CN110280620A - A kind of production technology of the clean pipe of semiconductor - Google Patents
A kind of production technology of the clean pipe of semiconductor Download PDFInfo
- Publication number
- CN110280620A CN110280620A CN201910440386.0A CN201910440386A CN110280620A CN 110280620 A CN110280620 A CN 110280620A CN 201910440386 A CN201910440386 A CN 201910440386A CN 110280620 A CN110280620 A CN 110280620A
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- CN
- China
- Prior art keywords
- semiconductor
- pipe
- clean
- content
- production technology
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/02—Cleaning pipes or tubes or systems of pipes or tubes
- B08B9/027—Cleaning the internal surfaces; Removal of blockages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
- B21C37/06—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of tubes or metal hoses; Combined procedures for making tubes, e.g. for making multi-wall tubes
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/002—Ferrous alloys, e.g. steel alloys containing In, Mg, or other elements not provided for in one single group C22C38/001 - C22C38/60
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/02—Ferrous alloys, e.g. steel alloys containing silicon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/04—Ferrous alloys, e.g. steel alloys containing manganese
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/18—Ferrous alloys, e.g. steel alloys containing chromium
- C22C38/40—Ferrous alloys, e.g. steel alloys containing chromium with nickel
- C22C38/44—Ferrous alloys, e.g. steel alloys containing chromium with nickel with molybdenum or tungsten
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
- C22C38/18—Ferrous alloys, e.g. steel alloys containing chromium
- C22C38/40—Ferrous alloys, e.g. steel alloys containing chromium with nickel
- C22C38/58—Ferrous alloys, e.g. steel alloys containing chromium with nickel with more than 1.5% by weight of manganese
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Heat Treatment Of Articles (AREA)
Abstract
The invention discloses a kind of semiconductor production technologies of clean pipe, comprising the following steps: selects specific tubing raw material, and carries out constituent analysis to tubing raw material；According to customer demand, tubing raw material are processed, obtain the pipe fitting of corresponding size；Electrochemical polish and semiconductor grade cleaning processing are carried out to pipe fitting；Treated that pipe fitting carries out service check to clean；It will be dispatched from the factory by the pipe fitting packing examined, compared with prior art, the present invention has rational design, simple process, can produce the clean pipe of standard compliant semiconductor, promotes the clean accounting amount for managing market at home of domestic semiconductor.
Description
[technical field]
The present invention relates to stainless steel tube technical field, the production technology of the clean pipe of especially a kind of semiconductor.
[background technique]
Seamless steel pipe is a kind of with hollow section, the non-jointed strip steel in periphery, and seamless steel pipe is with hollow section
Face, can be used as the pipeline of trandfer fluid, such as transfer oil, natural gas, coal gas and water and certain solid materials pipeline, it is noble and unsullied
The stainless steel tube of cleanliness is commonly used in semiconductor Preparation equipment, and the domestic manufacturer that can produce the clean pipe of semiconductor extremely has
Limit, can only be by external import, it is therefore necessary to propose a kind of production technology of clean pipe of semiconductor.
[summary of the invention]
The object of the invention is to solve the problems of the prior art, a kind of production work of clean pipe of semiconductor is proposed
Skill, the present invention has rational design, simple process, can produce the clean pipe of standard compliant semiconductor, promote domestic semiconductor
With the clean accounting amount for managing market at home.
To achieve the above object, the invention proposes a kind of semiconductor production technologies of clean pipe, comprising the following steps:
A specific blank) is selected, and constituent analysis is carried out to blank；
B) pass through the techniques pair such as finish rolling, oil lubrication floating plug drawing process, solid solution brightness heat treatment, the cleaning of surfaces externally and internally depth
Blank is processed, and the pipe fitting of corresponding size is obtained；
C electrochemical polish) is carried out to pipe fitting and semiconductor grade cleaning is handled；
D) treated that pipe fitting carries out service check to clean；
E) factory will be packaged by the pipe fitting examined.
Preferably, the step A) in blank be 316L gapless stainless steel tube.
Preferably, the step A) in constituent analysis be analysis to C, Si, Mn, P, S, Ni, Cr, Mo content,
The content of the C will be lower than 0.03%, and the content of the Si will be lower than 1%, and the content of the Mn will be lower than 2%, and the P's contains
Amount will be lower than 0.04%, and the content of the S will be lower than 0.01%, and the content of the Ni is 8%-11%, and the content of the Cr is
The content of 16%-18%, the Mo are 2%-3%.
Preferably, the step B) in include: pickling to the manufacturing procedure of blank, calendering, clean, take the lead,
Cold-drawn, cleaning, correction and bright annealing.
Preferably, the step B) in electrochemical polish be chemical cleaning and electrochemical polish.
Preferably, the step C) in semiconductor grade cleaning processing successively to carry out pickling, ultrapure water to pipe fitting
Cleaning and the cleaning of inside pipe wall depth, the ultrapure water cleaning use the ultrapure water of 18M Ω, and the inside pipe wall depth cleaning is using white
Color cotton cloth cleans inside pipe wall after dipping trichloro ethylene or acetone, then purges steel tube inner hole, the semiconductor with pressure air
The clean processing of grade is completed in dust free room.
Preferably, the step D) in the instrument that uses of service check be roughness instrument, metallographic microscope
And hardometer.
Preferably, the step E) in pipe fitting packaging operation completed in dust free room.
Beneficial effects of the present invention: the present invention has rational design, and process flow is accurate, can produce and standard compliant partly lead
The clean pipe of body, promotes the clean accounting amount for managing market at home of domestic semiconductor.
[specific embodiment]
In order to make the objectives, technical solutions and advantages of the present invention clearer, below by embodiment, to the present invention into
Row is further described.However, it should be understood that the specific embodiments described herein are merely illustrative of the present invention, and do not have to
In limiting the scope of the invention.In addition, in the following description, descriptions of well-known structures and technologies are omitted, to avoid need not
Obscure idea of the invention in strategic point.
A kind of production technology of the clean pipe of semiconductor of the present invention, comprising the following steps:
A specific blank) is selected, and constituent analysis is carried out to blank；
B) pass through finish rolling, oil lubrication floating plug drawing process, solid solution brightness heat treatment, the cleaning of surfaces externally and internally depth
Etc. techniques blank is processed, obtain the pipe fitting of corresponding size；
C electrochemical polish) is carried out to pipe fitting and semiconductor grade cleaning is handled；
D) treated that pipe fitting carries out service check to clean；
E) factory will be packaged by the pipe fitting examined.
Wherein, the step A) in blank be 316L gapless stainless steel tube.
Wherein, the step A) in constituent analysis be analysis to C, Si, Mn, P, S, Ni, Cr, Mo content, the C
Content to be lower than 0.03%, the content of the Si will be lower than 1%, and the content of the Mn will be lower than 2%, and the content of the P is wanted
Lower than 0.04%, the content of the S will be lower than 0.01%, and the content of the Ni is 9%, and the content of the Cr is 17%, described
The content of Mo is 3%.
Wherein, the step B) in include: pickling to the manufacturing procedure of blank, calendering, clean, take the lead, cold-drawn,
Cleaning, correction and bright annealing.
Wherein, the step B) in electrochemical polish be chemical cleaning and electrochemical polish.
Wherein, the step C) in semiconductor grade cleaning processing for pipe fitting is successively carried out pickling, ultrapure water cleaning
It is cleaned with inside pipe wall depth, the ultrapure water cleaning uses the ultrapure water of 18M Ω, and the inside pipe wall depth cleaning uses white cotton
Cloth cleans inside pipe wall after dipping trichloro ethylene or acetone, then purges steel tube inner hole with pressure air, and the semiconductor grade is clean
Net processing is completed in dust free room.
Wherein, the step D) in the instrument that uses of service check be roughness instrument, metallographic microscope and hard
Degree meter.
Wherein, the step E) in pipe fitting packaging operation completed in dust free room.
Compared with prior art, the present invention has rational design, and process flow is accurate, can produce standard compliant semiconductor
It is managed with cleaning, promotes the clean accounting amount for managing market at home of domestic semiconductor.
Above-described embodiment is the description of the invention, is not limitation of the invention, after any pair of simple transformation of the present invention
Scheme all belong to the scope of protection of the present invention.
Claims (8)
1. a kind of semiconductor production technology of clean pipe, it is characterised in that: the following steps are included:
A specific blank) is selected, and constituent analysis is carried out to blank；
B) by techniques such as finish rolling, oil lubrication floating plug drawing process, solid solution brightness heat treatment, the cleanings of surfaces externally and internally depth to pipe
Material is processed, and the pipe fitting of corresponding size is obtained；
C electrochemical polish) is carried out to pipe fitting and semiconductor grade cleaning is handled；
D) treated that pipe fitting carries out service check to clean；
E) factory will be packaged by the pipe fitting examined.
2. a kind of production technology of the clean pipe of semiconductor as described in claim 1, it is characterised in that: the step A) in
Blank be 316L gapless stainless steel tube.
3. a kind of production technology of the clean pipe of semiconductor as described in claim 1, it is characterised in that: the step A) in
Constituent analysis be analysis to C, Si, Mn, P, S, Ni, Cr, Mo content, the content of the C will be lower than 0.03%, the Si's
Content will be lower than 1%, and the content of the Mn will be lower than 2%, and the content of the P will be lower than 0.04%, and the content of the S will be lower than
The content of 0.01%, the Ni are 8%-11%, and the content of the Cr is 16%-18%, and the content of the Mo is 2%-3%.
4. a kind of production technology of the clean pipe of semiconductor as described in claim 1, it is characterised in that: the step B) in
Include: pickling to the manufacturing procedure of blank, calendering, clean, take the lead, cold-drawn, cleaning, correction and bright annealing.
5. a kind of production technology of the clean pipe of semiconductor as described in claim 1, it is characterised in that: the step B) in
Electrochemical polish be chemical cleaning and electrochemical polish.
6. a kind of production technology of the clean pipe of semiconductor as described in claim 1, it is characterised in that: the step C) in
Semiconductor grade cleaning processing for pipe fitting is successively carried out pickling, ultrapure water cleaning and inside pipe wall depth cleaning, the ultrapure water
Cleaning uses the ultrapure water of 18M Ω, and inside pipe wall depth cleaning is dipped after trichloro ethylene or acetone using white cotton to pipe
Inner wall is cleaned, and then purges steel tube inner hole with pressure air, and the semiconductor grade cleaning processing is completed in dust free room.
7. a kind of production technology of the clean pipe of semiconductor as described in claim 1, it is characterised in that: the step D) in
The instrument that uses of service check be roughness instrument, metallographic microscope and hardometer.
8. a kind of production technology of the clean pipe of semiconductor as described in claim 1, it is characterised in that: the step E) in
Pipe fitting packaging operation completed in dust free room.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910440386.0A CN110280620A (en) | 2019-05-24 | 2019-05-24 | A kind of production technology of the clean pipe of semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910440386.0A CN110280620A (en) | 2019-05-24 | 2019-05-24 | A kind of production technology of the clean pipe of semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110280620A true CN110280620A (en) | 2019-09-27 |
Family
ID=68002617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910440386.0A Pending CN110280620A (en) | 2019-05-24 | 2019-05-24 | A kind of production technology of the clean pipe of semiconductor |
Country Status (1)
| Country | Link |
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| CN (1) | CN110280620A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101671773A (en) * | 2009-09-17 | 2010-03-17 | 苏州贝思特金属制品有限公司 | Method for manufacturing seamless steel tube |
| CN107282689A (en) * | 2017-07-01 | 2017-10-24 | 浙江义腾特种钢管有限公司 | A kind of production technology of fluid pressure line stainless steel tube |
| CN107321814A (en) * | 2017-07-19 | 2017-11-07 | 浙江义腾特种钢管有限公司 | A kind of preparation technology of high-purity gas conveying stainless steel tube |
| CN108561641A (en) * | 2018-06-20 | 2018-09-21 | 长兴云腾新能源科技有限公司 | A kind of manufacturing process of semiconductor high-cleanness stainless steel pipe fitting |
-
2019
- 2019-05-24 CN CN201910440386.0A patent/CN110280620A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101671773A (en) * | 2009-09-17 | 2010-03-17 | 苏州贝思特金属制品有限公司 | Method for manufacturing seamless steel tube |
| CN107282689A (en) * | 2017-07-01 | 2017-10-24 | 浙江义腾特种钢管有限公司 | A kind of production technology of fluid pressure line stainless steel tube |
| CN107321814A (en) * | 2017-07-19 | 2017-11-07 | 浙江义腾特种钢管有限公司 | A kind of preparation technology of high-purity gas conveying stainless steel tube |
| CN108561641A (en) * | 2018-06-20 | 2018-09-21 | 长兴云腾新能源科技有限公司 | A kind of manufacturing process of semiconductor high-cleanness stainless steel pipe fitting |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190927 |