CN110270729A - A method of with graphene barrier layer assistant brazing Ti-Al system's alloy and ceramics - Google Patents
A method of with graphene barrier layer assistant brazing Ti-Al system's alloy and ceramics Download PDFInfo
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- CN110270729A CN110270729A CN201910659487.7A CN201910659487A CN110270729A CN 110270729 A CN110270729 A CN 110270729A CN 201910659487 A CN201910659487 A CN 201910659487A CN 110270729 A CN110270729 A CN 110270729A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/206—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/14—Titanium or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
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- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Ceramic Products (AREA)
Abstract
A method of with graphene barrier layer assistant brazing Ti-Al system's alloy and ceramics, being related to the method for a kind of soldering Ti-Al system alloy and ceramics.Purpose is the problem that the brittlement phase that can be generated in connector causes joint bending stiffness low when solving to connect Ti-Al system alloy with Ceramic brazing using cupric solder.Method: preparing graphene barrier layer using the method that liquid phase shifts on the surface to be welded of Ti-Al system alloy, then places cupric solder paillon between the surface to be welded of Ti-Al system alloy and ceramic surface to be welded, is finally brazed.The present invention introduces lamellar graphite alkene as barrier layer in brazing process, it effectively reduces and generates reaction and the dissolution of Ti-Al system alloy between Ti-Al system alloy and ceramic pricker, and the generation of brittlement phase in connector is avoided, it ensure that the thickness of conversion zone, excellent in mechanical performance.The present invention is suitable for soldering Ti-Al system alloy and ceramics.
Description
Technical field
The present invention relates to the methods of a kind of soldering Ti-Al system alloy and ceramics.
Background technique
Two sides base material thermal expansion coefficient difference causes greatly when solder containing Cu is able to solve weldering Ti-Al system alloy and Ceramic brazing
The low problem of strength of joint, but in brazing process, the Ti-Al system alloy of dissolution can with solder containing Cu can and ceramics occur instead
It answers, excessive brittlement phase, such as Cu is generated in soldered fitting2Ti or TiSiCu, brittlement phase will lead to soldered fitting shearing strength drop
It is low.
Summary of the invention
When object of the present invention is to solve to connect Ti-Al system alloy with Ceramic brazing using cupric solder, generated in connector
The brittlement phase problem that causes joint bending stiffness low, propose it is a kind of with graphene barrier layer assistant brazing Ti-Al system's alloy and
The method of ceramics.
The present invention is followed the steps below in the method for graphene barrier layer assistant brazing Ti-Al system's alloy and ceramics:
Graphene layer is prepared on the surface to be welded of Ti-Al system alloy using the method for liquid phase transfer first, then in Ti-Al
It is to place cupric solder paillon between the surface to be welded of alloy and ceramic surface to be welded, is finally brazed, that is, completed.
Further, it is described graphene barrier layer is prepared on the surface to be welded of Ti-Al system alloy before further include surface to be welded
Polishing and cleaning, when polishing polishes to the surface to be welded of Ti-Al system alloy using the sand paper of different model, carries out after polishing
Cleaning；For the cleaning liquid used when cleaning for ethanol solution, cleaning way is ultrasonic cleaning；The ultrasonic cleaning time be 15~
25min。
Further, the surface to be welded of ceramics is successively polished and cleaned before being brazed；Different shaped is used when polishing
Number sand paper to ceramics surface to be welded polish, cleaned after polishing；The cleaning liquid used when cleaning is ethanol solution, clearly
Mode is washed as ultrasonic cleaning；The ultrasonic cleaning time is 15~25min.
Further, it is described be brazed before Ti-Al system alloy, cupric solder paillon and ceramics compressed using graphite block.
Further, the soldering specifically comprises the processes of: carried out in vacuum brazing furnace, vacuum degree is 5 × 10 when soldering-3Pa
More than, brazing temperature is 800~880 DEG C, and soaking time is 8~12min；It is cooled to room temperature after the completion of soldering, cools down when cooling
Speed is 4~6 DEG C/min.
Further, the method using liquid phase transfer prepares graphene layer on the surface to be welded of Ti-Al system alloy
Method sequentially includes the following steps:
Step 1, metal base surface applies one layer of PMMA solution and heats in graphene/metallic substrates laminate samples first
Solidification；
Further, the graphite that graphene described in step 1/metallic substrates laminate samples are adhered to by metallic substrates and its surface
Alkene layer is constituted；In Chongqing Mo Xi Science and Technology Ltd., product name is copper foil substrate for graphene/metallic substrates laminate samples purchase
Graphene film.
Further, the solvent of PMMA solution described in step 1 is acetone, and the concentration of PMMA solution is 4wt.%.
Further, solidification temperature described in step 1 is 150~200 DEG C, and curing time is 4~5min.
Then step 2 uses corrosive liquid corrosion metal substrate, obtain PMMA/ graphene laminate samples；
Further, corrosive liquid described in step 2 is the FeCl of 1~4mol/L of concentration3Solution；With corrosion corrosion Metal Substrate
Graphene/metallic substrates laminate samples are immersed in corrosive liquid when bottom；Corrosive liquid leaching can remove metallic substrates；
PMMA/ graphene laminate samples are transferred on the surface to be welded of Ti-Al system alloy by step 3, wherein PMMA/ graphite
Graphene side is heat-treated towards the surface to be welded of Ti-Al system alloy in alkene laminate samples；
Further, the hot temperature of heat treatment described in step 3 is 100~140 DEG C, and the time is 1~2min.
The PMMA in PMMA/ graphene laminate samples after step 4, removal heat treatment, obtains having one layer of graphene
Ti-Al system alloy；
Further, when removing the PMMA in the PMMA/ graphene laminate samples after being heat-treated described in step 4, by sample
It immerses and impregnates 6~8h in acetone, cleaned after the completion of immersion using deionized water.
Step 5 repeats step 1~step 4, obtains the Ti-Al system alloy with multi-layer graphene.
The principle of the invention and beneficial effect are:
The present invention introduces graphene as barrier layer in brazing process, effectively reduces Ti-Al system alloy and ceramic pricker
Reaction and the dissolution of Ti-Al system alloy are generated between material, and avoids the generation of brittlement phase in connector, ensure that conversion zone
Thickness, therefore excellent in mechanical performance.The shearing strength that the present invention is brazed Ti-Al system alloy and ceramic rear joint reach 110MPa with
On.The method of the present invention is connected for Ti-Al system alloy with ceramic pricker.
Patent CN201811101772.9 passes through black alkene sponge and AgCuTi solder occurs reaction in-situ and generates in brazed seam
Equally distributed TiC phase, since TiC phase has lower linear expansion coefficient and preferable plastic deformation ability, therefore can be to brazed seam
Thermal expansion coefficient be adjusted, refine and enhance brazed seam matrix, while plastic deformation can be passed through to alleviate connector remaining
Stress.Distinctive points are: the graphene of number layer of the present invention be transferred to it is on hard alloy surface to be welded and with hard alloy surface to be welded
In parallel, it is therefore an objective to inhibit excessive dissolution of the hard alloy into solder；And patent CN201811101772.9 is spongiform stone
Black alkene is placed between two layers of solder rather than between solder and welding object, therefore hard alloy can not be inhibited into solder
Dissolution.Patent CN201811101772.9 purpose is only compound with solder and reacts and reduce the content of Ti element in brazed seam, final
Reach and frangible compounds in brazed seam is inhibited to generate, what which can not solve that the base materials element such as hard alloy dissolves into brazed seam asks
Topic.
Patent CN201510980623.4 is successfully prepared graphene/aluminum base solder using the reduction method of graphene oxide,
To realize graphene to the reinforcing effect of aluminium base solder.The purpose of patent CN201510980623.4 is by adding graphite
Alkene enhances the comprehensive performance of aluminium base solder, and the purpose that the present invention shifts graphene is the dissolution for inhibiting hard alloy into brazed seam,
Therefore purpose is different.What patent CN201510980623.4 can not solve that the base materials element such as hard alloy dissolves into brazed seam asks
Topic.
Patent CN201410828186.X introduces three-dimensional structure graphene composite interlayer in brazing process, using chemistry
Be vapor-deposited CVD method, and three-dimensional structure graphene composite interlayer is prepared on foam Cu or foam Ni, graphene is improved and exists
Dispersibility in solder reduces solder thermal expansion coefficient, alleviates the stress in connector, is conducive to improve soldered fitting
Energy.Foam Cu or foam Ni be porous material, deposition graphene be still it is porous, therefore patent CN201410828186.X without
Method solves the problems, such as hard alloy excessive dissolution into brazed seam.
Detailed description of the invention
Fig. 1 is Ti in embodiment 12AlNb alloy and Ti3SiC2The microstructure back scattering picture of ceramic soldered joint；
Fig. 2 is the Ti that graphene barrier layer is not introduced into comparative example 12AlNb alloy and Ti3SiC2Ceramic soldered joint is microcosmic
Organize back scattering picture.
Specific embodiment:
In order to keep the objectives, technical solutions, and advantages of the present invention more clear, with reference to the accompanying drawings and embodiments,
This hair is further described.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and unlimited
The fixed present invention.
Embodiment 1: in the present embodiment, ceramics are Ti3SiC2Ceramics, Ti-Al system alloy are Ti2AlNb alloy, cupric solder
Paillon is AgCu solder paillon；The present embodiment method follows the steps below:
Graphene layer is prepared on the surface to be welded of Ti-Al system alloy using the method for liquid phase transfer first, then in Ti-Al
It is to place a layer thickness between the surface to be welded of alloy and ceramic surface to be welded as 50 μm of cupric solder paillons, is finally brazed, i.e.,
It completes.
Further, it is described graphene barrier layer is prepared on the surface to be welded of Ti-Al system alloy before further include surface to be welded
Polishing and cleaning, when polishing successively uses the sand paper of 240# and 600# to polish the surface to be welded of Ti-Al system alloy, polishes
After cleaned；For the cleaning liquid used when cleaning for ethanol solution, cleaning way is ultrasonic cleaning；The ultrasonic cleaning time
For 20min.
Further, the surface to be welded of ceramics is successively polished and cleaned before being brazed；Different shaped is used when polishing
Number sand paper to ceramics surface to be welded polish, cleaned after polishing；The cleaning liquid used when cleaning is ethanol solution, clearly
Mode is washed as ultrasonic cleaning；The ultrasonic cleaning time is 20min.
Further, it is described be brazed before Ti-Al system alloy, cupric solder paillon and ceramics compressed using graphite block.
Further, the soldering specifically comprises the processes of: carried out in vacuum brazing furnace, vacuum degree is 5 × 10 when soldering-3Pa
More than, brazing temperature is 840 DEG C, soaking time 10min；It is cooled to room temperature after the completion of soldering, cooling rate is 5 when cooling
℃/min。
Further, the method using liquid phase transfer prepares graphene layer on the surface to be welded of Ti-Al system alloy
Method sequentially includes the following steps:
Step 1, metal base surface applies one layer of PMMA solution and heats in graphene/metallic substrates laminate samples first
Solidification；
Further, the graphite that graphene described in step 1/metallic substrates laminate samples are adhered to by metallic substrates and its surface
Alkene layer is constituted；In Chongqing Mo Xi Science and Technology Ltd., product name is copper foil substrate for graphene/metallic substrates laminate samples purchase
Graphene film.
Further, the solvent of PMMA solution described in step 1 is acetone, and the concentration of PMMA solution is 4wt.%.
Further, solidification temperature described in step 1 is 180 DEG C, curing time 5min.
Then step 2 uses corrosive liquid corrosion metal substrate, obtain PMMA/ graphene laminate samples；
Further, corrosive liquid described in step 2 is the FeCl of concentration 1mol/L3Solution；With corrosive liquid corrosion metal substrate
When graphene/metallic substrates laminate samples is immersed in corrosive liquid；Corrosive liquid leaching can remove metallic substrates；
PMMA/ graphene laminate samples are transferred on the surface to be welded of Ti-Al system alloy by step 3, wherein PMMA/ graphite
Graphene side is heat-treated towards the surface to be welded of Ti-Al system alloy in alkene laminate samples；
Further, the hot temperature of heat treatment described in step 3 is 120 DEG C, time 2min.
The PMMA in PMMA/ graphene laminate samples after step 4, removal heat treatment, obtains having one layer of graphene
Ti-Al system alloy；
Further, when removing PMMA described in step 4, sample is immersed in acetone and impregnates 7h, use is gone after the completion of impregnating
Ionized water cleaning.
Step 5 repeats step 1~step 4, obtains the Ti-Al system alloy for having the graphene that haves three layers.
Comparative example 1:
In this comparative example, ceramics are Ti3SiC2Ceramics, Ti-Al system alloy are Ti2AlNb alloy, cupric solder paillon are
AgCu solder paillon；This comparative example method follows the steps below: in Ti-Al system alloy (Ti2AlNb alloy) surface to be welded
It is 50 μm of cupric solder paillons that a layer thickness is placed between ceramic surface to be welded, is brazed, that is, completed.
Further, the surface to be welded of ceramics and Ti-Al system alloy is successively polished and cleaned before being brazed；
It is polished using the sand paper of 240# and 600# the surface to be welded to ceramics when polishing, is cleaned after polishing；What is used when cleaning is clear
Wash liq is ethanol solution, and cleaning way is ultrasonic cleaning.The ultrasonic cleaning time is 20min.
Further, it is described be brazed before Ti-Al system alloy, cupric solder paillon and ceramics compressed using graphite block.
Further, the soldering specifically comprises the processes of: carried out in vacuum brazing furnace, vacuum degree is 5 × 10 when soldering-3Pa
More than, brazing temperature is 840 DEG C, soaking time 10min；It is cooled to room temperature after the completion of soldering, cooling rate is 5 when cooling
℃/min。
Fig. 1 is Ti in embodiment one2AlNb alloy and Ti3SiC2The microstructure back scattering picture of ceramic soldered joint；Figure
2 Ti to be not introduced into graphene barrier layer in comparative example 12AlNb alloy and Ti3SiC2Ceramic soldered joint microstructure back scattering
Picture.By Fig. 1 and Fig. 2 comparison it can be found that Ti2The Ti when transfer of AlNb alloy surface has graphene barrier layer2AlNb alloy
Dissolution degree is obviously reduced, and while ensure that reaction sufficiently carries out, the thickness of frangible compounds conversion zone is also obvious
Reduce, the addition of graphene barrier layer effectively inhibits brittleness Cu in brazed seam2The generation of Ti and TiSiCu compound, while stone is added
Brazing seam structure is more uniform after black alkene barrier layer, effectively improves joint performance.
Shearing test, loading velocity 0.5mm/min are carried out using electronic universal tester, embodiment 1 uses graphene
The resulting jointing room temperature shear strength of barrier layer assisted brazing method reaches 110MPa.And under identical parameters, it is not introduced into resistance
Interlayer is directly brazed resulting jointing (comparative example) room temperature shear strength and there was only 82MPa.
Claims (12)
1. it is a kind of with graphene barrier layer assistant brazing Ti-Al system's alloy and ceramics method, it is characterised in that: this method according to
Following steps carry out:
Graphene layer is prepared on the surface to be welded of Ti-Al system alloy using the method for liquid phase transfer first, is then closed in Ti-Al system
Cupric solder paillon is placed between the surface to be welded of gold and ceramic surface to be welded, is finally brazed, that is, completed.
2. the method according to claim 1 with graphene barrier layer assistant brazing Ti-Al system's alloy and ceramics, feature
Be: it is described graphene barrier layer is prepared on the surface to be welded of Ti-Al system alloy before further include surface to be welded polishing and cleaning,
It is polished when polishing using surface to be welded of the sand paper of different model to Ti-Al system alloy, is cleaned after polishing；It is adopted when cleaning
Cleaning liquid is ethanol solution, and cleaning way is ultrasonic cleaning；The ultrasonic cleaning time is 15~25min.
3. the method according to claim 1 or 2 with graphene barrier layer assistant brazing Ti-Al system's alloy and ceramics,
It is characterized in that: the surface to be welded of ceramics successively being polished and cleaned before being brazed；Using the sand paper of different model when polishing
It polishes the surface to be welded to ceramics, is cleaned after polishing；For ethanol solution, cleaning way is the cleaning liquid used when cleaning
Ultrasonic cleaning；The ultrasonic cleaning time is 15~25min.
4. the method according to claim 3 with graphene barrier layer assistant brazing Ti-Al system's alloy and ceramics, feature
Be: it is described be brazed before Ti-Al system alloy, cupric solder paillon and ceramics compressed using graphite block.
5. the method according to claim 1,2 or 4 with graphene barrier layer assistant brazing Ti-Al system's alloy and ceramics,
It is characterized by: the soldering specifically comprises the processes of: carried out in vacuum brazing furnace, vacuum degree is 5 × 10 when soldering-3Pa or more,
Brazing temperature is 800~880 DEG C, and soaking time is 8~12min；It is cooled to room temperature after the completion of soldering, cooling rate is when cooling
4~6 DEG C/min.
6. the method according to claim 5 with graphene barrier layer assistant brazing Ti-Al system's alloy and ceramics, feature
Be: the method using liquid phase transfer prepares the method for graphene layer by following step on the surface to be welded of Ti-Al system alloy
It is rapid to carry out:
Step 1, metal base surface applies one layer of PMMA solution and heats solid in graphene/metallic substrates laminate samples first
Change；
Then step 2 uses corrosive liquid corrosion metal substrate, obtain PMMA/ graphene laminate samples；
PMMA/ graphene laminate samples are transferred on the surface to be welded of Ti-Al system alloy by step 3, and wherein PMMA/ graphene is folded
Graphene side is heat-treated towards the surface to be welded of Ti-Al system alloy in layer sample；
The PMMA in PMMA/ graphene laminate samples after step 4, removal heat treatment, obtains the Ti-Al with one layer of graphene
It is alloy；
Step 5 repeats step 1~step 4, obtains the Ti-Al system alloy with multi-layer graphene.
7. the method according to claim 6 with graphene barrier layer assistant brazing Ti-Al system's alloy and ceramics, feature
Be: graphene described in step 1/metallic substrates laminate samples are made of the graphene layer that metallic substrates and its surface are adhered to.
8. the method according to claim 7 with graphene barrier layer assistant brazing Ti-Al system's alloy and ceramics, feature
Be: the solvent of PMMA solution described in step 1 is acetone, and the concentration of PMMA solution is 4wt.%.
9. the method according to claim 7 with graphene barrier layer assistant brazing Ti-Al system's alloy and ceramics, feature
Be: solidification temperature described in step 1 is 150~200 DEG C, and curing time is 4~5min.
10. the method according to claim 7 with graphene barrier layer assistant brazing Ti-Al system's alloy and ceramics, special
Sign is: corrosive liquid described in step 2 is the FeCl of 1~4mol/L of concentration3Solution；With when corrosive liquid corrosion metal substrate by graphite
Alkene/metallic substrates laminate samples immerse in corrosive liquid.
11. the method according to claim 7 with graphene barrier layer assistant brazing Ti-Al system's alloy and ceramics, special
Sign is: the hot temperature of heat treatment described in step 3 is 100~140 DEG C, and the time is 1~2min.
12. the method according to claim 7 with graphene barrier layer assistant brazing Ti-Al system's alloy and ceramics, special
Sign is: when removing the PMMA in the PMMA/ graphene laminate samples after being heat-treated described in step 4, sample being immersed in acetone
6~8h is impregnated, is cleaned after the completion of immersion using deionized water.
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| CN114178738A (en) * | 2021-12-08 | 2022-03-15 | 浙江亚通焊材有限公司 | Active solder for brazing ceramic and stainless steel and solder paste |
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| CN112756727A (en) * | 2020-12-29 | 2021-05-07 | 哈尔滨工业大学 | Method for enhancing reduction resistance of brazed joint by graphene sponge barrier layer |
| CN112756727B (en) * | 2020-12-29 | 2022-08-02 | 哈尔滨工业大学 | Method for enhancing reduction resistance of brazed joint by graphene sponge barrier layer |
| CN114178738A (en) * | 2021-12-08 | 2022-03-15 | 浙江亚通焊材有限公司 | Active solder for brazing ceramic and stainless steel and solder paste |
| CN115415656A (en) * | 2022-09-19 | 2022-12-02 | 哈尔滨工业大学 | Method for connecting skutterudite thermoelectric material with Fe-Cr-Mo/W as barrier layer and copper electrode |
| CN115415656B (en) * | 2022-09-19 | 2023-08-15 | 哈尔滨工业大学 | Connection method of skutterudite thermoelectric material and copper electrode by using Fe-Cr-Mo/W as barrier layer |
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