CN110312374A - Debris removal system, optical processing system, air knife and the method for removing clast - Google Patents
Debris removal system, optical processing system, air knife and the method for removing clast Download PDFInfo
- Publication number
- CN110312374A CN110312374A CN201910207892.5A CN201910207892A CN110312374A CN 110312374 A CN110312374 A CN 110312374A CN 201910207892 A CN201910207892 A CN 201910207892A CN 110312374 A CN110312374 A CN 110312374A
- Authority
- CN
- China
- Prior art keywords
- air knife
- clast
- blowing device
- gas blowing
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- BVPWJMCABCPUQY-UHFFFAOYSA-N 4-amino-5-chloro-2-methoxy-N-[1-(phenylmethyl)-4-piperidinyl]benzamide Chemical compound COC1=CC(N)=C(Cl)C=C1C(=O)NC1CCN(CC=2C=CC=CC=2)CC1 BVPWJMCABCPUQY-UHFFFAOYSA-N 0.000 title claims abstract description 100
- 230000003287 optical effect Effects 0.000 title claims description 66
- 238000012545 processing Methods 0.000 title claims description 26
- 238000000034 method Methods 0.000 title claims description 14
- 238000007664 blowing Methods 0.000 claims abstract description 102
- 239000000758 substrate Substances 0.000 claims abstract description 77
- 238000002679 ablation Methods 0.000 claims description 22
- 230000001154 acute effect Effects 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 238000005452 bending Methods 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- 239000007789 gas Substances 0.000 description 72
- 239000004020 conductor Substances 0.000 description 12
- 230000008021 deposition Effects 0.000 description 8
- 238000012937 correction Methods 0.000 description 6
- 230000001276 controlling effect Effects 0.000 description 5
- 238000010276 construction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005286 illumination Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 238000000608 laser ablation Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/04—Cleaning by suction, with or without auxiliary action
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Cleaning In General (AREA)
Abstract
A kind of debris removal system for from the target area removal clast with specific morphology, it includes first gas blowing device and second gas blowing device, the first gas blowing device and the second gas blowing device are arranged in fixed position relative to each other and are at an angle of and are suitable for blowing gas along the surface of target substrate, to evict the clast of setting on said surface from.First gas blowing device and second gas blowing device are respectively adapted to blow gas on first gas flow direction and second gas flow direction, and can be air knife.Debris removal system further comprises suction unit, and the suction unit is arranged in fixed position relative to first gas blowing device and second gas blowing device and is suitable for collecting the clast being expelled out of.Control circuit system is suitable for the position according to clast relative to the specific morphology of the target area of substrate and operates first gas blowing device, second gas blowing device or two gas blowing devices.
Description
Technical field
The present invention relates to a kind of systems for removing clast from the target area of substrate in optical processing system, and more
For body, be related to it is a kind of for by from least two gas blowing device (such as air knife) blowing out pressurised air or it is any its
The system that he is suitble to the gas of type to remove clast.
Background technique
Optical processing system is used, during manufacturing the electronic component such as printed circuit board (PCB) for example to ensure institute
The position of contact in need contacts really, and there is no short circuits on PCB.In some such optical processing systems, pass through
Ablation is unintentionally located between two intentional conductors and causes copper or other electric conductors of short circuit between them to correct and solve
The certainly short circuit on PCB.It issues in applicant on October 16th, 2012 and entitled " circuit is automatically repaired (Automatic
Repair of Electric Circuits) " U.S. Patent No. 8,290,239 in elaborate a reality of such system
Example, the United States Patent (USP) is incorporated herein by reference, as being fully explained the same in this article.
In the ablated such system of short-circuit contact, often has some ablated materials and solidify in air, and
Then fall back on substrate as clast.Other than unsightly, such clast may also result in other problems, for example, it is new or
Other short circuits.
Therefore, there is a need in the art for it is a kind of in optical processing system after the contact on ablation substrate from substrate
The system for removing clast.
Summary of the invention
According to an aspect of the present invention, it provides a kind of broken for being removed in optical processing system from the target area of substrate
The debris removal system of bits, the target area have specific morphology, and the debris removal system includes:
First gas blowing device and second gas blowing device are arranged in fixed position relative to each other and are at an angle of, and
And be suitable for blowing gas along the surface of the target area of the substrate to move the clast being located in the target area, it is described
First gas blowing device and the second gas blowing device are respectively adapted in first gas flow direction and second gas stream
Dynamic side is blown up gas；
Suction unit, relative to the first gas blowing device and second gas blowing device setting in fixed position
In, and be suitable for collecting by the mobile clast；And
Control circuit system, suitable for the position according to the clast relative to the specific morphology of the target area of the substrate
It sets and operates the first gas blowing device, the second gas blowing device or two gas blowing devices.
In some embodiments, first body flow direction and the second gas flow direction Cheng Zhi relative to each other
Angle.
In some embodiments, at least one of the first gas blowing device and the second gas blowing device
Including air knife.In some embodiments, the air knife has in the range of 5 mm to 10 mm or 7 mm to 8 mm
Length.In some embodiments, the air knife has the width in the range of 12 mm to 17 mm or 15 mm to 16 mm
Degree.In some embodiments, the air knife has 160 liters/min to 180 liters/min of air rate.
In some embodiments, at least one of the first gas blowing device and the second gas blowing device
It is controlled by solenoid, and wherein the control circuit system is suitable for operating described first by controlling the solenoidal operation
Gas blowing device or the second gas blowing device.
In some embodiments, the suction unit is blown relative to the first gas blowing device and the second gas
It send the first gas flow direction and the second gas flow direction of device angled, and is suitable for collecting by described first
The clast of either one or two of gas blowing device and the second gas blowing device movement.
In some embodiments, the suction unit includes device for vacuum generation and pump orifice, and the pump orifice is functionally
Associated with the device for vacuum generation and neighbouring first gas blowing device and the second gas blowing device and set
It sets.
In some embodiments, the first gas blowing device and the second gas blowing device and the suction
At least part of device is installed on the optical head of the optical treatment subsystem.
In some embodiments, the debris removal system can be mobile relative to the substrate.
In some embodiments, the copper generated due to the clast includes the copper deposit on the substrate described in the laser ablation
Grain.
According to another embodiment of the present invention, a kind of optical processing system is provided, comprising:
Chassis is provided with substrate；
Optical head, including being suitable for the ablation subsystem from the substrate ablation excess material, the ablation, which generates, is located at the lining
Clast in the target area at bottom；And
Debris removal system as described above, wherein the debris removal system is suitable for removing from the target area of the substrate
The clast.
In some embodiments, at least part of the debris removal system is installed on the optical head, and wherein
The optical head and the chassis can be moved relative to each other, and the debris removal system is oriented from the substrate
The target area removes the clast.
According to still another embodiment of the invention, a kind of air knife is provided, comprising:
Shell has first end section and second end section and substrate surface；
Hollow chamber is arranged in the shell, and the chamber includes at least one elongated portion and tool along axis arrangement
There is chamber width；
Slit is defined between the first end section and the second end section and has slot width；And
The elongated portion of the hollow chamber is fluidly connected to the slit by tapered hollow,
Wherein the slit is arranged relative to the axis of the elongated portion with acute angle.
In some embodiments, the gas-pressurized being blown into the hollow chamber flows into the cone from the hollow chamber
It is flowed out in shape hollow portion and across the slit from the shell.
In some embodiments, the slot width is in the range of 0.1 mm to 0.3 mm.
In some embodiments, the shell has the length in the range of 5 mm to 10 mm or 7 mm to 8 mm.
In some embodiments, the shell has the width in the range of 12 mm to 17 mm or 15 mm to 16 mm.
In some embodiments, the sky that it is 160 liters/min to 180 liters/min across the slit that the air knife, which has,
Gas flow rate.
In some embodiments, the acute angle is in the range of 8 degree to 12 degree.
In some embodiments, the ratio between the hollow width and the slot width is in the model of 20:1 to 15:1
In enclosing.
In some embodiments, the air knife is functionally and suitable for providing the pressurization gas of gas stream into the hollow portion
The solenoid of body source and the operation suitable for controlling the air knife is associated.
In some embodiments, the substrate surface has profile, and the profile continues the acute angle of the slit simultaneously
It bends to substantially parallel to the axis.In some embodiments, the profile continue bending with the profile with it is described
The second acute angle is formed between axis.In some embodiments, second acute angle is in the range of 8 degree to 12 degree.Some
In embodiment, the profile is adapted so that the air stream gone out from the slit is gone along the profile and adjacent to the substrate table
Face and leave the air knife.
According to an embodiment of the invention, in addition providing a kind of for being removed in optical processing system from the target area of substrate
The debris removal system of clast, the target area have specific morphology, and the debris removal system includes:
First air knife and the second air knife as described herein are arranged in fixed position relative to each other and are at an angle of, and
And be suitable for blowing air along the surface of the target area of the substrate to move the clast being located in the target area, it is described
First air knife and second air knife are respectively adapted to blow on the first air-flow direction and the second air-flow direction
Air；
Suction unit relative to first air knife and second air knife setting in fixed position, and is suitable for from institute
Target area is stated to collect by the mobile clast；And
Control circuit system, suitable for the position according to the clast relative to the specific morphology of the target area of the substrate
It sets and operates first air knife, second air knife or two air knifes.
In some embodiments, first air-flow direction and second air-flow direction relative to each other with
Right angle setting.
In some embodiments, the suction unit is relative to first air-flow direction and second air stream
Dynamic direction is angled, and is suitable for what collection was moved by either one or two of first air knife and second air knife
Clast.
In some embodiments, the suction unit includes device for vacuum generation and pump orifice, and the pump orifice is functionally
Associated with the device for vacuum generation and neighbouring first air knife and second air knife and be arranged.
In some embodiments, at least the one of first air knife and second air knife and the suction unit
Part is installed on the optical head of the optical treatment subsystem.
According to another embodiment of the present invention, a kind of mesh using debris removal system as described herein from substrate is provided
The method that area removes clast is marked, the target area has specific morphology, which comprises
The target area of the substrate is aligned with the debris removal system；
It is selected to operate described relative to the position of the specific morphology based on the clast by the control circuit system
Which of one gas blowing device and the second gas blowing device multiple remove clast；
It is one or more of selected by operating in the first gas blowing device and the second gas blowing device, to move
Move the clast in the target area；And
The suction unit is operated to collect by the institute in the first gas blowing device and the second gas blowing device
State one or more mobile clasts.
In some embodiments, operate the suction unit time and the operation first gas blowing device and
Selected one or more of times at least partly overlap in the second gas blowing device.
According to still another embodiment of the invention, a kind of mesh using debris removal system as described herein from substrate is provided
The method that area removes clast is marked, the target area has specific morphology, which comprises
The target area of the substrate is aligned with the debris removal system；
It is selected to operate described relative to the position of the specific morphology based on the clast by the control circuit system
Which of one air knife and second air knife multiple remove clast；
It is one or more of selected by operating in first air knife and second air knife, with the movement target area
In the clast；And
The suction unit is operated to collect by one or more of in first air knife and second air knife
The mobile clast.
In some embodiments, time and the operation first air knife and described the of the suction unit are operated
Selected one or more of times at least partly overlap in two air knifes.
According to still another embodiment of the invention, it provides a kind of for being removed in optical processing system from the target area of substrate
The debris removal system of clast, the target area have specific morphology, and the debris removal system includes:
At least two gas blowing devices are arranged in fixed position relative to each other and are at an angle of, and are suitable for along described
The surface of the target area of substrate blows gas with the mobile clast being located in the target area, and at least two gas is blown
Device is sent to be suitable for blowing gas at least two different gas flow directions；
Suction unit relative at least two gas blowing device setting in fixed position, and is suitable for collecting and be moved
The clast；And
Control circuit system, suitable for the position according to the clast relative to the specific morphology of the target area of the substrate
It each of sets and operates at least two gas blowing device or two gas blowing devices.
In some embodiments, at least one of described gas blowing device includes air knife.
In some embodiments, all gas blowing device can rotate together relative to the suction unit.
In some embodiments, all gas blowing device and getter device are mounted on single chassis, therefore can be together
Rotation.
Detailed description of the invention
The present invention is only elaborated by way of example herein with reference to attached drawing.Now in detail referring in particular to attached drawing, emphasize
Shown in details be only by way of example and show and be only used for illustratively discussing the preferred embodiment of the present invention, and be for
It provides and is believed to be the content to the most useful and understandable explanation in terms of the principle of the invention and concept and presents.This is come
It says, is not intended to degree more essential to the invention than basic comprehension and CONSTRUCTED SPECIFICATION of the invention is shown in greater detail, read referring to attached drawing
Reading the explanation can make those of skill in the art be illustrated several forms of the invention how can be practically carrying out.Entire
In attached drawing, identical element is specified using identical reference character.
In the accompanying drawings:
Fig. 1 is the schematic perspective view of optical processing system according to an embodiment of the present invention, and the optical processing system includes using
In the system for removing clast；
Fig. 2A is the schematic plan side view of the optical head of optical processing system shown in Fig. 1, is equipped with root on the optical head
The system for being used to remove clast according to the embodiment of the present invention；
Fig. 2 B and Fig. 2 C are mounted to respectively on optical head shown in Fig. 2A
The schematic plan side view and schematic plan bottom view of system；
Fig. 3 A and Fig. 3 B are the perspective view and cross-sectional view of air knife according to an embodiment of the present invention respectively, and the air knife is suitble to use
In the system shown in Fig. 2 for removing clast；
Fig. 4 is the schematic diagram across the direction of the air stream of air knife shown in Fig. 3 A and Fig. 3 B；
Fig. 5 A and Fig. 5 B are shown to shown in Fig. 2 for removing the schematic diagram of the control of the air knife of the system of clast；And
Fig. 6 is according to embodiments of the present invention for example using shown in Fig. 2 for removing the system of clast from the target area of substrate
Remove the flow chart of the method for clast.
Description of symbols
100: optical processing system 102: optical head
104: chassis 106: rear upright
108: foreground 109: evacuated panel
110: debris removal system 112: device for vacuum generation
202: light structures/optical configuration 204: construction
208: camera 212:z axis motor
224: removable microscope carrier 240: laser
270: control circuit system 276: supporting shell
278: back section 290a: gas blowing device/air knife
290b: gas blowing device/air knife 291: conduit
292: suction unit 294: suction tube
296: entrance 300: air knife
302: shell 304: first end section
306: second end section 308: substrate surface
310: wing flap 311: plenum chamber
312: cylindrical part 314: elongated portion
315: axis 316: slit
318: inclined surface 320: tapered hollow
The area 502 of 500:PCB: contact
504: the area of clast 510:PCB
512: contact 514: clast
600 ~ 616: step W: case width
Wc: the width We: the width of elongated portion of cylindrical part
Ws: the width α: acute angle of slit
β: angle.
Specific embodiment
The present invention relates to a kind of systems for removing clast from the target area of substrate in optical processing system, and more
For body, it is related to a kind of for by broken to remove from least two gas blowing device (such as air knife) blowing out pressurised air
The system of bits.
In the context of the application and claims, term " pattern of substrate surface " is related to in target substrate
The mapping of the height and difference in height of specific position or the height distribution for the position being related on substrate.
In the context of the application and claims, term " air " is used interchangeably with " gas ", and may include
Surrounding air or any other suitable gas, such as oxygen, CO2, helium, hydrogen, nitrogen or its any suitable combination.
In the context of the application and claims, term " substance " and " about " it is considered as and inclined with designated value
Value from most 10%, at most 8%, at most 5%, at most 3% or at most 1% is related.
It referring now to fig. 1, is the schematic perspective view of optical processing system according to an embodiment of the present invention, the optics
Processing system includes the system for removing clast.
Such as in seen in fig. 1, optical head 102 of the optical processing system 100 including being attached to chassis 104.Optical treatment system
System 100 is preferably run to execute optics deposition and/or ablation, substantially such as in publication on April 19th, 2017 and entitled " light
Learn the optical head and chassis (OPTICAL HEAD AND CHASSIS FOR AN OPTICAL PROCESSING of processing system
SYSTEM described in Japanese Utility Model the 3210312nd) ", the Japanese Utility Model is incorporated herein by reference,
As being fully explained the same in this article.Chassis 104 preferably includes: rear upright 106, optical head 102 are tied
In rear upright 106；And foreground 108, including evacuated panel 109, evacuated panel 109, which will be suitable for placing, to carry out above
The target of deposition.The form of printed circuit board (PCB) can be usually presented in such target, it is to be appreciated, however, that system 100 can be to various
Suitable target executes deposition and/or ablation.
In the operation of optical system 100, optical head 102 is preferably run to carry out to the target being retained on platform 108
Imaging determines whether to need to deposit additional materials in target or from target ablation excess material.
If determination is deposited, then optical head 102 is preferably operable to material from consumable donor
Such deposition is executed on element laser deposition (for example, by before LIFT- induced with laser to transfer) to target, such as in 2015
August Japanese Patent Application Publication publication on the 6th the JP2015144252nd and the United States Patent (USP) disclosed on August 11st, 2016
Apply for that the two patent application publication cases are incorporated by reference described in publication US 2016/0233089, as
It is fully explained the same in this article.
If determination needs to carry out ablation, then optical head 102 is operable to laser ablation preferably to execute such burning
Erosion, described in as described above U.S. Patent No. 8,290,239.
According to an embodiment of the invention, being equipped on optical head 102 functionally associated with device for vacuum generation 112
Debris removal system 110 can hereinafter be illustrated in more details the two.Debris removal system 110 and vacuum generate
Device 112 is suitable for and runs to remove the clast generated by ablating technics from the surface of target, as described herein.
It is that the upper surface of optical processing system 100 is equipped with and is used for according to embodiments of the present invention referring additionally now to Fig. 2A
The schematic plan side view of the optical head 102 of the system 110 of clast is removed, and referring to Fig. 2 B and Fig. 2 C, is peace respectively
Be attached on optical head 102 according to embodiments of the present invention for remove clast system 110 schematic plan side view and show
Meaning property bottom plan view.
As seen in fig. 2, optical head 102 preferably includes light structures 202, and the operation of light structures 202 is put with illuminating
Set the target on vaccum bench 108.Light structures 202 preferably provide multi-direction illumination, and particularly preferably provide at least three
The illumination in a direction.Only by way of example, light structures 202 are illustratively comprised herein and is formed by light emitting diode (LED)
Construction 204.It will be appreciated, however, that light structures 202 can be implemented as providing any suitable illumination knot of illumination from multiple directions
Structure.The light issued from target passes through lens transmission to camera.Light structures 202 can be by z-axis motor 212 relative to camera
Mobile, z-axis motor 212 is connected to light structures 202 and assigns to light structures 202 and moves vertically.
Camera 208 can be configured to obtain the image of target, the accuracy of deposition and/or ablation can be assessed, and
It determines it is further possible that deposition and/or ablation requirement.
It elaborates especially in Japanese Utility Model the 3210312nd of publication on April 19th, 2017 in optical system
Conductive material is deposited on the contact in target PCB and from optics during the operation of target PCB ablation excess conductive material
First 102 structure and details of operation.Optical head as described herein is implemented in AOS product line by applicant, the product system
It is listed inhttps://www.orbotech.com/products/innovative-aos-solutionsPlace is illustrated, and
For example including Precise 800 and Perfix 200, both products can from Ya Funei trade council, Israel street (postcode:
8110101) Orbotech Ltd (Orbotech Ltd. of Sanhedrin Blvd, Yavne, 8110101
Israel it) buys.
Briefly, when needing to remove the excess material in target, laser 240 can hold the excess material in target
Row laser ablation.During ablation, laser 240 provides laser output, and the laser output can be by including scanning mirror
Optical element be conducted directly on target surface.During ablation, spot size of the laser beam in target can be at about 2
μm in the range of 8 μm.Can be adjusted repeatedly during the operation of laser 240 laser output spot size, such as by
The optical beam expander being described in detail in above-mentioned Japanese Utility Model the 3210312nd.
Preferably, such as on the first control panel and the second control panel it is provided with control circuit system 270, for controlling
The operation of optical head 102.The mountable supporting shell outstanding of back section 278 from optical head 102 of the control circuit system
On 276.
Optical head 102 further comprises removable microscope carrier 224, and moving microscope carrier 224 can be relative to chassis 104 and vaccum bench
108 is mobile.The details of removable microscope carrier is illustrated in above-mentioned Japanese Utility Model the 3210312nd.
Go to Fig. 2 B and Fig. 2 C, it can thus be seen that in some embodiments, debris removal system 110 is arranged by optical configuration
In 202 hollow portions formed, so that it can be moved together with optical configuration 202 and laser 240.Debris removal system 110 is wrapped
Include two (or more) gas blowing device 290a and 290b.In some embodiments, gas blowing device 290 is air
Knife, for example, being configured to come with thread compressed-air blows, each air knife is in sky referring below to described in Fig. 3 A to Fig. 4
Air is blowed on gas blowing direction.
It will be appreciated that although presently disclosed embodiment includes two such air knifes, any suitable number of sky
Air knife (for example, 3) is all considered to be within the scope of the invention.
In an embodiment of the present invention, air knife 290a and 290b is arranged in fixed position and angulation relative to each other
Degree.As seen in fig. 2 c, in some embodiments, each of air knife is anchored in place by conduit 291, the conduit
Be suitable for by conduit 291 to air knife offer gas-pressurized pressurized-gas source (not shown) be in fluid communication.Air knife
290a and 290b be each adapted at an angle relative to each other first direction and second party be blown up gas-pressurized or air.
The air knife is arranged and is configured to blow air along the surface of the target area for the substrate being arranged in below the optical head
Stream, with the mobile clast being arranged in the target area.
In the context of this application, if clast is arranged on the surface of target area or clast is being in target area just
In the air of top, for instance in the air between light structures 202 and the target area of substrate, then it is assumed that clast is arranged in mesh
It marks in area.
In some embodiments, air knife can be enabled during ablation excess conductive material, to be deposited to target in clast
Clast is removed before on surface.In other embodiments, air knife can be operated to remove the ablation work for example because previously having occurred
Skill and be set clast on the target surface.In some embodiments, air knife 290a and 290b is relative to each other with straight
Angle setting, and the first flow direction and the second flow direction are relative to each other at right angle.
Such as suction unit 292 associated with device for vacuum generation 112 is arranged relative to air knife 290a and 290b
In fixed position.Suction unit includes suction tube 294, and suction tube 294 terminates at neighbouring first gas blowing device and the second gas
Body blowing device and at the entrance 296 that is arranged.Suction tube 294 is fluidly connected to device for vacuum generation 112(Fig. 2 B), and be suitable for from
The particle such as the clast being expelled out of is collected and removed to the suction areas of neighboring entry 296.In some embodiments, suction unit
292 pipe 294 and entrance 296 is angled relative to the gas flow direction of air knife 290a and 290b.
In embodiment, air knife 290a and 290b can be rotated relative to suction unit 292, to change simultaneously suction unit
Angle between 292 and two air knifes 290a and 290b.
In another embodiment, air knife 290a, 290b and suction unit 292 are installed on same foundation facility, so that
They can be rotated together without changing the relative angle between them.
Air knife 290a and 290b and suction unit 292 are functionally associated with control circuit system 270, control electricity
Road system 270 is suitable for the position according to clast relative to the specific morphology of the target area of substrate and operates air knife 290a, air
Knife 290b or the two air knifes, are explained referring below to Fig. 5 A to Fig. 5 B.In other words, control circuit system 270 is based on
Position and " wall " or the air stream that based on thus a little conductors are formed of the clast relative to the position of target substrate (PCB) upper conductor
Obstacle judges which of air knife to be operated.
In some embodiments, at least one of air knife 290a and 290b is functionally and suitable for controlling across air
The solenoid (not shown) of the gas stream of knife is associated, and control circuit system 270 is grasped by controlling solenoidal operation
Make the air knife or two air knifes.
It is the perspective view and section view of air knife 300 according to an embodiment of the present invention respectively referring now to Fig. 3 A and Fig. 3 B
Figure, the air knife are suitable as air knife 290a and/or 290b in system shown in Figure 2 110, and are to wear referring to Fig. 4
Cross the schematic diagram in the direction of the air stream of air knife 300 shown in Fig. 3 A and Fig. 3 B.
As seen in Fig. 3 A and Fig. 3 B, air knife 300 includes shell 302, and shell 302 has first end section 304, the
Two end parts 306 and substrate surface 308.In illustrated embodiment, second end section 306 forms the one of wing flap (flap) 310
Part, wing flap 310 are arranged to overlapping with the wall of first end section 304.In general, shell 300 is formed by metal.
Shell 300 can have any suitable size, including width W and length L shown in Fig. 3 A.In some embodiments
In, shell length L is in the range of 5 mm to 10 mm or 7 mm to 9 mm, and is 8 mm in some embodiments.Some
In embodiment, case width W is in the range of 12 mm to 17 mm, and is 15 mm in some embodiments.
Shell 300 include hollow chamber 311, hollow chamber 311 be illustrated as here include cylindrical part 312 and carefully
Long part 314.Hollow chamber 311 or the associated cross-sectional width of its each section.In illustrated embodiment, cylinder
The width of shape part 312 is indicated by Wc, and the width of elongated portion 314 is indicated by We.
Slit 316 is defined between the wing flap 310 and first end section 304 of second end section 306, the slit has
The slot width indicated by Ws.In some embodiments, slot width Ws is in the range of 0.1 mm to 0.3 mm, and one
It is 0.2 mm in a little embodiments.In some embodiments, at the ratio between the width We of elongated portion and the width Ws of slit
It in the range of 20:1 to 15:1, and is 16:1 in some embodiments.
As clearly visible in figure 3b, the elongated portion 314 of hollow chamber 311 includes inclined surface 318, inclined surface
318 form tapered hollows 320, and tapered hollow 320 is by hollow chamber 311 and specifically second of hollow chamber 311
314 are divided to fluidly connect with slit 316.
Particularly unique feature of the present invention is, slit 316 relative to the elongated portion 314 of hollow chamber axis 315 with acute angle
(angle as shown in α in Fig. 3 B) arrangement.In some embodiments, sharp angle α is in the range of 8 degree to 12 degree, and some
It is 10 degree in embodiment.
Particularly unique feature of the present invention is that substrate surface 308 is curved, so that its profile continues the angle of slit 316, and
And it bends to substantially parallel to axis 315 and is further bent as shown in angle beta in some embodiments.Such curvature energy
It is enough to guide air stream towards target area, it is as follows to be described in detail.In some embodiments, angle beta is in 8 degree to 12 degree
It in range, and is 10 degree in some embodiments.
In use, functionally compression associated with air knife 300 or pressurization are empty for compression or gas-pressurized or air
Gas source (not shown) flow into hollow chamber 311 in, and from hollow chamber 311 by elongated portion 314, tapered hollow 320 and
Slit 316 and flow out shell 302, as illustrated in fig. 4.In some embodiments, functionally with compression or pressurized air source and/
Or the associated solenoid (not shown) of air knife controls the operation of air knife and the air stream across air knife.
Due to coanda (Coanda) effect, the air blown out from slit 316 flows simultaneously along the curvature of substrate surface 308
It is flowed out under substrate surface 308, as being best illustrated in Fig. 3 B.Therefore, the arrangement orientation of substrate surface 308 is determined from air
The direction of knife 300 and air stream out.
Therefore, when air knife 300 is arranged above target substrate and adjacent objects substrate, from slit 316 and along base
Bottom 308 and the air stream gone out continues to flow along the surface of substrate, and clast can be evicted from from the surface of substrate, such as this paper institute
It states.
In some embodiments, 160 liters/min to 180 liters/min of range is in across the air rate of slit 316
It is interior, and be about 170 liters/min in some embodiments.
In some embodiments, air knife or to provide it the pressurized air source of gas-pressurized or air include for root
The pressure regulatory element (not shown) of pressure is adjusted according to required air stream.
It referring now to Fig. 5 A and Fig. 5 B, is shown when removing clast from the substrate with particular topology to Fig. 2A and figure
For removing the schematic diagram of the control of the air knife 290a and 290b of the system 110 of clast shown in 2B.
As seen in figures, the target substrate as PCB a part includes multiple copper conductors, is deposited between the multiple copper conductor
There is clast.As known in the art, the copper conductor of PCB swells above the substrate surface of PCB, and therefore can play wall or screen
The effect of barrier, so that the air stream of the air knife from the system for removing clast is passed through.
Therefore, control circuit system (270, Fig. 2A) according to PCB surface topology and specifically according to being deposited on PCB table
The position and direction of contact on face and operate air knife 290a and 290b(by include pattern lines rectangle illustrate) in
Different one.
As seen in fig. 5, the area 500 of PCB includes the contact for (being illustrated as vertical) arrangement on the page in one direction
502.In such construction, the air stream from air knife 290a will be stopped by contact 502, and control circuit system will be operated only
Air knife 290b is to evict the clast being arranged between contact 502 504 from.
In contrast, in figure 5B, the area 510 of PCB includes the contact 512 arranged in a second direction, the second direction
It is generally perpendicular to the first direction and is illustrated as level on the page.In such construction, the air stream from air knife 290b
It will be stopped by contact 512, and control circuit system will only operate air knife 290a to evict the clast being arranged between contact 512 from
514。
Fig. 6 is for example to handle substrate (packet for removing the system of clast using shown in Fig. 2 according to embodiments of the present invention
Include from the target area of the substrate remove clast) method flow chart.
Such as seen in fig. 6, at step 600, the target area of substrate is selected.At step 602, to selected areas into
Row imaging, and at step 604, analysis gained image, with judge the target area of substrate in the layout of conductor whether include
Need to correct any mistake of (such as deposition additional materials or ablation excess conductor material).
If determination needs ablation contact at step 606, particularly with respect to the pattern of target area at step 608
And the placement of the contact on target area is to identify the position of correction and the expection sedimentation location of clast.At step 610, control
Circuit system (270, Fig. 2) selects that gas can be used during correction based on the pattern of the correction position and target area that are identified
Which of body blowing device (290a, 290b) or use two gas blowing devices, with prevent clast settle or with by
Clast out.At step 612, control circuit system operates selected gas while operating suction unit (292, Fig. 2 B) and blows
Device is sent, and at step 614, correction needed for implementing while operating gas blowing device.
In some optional embodiments, after the correction needed for implementing, at step 616, the warp of target area can be captured
More new images, and described image can be analyzed again if necessary in step 604 place, to ensure not needing additional correction.
If not needing to correct at step 606, another target area of substrate can be selected at step 600, can be divided
Analysing another substrate or process can terminate.
It will be appreciated that for the sake of clarity and the certain features of the present invention described in the context of separate embodiments can also be
It is provided in combination in single embodiment.On the contrary, for simplicity and described in the context of single embodiment this
Inventing various features can also provide individually or in the form of any suitable sub-portfolio.
Although specific embodiments of the present invention has been combined to be expounded the present invention, but it will be apparent that in this field
Technical staff will become apparent from many alternative solutions, modification and modification.Therefore, the present invention is intended to include belong to the appended claims
Spirit and broad range in all such alternative solutions, modification and modification.All publication mentioned in this specification,
Patent and patent application (including JP utility model the 3210312nd, U.S. Patent No. 8,290,239, Japanese patent application are public
Open case the JP2015144252nd and Patent Application Publication the 2016/0233089th) it is complete by reference herein
Portion is incorporated in this specification, incorporated extent and each individual publication, patent or patent application it is specific and individually by
It is identical to be indicated as being degree incorporated herein by reference.In addition, any bibliography quoted from or identified in this application
It is not necessarily to be construed as recognizing that this bibliography can be used as the prior art of the invention.
Claims (38)
1. a kind of for removing the debris removal system of clast, the target area from the target area of substrate in optical processing system
With specific morphology, which is characterized in that the debris removal system includes:
First gas blowing device and second gas blowing device are arranged in fixed position relative to each other and are at an angle of, and
And be suitable for blowing gas along the surface of the target area of the substrate to move the clast being located in the target area, it is described
First gas blowing device and the second gas blowing device are respectively adapted in first gas flow direction and second gas stream
Dynamic side is blown up gas；
Suction unit, relative to the first gas blowing device and second gas blowing device setting in fixed position
In, and be suitable for collecting by the mobile clast；And
Control circuit system, suitable for the position according to the clast relative to the specific morphology of the target area of the substrate
It sets and operates the first gas blowing device, the second gas blowing device or two gas blowing devices.
2. debris removal system as described in claim 1, which is characterized in that first body flow direction and second gas
Body flow direction is relative to each other at right angle.
3. the debris removal system as described in claim 1 or claim 2, which is characterized in that the first gas blows dress
It sets and at least one of the second gas blowing device includes air knife.
4. debris removal system as claimed in claim 3, which is characterized in that the air knife, which has, is in 5 mm to 10 mm
Or 7 length in the range of mm to 8 mm.
5. debris removal system as claimed in claim 3, which is characterized in that the air knife, which has, is in 12 mm to 17 mm
Or 15 width in the range of mm to 16 mm.
6. debris removal system as claimed in claim 3, which is characterized in that the air knife has 160 liters/min to 180
Liter/min air rate.
7. the debris removal system as described in claim 1 or claim 2, which is characterized in that the first gas blows dress
Set and at least one of the second gas blowing device controlled by solenoid, and wherein the control circuit system be suitable for it is logical
It crosses and controls the solenoidal operation to operate the first gas blowing device or the second gas blowing device.
8. the debris removal system as described in claim 1 or claim 2, which is characterized in that the suction unit relative to
The first gas flow direction and second gas of the first gas blowing device and the second gas blowing device
Body flow direction is angled, and is suitable for collecting by appointing in the first gas blowing device and the second gas blowing device
The clast of one or two movement.
9. the debris removal system as described in claim 1 or claim 2, which is characterized in that the suction unit includes true
Empty generation device and pump orifice, the pump orifice are functionally associated with the device for vacuum generation and adjacent to the first gas
Blowing device and the second gas blowing device and be arranged.
10. the debris removal system as described in claim 1 or claim 2, which is characterized in that the first gas blows dress
It sets and at least part of the second gas blowing device and the suction unit is installed to the optical treatment subsystem
Optical head on.
11. the debris removal system as described in claim 1 or claim 2, which is characterized in that the debris removal system energy
It is enough mobile relative to the substrate.
12. the debris removal system as described in claim 1 or claim 2, which is characterized in that the clast includes because of laser
Copper deposit on substrate described in ablation and the copper particle generated.
13. a kind of optical processing system characterized by comprising
Chassis is provided with substrate；
Optical head, including being suitable for the ablation subsystem from the substrate ablation excess material, the ablation, which generates, is located at the lining
Clast in the target area at bottom；And
Debris removal system as described in claim 1 or claim 2, wherein the debris removal system is suitable for from the lining
The target area at bottom removes the clast.
14. optical processing system as claimed in claim 13, which is characterized in that at least part of the debris removal system
It is installed on the optical head, and wherein the optical head and the chassis can be moved relative to each other, by the clast
Removal system is oriented from the target area of the substrate and removes the clast.
15. a kind of air knife characterized by comprising
Shell has first end section and second end section and substrate surface；
Hollow chamber is arranged in the shell, and the chamber includes at least one elongated portion and tool along axis arrangement
There is chamber width；
Slit is defined between the first end section and the second end section and has slot width；And
The elongated portion of the hollow chamber is fluidly connected to the slit by tapered hollow,
Wherein the slit is arranged relative to the axis of the elongated portion with acute angle.
16. air knife as claimed in claim 15, which is characterized in that be blown into gas-pressurized in the hollow chamber from institute
It states hollow chamber and flows into the tapered hollow and pass through the slit and flowed out from the shell.
17. the air knife as described in claim 15 or claim 16, which is characterized in that the slot width is in 0.1 mm
To 0.3 mm.
18. the air knife as described in claim 15 or claim 16, which is characterized in that the shell has in 5 mm extremely
Length in the range of 10 mm or 7 mm to 8 mm.
19. the air knife as described in claim 15 or claim 16, which is characterized in that the shell, which has, is in 12 mm
Width to 17 mm or 15 mm to 16 mm.
20. the air knife as described in claim 15 or claim 16, which is characterized in that having across the slit is 160
Liter/min to 180 liters/min of air rate.
21. the air knife as described in claim 15 or claim 16, which is characterized in that the acute angle is in 8 degree to 12 degree
In the range of.
22. the air knife as described in claim 15 or claim 16, which is characterized in that the hollow width and the slit
Ratio between width is in the range of 20:1 to 15:1.
23. the air knife as described in claim 15 or claim 16, which is characterized in that functionally be suitable for described hollow
The solenoid of pressurized-gas source and the operation suitable for controlling the air knife that gas stream is provided in portion is associated.
24. the air knife as described in claim 15 or claim 16, which is characterized in that the substrate surface has profile,
The profile continues the acute angle of the slit and bends to substantially parallel to the axis.
25. air knife as claimed in claim 24, which is characterized in that the profile continue bending with the profile with it is described
The second acute angle is formed between axis.
26. air knife as claimed in claim 25, which is characterized in that second acute angle is in the range of 8 degree to 12 degree.
27. air knife as claimed in claim 24, which is characterized in that the profile is adapted so that the sky gone out from the slit
Air-flow goes along the profile and leaves the air knife adjacent to the substrate surface.
28. a kind of for removing the debris removal system of clast, the target from the target area of substrate in optical processing system
Area has specific morphology, which is characterized in that the debris removal system includes:
The first air knife and the second air knife as described in claim 15 or claim 16, are arranged in fixation relative to each other
It is in position and angled, and be suitable for blowing air along the surface of the target area of the substrate to move and be located at the mesh
The clast in area is marked, first air knife and second air knife are respectively adapted to empty in the first air-flow direction and second
Flow of air side is blown up air；
Suction unit relative to first air knife and second air knife setting in fixed position, and is suitable for from institute
Target area is stated to collect by the mobile clast；And
Control circuit system, suitable for the position according to the clast relative to the specific morphology of the target area of the substrate
It sets and operates first air knife, second air knife or two air knifes.
29. debris removal system as claimed in claim 28, which is characterized in that first air-flow direction and described
Two air-flow directions are arranged relative to each other with right angle.
30. debris removal system as claimed in claim 28, which is characterized in that the suction unit is empty relative to described first
Flow of air direction and second air-flow direction are angled, and are suitable for collecting by first air knife and second sky
The clast of either one or two of air knife movement.
31. debris removal system as claimed in claim 28, which is characterized in that the suction unit includes device for vacuum generation
And pump orifice, the pump orifice is functionally associated with the device for vacuum generation and neighbouring first air knife and described the
Two air knifes and be arranged.
32. debris removal system as claimed in claim 28, which is characterized in that first air knife and second air
At least part of knife and the suction unit is installed on the optical head of the optical treatment subsystem.
33. a kind of debris removal system using as described in claim 1 or claim 2 removes clast from the target area of substrate
Method, the target area have specific morphology, which is characterized in that the described method includes:
The target area of the substrate is aligned with the debris removal system；
It is selected to operate described relative to the position of the specific morphology based on the clast by the control circuit system
Which of one gas blowing device and the second gas blowing device multiple remove clast；
It is one or more of selected by operating in the first gas blowing device and the second gas blowing device, to move
Move the clast in the target area；And
The suction unit is operated to collect by the institute in the first gas blowing device and the second gas blowing device
State one or more mobile clasts.
34. method as claimed in claim 33, which is characterized in that operate described in time and the operation of the suction unit
The selected one or more of time at least portions in first gas blowing device and the second gas blowing device
It overlaps with dividing.
35. a kind of method for removing clast from the target area of substrate using debris removal system as claimed in claim 28, institute
Target area is stated with specific morphology, which is characterized in that the described method includes:
The target area of the substrate is aligned with the debris removal system；
It is selected to operate described relative to the position of the specific morphology based on the clast by the control circuit system
Which of one air knife and second air knife multiple remove clast；
It is one or more of selected by operating in first air knife and second air knife, with the movement target area
In the clast；And
The suction unit is operated to collect by one or more of in first air knife and second air knife
The mobile clast.
36. method as claimed in claim 35, which is characterized in that operate described in time and the operation of the suction unit
Selected one or more of times at least partly overlap in first air knife and second air knife.
37. a kind of for removing the debris removal system of clast, the target from the target area of substrate in optical processing system
Area has specific morphology, which is characterized in that the debris removal system includes:
At least two gas blowing devices are arranged in fixed position relative to each other and are at an angle of, and are suitable for along described
The surface of the target area of substrate blows gas with the mobile clast being located in the target area, and at least two gas is blown
Device is sent to be suitable for blowing gas at least two different gas flow directions；
Suction unit relative at least two gas blowing device setting in fixed position, and is suitable for collecting and be moved
The clast；And
Control circuit system, suitable for the position according to the clast relative to the specific morphology of the target area of the substrate
It each of sets and operates at least two gas blowing device or two gas blowing devices.
38. debris removal system as claimed in claim 37, which is characterized in that in at least two gas blowing device
At least one includes air knife.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410326697.5A CN118338555A (en) | 2018-03-20 | 2019-03-19 | Debris removal system, optical treatment system, air knife and method for removing debris |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862645203P | 2018-03-20 | 2018-03-20 | |
| US62/645,203 | 2018-03-20 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410326697.5A Division CN118338555A (en) | 2018-03-20 | 2019-03-19 | Debris removal system, optical treatment system, air knife and method for removing debris |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110312374A true CN110312374A (en) | 2019-10-08 |
| CN110312374B CN110312374B (en) | 2024-05-14 |
Family
ID=68074359
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410326697.5A Pending CN118338555A (en) | 2018-03-20 | 2019-03-19 | Debris removal system, optical treatment system, air knife and method for removing debris |
| CN201910207892.5A Active CN110312374B (en) | 2018-03-20 | 2019-03-19 | Debris removal system, optical treatment system, air knife and method for removing debris |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410326697.5A Pending CN118338555A (en) | 2018-03-20 | 2019-03-19 | Debris removal system, optical treatment system, air knife and method for removing debris |
Country Status (4)
| Country | Link |
|---|---|
| JP (2) | JP7362272B2 (en) |
| KR (1) | KR20190110442A (en) |
| CN (2) | CN118338555A (en) |
| TW (1) | TWI809060B (en) |
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| JP2009148699A (en) * | 2007-12-20 | 2009-07-09 | Toppan Printing Co Ltd | Substrate treatment device |
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| US7294045B1 (en) * | 2005-12-21 | 2007-11-13 | Corning Incorporated | Apparatus and method for edge processing of a glass sheet |
| GB2433459B (en) * | 2005-12-22 | 2008-01-16 | Sony Corp | Laser processing apparatus and laser processing method as well as debris extraction mechanism and debris extraction method |
| JP5165203B2 (en) * | 2006-03-07 | 2013-03-21 | ソニー株式会社 | Laser processing apparatus and laser processing method |
| JP2012168539A (en) * | 2012-02-20 | 2012-09-06 | Japan Display West Co Ltd | Defect correction device |
| KR200494591Y1 (en) * | 2016-03-09 | 2021-11-10 | 오르보테크 엘티디. | Optical head and chassis for an optical processing system |
-
2019
- 2019-03-15 KR KR1020190029861A patent/KR20190110442A/en not_active Application Discontinuation
- 2019-03-18 JP JP2019049993A patent/JP7362272B2/en active Active
- 2019-03-19 CN CN202410326697.5A patent/CN118338555A/en active Pending
- 2019-03-19 TW TW108109210A patent/TWI809060B/en active
- 2019-03-19 CN CN201910207892.5A patent/CN110312374B/en active Active
-
2023
- 2023-10-04 JP JP2023172507A patent/JP2023181194A/en active Pending
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|---|---|---|---|---|
| CA2029244A1 (en) * | 1989-11-03 | 1991-05-04 | Timothy L. Hoopman | Planarizing surfaces of interconnect substrates by diamond turning |
| CA2101902A1 (en) * | 1992-08-11 | 1994-02-12 | Fraser P. Donlan, Jr. | Fluid treatment apparatus and method |
| TW546235B (en) * | 2001-09-14 | 2003-08-11 | Dainippon Screen Mfg | Substrate processing apparatus |
| JP2004298889A (en) * | 2003-03-28 | 2004-10-28 | Seiko Epson Corp | Laser beam machining device |
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| JP2009148699A (en) * | 2007-12-20 | 2009-07-09 | Toppan Printing Co Ltd | Substrate treatment device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190110442A (en) | 2019-09-30 |
| TW201941673A (en) | 2019-10-16 |
| JP7362272B2 (en) | 2023-10-17 |
| CN110312374B (en) | 2024-05-14 |
| JP2019208014A (en) | 2019-12-05 |
| CN118338555A (en) | 2024-07-12 |
| JP2023181194A (en) | 2023-12-21 |
| TWI809060B (en) | 2023-07-21 |
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