CN110311054A - A kind of display panel and preparation method thereof - Google Patents
A kind of display panel and preparation method thereof Download PDFInfo
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- CN110311054A CN110311054A CN201910639247.0A CN201910639247A CN110311054A CN 110311054 A CN110311054 A CN 110311054A CN 201910639247 A CN201910639247 A CN 201910639247A CN 110311054 A CN110311054 A CN 110311054A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
This application discloses a kind of display panels and preparation method thereof, including thin-film transistor array base-plate, organic luminescent device and thin-film encapsulation layer；Thin-film transistor array base-plate includes viewing area and non-display area, and non-display area is arranged around viewing area；The viewing area of thin-film transistor array base-plate is arranged in organic luminescent device；The non-display area of thin-film transistor array base-plate is equipped with circular groove structure, and circular groove structure is arranged around the surrounding of organic luminescent device, and water oxygen barrier material is filled in circular groove structure, to form water oxygen barrier layer；Thin-film encapsulation layer is covered on organic luminescent device, the non-display area of thin-film transistor array base-plate and water oxygen barrier layer.Water oxygen barrier layer in circular groove structure can stop extraneous steam to invade organic luminescent device from the contact interface of thin-film encapsulation layer and thin-film transistor array base-plate; it protects the performance of organic luminescent device unaffected, increases the service life of organic luminescent device.
Description
Technical field
This application involves technical field of display panel more particularly to a kind of display panel and preparation method thereof.
Background technique
OLED (Organic Light-Emitting Diode, Organic Light Emitting Diode) device is compared with traditional LC D (Liquid
Crystal Display, liquid crystal display) compared to having, weight light and handy, wide viewing angle, response time is fast, low temperature resistant, luminous efficiency
The advantages that high, therefore next-generation novel display technology is regarded it as in display industry, especially OLED device can be in flexible base
The curved flexible display screen of energy is made on plate, this is even more huge advantage specific to OLED.In order to realize the Flexible Displays of OLED
Advantage, thin-film package (Thin Film Encapsulation, TFE) technology is essential core technology.
For OLED device, if extraneous steam intrudes into inside OLED device, the luminous effect of device can be seriously affected
Rate and service life.In TFE technology, in order to effectively prevent steam invade and realize flexible package, frequently with it is inorganic/organic/
The film layer structure of inorganic alternative stacked.Wherein inorganic film is as barrier water oxygen layer, and organic film is then used as buffer layer, for delaying
Inorganic film internal stress is released, the flexibility of TFE film layer is enhanced.
Part inorganic film for the OLED device of current TFE encapsulation, in the double inorganic films and Array processing procedure of TFE
Extraneous steam invasion can be effectively obstructed, but since the part inorganic film in the double inorganic films and Array processing procedure of TFE is not one
Secondary film forming, therefore each inorganic film in part inorganic film interface in TFE and Array processing procedure can not achieve and closely connect
Touching, this results in extraneous steam that may invade from surrounding.If extraneous steam is invaded to effective display area domain, electricity will be seriously reduced
The luminous efficiency and service life of electroluminescent material；If extraneous steam is invaded to the organic encapsulation layer of TFE, will seriously affect organic
The performance of encapsulating material reduces the flexible package ability of TFE.Therefore, how effectively to prevent extraneous steam from invading from side
OLED device is the research topic of a great practical application meaning.
Summary of the invention
The embodiment of the present application provides a kind of display panel and preparation method thereof, can effectively prevent extraneous steam from display
The organic layer of side the invasion organic luminescent device and thin-film encapsulation layer of panel, extends the service life of organic luminescent device, mentions
The flexible package effect of high thin-film encapsulation layer.
The embodiment of the present application provides a kind of display panel, including thin-film transistor array base-plate, organic luminescent device and
Thin-film encapsulation layer；
The thin-film transistor array base-plate includes viewing area and non-display area, and the non-display area surrounds the viewing area
Setting；The viewing area of the thin-film transistor array base-plate is arranged in the organic luminescent device；The thin film transistor (TFT) array
The non-display area of substrate is equipped with circular groove structure, and the circular groove structure is set around the surrounding of the organic luminescent device
It sets, and is filled with water oxygen barrier material in the circular groove structure, to form water oxygen barrier layer；
The thin-film encapsulation layer is covered on the non-display area of the organic luminescent device, the thin-film transistor array base-plate
On the water oxygen barrier layer.
Optionally, the thin-film transistor array base-plate includes underlay substrate, and is successively set on the underlay substrate
On thin film transistor array layer and interlayer insulating film, the circular groove structure be set to the interlayer insulating film on, it is described thin
Film encapsulated layer is covered on the organic luminescent device, the interlayer insulating film and the water oxygen barrier layer.
Optionally, the thin-film encapsulation layer includes the first inorganic layer, organic layer and the second inorganic layer；First inorganic layer
It is covered on the organic luminescent device and the thin-film transistor array base-plate, and the circular groove structure is around described the
The surrounding of one inorganic layer is arranged；The organic layer is arranged on the first inorganic layer corresponding with the organic luminescent device；It is described
Second inorganic layer be covered on the organic layer, first inorganic layer, the thin-film transistor array base-plate non-display area and
On the water oxygen barrier layer.
Optionally, the water oxygen barrier material includes the organic basis material doped with nanometer dry particle.
Optionally, the circular groove structure includes at least one annular groove, and each annular groove is around described organic
The surrounding of luminescent device is arranged.
Optionally, each annular groove is in the shape packet perpendicular to the section on the thin-film transistor array base-plate direction
Include any one in square, rectangle, trapezoidal, arc and up-side down triangle.
The embodiment of the present application also provides a kind of production methods of display panel, comprising the following steps:
Thin-film transistor array base-plate is provided；The thin-film transistor array base-plate includes viewing area and non-display area, institute
Non-display area is stated to be arranged around the viewing area；
Organic luminescent device is formed in the viewing area of the thin-film transistor array base-plate；
Circular groove structure is formed in the non-display area of the thin-film transistor array base-plate；The circular groove structure encloses
Surrounding around the organic luminescent device is arranged；
Water oxygen barrier material is filled in the circular groove structure, and forms water oxygen barrier layer；
The organic luminescent device, the thin-film transistor array base-plate non-display area and the water oxygen barrier layer on
Form thin-film encapsulation layer.
Optionally, the thin-film transistor array base-plate includes underlay substrate, and is successively set on the underlay substrate
On thin film transistor array layer and interlayer insulating film；
The non-display area in the thin-film transistor array base-plate forms circular groove structure, comprising the following steps:
Annular groove knot is formed on the interlayer insulating film corresponding to the non-display area of the thin-film transistor array base-plate
Structure.
Optionally, described that water oxygen barrier material is filled in the circular groove structure, and water oxygen barrier layer is formed, including
Following steps:
It is filled in the circular groove structure using coating, silk-screen printing or inkjet printing technology dry doped with nanometer
The organic basis material of particle；
Using heat curing techniques or ultraviolet curing technology by the organic basis material doped with nanometer dry particle
Solidification forms water oxygen barrier layer.
Optionally, the thin-film encapsulation layer includes the first inorganic layer, organic layer and the second inorganic layer；
It is described to stop in the organic luminescent device, the non-display area of the thin-film transistor array base-plate and the water oxygen
Thin-film encapsulation layer is formed on layer, comprising the following steps:
The first inorganic layer is formed on the organic luminescent device and the thin-film transistor array base-plate；Wherein, described
Water oxygen barrier layer is arranged around the surrounding of first inorganic layer；
Organic layer is formed on first inorganic layer；The organic layer corresponds to the organic luminescent device setting；
The organic layer, first inorganic layer, the thin-film transistor array base-plate non-display area and the water
The second inorganic layer is formed on oxygen barrier layers.
The application's has the beneficial effect that in the application, and the non-display area of thin-film transistor array base-plate is equipped with filling water oxygen
The circular groove structure of barrier material, the viewing area of thin-film transistor array base-plate are equipped with organic luminescent device, and thin-film package
Layer is covered on organic luminescent device, the non-display area of thin-film transistor array base-plate and water oxygen barrier layer, circular groove structure
Interior water oxygen barrier layer can stop extraneous steam from the contact interface of thin-film encapsulation layer and thin-film transistor array base-plate
Organic luminescent device is invaded, protects the performance of organic luminescent device unaffected, increase organic luminescent device uses the longevity
Life；Second inorganic layer of thin-film encapsulation layer is covered on the non-display area of organic layer, the first inorganic layer, thin-film transistor array base-plate
On water oxygen barrier layer, water oxygen barrier layer can both stop extraneous steam from the second inorganic layer and thin-film transistor array base-plate
Contact interface and the first inorganic layer and thin-film transistor array base-plate contact interface at invade organic luminescent device, can also
To stop extraneous steam to invade organic layer from the contact interface of the second inorganic layer and the first inorganic layer, organic hair can be protected
The performance of optical device it is unaffected increase organic luminescent device service life, also can protective film encapsulated layer organic layer not by
Destroy the flexible package effect for improving thin-film encapsulation layer.
Detailed description of the invention
With reference to the accompanying drawing, it is described in detail by the specific embodiment to the application, the technical solution of the application will be made
And other beneficial effects are apparent.
Fig. 1 is a kind of section structural schematic diagram of display panel provided by the embodiments of the present application；
Fig. 2 is the top view of interlayer insulating film provided by the embodiments of the present application and water oxygen barrier layer；
Fig. 3 is the section structural schematic diagram of another display panel provided by the embodiments of the present application；
Fig. 4 is the schematic process flow diagram of the production method of display panel provided by the embodiments of the present application.
Specific embodiment
Specific structure and function details disclosed herein are only representative, and are for describing showing for the application
The purpose of example property embodiment.But the application can be implemented by many alternative forms, and be not interpreted as
It is limited only by the embodiments set forth herein.
In the description of the present application, it is to be understood that term " center ", " transverse direction ", "upper", "lower", "left", "right",
The orientation or positional relationship of the instructions such as "vertical", "horizontal", "top", "bottom", "inner", "outside" be orientation based on the figure or
Positional relationship is merely for convenience of description the application and simplifies description, rather than the device or element of indication or suggestion meaning must
There must be specific orientation, be constructed and operated in a specific orientation, therefore should not be understood as the limitation to the application.In addition, art
Language " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance or implicitly indicate institute
The quantity of the technical characteristic of instruction." first " is defined as a result, the feature of " second " can explicitly or implicitly include one
Or more this feature.In the description of the present application, unless otherwise indicated, the meaning of " plurality " is two or more.
In addition, term " includes " and its any deformation, it is intended that cover and non-exclusive include.
In the description of the present application, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected；It can be directly connected, can also can be indirectly connected through an intermediary
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
Concrete meaning in application.
Term used herein above is not intended to limit exemplary embodiment just for the sake of description specific embodiment.Unless
Context clearly refers else, otherwise singular used herein above "one", " one " also attempt to include plural number.Also answer
When understanding, term " includes " and/or "comprising" used herein above provide stated feature, integer, step, operation,
The presence of unit and/or component, and do not preclude the presence or addition of other one or more features, integer, step, operation, unit,
Component and/or combination thereof.
The application is described further with reference to the accompanying drawings and examples.
As shown in Figure 1 to Figure 3, the embodiment of the present application provides a kind of display panel 1, including thin film transistor (TFT) (Thin
Film Transistor, TFT) array substrate 2, organic luminescent device 3 and thin-film encapsulation layer 4；Thin-film transistor array base-plate 2
Including viewing area 5 and non-display area 6, non-display area 6 is arranged around viewing area 5；Organic luminescent device 3 is arranged in thin film transistor (TFT)
The viewing area 5 of array substrate 2；The non-display area 6 of thin-film transistor array base-plate 2 is equipped with circular groove structure 7, annular groove knot
Structure 7 is arranged around the surrounding of organic luminescent device 3, and water oxygen barrier material is filled in circular groove structure 7, to form water oxygen
Barrier layer 8；Thin-film encapsulation layer 4 is covered on organic luminescent device 3, the non-display area 6 of thin-film transistor array base-plate 2 and water oxygen resistance
In barrier 8.
Specifically, the viewing area 5 of thin-film transistor array base-plate 2 and non-display area 6 viewing area with display panel 1 respectively
5 and non-display area 6 it is corresponding；The water oxygen barrier layer 8 that water oxygen barrier material is formed in circular groove structure 7 can stop extraneous water
Vapour intrudes into inside display panel 1.
In the present embodiment, the annular that the non-display area 6 of thin-film transistor array base-plate 2 is equipped with filling water oxygen barrier material is recessed
Slot structure 7, the viewing area 5 of thin-film transistor array base-plate 2 are equipped with organic luminescent device 3, and thin-film encapsulation layer 4 be covered on it is organic
Luminescent device 3, thin-film transistor array base-plate 2 non-display area 6 and water oxygen barrier layer 8 on, the water oxygen in circular groove structure 7
Barrier layer 8, which can stop extraneous steam to be invaded from the contact interface of thin-film encapsulation layer 4 and thin-film transistor array base-plate 2, to be had
Machine luminescent device 3 protects the performance of organic luminescent device 3 unaffected, increases the service life of organic luminescent device 3.
The present embodiment is optional, and thin-film transistor array base-plate 2 includes underlay substrate 9, and is successively set on substrate base
Thin film transistor array layer 10 and interlayer insulating film 11 on plate 9, circular groove structure 7 are set on interlayer insulating film 11, film
Encapsulated layer 4 is covered on organic luminescent device 3, interlayer insulating film 11 and water oxygen barrier layer 8.
Specifically, interlayer insulating film 11 is one layer of inorganic layer on thin-film transistor array base-plate 2, interlayer insulating film 11 with
Thin-film encapsulation layer 4 is contacted in the position of the non-display area 6 of corresponding thin-film transistor array base-plate 2, and organic luminescent device 3 is wrapped up
Firmly, invasion of the organic luminescent device 3 not by extraneous steam is protected, but interlayer insulating film 11 and thin-film encapsulation layer 4 are not one
Molding, steam may invade from interlayer insulating film 11 and the contact interface of thin-film encapsulation layer 4.In the present embodiment, such as Fig. 1 and
Shown in Fig. 2, water oxygen is filled in the position setting of the non-display area 6 of the corresponding thin-film transistor array base-plate 2 of interlayer insulating film 11
The circular groove structure 7 of barrier material forms water oxygen barrier layer 8, and extraneous steam can be stopped from interlayer insulating film 11 and thin
Organic luminescent device 3 is invaded at the contact interface of film encapsulated layer 4, protects the performance of organic luminescent device 3 unaffected, is increased
The service life of organic luminescent device 3.
The present embodiment is optional, and thin-film encapsulation layer 4 includes the first inorganic layer 12, organic layer 13 and the second inorganic layer 14；The
One inorganic layer 12 is covered on organic luminescent device 3 and thin-film transistor array base-plate 2, and circular groove structure 7 surrounds first
The surrounding of inorganic layer 12 is arranged；Organic layer 13 is arranged on first inorganic layer 12 corresponding with organic luminescent device 3；Second is inorganic
Layer 14 is covered on organic layer 13, the first inorganic layer 12, the non-display area 6 of thin-film transistor array base-plate 2 and water oxygen barrier layer 8
On.
Specifically, the first inorganic layer 12 and the second inorganic layer 14 include but is not limited to silicon nitride, silica, silicon oxynitride,
The inorganic material such as silicon carbide, carbonitride of silicium, aluminium oxide, zirconium oxide or titanium oxide, organic layer 13 include but is not limited to acrylic or
The thermoset materials such as epoxy.
In the present embodiment, the second inorganic layer 14 of thin-film encapsulation layer 4 is covered on organic layer 13, the first inorganic layer 12, film
On the non-display area 6 and water oxygen barrier layer 8 of transistor (TFT) array substrate 2, water oxygen barrier layer 8 can both stop extraneous steam from the
The contact interface and the first inorganic layer 12 and thin-film transistor array base-plate of two inorganic layers 14 and thin-film transistor array base-plate 2
Organic luminescent device 3 is invaded at 2 contact interface, and extraneous steam can also be stopped from the second inorganic layer 14 and the first inorganic layer
Organic layer 13 is invaded at 12 contact interface, the performance of organic luminescent device 3 can be protected unaffected, increases organic illuminator
The service life of part 3, also can the organic layer 13 of protective film encapsulated layer 4 be not damaged and improve the flexible package of thin-film encapsulation layer 4
Effect.
The present embodiment is optional, and water oxygen barrier material includes the organic basis material doped with nanometer dry particle.Specifically
, nanometer dry particle includes and is not limited to calcium oxide, magnesia and other silicates, and partial size includes 5 nanometers to 50 nanometers；
Organic basis material includes the thermoset materials such as acrylic and epoxy.
In the present embodiment, nanometer dry particle is used to capture the steam of outside invading, and organic basis material is received for fixation
Rice dry particle.When extraneous steam invades organic luminescent device 3 from side, the nanometer dry particle in water oxygen barrier layer 8 can
To capture the steam of invasion, to prevent steam from further invading to the inside of display panel 1, organic luminescent device 3 is increased
Service life.
The present embodiment is optional, and circular groove structure 7 includes at least one annular groove 15, such as two shown in Fig. 2
Spaced annular groove 15, each annular groove 15 are arranged around the surrounding of organic luminescent device 3.
In the present embodiment, the quantity of annular groove 15 is that multiple advantages is, when the annular far from organic luminescent device 3
When the steam of nanometer dry particle capture outside invading in groove 15 reaches saturation state, close to the ring of organic luminescent device 3
Nanometer dry particle in connected in star 15 can continue to capture extraneous steam, and the water oxygen strengthened in circular groove structure 7 stops
Layer 8 stops the effect of extraneous steam invasion.
The present embodiment is optional, and each annular groove 15 is perpendicular to the section on 2 direction of thin-film transistor array base-plate
Shape include any one in square, rectangle, trapezoidal, arc and up-side down triangle.
Specifically, as shown in figures 1 and 3, when circular groove structure 7 includes multiple annular grooves 15, each annular is recessed
Slot 15 can be identical in the shape perpendicular to the section on 2 direction of thin-film transistor array base-plate, can not also be identical, specifically
Combination of shapes can be selected according to product, and certainly, annular groove 15 is perpendicular to 2 direction of thin-film transistor array base-plate
On section shape be not limited to the present embodiment in the shape enumerated.
As shown in figure 4, the embodiment of the present application also provides a kind of production methods of display panel 1, comprising the following steps:
S401: thin-film transistor array base-plate is provided；Thin-film transistor array base-plate includes viewing area and non-display area, non-
Viewing area is arranged around viewing area；
S402: organic luminescent device is formed in the viewing area of thin-film transistor array base-plate；
S403: circular groove structure is formed in the non-display area of thin-film transistor array base-plate；Circular groove structure surrounds
The surrounding of organic luminescent device is arranged；
S404: water oxygen barrier material is filled in circular groove structure, and forms water oxygen barrier layer；
S405: it is formed on organic luminescent device, the non-display area of thin-film transistor array base-plate and water oxygen barrier layer thin
Film encapsulated layer.
Specifically, display panel made from above-mentioned production method is as shown in Figure 1, organic luminescent device 3 is located at film crystal
On the viewing area 5 of pipe array substrate 2；Circular groove structure 7 is located at the non-display area 6 of thin-film transistor array base-plate 2, and annular is recessed
Slot structure 7 is arranged around the surrounding of organic luminescent device 3, and water oxygen barrier layer 8 is covered in circular groove structure 7；Film envelope
Dress layer 4 is covered on the non-display area 6 and water oxygen barrier layer 8 of organic luminescent device 3, thin-film transistor array base-plate 2.
In the present embodiment, the annular that the non-display area 6 of thin-film transistor array base-plate 2 is equipped with filling water oxygen barrier material is recessed
Slot structure 7, the viewing area 5 of thin-film transistor array base-plate 2 are equipped with organic luminescent device 3, and thin-film encapsulation layer 4 be covered on it is organic
Luminescent device 3, thin-film transistor array base-plate 2 non-display area 6 and water oxygen barrier layer 8 on, the water oxygen in circular groove structure 7
Barrier layer 8, which can stop extraneous steam to be invaded from the contact interface of thin-film encapsulation layer 4 and thin-film transistor array base-plate 2, to be had
Machine luminescent device 3 protects the performance of organic luminescent device 3 unaffected, increases the service life of organic luminescent device 3.
The present embodiment is optional, as shown in Figure 1, thin-film transistor array base-plate 2 includes underlay substrate 9, and successively sets
Set thin film transistor array layer 10 and interlayer insulating film 11 on underlay substrate 9；In step S403, in thin film transistor (TFT) array
The non-display area of substrate forms circular groove structure, comprising the following steps:
Annular groove knot is formed on the interlayer insulating film 11 corresponding to the non-display area 6 of thin-film transistor array base-plate 2
Structure 7.
Specifically, preparing circular groove structure 7 using etching technique；Interlayer insulating film 11 is thin-film transistor array base-plate
One layer of inorganic layer on 2, the non-display area 6 of interlayer insulating film 11 and thin-film encapsulation layer 4 in corresponding thin-film transistor array base-plate 2
Position contact, organic luminescent device 3 is wrapped, protects invasion of the organic luminescent device 3 not by extraneous steam, but interlayer
Insulating layer 11 with thin-film encapsulation layer 4 be not it is integrally formed, steam may be from the contact of interlayer insulating film 11 and thin-film encapsulation layer 4
Interface invasion.
In the present embodiment, formed on the interlayer insulating film 11 corresponding to the non-display area 6 of thin-film transistor array base-plate 2
Circular groove structure 7 filled with water oxygen barrier material can stop extraneous steam from interlayer insulating film 11 and thin-film package
Organic luminescent device 3 is invaded at the contact interface of layer 4, is protected the performance of organic luminescent device 3 unaffected, is increased organic
The service life of luminescent device 3.
The present embodiment is optional, step S404 specifically includes the following steps:
It is filled in circular groove structure 7 using coating, silk-screen printing or inkjet printing technology doped with nanometer dry
The organic basis material of grain；
It will be solidified doped with the organic basis material of nanometer dry particle using heat curing techniques or ultraviolet curing technology,
Form water oxygen barrier layer 8.
Specifically, nanometer dry particle includes and is not limited to calcium oxide, magnesia and other silicates, partial size includes 5
Nanometer is to 50 nanometers；Organic basis material includes the thermoset materials such as acrylic and epoxy.
In the present embodiment, nanometer dry particle is used to capture the steam of outside invading, and organic basis material is received for fixation
Rice dry particle.When extraneous steam invades organic luminescent device 3 from side, the nanometer dry particle in water oxygen barrier layer 8 can
To capture the steam of invasion, to prevent steam from further invading to the inside of display panel 1, organic luminescent device 3 is increased
Service life.
The present embodiment is optional, and thin-film encapsulation layer 4 includes the first inorganic layer 12, organic layer 13 and the second inorganic layer 14；Step
Rapid S405 specifically includes the following steps:
The first inorganic layer 12 is formed on organic luminescent device 3 and thin-film transistor array base-plate 2；Wherein, water oxygen stops
Layer 8 is arranged around the surrounding of the first inorganic layer 12；
Organic layer 13 is formed on the first inorganic layer 12；The corresponding organic luminescent device 3 of organic layer 13 is arranged；
Organic layer 13, the first inorganic layer 12, thin-film transistor array base-plate 2 non-display area 6 and water oxygen barrier layer 8 on
Form the second inorganic layer 14.
Specifically, the first inorganic layer 12 and the second inorganic layer 14 include but is not limited to silicon nitride, silica, silicon oxynitride,
The inorganic material such as silicon carbide, carbonitride of silicium, aluminium oxide, zirconium oxide or titanium oxide, organic layer 13 include but is not limited to acrylic or
The thermoset materials such as epoxy.
In the present embodiment, the second inorganic layer 14 of thin-film encapsulation layer 4 is covered on organic layer 13, the first inorganic layer 12, film
On the non-display area 6 and water oxygen barrier layer 8 of transistor (TFT) array substrate 2, water oxygen barrier layer 8 can both stop extraneous steam from the
The contact interface and the first inorganic layer 12 and thin-film transistor array base-plate of two inorganic layers 14 and thin-film transistor array base-plate 2
Organic luminescent device 3 is invaded at 2 contact interface, and extraneous steam can also be stopped from the second inorganic layer 14 and the first inorganic layer
Organic layer 13 is invaded at 12 contact interface, can protect the unaffected increase organic illuminator of the performance of organic luminescent device 3
The service life of part 3, also can the organic layer 13 of protective film encapsulated layer 4 be not damaged and improve the flexible package of thin-film encapsulation layer 4
Effect.
Although above preferred embodiment is not to limit in conclusion the application is disclosed above with preferred embodiment
The application processed, those skilled in the art are not departing from spirit and scope, can make various changes and profit
Decorations, therefore the protection scope of the application subjects to the scope of the claims.
Claims (10)
1. a kind of display panel, which is characterized in that including thin-film transistor array base-plate, organic luminescent device and thin-film package
Layer；
The thin-film transistor array base-plate includes viewing area and non-display area, and the non-display area is set around the viewing area
It sets；The viewing area of the thin-film transistor array base-plate is arranged in the organic luminescent device；The thin film transistor (TFT) array base
The non-display area of plate is equipped with circular groove structure, and the circular groove structure is arranged around the surrounding of the organic luminescent device,
And water oxygen barrier material is filled in the circular groove structure, to form water oxygen barrier layer；
The thin-film encapsulation layer is covered on the organic luminescent device, the non-display area of the thin-film transistor array base-plate and institute
It states on water oxygen barrier layer.
2. display panel as described in claim 1, which is characterized in that the thin-film transistor array base-plate includes substrate base
Plate, and the thin film transistor array layer and interlayer insulating film that are successively set on the underlay substrate, the annular groove knot
Structure be set to the interlayer insulating film on, the thin-film encapsulation layer be covered on the organic luminescent device, the interlayer insulating film and
On the water oxygen barrier layer.
3. display panel as described in claim 1, which is characterized in that the thin-film encapsulation layer includes the first inorganic layer, organic
Layer and the second inorganic layer；First inorganic layer is covered on the organic luminescent device and the thin-film transistor array base-plate
On, and the circular groove structure is arranged around the surrounding of first inorganic layer；Organic layer setting with it is described organic
On corresponding first inorganic layer of luminescent device；Second inorganic layer is covered on the organic layer, first inorganic layer, described
On the non-display area of thin-film transistor array base-plate and the water oxygen barrier layer.
4. display panel as described in claim 1, which is characterized in that the water oxygen barrier material includes dry doped with nanometer
The organic basis material of particle.
5. display panel as claimed in claim 1 or 2, which is characterized in that the circular groove structure includes at least one ring
Connected in star, each annular groove are arranged around the surrounding of the organic luminescent device.
6. display panel as claimed in claim 5, which is characterized in that each annular groove is perpendicular to the thin film transistor (TFT)
The shape in the section on array substrate direction includes any one in square, rectangle, trapezoidal, arc and up-side down triangle.
7. a kind of production method of display panel, which comprises the following steps:
Thin-film transistor array base-plate is provided；The thin-film transistor array base-plate includes viewing area and non-display area, described non-
Viewing area is arranged around the viewing area；
Organic luminescent device is formed in the viewing area of the thin-film transistor array base-plate；
Circular groove structure is formed in the non-display area of the thin-film transistor array base-plate；The circular groove structure surrounds institute
State the surrounding setting of organic luminescent device；
Water oxygen barrier material is filled in the circular groove structure, and forms water oxygen barrier layer；
It is formed on the organic luminescent device, the non-display area of the thin-film transistor array base-plate and the water oxygen barrier layer
Thin-film encapsulation layer.
8. the production method of display panel as claimed in claim 7, which is characterized in that the thin-film transistor array base-plate packet
Underlay substrate is included, and the thin film transistor array layer and interlayer insulating film that are successively set on the underlay substrate；
The non-display area in the thin-film transistor array base-plate forms circular groove structure, comprising the following steps:
Circular groove structure is formed on the interlayer insulating film corresponding to the non-display area of the thin-film transistor array base-plate.
9. the production method of display panel as claimed in claim 7, which is characterized in that described in the circular groove structure
Water oxygen barrier material is filled, and forms water oxygen barrier layer, comprising the following steps:
It is filled in the circular groove structure doped with nanometer dry particle using coating, silk-screen printing or inkjet printing technology
Organic basis material；
The organic basis material doped with nanometer dry particle is solidified using heat curing techniques or ultraviolet curing technology,
Form water oxygen barrier layer.
10. the production method of display panel as claimed in claim 7, which is characterized in that the thin-film encapsulation layer includes first
Inorganic layer, organic layer and the second inorganic layer；
It is described the organic luminescent device, the thin-film transistor array base-plate non-display area and the water oxygen barrier layer on
Form thin-film encapsulation layer, comprising the following steps:
The first inorganic layer is formed on the organic luminescent device and the thin-film transistor array base-plate；Wherein, the water oxygen
Barrier layer is arranged around the surrounding of first inorganic layer；
Organic layer is formed on first inorganic layer；The organic layer corresponds to the organic luminescent device setting；
It is hindered in the organic layer, first inorganic layer, the non-display area of the thin-film transistor array base-plate and the water oxygen
The second inorganic layer is formed in barrier.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
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| CN201910639247.0A CN110311054A (en) | 2019-07-16 | 2019-07-16 | A kind of display panel and preparation method thereof |
| PCT/CN2019/099184 WO2021007888A1 (en) | 2019-07-16 | 2019-08-05 | Display panel and fabrication method therefor |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910639247.0A CN110311054A (en) | 2019-07-16 | 2019-07-16 | A kind of display panel and preparation method thereof |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910639247.0A Pending CN110311054A (en) | 2019-07-16 | 2019-07-16 | A kind of display panel and preparation method thereof |
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| WO (1) | WO2021007888A1 (en) |
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Application publication date: 20191008 |