Organic silicon composition
Technical Field
The invention relates to a crosslinkable organic silicon composition, and belongs to the technical field of fine chemical preparations.
Background
The paper industry is an important industry closely related to the development of national economy, and although the dosage of the defoaming agent in the paper industry is small, the defoaming agent plays an extremely important role. In the pulping process of the paper industry, because the pulp contains a large amount of fatty acid soap and resin acid soap foaming substances and cellulose foam stabilizing substances, a large amount of foam is easily generated in the transportation of the pulp, unnecessary troubles and loss are brought to the production, and the alkaline pulp also brings health problems to production workers. Early paper mills used a "clean water bubble" approach to suppress foam formation, but the effect was not ideal. With the rise of the silicone industry and the continuous attention paid to the harm of foam, organopolysiloxane antifoaming agents are beginning to be widely used in the paper industry.
As early as 1968, the preparation research of organopolysiloxane antifoaming agents has been carried out abroad, for example, in US3383327, an antifoaming agent composition is prepared by taking polydimethylsiloxane as a main body, but the antifoaming agent composition has poor foam inhibition performance due to too single structure. In later researches, US3455839 describes a method for preparing a crosslinkable organopolysiloxane defoaming agent composition, and firstly proposes a process for reacting vinyl polysiloxane with hydrogen-containing polysiloxane, so that the later-stage foam inhibition capability of the defoaming agent is improved, but the defoaming property of the defoaming agent is still insufficient; US4690713 teaches to introduce vinyl and phenyl groups into polyorganosiloxanes and to crosslink with hydrogenpolysiloxanes under conditions catalysed by platinum catalysts to give antifoam compositions whose foam suppressing properties do not fully meet the practical requirements of production; US4639489 uses high viscosity hydroxyl terminated polysiloxane to react with ethyl polysilicate under base catalysis to prepare an organopolysiloxane defoamer, but the prepared organosilicon polymer has high viscosity and does not have good defoaming performance; WO2013043487 discloses a method for preparing a defoaming agent composition by crosslinking an organopolysiloxane containing hydroxyl and an organopolysiloxane containing amino at the end chain to generate a crosslinking reaction, but the crosslinking structure is weak, and the defoaming agent composition cannot play a good foam inhibition role in a strong alkali system.
Disclosure of Invention
The invention relates to an organic silicon composition, which is prepared by reacting hydrogen-containing polysiloxane with unsaturated polyether, performing hydrosilylation reaction with dimethyl hydrogen-terminated vinyl polysiloxane after the reaction is finished, performing alkali treatment, effectively controlling crosslinking viscosity through the hydrogen-containing polysiloxane, forming a flowing state crosslinking polymer with a space structure, simultaneously adding the unsaturated polyether, and improving the dispersion performance of the organic silicon composition.
Technical scheme
A silicone composition characterized by consisting of:
A. dimethyl radical end capping vinyl polyorganosiloxane
The dimethyl hydrogen-based end-capped vinyl polyorganosiloxane provided by the invention at least contains two vinyl groups bonded with silicon, and has the following structural general formula:
wherein Me is methyl and Vi is vinyl; r1、R2Is a hydrocarbon radical selected from alkyl radicalsAryl, alkenyl, wherein alkyl is selected from the group consisting of methyl, ethyl, n-propyl, n-butyl, isobutyl, n-pentyl, cyclopentyl, n-hexyl, n-heptyl, n-octyl, isooctyl, n-nonyl, n-decyl, n-dodecyl, and n-octadecyl; aryl is selected from phenyl and benzyl; the alkenyl group is selected from vinyl and allyl. R1、R2Preferably methyl, but R is bound to the same silicon atom1And R2It may not be both vinyl groups and may be both methyl groups. The subscript p is an integer of 100-2000, preferably 500-1500; the subscript q is an integer of 2 to 500, preferably 40 to 300. The kinematic viscosity of the dimethyl hydrogen-terminated vinyl polyorganosiloxane at 25 ℃ is within the range of 100-200,000 mPa.s, and the preferable viscosity is within the range of 3,000-100,000 mPa.s. The amount of the dimethyl hydrogen-based end-capped vinyl polyorganosiloxane accounts for 20-50%, preferably 30-40% of the total mass of the organosilicon composition.
B. Hydrogen-containing polyorganosiloxanes
The hydrogen-containing polyorganosiloxane of the invention refers to polyorganosiloxane containing at least three hydrogen groups bonded to silicon:
wherein Me is methyl, R3、R4Is a hydrocarbyl group selected from the group consisting of alkyl groups, aryl groups, wherein the alkyl groups are selected from the group consisting of methyl, ethyl, n-propyl, n-butyl, isobutyl, n-pentyl, cyclopentyl, n-hexyl, n-heptyl, n-octyl, isooctyl, n-nonyl, n-decyl, n-dodecyl, and n-octadecyl; aryl is selected from phenyl and benzyl. R3、R4Methyl is preferred. The subscript m is an integer of 5-350, preferably an integer of 35-200; the subscript n is an integer of 15-30. The hydrogen-containing polyorganosiloxane has a kinematic viscosity of 10 to 1,000mPa.s at 25 ℃, and preferably has a kinematic viscosity of 40 to 500 mPa.s. The dosage of the hydrogen-containing polyorganosiloxane accounts for 0.01-30%, preferably 5-19% of the total mass of the organic silicon composition.
C. Unsaturated polyethers
The molecular structure general formula of the unsaturated polyether is as follows:
XO(EO)e(PO)fR5
all R in the molecular structure5May be the same or different. It comprises hydrogen atom or monovalent substituted C1-4 alkyl selected from methyl, ethyl, propyl, n-propyl, butyl, preferably more than 80% of substituted groups R5Is a hydrogen atom. X is an initiator group and is 3-10 unsaturated straight chain or branched chain alkyl, including allyl, alpha-butenyl, alpha-pentenyl, alpha-hexenyl, alpha-heptenyl, alpha-octenyl, alpha-nonenyl and alpha-decenyl. X is preferably allyl. Subscripts e and f are polymerization degrees, e is an integer of 1-100, preferably 1-40, and f is an integer of 0-80, preferably 0-60. The dosage of the unsaturated polyether accounts for 0.5-10%, preferably 1-5% of the total mass of the organic silicon composition.
D. Catalyst I
The catalyst I is a noble metal catalyst for promoting hydrosilylation, and is selected from platinum-alcohol complexes, platinum-olefin complexes, platinum-alkoxide complexes, platinum-ether complexes, platinum-ketone complexes, chloroplatinic acid isopropyl alcohol solutions having a chloroplatinic acid concentration of 1%, rhodium-alcohol complexes, rhodium-alkoxide complexes, and preferably chloroplatinic acid isopropyl alcohol solutions having a chloroplatinic acid concentration of 1%. The amount of the catalyst I is 0.0001 to 0.001%, preferably 0.0005 to 0.001%, based on the total mass of the silicone composition.
E. Catalyst II
The catalyst II is selected from potassium hydroxide-isopropanol solution, potassium hydroxide-methanol solution, potassium hydroxide-ethanol solution, potassium hydroxide-methyl polysiloxane mixture, preferably potassium hydroxide-isopropanol solution. The amount of the catalyst II is 0.1-5%, preferably 1-3% of the total weight of the organosilicon composition.
F. Silicon dioxide
The silicon dioxide is hydrophobic silicon dioxide, specifically selected from gas-phase hydrophobic silicon dioxide and precipitation hydrophobic silicon dioxide, and the specific surface area of the silicon dioxide is 50-500 m2(ii) in terms of/g. The content of the silicon dioxide accounts for 2-15 percent of the total mass of the organic silicon composition, and the optimal content is 4 percent~8%。
G. Silicone resin
The organic silicon resin is organic silicon resin containing M and Q units, and the organic silicon resin is formed by chain links CH3SiOl/2(M units) and SiO units4/2(Q unit) in a molar ratio of 0.4:1.0 to 1.2:1.0, preferably 0.5:1.0 to 0.8: 1.0. The amount of the organic silicon resin is 1-15%, preferably 4-8% of the total mass of the organic silicon composition.
H. Solvent(s)
The solvent of the invention is used as a reaction medium of various reactants and is selected from alkane and polysiloxane. Wherein the alkane is C6-C20 saturated hydrocarbon, and is specifically selected from cyclohexane, dodecane and hexadecane; the polysiloxane is polysiloxane without active groups, specifically selected from polymethylsiloxane and polyethylsiloxane, preferably polymethylsiloxane, and the kinematic viscosity of the solvent is 500-2000 mPa.s. The amount of the solvent is 20-70%, preferably 40-50% of the total mass of the organosilicon composition.
A silicone composition is prepared by the following steps:
(1) adding hydrogen-containing polysiloxane B, organic silicon resin G, unsaturated polyether C and a solvent H into a reactor, mixing and stirring uniformly, heating to 50 ℃, adding a catalyst I, reacting for 1-2H at 50-90 ℃, preserving heat, adding dimethyl hydrogen terminated vinyl polysiloxane A, mixing, stirring uniformly, preserving heat, and continuing to react for 1-2H;
(2) and (2) continuing adding a catalyst II into the composition in the step (1), heating to 100-140 ℃, reacting for 0.5-1 h, preserving heat, adding silicon dioxide, mixing, stirring uniformly, reacting for 0.5-1 h under the condition of preserving heat, and cooling to room temperature to obtain the organic silicon composition.
The silicone composition prepared by the present invention can be prepared in the form of an emulsion by a known technique, and the defoaming composition and the emulsifier are mixed, and water and the thickener are gradually added, and after being uniformly mixed, the oil-in-water silicone emulsion is prepared by a mechanical device such as a colloid mill and a homogenizer.
The emulsifier comprises a nonionic surfactant and an anionic surfactant. The nonionic surfactant is selected from polyoxyethylene nonyl phenyl ether, polyoxyethylene octyl phenyl ether, polyoxyethylene lauric acid, polyoxyethylene oleic ether, sorbitan monostearate, sorbitan monooleate, sorbitan tristearate, sorbitan trioleate, polyoxyethylene sorbitan monostearate ether ester, polyoxyethylene sorbitan monooleate ether ester, polyoxyethylene sorbitan tristearate ether ester and polyoxyethylene castor oil polyoxyethylene ether.
The anionic surfactant is selected from sodium dodecyl polyoxyethylene ether sulfate, sodium dodecyl benzene sulfonate, sodium dodecyl sulfonate, sodium hexadecyl benzene sulfonate, and sodium dodecyl diphenyl ether disulfonate.
The above emulsifiers are used alone or in admixture in any proportion.
The thickener is selected from xanthan gum, guar gum, polyvinyl alcohol, sodium carboxymethylcellulose, hydroxyethyl cellulose, polyacrylic acid, polyacrylamide, and polyacrylate.
Detailed Description
Example 1
(1) Into the reactor was charged 100g of (Me) having a viscosity of 90mPa.s2HSiO(Me2SiO)50(MeHSiO)20SiH(Me)240g of a silicone resin (M: Q: 0.5:1.0), 493g of a polymethylsiloxane having a viscosity of 500mPa.s, and 12g of a silicone resin having a CH structure2=CHCH2(EO)20(PO)60H, an unsaturated polyether; mixing, stirring, heating to 50 deg.C, adding 0.005g 1% chloroplatinic acid isopropanol solution, keeping the temperature at 50 deg.C, reacting for 2 hr, adding 300g H (Me) with viscosity of 3000mPa.s2SiO(Me2SiO)500(MeViSiO)40SiH(Me)2Mixing and stirring evenly, and continuing to react for 2 hours at 50 ℃; (2) 14.995g of potassium hydroxide-isopropanol solution is continuously added into the composition in the step (1), and the temperature is raised to 100 ℃ for reaction for 1 h; keeping the temperature, adding 40g of the mixture with the specific surface area of 300m2The hydrophobic silicon dioxide is mixed and stirred evenly for reaction for 1 hour at the temperature of 100 ℃, and the mixture is cooled to the room temperature to obtain the organic silicon composition S1.
Example 2
(1) 50g of (Me) having a viscosity of 500 mPas are charged into the reactor2HSiO(Me2SiO)200(MeHSiO)30SiH(Me)280g of a silicone resin (M: Q ═ 0.8:1.0), 400g of a polymethylsiloxane having a viscosity of 2000mPa.s, and 10g of a silicone resin having a structure of CH2=CHCH2(EO)40(PO)30H, an unsaturated polyether; mixing, stirring, heating to 50 deg.C, adding 0.01g 1% chloroplatinic acid isopropanol solution, heating to 90 deg.C, reacting for 1h, adding 400g H (Me) with viscosity of 100000mPa.s2SiO(Me2SiO)1500(MeViSiO)300SiH(Me)2Mixing and stirring evenly, and continuously reacting for 0.5h at 90 ℃; (2) continuously adding 10g of potassium hydroxide-isopropanol solution into the composition in the step (1), and heating to 140 ℃ for reaction for 30 min; keeping the temperature, adding 49.99g of the mixture with the specific surface area of 500m2The hydrophobic silicon dioxide of the gas phase method is mixed and stirred evenly, the reaction is continued for 30min at the temperature of 140 ℃, and the organosilicon composition S2 is obtained after the reaction is cooled to the room temperature.
Example 3
(1) 190g of (Me) having a viscosity of 40mPa.s are charged into the reactor2HSiO(Me2SiO)35(MeHSiO)15SiH(Me)240g of a silicone resin (M: Q: 0.6:1.0), 500g of a polymethylsiloxane having a viscosity of 1000mPa.s, and 15g of a silicone resin having a CH structure2=CHCH2(EO)(PO)40H, an unsaturated polyether; mixing, stirring, heating to 50 deg.C, adding 0.008g 1% chloroplatinic acid isopropanol solution, heating to 70 deg.C, reacting for 0.8h, adding 300g H (Me) with viscosity of 5000mPa.s2SiO(Me2SiO)600(MeViSiO)60SiH(Me)2Mixing and stirring evenly, and continuously reacting for 1.5h at 70 ℃; (2) 15.008g of potassium hydroxide-isopropanol solution is continuously added into the composition in the step (1), and the temperature is raised to 120 ℃ for reaction for 0.6 h; keeping the temperature, adding 40g of the mixture with the specific surface area of 50m2The hydrophobic silicon dioxide is mixed and stirred evenly at 120 ℃ for further reaction for 30min, and is cooled to room temperature to obtain the organic silicon composition S3.
Example 4
(1) 159.994g of (Me) having a viscosity of 200mPa.s were charged into the reactor2HSiO(Me2SiO)100(MeHSiO)25SiH(Me)240g of a silicone resin (M: Q ═ 0.7:1.0), 400g of hexadecane having a viscosity of 800mPa.s, and 50g of a compound having a structure of CH2=CHCH2(EO)30H, an unsaturated polyether; mixing, stirring, heating to 50 deg.C, adding 0.006g 1% chloroplatinic acid isopropanol solution, heating to 80 deg.C, reacting for 1h, adding 350g H (Me) with viscosity of 10000mPa.s2SiO(Me2SiO)700(MeViSiO)150SiH(Me)2Mixing and stirring evenly, and continuously reacting for 1h at 80 ℃; (2) continuously adding 10g of potassium hydroxide-isopropanol solution into the composition in the step (1), and heating to 130 ℃ for reaction for 1 h; keeping the temperature, adding 40g of the mixture with the specific surface area of 260m2The hydrophobic silicon dioxide is mixed and stirred evenly for further reaction for 30min at the temperature of 130 ℃, and the mixture is cooled to room temperature to obtain the organic silicon composition S4.
Example 5
(1) 59.995g of (Me) having a viscosity of 400mPa.s were charged into the reactor2HSiO(Me2SiO)175(MeHSiO)25SiH(Me)240g of a silicone resin (M: Q: 0.6:1.0), 500g of a polymethylsiloxane having a viscosity of 1500mPa.s, and 10g of a silicone resin having a CH structure2=CHCH2(EO)15(PO)15H, an unsaturated polyether; mixing, stirring, heating to 50 deg.C, adding 0.005g 1% chloroplatinic acid isopropanol solution, heating to 60 deg.C, reacting for 1h, adding 300g H (Me) with viscosity of 30000mPa.s2SiO(Me2SiO)1000(MeViSiO)240SiH(Me)2Mixing and stirring evenly, and continuously reacting for 1h at 60 ℃; (2) continuously adding 10g of potassium hydroxide-isopropanol solution into the composition in the step (1), and heating to 115 ℃ for reacting for 1 h; keeping the temperature, adding 80g of the mixture with the specific surface area of 150m2The hydrophobic silicon dioxide of the gas phase method is mixed and stirred evenly, the reaction is continued for 30min at the temperature of 115 ℃, and the organosilicon composition S5 is obtained after the reaction is cooled to the room temperature.
Example 6
(1) 50g of (Me) having a viscosity of 70mPa.s are charged into the reactor2HSiO(Me2SiO)50(MeHSiO)15SiH(Me)260g of a silicone resin (M: Q: 0.5:1.0), 449.993g of a polymethylsiloxane having a viscosity of 600mPa.s, and 30g of a silicone resin having a CH structure2=CHCH2(EO)10(PO)5H, an unsaturated polyether; mixing, stirring, heating to 50 deg.C, adding 0.007g 1% chloroplatinic acid isopropanol solution, heating to 85 deg.C, reacting for 1h, adding 340g H (Me) with viscosity of 50000mPa.s2SiO(Me2SiO)1200(MeViSiO)150SiH(Me)2Mixing and stirring evenly, and continuously reacting for 1h at 85 ℃; (2) continuously adding 30g of potassium hydroxide-isopropanol solution into the composition in the step (1), and heating to 120 ℃ for reacting for 1 h; keeping the temperature, adding 40g of the mixture with the specific surface area of 300m2The hydrophobic silicon dioxide is mixed and stirred evenly for further reaction for 1 hour at the temperature of 120 ℃, and the mixture is cooled to the room temperature to obtain the organic silicon composition S6.
Example 7
(1) 130g of (Me) having a viscosity of 300 mPas are charged into the reactor2HSiO(Me2SiO)140(MeHSiO)20SiH(Me)250g of a silicone resin (M: Q ═ 0.7:1.0), 420g of a polymethylsiloxane having a viscosity of 1200mPa.s, and 24.995g of a silicone resin having a structure of CH2=CHCH2(EO)5(PO)25H, an unsaturated polyether; mixing, stirring, heating to 50 deg.C, adding 0.005g 1% chloroplatinic acid isopropanol solution, heating to 70 deg.C, reacting for 1h, adding 300g H (Me) with viscosity of 80000mPa.s2SiO(Me2SiO)1500(MeViSiO)190SiH(Me)2Mixing and stirring evenly, and continuously reacting for 1h at 70 ℃; (2) continuously adding 20g of potassium hydroxide-isopropanol solution into the composition in the step (1), and heating to 110 ℃ for reaction for 2 hours; keeping the temperature, adding 55g of the mixture with the specific surface area of 200m2The hydrophobic silicon dioxide of the gas phase method is mixed and stirred evenly, and the reaction is continued for 1h at the temperature of 110 ℃, and the organosilicon composition S7 is obtained after the cooling to the room temperature.
Comparative example 1
(1) Into the reactor was charged 100g of (Me) having a viscosity of 90mPa.s2HSiO(Me2SiO)50(MeHSiO)20SiH(Me)240g of a silicone resin (M: Q ═ 0.5:1.0), 505g of polymethylsiloxane having a viscosity of 500 mpa.s; mixing, stirring, heating to 50 deg.C, adding 0.005g 1% chloroplatinic acid isopropanol solution, keeping the temperature at 50 deg.C, reacting for 2 hr, adding 300g H (Me) with viscosity of 3000mPa.s2SiO(Me2SiO)500(MeViSiO)40SiH(Me)2Mixing and stirring evenly, and continuing to react for 2 hours at 50 ℃; (2) 14.995g of potassium hydroxide-isopropanol solution is continuously added into the composition in the step (1), and the temperature is raised to 100 ℃ for reaction for 1 h; keeping the temperature, adding 40g of the mixture with the specific surface area of 300m2The hydrophobic silicon dioxide is mixed and stirred evenly for reaction for 1 hour at the temperature of 100 ℃, and the mixture is cooled to the room temperature to obtain the organic silicon composition S8.
Comparative example 2
(1) 50g of (Me) having a viscosity of 500 mPas are charged into the reactor2HSiO(Me2SiO)200(MeHSiO)30SiH(Me)280g of a silicone resin (M: Q ═ 0.8:1.0), 800g of a polymethylsiloxane having a viscosity of 2000mPa.s, and 10g of a silicone resin having a structure of CH2=CHCH2(EO)40(PO)30H, an unsaturated polyether; mixing, stirring, heating to 50 deg.C, adding 1% chloroplatinic acid isopropanol solution 0.01g, and heating to 90 deg.C for reaction for 1.5 hr; (2) continuously adding 10g of potassium hydroxide-isopropanol solution into the composition in the step (1), and heating to 140 ℃ for reaction for 30 min; keeping the temperature, adding 49.99g of the mixture with the specific surface area of 500m2The hydrophobic silicon dioxide of the gas phase method is mixed and stirred evenly, the reaction is continued for 30min at the temperature of 140 ℃, and the organosilicon composition S9 is obtained after the reaction is cooled to the room temperature.
Comparative example 3
(1) 190g of (Me) having a viscosity of 40mPa.s are charged into the reactor2HSiO(Me2SiO)35(MeHSiO)15SiH(Me)240g of silicone resin (M: Q ═ 0.6:1.0), 500g of polymethylsiloxane having a viscosity of 1000mPa.s, 300g of H (Me) having a viscosity of 5000mPa.s2SiO(Me2SiO)600(MeViSiO)60SiH(Me)2(ii) a Mixing, stirring, heating to 50 deg.C, adding 0.008g 1% chloroplatinic acid isopropanol solution, heating to 70 deg.C, reacting for 0.8h, adding 15g CH2=CHCH2(EO)(PO)40Mixing unsaturated polyether of H, stirring uniformly, and continuously reacting for 1.5H at 70 ℃; (2) 15.008g of potassium hydroxide-isopropanol solution is continuously added into the composition in the step (1), and the temperature is raised to 120 ℃ for reaction for 0.6 h; keeping the temperature, adding 40g of the mixture with the specific surface area of 50m2Precipitation process hydrophobic silica/gMixing, stirring uniformly, continuing to react for 30min at 120 ℃, and cooling to room temperature to obtain the organic silicon composition S10.
Examples 11 to 20
The organopolysiloxane antifoam composition emulsions were prepared using S1-S10 by the following method:
at room temperature, 40g of the organopolysiloxane antifoam composition, 8g of sorbitan trioleate and 12g of polyoxyethylene oleate are fully mixed for 1 hour under stirring, the temperature of the system is raised to 80 ℃ after completion, then the temperature of the system is kept, 40g of water is slowly added, the stirring speed is increased to change the water-in-oil emulsion into the oil-in-water emulsion, 20g of water is continuously added until the required mass concentration is 50%, the crude emulsion is further emulsified by a colloid mill, and finally, the organopolysiloxane antifoam composition emulsion M1-M10 with the solid content of 10% is diluted by acrylic acid thickening water.
Defoaming and foam suppressing performance test
The organopolysiloxane defoamer composition emulsions of examples 11-20 were tested for defoaming and foam suppressing properties in a circulating bubbler using a self-dispensing cork liquid. Injecting 600mL of cork liquid into a hard glass cylinder with the inner diameter of 5cm in a circulating bubbler, heating and maintaining at 90 ℃, opening a liquid circulating switch, controlling the flow to be 6L/min, injecting 0.4mL of organopolysiloxane antifoaming agent composition emulsion when the foam height in the glass cylinder rises to 300mL, starting timing, simultaneously recording the foam height until the foam height rises to 300mL again, and stopping liquid circulation. The higher the speed of the foam falling to 250mL after the defoamer composition emulsion is added, the lower the minimum foam height is, and the better the defoaming performance is; the longer the time taken for the foam to rise back to 300mL again indicates the better foam suppression of the defoamer composition. The test results are shown in Table 1.
TABLE 1 defoaming and foam suppressing Properties test results
Time/s
|
M1
|
M2
|
M3
|
M4
|
M5
|
M6
|
M7
|
M8
|
M9
|
M10
|
0
|
300
|
300
|
300
|
300
|
300
|
300
|
300
|
300
|
300
|
300
|
5
|
280
|
280
|
280
|
280
|
280
|
270
|
280
|
280
|
300
|
300
|
10
|
240
|
240
|
240
|
240
|
240
|
230
|
240
|
280
|
290
|
290
|
15
|
210
|
220
|
210
|
210
|
210
|
210
|
210
|
280
|
290
|
290
|
30
|
210
|
220
|
200
|
200
|
210
|
210
|
210
|
270
|
280
|
300
|
60
|
210
|
220
|
200
|
200
|
210
|
210
|
210
|
250
|
280
|
|
90
|
210
|
220
|
200
|
200
|
210
|
200
|
210
|
250
|
270
|
|
120
|
210
|
220
|
200
|
200
|
210
|
200
|
210
|
260
|
260
|
|
150
|
210
|
220
|
210
|
210
|
210
|
200
|
210
|
280
|
290
|
|
180
|
210
|
230
|
210
|
210
|
210
|
200
|
210
|
290
|
300
|
|
210
|
220
|
230
|
210
|
210
|
220
|
200
|
220
|
300
|
|
|
240
|
220
|
230
|
210
|
210
|
230
|
210
|
220
|
|
|
|
270
|
240
|
240
|
210
|
210
|
240
|
230
|
240
|
|
|
|
300
|
260
|
260
|
240
|
240
|
280
|
240
|
260
|
|
|
|
330
|
280
|
300
|
270
|
270
|
300
|
260
|
280
|
|
|
|
360
|
300
|
|
300
|
300
|
|
260
|
300
|
|
|
|
390
|
|
|
|
|
|
280
|
|
|
|
|
420
|
|
|
|
|
|
300
|
|
|
|
|
As can be seen from Table 1, the emulsions prepared in examples S1-S7 exhibited a faster foam reduction rate in the early stage and a slower foam rise time in the later stage during the testing; in the tests of the emulsions prepared in S8, S9 and S10 of the comparative examples, the defoaming rate in the early stage was slow, the foam decreasing amplitude was small, and the foam rising speed in the later stage was fast.