CN110298064A - It has both the superstructure of zero warpage of high resonant frequency and thermal mismatching and its determines method - Google Patents
It has both the superstructure of zero warpage of high resonant frequency and thermal mismatching and its determines method Download PDFInfo
- Publication number
- CN110298064A CN110298064A CN201910392828.9A CN201910392828A CN110298064A CN 110298064 A CN110298064 A CN 110298064A CN 201910392828 A CN201910392828 A CN 201910392828A CN 110298064 A CN110298064 A CN 110298064A
- Authority
- CN
- China
- Prior art keywords
- superstructure
- structural slab
- microstructure unit
- micro
- structure plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/10—Geometric CAD
- G06F30/17—Mechanical parametric or variational design
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/20—Design optimisation, verification or simulation
- G06F30/23—Design optimisation, verification or simulation using finite element methods [FEM] or finite difference methods [FDM]
Abstract
The present invention relates to a kind of superstructure for having both zero warpage of high resonant frequency and thermal mismatching and its determine method, superstructure is used for the connection of heterojunction structure, including multistage microstructural；Every level-one micro-structure includes multiple microstructure units；The multistage microstructural ecto-entad is distributed, and shape contour line all has geometric similarity relationship in the face of the envelope and heterojunction structure that there is micro-structures at different levels every grade of micro-structure of self-similarity characteristics to be formed in face.Based on superstructure provided by the invention, the buckling deformation in temperature change is close to zero, and the characteristic with high first order resonance frequency, meets the in-orbit dimensional stability of spacecraft structure and emits the requirement of high rigidity.
Description
Technical field
The present invention relates to connection structures between spacecraft high-precision payload and spacecraft structure more particularly to heterogeneous
In the thermal mismatching deformation release structure of structure, has both the superstructure of zero warpage of high resonant frequency and thermal mismatching and its determine method.
Background technique
The payload such as synthetic aperture radar, optical camera, star sensor are that spacecraft realizes space-based calibration and measurement, sky
Between the main means of the functions such as science and detection influenced in space orbit operation by sun irradiation angle, temperature can be
Variation in a certain range.In order to realize high resolution measurement, imaging and monitoring, heat of the high-performance payload to spacecraft structure
Deformation proposes harsh requirement.Payload and spacecraft structure selection are often different, heterojunction structure are constituted, in temperature change
When, since the thermal deformation of two kinds of materials mismatches, buckling deformation will be generated, influence microwave or optical remote sensing imaging precision, or
Influence antenna-point accuracy.In order to reduce thermal deformation, the prior art is generally designed from two scales of material and structure: in material
Expect that scale realizes thermal deformation near-zero thermal expansion by alloy material or composite technology；It is designed and is realized by structure in structure dimension
Thermal deformation is cancelled out each other or the release of thermal deformation flexibility.However, the technical solution of current material scale, leads to material fragility, height
The disadvantages of density, complicated anisotropy or manufacturing process, and the technical solution of existing structure scale, there are structural natural frequencies
It is too low, rocket launching is unable to satisfy to the requirement of spacecraft structure minimum intrinsic frequency, especially for nearly hundred kilograms of magnitudes or more
The payload of weight, it is also necessary to design additional hold-down mechanism, for improving intrinsic frequency when transmitting, but hold-down mechanism is significantly
Construction weight cost is increased, the introducing of hold-down mechanism also results in system reliability reduction.
Summary of the invention
To overcome the above problem in the prior art at least to a certain extent, the present invention provides one kind and has both high resonance frequency
The superstructure of zero warpage of rate and thermal mismatching and its determining method, are based on superstructure provided by the invention, sticking up in temperature change
Song deformation close to zero, and with high first order resonance frequency characteristic, meet the in-orbit dimensional stability of spacecraft structure and
Emit the requirement of high rigidity.
In a first aspect, the invention proposes a kind of superstructure determination sides for having both zero warpage of high resonant frequency and thermal mismatching
Method, the superstructure is for the connection in heterojunction structure to connection structure, comprising: multistage microstructural；Every level-one micro-structure includes more
A microstructure unit；There is every grade of micro-structure of self-similarity characteristics to exist for the multistage microstructural ecto-entad distribution, micro-structures at different levels
Shape contour line all has geometric similarity relationship in the face of the envelope and heterojunction structure that are formed in face, which determines method
Include the following steps::
Step 1) establishes finite element analysis model, the finite element analysis model be include first structure plate, the second structure
Plate, and the model of superstructure being rigidly connected between the first structure plate and second structural slab；In the model,
Second structural slab and payload are rigidly connected；
Wherein, the material thermal expansion coefficient of first structure plate is α1, the material thermal expansion coefficient of the second structural slab is α2, and
α1≥α2；
First structure plate and the second structural slab inscribed circle diameter in direction in face are denoted as D respectively1And D2, and Dmin=Min
(D1,D2)；
In the superstructure, the initial design values of microstructure unit thickness are as follows:
t1=Min (3Dmin/1000, d), d are preset thickness；
Microstructure unit width and the ratio of height are redefined for w=t1/ 0.075, h=t1/0.015；
The adjacent circumferential spacing d of microstructure unitθ=1.25w；
The initial design values n of microstructure unit radial direction number of levels1=10；
Step 2), displacement constraint situation when being used according to superstructure, apply displacement boundary conditions, carry out modal calculation,
Obtain first natural frequency f1；
Step 3), according to in-orbit temperature case, apply temperature field load, carry out inertia release setting, carry out thermal deformation meter
It calculates, obtains the normal direction buckling deformation v of the second structural slab1；
Step 4), by FEM modal analysis and modal and Calculation of Thermal Deformation result respectively with first natural frequency binding occurrence f0And structure
Warping constraint value v0It is compared, if f1>f0, and v1<v0, then superstructure design parameter satisfies the use demand, the configuration of superstructure
Design scheme is completed；Otherwise, step i, j or k are carried out；
If i. f1≤f0, and v1<v0, then increase microstructure unit thickness, by t2=1.1t1, t3=1.1t2... it changes
Generation, until meeting f1>f0, and v1<v0；Otherwise, step k is carried out；
If j. f1>f0, and v1≥v0, then reduce microstructure unit thickness, by t2=0.9t1, t3=0.9t2... it changes
Generation, until meeting f1>f0, and v1<v0；Otherwise, step k is carried out；
K increases microstructure unit level quantity, by n2=n1+ 1, n3=n2+ 1 ... it is iterated, until f1>1.3f0Or
1.5f0, then reduce microstructure unit thickness, by t2=0.9t1、t3=0.9t2It is iterated, until meeting f1>f0, and v1<
v0。
Preferably, above-mentioned superstructure determines in method, d=0.3mm.
Second aspect determines the determining superstructure of method according to above-mentioned superstructure the present invention also provides a kind of.
Preferably, in above-mentioned superstructure, in the micro-structure, the minimum rigidity direction edge of the multiple microstructure unit
Thermal deformation direction arrangement.
Preferably, in above-mentioned superstructure, the envelope shape that every grade of micro-structure is formed in face is triangle, square
Shape, hexagon, trapezoidal, parallelogram or circle.
The third aspect, the present invention also provides a kind of heterojunction structures, comprising: first structure plate, the second structural slab；Rigidity connects
The superstructure as described above being connected between the first structure plate and second structural slab；Second structural slab also with have
Imitate load rigid connection；The coefficient of expansion of the first structure plate is greater than the coefficient of expansion of second structural slab.
Further, in above-mentioned heterojunction structure, the first structure plate is the first alloy sheets；Second structural slab is the
Two alloy sheets.
Further, in above-mentioned heterojunction structure, first alloy sheets are aluminium alloy；Second alloy sheets are invar conjunction
Gold.
The advantages of the present invention over the prior art are that: it is designed by the superstructure with multi-layer microstructure unit,
It realizes vibration high rigidity and thermal mismatching deforms nearly zero warpage, first natural frequency and thermal deformation amount of warpage can satisfy mostly
The use needs that the spacecrafts payload such as number satellite are connect with structure, in terms of being embodied in following three:
1) by, in the adjusting of 1 magnitude, realizing structure curl deformation in the tune of 3 magnitudes to microstructure unit thickness
Control, i.e., when microstructure unit thickness 1.1mm~0.1mm range adjust when, it can be achieved that normal direction buckling deformation from 134.4 μm to
The regulation of 0.1 μ m；
2) present invention realizes regulation of the first natural frequency from 100Hz to 26Hz, can satisfy common payload pair
The requirement of thermal mismatching buckling deformation and carrier rocket transmitting segment structure first natural frequency；
3) present invention realizes thermal mismatch stress and is below 50MPa, much smaller than the yield strength 160MPa of aluminum alloy materials,
There is no thermal mismatching Strength Failure risks.
Superstructure in the present invention can melt forming technology by the selective laser of metal powder and prepare, because having
The geometrical property of inner open can guarantee that unshaped powder is easy to remove in post-processing stages, have increasing material manufacturing integration
Forming and convenient for post-processing process advantage.The superstructure design method, which can satisfy space based radar, camera and antenna etc., to be had
It imitates connection structure design between load and spacecraft structure to need, have a good application prospect.
It should be understood that above general description and following detailed description be only it is exemplary and explanatory, not
It can the limitation present invention.
Detailed description of the invention
The drawings herein are incorporated into the specification and forms part of this specification, and shows and meets implementation of the invention
Example, and be used to explain the principle of the present invention together with specification.
Fig. 1 is that the present invention has both in the superstructure embodiment of zero warpage of high resonant frequency and thermal mismatching, and microstructure unit shows
It is intended to；
Fig. 2 is that the present invention has both in the superstructure embodiment of zero warpage of high resonant frequency and thermal mismatching, and microstructure unit is more
Level self similarity schematic layout pattern；
Fig. 3 is heterojunction structure of the present invention and its connection relationship diagram；
Relationship of the Fig. 4 between thermal mismatching buckling deformation of the present invention and microstructure unit thickness；
Relationship of the Fig. 5 between first natural frequency of the present invention and microstructure unit thickness；
Relationship of the Fig. 6 between thermal mismatch stress of the present invention and microstructure unit thickness；
Fig. 7 is the step of superstructure of the invention for having both zero warpage of high resonant frequency and thermal mismatching determines embodiment of the method stream
Cheng Tu.
Specific embodiment
It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not intended to limit the present invention.
It should be mentioned that some exemplary embodiments are by institute here before exemplary embodiment is discussed in greater detail
Disclosed specific structure and function details are only representative, and are the mesh of exemplary embodiment for describing the present invention
's.But the present invention can be implemented by many alternative forms, and be not interpreted as being limited only by here
The embodiment illustrated.
Although it should be understood that may have been used term " first ", " second " etc. herein to describe each unit,
But these units should not be limited by these terms.The use of these items is only for by a unit and another unit
It distinguishes.For example, without departing substantially from the range of exemplary embodiment, it is single that first unit can be referred to as second
Member, and similarly second unit can be referred to as first unit.Term "and/or" used herein above include one of them or
Any and all combinations of more listed associated items.
Term used herein above is not intended to limit exemplary embodiment just for the sake of description specific embodiment.Unless
Context clearly refers else, otherwise singular used herein above "one", " one " also attempt to include plural number.Also answer
When understanding, term " includes " and/or "comprising" used herein above provide stated feature, integer, step, operation,
The presence of unit and/or component, and do not preclude the presence or addition of other one or more features, integer, step, operation, unit,
Component and/or combination thereof.
The solution of the embodiment of the present invention is: having the microstructure unit of rigidity anisotropic by designing, and will
The minimum rigidity direction of microstructure unit is arranged along thermal deformation direction, so that any local thermal deformation directional stiffness is low, but
Rigidity is high on two orthogonal directions perpendicular to thermal deformation, has the multi-layer micro-structure cloth of self-similarity characteristics by designing
Structure overall stiffness improves in office, so that structure has thermal deformation release function and high resonant frequency performance simultaneously.
Below with reference to Fig. 1 to Fig. 7, the superstructure for having both zero warpage of high resonant frequency and thermal mismatching to the present invention determines method
Embodiment is illustrated.
Before illustrating the determination step of superstructure, superstructure is illustrated first.Superstructure in the embodiment is used
In the connection of heterojunction structure, comprising: multiple microstructure units；The distribution of the microstructure unit has multistage self-similarity characteristics,
Ecto-entad is divided into multistage, and shape contour line all has in the face of envelope and heterojunction structure that every grade of micro-structure is formed in face
Geometric similarity relationship.Microstructure unit is chip shape, as shown in Figure 1, the width of microstructure unit 1, height and thickness difference
For w, h and t, wherein t/w≤0.075, and t/h≤0.015.Also, the distribution of microstructure unit has multistage in superstructure
Self-similarity characteristics, as shown in Fig. 2, being illustrated with top view, short-term represents microstructure unit, and ecto-entad is divided into multistage, and every grade micro-
Shape contour line all has geometric similarity relationship, point of multistage microstructural unit in the face of envelope and structure of the structure in face
Cloth parameter includes the circumferential spacing d of microstructure unitθWith number of levels n, wherein dθ>=w, n >=10.Figure it is seen that every grade micro-
The envelope shape that structure is formed in face is triangle 2, rectangle 3, hexagon 4, trapezoidal 5, parallelogram 6 or circle 7 etc.
Other geometries.
Referring to Fig. 3, Fig. 3 is heterojunction structure and its connection relationship diagram, and heterojunction structure includes: first structure plate, second
Structural slab；The superstructure as described above being rigidly connected between the first structure plate and second structural slab；Described
Two structural slabs are also rigidly connected with payload 8；The coefficient of expansion of the first structure plate is greater than the swollen of second structural slab
Swollen coefficient.
In heterojunction structure, the first structure plate and the second structural slab are all alloy sheets, for example, the first alloy sheets are aluminium
Alloy, the second alloy sheets are invar alloy.
Referring to Fig. 7, Fig. 7, which is shown, to be had both the superstructure of zero warpage of high resonant frequency and thermal mismatching and determines embodiment of the method,
This method is based on above-mentioned heterojunction structure.The following steps are included:
A, the material thermal expansion coefficient of first structure plate (structural slab A) and the second structural slab (structural slab B) is denoted as respectively
α1And α2, wherein α1≥α2；
B, the inscribed circle in the structural slab being made of high thermal expansion coefficient material and low coefficient of thermal expansion materials direction in face
Diameter is denoted as D respectively1And D2, its smaller value is denoted as Dmin=Min (D1,D2), as the characteristic size to connection structure 8.
C, the initial design values of microstructure unit thickness are t1=Min (3Dmin/1000,0.3mm), microstructure unit is wide
The design value of degree and height is w=t1/ 0.075, h=t1/0.015；
D, microstructure unit circumferential direction parameter design value dθThe initial design values n of=1.25w and radial number of levels1=10；
E, finite element model is established, including is surpassed to connection structure, payload and " high zero warpage of resonant frequency-thermal mismatching "
Structure, in order to improve computational efficiency, payload is simulated by zero dimension mass unit, microstructure unit using shell unit into
Row simulation is simulated to connection structure using shell unit or body unit；
F, displacement constraint situation when being used according to structure applies displacement boundary conditions, carries out modal calculation, obtains single order
Intrinsic frequency f1；
G, according to in-orbit temperature case, apply temperature field load, carry out inertia release setting, carry out Calculation of Thermal Deformation, obtain
Obtain the normal direction buckling deformation v of the second structural slab1；
H, by FEM modal analysis and modal and Calculation of Thermal Deformation result respectively with first natural frequency binding occurrence f0And structure curl
Binding occurrence v0It is compared, if f1>f0, and v1<v0, then superstructure design parameter satisfies the use demand, the configuration design of superstructure
Scheme is completed；Otherwise, step i, j or k are carried out；
If i, f1≤f0, and v1<v0, then increase microstructure unit thickness, by t2=1.1t1, t3=1.1t2... it changes
Generation, until meeting f1>f0, and v1<v0；Otherwise, step k is carried out；
If j, f1>f0, and v1≥v0, then reduce microstructure unit thickness, by t2=0.9t1, t3=0.9t2... it changes
Generation, until meeting f1>f0, and v1<v0；Otherwise, step k is carried out；
K, otherwise, increase microstructure unit level quantity, by n2=n1+ 1, n3=n2+ 1 ... it is iterated, until f1>
1.3f0Or 1.5f0, then reduce microstructure unit thickness, by t2=0.9t1、t3=0.9t2It is iterated, until meeting f1>f0,
And v1<v0。
It is above-mentioned in one more specifically embodiment, the first structure plate and the second structural slab of two kinds of unlike materials are
Circular slab, diameter are 1m, and thickness is 10mm, and first structure plate is aluminium alloy, and the second structural slab is invar alloy, and second
Structural slab and payload are rigidly connected, and the quality of payload is 200kg, the second structural slab of height of center of mass distance upper surface
0.5m.The present invention have both the superstructure of zero warpage of high resonant frequency and thermal mismatching between first structure plate and the second structural slab it
Between, it is rigid connection, the distribution such as -7 in Fig. 2 in microstructure unit direction in face with first structure plate and the second structural slab
Shown, short-term represents microstructure unit, and ecto-entad is divided into multistage, in the face of envelope and structure of the every grade of micro-structure in face
Appearance profile line is geometric similarity relationship, the circumferential spacing d of microstructure unitθ=5mm, radial number of levels n=10.Micro-structure
Unit is flake, as shown in Figure 1, its width, height and thickness are respectively w=4mm, h=20mm and t=0.1mm.Micro- knot
The material of structure unit 1 is aluminium alloy.
When the structure local environment temperature increases 10 DEG C, due to the thermalexpansioncoefficientα of aluminum alloy materials1=2.47 × 10-5/ DEG C, it is far longer than the thermalexpansioncoefficientα of invar alloy2=1.0 × 10-6/ DEG C, the heat distortion amount that first structure plate generates is long-range
In the heat distortion amount that the second structural slab generates, the two is intended to generate thermal mismatching buckling deformation；But due to being arbitrarily displaced micro-structure
The minimum rigidity direction and thermal deformation direction of unit are consistent, therefore the thermal deformation of first structure plate will be by micro- knot in superstructure
The bending deformation of structure unit is discharged, and is formd the thermal deformation relaxation effect from first structure plate to the second structural slab, is caused
The thermal deformation of first structure plate is hardly transferred to the second structural slab, to reach the effect of zero buckling deformation of heterojunction structure
Fruit.On the other hand, due to microstructure unit, rigidity is high on two orthogonal directions perpendicular to thermal deformation, and structure is integrally total
Vibration frequency is high.
To sum up: the present embodiment is designed by superstructure with multi-layer microstructure unit, realize vibration high rigidity and
Thermal mismatching deforms nearly zero warpage, and it is effective that first natural frequency and thermal deformation amount of warpage can satisfy the spacecrafts such as most of satellites
The use needs that load is connect with structure, and this method is by the adjusting of 1 magnitude, realizing microstructure unit thickness
Structure curl deform 3 magnitudes regulation, i.e., when microstructure unit thickness 1.1mm~0.1mm range adjust when, it can be achieved that
The regulation of normal direction buckling deformation μ m from 134.4 μm to 0.1, as shown in figure 4, and first natural frequency from 100Hz to
The regulation of 26Hz emits segment structure to thermal mismatching buckling deformation and carrier rocket as shown in figure 5, can satisfy common payload
The requirement of first natural frequency, and thermal mismatch stress is below 50MPa, as shown in fig. 6, strong much smaller than the surrender of aluminum alloy materials
160MPa is spent, thermal mismatching Strength Failure risk is not present.Determining superstructure through this embodiment, can swashing by metal powder
Prepared by light selective melting forming technology, because the geometrical property with inner open, can guarantee unshaped powder rear
Processing stage is easy to remove, and has increasing material manufacturing integral forming and the process advantage convenient for post-processing.The superstructure design side
Method can satisfy space based radar, camera and antenna etc. between payload and spacecraft structure connection structure design needs, have
There is good application prospect.
In one more specifically embodiment, in heterojunction structure shown in Fig. 3, the first structure plate and of two kinds of materials
Two structural slabs are circular slab, a diameter of D1=D2=1m, thickness are 10mm, and first structure plate is aluminium alloy, the second structure
Plate is invar alloy, and the second structural slab and payload are rigidly connected, and the quality of payload is 200kg, height of center of mass distance
Second structural slab upper surface 0.5m." high zero warpage of resonant frequency-thermal mismatching " superstructure is between first structure plate and the second structure
It is rigid connection with first structure plate and the second structural slab between plate.
The thermal expansion coefficient of the aluminium alloy and invar alloy material that constitute first structure plate and the second structural slab is respectively α1
=2.47 × 10-5/ DEG C and α2=1.0 × 10-6/℃；
The characteristic size of heterojunction structure is Dmin=Min (D1,D2)=1m；
The initial design values of microstructure unit thickness are t1=Min (3Dmin/ 1000,0.3mm)=0.3mm, micro-structure list
The design value of first width and height is w=t1/ 0.075=4mm, h=t1/ 0.015=20mm；
Microstructure unit circumferential direction parameter design value dθ=1.25w=5mm, the initial design values n of radial number of levels1=10；
Using Patran software, the finite element model of whole system is established, wherein first structure plate and the second structural slab are used
Shell unit is simulated, and payload is simulated using zero dimension mass unit, " high zero warpage of resonant frequency-thermal mismatching " superjunction
Microstructure unit in structure is simulated using shell unit；Assign first structure plate aluminum alloy material properties, including thermal expansion system
Number α1=2.47 × 10-5/ DEG C, elastic modulus E1=70GPa and Poisson's ratio p2=0.30；Assign the second structural slab invar alloy material
Expect attribute, including thermalexpansioncoefficientα2=1.0 × 10-6/ DEG C, elastic modulus E2=110GPa and Poisson's ratio p2=0.29；Material
Initial temperature is set as 20 DEG C.
Using Patran software, built-in boundary item is applied to the node in finite element model in first structure edges of boards edge 3mm
Part carries out modal calculation using Nastran software, obtains the first natural frequency f of system1=46Hz；
Using Patran software, apply 30 DEG C of uniform temperature field load, inertia release setting is carried out, using Nastran
Software carries out Calculation of Thermal Deformation, obtains the normal direction buckling deformation v of payload structural slab1=3 μm；
By the first natural frequency obtained by FEM calculation and thermal deformation amount of warpage respectively with first natural frequency about
Beam value f0With thermal deformation amount of warpage binding occurrence v0It is compared, finds f1=46Hz > f0=20Hz, but v1=3 μm > v0=1 μm, heat
Deformation amount of warpage is unsatisfactory for use demand, carries out step j；
Reduce microstructure unit thickness, by t2=0.9t1, t3=0.9t2It is iterated, t is worked as in discovery4When=0.2mm, meet
f1=38Hz > f0=20Hz, and v1=0.9 μm < v0=1 μm.
So far, the relevant parameter determination of the superstructure of the present embodiment finishes.It is melted and is shaped using invar alloy selective laser
Technology carries out increasing material manufacturing to the second structural slab, then using aluminium alloy selective laser fusing forming technique to first structure plate and
Superstructure carries out increasing material manufacturing, forms " the second structural slab-superstructure-first structure plate " integral structure.Due in the present invention
Superstructure have inner open geometrical property, can guarantee that unshaped powder is easy to remove in post-processing stages, have it is good
Good technique realizability.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are not
Centainly refer to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be any
One or more embodiment or examples in can be combined in any suitable manner.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, modifies, replacement and variant.
Claims (8)
1. a kind of superstructure for having both zero warpage of high resonant frequency and thermal mismatching determines method, which is characterized in that
The superstructure is for the connection in heterojunction structure to connection structure, comprising: multistage microstructural；Every level-one micro-structure includes more
A microstructure unit；There is every grade of micro-structure of self-similarity characteristics to exist for the multistage microstructural ecto-entad distribution, micro-structures at different levels
Shape contour line all has geometric similarity relationship in the face of the envelope and heterojunction structure that are formed in face, which determines method
Include the following steps:
Step 1) establishes finite element analysis model, the finite element analysis model be include first structure plate, the second structural slab,
And it is rigidly connected in the model of the superstructure between the first structure plate and second structural slab；In the model, institute
It states the second structural slab and payload is rigidly connected；
Wherein, the material thermal expansion coefficient of first structure plate is α1, the material thermal expansion coefficient of the second structural slab is α2, and α1≥
α2；
First structure plate and the second structural slab inscribed circle diameter in direction in face are denoted as D respectively1And D2, and Dmin=Min (D1,
D2)；
In the superstructure, the initial design values of microstructure unit thickness are as follows:
t1=Min (3Dmin/ 1000, d), d is preset thickness；
Microstructure unit width and height are redefined for w=t1/ 0.075, h=t1/0.015；
The adjacent circumferential spacing d of microstructure unitθ=1.25w；
The initial design values n of microstructure unit radial direction number of levels1=10；
Step 2), displacement constraint situation when being used according to superstructure, apply displacement boundary conditions, carry out modal calculation, obtain
First natural frequency f1；
Step 3), according to in-orbit temperature case, apply temperature field load, carry out inertia release setting, carry out Calculation of Thermal Deformation, obtain
Obtain the normal direction buckling deformation v of the second structural slab1；
Step 4), by FEM modal analysis and modal and Calculation of Thermal Deformation result respectively with first natural frequency binding occurrence f0And structure curl
Binding occurrence v0It is compared, if f1>f0, and v1<v0, then superstructure design parameter satisfies the use demand, the configuration design of superstructure
Scheme is completed；Otherwise, step i, j or k are carried out；
If i. f1≤f0, and v1<v0, then increase microstructure unit thickness, by t2=1.1t1, t3=1.1t2... it is iterated, directly
To meeting f1>f0, and v1<v0；Otherwise, step k is carried out；
If j. f1>f0, and v1≥v0, then reduce microstructure unit thickness, by t2=0.9t1, t3=0.9t2... it is iterated, directly
To meeting f1>f0, and v1<v0；Otherwise, step k is carried out；
K increases microstructure unit level quantity, by n2=n1+ 1, n3=n2+ 1 ... it is iterated, until f1>1.3f0Or
1.5f0, then reduce microstructure unit thickness, by t2=0.9t1、t3=0.9t2It is iterated, until meeting f1>f0, and v1<
v0。
2. superstructure determines method according to claim 1, which is characterized in that
D=0.3mm.
3. a kind of superstructure according to claim 1 determines the superstructure that method determines.
4. superstructure according to claim 3, which is characterized in that
In the micro-structure, the minimum rigidity direction of the multiple microstructure unit is arranged along thermal deformation direction.
5. superstructure according to claim 4, which is characterized in that
The envelope shape that every grade of micro-structure is formed in face is triangle, rectangle, hexagon, trapezoidal, parallelogram
Or it is round.
6. a kind of heterojunction structure characterized by comprising
First structure plate；
Second structural slab；
The superstructure as claimed in claim 3 being rigidly connected between the first structure plate and second structural slab；
Second structural slab is also rigidly connected with payload；
The coefficient of expansion of the first structure plate is greater than the coefficient of expansion of second structural slab.
7. heterojunction structure according to claim 6, which is characterized in that
The first structure plate is the first alloy sheets；
Second structural slab is the second alloy sheets.
8. heterojunction structure according to claim 7, which is characterized in that
First alloy sheets are aluminium alloy；
Second alloy sheets are invar alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910392828.9A CN110298064B (en) | 2019-05-13 | 2019-05-13 | Superstructure with high resonance frequency and thermal mismatch zero warpage and determination method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910392828.9A CN110298064B (en) | 2019-05-13 | 2019-05-13 | Superstructure with high resonance frequency and thermal mismatch zero warpage and determination method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110298064A true CN110298064A (en) | 2019-10-01 |
| CN110298064B CN110298064B (en) | 2022-12-06 |
Family
ID=68026900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910392828.9A Active CN110298064B (en) | 2019-05-13 | 2019-05-13 | Superstructure with high resonance frequency and thermal mismatch zero warpage and determination method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110298064B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113886943A (en) * | 2021-09-06 | 2022-01-04 | 蓝箭航天空间科技股份有限公司 | Carrier rocket takeoff interference detection method and detection device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008109618A2 (en) * | 2007-03-07 | 2008-09-12 | Applied Extrusion Technologies, Inc. | System and method for making seamless holograms, optically variable devices and embossing substrates |
| CN102799729A (en) * | 2012-07-13 | 2012-11-28 | 北京航空航天大学 | Effective method for quickly eliminating residual stress of heterogeneous component |
| CN105183990A (en) * | 2015-09-07 | 2015-12-23 | 哈尔滨工业大学 | Composite material and method for multiscale response analysis of structure thereof |
| CN106599420A (en) * | 2016-12-02 | 2017-04-26 | 北京空间飞行器总体设计部 | Zero-expansion dot matrix cylindrical shell structure used for spacecraft and design method thereof |
| CN107451307A (en) * | 2016-05-31 | 2017-12-08 | 西北工业大学 | A kind of method of Multi-Scale Calculation complex composite material structure effective stiffness matrix |
| CN107742014A (en) * | 2017-09-29 | 2018-02-27 | 北京空间飞行器总体设计部 | The design method of phase-change energy storage device dot matrix sandwich based on increasing material manufacturing |
-
2019
- 2019-05-13 CN CN201910392828.9A patent/CN110298064B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008109618A2 (en) * | 2007-03-07 | 2008-09-12 | Applied Extrusion Technologies, Inc. | System and method for making seamless holograms, optically variable devices and embossing substrates |
| CN102799729A (en) * | 2012-07-13 | 2012-11-28 | 北京航空航天大学 | Effective method for quickly eliminating residual stress of heterogeneous component |
| CN105183990A (en) * | 2015-09-07 | 2015-12-23 | 哈尔滨工业大学 | Composite material and method for multiscale response analysis of structure thereof |
| CN107451307A (en) * | 2016-05-31 | 2017-12-08 | 西北工业大学 | A kind of method of Multi-Scale Calculation complex composite material structure effective stiffness matrix |
| CN106599420A (en) * | 2016-12-02 | 2017-04-26 | 北京空间飞行器总体设计部 | Zero-expansion dot matrix cylindrical shell structure used for spacecraft and design method thereof |
| CN107742014A (en) * | 2017-09-29 | 2018-02-27 | 北京空间飞行器总体设计部 | The design method of phase-change energy storage device dot matrix sandwich based on increasing material manufacturing |
Non-Patent Citations (4)
| Title |
|---|
| 刘国青等: "航天器在轨全周期热变形分析方法", 《航天器工程》 * |
| 张静等: "卫星结构悬浮式设计方案的热变形抑制作用分析", 《中国空间科学技术》 * |
| 田宏杰等: "变形温度对Ti2AlNb/Ti60双合金焊接接头组织性能的影响", 《热加工工艺》 * |
| 苏若斌等: "卫星复合材料桁架结构多级优化设计方法", 《航天器工程》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113886943A (en) * | 2021-09-06 | 2022-01-04 | 蓝箭航天空间科技股份有限公司 | Carrier rocket takeoff interference detection method and detection device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110298064B (en) | 2022-12-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101267062B (en) | Method for predicting antenna electric performance based on simulated distortion reflective side | |
| CN101344564B (en) | Active phase array antenna electrical property prediction method based on mechanical, electric and thermal three-field coupling | |
| CN105718697B (en) | The large-scale mobile fitting method of adjustment of deformation parabola antenna panel is directed toward towards antenna | |
| CN108594396A (en) | A kind of quasi- zero thermal expansion space optical remote sensor support construction and method | |
| US9709713B1 (en) | High quality telescope mirrors made from polymer matrix composite materials and method | |
| CN106991210B (en) | A kind of Shaped-beam reflector antenna electrical behavior prediction method based on electromechanical Coupling Model | |
| JP2016540196A (en) | Ranging camera using common substrate | |
| CN106772221B (en) | Conformal array amplitude and phase error correction method based on wing deformation fitting | |
| CN102768377A (en) | Unfoldable reflecting mirror body based on double-curvature negative poisson ratio honeycomb structure | |
| CN104715111A (en) | Auxiliary face compensation method for large beam-forming double-reflection-face antenna based on electromechanical coupling | |
| JP2011135223A (en) | Radome for flying object | |
| CN110298064A (en) | It has both the superstructure of zero warpage of high resonant frequency and thermal mismatching and its determines method | |
| WO2013158805A1 (en) | Thin film bi-material lattice structures and methods of making the same | |
| You et al. | Impact behavior of composite antenna array that is conformed around cylindrical bodies | |
| CN105576385B (en) | Towards gain method of adjustment is rotated with being directed toward large-scale deformation parabola antenna panel and coincideing | |
| Wu et al. | Ultra conformal patch antenna array on a doubly curved surface | |
| Zhang et al. | The buckling behavior of radome with different braided angles based on CFRP | |
| CN107622148A (en) | Characteristics of conformal array antenna structure best elasticity mould method for determination of amount based on mechanical-electric coupling | |
| Alaluf et al. | Damping of piezoelectric space instruments: application to an active optics deformable mirror | |
| Spiga et al. | Active shape correction of a thin glass/plastic x-ray mirror | |
| Toropova | Anisotropic multimaterial lattices as thermal adapters | |
| Ash et al. | Shape achievement of optical membrane mirrorsusing coating/substrate intrinsic stresses | |
| You et al. | Impact behavior and radiation performance of a structurally integrated antenna array conformed around cylindrical bodies | |
| Guo et al. | Stress analysis at the interface between Ni–P coating and SiCp/Al substrate of space mirror | |
| Pfeiffer et al. | Highly stable antenna structure technologies |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |