display heavy metal collection system of the invention.
Compare Fig. 1 and Fig. 3 it can be found that second embodiment further includes and is set to light source and provides between unit 15 and semiconductor material 13
An at least optical transmission unit 16.Fig. 3 shows that the optical transmission unit 16 is a light guide plate, is produced to provide light source to unit 15
Raw light beam is converted into irradiating the semiconductor material 13 after area source, and mode increases the light-receiving surface of semiconductor material 13 whereby
Product.Please the schematic perspective view of unit, optical transmission unit and semiconductor material is provided for display light source simultaneously refering to Fig. 4 again.By
Fig. 4 it is found that optical transmission unit 16 can further be designed to the light guide plate of hollow cylindrical so that semiconductor material 13 with
Conductor 12 can be placed in one；Meanwhile unit 15 is provided using plurality of LEDs element as the light source.Unceasingly, referring again to figure
5, for the side sectional view for showing reactive tank.As shown in Figure 5, the optical transmission unit 16 be also possible to more photoconductive tubes (such as:
Optical fiber), to guide or transmission light source provide unit 15 caused by light beam to irradiate the semiconductor material 13.
3rd embodiment
Unceasingly refering to Fig. 6, for the schematic perspective view of the 3rd embodiment of display heavy metal collection system of the invention.
Compare Fig. 1 and Fig. 6 it can be found that 3rd embodiment further includes and is set to light source and provides between unit 15 and semiconductor material 13
An at least optical transmission unit 16.Fig. 6 shows that the optical transmission unit 16 is a smooth disperser, to provide light source to unit 15
Generated light beam irradiates the semiconductor material 13 after being spread, and mode increases the light-receiving surface of semiconductor material 13 whereby
Product.
Fourth embodiment
Referring to Fig. 7, the schematic architectural diagram of the fourth embodiment to show heavy metal collection system of the invention.Compare
Fig. 1 and Fig. 7 is it can be found that fourth embodiment further includes: a storage of waste water unit 17, an electrolyte supply unit 17a and one are anti-
Answer accelerator feed unit 17b.As shown in fig. 7, the storage of waste water unit 17 is to store the waste water, and at least 1 can be passed through
One supply unit 18 injects the waste water in the reactive tank 11.On the other hand, the electrolyte supply unit 17a is to store the electricity
Liquid EL is solved, and it can be injected electrolyte EL in the reactive tank 11 by least one second supply unit 18a.It is worth especially explaining
, fourth embodiment using feed-line automatically by the waste water containing heavy metal and electrolyte injection reactive tank 11 in, such as
This can suitably supplement reactant, to keep the concentration, pressure of reactant in reactive tank 11, steady with the states such as osmotic pressure
It is fixed.Furthermore in fourth embodiment, which passes through at least third supply unit 18b addition one
Reaction accelerator is among electrolyte EL；Particularly, the reaction accelerator is in can release multiple reactions in electrolyte EL
Accelerate ion, such as: the combination or above-mentioned of phosphate anion, nitrite ion, stannous ion, ferrous ion, above-mentioned the two
Appoint the combination of the two or more.In this way, by release reaction accelerate ion in the way of can adjust reactive tank 11 in electrolyte EL with
The pH-value of the mixed liquor of waste water is used and the heavy metal ion in the waste water is accelerated to be reduced on the metal reducing electrode 14
For the metal film.
Experimental example
Figure one and following table (2) are please referred to learn each unit of heavy metal collection system 1 designed by experimental example.
Table (2)
As shown in Figure 1, the waste water containing heavy metal component is injected electrolyte EL, then partly led with xenon lamp continuous illumination
Metal reducing electrode 14 has been taken after body material 13 2 hours.Fig. 8 is the metal reducing electrode that display surface is covered with metal film
Practical striograph.The practical striograph system of Fig. 8 confirms, after being handled waste water two hours with heavy metal collection system 1 of the invention,
Heavy metal composition in waste water can be formed as metal film in metal reducing electrode 14 really.In order to confirm the main of the metal film
Ingredient comes from the heavy metal in waste water, and inventor, which shows, has been X-ray diffraction analysis (X-ray to metal film
diffraction,XRD).Fig. 9, that is, metal film X-ray diffraction diagram, wherein the essential information of the three of Fig. 9 group XRD data arranges
Among following table (3).Also, by comparing three groups of XRD data it is believed that metal film ingredient include heavy metal (Cu) and
The oxide (CuO) of heavy metal.
Table (3)
In this way, it is above-mentioned completely and the heavy metal species recyclable device and application thereof that one of clearly demonstrates the present invention；Also, it passes through
The present invention has the advantages that following from the above:
(1) all there is the processing method of the heavy metal contained by existing removal industrial wastewater the main of high disposal cost to lack
It falls into, while these processing methods also can not be directly from recycling heavy metal in waste water.In view of this, the present invention proposes an a kind of huge sum of money
Belong to recyclable device, can be applied in existing any waste water treatment system.This heavy metal collection system 1 on composition only
Include: the reactive tank 11 for filling electrolyte EL, an at least conductor 12, semiconductor material 13, an at least metal reducing electrode 14,
And one light source provide unit 15.When using heavy metal collection system 1 of the invention, it need to will only give up containing heavy metal ion
Water injects among electrolyte EL, then enables light source provide unit 15 and generate light beam to irradiate semiconductor material 13.So operation, by half
Electronics electricity hole inside conductor material 13 can provide an oxidizing force and a reducing power to the more electrons and holes released, so that
Heavy metal ion in waste water restores on the metal reducing electrode 14 becomes a metal film.
It must be subject to detailed description the illustrating for possible embodiments of the present invention, it is emphasized that above-mentioned, only the reality
Apply the scope of the patents that example is not intended to limit the invention, all equivalence enforcements or change without departing from carried out by technical spirit of the present invention,
It is intended to be limited solely by the scope of the patents of this case.
Claims (14)
1. a kind of heavy metal collection system characterized by comprising
One reactive tank is equipped with an electrolyte；
An at least conductor is placed among the electrolyte；
Semiconductor material is overlying on the surface of the conductor；
An at least metal reducing electrode, is placed among the electrolyte, and is electrically connected the conductor；And
One light source provides unit, to issue a light beam to irradiate the semiconductor material；
Wherein, the waste water containing heavy metal ion injects among the electrolyte, and irradiates the semiconductor material with the light beam and make
It obtains the semiconductor material and generates polyelectron electric hole pair；
Wherein, more electronics of those electronics electricity holes pair are moved to the metal reducing electrode, and those electronics electricity via the conductor
The more electric holes in hole pair are moved to the surface of the semiconductor material；
Wherein, those electric holes and those electronics provide an oxidizing force and a reducing power respectively so that the heavy metal in the waste water from
Son restores on the metal reducing electrode becomes a metal film.
2. heavy metal collection system as described in claim 1, which is characterized in that the light source provides unit and is located in the reactive tank
Or outside the reactive tank, and its can for it is following any one: artificial light sources or natural light.
3. heavy metal collection system as described in claim 1, which is characterized in that further include:
An at least optical transmission unit is set to the light source and provides between unit and the semiconductor material, to guide or transmit this
Light beam irradiates the semiconductor material.
4. heavy metal collection system as described in claim 1, which is characterized in that further include:
One storage of waste water unit, to store the waste water, and it is anti-the waste water can be injected this by least one first supply unit
It answers in slot.
5. heavy metal collection system as claimed in claim 3, which is characterized in that the optical transmission unit can for it is following any one:
Guiding device, light disperser, or both combination.
6. heavy metal collection system as claimed in claim 4, which is characterized in that further include:
One electrolyte supply unit to store the electrolyte, and can be infused the electrolyte by least one second supply unit
Enter in the reactive tank.
7. heavy metal collection system as claimed in claim 6, which is characterized in that further include:
One reaction accelerator feed unit, can by an at least third supply unit add a reaction accelerator in the electrolyte it
In, it uses and the heavy metal ion in the waste water is accelerated to be restored on the metal reducing electrode as the metal film.
8. heavy metal collection system as described in claim 1, which is characterized in that the semiconductor material is thin with multiple particles or one
The form of film is overlying on the surface of the conductor.
9. heavy metal collection system as described in claim 1, which is characterized in that the semiconductor material can for it is following any one:
Oxide semiconductor material, sulfide semiconductor material, selenide semiconductor material, gallium based compound, above-mentioned the two group
It closes, combination more than above-mentioned the two, the compound of above-mentioned the two, compound more than above-mentioned the two.
10. heavy metal collection system as claimed in claim 7, which is characterized in that the reaction accelerator is in meeting in the electrolyte
Release multiple reactions and accelerate ions, and the reaction accelerate ion can be it is following any one: phosphate anion, nitrite ion,
Stannous ion, ferrous ion, the combination of above-mentioned the two or combination more than above-mentioned the two.
11. heavy metal collection system as claimed in claim 9, which is characterized in that a transmission of the conductor as those electronics
Channel, and its manufacture material can for it is following any one: copper, silver, gold, platinum, tin indium oxide (Indium Tin Oxide, ITO), oxygen
Change tin (SnO2), zinc oxide (ZnO), the combination of above-mentioned the two or combination more than above-mentioned the two.
12. heavy metal collection system as claimed in claim 11, which is characterized in that shape between the semiconductor material and the conductor
At there is Ohmic contact (Ohmic contact).
13. heavy metal collection system as described in claim 1, which is characterized in that the metal reducing electrode is a mesh electrode
And have lower oxidation reduction overpotential (Redox over-potential), and its manufacture material can for it is following any one: platinum
(Pt), iron (Fe), palladium (Pd), golden (Au), ruthenium (Ru), nickel (Ni), platinum series compound, ruthenium based compound, nickel series compounds, transparent
Conductive material, the combination of above-mentioned the two, combination more than above-mentioned the two, above-mentioned the two compound or above-mentioned wantonly two
Compound more than person.
14. a kind of purposes of heavy metal collection system as described in claim 1, which is characterized in that be applied to a wastewater treatment
Among system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810261858.1A CN110318071A (en) | 2018-03-28 | 2018-03-28 | Heavy metal collection system and application thereof |
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| CN201810261858.1A CN110318071A (en) | 2018-03-28 | 2018-03-28 | Heavy metal collection system and application thereof |
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| CN105884100A (en) * | 2016-06-08 | 2016-08-24 | 浙江奇彩环境科技股份有限公司 | Heavy metal wastewater treatment method |
| CN106673285A (en) * | 2016-11-29 | 2017-05-17 | 环境保护部华南环境科学研究所 | Resource recycling method for gold-containing electroplating wastewater |
| CN107651733A (en) * | 2016-07-26 | 2018-02-02 | 中国科学院生态环境研究中心 | A kind of method that rotating cathode strengthens photoelectrocatalysioxidization oxidization processing complex state heavy metal wastewater thereby and negative electrode recovery heavy metal |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104129830A (en) * | 2013-05-03 | 2014-11-05 | 中国科学院生态环境研究中心 | Photoelectrocatalytic method for treating heavy metal complex waste water and recovering heavy metal therefrom |
| CN104925914A (en) * | 2014-03-18 | 2015-09-23 | 中国科学院生态环境研究中心 | Method for photoelectric combination treatment of heavy metal cyanide-containing wastewater and recovery of heavy metal simultaneously |
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| CN105884100A (en) * | 2016-06-08 | 2016-08-24 | 浙江奇彩环境科技股份有限公司 | Heavy metal wastewater treatment method |
| CN107651733A (en) * | 2016-07-26 | 2018-02-02 | 中国科学院生态环境研究中心 | A kind of method that rotating cathode strengthens photoelectrocatalysioxidization oxidization processing complex state heavy metal wastewater thereby and negative electrode recovery heavy metal |
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Application publication date: 20191011 |