CN110278347A - Imaging modules and electric terminal - Google Patents
Imaging modules and electric terminal Download PDFInfo
- Publication number
- CN110278347A CN110278347A CN201810204778.2A CN201810204778A CN110278347A CN 110278347 A CN110278347 A CN 110278347A CN 201810204778 A CN201810204778 A CN 201810204778A CN 110278347 A CN110278347 A CN 110278347A
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- China
- Prior art keywords
- imaging modules
- microscope base
- conducting wire
- interconnecting piece
- circuit board
- Prior art date
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- 230000002411 adverse Effects 0.000 abstract description 5
- 239000011521 glass Substances 0.000 description 18
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- 239000000463 material Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 9
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- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
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- 238000010586 diagram Methods 0.000 description 4
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- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 3
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- 238000002955 isolation Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 229910019142 PO4 Inorganic materials 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
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- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Abstract
The invention discloses a kind of imaging modules and electric terminals.Imaging modules include circuit board, setting microscope base on circuit boards, the lens barrel being housed in microscope base, the lens arrangement and electric connection structure that lens barrel is arranged in.Electric connection structure includes conducting wire.Conducting wire is at least partially installed at the lateral surface of microscope base, and the upper end of conducting wire is electrically connected with lens arrangement, and conducting wire includes the interconnecting piece for being located at the lower end of conducting wire and connecting with circuit board.The imaging modules and electric terminal of embodiment of the present invention, it is connect using interconnecting piece with circuit board and realizes electrically conducting for lens arrangement, to the adverse effect caused by microscope base the problems such as such as electrical bad and bad order when reducing or avoid welding, the reliability of imaging modules is improved.
Description
Technical field
The present invention relates to technical field of imaging, more particularly, to a kind of imaging modules and electric terminal.
Background technique
The imaging modules of the relevant technologies focusing realized using the focal length that Zoom lens structure changes camera lens and in lens barrel or
Using laser direct structuring technique (Laser Direct Structuring, LDS), electrically conduct lens arrangement on microscope base.So
And since the material of lens barrel or microscope base is largely that liquid crystal polymer (Liquid Crystal Polymer, LCP) etc. is not resistant to
The material of high temperature, the problems such as lens barrel or microscope base being easy to cause to generate electrically bad and bad order in welding.
Summary of the invention
Embodiment of the present invention provides a kind of imaging modules and electric terminal.
The imaging modules of embodiment of the present invention include circuit board, the microscope base being arranged on the circuit board, at least partly
Lens barrel that ground is housed in the microscope base, the lens arrangement and electric connection structure that the lens barrel is set.The electric connection structure
Including conducting wire, the conducting wire is at least partially installed at the lateral surface of the microscope base, the upper end of the conducting wire and the lens knot
Structure electrical connection, the conducting wire include the interconnecting piece for being located at the lower end of the conducting wire and connecting with the circuit board.
The imaging modules of embodiment of the present invention due to being provided with conducting wire on microscope base lateral surface, and utilize the interconnecting piece
It is connect with the circuit board, therefore, when welding, the conducting wire on microscope base lateral surface can protect microscope base, when reducing or avoiding welding
To the adverse effect caused by the microscope base or the lens barrel the problems such as such as electrical bad and bad order, improve described
The reliability of imaging modules.
In some embodiments, the imaging modules include being formed in the board pads of the circuit board, the company
Socket part connects the board pads.In this way, the connection of the conducting wire Yu the circuit board is realized, to make the lens arrangement
It electrically conducts.
In some embodiments, the interconnecting piece is bulge-structure.In this way, increasing bonding area and the three-dimensional sky of welding
Between, be conducive to the intensity and efficiency that improve welding.
In some embodiments, the interconnecting piece is protruded from the outside of the microscope base towards the outside of the microscope base.Such as
This, realizes the bulge-structure of interconnecting piece.
In some embodiments, the interconnecting piece is widening structure.In this way, increasing bonding area, be conducive to improve
The intensity and efficiency of welding.
In some embodiments, the interconnecting piece from top to bottom gradually widen by type.In this way, realization interconnecting piece widens knot
Structure.
In some embodiments, the width range of the interconnecting piece is 0.2-3.5mm.In this way, guaranteeing weld strength
While being improved with efficiency, cost can be reduced.
In some embodiments, the lateral surface of the microscope base is formed with cabling channel, is mounted on the lateral surface of the microscope base
The position of the conducting wire be housed in the cabling channel.In this way, reducing conducting wire and extraneous friction, it is conducive to extend conducting wire
Service life.
In some embodiments, the conducting wire includes at least one positive wire and a cathode conductor, the anode
Conducting wire and the cathode conductor interval.In this way, realizing electrically conducting for lens arrangement.
Embodiment of the present invention provides a kind of electric terminal, and the electric terminal includes the imaging of any of the above-described embodiment
Mould group and shell, the shell offer positioning through hole.The imaging modules are arranged in the shell and lead to from the positioning
Expose in hole.
The electric terminal of embodiment of the present invention utilizes the interconnecting piece using the imaging modules of embodiment of the present invention
Connect with the circuit board, when reducing or avoid welding to such as electrically bad caused by the microscope base or the lens barrel and
The adverse effect of the problems such as bad order improves the reliability of the imaging modules.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, partially will be from following
Description in become obvious, or the practice of embodiment through the invention is recognized.
Detailed description of the invention
Above-mentioned and/or additional aspect and advantage of the invention is from combining in description of the following accompanying drawings to embodiment by change
It obtains obviously and is readily appreciated that, in which:
Fig. 1 is the structural schematic diagram of the imaging modules of embodiment of the present invention；
Fig. 2 is the structural schematic diagram of the lens section of the lens arrangement of embodiment of the present invention；
Fig. 3 is the structural schematic diagram of the imaging modules of another embodiment of the present invention；
Fig. 4 is the enlarged diagram of the part IV of the imaging modules of Fig. 3；
Fig. 5 is the floor map of the electric terminal of embodiment of the present invention.
Main element symbol description:
Imaging modules 10, circuit board 12, the first connector 122, the second connector 124, flexible joint 126, microscope base 14,
Lateral surface 142, cabling channel 144, roof 146, aperture 148, body part 141, protrusion 143, lens barrel 16, top surface 162, installation knot
Structure 164, locating piece 1642, locating slot 1644, lens arrangement 18, lead 182, adjustable lens 184, lens section 1842, encapsulation part
1844, interval 1846, glass substrate 1841, high molecular polymer 1843, glass film 1845, piezoceramics film 1847, electricity
Connection structure 19, conducting wire 192, interconnecting piece 1922, ontology 1924, conducting wire 194, interconnecting piece 1942, ontology 1944, bottom edge 1946,
Board pads 11, electric terminal 100, shell 20, positioning through hole 22.
Specific embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and for explaining only the invention, and is not considered as limiting the invention.
In the description of the present invention, term " first ", " second " are used for description purposes only, and should not be understood as instruction or dark
Show relative importance or implicitly indicates the quantity of indicated technical characteristic.The feature of " first ", " second " is defined as a result,
It can explicitly or implicitly include one or more feature.In the description of the present invention, the meaning of " plurality " is
Two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected or can mutually communicate；It can be directly connected, it can also be by between intermediary
It connects connected, can be the connection inside two elements or the interaction relationship of two elements.For the ordinary skill of this field
For personnel, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
Following disclosure provides many different embodiments or example is used to realize different structure of the invention.In order to
Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
Imaging modules 10 of the invention can be divided into two specific embodiments, be illustrated below to two embodiments.It needs
It is noted that deformation or alternative and this hair made by those skilled in the art's two embodiments according to the present invention
Within bright protection scope.
Embodiment one:
Referring to Fig. 1, the imaging modules 10 of embodiment of the present invention include circuit board 12, the mirror of setting on the circuit board 12
Seat 14, the lens barrel 16 being at least partly housed in microscope base 14, the lens arrangement 18 and electric connection structure 19 that lens barrel 16 is set.
Electric connection structure 19 includes conducting wire 192, and conducting wire 192 is at least partially installed at the lateral surface 142 of microscope base 14, conducting wire 192 it is upper
End is electrically connected with lens arrangement 18, and conducting wire 192 includes the interconnecting piece for being located at the lower end of conducting wire 192 and connecting with circuit board 12
1922。
The imaging modules 10 of embodiment of the present invention, due to being provided with conducting wire 192, and benefit on the lateral surface 142 of microscope base 14
It is connect with interconnecting piece 1922 with circuit board 12, therefore, when welding, the conducting wire 192 on the lateral surface 142 of microscope base 14 can protect microscope base
14, when reducing or avoid welding to caused by microscope base 14 or lens barrel 16 such as electrically bad and bad order the problems such as not
Benefit influences, and improves the reliability of imaging modules 10.
For the present invention, the lens barrel 16 being at least partly housed in microscope base 14, in the example of fig. 1, lens barrel 16
It is partly to be housed in microscope base 14, it is to be understood that lens barrel 16 includes the position in microscope base 14, and is located at microscope base 14
Outer position.For example, offering accommodating space (not shown), 146 company of opening up of roof of microscope base 14 in microscope base 14 incorporated by reference to Fig. 1
The aperture 148 of logical accommodating space, a position of lens barrel 16 are located at accommodating space, and another position of lens barrel 16 is stretched out from aperture 148
Outside microscope base 14.
In the example of fig. 1, the face shaping of microscope base 14 is substantially in cuboid.
In other embodiments, the lens barrel 16 being at least partly housed in microscope base 14, also can refer to, and lens barrel 16 accommodates completely
In microscope base 14, for example, entire lens barrel 16 is respectively positioned in accommodating space or, in idle space and aperture 148, that is to say, that water
Level land looks over, and the position for protruding from microscope base 14 is not present in lens barrel 16.Light can be from 148 incidence of aperture of 14 roof 146 of microscope base
To lens barrel 16.
In the present embodiment, circuit board 12 includes flexible circuit board.Flexible circuit board Distribution density is high, light-weight, thickness
It is thin, freely it can wind and fold, help to reduce assembling procedure and enhance reliability.In addition, flexible circuit board can mention
For excellent electrical property, it is able to satisfy the design needs of the miniaturization of imaging modules 10.
It is appreciated that in other embodiments, circuit board 12 includes Rigid Flex.Rigid Flex is existing certain to scratch
Property region, also have certain rigid region, be conducive to save interiors of products space, reduce imaging modules 10 volume.Another
In a little other embodiments, circuit board 12 includes ceramic substrate.Ceramic substrate has excellent thermal conductivity, keeps the encapsulation of chip very tight
It gathers, so that power density be made to greatly improve, improves the reliability of imaging modules 10.In other other embodiments, circuit board
12 include printed circuit board.The mistake of wiring and assembly can be reduced using printed circuit board, to save the maintenance of equipment, adjust
Examination and review time.In addition, printed circuit board is mechanization, automated production, cost is lower, is conducive to save the cost.
In the present embodiment, circuit board 12 includes the first connector 122, the second connector 124 and flexible joint 126.
Flexible joint 126 connects the first connector 122 and the second connector 124.Second connector 124 is used for and external circuit phase
Even.External circuit powers to imaging modules 10 by circuit board 12 and data are transmitted.The transmittable control signal of external circuit or
Other signals of communication are to imaging modules 10 and receive picture signal or other signals of communication that imaging modules 10 generate, so that at
As mould group 10 can work normally.
In addition, imaging modules 10 include the imaging sensor (not shown) being arranged on the first connector 122, image sensing
Device is located at the image side of lens arrangement 18.Imaging sensor carries out Image Acquisition, and optical imagery is converted to electronic signal.
In one example, imaging sensor is cmos image sensor.Cmos image sensor not only very power saving, energy
The cost used is enough reduced, and the hardware configuration of system can be greatly simplified.In other examples, imaging sensor
It can be ccd image sensor.
In one example, microscope base 14 and lens barrel 16 are adopted and are made from an insulative material.The resistivity of insulating materials is very high, uses
Insulating materials separates internal element and the external world, can be avoided the adverse effects such as short circuit.Insulating materials can be plastics.Plastics are good
Good insulator, light weight and firm, handling ease, it is cheap light, cost is advantageously reduced, the weight of imaging modules 10 is mitigated
Amount, facilitates production.
In the present embodiment, lens arrangement 18 includes the lead 182 being electrically connected with conducting wire 192.It is provided with outside lead 182
Shadowless glue (not shown).Shadowless glue is applied outside lead 182, the intensity of lead 182 can be increased and delays the old of lead 182
Change.
In the present embodiment, the top surface 162 of lens barrel 16 is formed with mounting structure 164.Mounting structure 164 can be from top surface
162 sagging containers, container is connected to the through-hole (not shown) that lens barrel 16 is used to accommodate eyeglass (not shown) and lens knot
The center of structure 18 and the center of eyeglass are corresponding.Lens arrangement 18 is at least partially disposed in mounting structure 164.In other words,
Lens arrangement 18 may include the position in mounting structure 164 and the position outside mounting structure 164.It is appreciated that
Lens arrangement 18 can it is concordant with top surface 162, go out in the lower section of top surface 162 or from 162 dimpling of top surface.When lens arrangement 18 and top
When face 162 is concordant, the entirety of imaging modules 10 can be reduced as much as possible while being adequately protected lens arrangement 18
Volume.When lower section of the lens arrangement in top surface 162, mounting structure 18 can be made more abundant to the protection of lens arrangement.
When lens arrangement 18 goes out from 162 dimpling of top surface, the specific of certain electric terminals for needing to install imaging modules 10 can be adapted to
Structure.In this way, the above structure can be selected and be adjusted according to specific requirements and the condition of production.
In the present embodiment, lens arrangement 18 is Zoom lens structure comprising adjustable lens 184 and anti-dazzling screen (figure
Do not show), adjustable lens 184 include lens section 1842 and encapsulation part 1844, and lens section 1842 is arranged in encapsulation part 1844.Shading
Piece offers through-hole (not shown), and anti-dazzling screen is arranged on lens section 1842 and lens section 1842 partly exposes from through-hole.It hides
Mating plate covers the interval 1846 between lens section 1842 and encapsulation part 1844.1842 He of lens section is covered by setting anti-dazzling screen
Interval 1846 between encapsulation part 1844, makes the foreign matters such as dust be not easily accessed lens arrangement 18, adjustable lens is reduced or avoided
184 risks being scratched.
Referring to Fig. 2, in the present embodiment, lens section 1842 includes glass substrate 1841, high molecular polymer 1843, glass
Glass film 1845 and piezoceramics film 1847.Piezoceramics film 1847 by voltage control and deformation occurs so that glass
Deformation occurs for film 1845 and high molecular polymer 1843, to generate different refractive index, changes the focus point of light, realizes
The zoom function of lens arrangement 18.Using piezoceramics film 1847 by voltage is controlled and the principle that deformation occurs realizes that optics becomes
Coke realizes focusing compared to using voice coil motor, and the manufacturing process of imaging modules 10 is simpler.In addition, imaging modules 10 do not have
Be magnetic component, will not generate magnetic interference.
In some instances, glass substrate 1841 is blue tinted glass, and advantageously, glass substrate 1841 is blue color plane glass
Glass, the main component of blue tinted glass phosphoric acid for phosphate or not.Glass substrate 1841 can be through infrared isolation coating film treatment.
The main component blue tinted glass of phosphoric acid and glass substrate 1841 through infrared isolation coating film treatment for phosphate or not,
It can be with filtering infrared light.Since imaging sensor can sense infrared light, and human eye only has reaction to visible light.It chooses blue
Material of the color glass as glass substrate 1841, or glass substrate 1841 is subjected to infrared isolation plated film, enable to image
Sensor and scenery effect seen by person are almost the same.
In the present embodiment, imaging modules 10 include being formed in the board pads 11 of circuit board 12, and interconnecting piece 1922 connects
Connect board pads 11.In this way, board pads 11 are easy to implement the connection of conducting wire 192 Yu circuit board 12, to make lens knot
Structure 18 electrically conducts.
In the example of fig. 1, interconnecting piece 1922 is bulge-structure.In this way, bonding area and welding solid space are increased,
The intensity and efficiency for being conducive to improve welding, advantageously account for electrically bad problem.Meanwhile raised interconnecting piece 1922 is welding
The distance between lateral surface 142 of microscope base 14 has been zoomed out when connecing, and can reduce or avoid microscope base 14 due to being influenced by welding
Caused by bad order.
Specifically, interconnecting piece 1922 is protruded from the lateral surface 142 of microscope base 14 to the outside of microscope base 14.In this way, to microscope base 14
Outside protrusion interconnecting piece 1922, be circuit board 12 connect when, can be according to the position of board pads 11 first by interconnecting piece
1922 pre-determined bits, facilitate the connection for realizing interconnecting piece 1922 and board pads 11.Meanwhile pad can be far from microscope base 14, drop
Bad order that is low or avoiding the problem that the generation of microscope base 14.
It is appreciated that conducting wire 192 can be L-shaped, interconnecting piece 1922 can be considered as the short side of L, the ontology 1924 of conducting wire 192
The long side of L can be considered as.The ontology 1924 of conducting wire 192 is at least partly attached to the lateral surface 142 of microscope base 14, and interconnecting piece 1922 is certainly
The ontology 1924 of conducting wire 192 is protruded to the outside of microscope base 14.Wherein, protrusion can refer to that sheet extends, and can also refer to block-shaped protrusion,
Shape can be regular, can also be irregular, is not defined herein to the concrete shape of the bulge-structure of interconnecting piece 1922.
The lateral surface 142 of microscope base 14 is formed with cabling channel 144, is mounted on the portion of the conducting wire 192 of the lateral surface 142 of microscope base 14
Position is housed in cabling channel.In this way, reducing conducting wire 192 and extraneous friction, it is conducive to extend the service life of conducting wire 192.Scheming
In the embodiment shown, the position for being mounted on the conducting wire 192 of the lateral surface 142 of microscope base 14 can be a part or whole of ontology 1924
Body.
Conducting wire 192 includes at least one positive wire and a cathode conductor, positive wire and cathode conductor interval.Herein
Interval refer to, positive wire and cathode conductor insulation.In this way, realizing electrically conducting for lens arrangement 18.Certainly, conducting wire 192
It can also include one group of spare conducting wire, imaging modules 100 be repaired and fault detection with facilitating.
It is appreciated that the specific structure of conducting wire 192 is not limited to above-mentioned bulge-structure and widening structure, and every
The specific structure of conducting wire can be the same or different.
In the present embodiment, the mode of the lateral surface 142 of microscope base 14 is arranged in as vapor deposition in conducting wire 192.The technique of vapor deposition is fast
It is prompt efficient, make conducting wire 192 that the lateral surface 142 of microscope base 14 is set using the technique of vapor deposition, can be improved the life of imaging modules 10
Produce efficiency.
In other embodiments, the mode of the lateral surface 142 of microscope base 14 is arranged in as plating in conducting wire 192.Electroplating technique
It is widely used, using electroplating technique conducting wire 192 is set in 14 lateral surface 142 of microscope base, can mention while cost is reduced
The production efficiency of high imaging modules 10.
Embodiment two:
In the interpretation of embodiment two, explanation be embodiment two Yu one main difference of embodiment place, implement
Example two is the same as example 1 or similar part, omits in the explanation of this embodiment.
Fig. 3 and Fig. 4 are please referred to, in the present embodiment, interconnecting piece 1942 is widening structure.In this way, bonding area is increased,
Be conducive to improve the intensity and efficiency of welding, to solve the problems, such as electrically bad.
In the example shown in the series of figures, interconnecting piece 1942 from top to bottom gradually widen by type.In this way, realization interconnecting piece 1942 widens knot
Structure.
It is appreciated that gradually type is widened and is referred to from top to bottom, i.e., from the ontology 1944 of conducting wire 194 to the bottom edge of interconnecting piece 1942
1946 width are gradually increased.Certainly, herein not will gradually type widen be limited to it is stringent from ontology 1944 to 1946 width of bottom edge
In the range of ground is gradually increased.In other words, the partial width from ontology 1944 downwards but also not to bottom edge 1946 is gradually increased
And this width is kept until the model also widened in gradually type of bottom edge 1946 or width and situations such as being anisotropically gradually increased
Farmland.
Advantageously, the width range P of interconnecting piece 1942 is 0.2-3.5mm.In this way, being obtained in guarantee weld strength and efficiency
While raising, cost can be reduced.
It is worth noting that, the width range P of interconnecting piece 1942 refers to interconnecting piece 1942 as shown in the mark in Fig. 3
The width range on bottom edge 1946.Specifically, when the width P on the bottom edge of interconnecting piece 1,942 1946 is 0.5mm, guarantee weld strength
It is best with the effect of efficiency.
It is appreciated that when the width P on bottom edge 1946 is less than 0.2mm, due to interconnecting piece 1942 and board pads 11
Bonding area is too small, and weld strength and welding efficiency cannot be guaranteed.When the width P on bottom edge 1946 is greater than 3.5mm, interconnecting piece
1942 bonding area is excessive, and the part for having exceeded 3.5mm cannot participate in welding or cannot being actively engaged in welding.Work as bottom edge
When 1946 width P range is 0.2-3.5mm, it can both guarantee the intensity and efficiency of welding, material can also be saved as much as possible
Expect and reduce cost.
In addition, in the present embodiment, the horizontal face shaping of microscope base 14 is in " convex " font, i.e., microscope base 14 includes body part
141 and protrusion 143.Body part 141 is arranged on the first connector 122 of circuit board 12, and the first connector 122 passes through flexibility
Interconnecting piece 126 is connect with the second connector 124, and the details of the second connector 124 is not drawn in figure three, it is readily appreciated that
It is that the details of second connector 124 can be identical with figure one in figure three.Protrusion 143 is arranged on body part 141, accommodating
Body part 141 and protrusion 143 are run through in space, and the top of protrusion 143 offers aperture (not shown), and the lower part of lens barrel 16 is certainly
Aperture is protruded into microscope base 14, and the top projection of lens barrel 16 is outside microscope base 14.
In the present embodiment, imaging modules 10 include being formed on the top surface 162 of lens barrel 16 and cooperating with 162 shape of top surface
Mounting structure 164.Lens arrangement 18 is arranged in mounting structure 164.In this way, accommodating and protecting the same of lens arrangement 18
When, the size of imaging modules 10 will not expand because of mounting structure 164, be conducive to the miniaturization of imaging modules 10.
In the present embodiment, mounting structure 164 includes the multiple locating pieces 1642 upwardly extended from the top surface of lens barrel 16 162
With the locating slot 1644 limited jointly by locating piece 1642, lens arrangement 18 is mounted in locating slot 1644.Each locating piece
1642 is blocky in circular arc, and the outer periphery of the top surface 162 of the outer arc side and lens barrel 16 of locating piece 1642 is aligned.This makes locating piece
1642 cooperate with 162 shape of top surface of lens barrel 16, to keep the structure of imaging modules 10 more smooth, shape is more beautiful.
In other examples, mounting structure 164 includes being arranged on the top surface 162 of lens barrel 16 and shape and top surface
Multiple locating pieces 1642 that the substrate (not shown) and self-reference substrate of 162 cooperations upwardly extend.In other words, 164 He of mounting structure
Lens barrel 16 is separately formed, and makes mounting structure 164 and 16 groups of lens barrel by substrate being arranged on the top surface 162 of lens barrel 16
It closes.Specifically, substrate can be arranged on lens barrel 16 by way of glued.
Referring to Fig. 5, embodiment of the present invention provides a kind of electric terminal 100, electric terminal 100 includes any of the above-described reality
The imaging modules 10 and shell 20 of mode are applied, shell 20 offers positioning through hole 22.Imaging modules 10 be arranged in shell 20 and
Self-positioning through-hole 22 exposes.
The electric terminal 100 of embodiment of the present invention is reduced or is avoided using the imaging modules 10 of embodiment of the present invention
When welding to caused by microscope base 14 or lens barrel 16 such as electrically bad and bad order the problems such as adverse effect, improve
The reliability of imaging modules 10.
Electric terminal 100 includes but is not limited to that mobile phone, tablet computer, wearable device, entrance guard device, car-mounted terminal etc. make
With the electric terminal of shooting function.
In the example shown in the series of figures, electric terminal 100 includes rear camera or front camera.Front camera generally as
Element is relatively low, and using fixed-focus mould group, therefore pervious front camera size is smaller.It is preposition but as functional requirement increases
The size of camera increases.Based on the considerations of taking into account functional and full frameization, in the illustrated embodiment, by imaging modules 10
It is applied in front camera, has both met the demand of function, also complied with the trend of comprehensive screen.It is appreciated that imaging modules
10 are equally applicable to rear camera.
Specifically, embodiment of the present invention can only meet above-mentioned one of embodiment or meet simultaneously above-mentioned multiple
Embodiment, that is to say, that the embodiment that said one or multiple embodiments are composed also belongs to embodiment party of the present invention
The protection scope of formula.
In the description of this specification, reference term " certain embodiments ", " embodiment ", " some embodiment party
The description of formula ", " exemplary embodiment ", " example ", " specific example " or " some examples " etc. means in conjunction with the embodiment party
Formula or example particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the invention
In.In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover,
Particular features, structures, materials, or characteristics described can be in any one or more embodiments or example with suitable
Mode combine.
Although embodiments of the present invention have been shown and described above, it is to be understood that above embodiment is
Illustratively, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be right
Above embodiment is changed, modifies, replacement and variant, and the scope of the present invention is defined by the claims and their equivalents.
Claims (10)
1. a kind of imaging modules characterized by comprising
Circuit board；
Microscope base on the circuit board is set；
The lens barrel being at least partly housed in the microscope base；
The lens arrangement of the lens barrel is set；With
Electric connection structure, the electric connection structure include conducting wire, and the conducting wire is at least partially installed at the outside of the microscope base
Face, the upper end of the conducting wire are electrically connected with the lens arrangement, the conducting wire include positioned at the conducting wire lower end and with it is described
The interconnecting piece of circuit board connection.
2. imaging modules as described in claim 1, which is characterized in that the imaging modules include being formed in the circuit board
Board pads, the interconnecting piece connect the board pads.
3. imaging modules as described in claim 1, which is characterized in that the interconnecting piece is bulge-structure.
4. imaging modules as claimed in claim 3, which is characterized in that the interconnecting piece is from the outside of the microscope base towards described
It protrudes in the outside of microscope base.
5. imaging modules as described in claim 1, which is characterized in that the interconnecting piece is widening structure.
6. imaging modules as claimed in claim 5, which is characterized in that the interconnecting piece from top to bottom gradually widen by type.
7. imaging modules as claimed in claim 5, which is characterized in that the width range of the interconnecting piece is 0.2-3.5mm.
8. imaging modules as described in claim 1, which is characterized in that the lateral surface of the microscope base is formed with cabling channel, installation
It is housed in the cabling channel at the position of the conducting wire of the lateral surface of the microscope base.
9. imaging modules as described in claim 1, which is characterized in that the conducting wire includes at least one positive wire and one
Cathode conductor, the positive wire and the cathode conductor interval.
10. a kind of electric terminal characterized by comprising
Shell, the shell offer positioning through hole；
The described in any item imaging modules of claim 1-9, the imaging modules are arranged in the shell and from the positioning
Through-hole exposes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810204778.2A CN110278347A (en) | 2018-03-13 | 2018-03-13 | Imaging modules and electric terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810204778.2A CN110278347A (en) | 2018-03-13 | 2018-03-13 | Imaging modules and electric terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110278347A true CN110278347A (en) | 2019-09-24 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810204778.2A Pending CN110278347A (en) | 2018-03-13 | 2018-03-13 | Imaging modules and electric terminal |
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| CN (1) | CN110278347A (en) |
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Address after: 510663 No.7, Shenzhou Road, Science City, Guangzhou hi tech Industrial Development Zone, Guangdong Province Applicant after: Guangzhou delta Imaging Technology Co.,Ltd. Address before: 510663 No.7, Shenzhou Road, Science City, Guangzhou hi tech Industrial Development Zone, Guangdong Province Applicant before: O-FILM IMAGE TECHNOLOGY (GUANGZHOU) Co.,Ltd. |
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Effective date of registration: 20210617 Address after: 330096 no.1404, Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: Jiangxi Jinghao optics Co.,Ltd. Address before: 510663 No.7, Shenzhou Road, Science City, Guangzhou hi tech Industrial Development Zone, Guangdong Province Applicant before: Guangzhou delta Imaging Technology Co.,Ltd. |