CN110277502A - Light emitting diode with quantum dots and preparation method thereof - Google Patents

Light emitting diode with quantum dots and preparation method thereof Download PDF

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Publication number
CN110277502A
CN110277502A CN201810208473.9A CN201810208473A CN110277502A CN 110277502 A CN110277502 A CN 110277502A CN 201810208473 A CN201810208473 A CN 201810208473A CN 110277502 A CN110277502 A CN 110277502A
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China
Prior art keywords
light emitting
emitting diode
quantum dots
metal
electrode layer
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CN201810208473.9A
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张滔
向超宇
李乐
王雄志
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TCL Corp
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TCL Corp
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/805Electrodes
    • H10K50/81Anodes
    • H10K50/813Anodes characterised by their shape
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60Forming conductive regions or layers, e.g. electrodes

Abstract

The invention belongs to technology of quantum dots fields, and in particular to a kind of light emitting diode with quantum dots and preparation method thereof.The light emitting diode with quantum dots, including hearth electrode and top electrode, and the quantum dot light emitting layer being arranged between the hearth electrode and the top electrode, it is characterised in that, the hearth electrode surface opposite with the quantum dot light emitting layer is in pleated structure, and the hearth electrode is made of metal material.Light emitting diode with quantum dots of the invention can effectively reduce SPP loss, improve device light extraction efficiency by the pleated structure being arranged on the surface of hearth electrode (can be cathode, be also possible to anode).

Description

Light emitting diode with quantum dots and preparation method thereof
Technical field
The invention belongs to quantum dot fields, and in particular to a kind of light emitting diode with quantum dots and preparation method thereof.
Background technique
Quantum dot light emitting device is to add the device that direct voltage drive quanta point material shines, tool in anode and cathode Colored saturation, purity is high, monochromaticjty is good, Color tunable and the advantages that can be prepared with solwution method, it is considered to be the next generation is flat The advantage technology of plate display.
Due to the multilayered structure of light emitting diode with quantum dots, photon in luminescence process be radiated device exterior can be with not Most energy is lost with form, to weaken the external quantum efficiency of device.The form of its energy loss includes: metal watch Surface plasma excimer (SPP) loss, substrate waveguide mode, ITO/ organic layer waveguide mode etc., wherein SPP loss is larger.SPP It is a kind of mixed activation state formed that interacted by free electron and photon of local on medium/metal interface, is a kind of The guided wave mode that can only be propagated along interface direction, and the energy of final SPP all translates into Joule heat and loses, and leads to device amount Sub- inefficiency.All there is SPP loss in bottom emitting and top emitting light emitting diode with quantum dots, wherein in top emitting device SPP loss is more serious, because usually all using metal electrode in cathode, anode in the device of top emitting, and two metal electrodes There will be SPP loss, how reduce SPP loss, be of great significance for the commercial applications of light emitting diode with quantum dots. Therefore, many researchers attempt to take different means to reduce SPP loss, for example increase between luminescent layer and metal electrode Distance, since SPP is to be radiated to cause with metal interaction by exciton in light emitting diode with quantum dots, although can subtract in this way Few SPP loss, but also will increase device operating voltages, while increasing waveguide mode loss.
Therefore, the prior art has much room for improvement.
Summary of the invention
It is an object of the invention to overcome the above-mentioned deficiency of the prior art, a kind of light emitting diode with quantum dots and its system are provided Preparation Method, it is intended to solve all there is technical issues that SPP in existing light emitting diode with quantum dots.
For achieving the above object, The technical solution adopted by the invention is as follows:
One aspect of the present invention provides a kind of light emitting diode with quantum dots, including hearth electrode and top electrode, and is arranged in institute State the quantum dot light emitting layer between hearth electrode and the top electrode, the hearth electrode surface opposite with the quantum dot light emitting layer In pleated structure, and the hearth electrode is made of metal material.
Another aspect of the present invention provides a kind of preparation method of light emitting diode with quantum dots, includes the following steps:
Substrate is provided;
On the substrate by metal material deposition, it is then made annealing treatment, obtains surface is in pleated structure first Metal electrode layer;The metal material is deposited on first metal electrode layer again, obtains the second metal electrode layer;Its In, first metal electrode layer and second metal electrode layer form the hearth electrode.
Quantum dot light emitting layer is deposited on second metal electrode layer, the deposition top electricity on the quantum dot light emitting layer Pole.
Light emitting diode with quantum dots provided by the invention, by hearth electrode (can be cathode, be also possible to anode) The pleated structure of surface setting can effectively reduce SPP loss, improve device light extraction efficiency.SPP is a kind of free electron and photon Interact the guided wave mode formed, when SPP wave vector, which is less than, is emitted light wave vector in luminescent layer, SPP mode wave vector energy Photon radiation is converted into be extracted, and the electrode of pleated structure can make SPP wave generate the loss of momentum by random scatter, The transformation efficiency of SPP to light radiation is improved, SPP loss is reduced.
In the preparation method of light emitting diode with quantum dots provided by the invention, the metal material for preparing electrode is deposited on base On bottom, detailed process is: first depositing the first metal electrode layer, two-dimensional metallic film (i.e. the first metal electricity being deposited in substrate Pole layer) it can be in thermodynamic instability state, metal material can occur irregularly to reunite, similar to " dewetting " in welding, Heat treatment can accelerate this irregular reunion situation;After deposited the first metal electrode layer in substrate, high temperature rapid thermal annealing, Make metal that irregular reunion occur, to form pleated structure, the second metal electrode is then deposited on the first metal electrode layer Layer obtains the complete hearth electrode with pleated structure.The pleated structure electrode that the preparation method obtains can effectively reduce SPP damage Consumption improves light emitting diode with quantum dots efficiency, and the method is easy to operate, is not necessarily to complicated technology, at low cost, is suitable for big ruler Very little industrial production.
Detailed description of the invention
Fig. 1 is hearth electrode of embodiment of the present invention preparation process schematic diagram.
Specific embodiment
In order to which technical problems, technical solutions and advantageous effects to be solved by the present invention are more clearly understood, below in conjunction with Embodiment, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only used to explain The present invention is not intended to limit the present invention.
On the one hand, the embodiment of the invention provides a kind of light emitting diode with quantum dots, including hearth electrode and top electrode, and Quantum dot light emitting layer between the hearth electrode and the top electrode, the hearth electrode and the quantum dot light emitting layer phase are set Pair surface be in pleated structure, and the hearth electrode is made of metal material.
Light emitting diode with quantum dots provided in an embodiment of the present invention, by (can be cathode in hearth electrode, being also possible to sun Pole, when the hearth electrode is anode, the top electrode is cathode;When the hearth electrode is cathode, the top electrode is sun Pole) surface setting pleated structure, can effectively reduce SPP loss, improve device light extraction efficiency.SPP is a kind of free electron Interact the guided wave mode to be formed with photon, when SPP wave vector, which is less than, is emitted light wave vector in luminescent layer, SPP mode wave Vector can be converted into photon radiation and be extracted, and the electrode of pleated structure can make SPP wave generate momentum by random scatter Loss improves the transformation efficiency of SPP to light radiation, reduces SPP loss.
Further, the hearth electrode with a thickness of 45-260nm.Further, when the light emitting diode with quantum dots When for bottom emitting type light emitting diode with quantum dots, the thickness of hearth electrode is preferably 45-85nm, when the light emitting diode with quantum dots When for top emission type light emitting diode with quantum dots, the thickness of hearth electrode is preferably 100-260nm.It, can specifically when preparation It first metal material to be deposited in substrate, then makes annealing treatment, obtains with a thickness of 30-60nm, surface in the of pleated structure One metal electrode layer, the second metal that then deposition thickness is 15-25nm or 70-200nm on first metal electrode layer Electrode layer.
The principle of hearth electrode thickness selection are as follows: the thickness of the first metal electrode layer first deposited may be selected in 30-60nm, such as The too small metal film of fruit thickness can not generate the biggish pleated structure of surface undulation, can not play the role of effective random scatter to subtract Few SPP loss;And blocked up film can make metallic film tend to thermodynamic stability, it is difficult to occur during heat treatment not Rule agglomerates into pleated structure.Because the first metal electrode layer is with a thickness of 30-60nm, and there is pleated structure, is hardly formed Electrode layer with complete function, so can redeposited the second metal electricity with a thickness of 15-25nm on the first metal electrode layer Pole layer, to form the complete hearth electrode with a thickness of 45-85nm, hearth electrode in this case is relatively thin, may adapt to Bottom emitting type light emitting diode with quantum dots.
However, making deposition film be easy to hold in this way in island growth due to the presence of the first metal electrode layer pleated structure Easily there are electrode hole, electrode hole will cause the generation of blackspot in device light emitting region, while also will increase the leakage in device Electric current.In order to eliminate electrode hole this problem, the embodiment of the present invention is made to generate better effect, it can be in the first metal electrode layer Upper preferred deposition with a thickness of 70-200nm the second metal electrode layer.If the second metal electrode layer of deposition is excessively thin can also There are holes;Deposit the second blocked up metal electrode layer and will cause entire thickness of detector and increase, at the same increase time and technique at This.The complete hearth electrode obtained after the second metal electrode layer that deposition thickness is 70-200nm with a thickness of 100-260nm, because of this In the case of hearth electrode due to blocked up, be not suitable for bottom emitting type light emitting diode with quantum dots, be suitable only for top emission type amount Sub- point luminescent diode.Hearth electrode under the thickness can not only reduce SPP loss, but also can eliminate electrode hole, because This, in the embodiment of the present invention, the effect of top emission type light emitting diode with quantum dots is optimal.
Further, the metal material includes at least one of Al, Ag and Cu/Pt alloy.
Further, such as hearth electrode is anode, and the top electrode is cathode;Then the anode and the quantum dot are sent out Hole injection layer and hole transmission layer are also stacked between photosphere, the hole injection layer is adjacent with the anode;And institute It states and has also been stacked electron injecting layer and electron transfer layer between cathode and the quantum dot light emitting layer, the electron injecting layer It is adjacent with the cathode.If the hearth electrode is cathode, the top electrode is anode, also can be such.
Further, the light emitting diode with quantum dots is top emission type light emitting diode with quantum dots or bottom emitting type quantum Point luminescent diode.Because all there is SPP loss in the light emitting diode with quantum dots of bottom emitting type and top emission type, so the two It is all suitable for.However, the SPP loss in the device of top emission type is more serious, because usually in cathode, sun in the device of top emission type Pole all uses metal electrode, and two metal electrodes can all have SPP loss, therefore the light emitting diode with quantum dots of the present embodiment Preferably top emission type light emitting diode with quantum dots.But as stated above, for example two pole of bottom emitting type quantum dot light emitting Pipe, hearth electrode with a thickness of 50-80nm;For example top emission type light emitting diode with quantum dots, hearth electrode with a thickness of 100- 260nm。
On the other hand, the embodiment of the invention also provides a kind of preparation method of light emitting diode with quantum dots, including it is as follows Step:
S01: substrate is provided;
S02: on the substrate by metal material deposition, then being made annealing treatment, and obtains surface in pleated structure First metal electrode layer;The metal material is deposited on first metal electrode layer again, obtains the second metal electrode layer; Wherein, first metal electrode layer and second metal electrode layer form the hearth electrode.
S03: depositing quantum dot light emitting layer on second metal electrode layer, and top is deposited on the quantum dot light emitting layer Electrode.
Above-mentioned preparation method obtains in light emitting diode with quantum dots, and the hearth electrode is anode, and the top electrode is cathode; Or the hearth electrode is cathode, the top electrode is anode.
In the preparation method of light emitting diode with quantum dots provided in an embodiment of the present invention, the metal material for preparing electrode is sunk In substrate, detailed process is product: first depositing the first metal electrode layer, the two-dimensional metallic film (i.e. first being deposited in substrate Metal electrode layer) it can be in thermodynamic instability state, metal material can occur irregularly to reunite, similar to " anti-in welding Wetting ", heat treatment can accelerate this irregular reunion situation;After deposited the first metal electrode layer in substrate, high temperature is fast Fast annealing makes metal that irregular reunion occur, to form pleated structure, the second gold medal is then deposited on the first metal electrode layer Belong to electrode layer, obtains the complete hearth electrode with pleated structure.The pleated structure electrode that the preparation method obtains can effectively subtract Few SPP loss, improves light emitting diode with quantum dots efficiency, and the method is easy to operate, is not necessarily to complicated technology, at low cost, fits For large scale industrial production.
Further, in above-mentioned steps S01, the preferred glass substrate of substrate.
Further, in above-mentioned steps S02: the annealing carries out in inert gas.Inert gas can be nitrogen Gas, helium, neon etc..Further, the temperature of the annealing is 500-80 DEG C;The time of the annealing is 2- 6min.Under conditions of the annealing, the hearth electrode that surface is in pleated structure can be preferably obtained.
Further, in above-mentioned steps S02, first metal electrode layer with a thickness of 30-60nm, when the quantum dot Light emitting diode be bottom emitting type light emitting diode with quantum dots when, second metal electrode layer with a thickness of 15-25nm;Work as institute State light emitting diode with quantum dots be top emission type light emitting diode with quantum dots when, second metal electrode layer with a thickness of 70- 200nm.Selection and deposition process about hearth electrode thickness have been explained above, and no longer illustrate here.In addition, the present invention is real The metal material for applying example includes at least one of Al, Ag and Cu/Pt alloy.
The present invention successively carried out test of many times, and it is further detailed as reference pair invention progress now to lift A partial experiment result Thin description, is described in detail combined with specific embodiments below.
Embodiment 1
A kind of preparation method of light emitting diode with quantum dots, includes the following steps:
Deposit Ag metal film i.e. the first metal electrode layer of 30-60nm on the glass substrate using vacuum evaporation technology (such as Metal film 1 in Fig. 1).Utilize rta technique in 500-800 under nitrogen protection post-depositional first metal electrode layer DEG C annealing 2-6min, accelerates the agglomeration of metal film, forms the pleated structure such as Fig. 1, the Ag of 70-200nm is then deposited again Metal film i.e. the second metal electrode layer (metal film 2 as shown in figure 1), double layer of metal film (i.e. the first metal electrode layer and the second gold medal Belong to electrode layer) it is used as device cathodes;Be sequentially depositing on cathode later device other luminous layer structures (such as quantum dot light emitting layer and Anode).
Embodiment 2
A kind of preparation method of light emitting diode with quantum dots, includes the following steps:
Deposit Al metal film i.e. the first metal electrode layer of 30-60nm on the glass substrate using vacuum evaporation technology (such as Metal film 1 in Fig. 1).Utilize rta technique in 500-800 under nitrogen protection post-depositional first metal electrode layer DEG C annealing 2-6min, accelerates the agglomeration of metal film, forms the pleated structure such as Fig. 1, the Ag of 70-200nm is then deposited again Metal film i.e. the second metal electrode layer (metal film 2 as shown in figure 1), double layer of metal film (i.e. the first metal electrode layer and the second gold medal Belong to electrode layer) it is used as device cathodes;Be sequentially depositing on cathode later device other luminous layer structures (such as quantum dot light emitting layer and Anode).
Embodiment 3
A kind of preparation method of light emitting diode with quantum dots, includes the following steps:
Deposit Cu/Pt metal film i.e. the first metal electrode layer of 30-60nm on the glass substrate using vacuum evaporation technology (metal film 1 as shown in figure 1).Utilize rta technique in 500- under nitrogen protection post-depositional first metal electrode layer 800 DEG C of annealing 2-6min accelerate the agglomeration of metal film, form the pleated structure such as Fig. 1, are then deposited 70-200nm's again Cu/Pt metal film i.e. the second metal electrode layer (metal film 2 as shown in figure 1), double layer of metal film (i.e. the first metal electrode layer and Two metal electrode layers) device cathodes are used as, other luminous layer structure (such as quantum dot light emittings of device are sequentially depositing on cathode later Layer and anode).
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.

Claims (10)

1. a kind of light emitting diode with quantum dots, including hearth electrode and top electrode, and setting is in the hearth electrode and top electricity Quantum dot light emitting layer between pole, which is characterized in that the hearth electrode surface opposite with the quantum dot light emitting layer is in fold Structure, and the hearth electrode is made of metal material.
2. light emitting diode with quantum dots as described in claim 1, which is characterized in that the hearth electrode with a thickness of 45- 260nm。
3. light emitting diode with quantum dots as described in claim 1, it is characterised in that the light emitting diode with quantum dots is top hair Emitting light emitting diode with quantum dots or bottom emitting type light emitting diode with quantum dots.
4. light emitting diode with quantum dots as claimed in claim 3, which is characterized in that when the light emitting diode with quantum dots is bottom When emission type light emitting diode with quantum dots, the hearth electrode with a thickness of 45-85nm;When the light emitting diode with quantum dots is top When emission type light emitting diode with quantum dots, the hearth electrode with a thickness of 100-260nm.
5. light emitting diode with quantum dots as described in claim 1, which is characterized in that the metal material includes Al, Ag and Cu/ At least one of Pt alloy.
6. a kind of preparation method of light emitting diode with quantum dots, which comprises the steps of:
Substrate is provided;
On the substrate by metal material deposition, it is then made annealing treatment, obtains the first metal that surface is in pleated structure Electrode layer;The metal material is deposited on first metal electrode layer again, obtains the second metal electrode layer;Wherein, institute State the first metal electrode layer and second metal electrode layer composition hearth electrode.
Quantum dot light emitting layer is deposited on second metal electrode layer, deposits top electrode on the quantum dot light emitting layer.
7. the preparation method of light emitting diode with quantum dots as claimed in claim 6, which is characterized in that the annealing is lazy It is carried out in property gas.
8. the preparation method of light emitting diode with quantum dots as claimed in claim 6, which is characterized in that the temperature of the annealing Degree is 500-80 DEG C;And/or
The time of the annealing is 2-6min.
9. the preparation method of light emitting diode with quantum dots as claimed in claim 6, which is characterized in that first metal electrode Layer with a thickness of 30-60nm, when the light emitting diode with quantum dots is bottom emitting type light emitting diode with quantum dots, described second Metal electrode layer with a thickness of 15-25nm;When the light emitting diode with quantum dots is top emission type light emitting diode with quantum dots, Second metal electrode layer with a thickness of 70-200nm.
10. the preparation method of light emitting diode with quantum dots as claimed in claim 6, which is characterized in that the metal material packet Include at least one of Al, Ag and Cu/Pt alloy.
CN201810208473.9A 2018-03-14 2018-03-14 Light emitting diode with quantum dots and preparation method thereof Pending CN110277502A (en)

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CN104201290A (en) * 2014-08-22 2014-12-10 上海和辉光电有限公司 Inverted type organic electroluminescence structure
CN105489660A (en) * 2014-10-02 2016-04-13 三星电子株式会社 Stretchable optoelectronic device, method of manufacturing the same, and apparatus, light-emitting device, sensor system, and sensor circuit including the stretchable optoelectronic device
JP2017157740A (en) * 2016-03-03 2017-09-07 凸版印刷株式会社 Organic electroluminescent device, illumination device, light source, and image display device
CN107507920A (en) * 2017-09-22 2017-12-22 京东方科技集团股份有限公司 Organic electroluminescent LED, display base plate and preparation method thereof, display device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102487128A (en) * 2010-12-06 2012-06-06 三星移动显示器株式会社 Light-scattering substrate, method of manufacturing the same, organic light-emitting display device, and method of manufacturing organic light-emitting display device
CN102683607A (en) * 2011-03-14 2012-09-19 海洋王照明科技股份有限公司 Organic electroluminescent device and preparation method thereof
CN104201290A (en) * 2014-08-22 2014-12-10 上海和辉光电有限公司 Inverted type organic electroluminescence structure
CN105489660A (en) * 2014-10-02 2016-04-13 三星电子株式会社 Stretchable optoelectronic device, method of manufacturing the same, and apparatus, light-emitting device, sensor system, and sensor circuit including the stretchable optoelectronic device
JP2017157740A (en) * 2016-03-03 2017-09-07 凸版印刷株式会社 Organic electroluminescent device, illumination device, light source, and image display device
CN107507920A (en) * 2017-09-22 2017-12-22 京东方科技集团股份有限公司 Organic electroluminescent LED, display base plate and preparation method thereof, display device

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Application publication date: 20190924