CN110287585A - A kind of PCB layout method of non-isolated Switching Power Supply - Google Patents
A kind of PCB layout method of non-isolated Switching Power Supply Download PDFInfo
- Publication number
- CN110287585A CN110287585A CN201910544089.0A CN201910544089A CN110287585A CN 110287585 A CN110287585 A CN 110287585A CN 201910544089 A CN201910544089 A CN 201910544089A CN 110287585 A CN110287585 A CN 110287585A
- Authority
- CN
- China
- Prior art keywords
- circuit
- pcb
- pcb board
- function element
- power supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/36—Circuit design at the analogue level
- G06F30/367—Design verification, e.g. using simulation, simulation program with integrated circuit emphasis [SPICE], direct methods or relaxation methods
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/392—Floor-planning or layout, e.g. partitioning or placement
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2115/00—Details relating to the type of the circuit
- G06F2115/06—Structured ASICs
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
- G06F2119/08—Thermal analysis or thermal optimisation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Evolutionary Computation (AREA)
- Geometry (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Architecture (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a kind of PCB layout methods of non-isolated Switching Power Supply, more particularly to power circuit field, specifically includes the following steps: Step 1: determining each element, Step 2: 3D modeling is distributed, Step 3: circuit simulation, Step 4: export plane assembles drawing, Step 5: detection scanning is checked and approved, Step 6: field test.The present invention is using 3D software to pcb board, each function element, periphery object when route and PCB actual installation, plan power supply and other function element, recycle voltage and current and fever heat dispersal situations of the Multisim circuit simulating software analog circuit after being actually powered, so that it is determined that the preferred plan of pcb board layout, drawing is exported for builder's assembling, after assembling, the pcb board after installation is scanned using laser scanner, improve the position of adjustment function element, finally through temperature sensor and voltage-current sensor detection circuit and carry out pressure-bearing test again, guarantee that layout is optimal.
Description
Technical field
The present invention relates to power circuit technical fields, it is more particularly related to a kind of non-isolated Switching Power Supply
PCB layout method.
Background technique
One of Switching Power Supply common problem encountered is that " unstable " switching waveform.Sometimes, waveform shake is in sound wave
Section, magnetic element can produce audio-frequency noise.If problem goes out in the layout of printed circuit board, to find out reason may be very
It is difficult.Therefore, the correct PCB layout at Switching Power Supply design initial stage is just very crucial；
The design of PCB is divided into " layout " and " wiring " two stages, and so-called " layout " is exactly to arrive used in designing principle
The considerations of all components are laid on PCB, lay determination including component locations, component direction is subsequent " cloth
Line " is prepared.
The patent of invention of 107484344 A of patent application publication CN discloses a kind of based on core chips PIN foot
PCB layout method comprising the steps of: 1), determine core chips in PCB design；2), the PIN foot of core chips is carried out
Function confirmation；3) functional regional division, is carried out by function to the PIN foot of core chips；4), according to the functional area of core chips
Division, supplement corresponding functional circuit unit on the periphery of the corresponding functional area of core chips；5), according to entire PCB
Power supply requirement and power connector position, while considering the thermal balance of entire PCB, determine the placement of power supply chip；6),
According to the clock service condition of entire PCB, the placement of clock chip is determined.
But provided in above-mentioned technical proposal it is a kind of based on the PCB layout method of core chips PIN foot in practice
When, still there is more disadvantage, such as such layout method is to carry out region division according to function, in the corresponding function of core chips
The periphery in energy region supplements corresponding functional circuit unit, the position of core chips has only been determined, for the position of peripheral element
Deep analysis is not made with function, the position of components installation and wiring on periphery are inaccurate, will affect the steady of core chips
Fixed, heat dissipation etc., this layout type is too simple.
Summary of the invention
In order to overcome the drawbacks described above of the prior art, the embodiment of the present invention provides a kind of non-isolated Switching Power Supply
PCB layout method, periphery object when by using 3D software to pcb board, each function element, route and PCB actual installation
Body plans power supply and other function element, recycles Multisim circuit simulating software analog circuit after being actually powered
Voltage and current and fever heat dispersal situations, so that it is determined that the preferred plan of pcb board layout, export drawing assemble for builder,
After assembling, the pcb board after installation is scanned using laser scanner, the position of adjustment function element is improved, finally passes through again
Voltage and current and heat dissipation when temperature sensor and voltage-current sensor detection practical application, and pressure-bearing test is carried out, it protects
Card layout is optimal, and avoiding going wrong in the later period leads to the damage of product.
To achieve the above object, the invention provides the following technical scheme: a kind of layout side PCB of non-isolated Switching Power Supply
Method, specifically includes the following steps:
Step 1: determine each element, firstly, determining needs all of all function element to be mounted and formation on pcb board
Circuit determines the model, number and height of each function element, and all function element information is summarized through computer input,
And the circuit connection drawing of each circuit on PCB is obtained by search computer or directly from user；
Step 2: 3D modeling is distributed, PCB Designer referring to circuit connection drawing, and by 3D Software on Drawing pcb board and
Each function element, and when pcb board is specifically installed around product structure, be plotted in 3D software according to actual distribution situation
Around pcb board, each function element is then subjected to distributed-hierarchical, specific distributed-hierarchical according to connection circuit on pcb board again
Method is as follows:
A. dc/dc power supply is placed on pcb board first, and guarantees that dc/dc power supply is located at pcb board edge and exports close to negative
The position of device is carried, and preferably by dc/dc power supply close to position of fan setting and far from the heat radiating structure of product；
B. according to each circuit distribution map, on the basis of not influencing circuit holding and consistent high current cabling, by each function element
It is divided into multiple rows of, there are air draft gaps between every row, and are as far as possible distributed element from low to high, and lower element is close
Fan setting；
C. when multilayer circuit board is distributed, between the power component layer of high current and the small signal lead layer of sensitivity with laying direct current
Or direct current input/output voltage layer, and it is respectively provided with insulation rubber mat on stratum or direct current pressurized layer top bottom edge, provide screen
The AC deposition for covering small signal lead, protects it from the interference of strong noise power cabling and power component, and makes to stay between multilayer
There is airspace；
D. it when multilayer circuit board is distributed, avoids laying sensitive signal wire below power supply, not be avoided that, in bus plane and small letter
An internal grounded layers are placed between number floor, are used as shielding, and in power switch output end installation small capacitances；
Step 3: circuit simulation will be drawn when being drawn the pcb board after each function element of connection installation successfully using 3D software
The circuit distributing position and cabling obtained after system is input in Multisim circuit simulating software, and PCB Designer passes through
Voltage and current and fever heat dispersal situations of the Multisim circuit simulating software analog circuit after being actually powered, pass through testing number
According to PCB Designer rule of thumb adjusts the position of each function element and wiring in 3D software, then imports again
In Multisim circuit simulating software, breadboardin is carried out, until each function element and circuit trace distribution on pcb board are closed
It manages and is preferred plan；
Step 4: export plane assembles drawing, by every layer in 3D software of pcb board layering export plan view, and pass through printer
Plan view is printed, is assembled for the later period；
Step 5: detection scanning is checked and approved, the pcb board after installation is scanned by laser scanner, the drawing scanned
It is compared with plan view, obtains deviation data, to judge whether assembled position is correct, if incorrect, according to comparison
Data difference adjusts the position of function element, then scans again, until scanning is completed；
Step 6: field test is passed when pcb board is installed in physical product in its crown member or the setting of route junction
Sensor, and voltage-current sensor is connected in the connection line of critical elements, be finally powered detection on probation, and observation temperature passes
Whether within the set range sensor and the numerical value of voltage-current sensor detection, and carry out pressure-bearing test, and observation is held in maximum
Pressure, detection numerical value whether within the set range, if taking-out temperature sensor and voltage-current sensor, product can be with
It uses, if not existing, is analyzed again according to the numerical value of detection, the problem of finding out is adjusted, and summing up experience, in next PCB
When layout simulation analyzes, it is adjusted for same problem.
In a preferred embodiment, in a step of the step 2, dc/dc power supply is close to position of fan side
And it is located at pcb board edge.
In a preferred embodiment, in the b step of the step 2, the function element in each circuit can account for two
Positions more than row or two rows, and guarantee each element aggregation linearly connection, the cabling between each element is straight line, guarantees row
Connection line quantity between row in air draft gap is at most or longest.
In a preferred embodiment, temperature sensor and voltage-current sensor pass through A/D in the step 6
Converter connects external PLC controller.
Technical effect and advantage of the invention:
1, the present invention utilizes periphery object of the 3D software to pcb board, each function element, route and PCB actual installation when, planning
Power supply and other function element recycle voltage and current of the Multisim circuit simulating software analog circuit after being actually powered
And fever heat dispersal situations, so that it is determined that the preferred plan of pcb board layout, exports drawing for builder's assembling, after assembling, benefit
The pcb board after installation is scanned with laser scanner, the position of adjustment function element is improved, finally again through temperature sensor
Voltage and current and heat dissipation when detecting practical application with voltage-current sensor, and carry out pressure-bearing test, guarantee that layout is optimal,
It avoids going wrong in the later period and leads to the damage of product；
2, by far from heat radiating structure and close to fan and minimizing and blocking the positions of other elements dc/dc power source planning
It sets, multiple rows of by the way that each function element to be divided into, there are air draft gaps between every row, and as far as possible divide element from low to high
Cloth, and lower element is arranged close to fan, the function element in each circuit can account for the position of two or more rows, and
Guarantee each element aggregation linearly connection, the cabling between each element is straight line, guarantees the company in air draft gap between row and row
At most or longest, to make entirely to be laid out lower power supply and each element radiating effect is good, power supply is minimized and is blocked link quantity
Other elements, and the heat dissipation of other elements, long service life are not influenced；
3, when multilayer circuit board is distributed, between the power component layer of high current and the small signal lead layer of sensitivity with laying direct current
Or direct current input/output voltage layer, and it is respectively provided with insulation rubber mat on stratum or direct current pressurized layer top bottom edge, provide screen
The AC deposition for covering small signal lead, protects it from the interference of strong noise power cabling and power component, and makes to stay between multilayer
There is airspace, convenient for heat dissipation, prolongs the service life；
4, it when multilayer circuit board is distributed, avoids laying sensitive signal wire below power supply, not be avoided that, in bus plane and small letter
An internal grounded layers are placed between number floor, are used as shielding, and install small capacitances additional in power switch output end, reduction power supply is opened
Noise when pass avoids the signal of interference other elements.
Specific embodiment
Technical solution is clearly and completely described below in conjunction with specific embodiment, it is clear that described embodiment
Only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, the common skill in this field
Art personnel every other embodiment obtained without making creative work belongs to the model that the present invention protects
It encloses.
Embodiment 1:
The present invention provides a kind of PCB layout methods of non-isolated Switching Power Supply, specifically includes the following steps:
Step 1: determine each element, firstly, determining needs all of all function element to be mounted and formation on pcb board
Circuit determines the model, number and height of each function element, and all function element information is summarized through computer input,
And the circuit connection drawing of each circuit on PCB is obtained by search computer or directly from user；
Step 2: 3D modeling is distributed, PCB Designer referring to circuit connection drawing, and by 3D Software on Drawing pcb board and
Each function element, and when pcb board is specifically installed around product structure, be plotted in 3D software according to actual distribution situation
Around pcb board, each function element is then subjected to distributed-hierarchical, specific distributed-hierarchical according to connection circuit on pcb board again
Method is as follows:
A. dc/dc power supply is placed on pcb board first, and guarantees that dc/dc power supply is located at pcb board edge and exports close to negative
The position of device is carried, and preferably by dc/dc power supply close to position of fan setting and far from the heat radiating structure of product, dc/dc electricity
Source is close to position of fan side and is located at pcb board edge；
B. according to each circuit distribution map, on the basis of not influencing circuit holding and consistent high current cabling, by each function element
It is divided into multiple rows of, there are air draft gaps between every row, and are as far as possible distributed element from low to high, and lower element is close
Fan is arranged, and the function element in each circuit can account for the position of two or more rows, and guarantees each element aggregation in straight
Line connection, the cabling between each element are straight line, guarantee connection line quantity in air draft gap between row and row at most or most
It is long；
C. when multilayer circuit board is distributed, between the power component layer of high current and the small signal lead layer of sensitivity with laying direct current
Or direct current input/output voltage layer, and it is respectively provided with insulation rubber mat on stratum or direct current pressurized layer top bottom edge, provide screen
The AC deposition for covering small signal lead, protects it from the interference of strong noise power cabling and power component, and makes to stay between multilayer
There is airspace；
D. it when multilayer circuit board is distributed, avoids laying sensitive signal wire below power supply, not be avoided that, in bus plane and small letter
An internal grounded layers are placed between number floor, are used as shielding, and in power switch output end installation small capacitances；
Step 3: circuit simulation will be drawn when being drawn the pcb board after each function element of connection installation successfully using 3D software
The circuit distributing position and cabling obtained after system is input in Multisim circuit simulating software, and PCB Designer passes through
Voltage and current and fever heat dispersal situations of the Multisim circuit simulating software analog circuit after being actually powered, pass through testing number
According to PCB Designer rule of thumb adjusts the position of each function element and wiring in 3D software, then imports again
In Multisim circuit simulating software, breadboardin is carried out, until each function element and circuit trace distribution on pcb board are closed
It manages and is preferred plan；
Step 4: export plane assembles drawing, by every layer in 3D software of pcb board layering export plan view, and pass through printer
Plan view is printed, is assembled for the later period；
Step 5: detection scanning is checked and approved, the pcb board after installation is scanned by laser scanner, the drawing scanned
It is compared with plan view, obtains deviation data, to judge whether assembled position is correct, if incorrect, according to comparison
Data difference adjusts the position of function element, then scans again, until scanning is completed；
Step 6: field test is passed when pcb board is installed in physical product in its crown member or the setting of route junction
Sensor, and voltage-current sensor is connected in the connection line of critical elements, be finally powered detection on probation, and observation temperature passes
Whether within the set range sensor and the numerical value of voltage-current sensor detection, and carry out pressure-bearing test, and observation is held in maximum
Pressure, detection numerical value whether within the set range, if taking-out temperature sensor and voltage-current sensor, product can be with
It uses, if not existing, is analyzed again according to the numerical value of detection, the problem of finding out is adjusted, and summing up experience, in next PCB
When layout simulation analyzes, it is adjusted for same problem.
Periphery object when by using 3D software to pcb board, each function element, route and PCB actual installation, planning
Power supply and other function element recycle voltage and current of the Multisim circuit simulating software analog circuit after being actually powered
And fever heat dispersal situations, so that it is determined that the preferred plan of pcb board layout, exports drawing for builder's assembling, after assembling, benefit
The pcb board after installation is scanned with laser scanner, the position of adjustment function element is improved, finally again through temperature sensor
Voltage and current and heat dissipation when detecting practical application with voltage-current sensor, and carry out pressure-bearing test, guarantee that layout is optimal,
It avoids going wrong in the later period and leads to the damage of product.
Embodiment 2:
Temperature sensor connects external PLC controller by A/D converter with voltage-current sensor in the step 6, described
Temperature sensor model is set as WZP-PT100, and the voltage current sensor model is set as HS-V610M, passes through temperature
Sensor and temperature and voltage and current analog quantity information on voltage-current sensor detection pcb board are spent, analog quantity information is through A/D
Converter is converted to digital information and is sent to external PLC controller, and whether within the set range PLC controller judges numerical value,
And by the more loads of PLC controller control access, implements more functions and carry out pressure-bearing test, observe in maximum pressure-bearing
Under, whether within the set range numerical value is detected, if taking-out temperature sensor and voltage-current sensor, product can make
With if not existing, PLC controller will test the temperature sensor to go wrong or voltage-current sensor position is shown, be convenient for work
People finder is convenient for post analysis to problem position.
The several points that should finally illustrate are: firstly, in the description of the present application, it should be noted that unless otherwise prescribed and
It limits, term " installation ", " connected ", " connection " shall be understood in a broad sense, can be mechanical connection or electrical connection, be also possible to two
Connection inside element, can be directly connected, and "upper", "lower", "left", "right" etc. are only used for indicating relative positional relationship, when
The absolute position for being described object changes, then relative positional relationship may change；
Secondly, the present invention discloses in embodiment, the structure being related to the embodiment of the present disclosure is related only to, other structures can refer to
It is commonly designed, under not conflict situations, the same embodiment of the present invention and different embodiments be can be combined with each other；
Finally, the foregoing is only a preferred embodiment of the present invention, it is not intended to restrict the invention, it is all in essence of the invention
Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (4)
1. a kind of PCB layout method of non-isolated Switching Power Supply, it is characterised in that: specifically includes the following steps:
Step 1: determine each element, firstly, determining needs all of all function element to be mounted and formation on pcb board
Circuit determines the model, number and height of each function element, and all function element information is summarized through computer input,
And the circuit connection drawing of each circuit on PCB is obtained by search computer or directly from user；
Step 2: 3D modeling is distributed, PCB Designer referring to circuit connection drawing, and by 3D Software on Drawing pcb board and
Each function element, and when pcb board is specifically installed around product structure, be plotted in 3D software according to actual distribution situation
Around pcb board, each function element is then subjected to distributed-hierarchical, specific distributed-hierarchical according to connection circuit on pcb board again
Method is as follows:
A. dc/dc power supply is placed on pcb board first, and guarantees that dc/dc power supply is located at pcb board edge and exports close to negative
The position of device is carried, and preferably by dc/dc power supply close to position of fan setting and far from the heat radiating structure of product；
B. according to each circuit distribution map, on the basis of not influencing circuit holding and consistent high current cabling, by each function element
It is divided into multiple rows of, there are air draft gaps between every row, and are as far as possible distributed element from low to high, and lower element is close
Fan setting；
C. when multilayer circuit board is distributed, between the power component layer of high current and the small signal lead layer of sensitivity with laying direct current
Or direct current input/output voltage layer, and it is respectively provided with insulation rubber mat on stratum or direct current pressurized layer top bottom edge, provide screen
The AC deposition for covering small signal lead, protects it from the interference of strong noise power cabling and power component, and makes to stay between multilayer
There is airspace；
D. it when multilayer circuit board is distributed, avoids laying sensitive signal wire below power supply, not be avoided that, in bus plane and small letter
An internal grounded layers are placed between number floor, are used as shielding, and in power switch output end installation small capacitances；
Step 3: circuit simulation will be drawn when being drawn the pcb board after each function element of connection installation successfully using 3D software
The circuit distributing position and cabling obtained after system is input in Multisim circuit simulating software, and PCB Designer passes through
Voltage and current and fever heat dispersal situations of the Multisim circuit simulating software analog circuit after being actually powered, pass through testing number
According to PCB Designer rule of thumb adjusts the position of each function element and wiring in 3D software, then imports again
In Multisim circuit simulating software, breadboardin is carried out, until each function element and circuit trace distribution on pcb board are closed
It manages and is preferred plan；
Step 4: export plane assembles drawing, by every layer in 3D software of pcb board layering export plan view, and pass through printer
Plan view is printed, is assembled for the later period；
Step 5: detection scanning is checked and approved, the pcb board after installation is scanned by laser scanner, the drawing scanned
It is compared with plan view, obtains deviation data, to judge whether assembled position is correct, if incorrect, according to comparison
Data difference adjusts the position of function element, then scans again, until scanning is completed；
Step 6: field test is passed when pcb board is installed in physical product in its crown member or the setting of route junction
Sensor, and voltage-current sensor is connected in the connection line of critical elements, be finally powered detection on probation, and observation temperature passes
Whether within the set range sensor and the numerical value of voltage-current sensor detection, and carry out pressure-bearing test, and observation is held in maximum
Pressure, detection numerical value whether within the set range, if taking-out temperature sensor and voltage-current sensor, product can be with
It uses, if not existing, is analyzed again according to the numerical value of detection, the problem of finding out is adjusted, and summing up experience, in next PCB
When layout simulation analyzes, it is adjusted for same problem.
2. a kind of PCB layout method of non-isolated Switching Power Supply according to claim 1, it is characterised in that: the step
In rapid two a step, dc/dc power supply is close to position of fan side and is located at pcb board edge.
3. a kind of PCB layout method of non-isolated Switching Power Supply according to claim 1, it is characterised in that: the step
In rapid two b step, the function element in each circuit can account for the position of two or more rows, and guarantee each element aggregation
It linearly connects, the cabling between each element is straight line, guarantees that the connection line quantity in air draft gap between row and row is most
Or longest.
4. a kind of PCB layout method of non-isolated Switching Power Supply according to claim 1, it is characterised in that: the step
Temperature sensor connects external PLC controller by A/D converter with voltage-current sensor in rapid six.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910544089.0A CN110287585A (en) | 2019-06-21 | 2019-06-21 | A kind of PCB layout method of non-isolated Switching Power Supply |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910544089.0A CN110287585A (en) | 2019-06-21 | 2019-06-21 | A kind of PCB layout method of non-isolated Switching Power Supply |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110287585A true CN110287585A (en) | 2019-09-27 |
Family
ID=68004806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910544089.0A Pending CN110287585A (en) | 2019-06-21 | 2019-06-21 | A kind of PCB layout method of non-isolated Switching Power Supply |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110287585A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111278227A (en) * | 2020-03-27 | 2020-06-12 | 昆山航宇华电电子科技有限公司 | Layout and wiring method for PCB Layout of SMT32 system mainboard |
| CN113947644A (en) * | 2021-10-15 | 2022-01-18 | 中国核动力研究设计院 | Automatic drawing system of nuclear power plant safety level electrical cabinet hardware drawing |
| CN116321757A (en) * | 2023-05-24 | 2023-06-23 | 深圳市丰达兴线路板制造有限公司 | Precise control method and system for printed circuit board processing |
-
2019
- 2019-06-21 CN CN201910544089.0A patent/CN110287585A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111278227A (en) * | 2020-03-27 | 2020-06-12 | 昆山航宇华电电子科技有限公司 | Layout and wiring method for PCB Layout of SMT32 system mainboard |
| CN111278227B (en) * | 2020-03-27 | 2022-10-25 | 昆山航宇华电电子科技有限公司 | Layout and wiring method for PCB Layout of SMT32 system mainboard |
| CN113947644A (en) * | 2021-10-15 | 2022-01-18 | 中国核动力研究设计院 | Automatic drawing system of nuclear power plant safety level electrical cabinet hardware drawing |
| CN113947644B (en) * | 2021-10-15 | 2023-08-08 | 中国核动力研究设计院 | Automatic drawing system for nuclear power plant safety level electrical cabinet hardware drawing |
| CN116321757A (en) * | 2023-05-24 | 2023-06-23 | 深圳市丰达兴线路板制造有限公司 | Precise control method and system for printed circuit board processing |
| CN116321757B (en) * | 2023-05-24 | 2023-07-21 | 深圳市丰达兴线路板制造有限公司 | Precise control method and system for printed circuit board processing |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110287585A (en) | A kind of PCB layout method of non-isolated Switching Power Supply | |
| CN111278227B (en) | Layout and wiring method for PCB Layout of SMT32 system mainboard | |
| CN104424374B (en) | The scaling method and system of the hot simulation model of circuit board | |
| CN103713265A (en) | Burn-in detection system | |
| CN108133103A (en) | A kind of Electronic Design DFM detecting systems, method and medium | |
| CN106020167B (en) | A kind of anti-collision system test equipment and its test method based on gpib bus interface | |
| CN101065011B (en) | System for generating producing program | |
| CN101782931B (en) | Processing method and system of constraint areas of circuit board wiring | |
| CN206370163U (en) | A kind of aircraft berths visual Intelligent boot device | |
| CN106599351B (en) | A kind of electric drive mobile device low frequency radiation emission characteristics prediction technique | |
| US7975253B2 (en) | Power supply noise analysis model generating method and power supply noise analysis model generating apparatus | |
| US11380618B2 (en) | Power distribution circuitry | |
| CN101815428B (en) | Electromagnetic interference source of Hall sensor of excitation system and determination method of mounting surface thereof | |
| US8584076B2 (en) | Printed circuit board design assisting device, method, and program | |
| CN207703967U (en) | A kind of electromagnetic interference trouble-shooter | |
| JPH1114671A (en) | Current-estimating device | |
| CN101206682A (en) | Object management system and method | |
| CN105557081A (en) | Method for determining validity of compensation matrix during substrate inspection | |
| US20050275423A1 (en) | System and method for checking a layout of circuit traces on a PCB | |
| CN101582094A (en) | Through hole arrangement system and through hole arrangement method | |
| CN102289532A (en) | Multidisciplinary modeling method for integrated electronic equipment based on multidisciplinary mast model technology | |
| CN117269656B (en) | New energy automobile direct current fills electric pile test system | |
| CN209516213U (en) | Fixation kit and its connector for rectangular connector | |
| CN209343164U (en) | A kind of industrial control all-in-one machine | |
| CN216526264U (en) | Linkage testing device for intelligent electric meter |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |