CN110295721A - A kind of hard or the high anti-shrink EPC composite floor board of semi-rigid and its manufacture craft - Google Patents
A kind of hard or the high anti-shrink EPC composite floor board of semi-rigid and its manufacture craft Download PDFInfo
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- CN110295721A CN110295721A CN201910525133.3A CN201910525133A CN110295721A CN 110295721 A CN110295721 A CN 110295721A CN 201910525133 A CN201910525133 A CN 201910525133A CN 110295721 A CN110295721 A CN 110295721A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D99/00—Subject matter not provided for in other groups of this subclass
- B29D99/001—Producing wall or panel-like structures, e.g. for hulls, fuselages, or buildings
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/04—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
- C08L27/06—Homopolymers or copolymers of vinyl chloride
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/10—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials
- E04F15/105—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials of organic plastics with or without reinforcements or filling materials
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/10—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials
- E04F15/107—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials composed of several layers, e.g. sandwich panels
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/18—Separately-laid insulating layers; Other additional insulating measures; Floating floors
- E04F15/20—Separately-laid insulating layers; Other additional insulating measures; Floating floors for sound insulation
- E04F15/206—Layered panels for sound insulation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2327/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
- C08J2327/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
- C08J2327/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
- C08J2327/06—Homopolymers or copolymers of vinyl chloride
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F2290/00—Specially adapted covering, lining or flooring elements not otherwise provided for
- E04F2290/04—Specially adapted covering, lining or flooring elements not otherwise provided for for insulation or surface protection, e.g. against noise, impact or fire
- E04F2290/041—Specially adapted covering, lining or flooring elements not otherwise provided for for insulation or surface protection, e.g. against noise, impact or fire against noise
- E04F2290/043—Specially adapted covering, lining or flooring elements not otherwise provided for for insulation or surface protection, e.g. against noise, impact or fire against noise with a bottom layer for sound insulation
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- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Chemical & Material Sciences (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
Abstract
The present invention relates to a kind of hard or the high anti-shrink EPC composite floor board of semi-rigid and its manufacture crafts, the EPC composite floor board includes hyaline layer, color film layer, the first high-intensitive substrate layer, the second fretting map substrate layer, third substrate layer that co-extrusion mode realizes integration fitting from top to bottom.The present invention provides a kind of hard or the high anti-shrink EPC composite floor board of semi-rigid and its manufacture craft, ground board finished product has good resistance to compression, anti-shrink ability, in its manufacture craft, heat treatment procedure is increased newly, process is simple and easy, cooperate caterpillar conveyer belt, avoids the case where influencing finished product thickness due to second time of foaming occurs in temperature change fretting map substrate layer generation.
Description
Technical field
The present invention relates to floor fields, especially with regard to a kind of hard or the high anti-shrink EPC composite floor board of semi-rigid.
Background technique
One layer of substrate layer is directly enclosed by heating pressuring method after machine barrel, mold squeeze out in traditional floor EPC, should
Substrate layer is because can only be stored and be used by rolled fashion, so have certain limitation to its thickness and pliability, therefore substrate
Layer is not available high filling, high-intensitive material production, so that ground board finished product resistance to compression, anti-shrink effect are poor.
In addition, EPC product directly fits color film layer, wearing layer after being bonded one layer of substrate layer, after dandy roll through thickness measuring roller
Dimension is cut into, then also needs to be bonded sound absorbing layer using glue after lamination, molding, fluting process, the technique is relatively complicated,
And can not be eliminated in the tensile stress squeezed out, traction section generates, it eventually leads to product contraction and is unable to control.
Summary of the invention
In view of this, the present invention is in order to solve the above technical problems, provide a kind of hard or the high anti-shrink EPC of semi-rigid is compound
Floor and its manufacture craft, ground board finished product have good resistance to compression, anti-shrink ability, in manufacture craft, increased heat treatment newly
Process, process is simple and easy, cooperates caterpillar conveyer belt, avoids shadow due to temperature change fretting map substrate layer second time of foaming occurs
The case where ringing finished product thickness occurs.
The technical problems to be solved by the invention are achieved through the following technical solutions:
A kind of hard or the high anti-shrink EPC composite floor board of semi-rigid, include from top to bottom the hyaline layer being successively bonded, color film layer,
Three-layer co-extruded composite base material layer, sound absorbing layer, the three-layer co-extruded composite base material layer is by the first high-intensitive substrate layer, the second fretting map
Substrate layer, third high intensity substrate layer are constituted, the hyaline layer, color film layer, the first high-intensitive substrate layer, the second fretting map substrate
Layer, third high intensity substrate layer binding face be not provided with glue.
A kind of high intensity substrate layer formula, is made of following material component: 50-75 part of PVC powder, 150-250 parts of mountain flour, surely
Determine 4-8 parts of agent, 1.5-3 parts of lubricant, 5-12 parts of toughener, 0.2-1.2 parts of plasticizer, 0-3 parts of toner.
A kind of fretting map substrate layer formula, is made of following material component: PVC50-75 powder, is stablized 150-250 parts of mountain flour
3-6 parts of agent, 1-2.5 parts of lubricant, 5-12 parts of toughener, 0.2-1.2 parts of plasticizer, 4-8 parts of foaming control agent, foaming agent 0.2-
1 part, 0-3 parts of toner.
A kind of manufacture craft of hard or the high anti-shrink EPC composite floor board of semi-rigid, comprising the following steps:
Step 1: according to the weighing of high-intensitive substrate layer formula, the high-intensitive substrate layer of configuration first and third high intensity substrate layer
Raw material, according to the weighing of fretting map substrate layer formula, the raw material of the second fretting map substrate layer of configuration；
It is stirred Step 2: configured raw material are put into respectively in blender one and blender two；When the temperature of mixture
Degree rises to after default heating temperature and opens the valve of thermal agitation machine, and by the object after two thermal agitation of blender one and blender
Material is put into and carries out cold stirring in cold blender, and the temperature of mixture is begun to decline, when the temperature of mixture drop to preset it is cold
But each cold blender valve is opened after temperature, material respectively enters respective storage bin；
Step 3: the mixture in blender one is transported extruder one by screw feeding machine, will be stirred by screw feeding machine
Mixture in machine two transports extruder two；
Step 4: extruder one and the good material of two heating plasticizing of extruder reach mold by distributor, it is high to adjust first
Extrusion molding after the predetermined thickness of intensity substrate layer and the second fretting map substrate layer；
Step 5: squeezing out preliminary molding material, by thickness measuring roller, the first high-intensitive substrate layer and second of specified thickness is obtained
Fretting map substrate layer；
Step 6: three-layer co-extruded composite base material layer is connected with the setting roll of conduction oil by multi-group pressure cocurrent, temperature is set as
60 DEG C -120 DEG C,
Step 7: three-layer co-extruded composite base material layer heat preservation is by color film layer overlay film roller, overlay film roll temperature is set as 130 DEG C -150
DEG C, color film layer is fitted into the first high-intensitive substrate layer surface via overlay film roller；Then hyaline layer overlay film roller, overlay film are passed through in heat preservation
Roll temperature is set as 130 DEG C -150 DEG C, and hyaline layer is fitted in color film layer via overlay film roller；
Step 8: sound absorbing layer to be fitted to third substrate layer from below；
Step 9: the semi-finished product after dragger will be compound are transported to tracking mode plate shearing machine through powered carriage, it is cut into setting rule
Lattice, using 3 sections of caterpillar conveyer belts pass sequentially through 90 DEG C of -100 DEG C of hot water storgaes, 55 DEG C of -65 DEG C of warm water tanks, 25 DEG C -35 DEG C it is cold
Sink is heat-treated, then is reached manipulator after air curtain cooler cooling air-drying and realized automatic material receiving.
Preferably, in step 2, default heating temperature is set as 110 DEG C -130 DEG C, blender one and two turns of blender
Speed is set as 1200-1800 and turns/min.
Preferably, in step 2, default cooling temperature is set as 40 DEG C -50 DEG C.
Preferably, in step 2, thermal agitation machine, cold blender, storage bin are put in step, and thermal agitation machine is in height
Position, storage bin are in low level.
Preferably, in step 3, the mixture in blender one and blender two pass through respectively feeding motor be fed to it is crowded
The machine barrel of machine one and extruder two carries out heating plasticizing, one machine barrel of extruder and two machine barrel of extruder in 30 ° of -60 ° of angles pendulum out
It puts.
Preferably, in step 4, using the second fretting map substrate layer as main substrate layer, the thickness of the second fretting map substrate layer
Spend range 2-10mm, the first high-intensitive substrate layer and third high intensity substrate layer are secondary substrate layer, the first high-intensitive substrate layer and
The thickness range of third high intensity substrate layer is 0.2-3mm.
Preferably, in step 6, the first high-intensitive substrate layer and the second fretting map substrate layer pass through multiple groups setting roll, the
One high-intensitive substrate layer upper surface contacts preliminary cooling and shaping with setting roll；Third high intensity substrate layer lower surface connects with setting roll
Touching slightly cooling and shaping.
Preferably, it in step 7, keeps the temperature through the progress temperature-compensating of electric heating constant temperature cover to keep constant temperature, the electricity
Heated constant temperature cover is made of heat-generating pipe, temperature probe and controller.
Preferably, in step 8, sound absorbing layer is the flexible foamed material system with flexible nature and significant sound-absorbing effect
At sound absorbing layer is fitted in below third high intensity substrate layer by the waste heat of joint product semi-finished product.
Compared with the prior art, the invention has the advantages that:
Hyaline layer and color film layer are bonded by combined heated roller with the first high-intensitive substrate layer, the first high-intensitive substrate layer, second
Fretting map substrate layer is made from third high intensity substrate layer according to different formulas, by different extruder barrels, and
Realize that integration is compound by same mold co-extrusion；Third high intensity substrate layer and sound absorbing layer are realized by combined heated roller to be pasted
It closes, and then reaches integrated effect, entire recombination process compares more traditional EPC product without using glue, reduces process and drop
While inexpensive, keep product more environmentally-friendly.
It is cut into specified specification after multilayered structure fitting is integral, then passes sequentially through 100 DEG C of hot water storgaes, 60 DEG C of warm water
Slot, 30 DEG C of cold rinse banks are heat-treated, and are then air-dried, and heat treatment procedure is all made of caterpillar conveyer belt, are so passed through in product
When the sink of different temperature zones, it is ensured that obvious deformation will not occur because of temperature change in product, complete to protect while conveying
The flatness of product is demonstrate,proved.Most importantly pass through heat treatment procedure, eliminates product in the drawing for squeezing out with generating in distraction procedure
Stress is stretched, ensure that the shrinkage of finished product reaches iso standard, surmounts the common generic product in market.
Detailed description of the invention
Fig. 1 is the structure chart of hard or the high anti-shrink EPC composite floor board of semi-rigid in one embodiment of the invention.
Fig. 2 is process equipment composition figure in one embodiment of the invention.
Fig. 3 is the process equipment composition figure being connected in one embodiment of the invention with Fig. 2 phase.
Fig. 4 is the location diagram of extruder one and extruder two in one embodiment of the invention.
Specific embodiment
In order to facilitate the understanding of those skilled in the art, making below in conjunction with specific embodiments and drawings to the present invention further
Detailed description.
Fig. 1-4 is please referred to, the embodiment of the present invention includes:
A kind of hard or the high anti-shrink EPC composite floor board of semi-rigid include the hyaline layer 1 being successively bonded, color film layer from top to bottom
2, the first high-intensitive substrate layer 3, the second fretting map substrate layer 4, third high intensity substrate layer 5, sound absorbing layer, hyaline layer, color film layer,
First high-intensitive substrate layer, the second fretting map substrate layer, third high intensity substrate layer, sound-absorbing interlayer are not provided with glue.
A kind of manufacture craft of hard or the high anti-shrink EPC composite floor board of semi-rigid, comprising the following steps:
Step 1: according to the weighing of high-intensitive substrate layer formula, the high-intensitive substrate layer of configuration first and third high intensity substrate layer
Raw material, according to the weighing of fretting map substrate layer formula, the raw material of the second fretting map substrate layer of configuration.
It is stirred Step 2: configured raw material are put into respectively in blender 1 and blender 2 24, temperature
It is set as 120 DEG C, blender 1 and 2 24 revolving speed of blender are set as 1500 turns/min, when the temperature of mixture rises to
The valve of thermal agitation machine 11 is opened after 120 DEG C, and the material that blender 1 and blender 2 24 are stirred, is put into respectively
Cold stirring is carried out into each self cooling blender 12, the temperature of mixture is begun to decline, and temperature is set as 45 DEG C, when the temperature of mixture
Degree opens cold 12 valve of blender after dropping to 45 DEG C, and by blender 1 and the stirred material of blender 2 24, respectively
Put into respective storage bin 13；Thermal agitation machine 11, cold blender 12, storage bin 13 are put in step, and thermal agitation machine 11 is in
A high position, storage bin 13 are in low level.
Step 3: the mixture in blender 1 to be transported to the storing of one 26 top of extruder by screw feeding machine 14
Mixture in blender 2 24 is transported extruder 2 15, blender 1 and stirring by matched screw feeding machine by tank
The mixture that machine 2 24 is stirred passes through respective screw rod conveyor respectively and is transported to respective machine barrel storage tank, using respective feeding
Motor is fed to extruder 1 and the machine barrel of extruder 2 15 carries out heating plasticizing, one 26 machine barrel of extruder and two machine barrel of extruder
27 put in 45° angle；3, extruder 1 and 2 barrel temperatures set of extruder are following table data.
Step 4: extruder 1 and the good material of 2 15 heating plasticizing of extruder, which pass through distributor, reaches mold, adjustment
Extrusion molding after the predetermined thickness of first high-intensitive substrate layer 3, the second fretting map substrate layer 4 and third high intensity substrate layer 5；
It regard the second fretting map substrate layer 4 as main substrate layer, the thickness of the second fretting map substrate layer 4 is greater than the first high-intensitive substrate layer 3
With the thickness of third high intensity substrate layer 5；First high-intensitive substrate layer 3, third high intensity substrate layer 5 and the second fretting map substrate
4 co-extruding mould temperature of layer are set as following table data.
Step 5: squeezing out preliminary molding material, by thickness measuring roller 16, the first high-intensitive substrate layer of specified thickness is obtained
3, the second fretting map substrate layer 4 and third high intensity substrate layer 5；Thickness measuring roller 16 is to keep predetermined temperature and with certain pressure
Smooth roll, temperature are set as 180 DEG C -190 DEG C, are not in adhesion when material passes through, and achieve the effect that control thickness.
Step 6: the first high-intensitive substrate layer 3, the second fretting map substrate layer 4 and third high intensity substrate layer 5 pass through multiple groups
It is connected with the setting roll of conduction oil with pressure cocurrent, temperature is set as 60 DEG C -120 DEG C, the first high-intensitive 3 upper surface of substrate layer and fixed
Type roller contacts preliminary cooling and shaping, and third high intensity substrate layer lower surface contacts slightly cooling and shaping with setting roll.
Step 7: the first high-intensitive substrate layer 3, the second fretting map substrate layer 4 and the heat preservation of third high intensity substrate layer 5 are passed through
Color film layer overlay film roller 17, overlay film roll temperature are set as 140 DEG C, and color film layer 2 is fitted to the first high-intensitive substrate via overlay film roller
3 surface of layer；It is kept the temperature again by hyaline layer overlay film roller 18, overlay film roll temperature is set as 140 DEG C, and hyaline layer 1 is pasted via overlay film roller
It closes in color film layer 2；Heat preservation by electric heating constant temperature cover carry out temperature-compensating to keep constant temperature, the electric heating constant temperature cover by
Heat-generating pipe, temperature probe and controller composition, can intelligently adjust temperature after setting required temperature, to reach heat insulation effect.
Step 8: sound absorbing layer to be fitted to third substrate layer from below, hence it is evident that promote sound-absorbing effect.
Step 9: the semi-finished product after dragger will be compound are transported to tracking mode plate shearing machine through powered carriage, it is cut into and sets
Establish rules lattice, using 3 sections of caterpillar conveyer belts pass sequentially through 19,60 DEG C of 100 DEG C of hot water storgaes, 20,30 DEG C of warm water tank cold rinse bank 21 into
Row heat treatment, then reach manipulator 23 after 22 cooling air-drying of air curtain cooler and realize automatic material receiving；This section of heat treatment procedure is equal
Using caterpillar conveyer belt, when sink so in product Jing Guo different temperature zones, it is ensured that product will not be because of temperature change
And there is obvious deformation, complete the flatness that ensure that product while conveying.Most importantly pass through heat treatment procedure, eliminates
Product ensure that the shrinkage of finished product reaches iso standard, surmount market in the tensile stress for squeezing out with generating in distraction procedure
Common generic product.
Step 10: it is preliminary it is compound after the completion of semi-finished product through lamination, cut, slot, can be put in storage after product examine packaging, the work
Sequence is routine techniques of the same trade, and details are not described herein.
Although description of this invention combination embodiments above carries out, those skilled in the art
Member can carry out many replacements based on the above contents, modifications and variations, be obvious.Therefore, all such substitutions,
Improvements and changes are included in the spirit and scope of appended claims.
Claims (10)
1. a kind of hard or the high anti-shrink EPC composite floor board of semi-rigid, which is characterized in that saturating including being successively bonded from top to bottom
Bright layer, color film layer, three-layer co-extruded composite base material layer, sound absorbing layer, the three-layer co-extruded composite base material layer is by the first high-intensitive substrate
Layer, the second fretting map substrate layer, third high intensity substrate layer are constituted, the hyaline layer, color film layer, the first high-intensitive substrate layer,
Second fretting map substrate layer, third high intensity substrate layer binding face be not provided with glue.
2. a kind of high intensity substrate layer formula, which is characterized in that be made of following material component: 50-75 parts of PVC powder, mountain flour
150-250 parts, 4-8 parts of stabilizer, 1.5-3 parts of lubricant, 5-12 parts of toughener, 0.2-1.2 parts of plasticizer, 0-3 parts of toner.
3. a kind of fretting map substrate layer formula, which is characterized in that be made of following material component: 50-75 parts of PVC powder, mountain flour
150-250 parts, 3-6 parts of stabilizer, 1-2.5 parts of lubricant, 5-12 parts of toughener, 0.2-1.2 parts of plasticizer, foaming control agent 4-
8 parts, 0.2-1 parts of foaming agent, 0-3 parts of toner.
4. the manufacture craft of a kind of hard or the high anti-shrink EPC composite floor board of semi-rigid, which comprises the following steps:
Step 1: according to the weighing of high-intensitive substrate layer formula, the high-intensitive substrate layer of configuration first and third high intensity substrate layer
Raw material, according to the weighing of fretting map substrate layer formula, the raw material of the second fretting map substrate layer of configuration；
It is stirred Step 2: configured raw material are put into respectively in blender one and blender two；When the temperature of mixture
Degree rises to after default heating temperature and opens the valve of thermal agitation machine, and by the object after two thermal agitation of blender one and blender
Material is put into and carries out cold stirring in cold blender, and the temperature of mixture is begun to decline, when the temperature of mixture drop to preset it is cold
But each cold blender valve is opened after temperature, material respectively enters respective storage bin；
Step 3: the mixture in blender one is transported extruder one by screw feeding machine, will be stirred by screw feeding machine
Mixture in machine two transports extruder two；
Step 4: extruder one and the good material of two heating plasticizing of extruder reach mold by distributor, it is high to adjust first
Extrusion molding after the predetermined thickness of intensity substrate layer and the second fretting map substrate layer；
Step 5: squeezing out preliminary molding material, by thickness measuring roller, the first high-intensitive substrate layer and second of specified thickness is obtained
Fretting map substrate layer；
Step 6: three-layer co-extruded composite base material layer is connected with the setting roll of conduction oil by multi-group pressure cocurrent, temperature is set as
60 DEG C -120 DEG C,
Step 7: three-layer co-extruded composite base material layer heat preservation is by color film layer overlay film roller, overlay film roll temperature is set as 130 DEG C -150
DEG C, color film layer is fitted into the first high-intensitive substrate layer surface via overlay film roller；Then hyaline layer overlay film roller, overlay film are passed through in heat preservation
Roll temperature is set as 130 DEG C -150 DEG C, and hyaline layer is fitted in color film layer via overlay film roller；
Step 8: sound absorbing layer to be fitted to third substrate layer from below；
Step 9: the semi-finished product after dragger will be compound are transported to tracking mode plate shearing machine through powered carriage, it is cut into setting rule
Lattice, using 3 sections of caterpillar conveyer belts pass sequentially through 90 DEG C of -100 DEG C of hot water storgaes, 55 DEG C of -65 DEG C of warm water tanks, 25 DEG C -35 DEG C it is cold
Sink is heat-treated, then is reached manipulator after air curtain cooler cooling air-drying and realized automatic material receiving.
5. the manufacture craft of hard according to claim 4 or the high anti-shrink EPC composite floor board of semi-rigid, feature exist
In in step 2, the default heating temperature is set as 110 DEG C -130 DEG C, and blender one and two revolving speed of blender are set as
1200-1800 turns/min, and the default cooling temperature is set as 40 DEG C -50 DEG C, the thermal agitation machine, cold blender, storage bin
It is put in step, thermal agitation machine is in a high position, and storage bin is in low level.
6. the manufacture craft of hard according to claim 4 or the high anti-shrink EPC composite floor board of semi-rigid, feature exist
In in step 3, the mixture in the blender one and blender two passes through feeding motor respectively and is fed to extruder one and squeezes
The machine barrel of machine two carries out heating plasticizing out, and one machine barrel of extruder is put with two machine barrel of extruder in 30 ° of -60 ° of angles.
7. the manufacture craft of hard according to claim 4 or the high anti-shrink EPC composite floor board of semi-rigid, feature exist
In, in step 4, using the second fretting map substrate layer as main substrate layer, the thickness range 2-10mm of the second fretting map substrate layer,
First high-intensitive substrate layer and third high intensity substrate layer are secondary substrate layer, the first high-intensitive substrate layer and third high intensity substrate
The thickness range of layer is 0.2-3mm.
8. the manufacture craft of hard according to claim 4 or the high anti-shrink EPC composite floor board of semi-rigid, feature exist
In in step 6, the first high-intensitive substrate layer and the second fretting map substrate layer pass through multiple groups setting roll, the first high-intensitive substrate layer
Upper surface contacts preliminary cooling and shaping with setting roll；Third high intensity substrate layer lower surface contacts slightly cooling fixed with setting roll
Type.
9. the manufacture craft of hard according to claim 4 or the high anti-shrink EPC composite floor board of semi-rigid, feature exist
In described to keep the temperature through the progress temperature-compensating of electric heating constant temperature cover to keep constant temperature in step 7, the electric heating constant temperature cover
It is made of heat-generating pipe, temperature probe and controller.
10. the manufacture craft of hard according to claim 4 or the high anti-shrink EPC composite floor board of semi-rigid, feature exist
In in step 8, the sound absorbing layer is made of the flexible foamed material with flexible nature and significant sound-absorbing effect, the sound-absorbing
Layer is fitted in below third high intensity substrate layer by the waste heat of joint product semi-finished product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910525133.3A CN110295721A (en) | 2019-06-18 | 2019-06-18 | A kind of hard or the high anti-shrink EPC composite floor board of semi-rigid and its manufacture craft |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910525133.3A CN110295721A (en) | 2019-06-18 | 2019-06-18 | A kind of hard or the high anti-shrink EPC composite floor board of semi-rigid and its manufacture craft |
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| CN110295721A true CN110295721A (en) | 2019-10-01 |
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| CN201910525133.3A Pending CN110295721A (en) | 2019-06-18 | 2019-06-18 | A kind of hard or the high anti-shrink EPC composite floor board of semi-rigid and its manufacture craft |
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| CN (1) | CN110295721A (en) |
Cited By (2)
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| CN113524844A (en) * | 2021-08-09 | 2021-10-22 | 南京赛旺科技发展有限公司 | Novel halogen-free environment-friendly floor and production process thereof |
| CN114633413A (en) * | 2022-03-14 | 2022-06-17 | 南京赛旺科技发展有限公司 | Process method for producing EPC (electronic product code) floor |
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