CN110275595A - A kind of cooling radiator structure of embedded host equipment - Google Patents
A kind of cooling radiator structure of embedded host equipment Download PDFInfo
- Publication number
- CN110275595A CN110275595A CN201910575265.7A CN201910575265A CN110275595A CN 110275595 A CN110275595 A CN 110275595A CN 201910575265 A CN201910575265 A CN 201910575265A CN 110275595 A CN110275595 A CN 110275595A
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- China
- Prior art keywords
- wall
- groups
- mainframe box
- heat dissipation
- right sides
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Abstract
The invention discloses a kind of cooling radiator structures of embedded host equipment of embedded host equipment technical field, including mainframe box, the left and right sides outer wall rear end of mainframe box, which is run through, offers radiator window, deck is socketed on rear side of the upper surface of mainframe box, the left and right sides outer wall of deck is spirally connected with the outer wall of mainframe box, the inner cavity top of deck is connected with water tank, the center of top of water tank is hinged with chamber door, symmetrically run through between the inner wall top of mainframe box and deck and the bottom of water tank and offers two groups of through-holes, the inner cavity of two groups of through-holes is plugged with outlet pipe, and valve is respectively connected at the top of two groups of outlet pipes;Four groups of heat dissipation copper pipes of the invention are respectively distributed to the rear and front end at left and right sides of the inner cavity of mainframe box, the internal component of mainframe box is surrounded, utilize the flow enhuancement heat dissipation effect back and forth of heat dissipation copper pipe internal liquid, the left and right sides of mainframe box, which is run through, offers radiator window, realize that heat dissipation is efficient to wind is flowed through.
Description
Technical field
The present invention relates to embedded host equipment technical fields, and in particular to a kind of cooling heat dissipation of embedded host equipment
Structure.
Background technique
Internet of Things creates the surging incomparable climax of a wave to the data volume of enterprise.Still making great efforts with regard to this in the world, enterprise
Phenomenon is compromised.The potential branch of embedded technology has been diffused into from towards advertisement hyperplasia including production and customer service
Interior business process inside.As internet and wireless sensor technology are embedded into more and more equipment, this has become
Another source seen clearly, can be used for formulating and improving the every aspect of business game.Embedded device is mainly by embedded
Device, associated support hardware and embedded software system composition are managed, it is " device " that can work independently for integrating software and hardware.
Overall apparently embedded system has the characteristics that convenient flexible, ratio of performance to price height, embeddability are strong, can be embedded into existing
In what information household appliances and industrial control system.From the point of view of software respective, embedded system has matches needed for not alterability, system
It sets and requires the features such as lower, system is professional and real-time is stronger.Host and target machine are the exploitations based on different architectural frameworks,
Host exploitation, compiling, target machine operation carry out before embedded development, it is necessary first to install cross tool chain, network protocol
Stack and Driver Development.Protocol stack is divided into the exploitation and the handling routine new based on existing Protocol Design of new agreement;Driving
Including char device driver, Block Device Driver, network device driver.Host equipment as a part in embedded device,
Under conditions of high speed operation operating, the heat of generation, which cannot distribute, will affect the normal work of device, shorten the working life,
To the heat dissipation of host equipment greatly it is necessary to.Based on this, the present invention devises a kind of cooling radiator structure of embedded host equipment,
To solve the above problems.
Summary of the invention
The purpose of the present invention is to provide a kind of cooling radiator structures of embedded host equipment, to solve above-mentioned background skill
The problem of being proposed in art.
To achieve the above object, the invention provides the following technical scheme: a kind of cooling heat dissipation knot of embedded host equipment
Structure, including mainframe box, the left and right sides outer wall rear end of the mainframe box, which is run through, offers radiator window, the upper table of the mainframe box
It is socketed with deck on rear side of face, the left and right sides outer wall of the deck is spirally connected with the outer wall of mainframe box, the inner cavity top of the deck
Portion is connected with water tank, and the center of top of the water tank is hinged with chamber door, at the top of the inner wall of the mainframe box with deck and water tank
Symmetrically through two groups of through-holes are offered between bottom, the inner cavity of through-hole described in two groups is plugged with outlet pipe, and two groups of outlet pipes
Top be respectively connected with valve, the valve is located at the intracavity bottom of water tank, at left and right sides of the bottom of outlet pipe described in two groups
Be plugged with heat dissipation copper pipe respectively by tee tube, the intracavity bottom of the mainframe box is welded with transition case, the transition case it is interior
Wall bottom center is bolted with circulating pump, and heat dissipation copper pipe described in four groups is respectively two-by-two through the left and right sides of the transition case and extension
To the inner cavity of transition case, the left side inlet and right side liquid storage mouth of the circulating pump pass through two groups of tee tube and the left and right sides respectively
The outer wall of the heat dissipation copper pipe is socketed.
Preferably, the inner wall center of top of the mainframe box is bolted with radiator fan, and the radiator fan is located at two groups of institutes
State the relative inner center of through-hole.
Preferably, radiator window described in two groups is interior along being bolted with Air Filter.
Preferably, separated on the left of the inner cavity of the water tank by partition and be equipped with condenser, the entrance of the condenser connects
It is connected to compressor, the outlet of the condenser is connected to by the connecting tube with check valve with the inner cavity of water tank.
Preferably, sealing-plug is plugged between the outer wall of the outlet pipe and the inner wall of through-hole.
Preferably, the left and right sides outer wall of the transition case passes through integrated molding equipped with connector sleeve, radiates described in four groups
The outer wall of copper pipe with the inner cavity grafting that is correspondingly connected with set, and is plugged between the inner wall of connector sleeve and the outer wall of heat dissipation copper pipe respectively
Sealing ring.
Compared with prior art, the beneficial effects of the present invention are: it is water that the present invention, which utilizes drinking-water pipe by the folding of chamber door,
Case carries out changing water, unscrews valve manually, in conjunction with the work of circulating pump, so that the liquid in water tank is distinguished via in two groups of outlet pipes
Connected heat dissipation copper pipe is flowed to, totally four groups of heat dissipation copper pipes are respectively distributed to the rear and front end at left and right sides of the inner cavity of mainframe box,
The internal component of mainframe box is surrounded, the heat dissipation effect of copper is good, utilizes the flow enhuancement back and forth of heat dissipation copper pipe internal liquid
Heat dissipation effect, the left and right sides of mainframe box, which is run through, offers radiator window, realizes that heat dissipation efficiently, effectively extends embedding to wind is flowed through
Enter the service life of formula host equipment, high financial profit.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, will be described below to embodiment required
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for ability
For the those of ordinary skill of domain, without creative efforts, it can also be obtained according to these attached drawings other attached
Figure.
Fig. 1 is schematic diagram of the three-dimensional structure.
Fig. 2 is structure of the invention cross-sectional view.
Fig. 3 is heat dissipation copper pipe structural schematic diagram of the present invention.
Fig. 4 is the inner wall top structure bottom view of mainframe box of the present invention.
In attached drawing, parts list represented by the reference numerals are as follows:
Mainframe box 1, radiator window 2, deck 3, water tank 4, chamber door 5, through-hole 6, outlet pipe 7, valve 8, heat dissipation copper pipe 9, transition
Case 10, circulating pump 11, radiator fan 12.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts all other
Embodiment shall fall within the protection scope of the present invention.
Fig. 1-4 is please referred to, the present invention provides a kind of technical solution: a kind of cooling radiator structure of embedded host equipment,
Including mainframe box 1, the left and right sides outer wall rear end of mainframe box 1, which is run through, offers radiator window 2, on rear side of the upper surface of mainframe box 1
It is socketed with deck 3, outer wall of the left and right sides outer wall of deck 3 with mainframe box 1 is spirally connected, and the inner cavity top of deck 3 is connected with water
Case 4, the center of top of water tank 4 is hinged with chamber door 5, symmetrical between the inner wall top of mainframe box 1 and deck 3 and the bottom of water tank 4
Through two groups of through-holes 6 are offered, the inner cavity of two groups of through-holes 6 is plugged with outlet pipe 7, and the top of two groups of outlet pipes 7 is all connected with
There is valve 8, valve 8 is located at the intracavity bottom of water tank 4, inserts respectively by tee tube at left and right sides of the bottom of two groups of outlet pipes 7
It is connected to heat dissipation copper pipe 9, the intracavity bottom of mainframe box 1 is welded with transition case 10, and the inner wall bottom center of transition case 10, which is bolted with, to be followed
Ring pump 11, four groups of heat dissipation copper pipes 9 run through the left and right sides of transition case 10 two-by-two respectively and extend to the inner cavity of transition case 10, circulation
The left side inlet and right side liquid storage mouth of pump 11 pass through tee tube respectively and the outer wall of two groups of left and right sides heat dissipation copper pipe 9 is socketed.
Wherein, the inner wall center of top of mainframe box 1 is bolted with radiator fan 12, and radiator fan 12 is located at two groups of through-holes 6
Relative inner center.
Two groups of radiator windows 6 it is interior along being bolted with Air Filter.
Separated on the left of the inner cavity of water tank 4 by partition and be equipped with condenser, the entrance of condenser is connected with compressor, condenses
The outlet of device is connected to by the connecting tube with check valve with the inner cavity of water tank 4.
Sealing-plug is plugged between the outer wall of outlet pipe 7 and the inner wall of through-hole 6.
The left and right sides outer wall of transition case 10 passes through integrated molding and is equipped with connector sleeve, the outer wall point of four groups of heat dissipation copper pipes 9
Not with the inner cavity grafting that is correspondingly connected with set, and sealing ring is plugged between the inner wall of connector sleeve and the outer wall of heat dissipation copper pipe 9.
One concrete application of the present embodiment are as follows: carry out changing water for water tank 4 using drinking-water pipe by the folding of chamber door 5, follow
Ring pump 11 carries out control starting by control button, since the matched equipment of control button is commonly used equipment, belongs to existing maturation
Technology, details are not described herein its electrical connection and specific circuit structure, valve 8 are arranged in the water of water tank 4, manually
Valve 8 is unscrewed, in conjunction with the work of circulating pump 11, so that the liquid in water tank 4 is via flow direction is connected respectively in two groups of outlet pipes 7
Heat dissipation copper pipe 9, totally four groups of heat dissipation copper pipes 9 are respectively distributed to the rear and front end at left and right sides of the inner cavity of mainframe box 1, by mainframe box
1 internal component surrounds, and the heat dissipation effect of copper is good, is radiated and is imitated using the flow enhuancement back and forth of 9 internal liquid of heat dissipation copper pipe
Fruit, the left and right sides of mainframe box 1, which is run through, offers radiator window 2, realizes that heat dissipation is efficient to wind is flowed through.
In the description of this specification, the description of reference term " one embodiment ", " example ", " specific example " etc. means
Particular features, structures, materials, or characteristics described in conjunction with this embodiment or example are contained at least one implementation of the invention
In example or example.In the present specification, schematic expression of the above terms may not refer to the same embodiment or example.
Moreover, particular features, structures, materials, or characteristics described can be in any one or more of the embodiments or examples to close
Suitable mode combines.
Present invention disclosed above preferred embodiment is only intended to help to illustrate the present invention.There is no detailed for preferred embodiment
All details are described, are not limited the invention to the specific embodiments described.Obviously, according to the content of this specification,
It can make many modifications and variations.These embodiments are chosen and specifically described to this specification, is in order to better explain the present invention
Principle and practical application, so that skilled artisan be enable to better understand and utilize the present invention.The present invention is only
It is limited by claims and its full scope and equivalent.
Claims (6)
1. a kind of cooling radiator structure of embedded host equipment, including mainframe box (1), it is characterised in that: the mainframe box (1)
Left and right sides outer wall rear end run through and offer radiator window (2), be socketed with deck on rear side of the upper surface of the mainframe box (1)
(3), outer wall of the left and right sides outer wall of the deck (3) with mainframe box (1) is spirally connected, the inner cavity top card of the deck (3)
It is connected to water tank (4), the center of top of the water tank (4) is hinged with chamber door (5), the inner wall top of the mainframe box (1) and deck
(3) and symmetrically run through between the bottom of water tank (4) and offer two groups of through-holes (6), the inner cavity of through-hole described in two groups (6) is plugged with
Outlet pipe (7), and be respectively connected with valve (8) at the top of two groups of outlet pipes (7), the valve (8) is located at the interior bottom of chamber of water tank (4)
The bottom left and right sides in portion, outlet pipe described in two groups (7) is plugged with heat dissipation copper pipe (9), the host by tee tube respectively
The intracavity bottom of case (1) is welded with transition case (10), and the inner wall bottom center of the transition case (10) is bolted with circulating pump (11),
Heat dissipation copper pipe described in four groups (9) runs through the left and right sides of the transition case (10) two-by-two respectively and extends to the interior of transition case (10)
Chamber, the left side inlet and right side liquid storage mouth of the circulating pump (11) pass through heat dissipation described in two groups of tee tube and the left and right sides respectively
The outer wall of copper pipe (9) is socketed.
2. a kind of cooling radiator structure of embedded host equipment according to claim 1, it is characterised in that: the host
The inner wall center of top of case (1) is bolted with radiator fan (12), phase of the radiator fan (12) positioned at through-hole (6) described in two groups
To inner central.
3. a kind of cooling radiator structure of embedded host equipment according to claim 2, it is characterised in that: described in two groups
Radiator window (6) it is interior along being bolted with Air Filter.
4. a kind of cooling radiator structure of embedded host equipment according to claim 3, it is characterised in that: the water tank
(4) separated on the left of inner cavity by partition and be equipped with condenser, the entrance of the condenser is connected with compressor, the condenser
Outlet by being connected to the connecting tube of check valve with the inner cavity of water tank (4).
5. a kind of cooling radiator structure of embedded host equipment according to claim 1, it is characterised in that: the water outlet
It manages and is plugged with sealing-plug between the outer wall of (7) and the inner wall of through-hole (6).
6. a kind of cooling radiator structure of embedded host equipment according to claim 1, it is characterised in that: the transition
The left and right sides outer wall of case (10) pass through integrated molding be equipped with connector sleeve, the outer wall of heat dissipation copper pipe described in four groups (9) respectively with
It is correspondingly connected with the inner cavity grafting of set, and is plugged with sealing ring between the inner wall of connector sleeve and the outer wall of heat dissipation copper pipe (9).
Priority Applications (1)
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CN201910575265.7A CN110275595A (en) | 2019-06-28 | 2019-06-28 | A kind of cooling radiator structure of embedded host equipment |
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CN201910575265.7A CN110275595A (en) | 2019-06-28 | 2019-06-28 | A kind of cooling radiator structure of embedded host equipment |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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EP1158389A3 (en) * | 2000-05-25 | 2002-11-13 | Kioan Cheon | Computer having cooling apparatus and heat exchanging device of the cooling apparatus |
CN203786640U (en) * | 2014-04-08 | 2014-08-20 | 哈尔滨精达自动化技术开发有限责任公司 | Multifunctional table computer case |
CN205302173U (en) * | 2016-01-18 | 2016-06-08 | 浙江财经大学 | High -speed heat abstractor that circulates of computer |
CN207234237U (en) * | 2017-06-07 | 2018-04-13 | 国网新疆电力有限公司吐鲁番供电公司 | A kind of electric power cabinet with heat sinking function |
CN207503152U (en) * | 2017-12-13 | 2018-06-15 | 焦海坤 | A kind of water cooling computer cabinet |
CN207516907U (en) * | 2017-09-20 | 2018-06-19 | 邯郸市水利工程处 | A kind of Novel cloud computer equipment |
-
2019
- 2019-06-28 CN CN201910575265.7A patent/CN110275595A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1158389A3 (en) * | 2000-05-25 | 2002-11-13 | Kioan Cheon | Computer having cooling apparatus and heat exchanging device of the cooling apparatus |
CN203786640U (en) * | 2014-04-08 | 2014-08-20 | 哈尔滨精达自动化技术开发有限责任公司 | Multifunctional table computer case |
CN205302173U (en) * | 2016-01-18 | 2016-06-08 | 浙江财经大学 | High -speed heat abstractor that circulates of computer |
CN207234237U (en) * | 2017-06-07 | 2018-04-13 | 国网新疆电力有限公司吐鲁番供电公司 | A kind of electric power cabinet with heat sinking function |
CN207516907U (en) * | 2017-09-20 | 2018-06-19 | 邯郸市水利工程处 | A kind of Novel cloud computer equipment |
CN207503152U (en) * | 2017-12-13 | 2018-06-15 | 焦海坤 | A kind of water cooling computer cabinet |
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Application publication date: 20190924 |
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