CN110310756A - A kind of preparation process of the dedicated conductive silver powder of glass base circuit board - Google Patents
A kind of preparation process of the dedicated conductive silver powder of glass base circuit board Download PDFInfo
- Publication number
- CN110310756A CN110310756A CN201910570960.4A CN201910570960A CN110310756A CN 110310756 A CN110310756 A CN 110310756A CN 201910570960 A CN201910570960 A CN 201910570960A CN 110310756 A CN110310756 A CN 110310756A
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- China
- Prior art keywords
- silver
- low temperature
- glass base
- aerosol
- circuit board
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
- B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Dispersion Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Abstract
The present invention provides a kind of preparation processes of dedicated conductive silver powder of glass base circuit board, comprising the following steps: solid fine silver or silver alloy are fused into liquid silver；Liquid silver is imported to the nitrogen atmosphere spray chamber of nitrogen gas concn >=99.99%, atomizer is atomized liquid silver the liquid silver injection high-pressure atomisation gas of importing, before aerosol solidification, it is set to the low temperature nitrogen nozzle of spray chamber and bursts injection to what the aerosol of ot-yet-hardened carried out 3~10HZ of frequency, aerosol becomes irregular shape under the percussion for bursting the low temperature nitrogen ejected, and the low temperature of low temperature nitrogen makes aerosol quick solidification while deformation, forms the dedicated conductive silver powder of glass base circuit board.Dedicated conductive silver powder particle provided by the invention is in irregular shape, interparticle contact point is random, power is unordered to transmitting when stress, makes to be tightly combined between silver powder particles, the conductive capability of circuit can be made to be remarkably reinforced when as the basic ingredients for preparing glass base conducting channel.
Description
Technical field
The present invention relates to a kind of preparation processes of dedicated conductive silver powder of glass base circuit board, belong to metallurgical technology field.
Background technique
Conductive silver powder passes through gas-atomized powder technique mostly and prepares at present, and gas-atomized powder technique is made using high-speed flow
For melting liquid stream, gas kinetic energy is set to be converted into bath surface, and then form tiny drop and be frozen into powder particle.
The silver powder that gas-atomized powder method in the prior art is produced is spherical, but this silver powder of surface shape rule
When being used as the conductive material of manufacture glass base circuit board, since the contact surface between the spherical silver powder of surface shape rule is small,
Gap between adjacent silver powder particles is larger, therefore the binding force of circuit is poor, and the electric conductivity of circuit is caused to be deteriorated.
Summary of the invention
It is an object of the invention to overcome the deficiencies in the prior art, and provide that a kind of glass base circuit board is dedicated to lead
The preparation process of electric silver powder manufactures a kind of non-spherical irregular body silver powder by the technique, promotes the combination between silver powder particles
Degree keeps circuit conductive made of the silver powder more preferable.
To achieve the above object, the technical solution adopted by the present invention the following steps are included:
S1, solid fine silver or silver alloy are fused into liquid silver, wherein silver content >=99.9% in the fine silver；It is described
Silver content >=90% in silver alloy, remaining group are divided into conductive metal；
S2, the nitrogen atmosphere spray chamber that liquid silver is imported to nitrogen gas concn >=99.99%, liquid silver of the atomizer to importing
Injection high-pressure atomisation gas is atomized liquid silver, and the nebulant particles after atomization are 1-5 μm, before aerosol solidification, is set to
The low temperature nitrogen nozzle of spray chamber bursts injection to what the aerosol of ot-yet-hardened carried out 3~10HZ of frequency, bursts the gas of injection
Body pressure is 0.2~1MPa, and aerosol becomes irregular shape under the percussion for bursting the low temperature nitrogen ejected, and
The low temperature of low temperature nitrogen makes aerosol quick solidification while deformation, forms the dedicated conductive silver powder of glass base circuit board, used
The temperature of low temperature nitrogen is -85 DEG C~-65 DEG C, and concentration is >=99.99%.
Further improvement to above-mentioned technical proposal is, in step S2, the operating voltage of the atomizer is 30-
60KV, atomization rates are 2~15Kg/h, and atomization frequency is 1~30MHZ, and atomizer atomizing pressure is 0.8~2.4MPa.
More than one low temperature nitrogen nozzle, the jet direction of low temperature nitrogen nozzle and the atomization before solidification are equipped in spray chamber
The moving direction of object is in 90 °~135 ° of angles.
Other conductive metals in the silver alloy are one of gold, copper, indium, gallium, aluminium, tin and lead or a variety of.
As shown from the above technical solution, the present invention uses gas-atomized powder technique, but before aerosol solidification, passes through setting
Injection is burst to nebulant particles progress 3~10HZ of frequency in the low temperature nitrogen nozzle of spray chamber, bursts the gas pressure of injection
Power is 0.2~1MPa, bursts the low temperature nitrogen of injection quick solidification while making aerosol become irregular shape, forms glass
The dedicated conductive silver powder of glass base circuit board, this silver powder utilize its structure special as being exclusively used in preparing the main silver powder of glass base circuit
Very, contact point is random between irregularly shaped particles, and power is unordered to transmitting when stress, in the stone or concrete when paving the way
Stress condition when stone is combined by bonding agent is similar, makes to be tightly combined between silver powder particles.This silver powder is used as and prepares glass
The principal ingredients of glass base conducting channel can make the circuit of preparation leading than circuit prepared by existing spherical or other shapes of silver powder
Electric energy power is remarkably reinforced, and has greatly improved to the weldering knotting strength of circuit board component.
Specific embodiment
Below with reference to two embodiments, the invention will be further described:
The preparation process of embodiment one the following steps are included:
S1, solid fine silver is fused into liquid silver, wherein silver content is 99.9% in the fine silver；
S2, liquid silver is imported to the nitrogen atmosphere spray chamber that nitrogen gas concn is 99.99%, liquid silver of the atomizer to importing
Injection high-pressure atomisation gas is atomized liquid silver, and the nebulant particles after atomization are 1.5 μm, before aerosol solidification, is set to
One low temperature nitrogen nozzle of spray chamber bursts injection, low temperature nitrogen nozzle to what the aerosol of ot-yet-hardened carried out frequency 8HZ
Jet direction and solidification before aerosol moving direction angle in 90 °.The gas pressure for bursting injection is 0.8MPa, atomization
Object becomes irregular shape under the percussion for bursting the low temperature nitrogen ejected, and the low temperature of low temperature nitrogen makes aerosol
Quick solidification while deformation forms the dedicated conductive silver powder of glass base circuit board, and the temperature of low temperature nitrogen used is -80 DEG C,
Concentration is 99.99%.The operating voltage of atomizer is 52KV, and atomization rates 3Kg/h, atomization frequency is 23MHZ, atomization spray
Mouth atomizing pressure is 2.2MPa.
The preparation process of embodiment two the following steps are included:
S1, solid silver alloy is fused into liquid silver, wherein silver content is 91% in the pure silver alloy, remaining is conductive
Metal is one of copper or gold, indium, gallium, aluminium, tin and lead or a variety of, content 9%；
S2, liquid silver is imported to the nitrogen atmosphere spray chamber that nitrogen gas concn is 99.99%, liquid silver of the atomizer to importing
Injection high-pressure atomisation gas is atomized liquid silver, and the nebulant particles after atomization are 4 μm, before aerosol solidification, is set to mist
Change two low temperature nitrogen nozzles of room and bursts injection, two low temperature nitrogens to what the aerosol of ot-yet-hardened carried out frequency 3.5HZ
Nozzle in the same horizontal line, and the jet direction of two low temperature nitrogen nozzles with the moving direction of the aerosol before solidification at
120 ° of angles, the gas pressure for bursting injection is 0.4MPa, and aerosol is under the percussion for bursting the low temperature nitrogen ejected
Become irregular shape, and the low temperature of low temperature nitrogen makes aerosol quick solidification while deformation, forms glass base circuit
The dedicated conductive silver powder of plate, the temperature of low temperature nitrogen used are -68 DEG C, concentration 99.99%.The operating voltage of atomizer is
36KV, atomization rates 12Kg/h, atomization frequency are 5MHZ, and atomizer atomizing pressure is 1.0MPa.
Above-mentioned two embodiment has successfully prepared the dedicated conductive silver powder of glass base circuit board, the shape of dedicated conductive silver powder
Shape is in irregular, since the irregular shape of dedicated conductive silver powder greatly improves combination degree between silver powder particles, particle
Between contact point it is random, power is unordered to transmitting when stress, is tightly combined between silver powder particles, to improve glass base circuit board
Conductive capability.
Claims (4)
1. a kind of preparation process of the dedicated conductive silver powder of glass base circuit board, it is characterised in that the following steps are included:
S1, solid fine silver or silver alloy are fused into liquid silver, wherein silver content >=99.9% in the fine silver；The silver closes
Silver content >=90% in gold, remaining group are divided into conductive metal；
S2, the nitrogen atmosphere spray chamber that liquid silver is imported to nitrogen gas concn >=99.99%, atomizer spray the liquid silver of importing
High-pressure atomisation gas is atomized liquid silver, and the nebulant particles after atomization are 1-5 μm, before aerosol solidification, is set to atomization
The low temperature nitrogen nozzle of room bursts injection to what the aerosol of ot-yet-hardened carried out 3~10HZ of frequency, bursts the gas pressure of injection
Power is 0.2~1MPa, and aerosol becomes irregular shape, and low temperature under the percussion for bursting the low temperature nitrogen ejected
The low temperature of nitrogen makes aerosol quick solidification while deformation, forms the dedicated conductive silver powder of glass base circuit board, low temperature used
The temperature of nitrogen is -85 DEG C~-65 DEG C, and concentration is >=99.99%.
2. the preparation process of the dedicated conductive silver powder of glass base circuit board according to claim 1, it is characterised in that: step S2
In, the operating voltage of the atomizer is 30-60KV, and atomization rates are 2~15Kg/h, and atomization frequency is 1~30MHZ, mist
Change nozzle atomization pressure is 0.8~2.4MPa.
3. the preparation process of the dedicated conductive silver powder of glass base circuit board according to claim 1, it is characterised in that: spray chamber
It is interior to be equipped with more than one low temperature nitrogen nozzle, the moving direction of the jet direction of low temperature nitrogen nozzle and the aerosol before solidification at
90 °~135 ° angles.
4. the preparation process of the dedicated conductive silver powder of glass base circuit board according to claim 1, it is characterised in that: the silver
Other conductive metals in alloy are one of gold, copper, indium, gallium, aluminium, tin and lead or a variety of.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910570960.4A CN110310756B (en) | 2019-06-28 | 2019-06-28 | Preparation process of conductive silver powder special for glass-based circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910570960.4A CN110310756B (en) | 2019-06-28 | 2019-06-28 | Preparation process of conductive silver powder special for glass-based circuit board |
Publications (2)
| Publication Number | Publication Date |
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| CN110310756A true CN110310756A (en) | 2019-10-08 |
| CN110310756B CN110310756B (en) | 2020-06-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910570960.4A Active CN110310756B (en) | 2019-06-28 | 2019-06-28 | Preparation process of conductive silver powder special for glass-based circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113517093A (en) * | 2021-04-22 | 2021-10-19 | 苏州海力金属粉体材料有限公司 | Preparation method of spherical silver powder conductive paste |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1164452A (en) * | 1996-05-07 | 1997-11-12 | 机械工业部桂林电器科学研究所 | Method for preparing hydraulic atomized silver powder |
| CN102218539A (en) * | 2011-05-26 | 2011-10-19 | 江苏科技大学 | Method for preparing ultrafine silver powder |
| CN103703159A (en) * | 2011-07-25 | 2014-04-02 | 埃卡特有限公司 | Method for applying a coating to a substrate, coating, and use of particles |
| CN109689250A (en) * | 2016-08-31 | 2019-04-26 | 同和电子科技有限公司 | The coating alloy powder of silver, conductive paste, electronic component and electric device |
-
2019
- 2019-06-28 CN CN201910570960.4A patent/CN110310756B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1164452A (en) * | 1996-05-07 | 1997-11-12 | 机械工业部桂林电器科学研究所 | Method for preparing hydraulic atomized silver powder |
| CN102218539A (en) * | 2011-05-26 | 2011-10-19 | 江苏科技大学 | Method for preparing ultrafine silver powder |
| CN103703159A (en) * | 2011-07-25 | 2014-04-02 | 埃卡特有限公司 | Method for applying a coating to a substrate, coating, and use of particles |
| CN109689250A (en) * | 2016-08-31 | 2019-04-26 | 同和电子科技有限公司 | The coating alloy powder of silver, conductive paste, electronic component and electric device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113517093A (en) * | 2021-04-22 | 2021-10-19 | 苏州海力金属粉体材料有限公司 | Preparation method of spherical silver powder conductive paste |
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| CN110310756B (en) | 2020-06-26 |
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Effective date of registration: 20200602 Address after: Room 203-5, floor 2, building 2, Jindi chuanggu, No. 147, Gaoxin 5th Road, high tech Zone, Heyuan City, Guangdong Province Applicant after: Smart glass new technology (Heyuan) Co., Ltd Applicant after: Xia Bo Address before: 430014 No. 590, Building 13, Hanzheng Street Metropolitan Industrial Zone, 21 Jiefang Avenue, Qiekou District, Wuhan City, Hubei Province Applicant before: Zhibo Blue New Technology (Wuhan) Co.,Ltd. Applicant before: Xia Bo |
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