CN110297392A - Photosensitive polymer combination - Google Patents
Photosensitive polymer combination Download PDFInfo
- Publication number
- CN110297392A CN110297392A CN201910222480.9A CN201910222480A CN110297392A CN 110297392 A CN110297392 A CN 110297392A CN 201910222480 A CN201910222480 A CN 201910222480A CN 110297392 A CN110297392 A CN 110297392A
- Authority
- CN
- China
- Prior art keywords
- photosensitive polymer
- polymer combination
- acid
- epoxy resin
- methyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920000642 polymer Polymers 0.000 title claims abstract description 57
- -1 carbamide compound Chemical class 0.000 claims abstract description 59
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 43
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 40
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000004202 carbamide Substances 0.000 claims abstract description 27
- 235000013877 carbamide Nutrition 0.000 claims abstract description 27
- 150000002118 epoxides Chemical class 0.000 claims abstract description 21
- 150000001875 compounds Chemical class 0.000 claims description 16
- 239000003085 diluting agent Substances 0.000 claims description 14
- 229910052799 carbon Inorganic materials 0.000 claims description 10
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 9
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 claims description 7
- 229920006395 saturated elastomer Polymers 0.000 claims description 7
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 6
- FLFWJIBUZQARMD-UHFFFAOYSA-N 2-mercapto-1,3-benzoxazole Chemical class C1=CC=C2OC(S)=NC2=C1 FLFWJIBUZQARMD-UHFFFAOYSA-N 0.000 claims description 5
- 229930195733 hydrocarbon Natural products 0.000 claims description 5
- 150000002430 hydrocarbons Chemical class 0.000 claims description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims 3
- ZCQWOFVYLHDMMC-UHFFFAOYSA-N Oxazole Chemical compound C1=COC=N1 ZCQWOFVYLHDMMC-UHFFFAOYSA-N 0.000 claims 1
- 125000001931 aliphatic group Chemical group 0.000 claims 1
- 239000003999 initiator Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 18
- 239000003822 epoxy resin Substances 0.000 description 54
- 229920000647 polyepoxide Polymers 0.000 description 54
- 239000010408 film Substances 0.000 description 43
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 34
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 25
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 20
- 239000002585 base Substances 0.000 description 20
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 16
- 235000010290 biphenyl Nutrition 0.000 description 16
- 239000004305 biphenyl Substances 0.000 description 16
- 229910000679 solder Inorganic materials 0.000 description 15
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 14
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 14
- 150000002148 esters Chemical class 0.000 description 14
- 239000002253 acid Substances 0.000 description 13
- 239000000758 substrate Substances 0.000 description 11
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 239000004593 Epoxy Substances 0.000 description 9
- 239000003086 colorant Substances 0.000 description 9
- 238000011156 evaluation Methods 0.000 description 9
- 239000004615 ingredient Substances 0.000 description 9
- 239000000047 product Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 229930185605 Bisphenol Natural products 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 150000001721 carbon Chemical group 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 239000003063 flame retardant Substances 0.000 description 7
- 229920003986 novolac Polymers 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 125000003700 epoxy group Chemical group 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000011161 development Methods 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-N phosphoric acid Substances OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 5
- 235000011007 phosphoric acid Nutrition 0.000 description 5
- 238000004321 preservation Methods 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- 150000008065 acid anhydrides Chemical class 0.000 description 4
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 238000001723 curing Methods 0.000 description 4
- 150000002576 ketones Chemical class 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- 239000000049 pigment Substances 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- XCBBNTFYSLADTO-UHFFFAOYSA-N Methyl-pentyl-glyoxal Natural products CCCCCC(=O)C(C)=O XCBBNTFYSLADTO-UHFFFAOYSA-N 0.000 description 3
- 229910019142 PO4 Inorganic materials 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 238000007259 addition reaction Methods 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 3
- SEGLCEQVOFDUPX-UHFFFAOYSA-N di-(2-ethylhexyl)phosphoric acid Chemical class CCCCC(CC)COP(O)(=O)OCC(CC)CCCC SEGLCEQVOFDUPX-UHFFFAOYSA-N 0.000 description 3
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N o-dimethylbenzene Natural products CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 239000010452 phosphate Substances 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- DPZSNGJNFHWQDC-ARJAWSKDSA-N (z)-2,3-diaminobut-2-enedinitrile Chemical compound N#CC(/N)=C(/N)C#N DPZSNGJNFHWQDC-ARJAWSKDSA-N 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Natural products CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000013039 cover film Substances 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- IXCSERBJSXMMFS-UHFFFAOYSA-N hcl hcl Chemical compound Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 2
- 125000005842 heteroatom Chemical group 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000000879 optical micrograph Methods 0.000 description 2
- 239000001061 orange colorant Substances 0.000 description 2
- MPQXHAGKBWFSNV-UHFFFAOYSA-N oxidophosphanium Chemical class [PH3]=O MPQXHAGKBWFSNV-UHFFFAOYSA-N 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- 239000003208 petroleum Substances 0.000 description 2
- YNPNZTXNASCQKK-UHFFFAOYSA-N phenanthrene Chemical compound C1=CC=C2C3=CC=CC=C3C=CC2=C1 YNPNZTXNASCQKK-UHFFFAOYSA-N 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- RLUFBDIRFJGKLY-UHFFFAOYSA-N (2,3-dichlorophenyl)-phenylmethanone Chemical compound ClC1=CC=CC(C(=O)C=2C=CC=CC=2)=C1Cl RLUFBDIRFJGKLY-UHFFFAOYSA-N 0.000 description 1
- VJMJYBVERHZATL-UHFFFAOYSA-N (2,4,6-trimethylbenzoyl)phosphonoyl-(2,4,6-trimethylphenyl)methanone Chemical class CC1=CC(C)=CC(C)=C1C(=O)P(=O)C(=O)C1=C(C)C=C(C)C=C1C VJMJYBVERHZATL-UHFFFAOYSA-N 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- XKSUVRWJZCEYQQ-UHFFFAOYSA-N 1,1-dimethoxyethylbenzene Chemical compound COC(C)(OC)C1=CC=CC=C1 XKSUVRWJZCEYQQ-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- GIMQKKFOOYOQGB-UHFFFAOYSA-N 2,2-diethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)(OCC)C(=O)C1=CC=CC=C1 GIMQKKFOOYOQGB-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- YRTNMMLRBJMGJJ-UHFFFAOYSA-N 2,2-dimethylpropane-1,3-diol;hexanedioic acid Chemical compound OCC(C)(C)CO.OC(=O)CCCCC(O)=O YRTNMMLRBJMGJJ-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- LCHAFMWSFCONOO-UHFFFAOYSA-N 2,4-dimethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC(C)=C3SC2=C1 LCHAFMWSFCONOO-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- YEVQZPWSVWZAOB-UHFFFAOYSA-N 2-(bromomethyl)-1-iodo-4-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=CC=C(I)C(CBr)=C1 YEVQZPWSVWZAOB-UHFFFAOYSA-N 0.000 description 1
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- 125000003944 tolyl group Chemical group 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- FIQMHBFVRAXMOP-UHFFFAOYSA-N triphenylphosphane oxide Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)(=O)C1=CC=CC=C1 FIQMHBFVRAXMOP-UHFFFAOYSA-N 0.000 description 1
- QVTVDJWJGGEOGX-UHFFFAOYSA-N urea;cyanide Chemical compound N#[C-].NC(N)=O QVTVDJWJGGEOGX-UHFFFAOYSA-N 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000001060 yellow colorant Substances 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
Abstract
The purpose of the present invention is to provide a kind of photosensitive polymer combinations, with chemical resistance, and even if being configured to one-pack-type, can also prevent the photoresist containing carboxyl during saving from being reacted with epoxide, to have excellent working life.The photosensitive polymer combination is characterized in that, is contained: the photoresist of (A) containing carboxyl, (B) Photoepolymerizationinitiater initiater, (C) epoxide and (D) fatty family carbamide compound.
Description
Technical field
The present invention relates to be suitable for the photosensitive polymer combination of for example insulation-coated material of lining material, have photonasty
Resin combination is coated on the dry film of film made of film and is coated with solidification made of making photosensitive polymer combination solidification
The printing distributing board of object.
Background technique
The conductor circuit pattern that conductor (such as copper foil) is formed on substrate, by welding electro part carrying in the electricity
The pad of road pattern, and using as the coating circuit part in addition to the pad of insulating film, that is, solder mask of protective film.Make
For above-mentioned insulating film, the photosensitive polymer combination comprising the photoresist containing carboxyl and Photoepolymerizationinitiater initiater is used
Cured film.
As the photosensitive polymer combination comprising the photoresist containing carboxyl and Photoepolymerizationinitiater initiater, one is proposed
Kind photo-curable-hot curing resin composition, which is characterized in that contain: (A) has carboxyl and olefinic unsaturated in the molecule
The polyurethane resin of double bond, (B) Photoepolymerizationinitiater initiater and the blocked isocyanate (patent document of (C) as Thermocurable ingredient
1).In addition, describing excellent storage stability, and energy in photo-curable-hot curing resin composition of patent document 1
Enough it is configured to one-pack-type.
On the other hand, also contain epoxy in the photosensitive polymer combination comprising the photoresist containing carboxyl sometimes
Compound.If the photoresist containing carboxyl coexists with epoxide, in the preservation of photosensitive polymer combination
Cheng Zhong, the photoresist containing carboxyl are reacted with epoxide.Therefore, for photo-curable-heat of patent document 1
For hardening resin composition, if being configured to one-pack-type, working life (pot life), there are problems, in storage stability
Aspect has room for improvement.In addition, the photonasty containing carboxyl will be included if dual liquid type is made in photosensitive polymer combination
The ingredient of resin and ingredient containing epoxide are taken care of respectively, then manage many and diverse, and the painting of photosensitive polymer combination
Cloth operation also becomes complicated.
In addition, in patent document 1, patience in the fundamental characteristics as solder mask, to inorganic acid, alcohols etc., i.e.
There is room for improvement in terms of chemical resistance.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2009-185182 bulletin
Summary of the invention
Subject to be solved by the invention
In view of above-mentioned actual conditions, the purpose of the present invention is to provide photosensitive polymer combination, with chemical resistance,
And even if forming for one-pack-type, the photoresist and epoxide being also prevented from during preservation containing carboxyl carry out anti-
It answers, there is excellent working life.
Means for solving the problems
Embodiments of the present invention are a kind of photosensitive polymer combination, which is characterized in that contain: (A) is containing carboxyl
Photoresist, (B) Photoepolymerizationinitiater initiater, (C) epoxide and (D) fatty family carbamide compound.
Embodiments of the present invention are a kind of photosensitive polymer combination, which is characterized in that above-mentioned (D) fatty family urea
Conjunction object is the compound that the following general formula (1) indicates.
(in formula, R1、R2、R3、R4、R5、R6、R7Each independently represent carbon atom number 1~20 saturated aliphatic hydrocarbons or
The unsaturated fatty hydrocarbons base of carbon atom number 2~20 at least one ethylenic bond unsaturated group.)
Embodiments of the present invention are a kind of photosensitive polymer combination, which is characterized in that above-mentioned R1、R2、R3、R4、R5、
R6、R7It is each independently the saturated aliphatic hydrocarbons of carbon atom number 1~5.
Embodiments of the present invention are a kind of photosensitive polymer combination, which is characterized in that above-mentioned R1、R2、R3、R4、R5、
R6、R7For methyl.
Embodiments of the present invention are a kind of photosensitive polymer combination, which is characterized in that relative to the upper of 100 mass parts
The photoresist of (A) containing carboxyl is stated, containing more than 10 mass parts and 30 above-mentioned (D) fatty family urea below the mass
Close object.
Embodiments of the present invention are a kind of photosensitive polymer combination, which is characterized in that also containing the dilution of (E) reactivity
Agent.
Embodiments of the present invention are a kind of photosensitive polymer combination, which is characterized in that also contain mercaptobenzoxazole
And/or mercaptobenzoxazole derivative.
Embodiments of the present invention are the photocured product of above-mentioned photosensitive polymer combination.
Embodiments of the present invention are the dry film with above-mentioned photosensitive polymer combination.
Embodiments of the present invention are the printing distributing board with above-mentioned photocured product.
The effect of invention
Embodiment according to the present invention, by photosensitive comprising the photoresist containing carboxyl and epoxide
Property resin combination in cooperation fatty family carbamide compound can also prevent even if one-pack-type is made in photosensitive polymer combination
Only photoresist during preservation containing carboxyl is reacted with epoxide, so as to obtain excellent be applicable in
Phase, in addition, can also obtain chemical resistance.
Embodiment according to the present invention is the compound that general formula (1) indicates by fatty family carbamide compound, so as to
Enough further increase working life.
Embodiment according to the present invention, by containing 10 matter relative to 100 mass parts of photoresist containing carboxyl
Part or more and 30 fatty family carbamide compound below the mass are measured, so as to further increase working life.
Specific embodiment
Next, being illustrated to photosensitive polymer combination of the invention.Photosensitive polymer combination of the invention contains
There are the photoresist of (A) containing carboxyl, (B) Photoepolymerizationinitiater initiater, (C) epoxide and (D) fatty family carbamide compound.
(A) containing the photoresist of carboxyl
Photoresist containing carboxyl is not particularly limited, such as can be enumerated in 1 molecule with 1 or more, preferably 2
The resin of the above photonasty unsaturated double-bond.As the photoresist containing carboxyl, such as modified by polyacid can be enumerated
The free-radical polymerised unsaturated monocarboxylic epoxy resin of the modified by polyacid such as epoxy (methyl) acrylate, the polyacid change
Property epoxy (methyl) acrylate obtains as follows: making acrylic acid, methacrylic acid (hereinafter sometimes referred to " (methyl) acrylic acid ".)
Etc. the epoxy group of the polyfunctional epoxy resin in free-radical polymerised unsaturated monocarboxylic and 1 molecule with 2 or more epoxy groups
At least part reaction, obtain the free-radical polymerised unsaturated monocarboxylic epoxy resin such as epoxy (methyl) acrylate,
And then react polyacid or its acid anhydrides with the hydroxyl of generation.
As long as above-mentioned multi-functional epoxy resin is the epoxy resin of 2 functions or more, it is not particularly limited, is able to use and appoints
One chemical structure.The epoxide equivalent of multi-functional epoxy resin is not particularly limited, upper limit value preferred 3000g/eq is more excellent
Select 1000g/eq, particularly preferred 500g/eq.On the other hand, the lower limit value of the epoxide equivalent of multi-functional epoxy resin is preferred
100g/eq, particularly preferred 200g/eq.
In multi-functional epoxy resin, such as biphenyl aralkyl-type epoxy resin, phenyl aralkyl-type can be enumerated
Epoxy resin, biphenyl type epoxy resin, naphthalene type epoxy resin, dicyclopentadiene type epoxy resin, 6-caprolactone modified epoxy tree
Rouge, bisphenol A type epoxy resin, bisphenol f type epoxy resin, phenol novolak type epoxy resin, o-cresol phenolic varnish type etc.
Cresol novolak type epoxy resin, phenol novolak type epoxy resin, bisphenol A novolac type epoxy resin, cyclic aliphatic epoxy resin, ethylene oxidic ester
Type epoxy resin, glycidyl amine type epoxy resin, hetero ring type epoxy resin, bis-phenol modified novolac type epoxy resin etc..
In addition, the product for having imported the halogen atoms such as Br, Cl in these resins can also be used.These epoxy resin can individually make
With can also be used in combination of two or more.
Free-radical polymerised unsaturated monocarboxylic is not particularly limited, for example, can enumerate (methyl) acrylic acid, bar
Beans acid, cinnamic acid etc., wherein from the aspect of the easiness obtained, preferred (methyl) acrylic acid.These are free-radical polymerised
Unsaturated monocarboxylic can be used alone, and can also be used in combination of two or more.
The reaction method of epoxy resin and free-radical polymerised unsaturated monocarboxylic is not particularly limited, such as can be led to
It crosses and epoxy resin is heated in diluent appropriate (such as organic solvent) with free-radical polymerised unsaturated monocarboxylic and made
It is reacted.
Polyacid or multi-anhydride and reacting by above-mentioned epoxy resin and free-radical polymerised unsaturated monocarboxylic
The hydroxyl of generation reacts, so that free carboxyl is imported photoresist.By the way that the carboxyl to dissociate is imported photoresist,
To assign alkali-developable.Polyacid or its acid anhydrides are not particularly limited, saturation, unsaturated polyacid or its acid anhydrides all may be used
It uses.In polyacid, such as succinic acid, maleic acid, adipic acid, citric acid, phthalic acid, phthalic acid can be enumerated
Derivative (such as tetrahydrophthalic acid, 3- methyl tetrahydrophthalic acid, 4- methyl tetrahydrophthalic acid, 3- ethyl four
Hydrogen phthalic acid, 4- ethyl tetrahydrophthalic acid, hexahydrophthalic acid, 3- methylhexahydrophthaacid acid, 4- methyl
Hexahydrophthalic acid, 3- ethyl hexahydrophthalic acid, 4- ethyl hexahydrophthalic acid, methyl tetrahydrophthalic acid,
Methylhexahydrophthaacid acid, endo-methylene group tetrahydrophthalic acid, methylendomethylene tetrahydrophthalic acid), inclined benzene three
Acid, Pyromellitic Acid and diglycolic acid etc..In addition, the acid anhydrides of these polyacids can be enumerated as multi-anhydride.These chemical combination
Object can be used alone, and can also be used in combination of two or more.
In the present invention, the free-radical polymerised unsaturated monocarboxylic epoxy resin of above-mentioned modified by polyacid be can be used as
Photoresist containing carboxyl uses, as needed, can by make to have 1 or more free-radical polymerised unsaturated group with
The glycidyl compound of epoxy group and the free-radical polymerised unsaturated monocarboxylic epoxy resin of above-mentioned modified by polyacid
Carboxyl reaction, to further import free-radical polymerised unsaturated group in side chain, being made further increases photonasty
Photoresist containing carboxyl.
The photoresist containing carboxyl for further increasing photonasty passes through above-mentioned glycidyl compound
It reacts and free-radical polymerised unsaturated group is made to be incorporated into the free-radical polymerised unsaturated monocarboxylic epoxy of modified by polyacid
The side chain of resin matrix, therefore photopolymerization reaction, i.e. photo-curable further increase, and have superior photobehavior.Make
For the compound with 1 or more free-radical polymerised unsaturated group and epoxy group, for example, can enumerate acrylic acid shrink it is sweet
Grease, glycidyl methacrylate, allyl glycidyl ether, pentaerythritol triacrylate monoglycidyl ether,
Pentaerythritol acrylate trimethyl monoglycidyl ether etc..It is above-mentioned have 1 or more free-radical polymerised unsaturated group and
The compound of epoxy group can be used alone, and can also be used in combination of two or more.
The acid value of photoresist containing carboxyl is not particularly limited, is examined in terms of obtaining reliable alkali-developable
Consider, lower limit value preferred 30mgKOH/g, particularly preferred 40mgKOH/g.On the other hand, from preventing exposure caused by alkaline developer
From the aspect of the dissolution in portion, the preferred 200mgKOH/g of the upper limit value of the acid value of the photoresist containing carboxyl is solid from preventing
From the aspect of the reduction of the moisture-proof and insulating properties of compound, particularly preferred 150mgKOH/g.
In addition, being not particularly limited to the matter average molecular weight of the photoresist containing carboxyl, from the obdurability of solidfied material
From the aspect of dry to touch, lower limit value preferably 6000, particularly preferred 7000.On the other hand, from being reliably prevented alkali
From the aspect of the reduction of developability, the upper limit value of the matter average molecular weight of the photoresist containing carboxyl preferably 200000 is special
Not preferably 50000.
Above-mentioned each raw material can be used to synthesize by above-mentioned reaction for photoresist containing carboxyl, it is possible to use commercially available
Photoresist containing carboxyl.As the commercially available photoresist containing carboxyl, such as " SP-4621 " can be enumerated
(Showa Denko K. K), " ZAR-2000 ", " ZFR-1122 ", " FLX-2089 ", " ZCR-1569H " (the above are Japanizations
The manufacture of medicine Co., Ltd.), " CYCLOMER P (ACA) Z-250 " (Daicel-Allnex Ltd.) etc..In addition, these contain carboxylic
The photoresist of base can be used alone, and can also be used in combination of two or more.
(B) Photoepolymerizationinitiater initiater
Photoepolymerizationinitiater initiater is not particularly limited, is able to use any.As Photoepolymerizationinitiater initiater, such as 1 can be enumerated,
2- acetyl caproyl, 1- [4- (thiophenyl) -2- (O- benzoyl oximes)], ethyl ketone 1- [9- ethyl -6- (2- methyl benzoyl) -9H-
Carbazole -3- base] -1- (O- acetyl group oxime), 2- (Acetyloxyimino methyl) thioxanthene-9-one, 1,8- acetyl caproyl, 1,8- is bis-
[9- ethyl -6- nitro -9H- carbazole -3- base] -, 1,8- bis- (O- acetyl group oximes), 1,8- acetyl caproyl, bis- [9- (the 2- ethyls of 1,8-
Hexyl) -6- nitro -9H- carbazole -3- base] -, 1,8- bis- (O- acetyl group oximes), (Z)-(9- ethyl -6- nitro -9H- carbazole -3-
Base) the oximes ester system Photoepolymerizationinitiater initiater such as (4- ((1- methoxy propane -2- base) oxygen) -2- aminomethyl phenyl) ketone O- acetyl group oxime；
Bis- (2,4,6- trimethylbenzoyl) phosphine oxides of phenyl, benzoin, benzoin methylether, benzoin ethyl ether, benzoin iso-propylether,
Benzoin n-butyl ether, benzoin isobutyl ether, acetophenone, dimethylamino benzoylformaldoxime, 2,2- dimethoxy -2- phenyl benzene second
Ketone, 2,2- diethoxy -2- phenyl acetophenone, 1- benzyl -1- (dimethylamino) propyl -4- morphlinophenyl -one, 2- first
Base -4 '-(methyl mercapto) -2- morpholino propiophenone, 2- benzyl -2- dimethylamino -1- (4- morphlinophenyl)-butanone -1,2-
Hydroxy-2-methyl -1- phenyl-propane -1- ketone, 1- hydroxycyclohexylphenylketone, 4- (2- hydroxyl-oxethyl) phenyl -2- (hydroxyl -
2- propyl) ketone, benzophenone, to phenyl benzophenone, 4,4 '-bis- (diethylamino) benzophenone, dichloro benzophenone, 2-
Tectoquinone, 2- ethyl hydrazine, 2- tert-butyl anthraquinone, 2- amino anthraquinones, 2- methyl thioxanthones, 2- ethyl thioxanthones, 2- diuril
Ton ketone, 2,4- dimethyl thioxanthone, 2,4- diethyl thioxanthone, benzil dimethyl ketal, acetophenone dimethyl ketal, to two
Methylaminobenzoate ethyl ester etc..These compounds can be used alone, and can also be used in combination of two or more.To Photoepolymerizationinitiater initiater
Content is not particularly limited, relative to 100 mass parts of photoresist (solid component, similarly hereinafter) containing carboxyl, preferably 1.0~
10 mass parts, particularly preferred 2.0~8.0 mass parts.
(C) epoxide
Epoxide improves the crosslink density of the photocured product of photosensitive polymer combination, to obtain having adequately mechanical
The cured coating film of intensity.As epoxide, such as epoxy resin can be enumerated.As epoxy resin, such as can arrange
Enumerate biphenyl type epoxy resin, biphenyl aralkyl-type epoxy resin, bisphenol A type epoxy resin, tetramethyl bisphenol f type epoxy resin
Equal bisphenol f type epoxy resins, phenol novolak type epoxy resin, cresol novolak type epoxy resin, dicyclopentadiene type
Epoxy resin, adamantane type epoxy resin.Wherein, from the aspect of further increasing working life, preferred bisphenol type epoxy tree
Rouge, biphenyl type epoxy resin, tetramethyl bisphenol f type epoxy resin, particularly preferred biphenyl type epoxy resin, tetramethyl bisphenol-f type
Epoxy resin.These compounds can be used alone, and can also be used in combination of two or more.
The content of epoxide is not particularly limited, from the photocured product for reliably obtaining sufficient mechanical strength
From the aspect of, relative to 100 mass parts of photoresist containing carboxyl, preferably 10~150 mass parts, particularly preferred 30~80
Mass parts.
(D) fatty family carbamide compound
By matching in the photosensitive polymer combination of the invention comprising the photoresist containing carboxyl and epoxide
Fatty family carbamide compound is closed, even if photosensitive polymer combination is made to become one-pack-type, can also be prevented under room temperature (25 DEG C)
Preservation during the photoresist containing carboxyl reacted with epoxide, to can be obtained at normal temperature
Obtain excellent working life.Therefore, it is able to extend under room temperature and handles the time, to improve photosensitive resin composition of the invention
Treatability of the object in coating operations etc..In addition, by cooperating fatty family urea in photosensitive polymer combination of the invention
Compound, to can also obtain the chemical resistance of the photocured product of photosensitive polymer combination.
Fatty family carbamide compound is the aliphatic carbamide compound for not having aromatic rings in its chemical structure.As fat
Family carbamide compound can enumerate the compound indicated by the following general formula (1).
(in formula, R1、R2、R3、R4、R5、R6、R7Each independently represent carbon atom number 1~20 saturated aliphatic hydrocarbons or
The unsaturated fatty hydrocarbons base of carbon atom number 2~20 at least one ethylenic bond unsaturated group.)
Wherein, from the aspect of further increasing working life, more preferable R1、R2、R3、R4、R5、R6、R7Each independently
For the fatty family carbamide compound of the general formula (1) of the saturated aliphatic hydrocarbons of carbon atom number 1~5, further preferred R1、R2、R3、
R4、R5、R6、R7It is each independently the fatty family urea chemical combination of the general formula (1) of the saturated aliphatic hydrocarbons of carbon atom number 1~3
Object, particularly preferred R1、R2、R3、R4、R5、R6、R7It is all the fatty family carbamide compound of the general formula (1) of methyl.R1、R2、R3、R4、
R5、R6、R7The fatty family carbamide compound for being all the general formula (1) of methyl is N '-[3- [[[(dimethylamino) carbonyl] amino] first
Base] -3,5,5- trimethylcyclohexyl]-N, N- dimethyl urea.
The content of fatty family carbamide compound is not particularly limited, from the aspect of further increasing working life, phase
For 100 mass parts of photoresist containing carboxyl, lower limit value preferably 5.0 mass parts, more preferable 10 mass parts are especially excellent
Select 15 mass parts.On the other hand, from the aspect of reliably obtaining excellent sensitivity, relative to the photonasty containing carboxyl
100 mass parts of resin, the upper limit value of the content of fatty family carbamide compound preferably 50 mass parts, more preferable 30 mass parts, especially
It is preferred that 25 mass parts.
In photosensitive polymer combination of the invention, other than above-mentioned (A) ingredient~(D) ingredient, as needed may be used
Further cooperation (E) reactive diluent.Reactive diluent is, for example, photopolymerization monomer, is that every 1 molecule has at least 1
A, preferably 2 or more polymeric double bonds compound.Reactive diluent facilitates the photocuring for making photosensitive polymer combination
Sufficiently, to improve the acid resistance of photocured product, heat resistance, alkali resistance etc..
As reactive diluent, such as (methyl) acrylate monomer of simple function can be enumerated, more than 2 functions
(methyl) acrylate monomer.As concrete example, (methyl) acrylic acid 2- hydroxy methacrylate, (methyl) acrylic acid benzene oxygen can be enumerated
Base ethyl ester, diglycol monotertiary (methyl) acrylate, (methyl) acrylic acid 2- hydroxyl -3- phenoxy-propyl, caprolactone modification (first
Base) acrylate, 1,4- butanediol two (methyl) acrylate, 1,6-hexylene glycols two (methyl) acrylate, neopentyl glycol two
(methyl) acrylate, diethylene glycol (deg) two (methyl) acrylate, NPGA neopentyl glycol adipate two (methyl) acrylate, hydroxyl are new
Valeric acid neopentyl glycol two (methyl) acrylate, Bicvclopentyl two (methyl) acrylate, ethylene-oxide-modified di(2-ethylhexyl)phosphate (first
Base) acrylate, allylation cyclohexyl two (methyl) acrylate, isocyanuric acid ester two (methyl) acrylate, three hydroxyl first
Base propane three (methyl) acrylate, two (trimethylolpropane) four (methyl) acrylate, dipentaerythritol three (methyl) third
Olefin(e) acid ester, pentaerythrite three (methyl) acrylate, epoxy pronane modification trimethylolpropane tris (methyl) acrylate, isocyanide
Urea acid three (acryloyl-oxyethyl) ester, propionic acid modified dipentaerythritol five (methyl) acrylate, six (first of dipentaerythritol
Base) acrylate etc..These reactive diluents can be used alone, and can also be used in combination of two or more.
The content of reactive diluent is not particularly limited, relative to 100 mass parts of photoresist containing carboxyl,
It is preferred that 5.0~100 mass parts, particularly preferred 10~50 mass parts.
It, as needed can be into other than above-mentioned (A)~(E) ingredient in photosensitive polymer combination of the invention
One step mates properly into other compositions, such as various additives, colorant, fire retardant, non-reactive diluent etc..
In various additives, the defoaming agent of organic silicon-type, hydrocarbon system and acrylic acid series etc. can be enumerated, sulfydryl benzo is disliked
It is azoles and its derivative, dicyandiamide (DICY) and its derivative, melamine and its derivative, boron trifluoride-amine complex, organic
The solidification such as sour hydrazides, diaminomaleonitrile (DAMN) and its derivative, guanamines and its derivative, amine acid imide (AI) and polyamines
Extender pigments such as catalyst, talcum, barium sulfate, hydrophobic silica, aluminium oxide, aluminium hydroxide, mica etc..Solidify in cooperation
In the case where catalyst, in above-mentioned various curing catalysts, from more reliably to the photocuring of photosensitive polymer combination
From the aspect of object assigns resistance to hydrochloric acid (HCl) property, preferably mercaptobenzoxazole and its derivative.
Colorant is pigment, pigment etc., is not particularly limited, furthermore it is also possible to use white color agents, blue-colored
Any colour colouring pigment such as agent, green colourant, yellow colorants, violet colorant, black colorant, orange colorant.?
In above-mentioned colorant, such as can to enumerate the titanium oxide as white color agents, the carbon black as black colorant etc. inorganic
It is colorant, the phthalocyanine green as green colourant and the phthalocyanine blue as blue colorant, thunder Austria Nore indigo plant ((Lionol
The phthalocyanines system, anthraquinone system, organic as the pyrrolo-pyrrole-diones systems such as the Chromophthal orange of orange colorant etc. such as blue))
It is colorant etc..
Fire retardant is used to assign anti-flammability to the photocured product of photosensitive polymer combination of the invention.As fire retardant,
Such as phosphorus flame retardant can be enumerated.As phosphorus flame retardant, such as tricresyl phosphate (chloroethyl) ester, tricresyl phosphate can be enumerated
(bis- chloropropyl of 2,3-) ester, tricresyl phosphate (2- chloropropyl) ester, tricresyl phosphate (2,3- bromopropyl) ester, tricresyl phosphate (bromine chloropropyl) ester,
Phosphoric acid 2,3- dibromopropyl -2,3- chlorine propyl ester, tricresyl phosphate (tribromo phenyl) ester, tricresyl phosphate (dibromo phenyl) ester, tricresyl phosphate (tribromo
Neopentyl) phosphate containing halogen system such as ester；Trimethyl phosphate, triethyl phosphate, tributyl phosphate, trioctyl phosphate, tricresyl phosphate
The non-halogens aliphatic phosphate ester such as butoxyethyl；Triphenyl phosphate, tricresyl phosphate base diphenyl, di(2-ethylhexyl)phosphate (tolyl)
Phenylester, tricresyl phosphate (toluene) ester, tricresyl phosphate (dimethylbenzene) ester, di(2-ethylhexyl)phosphate cresyl diphenyl phosphate, tricresyl phosphate (cumene
Base) ester, p isopropylbenzoic acid base phenyl diphenyl, phosphoric acid diisopropyl phenyl phenylester, tricresyl phosphate (trimethylphenyl) ester, phosphoric acid
The non-halogens aromatic phosphoric acids such as three (tert-butyl phenyl) esters, phosphoric acid hydroxy phenyl diphenyl, octyl diphenyl phosphate
Ester；Three (diethyl hypophosphorous acid) aluminium, three (Methylethyl hypophosphorous acid) aluminium, three (diphenyl hypophosphorous acid) aluminium, bis- (diethyl time phosphorus
Acid) zinc, bis- (Methylethyl hypophosphorous acid) zinc, bis- (diphenyl hypophosphorous acid) zinc, bis- (diethyl hypophosphorous acid) oxygen titaniums, four (diethyl
Hypophosphorous acid) titanium, bis- (Methylethyl hypophosphorous acid) oxygen titaniums, four (Methylethyl hypophosphorous acid) titaniums, bis- (diphenyl hypophosphorous acid) oxygen titaniums, four
The metal salt of the hypophosphorous acid such as (diphenyl hypophosphorous acid) titanium；Miscellaneous -10- phospho hetero phenanthrene -10- the oxide of 9,10- dihydro-9-oxy is (below
Referred to as HCA), the addition reaction product of HCA and acrylate, HCA and epoxy resin addition reaction product, HCA and hydrogen
The HCA modified version compound such as addition reaction product of quinone；Diphenylacetylene phosphine oxide, triphenylphosphine oxide, trialkyl oxygen
Change phosphine oxides based compounds such as phosphine, three (hydroxy alkyl) phosphine oxides etc..Wherein, the preferred fire retardant of organic phosphate system.These
Compound can be used alone, and can also be used in combination of two or more.
Non-reactive diluent is used to adjust coating, the drying property of photosensitive polymer combination.As non-reacted dilute
Agent is released, such as organic solvent can be enumerated.In organic solvent, such as the ketones such as methyl ethyl ketone, cyclohexanone can be enumerated；First
Benzene, dimethylbenzene etc. are aromatic hydrocarbon；The alcohols such as methanol, isopropanol, cyclohexanol；The ester ring types hydro carbons such as hexamethylene, hexahydrotoluene；
The petroleum series solvent such as petroleum ether, naphtha；The dioxanes such as cellosolve, butyl cellosolve；The cards such as carbitol, butyl carbitol must
Alcohols；Ethyl acetate, butyl acetate, cellosolve acetate, butyl cellosolve acetate, carbitol acetate, butyl carbitol second
Esters such as acid esters, Ethylene glycol acetate, ethyl diethylene glycol (DEG) acetic acid esters etc..Above-mentioned organic solvent can be used alone, can also be simultaneously
Use two or more.
The manufacturing method of the photosensitive polymer combination of aforementioned present invention is not limited to specific method, such as can be
With regulated proportion by after above-mentioned each components matching, filled under room temperature (room temperature) using mixings such as three rollers, ball mill, sand mills
It sets or the agitating devices such as super mixing machine, planetary-type mixer is kneaded or is mixed and manufactured.In addition, as needed, it can
To be kneaded or be pre-mixed in advance under room temperature (room temperature) before above-mentioned mixing or mixing.
Next, being illustrated for user's rule of the photosensitive polymer combination of aforementioned present invention.Here, so that
With being illustrated for the method for dry film formation solder mask, the dry film passes through the circuit diagram formed and having and etching copper foil
It is coated with photosensitive polymer combination of the invention on the printing distributing board of case and obtains.
Dry film becomes with support membrane (such as the thermoplastic films such as polyethylene terephthalate film, polyester film), coating
In the stepped construction of the solder mask and the cover film (such as polyethylene film, polypropylene screen) for protecting the solder mask of the support membrane.It is logical
It crosses and is coated with photosensitive polymer combination of the invention on support membrane using method well known to rolling method, stick coating method etc. and forms painting
After film, which is dried, to form solder mask on support membrane.Then, by the solder mask of formation
Laminated cover film, to make dry film.
By being bonded solder mask with printing distributing board while by the covering film stripping of above-mentioned dry film, thus printing
Solder mask is formed on distributing board.Then, as needed, in order to there is the non-reactive diluent in photosensitive polymer combination (
Solvent) volatilization, the at a temperature of heating predrying in 1~10 minute or so at 100~120 DEG C or so is carried out, is made non-reacted
Diluent (organic solvent) volatilizees from photosensitive polymer combination, and the surface of solder mask is made to become tack-free state.It is being formed
Solder mask on bonding there is the minus film of the pattern for making to become other than the pad of circuit pattern translucency, it is ultraviolet from irradiating thereon
Line (such as range of 300~400nm of wavelength).Then, by will non-exposed area corresponding with above-mentioned pad with dilute alkaline aqueous solution
Domain removes, so that solder mask be made to develop.Using spray-on process, spray process etc. in developing method, as the dilute alkaline aqueous solution used,
Such as the aqueous sodium carbonate of 0.5~5 mass % can be enumerated.After development, by using hot air circulation type drying machine etc. 130
~170 DEG C carry out 20~80 minutes after solidify, so as on printing distributing board formed have target pattern solder mask.
Embodiment
Next, being illustrated to the embodiment of the present invention, but the present invention is then not limited to without departing from its purport
These embodiments.
Examples 1 to 5, comparative example 1~6
With each ingredient shown in the cooperation following table 1 of mixing ratio shown in following table 1, using three rollers at room temperature (25 DEG C)
Under make its mixing dispersion, preparation Examples 1 to 5, photosensitive polymer combination used in comparative example 1~6.Institute in following table 1
The use level of each ingredient shown is as long as no special instructions, then it represents that mass parts.It should be noted that the sky of the use level in following table 1
Column portion indicates to mismatch.
It should be noted that the details about each ingredient in following table 1 is as described below.
(A) containing the photoresist of carboxyl
KAYARAD ZAR-2000: 65 mass % of solid component (resin portion), Nippon Kayaku K. K
It should be noted that KAYARAD ZAR-2000 is the Polyprotic-acid-modiepoxy epoxy acrylate resin obtained as follows: making acrylic acid
It is reacted at least part of the epoxy group of epoxy resin (bisphenol A type epoxy resin), obtains epoxy acrylate, make polyacid
It is reacted with the hydroxyl of the generation of epoxy acrylate.
(B) Photoepolymerizationinitiater initiater
IRGACURE369: Qi Ba special chemical article Co., Ltd.
EAB: Baotugu Chemical Industrial Co., Ltd
OXE02: Qi Ba special chemical article Co., Ltd. of IRGACURE
(C) epoxide
NC-3000: Nippon Kayaku K. K
EPICLON 860, EPICLON N-695:DIC Co., Ltd.
YX-4000HK: Mitsubishi chemical Co., Ltd
YSLV-80XY: Nippon Steel & Sumitomo Metal Corporation
(E) reactive diluent
DPCA-120: Nippon Kayaku K. K
Curing catalysts
Dicyandiamide: Tokyo Chemical Industry Co., Ltd
Melamine: Tokyo Chemical Industry Co., Ltd
2- mercaptobenzoxazole: Tokyo Chemical Industry Co., Ltd
Fire retardant
Exolit OP-935: Clariant Amada Co., Ltd.
Colorant
TR: Qi Ba special chemical article Co., Ltd. of CHROMOPHTHAL DPP ORANGE
LIONOL BLUE FG-7351: Toyo Ink Manufacturing Co., Ltd.
Defoaming agent
KS-66: Shin-Etsu Chemial Co., Ltd
Non-reactive diluent
EDGAC: Sanyo is melted into product Co., Ltd.
Test film production process
Coated substrates: polyethylene terephthalate film (PET film)
Rubbing method: rod coaters
Predrying: 110 DEG C, 5 minutes
Evaluate substrate: bilayer copper clad laminate (CCL) (polyimides (25 μm thick) substrate, copper foil (12.5 μm thick))
Surface treatment: 5 mass % sulfuric acid treatments
Lamination: 50 DEG C, pressurization 50MPa, 30 seconds/pressurization of vacuum 30 seconds
Dried film thickness: 25 μm
Exposure: using USHIO Co. Ltd. system projection aligner (light source is high-pressure sodium lamp) with 150mJ/cm2Film is carried out
Exposure
Development: 1 30 DEG C of mass % aqueous sodium carbonate temperature, jet pressure 0.2MPa, developing time 60 seconds
Solidify afterwards: 150 DEG C, 60 minutes
Assessment item
(1) working life
The photosensitive polymer combination prepared as described above is coated on the PET film as coated substrates, it, will after forming film
After coated substrates predrying, placed at 25 DEG C.The coated substrates placed at 25 DEG C were taken out every 24 hours, are laminated to work
After the double-deck CCL to evaluate substrate, develop in the case where no exposure.Metering is since development to film base can be seen
The time of the copper foil at bottom.It will to the time for the copper foil that film substrate can be seen be to be evaluated as zero within 30 seconds since development, it will
Time since development to the copper foil that film substrate can be seen be more than be evaluated as within 30 seconds ×, will placement the above are zero within 72 hours to comment
Valence is set as qualified.It should be noted that recording the maximum standing time for being able to maintain that zero evaluation in table 1, it is when placing 24 hours
In the case where × evaluation, it is labeled as " 24 hours × ".
(2) sensitivity
Sensitometry is set on the film of coated substrates with stage exposure meter (21 grades of Stouffer), passes through sensitivity
Stage exposure meter is measured, with 150mJ/cm2The main peak of illumination wavelength be 365nm ultraviolet light, using resulting product as
Test film.Ultraviolet irradiation light quantity uses ORC MANUFACTURING CO., the accumulative quantometer measurement of LTD. manufacture.With
After ultraviolet exposure, develop according to above-mentioned test film production process, indicates that exposed portion is not removed with digital (series)
Part.Series is bigger, indicates that sensitivity is better.
(3) resistance to hydrochloric acid (HCl) property
Test film obtained in above-mentioned test film production process is impregnated under room temperature to 30 points in the HCL aqueous solution of 10 mass %
Clock after dipping, is sufficiently carried out washing, is removed moisture with soft cloth.Then, it is applied with 200 times of optical microphotograph sem observation
Zero evaluation is set as qualified with the situation of the removing (heaving) of following 3 grades evaluation film by film surface.
Zero: not peeling-off (heaving)
△: slightly removing (heaving)
×: there are biggish removings (heaving).
(4) resistance to isopropanol (IPA) property
By test film obtained in above-mentioned test film production process in isopropanol (IPA) aqueous solution of 10 mass % under room temperature
Dipping 30 minutes, after dipping, is sufficiently carried out washing, is removed moisture with soft cloth.Then, with 200 times of optical microphotograph
Zero evaluation is set as qualified with the situation of the removing (heaving) of following 3 grades evaluation film by sem observation film coated surface.
Zero: not peeling-off (heaving)
△: slightly removing (heaving)
×: there are biggish removings (heaving)
It shows the results of the evaluation in following table 1.
[table 1]
As shown in above-mentioned table 1, cooperating N '-[the 3- [[[(dimethylamino as fatty family carbamide compound
Base) carbonyl] amino] methyl] -3,5,5- trimethylcyclohexyls]-N, in the Examples 1 to 5 of N- dimethyl urea, does not damage sense
Luminosity, and working life is tested, at 72 hours, the above are zero evaluations, can obtain excellent working life at normal temperature.It is special
It is not by embodiment 3,5 it is found that if using biphenyl type epoxy resin, tetramethyl bisphenol f type epoxy resin as epoxy compound
Object then can obtain especially excellent working life the above are zero evaluation at 192 hours at room temperature.
In addition, resistance to HCl and resistance to IPA are also excellent in Examples 1 to 5, it is excellent for the patience of acid and alcohol.Therefore,
In Examples 1 to 5, chemical resistance is also excellent.
On the other hand, use biphenyl aralkyl-type epoxy resin as epoxy resin, instead of fatty family carbamide compound
And cooperate in the comparative example 1 of aromatic system dimethyl urea compound, there is no good working life, resistance to HCl, resistance to IPA.
In addition, use bisphenol A type epoxy resin, biphenyl type epoxy resin as epoxy resin, instead of fatty family carbamide compound and
In the comparative example 2,3 for cooperating aromatic system dimethyl urea compound, there is no resistance to HCl, resistance to IPA.
In addition, there is no good working life in the comparative example 4~6 of no cooperation fatty family carbamide compound.
Industrial availability
Photosensitive polymer combination of the invention has chemical resistance, and even if being configured to one-pack-type, is also prevented from normal
The photoresist containing carboxyl is reacted with epoxide during preservation under temperature, to have long pot life.Cause
This, photosensitive polymer combination of the invention is after the manufacture of photosensitive polymer combination, when the processing being able to extend under room temperature
Between, therefore the treatability in coating operations etc. improves.It can be seen from the above, being protected such as the solder resist formed in printing distributing board
The field of cuticula, particularly the dry film that photosensitive polymer combination is coated on film made of film bestowed into printed wiring by having
Plate and that the protective films such as solder resist are formed in the field of printing distributing board utility value is high.
Claims (10)
1. a kind of photosensitive polymer combination, which is characterized in that contain: the photoresist of (A) containing carboxyl, (B) photopolymerization
Initiator, (C) epoxide and (D) fatty family carbamide compound.
2. photosensitive polymer combination according to claim 1, which is characterized in that (D) the fatty family carbamide compound
The compound indicated for the following general formula (1):
In formula, R1、R2、R3、R4、R5、R6、R7Each independently represent the saturated aliphatic hydrocarbons or tool of carbon atom number 1~20
There is the unsaturated fatty hydrocarbons base of the carbon atom number 2~20 of at least one ethylenically unsaturated groups.
3. photosensitive polymer combination according to claim 2, which is characterized in that the R1、R2、R3、R4、R5、R6、R7Respectively
From the saturated aliphatic hydrocarbons for independently being carbon atom number 1~5.
4. photosensitive polymer combination according to claim 2 or 3, which is characterized in that the R1、R2、R3、R4、R5、R6、R7
For methyl.
5. photosensitive polymer combination according to any one of claims 1 to 4, which is characterized in that relative to 100 mass
Part the photoresist of (A) containing carboxyl, containing it is more than 10 mass parts and 30 below the mass described in (D) aliphatic
It is carbamide compound.
6. photosensitive polymer combination according to any one of claims 1 to 5, which is characterized in that also reacted containing (E)
Property diluent.
7. photosensitive polymer combination described according to claim 1~any one of 6, which is characterized in that also contain sulfydryl benzene
And oxazole and/or mercaptobenzoxazole derivative.
8. a kind of photocured product is the photocured product of photosensitive polymer combination according to any one of claims 1 to 7.
9. a kind of dry film, with photosensitive polymer combination according to any one of claims 1 to 7.
10. a kind of printing distributing board, with photocured product according to any one of claims 8.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018057061A JP6802207B2 (en) | 2018-03-23 | 2018-03-23 | Photosensitive resin composition |
| JP2018-057061 | 2018-03-23 |
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| Publication Number | Publication Date |
|---|---|
| CN110297392A true CN110297392A (en) | 2019-10-01 |
Family
ID=68026516
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910222480.9A Pending CN110297392A (en) | 2018-03-23 | 2019-03-22 | Photosensitive polymer combination |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6802207B2 (en) |
| KR (1) | KR20190111791A (en) |
| CN (1) | CN110297392A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6811757B2 (en) * | 2018-09-11 | 2021-01-13 | 株式会社タムラ製作所 | Photosensitive resin composition |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05320312A (en) * | 1990-11-20 | 1993-12-03 | W R Grace & Co | Production of unsaturated epoxy ester resin and carboxylatedunsaturated epoxy ester resin and photosensitive resin composition containing same |
| JP2007079120A (en) * | 2005-09-14 | 2007-03-29 | Fujifilm Corp | Photosensitive composition, pattern forming material, photosensitive laminate, pattern forming apparatus, and pattern forming method |
| WO2010074197A1 (en) * | 2008-12-25 | 2010-07-01 | 味の素株式会社 | Photosensitive resin composition |
| JP2011227460A (en) * | 2010-03-30 | 2011-11-10 | Fujifilm Corp | Photosensitive composition |
| CN104334602A (en) * | 2012-08-02 | 2015-02-04 | 澳泽化学股份公司 | Liquid hardeners for hardening epoxide resins (I) |
| CN106556969A (en) * | 2015-09-29 | 2017-04-05 | 株式会社田村制作所 | Photosensitive polymer combination |
| JP2017173765A (en) * | 2016-03-25 | 2017-09-28 | 東京応化工業株式会社 | Colored photosensitive composition, colored cured product obtained therefrom, display element, and method of producing colored cured product |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5319132B2 (en) | 2008-02-06 | 2013-10-16 | 太陽ホールディングス株式会社 | Photocurable / thermosetting resin composition and cured product thereof |
-
2018
- 2018-03-23 JP JP2018057061A patent/JP6802207B2/en active Active
-
2019
- 2019-03-19 KR KR1020190031104A patent/KR20190111791A/en not_active Application Discontinuation
- 2019-03-22 CN CN201910222480.9A patent/CN110297392A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05320312A (en) * | 1990-11-20 | 1993-12-03 | W R Grace & Co | Production of unsaturated epoxy ester resin and carboxylatedunsaturated epoxy ester resin and photosensitive resin composition containing same |
| JP2007079120A (en) * | 2005-09-14 | 2007-03-29 | Fujifilm Corp | Photosensitive composition, pattern forming material, photosensitive laminate, pattern forming apparatus, and pattern forming method |
| WO2010074197A1 (en) * | 2008-12-25 | 2010-07-01 | 味の素株式会社 | Photosensitive resin composition |
| JP2011227460A (en) * | 2010-03-30 | 2011-11-10 | Fujifilm Corp | Photosensitive composition |
| CN104334602A (en) * | 2012-08-02 | 2015-02-04 | 澳泽化学股份公司 | Liquid hardeners for hardening epoxide resins (I) |
| CN106556969A (en) * | 2015-09-29 | 2017-04-05 | 株式会社田村制作所 | Photosensitive polymer combination |
| JP2017173765A (en) * | 2016-03-25 | 2017-09-28 | 東京応化工業株式会社 | Colored photosensitive composition, colored cured product obtained therefrom, display element, and method of producing colored cured product |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190111791A (en) | 2019-10-02 |
| JP2019168613A (en) | 2019-10-03 |
| JP6802207B2 (en) | 2020-12-16 |
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