CN110311703A - Enhanced smart gateway of internet of things - Google Patents
Enhanced smart gateway of internet of things Download PDFInfo
- Publication number
- CN110311703A CN110311703A CN201910596514.0A CN201910596514A CN110311703A CN 110311703 A CN110311703 A CN 110311703A CN 201910596514 A CN201910596514 A CN 201910596514A CN 110311703 A CN110311703 A CN 110311703A
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- Prior art keywords
- capacitor
- resistance
- zigbee
- circuit
- wireless
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W88/00—Devices specially adapted for wireless communication networks, e.g. terminals, base stations or access point devices
- H04W88/16—Gateway arrangements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
Abstract
The invention discloses a kind of enhanced smart gateway of internet of things, including enhanced smart gateway of internet of things circuit, enhanced smart gateway of internet of things circuit includes electric power management circuit, bus, WiFi Pack bottom plate and at least one enhanced ZigBee Pack plate, and enhanced ZigBee Pack plate includes the wireless MCU circuit of ZigBee, the second bus interface adapter circuit, ZigBee wireless RF amplifying circuit, ZigBee wireless RF transmitting-receiving control circuit, ZigBee wireless RF adapter circuit and the second memory of setting on the second circuit board.The present invention can open electricity and search for automatically, start available and optimal signal ZigBee wireless network, without user intervention, plug and play, significant increase user experience, so that ZigBee wireless networking being optimal of performance, can configure ZigBee wireless networking capacity, low-power consumption on demand.
Description
Technical field
The present invention relates to gateway of internet of things apparatus field, in particular to a kind of enhanced smart gateway of internet of things.
Background technique
Most of gateway of internet of things is limited for the various aspects factor such as cost or professional domain currently on the market, is all only had
The realization that more single product function and networking control need, such as: certain gateway of internet of things is answered what intelligent quotient surpassed on the market
With being only to complete networking with electronic tag, the caching of electronic tag data and parameter and forwarding, access Internet of Things cloud platform etc.
Basic function, the starting point of circuit design are the requirements met under specific application scene to the gateway of internet of things as possible,
And it is basic in the excavation of the usage experience for gateway of internet of things, networking efficiency and flexibility, generalization, expansibility energy etc.
It does not account for, this is for such product large-scale promotion and universal, future development and application upgrade and different manufacturers in the future
Between, without the hardware interconnection between product type be it is very unfavorable, even with inhibition.
Summary of the invention
The technical problem to be solved in the present invention is that in view of the above drawbacks of the prior art, provide it is a kind of can open it is electric automatic
It searches for, start available and optimal signal ZigBee wireless network, be not necessarily to user intervention, plug and play, significant increase user
Usage experience, so that ZigBee wireless networking being optimal of performance, can configure ZigBee wireless networking capacity, low function on demand
The enhanced smart gateway of internet of things of consumption.
The technical solution adopted by the present invention to solve the technical problems is: constructing a kind of enhanced smart gateway of internet of things, wraps
Enhanced smart gateway of internet of things circuit is included, the enhanced smart gateway of internet of things circuit includes electric power management circuit, bus, WiFi
Pack bottom plate and at least one enhanced ZigBee Pack plate, the electric power management circuit, WiFi Pack bottom plate and enhanced
ZigBee Pack plate is connect with the bus, the WiFi Pack bottom plate include the WiFi that is arranged on first circuit board without
Line MCU circuit, the first bus interface adapter circuit, WiFi wireless RF adapter circuit and first memory, first bus connect
Mouthful adapter circuit, WiFi wireless RF adapter circuit and first memory with the wireless MCU circuit connection of the WiFi, the enhancing
Type ZigBee Pack plate includes the wireless MCU circuit of ZigBee, the second bus interface adaptation electricity of setting on the second circuit board
Road, ZigBee wireless RF amplifying circuit, ZigBee wireless RF transmitting-receiving control circuit, ZigBee wireless RF adapter circuit and second are deposited
Reservoir, the second bus interface adapter circuit, ZigBee wireless RF amplifying circuit and second memory with the ZigBee
Wireless MCU circuit connection, the ZigBee wireless RF transmitting-receiving control circuit and ZigBee wireless RF adapter circuit with it is described
The connection of ZigBee wireless RF amplifying circuit, the enhanced smart gateway of internet of things pass through ZigBee Radio Link and electronic tag group
Object control platform is linked at star-like wireless network, and by WiFi Radio Link.
In enhanced smart gateway of internet of things of the present invention, the electric power management circuit includes being mounted on the first circuit
The positive power voltage step down module J 3 of plate, AC220V power interface J4, LDO decompression integrated chip U4, LDO decompression integrated chip U5,
Inductance L3, diode D1, resistance R10, resistance R11, capacitor C12, capacitor C13, capacitor C14, capacitor C15 and capacitor C16, it is described
Power voltage step down module J 3 is mounted on the lower-left end of the first circuit board, and described capacitor C12, LDO are depressured integrated chip U4, two poles
Pipe D1, inductance L3, capacitor C13, resistance R10, resistance R11 and capacitor C14 are respectively positioned on the top of the power voltage step down module J 3, institute
The upper right side that LDO decompression integrated chip U5 is mounted on the first circuit board is stated, the capacitor C16 is located at LDO decompression collection
At the left side of chip U5, the capacitor C15 is located at the lower section of LDO decompression integrated chip U5.
In enhanced smart gateway of internet of things of the present invention, the wireless MCU circuit of ZigBee includes being mounted on the
The positive capacitor C1 of two circuit boards, capacitor C2, capacitor C11, capacitor C12, capacitor C13, capacitor C14, capacitor C15, capacitor C16,
Crystal oscillator Y1 and ZigBee is wireless MCU chip U1, the wireless MCU chip U1 installation of ZigBee is on the second circuit board close to lower end
Position, it is wireless that the capacitor C1, capacitor C2, capacitor C14, capacitor C15, capacitor C16 and crystal oscillator Y1 are respectively positioned on the ZigBee
The right side of MCU chip U1, the capacitor C13 are located at the lower section of the crystal oscillator Y1, and it is wireless that the capacitor C11 is located at the ZigBee
The left side of MCU chip U1, the capacitor C12 are located at the lower section of the wireless MCU chip U1 of the ZigBee.
In enhanced smart gateway of internet of things of the present invention, it is characterised in that the second bus interface adapter circuit
Including being mounted on the positive resistance R4 of second circuit board and bus interface socket J1, it is wireless that the resistance R4 is located at the ZigBee
The lower left of MCU chip U1, the bus interface socket J1 are mounted on the left end of the second circuit board.
In enhanced smart gateway of internet of things of the present invention, the ZigBee wireless RF amplifying circuit includes being mounted on
Positive RF LNA chip U4, RF conveyer U5 of second circuit board, inductance L3, inductance L4, inductance L5, capacitor C8, capacitor C9 and
Capacitor C10, the RF LNA chip U4 are mounted on the second circuit board close to the position of upper end, the capacitor C8, inductance L3,
RF conveyer U5 and inductance L5 is respectively positioned on the lower section of the RF LNA chip U4, and the capacitor C9 capacitor C10 is respectively positioned on the RF
The left side of conveyer U5, the inductance L4 are located at the left side of the inductance L3.
In enhanced smart gateway of internet of things of the present invention, ZigBee wireless RF transmitting-receiving control circuit includes being mounted on
The positive RF detection chip U7 of second circuit board, triode Q1, triode Q2, resistance R10, resistance R11, resistance R12, resistance
R13, resistance R14, resistance R15, resistance R16, resistance R17, capacitor C19 and capacitor C20, the RF detection chip U7 are located at described
The right side of bus interface socket J1, the resistance R11, resistance R12, capacitor C19, resistance R13, resistance R15, resistance R16 and three
Pole pipe Q2 is respectively positioned on the top of the RF detection chip U7, and the resistance R14 is located at the left side of the resistance R11, three pole
Pipe Q1 is located at the top of the resistance R14, and the resistance R17 is located at the top of the triode Q2, and the capacitor C20 is located at institute
State the lower right of bus interface socket J1.
In enhanced smart gateway of internet of things of the present invention, the ZigBee wireless RF adapter circuit includes being mounted on
The positive resistance R1 of second circuit board, resistance R5, resistance R6, capacitor C3, capacitor C4, capacitor C5, capacitor C6, inductance L1, inductance
L2, onboard antenna E1 and external antenna seat J3, the inductance L2, capacitor C3, capacitor C4 and resistance R1 are respectively positioned on the ZigBee
The upper right side of wireless MCU chip U1, the inductance L1 and capacitor C6 state the upper of the wireless MCU chip U1 of ZigBee described in being respectively positioned on
Side, the external antenna seat J3 are located at the upper right side of the bus interface socket J1, and the resistance R5 and resistance R6 are respectively positioned on institute
The right side of external antenna seat J3 is stated, the onboard antenna E1 is located at the top of the external antenna seat J3.
In enhanced smart gateway of internet of things of the present invention, the second memory includes being mounted on second circuit board
Positive resistance R7, capacitor C17, SPI RAM integrated chip U2, resistance R8, resistance R9, capacitor C18 and SPI Flash integrate core
Piece U3, the SPI Flash integrated chip U3 are mounted on the right end of the second circuit board, and the resistance R8 and resistance R9 are located at
The lower left of the SPI Flash integrated chip U3, the capacitor C18 are located at the top of the SPI Flash integrated chip U3,
The SPI RAM integrated chip U2 is located at the upper left side of the SPI Flash integrated chip U3, the resistance R7 and capacitor C17
It is respectively positioned on the upper left side of the SPI RAM integrated chip U2.
Implement enhanced smart gateway of internet of things of the invention, has the advantages that due to enhanced smart Internet of Things
Powered-down road includes electric power management circuit, bus, WiFi Pack bottom plate and at least one enhanced ZigBee Pack plate, WiFi
Pack bottom plate includes the wireless MCU circuit of WiFi being arranged on first circuit board, the first bus interface adapter circuit, WiFi is wireless
RF adapter circuit and first memory, enhanced ZigBee Pack plate include the ZigBee of setting on the second circuit board wireless
MCU circuit, the second bus interface adapter circuit, ZigBee wireless RF amplifying circuit, ZigBee wireless RF transmitting-receiving control circuit,
ZigBee wireless RF adapter circuit and second memory, enhanced smart gateway of internet of things pass through ZigBee Radio Link and electronics mark
Label form star-like wireless network, and are linked into object control platform by WiFi Radio Link, and the present invention can open electric automatic search, starting
Available and optimal signal ZigBee wireless network, be not necessarily to user intervention, plug and play, significant increase user experience,
So that ZigBee wireless networking being optimal of performance, can configure ZigBee wireless networking capacity, low-power consumption on demand.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the schematic network structure of enhanced smart gateway of internet of things networking of the present invention；
Fig. 2 is the structure of enhanced smart gateway of internet of things circuit in enhanced smart gateway of internet of things one embodiment of the present invention
Schematic diagram；
Fig. 3 is the structural schematic diagram of WiFi Pack bottom plate in the embodiment；
Fig. 4 is the distribution map of the positive component of first circuit board in the embodiment；
Fig. 5 is the distribution map of first circuit board positive pad and conducting wire in the embodiment；
Fig. 6 is the distribution map of the component of first circuit board reverse side in the embodiment；
Fig. 7 is the pad of first circuit board reverse side and the distribution map of conducting wire in the embodiment；
Fig. 8 is the structural schematic diagram of enhanced ZigBee Pack plate in the embodiment；
Fig. 9 is the distribution map of the positive component of second circuit board in the embodiment；
Figure 10 is the distribution map of second circuit board positive pad and conducting wire in the embodiment；
Figure 11 is the distribution map of the component of second circuit board reverse side in the embodiment；
Figure 12 is the pad of second circuit board reverse side and the distribution map of conducting wire in the embodiment.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
In enhanced smart gateway of internet of things embodiment of the present invention, the network structure of the enhanced smart gateway of internet of things networking
Schematic diagram is as shown in Figure 1.Enhanced smart gateway of internet of things forms star-like wireless network by ZigBee Radio Link and electronic tag
Network, and object control platform is linked by WiFi Radio Link, user can by object control platform to enhanced smart gateway of internet of things into
Row operation control.Electronic tag in Fig. 1 is the models electronic tagging devices such as 2.9 cun of screens of research and development certainly, 7.5 cun of screens, rather than
Refer to ZigBee electronic tag on the market.Object control platform be from research and development for be managed collectively electronic labelling system equipment,
For the mating platform of enhanced enhanced smart gateway of internet of things seamless access.
The enhanced smart gateway of internet of things includes enhanced smart gateway of internet of things circuit, enhanced smart gateway of internet of things circuit
As the core of enhanced smart gateway of internet of things (enhanced smart gateway of internet of things equipment), using modularization, generalization, easily expansion
Exhibition, the design principle to domesticize as far as possible.The structural schematic diagram of the enhanced smart gateway of internet of things circuit is as shown in Figure 2.In Fig. 2,
The enhanced smart gateway of internet of things circuit includes electric power management circuit 1, bus 2, WiFi Pack bottom plate 3 and at least one enhancing
Type ZigBee Pack plate 4 (N number of enhanced ZigBee Pack plate 4 is depicted in figure as an example, N is the integer greater than 1,
In practical application, the number of enhanced ZigBee Pack plate 4 can be adjusted accordingly with concrete condition).Electric power management circuit 1,
WiFi Pack bottom plate 3 and enhanced ZigBee Pack plate 4 are connect with bus 2.
Electric power management circuit 1 mainly completes decompression and voltage stabilizing function, selects frequency conversion voltage dropping power supply module mature on the market.
Bus 2 mainly completes the power supply and data interaction of each circuit module in enhanced smart gateway of internet of things, using " power supply+
The mode of SPI hybrid bus " realizes that, in order to facilitate assembling product production, hardware state selects common DIP socket, contact pin.
The enhanced smart gateway of internet of things has a characteristic that 1) intelligent networking: be not necessarily to user's operation, power on ZigBee without
Line automatic network-building, plug and play；2) user can carry out flexibly, dynamically according to the needs of practical ZigBee wireless networking capacity
The quantity for configuring enhanced ZigBee Pack plate 4, without replacing enhanced smart gateway of internet of things；3) it eats dishes without rice or wine direct distribution, letter
Change user networking and uses link；4) net-working standard: IEEE 802.15.4 (ZigBee, to electronic tag), IEEE802.11b/g/
N (WiFi, to object control platform) supports AES128 encryption；5) supply voltage: AC220V；6) WiFi and ZigBee wirelessly works frequently
Section: 2.4GHz；7) the wireless output impedance of WiFi and ZigBee: 50 Ω；8) ZigBee radio transmitted power: 20dBm；9)ZigBee
Wireless receiving sensitivity: -106dBm；10) ZigBee wireless data transmission rate: 250Kbps；11) WiFi radio transmitted power:
20dBm(IEEE802.11b),17dBm(IEEE802.11g),14dBm(IEEE802.11n)；12) WiFi wireless receiving is sensitive
Degree: -91dBm (IEEE802.11b), -75dBm (IEEE802.11g), -72dBm (IEEE802.11n)；13) WiFi is without line number
According to transmission rate: 10/100Mbps is adaptive.
Fig. 3 is the structural schematic diagram of WiFi Pack bottom plate in the present embodiment, and in Fig. 3, which includes setting
Set the wireless MCU circuit 31 of WiFi, the first bus interface adapter circuit 32, WiFi wireless RF adapter circuit on first circuit board
33 and first memory 34, the first bus interface adapter circuit 32, WiFi wireless RF adapter circuit 33 and first memory 34 are equal
It is connect with the wireless MCU circuit 31 of WiFi.
Wherein, the wireless MCU circuit 31 of WiFi is for completing following function: WiFi air protocol conversion；Receive and process object
The instruction that control platform issues；Receive and process the instruction of enhanced ZigBee Pack plate 4；Electronic tag and gateway parameter data
Caching, storage or forwarding；It eats dishes without rice or wine direct distribution, simplifies user networking and use link；It manages each enhanced with automatic synchronization
The ZigBee wireless networking parameter and data of ZigBee Pack plate 4 guarantee the optimization of ZigBee wireless networking performance.
First bus interface adapter circuit 32 mainly completes that the uncoupling, filter of power supply, pressure stabilizing and bus data connect
The transmitting-receiving matching feature of mouth.Select separate type component (resistance, capacitor etc.) Lai Shixian.WiFi wireless RF adapter circuit 33 is main
Radio frequency (RF) impedance (50 Ω) matching feature is completed, is realized using separate type component (inductance, capacitor, resistance etc.).First deposits
Reservoir 34 mainly completes data buffer storage or store function, using SPI Flash and RAM integrated chip, in conjunction with separate type component
(resistance, capacitor etc.) Lai Shixian.
Fig. 8 is the structural schematic diagram of enhanced ZigBee Pack plate in the present embodiment, in Fig. 8, the enhanced ZigBee
Pack plate 4 include the setting wireless MCU circuit 41 of ZigBee on the second circuit board, the second bus interface adapter circuit 42,
ZigBee wireless RF amplifying circuit 43, ZigBee wireless RF transmitting-receiving control circuit 44, ZigBee wireless RF adapter circuit 45 and the
Two memories 46, wherein the second bus interface adapter circuit 42, ZigBee wireless RF amplifying circuit 43 and second memory 46 are equal
It is connect with the wireless MCU circuit 41 of ZigBee, ZigBee wireless RF receives and dispatches control circuit 44 and ZigBee wireless RF adapter circuit 45
It is connect with ZigBee wireless RF amplifying circuit 43.
Wherein, the wireless MCU circuit 41 of ZigBee is for completing following function: ZigBee air protocol conversion；It receives and locates
The instruction that reason WiFi Pack bottom plate 3 issues；Electronic tag and ZigBee wireless networking supplemental characteristic caching, storage or forwarding；Pipe
Manage the electronic tag ZigBee wireless networking parameter and data to network；Open that electricity is searched for automatically, to start available and signal optimal
ZigBee wireless network, and networking is carried out with object control platform, it is not necessarily to user intervention, plug and play, user is greatly promoted and uses body
Test and guarantee the maximization of network performance；Control in real time enters net state with maintenance electronic tag.
Second bus interface adapter circuit 42 mainly completes that the uncoupling, filter of power supply, pressure stabilizing and bus data connect
The transmitting-receiving matching feature of mouth selects separate type component (resistance, capacitor etc.) Lai Shixian.ZigBee wireless RF amplifying circuit 43 is main
ZigBee RF wireless signals enlarging function is completed, to provide the ZigBee wireless networking of greater room distance range, signal is connect
It receives respectively independent with sendaisle.Using " RF LNA chip+RF switch chip+RF conveyor elements+separate type component (electricity
Sense, capacitor, resistance etc.) " mode realize.
ZigBee wireless RF receives and dispatches the main signal reception for completing the amplification of ZigBee wireless RF of control circuit 44 and transmission is logical
Road seamless handover function.It is realized by the way of " RF detection chip+separate type component (inductance, capacitor, resistance etc.) ".
ZigBee wireless RF adapter circuit 45 mainly completes radio frequency (RF) impedance (50 Ω) matching feature, using separate type component (electricity
Sense, capacitor, resistance etc.) it realizes.Second memory 46 mainly completes data buffer storage or store function, using SPI Flash and RAM
Integrated chip, in conjunction with separate type component (resistance, capacitor etc.) Lai Shixian.The present invention can open electricity search for automatically, start it is available
And the ZigBee wireless network that signal is optimal, be not necessarily to user intervention, plug and play, significant increase user experience so that
ZigBee wireless networking being optimal of performance, can configure ZigBee wireless networking capacity, low-power consumption on demand.
Fig. 4 is the distribution map of the positive component of first circuit board in the present embodiment.In Fig. 4, electric power management circuit 1 includes
It is mounted on the positive power voltage step down module J 3 of first circuit board, AC220V power interface J4, LDO decompression integrated chip U4, LDO drop
Press integrated chip U5, inductance L3, diode D1, resistance R10, resistance R11, capacitor C12, capacitor C13, capacitor C14, capacitor C15
With capacitor C16, power voltage step down module J 3 is mounted on the lower-left end of first circuit board, and capacitor C12, LDO are depressured integrated chip U4, two
Pole pipe D1, inductance L3, capacitor C13, resistance R10, resistance R11 and capacitor C14 are respectively positioned on the top of power voltage step down module J 3, LDO
Decompression integrated chip U5 is mounted on the upper right side of first circuit board, and capacitor C16 is located at the left side of LDO decompression integrated chip U5, electricity
Hold the lower section that C15 is located at LDO decompression integrated chip U5.
WiFi is wireless, and MCU circuit 31 includes being mounted on the positive resistance R1 of first circuit board, resistance R2, resistance R3, resistance
R13, capacitor C1, capacitor C2, capacitor C5, capacitor C17, capacitor C18, crystal oscillator Y1 and WiFi is wireless, and MCU chip U1, WiFi are wireless
MCU chip U1 is mounted on the right end of first circuit board, and capacitor C17 is located at the upper left side of the wireless MCU chip U1 of WiFi, crystal oscillator Y1,
Capacitor C5, capacitor C18 and resistance R3 are respectively positioned on the left side of the wireless MCU chip U1 of WiFi, resistance R2, capacitor C1 and the equal position capacitor C2
In the lower left of the wireless MCU chip U1 of WiFi, resistance R1 and resistance R13 are respectively positioned on the lower right of the wireless MCU chip U1 of WiFi.It should
WiFi is wireless, and MCU chip U1 selects the wireless MCU of the dedicated WiFi of domestic ESP8266 of Le Xin company.
In the present embodiment, the first bus interface adapter circuit 32 includes being mounted on the positive resistance R14 of first circuit board, electricity
It is wireless that resistance R15, resistance R16, resistance R17 and bus interface socket J1, resistance R14, resistance R15 and resistance R16 are respectively positioned on WiFi
The top of MCU chip U1, resistance R17 are located at the upper right side WiFi wireless MCU chip U1, and it is wireless that bus interface socket J1 is located at WiFi
The upper left side of MCU chip U1.
In the present embodiment, WiFi wireless RF adapter circuit 33 includes being mounted on the positive resistance R18 of first circuit board, resistance
R19, capacitor C9, inductance L1, inductance L2, onboard antenna E1 and external antenna seat J5, external antenna seat J5 are located at the wireless MCU of WiFi
The lower right of chip U1, resistance R18, resistance R19, capacitor C9, inductance L1 and inductance L2 are respectively positioned on the left side of external antenna seat J5,
Onboard antenna E1 is located at the lower section of external antenna seat J5.
First memory 34 includes being mounted on the positive resistance R7 of first circuit board, capacitor C10, SPI RAM integrated chip
U2, resistance R9, resistance R12, capacitor C11 and SPI Flash integrated chip U3, resistance R12 and SPI Flash integrated chip U3 are equal
Positioned at the top of the wireless MCU chip U1 of WiFi, resistance R9 is located at the lower right of SPI Flash integrated chip U3, and capacitor C11 is located at
The upper right side of SPI Flash integrated chip U3, SPI RAM integrated chip U2 are located at the left side of SPI Flash integrated chip U3, electricity
Hold the upper left side that C10 is located at SPI Flash integrated chip U3, resistance R7 is located at the upper left side of SPI RAM integrated chip U2.
Fig. 5 is the distribution map of first circuit board positive pad and conducting wire in the present embodiment；Fig. 6 is first in the present embodiment
The distribution map of the component of circuit board reverse side；Fig. 7 is the pad of first circuit board reverse side and the distribution map of conducting wire in the present embodiment.
Fig. 9 is the distribution map of the positive component of second circuit board in the present embodiment.In Fig. 9, ZigBee is wireless MCU circuit
41 include being mounted on the positive capacitor C1 of second circuit board, capacitor C2, capacitor C11, capacitor C12, capacitor C13, capacitor C14, electricity
Appearance C15, capacitor C16, crystal oscillator Y1 and ZigBee is wireless, and the wireless MCU chip U1 of MCU chip U1, ZigBee is mounted on second circuit board
The upper position close to lower end, capacitor C1, capacitor C2, capacitor C14, capacitor C15, capacitor C16 and crystal oscillator Y1 be respectively positioned on ZigBee without
The right side of line MCU chip U1, capacitor C13 are located at the lower section of crystal oscillator Y1, and capacitor C11 is located at a left side of the wireless MCU chip U1 of ZigBee
Side, capacitor C12 are located at the lower section of the wireless MCU chip U1 of ZigBee.The ZigBee is wireless, and MCU chip U1 selects NXP company
The dedicated ZigBee of JN5169 is wireless MCU.
In the present embodiment, the second bus interface adapter circuit 42 includes being mounted on the positive resistance R4 of second circuit board and total
Line interface socket J1, resistance R4 are located at the lower left of the wireless MCU chip U1 of ZigBee, and bus interface socket J1 is mounted on the second electricity
The left end of road plate.
In the present embodiment, ZigBee wireless RF amplifying circuit 43 includes being mounted on the positive RF LNA chip of second circuit board
U4, RF conveyer U5, inductance L3, inductance L4, inductance L5, capacitor C8, capacitor C9 and capacitor C10, RF LNA chip U4 are mounted on
Second circuit board is respectively positioned on RF LNA chip U4's close to the position of upper end, capacitor C8, inductance L3, RF conveyer U5 and inductance L5
Lower section, capacitor C9 capacitor C10 are respectively positioned on the left side of RF conveyer U5, and inductance L4 is located at the left side of inductance L3.
In the present embodiment, ZigBee wireless RF transmitting-receiving control circuit 44 includes being mounted on the positive RF detection of second circuit board
Chip U7, triode Q1, triode Q2, resistance R10, resistance R11, resistance R12, resistance R13, resistance R14, resistance R15, resistance
R16, resistance R17, capacitor C19 and capacitor C20, RF detection chip U7 are located at the right side of bus interface socket J1, resistance R11, electricity
Resistance R12, capacitor C19, resistance R13, resistance R15, resistance R16 and triode Q2 are respectively positioned on the top of RF detection chip U7, resistance
R14 is located at the left side of resistance R11, and triode Q1 is located at the top of resistance R14, and resistance R17 is located at the top of triode Q2, capacitor
C20 is located at the lower right of bus interface socket J1.
In the present embodiment, ZigBee wireless RF adapter circuit 45 includes being mounted on the positive resistance R1 of second circuit board, electricity
Hinder R5, resistance R6, capacitor C3, capacitor C4, capacitor C5, capacitor C6, inductance L1, inductance L2, onboard antenna E1 and external antenna seat
J3, inductance L2, capacitor C3, capacitor C4 and resistance R1 are respectively positioned on the upper right side of the wireless MCU chip U1 of ZigBee, inductance L1 and capacitor
C6 is respectively positioned on the top for stating the wireless MCU chip U1 of ZigBee, and external antenna seat J3 is located at the upper right side of bus interface socket J1, electricity
Resistance R5 and resistance R6 is respectively positioned on the right side of external antenna seat J3, and onboard antenna E1 is located at the top of external antenna seat J3.
In the present embodiment, second memory 46 includes being mounted on the positive resistance R7 of second circuit board, capacitor C17, SPI
RAM integrated chip U2, resistance R8, resistance R9, capacitor C18 and SPI Flash integrated chip U3, SPI Flash integrated chip U3
It is mounted on the right end of second circuit board, resistance R8 and resistance R9 are located at the lower left of SPI Flash integrated chip U3, capacitor C18
Positioned at the top of SPI Flash integrated chip U3, SPI RAM integrated chip U2 is located at the upper left of SPI Flash integrated chip U3
Side, resistance R7 and capacitor C17 are respectively positioned on the upper left side of SPI RAM integrated chip U2.
Figure 10 is the distribution map of second circuit board positive pad and conducting wire in the present embodiment；Figure 11 is the in the present embodiment
The distribution map of the component of two circuit board reverse side；Figure 12 is the distribution of the pad and conducting wire of second circuit board reverse side in the present embodiment
Figure.
It searches for automatically in short, the present invention can open electricity, start available and optimal signal ZigBee wireless network, being not necessarily to
User intervention, plug and play, while significant increase user experience, but also ZigBee wireless networking performance is optimal
Change.
The present invention can configure ZigBee wireless networking capacity on demand, specifically, ZigBee wireless networking parameter by
WiFi Pack bottom plate 3 is managed and automatic synchronization, in addition respectively independence, modularization, unitized enhanced ZigBee
Pack plate 4 designs, and user is carried out according to the needs of practical ZigBee wireless networking capacity, and flexible, dynamically configuration increases
The quantity of strong type ZigBee Pack plate, without replacing enhanced smart gateway of internet of things.Every piece of enhanced ZigBee
The ZigBee wireless networking capacity of Pack plate is suitable with traditional ZigBee gateway of internet of things, increases enhanced ZigBee Pack plate
While configuring quantity, the purpose for the networking capacity that is multiplied also can achieve.
The ZigBee wireless RF amplification of pure hardware and transmitting-receiving switching control design, without any change of software, Ji Kewei
ZigBee wireless RF sends signal offer 10dBm, reception signal also provides the gain of 10dBm, and required current loss is only
20mA or so is significantly less than and reaches suitable RF signal using RF power amplifier integrated chip (such as: RFX2401C, AT2401C) on the market
The electric current (350mA or so) that gain is lost.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (8)
1. a kind of enhanced smart gateway of internet of things, which is characterized in that described enhanced including enhanced smart gateway of internet of things circuit
Intelligent things gateway circuit includes electric power management circuit, bus, WiFiPack bottom plate and at least one enhanced ZigBee Pack
Plate, the electric power management circuit, WiFi Pack bottom plate and enhanced ZigBee Pack plate are connect with the bus, described
WiFi Pack bottom plate include the wireless MCU circuit of WiFi being arranged on first circuit board, the first bus interface adapter circuit,
WiFi wireless RF adapter circuit and first memory, the first bus interface adapter circuit, WiFi wireless RF adapter circuit and
For first memory with the wireless MCU circuit connection of the WiFi, the enhanced ZigBee Pack plate includes setting in the second electricity
The wireless MCU circuit of ZigBee, the second bus interface adapter circuit, ZigBee wireless RF amplifying circuit, ZigBee on the plate of road without
Line RF transmitting-receiving control circuit, ZigBee wireless RF adapter circuit and second memory, the second bus interface adapter circuit,
With the wireless MCU circuit connection of the ZigBee, the ZigBee is wireless for ZigBee wireless RF amplifying circuit and second memory
RF transmitting-receiving control circuit and ZigBee wireless RF adapter circuit are connect with the ZigBee wireless RF amplifying circuit, the enhancing
Type intelligent things gateway forms star-like wireless network by ZigBee Radio Link and electronic tag, and passes through WiFi Radio Link
It is linked into object control platform.
2. enhanced smart gateway of internet of things according to claim 1, which is characterized in that the electric power management circuit includes peace
Mounted in the positive power voltage step down module J 3 of first circuit board, AC220V power interface J4, LDO decompression integrated chip U4, LDO decompression
Integrated chip U5, inductance L3, diode D1, resistance R10, resistance R11, capacitor C12, capacitor C13, capacitor C14, capacitor C15 and
Capacitor C16, the power voltage step down module J 3 are mounted on the lower-left end of the first circuit board, capacitor C12, LDO decompression collection
The power voltage step down mould is respectively positioned at chip U4, diode D1, inductance L3, capacitor C13, resistance R10, resistance R11 and capacitor C14
The top of block J3, the LDO decompression integrated chip U5 are mounted on the upper right side of the first circuit board, and the capacitor C16 is located at
The left side of the LDO decompression integrated chip U5, the capacitor C15 are located at the lower section of LDO decompression integrated chip U5.
3. enhanced smart gateway of internet of things according to claim 1, which is characterized in that the wireless MCU circuit of ZigBee
Including being mounted on the positive capacitor C1 of second circuit board, capacitor C2, capacitor C11, capacitor C12, capacitor C13, capacitor C14, capacitor
C15, capacitor C16, crystal oscillator Y1 and ZigBee is wireless, and MCU chip U1, the wireless MCU chip U1 of ZigBee are mounted on second circuit
Close to the position of lower end on plate, the capacitor C1, capacitor C2, capacitor C14, capacitor C15, capacitor C16 and crystal oscillator Y1 are respectively positioned on institute
The right side of the wireless MCU chip U1 of ZigBee is stated, the capacitor C13 is located at the lower section of the crystal oscillator Y1, and the capacitor C11 is located at institute
The left side of the wireless MCU chip U1 of ZigBee is stated, the capacitor C12 is located at the lower section of the wireless MCU chip U1 of the ZigBee.
4. enhanced smart gateway of internet of things according to claim 3, which is characterized in that the second bus interface adaptation electricity
Road includes being mounted on the positive resistance R4 of second circuit board and bus interface socket J1, the resistance R4 be located at the ZigBee without
The lower left of line MCU chip U1, the bus interface socket J1 are mounted on the left end of the second circuit board.
5. enhanced smart gateway of internet of things according to claim 4, which is characterized in that the ZigBee wireless RF amplification electricity
Road includes being mounted on positive RF LNA chip U4, RF conveyer U5 of second circuit board, inductance L3, inductance L4, inductance L5, capacitor
C8, capacitor C9 and capacitor C10, the RF LNA chip U4 are mounted on the second circuit board close to the position of upper end, the electricity
Appearance C8, inductance L3, RF conveyer U5 and inductance L5 are respectively positioned on the lower section of the RF LNA chip U4, the capacitor C9 capacitor C10
It is respectively positioned on the left side of the RF conveyer U5, the inductance L4 is located at the left side of the inductance L3.
6. enhanced smart gateway of internet of things according to claim 5, which is characterized in that ZigBee wireless RF transmitting-receiving control electricity
Road includes being mounted on the positive RF detection chip U7 of second circuit board, triode Q1, triode Q2, resistance R10, resistance R11, electricity
Hinder R12, resistance R13, resistance R14, resistance R15, resistance R16, resistance R17, capacitor C19 and capacitor C20, the RF detection chip
U7 is located at the right side of the bus interface socket J1, the resistance R11, resistance R12, capacitor C19, resistance R13, resistance R15, electricity
Resistance R16 and triode Q2 is respectively positioned on the top of the RF detection chip U7, and the resistance R14 is located at the left side of the resistance R11,
The triode Q1 is located at the top of the resistance R14, and the resistance R17 is located at the top of the triode Q2, the capacitor
C20 is located at the lower right of the bus interface socket J1.
7. enhanced smart gateway of internet of things according to claim 1, which is characterized in that the ZigBee wireless RF adaptation electricity
Road include be mounted on the positive resistance R1 of second circuit board, resistance R5, resistance R6, capacitor C3, capacitor C4, capacitor C5, capacitor C6,
Inductance L1, inductance L2, onboard antenna E1 and external antenna seat J3, the inductance L2, capacitor C3, capacitor C4 and resistance R1 are respectively positioned on
The upper right side of the wireless MCU chip U1 of ZigBee, the inductance L1 and capacitor C6 state the wireless MCU core of ZigBee described in being respectively positioned on
The top of piece U1, the external antenna seat J3 are located at the upper right side of the bus interface socket J1, the resistance R5 and resistance R6
It is respectively positioned on the right side of the external antenna seat J3, the onboard antenna E1 is located at the top of the external antenna seat J3.
8. enhanced smart gateway of internet of things according to claim 7, which is characterized in that the second memory includes installation
In the positive resistance R7 of second circuit board, capacitor C17, SPI RAM integrated chip U2, resistance R8, resistance R9, capacitor C18 and SPI
Flash integrated chip U3, the SPI Flash integrated chip U3 are mounted on the right end of the second circuit board, the resistance R8
It is located at the lower left of the SPI Flash integrated chip U3 with resistance R9, it is integrated that the capacitor C18 is located at the SPI Flash
The top of chip U3, the SPI RAM integrated chip U2 are located at the upper left side of the SPI Flash integrated chip U3, the electricity
Resistance R7 and capacitor C17 is respectively positioned on the upper left side of the SPI RAM integrated chip U2.
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