CN110250647A - A kind of interlayer can inlay the shoes of installation cumulative quantum chip - Google Patents
A kind of interlayer can inlay the shoes of installation cumulative quantum chip Download PDFInfo
- Publication number
- CN110250647A CN110250647A CN201910543034.8A CN201910543034A CN110250647A CN 110250647 A CN110250647 A CN 110250647A CN 201910543034 A CN201910543034 A CN 201910543034A CN 110250647 A CN110250647 A CN 110250647A
- Authority
- CN
- China
- Prior art keywords
- interlayer
- chip
- shoes
- waterproof cover
- spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- A—HUMAN NECESSITIES
- A43—FOOTWEAR
- A43B—CHARACTERISTIC FEATURES OF FOOTWEAR; PARTS OF FOOTWEAR
- A43B3/00—Footwear characterised by the shape or the use
- A43B3/0031—Footwear characterised by the shape or the use provided with a pocket, e.g. for keys or a card
-
- A—HUMAN NECESSITIES
- A43—FOOTWEAR
- A43B—CHARACTERISTIC FEATURES OF FOOTWEAR; PARTS OF FOOTWEAR
- A43B7/00—Footwear with health or hygienic arrangements
-
- A—HUMAN NECESSITIES
- A43—FOOTWEAR
- A43B—CHARACTERISTIC FEATURES OF FOOTWEAR; PARTS OF FOOTWEAR
- A43B7/00—Footwear with health or hygienic arrangements
- A43B7/12—Special watertight footwear
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- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Footwear And Its Accessory, Manufacturing Method And Apparatuses (AREA)
Abstract
The present invention relates to the shoes that a kind of interlayer can inlay installation cumulative quantum chip, including interlayer, mounting device, clamping device, chip and waterproof cover, the sole center is equipped with interlayer, interlayer inner sidewall is equipped with mounting device, clamping device is connected with by way of being slidably matched in mounting device, gripping apparatus grips have chip, and the front inner wall of interlayer is connected with waterproof cover, and clamping device includes the T-shaped slider with the sliding connection of T shape sliding slot.The present invention when can solve existing shoes installation cumulative quantum chip existing common interlayer be easy to be squeezed and deformed, chip is difficult to take out that replacement, interlayer using hard material reduce shoes comfort level, shoes compression is easy to damage the problems such as chip and common interlayer waterproof performance are poor;Shoes intraformational bed installation cumulative quantum chip may be implemented and replace the convenient and good function of protectiveness;Have the advantages that chip takes out that replacement is convenient, is not pressurised that impaired, waterproof performance is good, shoes comfort is good.
Description
Technical field
The present invention relates to healthcare field, in particular to a kind of interlayer can inlay the shoes of installation cumulative quantum chip.
Background technique
As the improvement of people's living standards, people also increasingly pay attention to health, the progress of scientific and technological level is not yet
The disconnected thinking for updating people's life enhancement, cumulative quantum chip can be generated biological electric wave and be come by electromagnetic wave in reception space
Coordinate the spontaneous biological electric frequency of human body, can boost metabolism, activating cell, enhancing human body self treat energy more
Cumulative quantum chip need to be only mounted on shoes, in dress ornament by power, still, existing to exist very when chip in shoes
More problems:
Problem one: chip uses overlong time meeting simply by the sandwich establishment in shoes, shoes in existing shoes
Interlayer is caused to be squeezed and deformed, to be difficult to that chip is taken out or replaced;
Problem two: chip is mounted in shoes addition in order to guarantee that chip is not damaged, shoes bottom generally uses harder
Material, thus reduce shoes dress comfort;
Problem three: existing shoes interlayer chip can be pressurized when on foot, chip is easy to damage when being pressurized larger, together
When, the waterproof performance of common interlayer is poor, and it is impaired that chip is easy chance water.
For above-mentioned listed problem, under the conditions of the prior art, there are no preferable exploration and practice achievements therefore to have very much
Necessity does further exploration and practice, above-mentioned listed to solve the problems, such as.
Summary of the invention
To solve the above-mentioned problems, the present invention uses following technical scheme, and a kind of interlayer can inlay installation cumulative quantum core
The shoes of piece, including interlayer, mounting device, clamping device, chip and waterproof cover, the sole center is equipped with interlayer, in interlayer
Side wall is equipped with mounting device, clamping device is connected with by way of being slidably matched in mounting device, gripping apparatus grips have
The front inner wall of chip, interlayer is connected with waterproof cover.
The clamping device includes the T-shaped slider with the sliding connection of T shape sliding slot, and T-shaped slider is mounted on pin shaft
Left side, the lower end surface of pin shaft are placed on the upper surface of supporting table, and the top and bottom sidewall of pin shaft is symmetrically rotatably connected to grip block, folder
Plate is held in corrugated, grip block is uniformly provided in the side wall of pin shaft, is equipped with fastening spring between upper and lower grip block, is clamped up and down
Clamping device is symmetrically arranged between plate.
The clamping device includes the grip slipper for being mounted on grip block lower end surface, and the inside of grip slipper is by being slidably matched
Mode be connected with clamping telescopic rod, the inside for clamping telescopic rod is equipped with clamp springs, up and down clamp telescopic rod between clamp
There is chip, the lower end surface for clamping telescopic rod and grip slipper is socketed with rubber antiskid pad;When work, clamping device can be by chip
The clamping of left and right end.
The mounting device includes the erecting bed for being mounted on interlayer or so inner sidewall, and the right side of erecting bed is equipped with T shape
Sliding slot, the upper and lower end face of erecting bed are symmetrically and evenly equipped with circular groove, installation telescopic rod are equipped in circular groove, install the top of telescopic rod
It is connected by mounting plate, the inside for installing telescopic rod is equipped with installation spring, pacifies spring-loaded spring constant greater than clamp springs
Spring constant, interlayer lower end inner wall has been left and right symmetrically arranged supporting table, and the upper surface of supporting table is arcuate structure, and its radian
Identical as the arc of pin shaft lateral wall, interlayer upper end inner wall is equipped with protection mechanism;When work, mounting device can fill clamping
Limit is set in interlayer.
The waterproof cover includes the limit spring being mounted in waterproof cover front end face limiting slot, and limit spring is symmetrical above and below
It is equipped with, the upper end of limit spring is equipped with the gag lever post with limiting slot sliding connection, and gag lever post passes through the upper end of waterproof cover
Limit hole in face and interlayer upper end inner wall is slidably connected.
The waterproof cover rear end face is equipped with drain bar, and drain bar lateral wall is socketed with water-absorbing sponge, drain bar lateral wall
It is uniformly provided with rhone, the lower end surface of rhone is provided tiltedly with the drainage hole across waterproof cover, and waterproof cover and drain bar are in ladder
Shape, adjacent rhone are connected, and rhone is also connected with drainage hole.
The rear end face outer of the waterproof cover and the rear end face of drain bar are equipped with sealing-plug, and the shape of interlayer front end face
It matches with the stairstepping of waterproof cover and drain bar;When work, waterproof cover can be avoided water and enter in interlayer.
The protection mechanism includes the protection spring being mounted in the inner wall protective trough of interlayer upper end, protects spring in interlayer
Bilateral symmetry is equipped in the inner wall of upper end, and is uniformly provided with from front to back in interlayer upper end inner wall, and the lower end surface of spring is protected to pass through
Fender rod is equipped with protective plate, connecting plate is equipped between the protective plate of left and right, and connecting plate is in the arcuate structure to arch upward upwards;Work
When making, clamping device and mounting device cooperate, and it is excessive impaired to can be avoided chip chucking power when shoes are pressurized.
The beneficial effects of the present invention are:
One, the present invention is provided with mounting device, and mounting device compression will not deform, and guarantees that chip takes out replacement conveniently, and
Shoes avoid the problem of mounting layer material is harder, and shoes comfort level reduces using conventional material;
Two, the present invention is provided with clamping device, and clamping device and mounting device cooperate, can when shoes are pressurized
Mitigate clamping device to the chucking power of chip, chucking power is excessive impaired when chip being avoided to be pressurized;
Three, the present invention is provided with waterproof cover, and waterproof cover is equipped with two layers of sealing-plug, and water-absorbing sponge can pass through the water of absorption
It crosses rhone to be discharged to outside shoes, it is impaired to avoid chip chance water.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples.
Fig. 1 is the front view of shoes bottom interlayer of the invention;
Fig. 2 is partially enlarged schematic view of fig. 1 in a direction a of the present invention;
Fig. 3 is the B-B sectional view of Fig. 1 of the present invention;
Fig. 4 is the structural schematic diagram between interlayer and waterproof plug of the invention.
Specific embodiment
Below with reference to the accompanying drawings the embodiment of the present invention is illustrated.In the process, for ensure illustrate definition and
Convenience, we may the width to lines in diagram or constituent element the mark exaggerated of size.
In addition, term hereinafter is defined based on the function in the present invention, it can be according to the intention of user, fortune user
Or convention and difference.Therefore, these terms are defined based on the full content of this specification.
As shown in Figures 1 to 4, a kind of interlayer can inlay the shoes of installation cumulative quantum chip, including interlayer 1, installation dress
2, clamping device 3, chip 4 and waterproof cover 5 are set, the sole center is equipped with interlayer 1, and 1 inner sidewall of interlayer is equipped with mounting device
2, it is connected with clamping device 3 in mounting device 2 by way of being slidably matched, clamping device 3 is clamped with chip 4, before interlayer 1
End inner wall is connected with waterproof cover 5.
The clamping device 3 includes the T-shaped slider 31 with the sliding connection of T shape sliding slot, and T-shaped slider 31 is mounted on pin
The left side of axis 32, the lower end surface of pin shaft 32 are placed on the upper surface of supporting table 25, the symmetrical company of rotation of the top and bottom sidewall of pin shaft 32
It is connected to grip block 33, grip block 33 is in corrugated, and grip block 33 is uniformly provided in the side wall of pin shaft 32, between upper and lower grip block 33
Fastening spring is installed, is symmetrically arranged with clamping device 34 between upper and lower grip block 33.
The clamping device 34 includes the grip slipper 35 for being mounted on 33 lower end surface of grip block, and the inside of grip slipper 35 passes through
The mode being slidably matched is connected with clamping telescopic rod 36, and the inside of clamping telescopic rod 36 is equipped with clamp springs 37, clamps up and down
Chip 4 is clamped between telescopic rod 36, clamping telescopic rod 36 and the lower end surface of grip slipper 35 are socketed with rubber antiskid pad 38;Work
When making, chip 4 is placed on the grip slipper 35 on 33 right side of grip block, fastening spring passes through clamping by 33 left side of pressing grip block
35 pairs of 4 or so sides of chip of seat are clamped fixation.
The mounting device 2 includes the erecting bed 21 for being mounted on 1 or so inner sidewall of interlayer, and the right side of erecting bed 21 is set
There is T shape sliding slot, the upper and lower end face of erecting bed 21 is symmetrically and evenly equipped with circular groove, installation telescopic rod 22 is equipped in circular groove, installation is stretched
The top of contracting bar 22 is connected by mounting plate 23, and the inside of installation telescopic rod 22 is equipped with installation spring 24, installation spring 24
Spring constant is greater than the spring constant of clamp springs 37, and 1 lower end inner wall of interlayer has been left and right symmetrically arranged supporting table 25, supporting table 25
Upper surface be arcuate structure, and its radian is identical as the arc of 32 lateral wall of pin shaft, and 1 upper end inner wall of interlayer is equipped with protection machine
Structure 26;When work, the T-shaped slider 31 in clamping device 3 is pushed in T shape sliding slot, at this point, supporting table 25 and T-shaped slider 31
Pin shaft 32 is propped up, 33 left side of grip block is mounted plate 23 under the action of installing spring 24 and struts, to pass through installation spring
24 pairs of clamping devices 3 for being clamped with chip 4 fix, and erecting bed 21 avoids interlayer 1 for a long time at 1 middle part of interlayer
Compressive deformation causes chip 4 to be difficult to the problem of taking out replacement.
The waterproof cover 5 includes the limit spring 51 being mounted in 5 front end face limiting slot of waterproof cover, and in limit spring 51
Under be symmetrically arranged with, the upper end of limit spring 51 is equipped with the gag lever post 52 with limiting slot sliding connection, and gag lever post 52 passes through
The upper surface of waterproof cover 5 and the limit hole in 1 upper end inner wall of interlayer are slidably connected.
5 rear end face of waterproof cover is equipped with drain bar 53, and 53 lateral wall of drain bar is socketed with water-absorbing sponge 54, drain bar
53 lateral walls are uniformly provided with rhone 55, and the lower end surface of rhone 55 is provided tiltedly with the drainage hole 56 across waterproof cover 5, waterproof cover
5 are stepped with drain bar 53, and adjacent rhone 55 is connected, and rhone 55 is also connected with drainage hole 56.
The rear end face outer of the waterproof cover 5 and the rear end face of drain bar 53 are equipped with sealing-plug 57, and 1 front end face of interlayer
Shape match with the stairstepping of waterproof cover 5 and drain bar 53;When work, waterproof cover 5 is snapped fit into clamping front end, and pass through
Gag lever post 52 limits waterproof cover 5, and two layers of sealing-plug 57 avoids water from entering in interlayer 1, and water-absorbing sponge 54 can will enter waterproof
The water of 5 back-end sealing plug 57 of lid adsorbs, and when shoes are pressurized, the compression of interlayer 1 simultaneously squeezes water-absorbing sponge 54, in water-absorbing sponge 54
Water converges to the drainage hole 56 of 53 lower end of drain bar by rhone 55, and is discharged to outside shoes from drainage hole 56, and waterproof cover 5 is to core
Piece 4 plays good waterproofing protection.
The protection mechanism 26 includes the protection spring 27 being mounted in 1 upper end inner wall protective trough of interlayer, protects spring
27 are symmetrically equipped in 1 upper end inner wall of interlayer, and are uniformly provided with from front to back in 1 upper end inner wall of interlayer, protect spring 27
Lower end surface protective plate 29 is equipped with by fender rod 28, connecting plate 210, and connecting plate are installed between left and right protective plate 29
210 in the arcuate structure to arch upward upwards;When work, when shoes are pressurized, the power that upper end is pressurized is transmitted to anti-by connecting plate 210
Backplate 29, protective plate 29, which is moved down, is transmitted to installation spring 24 by grip block 33 for power, and installation spring 24, which is pressurized, to be shunk, this
When, the grip slipper 35 on 33 right side of grip block is mobile to two sides, and grip slipper 35 is separated with chip 4, meanwhile, in the work of clamp springs 37
Under, clamping telescopic rod 36 is unfolded, so that chip 4 is clamped the clamping of telescopic rod 36, avoids when shoes are pressurized since chip 4 presss from both sides
The excessive and impaired problem of holding force.
Chip 4 clamps: chip 4 is placed on the grip slipper 35 on 33 right side of grip block, clamps by 33 left side of pressing grip block
Spring is clamped fixation to 4 or so side of chip by grip slipper 35;
Chip 4 is installed: the T-shaped slider 31 in clamping device 3 being pushed in T shape sliding slot, at this point, supporting table 25 and T shape
Sliding block 31 props up pin shaft 32, and 33 left side of grip block is mounted plate 23 under the action of installing spring 24 and struts, to pass through peace
Shock mount 24 fixes the clamping device 3 for being clamped with chip 4, and erecting bed 21 avoids interlayer 1 at 1 middle part of interlayer
Long-time compressive deformation causes chip 4 to be difficult to the problem of taking out replacement;
4 waterproof of chip: waterproof cover 5 is snapped fit into clamping front end, and is limited waterproof cover 5 by gag lever post 52, two layers close
Blocking 57 avoids water from entering in interlayer 1, and water-absorbing sponge 54 can adsorb the water for entering 5 back-end sealing plug 57 of waterproof cover, works as shoes
When son is pressurized, interlayer 1 is pressurized and squeezes water-absorbing sponge 54, and the water in water-absorbing sponge 54 converges to drain bar 53 by rhone 55
The drainage hole 56 of lower end, and be discharged to outside shoes from drainage hole 56, waterproof cover 5 plays good waterproofing protection to chip 4;
Chip 4, which is pressurized, to be protected: when shoes are pressurized, the power that upper end is pressurized is transmitted to protective plate 29 by connecting plate 210, prevents
Backplate 29, which is moved down, is transmitted to installation spring 24 by grip block 33 for power, and installation spring 24, which is pressurized, to be shunk, at this point, grip block
The grip slipper 35 on 33 right sides is mobile to two sides, and grip slipper 35 is separated with chip 4, meanwhile, under the action of clamp springs 37, clamping
Telescopic rod 36 is unfolded, so that chip 4 is clamped the clamping of telescopic rod 36, the spring constant of clamp springs 37 is less than installation spring 24
Spring constant, the problem excessive and impaired due to 4 chucking power of chip when so as to avoid shoes compression.
It is convenient good with protectiveness that workflow in summary realizes the installation replacement of cumulative quantum chip 4 of shoes intraformational bed 1
Function, existing common interlayer 1 is easy to be squeezed and deformed when solving existing shoes installation cumulative quantum chip 4, and chip 4 is difficult to
Taking-up replacement, interlayer 1 reduce shoes comfort level using hard material, shoes compression is easy to damage chip 4 and commonly interlayer 1 is anti-
It is aqueous can it is poor the problems such as, reached purpose.
The embodiment that the present invention only refers to drawing illustration is illustrated, it is believed that has related fields basic
The personnel of knowledge can carry out the other embodiments of diversified deformation and peer-level based on this.
Claims (8)
1. a kind of interlayer can inlay the shoes of installation cumulative quantum chip, including interlayer (1), mounting device (2), clamping device
(3), chip (4) and waterproof cover (5), it is characterised in that: the sole center is equipped with interlayer (1), and interlayer (1) inner sidewall is equipped with
Mounting device (2), mounting device (2) is interior to be connected with clamping device (3) by way of being slidably matched, clamping device (3) clamping
Have chip (4), the front inner wall of interlayer (1) is connected with waterproof cover (5);Wherein:
The mounting device (2) includes the erecting bed (21) for being mounted on interlayer (1) left and right inner sidewall, the right end of erecting bed (21)
Face is equipped with T shape sliding slot, and the upper and lower end face of erecting bed (21) is symmetrically and evenly equipped with circular groove, installation telescopic rod is equipped in circular groove
(22), the top for installing telescopic rod (22) is connected by mounting plate (23), and the inside of installation telescopic rod (22) is equipped with installation bullet
Spring (24), interlayer (1) lower end inner wall have been left and right symmetrically arranged supporting table (25), and interlayer (1) upper end inner wall is equipped with protection mechanism
(26);
The clamping device (3) includes the T-shaped slider (31) with the sliding connection of T shape sliding slot, and T-shaped slider (31) is mounted on
The left side of pin shaft (32), the lower end surface of pin shaft (32) are placed on the upper surface of supporting table (25), the top and bottom sidewall of pin shaft (32)
It is symmetrically rotatably connected to grip block (33), in corrugated, grip block (33) is uniformly set grip block (33) in the side wall of pin shaft (32)
Have, fastening spring is installed between upper and lower grip block (33), is symmetrically arranged with clamping device (34) between upper and lower grip block (33);
The waterproof cover (5) includes the limit spring (51) that is mounted in waterproof cover (5) front end face limiting slot, and limit spring
(51) symmetrical above and below to be equipped with, the upper end of limit spring (51) is equipped with the gag lever post (52) with limiting slot sliding connection, limit
Position bar (52) passes through the upper surface of waterproof cover (5) and the limit hole in the inner wall of interlayer (1) upper end is slidably connected.
2. the shoes that a kind of interlayer according to claim 1 can inlay installation cumulative quantum chip, it is characterised in that: described
Protection mechanism (26) include the protection spring (27) that is mounted in the inner wall protective trough of interlayer (1) upper end, protection spring (27) exists
Bilateral symmetry is equipped in the inner wall of interlayer (1) upper end, and is uniformly provided with from front to back in interlayer (1) upper end inner wall, and spring is protected
(27) lower end surface is equipped with protective plate (29) by fender rod (28), and left and right protective plate is equipped with connecting plate between (29)
(210), and connecting plate (210) is in the arcuate structure to arch upward upwards.
3. the shoes that a kind of interlayer according to claim 1 can inlay installation cumulative quantum chip, it is characterised in that: described
Clamping device (34) include being mounted on the grip slipper (35) of grip block (33) lower end surface, the inside of grip slipper (35) passes through sliding
The mode of cooperation is connected with clamping telescopic rod (36), and the inside of clamping telescopic rod (36) is equipped with clamp springs (37), presss from both sides up and down
It holds and is clamped with chip (4) between telescopic rod (36), the lower end surface of clamping telescopic rod (36) and grip slipper (35) is socketed with rubber
Non-slip mat (38).
4. the shoes that a kind of interlayer according to claim 1 can inlay installation cumulative quantum chip, it is characterised in that: described
The upper surface of supporting table (25) is arcuate structure, and its radian is identical as the arc of pin shaft (32) lateral wall.
5. the shoes that a kind of interlayer according to claim 1 can inlay installation cumulative quantum chip, it is characterised in that: described
Waterproof cover (5) rear end face is equipped with drain bar (53), and drain bar (53) lateral wall is socketed with water-absorbing sponge (54), drain bar (53)
Lateral wall is uniformly provided with rhone (55), and the lower end surface of rhone (55) is provided tiltedly with the drainage hole (56) across waterproof cover (5),
Waterproof cover (5) is stepped with drain bar (53).
6. the shoes that a kind of interlayer according to claim 1 can inlay installation cumulative quantum chip, it is characterised in that: described
The rear end face outer of waterproof cover (5) and the rear end face of drain bar (53) are equipped with sealing-plug (57), and the shape of interlayer (1) front end face
Shape matches with the stairstepping of waterproof cover (5) and drain bar (53).
7. the shoes that a kind of interlayer according to claim 5 can inlay installation cumulative quantum chip, it is characterised in that: described
Adjacent rhone (55) is connected, and rhone (55) is also connected with drainage hole (56).
8. the shoes that a kind of interlayer according to claim 1 can inlay installation cumulative quantum chip, it is characterised in that: described
The spring constant for installing spring (24) is greater than the spring constant of clamp springs (37).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201910543034.8A CN110250647B (en) | 2019-06-21 | 2019-06-21 | Shoes with interlayer capable of being embedded with energy-gathering quantum chips |
Applications Claiming Priority (1)
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CN201910543034.8A CN110250647B (en) | 2019-06-21 | 2019-06-21 | Shoes with interlayer capable of being embedded with energy-gathering quantum chips |
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CN110250647A true CN110250647A (en) | 2019-09-20 |
CN110250647B CN110250647B (en) | 2021-06-29 |
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CN105495844A (en) * | 2016-01-28 | 2016-04-20 | 王秀贵 | Intelligent thermostatic health shoe |
CN205846028U (en) * | 2016-07-27 | 2016-12-28 | 衢州环艺工业设计有限公司 | A kind of waterproof li battery shell |
CN206729329U (en) * | 2017-04-14 | 2017-12-12 | 湖南冠植丰生物科技有限公司 | Quantum resonance health-care footwear |
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