CN110278689B - Multi-server heat dissipation device of data center machine room - Google Patents
Multi-server heat dissipation device of data center machine room Download PDFInfo
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- CN110278689B CN110278689B CN201910546522.4A CN201910546522A CN110278689B CN 110278689 B CN110278689 B CN 110278689B CN 201910546522 A CN201910546522 A CN 201910546522A CN 110278689 B CN110278689 B CN 110278689B
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- air inlet
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
Abstract
The invention belongs to the field of server heat dissipation, and particularly relates to a multi-server heat dissipation device for a data center machine room, which aims at the problems that the existing data center machine room is poor in heat dissipation effect, external water vapor and dust are easily brought into a server, so that parts in a machine are corroded and short-circuited, and the service life of the server is greatly shortened; the air inlet heat conduction mechanism comprises a shell, an air inlet cylinder and an air outlet box, and heat conduction glue is filled in the shell. This device can dispel the heat alone to every server for the heat can not pile up in the computer lab, and inside external steam, dust can not bring the server into, prevent that the inside spare part of machine from corroding, short circuit, have greatly prolonged the life of server.
Description
Technical Field
The invention relates to the technical field of server heat dissipation, in particular to a multi-server heat dissipation device for a data center machine room.
Background
The existing data center machine room is provided with a large number of servers, and a large amount of heat can be generated during working, the heat accumulation can accelerate the damage of parts in the servers, reduce the service life of the servers and influence the running speed of machines;
the existing server room mostly carries out independent heat dissipation to each server through a fan, heat can be accumulated in the room, the heat dissipation effect is poor, external dust easily enters the inside of the server, the parts in the server are easily damaged, and in a humid area or season, the heat dissipation is realized through the fan, moisture in the external air can be brought into the machine, the parts in the machine are corroded and shorted, the service life of the server is greatly shortened, and therefore the multi-server heat dissipation device for the data center room is provided.
Disclosure of Invention
The multi-server heat dissipation device for the data center machine room solves the problems that the heat dissipation effect of the data center machine room is poor, external water vapor and dust are easily brought into the server, parts in the machine are corroded and short-circuited, and the service life of the server is greatly shortened.
In order to achieve the purpose, the invention adopts the following technical scheme:
the multi-server heat dissipation device for the data center machine room comprises an air outlet pipe and an air inlet pipe, wherein one end of the air inlet pipe is provided with a fan, the air inlet pipe is connected with a plurality of air inlet heat conduction mechanisms through air guide pipes, and the air outlet ends of the air inlet heat conduction mechanisms are connected with the air outlet pipe through the air guide pipes;
the air inlet heat conduction mechanism comprises a shell, an air inlet cylinder and an air outlet box, heat conduction glue is filled in the shell, the air inlet cylinder and the air outlet box are respectively installed at the top end and the bottom end of the shell, a plurality of heat conduction pipes are installed in the shell, two ends of each heat conduction pipe respectively extend into the air inlet cylinder and the air outlet box, a temperature sensing electromagnetic transmission mechanism is arranged between the shell and the air inlet cylinder, an output shaft of the temperature sensing electromagnetic transmission mechanism is connected with a rack which is horizontally arranged, the air inlet cylinder is internally and rotatably connected with a rotating shaft, a gear is installed on the rotating shaft, the rack is meshed with the gear, a flashboard is installed at the top end of the rotating shaft, a baffle fixed in the air inlet cylinder is connected with the top end of.
Preferably, the temperature sensing electromagnetic transmission mechanism comprises a fixed cylinder arranged on the inner wall of the air inlet cylinder, one end inside the fixed cylinder is provided with an armature, the armature is wound with a plurality of groups of coil windings, one side of the armature is provided with a movable block connected inside the fixed cylinder in a sliding manner, the movable block is provided with an action rod, one end of the action rod penetrates through the side wall of the fixed cylinder and is connected with a rack, the shell is provided with a temperature sensing storage tube and an installation frame, the installation frame is provided with conductive blocks the number of which is matched with that of the coil windings, one end of the temperature sensing storage tube extends into the shell, the other end of the temperature sensing storage tube is internally and slidably connected with a movable column, the movable column is provided with a conductive rod, the conductive rod is in sliding contact connection with the conductive blocks, the conducting rod is connected with a storage battery through a conducting wire, one end of the coil winding is connected with the storage battery through a conducting wire, and the other end of the coil winding is connected with a conducting block through a conducting wire.
Preferably, a plurality of heat conduction rods are installed on the side wall of the heat conduction pipe, one end of each heat conduction rod extends into the heat conduction pipe, and the other end of each heat conduction rod is inserted into the heat conduction glue.
Preferably, a magnet is embedded in the movable block.
Preferably, the rack is installed to the bottom of casing, is equipped with the opening on the lateral wall of casing, and the opening part articulates there is the closing plate.
Preferably, the heat conduction pipes are uniformly distributed outside the placing frame.
Preferably, a glue injection pipe is installed on the side wall of the top of the shell and communicated with the inside of the shell.
Preferably, one end of the temperature sensing storage tube is provided with a spherical storage cavity, and the mercury liquid is stored in the spherical storage cavity.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, through the arrangement of the air outlet pipe, the air inlet pipe, the fan and the air inlet heat conduction mechanism, external air can be guided into the specific air inlet heat conduction mechanism, each server is independently radiated, and heat cannot be accumulated in a machine room;
and through seal chamber with have insulating, the setting of heat conduction glue of thermal conductivity, can seal the server, the radiating effect is good, outside steam, dust can not lead-in to the inside of air inlet heat conduction mechanism for outside steam, dust can not bring into inside the server, prevent that the inside spare part of machine from corroding, the short circuit, greatly prolonged the life of server, heat conduction glue and server and inside spare part in close contact with moreover, the heat conduction radiating effect is good.
1. According to the invention, through the arrangement of the temperature sensing electromagnetic transmission mechanism, the rack, the gear, the rotating shaft, the flashboard, the baffle, the air guide hole and the air inlet cylinder, the size of the air inlet can be changed according to the size of the heat dissipation capacity of the server, and when the server does not work, heat dissipation is not required;
3. this device can dispel the heat alone to every server, and makes the heat can not pile up in the computer lab, and inside external steam, dust can not bring the server into, prevent that the inside spare part of machine from corroding, short circuit, have greatly prolonged the life of server, can realize the change to the air intake size according to the size of server heat dissipation capacity.
Drawings
Fig. 1 is a schematic structural diagram of a multi-server heat dissipation device of a data center room according to the present invention.
Fig. 2 is a front view of an air intake heat conducting mechanism of a multi-server heat dissipation device of a data center room according to the present invention.
Fig. 3 is a schematic structural diagram of an air intake heat conducting mechanism of a multi-server heat dissipation device of a data center room according to the present invention.
Fig. 4 is a schematic structural diagram of a temperature-sensing electromagnetic transmission mechanism of a multi-server heat dissipation device of a data center room according to the present invention.
Fig. 5 is a partial structural view of fig. 4.
Fig. 6 is a schematic structural diagram of a baffle, a gate and an air guide hole of the multi-server heat dissipation device for a data center room according to the present invention.
In the figure: 1 air outlet pipe, 2 air inlet pipes, 3 fans, 4 air inlet heat conducting mechanisms, 41 sealing plates, 42 air inlet drums, 43 shells, 44 air outlet boxes, 45 racks, 46 temperature sensing electromagnetic transmission mechanisms, 46-1 action rods, 46-2 fixed drums, 46-3 springs, 46-4 movable blocks, 46-5 coil windings, 46-6 armatures, 46-7 storage batteries, 46-8 conductive blocks, 46-9 mounting racks, 46-10 conductive rods, 46-11 temperature sensing storage pipes, 46-12 movable columns, 46-13 heat conducting pipes, 47 heat conducting pipes, 48 heat conducting rods, 49 placing racks, 410 heat conducting glue, 411 glue injection pipes, 412 rotating shafts, 413 gears, 414, 415 baffles and 416 air guide holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-6, the multi-server heat dissipation device for a data center machine room comprises an air outlet pipe 1 and an air inlet pipe 2, wherein one end of the air inlet pipe 2 is provided with a fan 3, the air inlet pipe 2 is connected with a plurality of air inlet heat conduction mechanisms 4 through air guide pipes, and air outlet ends of the air inlet heat conduction mechanisms 4 are connected with the air outlet pipe 1 through the air guide pipes;
the air inlet heat conducting mechanism 4 comprises a shell 43, an air inlet cylinder 42 and an air outlet box 44, heat conducting glue 410 is filled in the shell 43, the air inlet cylinder 42 and the air outlet box 44 are respectively installed at the top end and the bottom end of the shell 43, a plurality of heat conducting pipes 47 are installed in the shell 43, two ends of each heat conducting pipe 47 respectively extend into the air inlet cylinder 42 and the air outlet box 44, a temperature sensing electromagnetic transmission mechanism 46 is arranged between the shell 43 and the air inlet cylinder 42, an output shaft of the temperature sensing electromagnetic transmission mechanism 46 is connected with a horizontally arranged rack 45, a rotating shaft 412 is rotatably connected in the air inlet cylinder 42, a gear 413 is installed on the rotating shaft 412, the rack 45 is meshed with the gear 413, a shutter 414 is installed at the top end of the rotating shaft 412, a baffle 415 fixed in the air inlet cylinder 42 is connected at the top end of the shutter 414 in a sliding and.
The temperature sensing electromagnetic transmission mechanism 46 comprises a fixed cylinder 46-2 arranged on the inner wall of the air inlet cylinder 42, one end inside the fixed cylinder 46-2 is provided with an armature 46-6, a plurality of groups of coil windings 46-5 are wound on the armature 46-6, one side of the armature 46-6 is provided with a movable block 46-4 connected inside the fixed cylinder 46-2 in a sliding manner, the movable block 46-4 is provided with an action rod 46-1, one end of the action rod 46-1 penetrates through the side wall of the fixed cylinder 46-2 to be connected with a rack 45, the shell 43 is provided with a temperature sensing storage tube 46-11 and an installation frame 46-9, the installation frame 46-9 is provided with conductive blocks 46-8 matched with the coil windings 46-5 in number, one end of the temperature sensing storage tube 46-11 extends into the shell 43, the other end of the temperature sensing storage tube 46-11 is internally connected with a movable column 46-, the movable column 46-12 is provided with a conductive rod 46-10, the conductive rod 46-10 is connected with a conductive block 46-8 in a sliding contact mode, the conductive rod 46-10 is connected with a storage battery 46-7 through a conducting wire, one end of each coil winding 46-5 is connected with the storage battery 46-7 through a conducting wire, and the other end of each coil winding 46-5 is connected with one conductive block 46-8 through a conducting wire.
The side wall of the heat conduction pipe 47 is mounted with a plurality of heat conduction bars 48, one end of the heat conduction bar 48 extends to the inside of the heat conduction pipe 47, the other end of the heat conduction bar 48 is inserted into the heat conduction glue 410, the heat conduction glue 410 proposed by the invention can adopt the high heat conduction thermoplastic elastomer AR-CH series products developed by Japan アロソ (solo) formation company, such as: AR-CH-MO 120/AR-CH-MO 150D, which has excellent insulating property, heat resistance and humidity resistance and flame retardant property.
The movable block 46-4 is embedded with a magnet.
The rack 49 is installed to the bottom of casing 43, is equipped with the opening on the lateral wall of casing 43, and the opening part articulates there is closing plate 41.
The heat pipes 47 are uniformly distributed outside the placing frame 49.
The glue injection pipe 411 is installed on the side wall of the top of the shell 43, and the glue injection pipe 411 is communicated with the inside of the shell 43.
One end of the temperature sensing storage tube 46-11 is provided with a spherical storage cavity, and the mercury liquid is stored in the spherical storage cavity.
The working principle is as follows:
the working principle is as follows: when the server is used, firstly, according to the size of the heat dissipation holes in the existing server shell, when the holes in the server are more and larger, extra holes do not need to be formed in the server;
when the holes are small, holes are formed in the server shell, or the server shell is detached;
after the above operations are completed, the sealing plate 41 is opened, each server is respectively placed in the corresponding shell 43 on the air inlet heat conducting mechanism 4, the sealing plate 41 is closed, then glue is injected into the shell 43 through the glue injection pipe 411, the glue is waited to be solidified in the shell 43, and the glue is wrapped outside the server;
after the loading is finished, starting the fan 3 to ventilate, introducing outside air through the air inlet pipe 2, then introducing the air into the air inlet cylinder 42 through the air guide pipe, then introducing the air into the heat conduction pipe 47, transferring heat generated by the server during working to the outside through the heat conduction glue 410, then introducing the heat into the heat conduction pipe 47 through the heat conduction rod 48 and the heat conduction pipe 47, taking away the heat in the heat conduction pipe 47 by the outside, introducing the heat into the air outlet box 44, then introducing the heat into the air outlet pipe 1 through the air guide pipe, and discharging the heat generated by the server to the outside of a data center machine room; and through seal chamber with have insulating, the setting of heat conduction glue of thermal conductivity, can seal the server, the radiating effect is good, external steam, the inside to air inlet heat conduction mechanism can not be leading-in to the dust for external steam, the dust can not bring into inside the server, prevent that the inside spare part of machine from corroding, the short circuit, the life of server has greatly been prolonged, and heat conduction glue and server and inside spare part in close contact with, the heat conduction radiating effect is good
When the heat generated by the server is different, the temperature of the heat conducting adhesive 410 is different, the heat conducting adhesive conducts heat to the mercury in the temperature sensing storage tube 46-11, the mercury expands when heated, the volume of the mercury changes when the mercury expands when heated and contracts when cooled according to the temperature, then the mercury in the temperature sensing storage tube 46-11 expands to drive the movable column 46-12 to move to one side, the conductive rod 46-10 is driven to move to one side and is contacted with the conductive blocks 46-8 with different numbers, so that the coil windings 46-5 with different numbers on the armature 46-6 are electrified, the magnetism generated by the armature 46-6 is different, the magnetism of the armature 46-6 and the magnetism of the magnet block on the movable block 46-4 are mutually repelled to drive the movable block 46-4 to move to one side, the rack 45 is driven to move to one side by the action rod 46-1, the rack 45 is meshed with the gear, the damper 414 is driven to rotate, so that the size of the air guide hole 416 is changed, the size of the air inlet can be changed according to the change of the heat productivity of the server, the heat dissipation strength is adjusted, the size of the air inlet can be changed according to the size of the heat dissipation capacity of the server, and when the server does not work, heat dissipation is not needed.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (8)
1. The multi-server heat dissipation device for the data center machine room comprises an air outlet pipe (1) and an air inlet pipe (2), and is characterized in that a fan (3) is installed at one end of the air inlet pipe (2), the air inlet pipe (2) is connected with a plurality of air inlet heat conduction mechanisms (4) through air guide pipes, and air outlet ends of the air inlet heat conduction mechanisms (4) are connected with the air outlet pipe (1) through the air guide pipes;
the air inlet heat conduction mechanism (4) comprises a shell (43), an air inlet cylinder (42) and an air outlet box (44), each server is respectively placed in the shell (43) on the corresponding air inlet heat conduction mechanism (4), heat conduction glue (410) is filled in the shell (43), the air inlet cylinder (42) and the air outlet box (44) are respectively installed at the top end and the bottom end of the shell (43), a plurality of heat conduction pipes (47) are installed in the shell (43), two ends of each heat conduction pipe (47) respectively extend into the air inlet cylinder (42) and the air outlet box (44), a temperature sensing electromagnetic transmission mechanism (46) is arranged between the shell (43) and the air inlet cylinder (42), an output shaft of the temperature sensing electromagnetic transmission mechanism (46) is connected with a horizontally arranged rack (45), the inside of the air inlet cylinder (42) is rotatably connected with a rotating shaft (412), and a gear (413) is installed on the rotating shaft (412), the rack (45) is meshed with the gear (413), the top end of the rotating shaft (412) is provided with the shutter (414), the top end of the shutter (414) is connected with a baffle (415) fixed in the air inlet cylinder (42) in a sliding and sealing mode, and the baffle (415) is provided with a plurality of air guide holes (416).
2. The multi-server heat dissipation device of the data center machine room according to claim 1, wherein the temperature sensing electromagnetic transmission mechanism (46) comprises a fixed cylinder (46-2) installed on the inner wall of the air inlet cylinder (42), an armature (46-6) is installed at one end inside the fixed cylinder (46-2), a plurality of groups of coil windings (46-5) are wound on the armature (46-6), a movable block (46-4) slidably connected inside the fixed cylinder (46-2) is arranged at one side of the armature (46-6), an action rod (46-1) is installed on the movable block (46-4), one end of the action rod (46-1) penetrates through the side wall of the fixed cylinder (46-2) and is connected with a rack (45), a temperature sensing storage tube (46-11) and an installation frame (46-9) are installed on the housing (43), the mounting rack (46-9) is provided with conductive blocks (46-8) the number of which is matched with that of the coil windings (46-5), one end of the temperature sensing storage tube (46-11) extends into the shell (43), the other end of the temperature sensing storage tube (46-11) is internally connected with a movable column (46-12) in a sliding way, the movable column (46-12) is provided with a conductive rod (46-10), and the conductive rod (46-10) is connected with the conductive blocks (46-8) in a sliding contact way, the conductive rod (46-10) is connected with a storage battery (46-7) through a lead, one end of the coil winding (46-5) is connected with the storage battery (46-7) through a lead, and the other end of the coil winding (46-5) is connected with a conductive block (46-8) through a lead.
3. The heat dissipation device for multiple servers in a data center room according to claim 1, wherein a plurality of heat conducting rods (48) are mounted on a side wall of the heat conducting pipe (47), one end of each heat conducting rod (48) extends into the heat conducting pipe (47), and the other end of each heat conducting rod (48) is inserted into the heat conducting glue (410).
4. The data center room multi-server heat sink according to claim 2, wherein the movable block (46-4) has magnets embedded thereon.
5. The multi-server heat dissipation device of a data center room according to claim 1, wherein a placing frame (49) is installed at the bottom end of the housing (43), an opening is formed in a side wall of the housing (43), and a sealing plate (41) is hinged to the opening.
6. The data center room multi-server heat dissipation device according to claim 1, wherein the heat pipes (47) are uniformly distributed outside the rack (49).
7. The multi-server heat dissipation device for the data center room according to claim 1, wherein a glue injection pipe (411) is installed on a top side wall of the housing (43), and the glue injection pipe (411) is communicated with the inside of the housing (43).
8. The multi-server heat sink of the data center room according to claim 1, wherein one end of the temperature sensing storage tube (46-11) is provided with a spherical storage cavity, and mercury liquid is stored in the spherical storage cavity.
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| CN201910546522.4A CN110278689B (en) | 2019-06-24 | 2019-06-24 | Multi-server heat dissipation device of data center machine room |
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| CN201910546522.4A CN110278689B (en) | 2019-06-24 | 2019-06-24 | Multi-server heat dissipation device of data center machine room |
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| CN110278689B true CN110278689B (en) | 2020-04-10 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111615311A (en) * | 2020-06-17 | 2020-09-01 | 李东飞 | Computer lab rack heat abstractor for computer technology development |
| CN114924625B (en) * | 2022-05-25 | 2022-12-13 | 深圳市万桥技术有限公司 | Server device for data transmission of contact center |
| CN115348812B (en) * | 2022-09-06 | 2023-10-13 | 深圳宁冠鸿科技股份有限公司 | Multi-server heat dissipation device and system for data center machine room |
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| TR200800829A1 (en) * | 2008-02-08 | 2009-08-21 | Türk Demi̇r Döküm Fabri̇kalari Anoni̇m Şi̇rketi̇ | Panel radiator with 33 mm pitch. |
| CN208338152U (en) * | 2018-04-27 | 2019-01-04 | 张北数据港信息科技有限公司 | A kind of radiator directly to radiate to outside data center machine room |
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