CN110281615A - A kind of high frequency double-sided copper-clad dielectric-slab and preparation method thereof - Google Patents
A kind of high frequency double-sided copper-clad dielectric-slab and preparation method thereof Download PDFInfo
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/061—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of metal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/16—Drying; Softening; Cleaning
- B32B38/164—Drying
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/212—Electromagnetic interference shielding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/552—Fatigue strength
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Abstract
The invention discloses a kind of high frequency double-sided copper-clad dielectric-slabs, insulating medium layer including two layers of copper foil and between two layers of copper foil, the insulating medium layer includes 60-70 parts of resin material and 5-10 parts of glass fiber material by weight, and wherein resin material includes 40-50 parts of polyflons, 20-30 parts of fluorinated polyethylenes, 10-15 parts of thermosetting cyanate ester resins, 2-5 parts of polyphenylene oxide resins, 1-5 parts of epoxy resin, 5-10 parts of lubricants, 1-3 parts of curing agent by weight.A kind of high frequency double-sided copper-clad dielectric-slab and preparation method thereof that the present invention obtains, its preparation process is easy, production cost is low, dielectric constant is stable when batch production and consistency is good, have the characteristics such as high temperature resistant, anti-aging, anti-radiation, dielectric constant be accurate, the dielectric constant for the high frequency double-sided copper-clad dielectric-slab that the final present invention obtains is 2.2, loss angle tangent 0.0009.
Description
Technical field
The present invention relates to one to cover copper dielectric-slab, especially a kind of high frequency double-sided copper-clad dielectric-slab and preparation method thereof.
Background technique
The core base material that copper dielectric-slab is the high-frequency circuit boards such as radar, the base station 5G, satellite positioning is covered, totle drilling cost is accounted for
37% or more.But all domestic all dependence imports, overseas manufacturers carry out technology blockage to China at present.
Circuit board is the field of current maximum-norm application high frequency double-sided copper-clad dielectric-slab, and stability requirement is high.It is high
Frequencyization, high speed circuit board need to have three aspect characteristics: 1, low transmission lose；2, low transmission delay；3, Gao Te is needed
The precision controlling of property impedance.The printed circuit board for meeting frequency applications environmental requirement is known as high-frequency circuit board.Its medium dielectric constant microwave medium
(Dk) and dielectric loss factor (Df) is to measure two main indicators of circuit board and copper-clad plate high-frequency high-speed performance:
1) dielectric constant (Dk) is smaller more stable, and high-frequency high-speed performance is more excellent.When the height influence electromagnetic wave of Dk passes through medium
Phase velocity, material (dielectric constant) is directly proportional to the transfer rate C of signal.High dielectric constant often means that biggish
Signal transmission delay.
2) dielectric loss (Df) is smaller more stable, and high-frequency high-speed performance is more excellent.The electric energy of the more high then circuit system of Df and
Loss of signal is also high.In general, the Dk and Df of copper-clad plate are reduced, mainly by using special resin material, base
Plate material and copper foil solve.
Formula for raw stock directly influences copper-clad plate dielectric constant and dielectric loss, and technique production core difficult point is upstream
Raw material selection and formulation ratio, therefore existing urgent need researches and develops a high frequency double-sided copper-clad dielectric-slab and preparation method thereof.
Summary of the invention
A kind of high frequency double-sided copper-clad dielectric-slab is provided the purpose of the present invention is to solve above-mentioned the deficiencies in the prior art
And preparation method thereof, to improve its dielectric properties.
To achieve the goals above, the present invention designed by a kind of high frequency double-sided copper-clad dielectric-slab, including two layers of copper foil with
And the insulating medium layer between two layers of copper foil, the insulating medium layer by weight include 60-70 parts of resin material with
And 5-10 parts of glass fiber material, wherein resin material includes that 40-50 parts of polyflons, 20-30 parts of fluoro are poly- by weight
Ethylene, 10-15 part thermosetting cyanate ester resin, 2-5 parts of polyphenylene oxide resins, 1-5 parts of epoxy resin, 5-10 parts of lubricants, 1-3 parts
Curing agent；
The glass fiber material includes 50-60 parts of silica, 20-30 parts of micas, 5-15 parts of silicon carbide, 15-25 parts by weight
Zinc oxide, 8-10 part magnesia, 5-10 parts of aluminium oxide, 6-10 parts of boron nitride, 30-40 parts of zirconium oxides.
Resin material is used polyflon, fluorinated polyethylene, thermosetting cyanate ester resin, polyphenyl in the present invention
Ether resin is used in mixed way, to play the effect cooperateed with mutually.The resin material has excellent Jie suitable for high-frequency applications
Electrical characteristics, and what is formed covers copper dielectric-slab and can play excellent interlayer adaptation and heat resistance, and can prevent circuit
A problem that removing.
The preparation method of above-mentioned high frequency double-sided copper-clad dielectric-slab, comprising the following steps:
1) by weight by 50-60 parts of silica, 20-30 parts of micas, 5-15 parts of silicon carbide, 15-25 parts of zinc oxide, 8-10 parts
Magnesia, 5-10 part aluminium oxide, 6-10 parts of boron nitride, 30-40 parts of zirconium oxides are heat-treated using high temperature furnace, and temperature control exists
Between 800-1000 DEG C, melting time is 3-4 hours, then carries out wire-drawing process, temperature controls between 1200 DEG C, to fiber
Silk root application allows the fiber of high-temperature liquid state to rapidly cool to form glass fiber single filament by wire drawing machine, finally to force cooling provision
Again by glass fiber single filament plain weave, glass fiber material is obtained；
2) by weight by 40-50 parts of polyflons, 20-30 parts of fluorinated polyethylenes, 10-15 parts of thermosetting cyanate trees
Rouge is added sequentially in reaction kettle, turn on agitator, is stirred 15 minutes, is warming up to 120-140 DEG C, 2- is then added while stirring
5 parts of polyphenylene oxide resins, 1-5 parts of epoxy resin, 5-10 parts of lubricants, 1-3 parts of curing agent persistently keep 1000-1800 revs/min
Revolving speed stir 4-6 hour after to obtain the final product resin material；
3) 5-10 parts of glass fiber materials are impregnated into 60-70 parts of resin materials by weight, are impregnated by vertical glue dipping machine, and pass through
The drying of heat radiation type baking oven and high temperature sintering are crossed, is repeated 3-4 times, insulating medium layer is made；
4) two layers of copper foil and the insulating medium layer between two layers of copper foil are passed through into the heating of vacuum high-temperature hydraulic press, pressurization
It is combined, is recycled finally by cooling water, temperature is made to be down to 20-30 DEG C, high frequency double-sided copper-clad dielectric-slab is made.
A kind of high frequency double-sided copper-clad dielectric-slab and preparation method thereof that the present invention obtains, preparation process is easy, is produced into
This is low, and dielectric constant is stable when batch production and consistency is good, has high temperature resistant, anti-aging, anti-radiation, dielectric constant is accurate etc.
Characteristic, the dielectric constant for the high frequency double-sided copper-clad dielectric-slab that the final present invention obtains are 2.2, loss angle tangent 0.0009.
Specific embodiment
Below with reference to embodiment, the present invention is further described.
Embodiment 1:
A kind of high frequency double-sided copper-clad dielectric-slab provided in this embodiment, including two layers of copper foil and between two layers of copper foil
Insulating medium layer, the insulating medium layer include 60 parts of resin material and 5 parts of glass fiber material by weight, wherein resin material
It by weight include 40 parts of polyflons, 20 parts of fluorinated polyethylenes, 10 parts of thermosetting cyanate ester resins, 2 parts of polyphenylene oxide
Resin, 1 part of epoxy resin, 5 parts of lubricants, 1 part of curing agent.
The glass fiber material includes 50 parts of silica, 20 parts of micas, 5 parts of silicon carbide, 15 parts of zinc oxide, 8 by weight
Part magnesia, 5 parts of aluminium oxide, 6 parts of boron nitride, 30 parts of zirconium oxides.
The preparation method of above-mentioned high frequency double-sided copper-clad dielectric-slab, comprising the following steps:
1) by weight by 50 parts of silica, 20 parts of micas, 5 parts of silicon carbide, 15 parts of zinc oxide, 8 parts of magnesia, 5 parts of oxidations
Aluminium, 6 parts of boron nitride, 30 parts of zirconium oxides are heat-treated using high temperature furnace, and temperature controls the melting time between 800-1000 DEG C
It is 3-4 hours, then carries out wire-drawing process, temperature is controlled between 1200 DEG C, to fiber filament root application to force cooling provision, allowed
The fiber of high-temperature liquid state rapidly cools to form glass fiber single filament by wire drawing machine, finally again obtains glass fiber single filament plain weave
To glass fiber material；
2) 40 parts of polyflons, 20 parts of fluorinated polyethylenes, 10 parts of thermosetting cyanate ester resins are successively added by weight
Enter into reaction kettle, turn on agitator, stir 15 minutes, be warming up to 120-140 DEG C, 2 parts of polyphenylene oxide are then added while stirring
Resin, 1 part of epoxy resin, 5 parts of lubricants, 1 part of curing agent persistently keep 1000-1800 revs/min of revolving speed stirring 4-6 small
When after up to resin material；
3) 5 parts of glass fiber materials are impregnated into 60 parts of resin materials by weight, are impregnated by vertical glue dipping machine, and through overheating spoke
The drying of formula baking oven and high temperature sintering are penetrated, is repeated 3-4 times, insulating medium layer is made；
4) two layers of copper foil and the insulating medium layer between two layers of copper foil are passed through into the heating of vacuum high-temperature hydraulic press, pressurization
It is combined, is recycled finally by cooling water, temperature is made to be down to 20-30 DEG C, high frequency double-sided copper-clad dielectric-slab is made.
The dielectric constant for the high frequency double-sided copper-clad dielectric-slab that the present embodiment obtains is 2.2, loss angle tangent 0.0009.
Embodiment 2:
A kind of high frequency double-sided copper-clad dielectric-slab provided in this embodiment, including two layers of copper foil and between two layers of copper foil
Insulating medium layer, the insulating medium layer include 70 parts of resin material and 10 parts of glass fiber material by weight, wherein resinous wood
Material includes 50 parts of polyflons, 30 parts of fluorinated polyethylenes, 15 parts of thermosetting cyanate ester resins, 5 parts of polyphenyl by weight
Ether resin, 5 parts of epoxy resin, 10 parts of lubricants, 3 parts of curing agent.
The glass fiber material include by weight 60 parts of silica, 30 parts of micas, 15 parts of silicon carbide, 25 parts of zinc oxide,
10 parts of magnesia, 10 parts of aluminium oxide, 10 parts of boron nitride, 40 parts of zirconium oxides.
The dielectric constant for the high frequency double-sided copper-clad dielectric-slab that the present embodiment obtains is 2.2, loss angle tangent 0.0009.
Embodiment 3:
A kind of high frequency double-sided copper-clad dielectric-slab provided in this embodiment, including two layers of copper foil and between two layers of copper foil
Insulating medium layer, the insulating medium layer include 65 parts of resin material and 10 parts of glass fiber material by weight, wherein resinous wood
Material includes 45 parts of polyflons, 25 parts of fluorinated polyethylenes, 12 parts of thermosetting cyanate ester resins, 4 parts of polyphenyl by weight
Ether resin, 2 parts of epoxy resin, 8 parts of lubricants, 2 parts of curing agent.
The glass fiber material includes 55 parts of silica, 25 parts of micas, 8 parts of silicon carbide, 18 parts of zinc oxide, 10 by weight
Part magnesia, 8 parts of aluminium oxide, 8 parts of boron nitride, 35 parts of zirconium oxides.
The dielectric constant for the high frequency double-sided copper-clad dielectric-slab that the present embodiment obtains is 2.2, loss angle tangent 0.0009.
Claims (3)
1. a kind of high frequency double-sided copper-clad dielectric-slab, it is characterised in that: including two layers of copper foil and between two layers of copper foil
Insulating medium layer, the insulating medium layer includes 60-70 parts of resin material and 5-10 parts of glass fiber material by weight, wherein setting
Rouge material includes 40-50 parts of polyflons, 20-30 parts of fluorinated polyethylenes, 10-15 parts of thermosetting cyanates by weight
Resin, 2-5 part polyphenylene oxide resin, 1-5 parts of epoxy resin, 5-10 parts of lubricants, 1-3 parts of curing agent.
2. a kind of high frequency double-sided copper-clad dielectric-slab according to claim 1, it is characterised in that: the glass fiber material is by weight
Part includes 50-60 parts of silica, 20-30 parts of micas, 5-15 parts of silicon carbide, 15-25 parts of zinc oxide, 8-10 parts of magnesia, 5-
10 parts of aluminium oxide, 6-10 parts of boron nitride, 30-40 parts of zirconium oxides.
3. a kind of preparation method of high frequency double-sided copper-clad dielectric-slab as claimed in claim 1 or 2, comprising the following steps:
1) by weight by 50-60 parts of silica, 20-30 parts of micas, 5-15 parts of silicon carbide, 15-25 parts of zinc oxide, 8-10 parts
Magnesia, 5-10 part aluminium oxide, 6-10 parts of boron nitride, 30-40 parts of zirconium oxides are heat-treated using high temperature furnace, and temperature control exists
Between 800-1000 DEG C, melting time is 3-4 hours, then carries out wire-drawing process, temperature controls between 1200 DEG C, to fiber
Silk root application allows the fiber of high-temperature liquid state to rapidly cool to form glass fiber single filament by wire drawing machine, finally to force cooling provision
Again by glass fiber single filament plain weave, glass fiber material is obtained；
2) by weight by 40-50 parts of polyflons, 20-30 parts of fluorinated polyethylenes, 10-15 parts of thermosetting cyanate trees
Rouge is added sequentially in reaction kettle, turn on agitator, is stirred 15 minutes, is warming up to 120-140 DEG C, 2- is then added while stirring
5 parts of polyphenylene oxide resins, 1-5 parts of epoxy resin, 5-10 parts of lubricants, 1-3 parts of curing agent persistently keep 1000-1800 revs/min
Revolving speed stir 4-6 hour after to obtain the final product resin material；
3) 5-10 parts of glass fiber materials are impregnated into 60-70 parts of resin materials by weight, are impregnated by vertical glue dipping machine, and pass through
The drying of heat radiation type baking oven and high temperature sintering are crossed, is repeated 3-4 times, insulating medium layer is made；
4) two layers of copper foil and the insulating medium layer between two layers of copper foil are passed through into the heating of vacuum high-temperature hydraulic press, pressurization
It is combined, is recycled finally by cooling water, temperature is made to be down to 20-30 DEG C, high frequency double-sided copper-clad dielectric-slab is made.
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| CN201910542428.1A CN110281615A (en) | 2019-06-21 | 2019-06-21 | A kind of high frequency double-sided copper-clad dielectric-slab and preparation method thereof |
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| CN201910542428.1A CN110281615A (en) | 2019-06-21 | 2019-06-21 | A kind of high frequency double-sided copper-clad dielectric-slab and preparation method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113829700A (en) * | 2021-09-27 | 2021-12-24 | 江苏耀鸿电子有限公司 | Voltage-resistant high-temperature-resistant high-frequency copper-clad substrate and preparation method thereof |
| CN114311884A (en) * | 2021-12-15 | 2022-04-12 | 山东金宝电子股份有限公司 | Radiation-resistant anti-aging copper-clad laminate and preparation method thereof |
| CN114410046A (en) * | 2022-01-28 | 2022-04-29 | 浙江大学 | Preparation method of hydrocarbon resin base plate material for high-frequency copper-clad plate |
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| CN104371320A (en) * | 2014-11-11 | 2015-02-25 | 广东生益科技股份有限公司 | Thermosetting resin composition and prepreg and laminate prepared therefrom |
| CN107777872A (en) * | 2016-08-26 | 2018-03-09 | 芜湖新利德玻璃制品有限公司 | High rigidity glass and preparation method thereof |
| CN109081597A (en) * | 2018-09-27 | 2018-12-25 | 浙江德清蓝雅晶体纤维有限公司 | A kind of glass fibre |
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2019
- 2019-06-21 CN CN201910542428.1A patent/CN110281615A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104371320A (en) * | 2014-11-11 | 2015-02-25 | 广东生益科技股份有限公司 | Thermosetting resin composition and prepreg and laminate prepared therefrom |
| CN107777872A (en) * | 2016-08-26 | 2018-03-09 | 芜湖新利德玻璃制品有限公司 | High rigidity glass and preparation method thereof |
| CN109081597A (en) * | 2018-09-27 | 2018-12-25 | 浙江德清蓝雅晶体纤维有限公司 | A kind of glass fibre |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113829700A (en) * | 2021-09-27 | 2021-12-24 | 江苏耀鸿电子有限公司 | Voltage-resistant high-temperature-resistant high-frequency copper-clad substrate and preparation method thereof |
| CN113829700B (en) * | 2021-09-27 | 2022-08-19 | 江苏耀鸿电子有限公司 | Voltage-resistant high-temperature-resistant high-frequency copper-clad substrate and preparation method thereof |
| CN114311884A (en) * | 2021-12-15 | 2022-04-12 | 山东金宝电子股份有限公司 | Radiation-resistant anti-aging copper-clad laminate and preparation method thereof |
| CN114410046A (en) * | 2022-01-28 | 2022-04-29 | 浙江大学 | Preparation method of hydrocarbon resin base plate material for high-frequency copper-clad plate |
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Application publication date: 20190927 |
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