CN110267456A - A kind of chemical pre-processing method for wiring board production internal layer - Google Patents
A kind of chemical pre-processing method for wiring board production internal layer Download PDFInfo
- Publication number
- CN110267456A CN110267456A CN201910488832.5A CN201910488832A CN110267456A CN 110267456 A CN110267456 A CN 110267456A CN 201910488832 A CN201910488832 A CN 201910488832A CN 110267456 A CN110267456 A CN 110267456A
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- CN
- China
- Prior art keywords
- wiring board
- internal layer
- liquid medicine
- processing method
- chemical pre
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention provides a kind of chemical pre-processing methods for wiring board production internal layer comprising following steps: 1) to wiring board carries out oil removal treatment；2) wiring board is washed, removes residual liquid medicine；3) microetch liquid medicine is sprayed onto the surface of wiring board, microetch processing is carried out to the copper face of wiring board, removes the oxide of PCB surface；4) the microetch liquid medicine of PCB surface is removed.The present invention compared to the processing of tradition machinery polish-brush, be not in because of force-extension caused by plank harmomegathus, polish-brush section card it is bad, plate bent plate sticks up phenomenon, ill-exposed caused by can sticking up to avoid plate bent plate when inner figure transfer, reduces drilling because of deviation caused by internal layer harmomegathus.
Description
Technical field
The present invention relates to printed wiring board fields, before a kind of chemistry for wiring board production internal layer
Processing method.
Background technique
Currently, the production of pcb board requires increasingly precision, especially multilayer circuit board, in inner figure production, use
Core plate it is usually relatively thin, especially plate thickness≤0.5mm item number is handled using traditional mechanical polish-brush, will cause plank harmomegathus,
Polish-brush section card is bad, is unfavorable for the transfer of later period inner figure, pressing, drilling production.
Summary of the invention
In consideration of it, using microetch the present invention provides a kind of chemical pre-processing method for wiring board production internal layer
Liquid medicine handles oxide, the greasy dirt of plate face, obtains the plate face that clean non-oxidation has roughness, solves mechanical polish-brush processing
The adverse effects such as harmomegathus, polish-brush section card evil idea are caused to plank.
The present invention provides a kind of chemical pre-processing methods for wiring board production internal layer comprising following steps:
1) oil removal treatment is carried out to wiring board；
2) wiring board is washed, removes residual liquid medicine；
3) microetch liquid medicine is sprayed onto the surface of wiring board, microetch processing is carried out to the copper face of wiring board, removes wiring board table
The oxide in face；
4) the microetch liquid medicine of PCB surface is removed.
Further, above-mentioned steps 1) in, oil removing liquid medicine is sprayed on wiring board by way of jet pipe spray, removes route
The greasy dirt of plate surface.
Further, above-mentioned steps 1) in, wiring board is sent into oil removing section by way of horizontal line pan feeding.
Further, above-mentioned steps 2) in, it is washed by least 3 grades, removes the residual liquid medicine of wiring board.
Further, above-mentioned steps 3) in, microetch liquid medicine is sprayed on wiring board by way of jet pipe spray.
Further, above-mentioned microetch liquid medicine includes following components in percentage by weight:
CP grades of H2SO454-60%；
H2O213-16%；
Stabilizer 27-30%.
Further, above-mentioned CP grades of H2SO4Configuration concentration be 20-60ml/L.
Further, above-mentioned H2O2Configuration concentration be 10-35ml/L.
Further, the configuration concentration of above stabilizer is 40-60ml/L.
Further, above-mentioned steps 4) in, wiring board is by least 2 grades washings, at least 1 grade of pickling removal remains microetch medicine
Water is washed using at least 4 grades, is combined and is discharged into dry plate.
In a kind of chemical pre-processing method for wiring board production internal layer provided by the present invention, using microetch liquid medicine pair
Oxide, the greasy dirt of plate face are handled, and the plate face that clean non-oxidation has roughness is obtained, and solve mechanical polish-brush processing to plank
Cause the adverse effects such as harmomegathus, polish-brush section card evil idea；
Thus, this method compared to tradition machinery polish-brush processing, be not in because of force-extension caused by plank harmomegathus, polish-brush
Section card is bad, and plate bent plate sticks up phenomenon, ill-exposed caused by can sticking up to avoid plate bent plate when inner figure transfer, reduces drilling because in
Deviation caused by layer harmomegathus.
Specific embodiment
The exemplary embodiment of the disclosure is described in more detail below.Although showing the exemplary implementation of the disclosure
Example, it being understood, however, that may be realized in various forms the disclosure and should not be limited by the embodiments set forth herein.On the contrary,
These embodiments are provided to facilitate a more thoroughly understanding of the present invention, and can communicate completely to the scope of the present disclosure
Those skilled in the art.
A kind of chemical pre-processing method for wiring board production internal layer involved in the present embodiment comprising following step
It is rapid:
1) oil removal treatment is carried out to wiring board: oil removing section is entered by horizontal line pan feeding, will removed in the way of jet pipe spray
Oily liquid medicine (degreaser) is sprayed onto plate face, removes plate face greasy dirt；
2) 3 grades of washings are carried out to wiring board, removes residual liquid medicine；
3) microetch liquid medicine is sprayed onto the surface of wiring board in the way of jet pipe spray, the copper face of wiring board is carried out at microetch
Reason, needs to keep 35-45 degrees Celsius of processing temperature environment in the process, and the oxide of PCB surface is removed by 2 grades of washings,
Plate face is set to have certain roughness；
4) it using the microetch liquid medicine of 1 grade of pickling removal PCB surface of sulfuric acid, washes using 4 grades, is combined into dry plate
Discharging.
The detailed process of the above method includes: that pan feeding-oil removing-overflow washing (3 grades)-clear water washes-microetch-overflow washing-
(4 grades)-DI washing-dry plate combination-discharging is washed in (2 grades)-pickling-overflow.
Wherein, the specific control parameter of microetch liquid medicine is as shown in the table:
| Slot name | Sump volume | Control material | Configuration concentration | Configuration amount |
| Microetch | 600L | CP grades of H2SO4 | 20-60ml/L | 60L |
| Microetch | 600L | H202 | 10-35ml/L | 15L |
| Microetch | 600L | Stabilizer | 40-60ml/L | 30L |
The proportion of each control material therein can be selected in following range with as needed, be can achieve and connect
Close technical effect: CP grades of H2SO454-60%；H2O213-16%；Stabilizer 27-30%.
Provided by the present embodiment it is a kind of for wiring board production internal layer chemical pre-processing method in, using microetch liquid medicine
Oxide, the greasy dirt of plate face are handled, the plate face that clean non-oxidation has roughness is obtained, solves mechanical polish-brush processing to plate
Son causes the adverse effects such as harmomegathus, polish-brush section card evil idea；
Thus, this method compared to tradition machinery polish-brush processing, be not in because of force-extension caused by plank harmomegathus, polish-brush
Section card is bad, and plate bent plate sticks up phenomenon, ill-exposed caused by can sticking up to avoid plate bent plate when inner figure transfer, reduces drilling because in
Deviation caused by layer harmomegathus.
Obviously, various changes and modifications can be made to the invention without departing from essence of the invention by those skilled in the art
Mind and range.In this way, if these modifications and changes of the present invention belongs to the range of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to include these modifications and variations.
Claims (10)
1. a kind of chemical pre-processing method for wiring board production internal layer, which comprises the following steps:
1) oil removal treatment is carried out to wiring board；
2) wiring board is washed, removes residual liquid medicine；
3) microetch liquid medicine is sprayed onto the surface of the wiring board, microetch processing is carried out to the copper face of the wiring board, described in removal
The oxide of PCB surface；
4) the microetch liquid medicine of the PCB surface is removed.
2. a kind of chemical pre-processing method for wiring board production internal layer according to claim 1, which is characterized in that institute
It states in step 1), oil removing liquid medicine is sprayed on the wiring board by way of jet pipe spray, remove the oil of the PCB surface
It is dirty.
3. a kind of chemical pre-processing method for wiring board production internal layer according to claim 1 or 2, feature exist
In in the step 1), by wiring board feeding oil removing section by way of horizontal line pan feeding.
4. a kind of chemical pre-processing method for wiring board production internal layer according to claim 1, which is characterized in that institute
It states in step 2), is washed by least 3 grades, remove the residual liquid medicine of the wiring board.
5. a kind of chemical pre-processing method for wiring board production internal layer according to claim 1, which is characterized in that institute
It states in step 3), the microetch liquid medicine is sprayed on the wiring board by way of jet pipe spray.
6. a kind of chemical pre-processing method for wiring board production internal layer, feature exist according to claim 1 or 5
In the microetch liquid medicine includes following components in percentage by weight:
CP grades of H2SO454-60%；
H2O213-16%；
Stabilizer 27-30%.
7. a kind of chemical pre-processing method for wiring board production internal layer according to claim 6, which is characterized in that institute
State CP grades of H2SO4Configuration concentration be 20-60ml/L.
8. a kind of chemical pre-processing method for wiring board production internal layer according to claim 6, which is characterized in that institute
State H2O2Configuration concentration be 10-35ml/L.
9. a kind of chemical pre-processing method for wiring board production internal layer according to claim 6, which is characterized in that institute
The configuration concentration for stating stabilizer is 40-60ml/L.
10. a kind of chemical pre-processing method for wiring board production internal layer according to claim 1, which is characterized in that
In the step 4), the wiring board is by least 2 grades washings, at least 1 grade of pickling removal remains microetch liquid medicine, using at least
4 grades of washings, combine into dry plate and discharge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910488832.5A CN110267456A (en) | 2019-06-11 | 2019-06-11 | A kind of chemical pre-processing method for wiring board production internal layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910488832.5A CN110267456A (en) | 2019-06-11 | 2019-06-11 | A kind of chemical pre-processing method for wiring board production internal layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110267456A true CN110267456A (en) | 2019-09-20 |
Family
ID=67916974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910488832.5A Pending CN110267456A (en) | 2019-06-11 | 2019-06-11 | A kind of chemical pre-processing method for wiring board production internal layer |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4798218A (en) * | 1985-05-28 | 1989-01-17 | Outillages Scientifiques Et De Laboratoires O.S.L. | Cleaning apparatus for electronic components and/or precision parts of machinery |
| CN101824634A (en) * | 2009-03-06 | 2010-09-08 | 深圳市正基电子有限公司 | Process for manufacturing circuit board |
| CN104918417A (en) * | 2015-05-15 | 2015-09-16 | 江门崇达电路技术有限公司 | Method for producing organic solderability preservative on surface of circuit board |
| CN108472693A (en) * | 2015-11-04 | 2018-08-31 | 吉布尔·施密德有限责任公司 | Treatment fluid-suction unit and Etaching device comprising it |
| CN109518187A (en) * | 2018-11-29 | 2019-03-26 | 惠州市和鑫达电子科技有限公司 | A kind of pcb board surface chemistry pre-treating technology |
-
2019
- 2019-06-11 CN CN201910488832.5A patent/CN110267456A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4798218A (en) * | 1985-05-28 | 1989-01-17 | Outillages Scientifiques Et De Laboratoires O.S.L. | Cleaning apparatus for electronic components and/or precision parts of machinery |
| CN101824634A (en) * | 2009-03-06 | 2010-09-08 | 深圳市正基电子有限公司 | Process for manufacturing circuit board |
| CN104918417A (en) * | 2015-05-15 | 2015-09-16 | 江门崇达电路技术有限公司 | Method for producing organic solderability preservative on surface of circuit board |
| CN108472693A (en) * | 2015-11-04 | 2018-08-31 | 吉布尔·施密德有限责任公司 | Treatment fluid-suction unit and Etaching device comprising it |
| US20180324954A1 (en) * | 2015-11-04 | 2018-11-08 | Gebr. Schmid Gmbh | Treatment fluid extracting device and etching device comprising the latter |
| CN109518187A (en) * | 2018-11-29 | 2019-03-26 | 惠州市和鑫达电子科技有限公司 | A kind of pcb board surface chemistry pre-treating technology |
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Application publication date: 20190920 |