CN110249489A - Laser medium for solid state laser - Google Patents
Laser medium for solid state laser Download PDFInfo
- Publication number
- CN110249489A CN110249489A CN201880007760.1A CN201880007760A CN110249489A CN 110249489 A CN110249489 A CN 110249489A CN 201880007760 A CN201880007760 A CN 201880007760A CN 110249489 A CN110249489 A CN 110249489A
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- China
- Prior art keywords
- laser
- laser medium
- chamfering
- light emergence
- emergence face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000015572 biosynthetic process Effects 0.000 claims description 4
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- LCKIEQZJEYYRIY-UHFFFAOYSA-N Titanium ion Chemical compound [Ti+4] LCKIEQZJEYYRIY-UHFFFAOYSA-N 0.000 claims description 3
- 229910001429 cobalt ion Inorganic materials 0.000 claims description 3
- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 claims description 3
- 239000013078 crystal Substances 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052684 Cerium Inorganic materials 0.000 claims description 2
- 229910052693 Europium Inorganic materials 0.000 claims description 2
- 229910052689 Holmium Inorganic materials 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 2
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- WCWKKSOQLQEJTE-UHFFFAOYSA-N praseodymium(3+) Chemical compound [Pr+3] WCWKKSOQLQEJTE-UHFFFAOYSA-N 0.000 claims description 2
- 229910001456 vanadium ion Inorganic materials 0.000 claims description 2
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- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- 102100028829 Heat shock 70 kDa protein 4L Human genes 0.000 description 1
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 235000014360 Punica granatum Nutrition 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
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- 230000001154 acute effect Effects 0.000 description 1
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 1
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- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
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- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
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- 229910052746 lanthanum Inorganic materials 0.000 description 1
- 239000000087 laser glass Substances 0.000 description 1
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- 229910052751 metal Inorganic materials 0.000 description 1
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- 238000003199 nucleic acid amplification method Methods 0.000 description 1
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- 239000010452 phosphate Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
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- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/06—Construction or shape of active medium
- H01S3/0602—Crystal lasers or glass lasers
- H01S3/0615—Shape of end-face
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/06—Construction or shape of active medium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/06—Construction or shape of active medium
- H01S3/0602—Crystal lasers or glass lasers
- H01S3/0606—Crystal lasers or glass lasers with polygonal cross-section, e.g. slab, prism
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/06—Construction or shape of active medium
- H01S3/0602—Crystal lasers or glass lasers
- H01S3/061—Crystal lasers or glass lasers with elliptical or circular cross-section and elongated shape, e.g. rod
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/06—Construction or shape of active medium
- H01S3/0602—Crystal lasers or glass lasers
- H01S3/0617—Crystal lasers or glass lasers having a varying composition or cross-section in a specific direction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/06—Construction or shape of active medium
- H01S3/0619—Coatings, e.g. AR, HR, passivation layer
- H01S3/0621—Coatings on the end-faces, e.g. input/output surfaces of the laser light
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/08—Construction or shape of optical resonators or components thereof
- H01S3/08018—Mode suppression
- H01S3/0804—Transverse or lateral modes
- H01S3/0805—Transverse or lateral modes by apertures, e.g. pin-holes or knife-edges
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
- H01S3/16—Solid materials
- H01S3/17—Solid materials amorphous, e.g. glass
- H01S3/175—Solid materials amorphous, e.g. glass phosphate glass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/06—Construction or shape of active medium
- H01S3/0619—Coatings, e.g. AR, HR, passivation layer
- H01S3/0621—Coatings on the end-faces, e.g. input/output surfaces of the laser light
- H01S3/0623—Antireflective [AR]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
- H01S3/16—Solid materials
- H01S3/1601—Solid materials characterised by an active (lasing) ion
- H01S3/1603—Solid materials characterised by an active (lasing) ion rare earth
- H01S3/1608—Solid materials characterised by an active (lasing) ion rare earth erbium
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
- H01S3/16—Solid materials
- H01S3/1601—Solid materials characterised by an active (lasing) ion
- H01S3/1603—Solid materials characterised by an active (lasing) ion rare earth
- H01S3/1611—Solid materials characterised by an active (lasing) ion rare earth neodymium
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
- H01S3/16—Solid materials
- H01S3/1601—Solid materials characterised by an active (lasing) ion
- H01S3/1603—Solid materials characterised by an active (lasing) ion rare earth
- H01S3/1618—Solid materials characterised by an active (lasing) ion rare earth ytterbium
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/14—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range characterised by the material used as the active medium
- H01S3/16—Solid materials
- H01S3/1601—Solid materials characterised by an active (lasing) ion
- H01S3/162—Solid materials characterised by an active (lasing) ion transition metal
- H01S3/1623—Solid materials characterised by an active (lasing) ion transition metal chromium, e.g. Alexandrite
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Lasers (AREA)
- Glass Compositions (AREA)
- Laser Surgery Devices (AREA)
Abstract
The invention discloses a kind of for generating the laser medium of laser, wherein laser medium is configured to solid, and wherein laser medium includes light emergence face, laser is projected from laser medium by the light emergence face in laser operation, wherein light emergence face has limiting unit, the limiting unit is limited by least one chamfering or groove, and the present invention includes a kind of with this laser medium, pumping source for pump light to be introduced into laser medium and be used for photon multiple reflections resonator laser aid, wherein, the resonator includes the output coupling mirror especially formed by the coating partially reflected or the especially end mirror that is formed by the coating of high reflection, and the present invention includes a kind of method for manufacturing laser medium.
Description
Technical field
The present invention relates to solid laser medium field, it is used to generate laser by the stimulated emission of photon.
Background technique
The light amplification component being usually used as with the solid laser medium of laser bar form in solid state laser.In general, solid
Laser so constructs, so that laser bar is arranged in optical resonantor and is irradiated with so-called pump light higher to excite
Energy level.The photon that resonator is used herein to emit when higher energy level transits to reduced levels is fed back, and is made
They can with multipass laser bar and improve occur to induce, i.e. the probability of stimulated emission.
Laser resonator can for example realize that one of reflecting mirror has by two reflecting mirrors disposed opposing each other
Have close to absolutely reflectivity (end mirror), and another reflecting mirror has lower reflectivity, to allow a part to swash
Light projects (output coupling mirror) as collimated laser beam from resonator.
In most cases, laser also extends through aperture or the limitation by aperture diaphragm, specific to be realized according to application
Beam characteristics, especially contribute to form desired beam diameter, beam divergence or beam profile and inhibit unwanted oscillation.
Aperture diaphragm for example can be used as another component layout in the optical path before output coupling mirror.By means of this hole
Diameter diaphragm can extremely flexibly select the laser projected from laser medium, especially by selection aperture shape and pass through
Aperture diaphragm is realized relative to the positioning of laser medium.Sometimes it possibly even needs to keep aperture laterally inclined relative to laser medium
In-migration selection corresponds to the light of the pump energy density in laser medium.This is because in most cases in laser medium
Energy density is uneven and is not usually rotational symmetry or mirror symmetry.
On the other hand, the aperture diaphragm as independent component can also be saved.It at this time can be particularly by having existed
The geometry limiting unit of component limit aperture diaphragm or aperture, in some cases, for example, even passing through laser bar itself
Diameter limits.This is with series of advantages, for example, saving additional member and cost, simplifies the assembling of solid state laser,
More compact design is realized, and desired beam characteristics can be influenced in a restricted way in the production of laser medium.
However, the shortcomings that cancelling individual aperture diaphragm usually strictly limits the above-mentioned flexible choosing to desired light component
It selects.Its reason is that the geometry of laser medium relys more in addition to light selection than the geometry of individual aperture diaphragm
Other Considerations.For example, the geometry of laser bar should also have the best entering surface suitable for pump light, it is ensured that the greatest extent
It may advantageous production, high stability and simple installation safety.
1 341 271 A1 of document EP is related to a kind of laser aid with the laser bar based on Nd:YAG.Here, using
Laser bar there is relatively large size, such as diameter is 6mm or bigger.Therefore, especially small laser medium is infeasible.
102 22 852 A1 of document DE also discusses the various structures of the Optical devices with optical component, wherein scattering
Light should be blocked.A kind of elongated optical component is proposed, which seems there is recess on outer peripheral surface.
Therefore, it is desirable that, can most preferably consider above-mentioned factor when selecting the geometry of laser bar, but simultaneously can
It enough saves individual aperture diaphragm and still allows for extremely flexibly selecting desired light component.This can be considered as the present invention
Purpose.
Summary of the invention
Therefore, the purpose of the present invention is to provide a kind of laser medium, particularly laser bar, its geometry is passed through
Specific aperture and aperture diaphragm are defined, to cause desired beam characteristics, wherein ensuring that there is spy when light selects simultaneously
Not high flexibility, especially also about the energy density in laser medium, and wherein, furthermore for pumping smooth surface, stabilization
Property and installation can most preferably select the geometry of laser medium.
Another importance of the purpose of the present invention is to provide material for laser medium, on the one hand which has excellent
Optical characteristics, on the other hand however be also able to achieve cost-effective manufacture.In this case, it especially should be able to also set
Set the especially small laser medium of size, and the laser bar that such as manufacture diameter is less than 6mm.
Therefore, the purpose be especially to provide on one side can in laser medium used in solid state laser, without
Want aperture diaphragm as individual component.
The purpose is realized by subject matter of the independent claims.Advantageous embodiment is the theme of dependent claims.
According to the present invention, provide a kind of for generating the laser medium of laser, wherein laser medium is configured to solid, and
And wherein laser medium includes light emergence face, laser is projected from laser medium by the light emergence face in laser operation,
Wherein light emergence face has limiting unit, which is limited by least one chamfering or groove.
Therefore, the laser medium for being especially designed as laser bar can have at least one, preferably only one light emergence face,
Light emergence face transition at seamed edge is chamfering or the groove for being configured to folding.
In the case where chamfering, the transition from light emergence face to adjacent fillet surface is specifically designed to obtuse angle.And fillet surface
Especially there is the obtuse angle transition part to the side of laser medium again.
Understand as described above in light emergence face and fillet surface or (obtuse angle) angle between fillet surface and such as side
For the angle in laser medium.The angle is preferably at least 100 degree, and particularly preferably at least 120 degree, more preferably at least
130 degree and/or preferably at most 170 degree, particularly preferably at least 120 degree and at most 150 degree, and more preferably at least 130
Degree and at most 140 degree.The angle is for example in the range of at least 100 degree and at most 170 degree, particularly preferably at least 120 degree simultaneously
And at most 150 degree, and more preferably at least 130 degree and at most 140 degree.
Once in a while in order to describe chamfering also by (acute angle) supplement angle as above-mentioned angle, i.e. supplement angle is 180 degree.Therefore,
Chamfering preferably has at least 10 degree, particularly preferably at least 30 degree, more preferably at least 40 degree and/or at most 80 in the present specification
Degree, particularly preferably at most 60 degree and more preferably up to 60 degree of angle.For example, the angle is in the range of 10 to 80 degree, spy
Not preferably in the range of 30 to 60 degree and more preferably in the range of 40 to 60 degree.
In other words, light emergence face can be defined by chamfering or groove.Therefore it can be stated that limiting light emergence face extremely
A few seamed edge not will form the direct transition part of the outer peripheral surface of laser medium.But preferably at least two ribs to follow one another
Side only forms the transition part to outer peripheral surface or side.Term groove herein particularly including fold.In addition, term chamfering should also include
Medium altitude groove or rounding etc..However, with plane and obliquely extend about light emergence face and/or side or outer peripheral surface
The chamfering of fillet surface especially considers that the reason of production is preferred.
Multiple fillet surfaces also can be set in shape (such as quadrangle) depending on light emergence face, such as are respectively arranged to
The fillet surface of each of four four flank side surfaces of light emergence face or seamed edge, or for example in the case where circular light emergence face
Be arranged entirely around fillet surface.
Therefore it especially provides, light emergence face has the comprehensive limiting unit limited by least one chamfering or groove.Therefore,
Light emergence face can be limited by chamfering or groove comprehensively.Light emergence face for example circlewise passes through the seamed edge with obtuse angle at this time
To limit.
However, according to the present invention, light emergence face has to be not required by the limiting unit that at least one chamfering or groove limit
Keep the limiting unit of light emergence face and chamfering or groove adjacent.Thus, for example, can be set be configured to recess portion groove (rather than
It is configured to the groove folded), the limiting unit that light emergence face is limited along the protrusion of optical axial of the groove.In other words, light
The limiting unit of outgoing plane need not be formed by seamed edge.Therefore, light emergence face for example can also be the part face of the end face of laser medium,
Limiting unit along the separate chamfering of optical axial or groove especially by limiting.However for production reason, with light emergence face adjoining
Chamfering or groove are preferred.
Certainly, limiting unit, i.e. light emergence face seamed edge also by least one chamfering and at least one groove, i.e., usually by
One or more chamferings and/or groove limit.
Since light emergence face according to the present invention has the limiting unit limited by least one chamfering or groove, can almost have
The random desired shape of light emergence face is realized sharply.Such as the laser bar with square cross section dispose at least one chamfering or
Can have non-square after groove, for example, rectangle, circle or lateral shift, be when necessary also rectangular light emergence face.Cause
This lasing area can have any shape.Therefore, can have with surprising plain mode in the vpg connection of light emergence face
The flexibility of height.
Meanwhile the geometry of laser medium substantially can be independently selected with the shape of light emergence face.Such as it can be with
Simple mode manufactures the laser bar with square cross section and round light emergence face, or has circular cross section and polygon optical
The laser bar of outgoing plane.Therefore, the geometry of laser medium be especially selection can be carried out according to other requirements, for example,
It can choose with polygon, the usually design of square cross section, some real advantages, such as production cost can be provided
It is low, assembling that can be simpler and more stable with pump diode and radiator etc..
In laser operation, light emergence face is also used as aperture, and at least one chamfering or groove are used as aperture
Diaphragm, so as to form specific beam profile.Therefore, light emergence face or chamfering or groove can be used for helping to be formed specifically
Beam profile.
Therefore, can almost freely and independently of the geometry of laser medium selection light emergence face shape and position
Can also be used alone random molding and can the similar mode in the aperture of lateral register extremely flexibly select desired light point
Amount.Individual aperture diaphragm (pin hole) is not needed advantageously however,.Therefore, it can be omitted at other positions of Optical Maser System
Aperture and/or aperture diaphragm, to keep entire Optical Maser System smaller, more compact and lighter.Furthermore manufacturing cost can be reduced.
In addition, even if the light emergence face as aperture can also be thusly-formed when manufacturing laser bar, that is, it is special to obtain desired light beam
Property.Therefore such as beam quality can be further improved.
Particularly, the midpoint of light emergence face can allow to the optical axial laterally offset of laser bar about laser
Non-uniform energy density in medium carries out light selection.
The present invention, which can also reduce in laser assembling, is easy to the case where generating error, because laser medium itself is
Including it is optimal for specific purpose, for example pass through the quasi-definite aperture shape of computer mould.Particularly, using chamfering also to have
The mode of benefit improves the breaking strength of laser medium, because such as obtuse angle is relative insensitivity.
Therefore, at least one chamfering or groove may be used as aperture diaphragm, that is, pass through chamfering particularly against laser
Face or groove surface leave laser bar.In addition, light can be scattered in chamfering or groove.Therefore it in resonator, is preferably falling
The zlasing mode of optical axial oscillation is not parallel at position where angle or groove.
At least one chamfering or groove can be also used for the Effect Mode distribution in a limiting fashion during laser is run,
To generate the particular beam characteristic of laser and/or to improve the beam quality of laser.
Targetedly the starting of oscillation of Effect Mode for example can be calculated a priori by computer simulation, and in chamfering or recessed
It is considered in the molding of slot.
In a preferred embodiment of the invention, laser medium has longitudinal axis and is especially designed as laser bar, this swashs
Optical wand has first end face including light emergence face, and the second end face and outer peripheral surface set opposite with first end face.
Preferably, first end face forms light emergence face.Therefore, laser medium especially can have parallel six face through chamfering
The shape of body, cylindrical body, truncated pyramid or frustum of a cone.
It can be stated that the second end face of laser bar does not have chamfering or groove or the end face to have at least one chamfering yet
Or groove.Therefore, at least one is especially used as the chamfering in aperture or groove can be provided only on a lasing area or both
On.One in the light emergence face in the face that optics is opposite and sets can be set chamfering, regardless of being the limit for limiting light emergence face
One or more chamferings or groove in portion processed.But also it can be stated that one or more chamferings or groove in second end face
Limit the limiting unit of light emergence face.The one or more chamferings or groove that second end face can be limited especially can be with light emergence faces
On at least one chamfering or groove be shaped differently.This can be for example, it may be advantageous that realizing suitable asymmetry with shadow
Ring mode distribution and/or energy density.Therefore, on one in the face that the opposite with light emergence face optics of laser medium is set
At least one chamfering may be used as safe chamfering, especially for improving breaking strength, but optical function also may be implemented.
It is particularly preferred that laser medium is characterized in that, perpendicular to laser medium in most of length of laser medium
Longitudinal axis there is remain unchanged, particularly polygon, preferably rectangular or round, preferably round cross section.
Therefore, laser medium preferably has over much of its length and is obtained by rectangular or circular translation
Cross section.Laser medium can particularly preferably be configured to the parallelepiped with square cross section, in light emergence face
Side be chamfered.In this case, a part of side or outer peripheral surface is flat, and can actually with pump light
Source or radiator contact.
Therefore, light emergence face is especially less than the cross section of the longitudinal axis perpendicular to laser medium.
Light emergence face can also be relative to the cross section laterally offset of the longitudinal axis perpendicular to laser medium.
In this way, for example, laser can according to asymmetric energy density from laser medium decoupling.Laser medium
In asymmetric energy density even typical case because stick is generally pumped through side or outer peripheral surface.Due to material
Pump light of simultaneously therefore decaying is absorbed, therefore the energy density in stick is usually uneven.In most cases, even if the pump of transmission
Pu light is in opposite side, such as reflect again by mirror image and second is absorbed, energy density be also not symmetrically or
Mirror symmetry.
It therefore for example can be by the asymmetry of light emergence face, it is specified that only having been provided from the region couples of laser medium (close
Seemingly) the laser of uniform energy density.
It, can be humorous in laser according to the statistical magnitude of reflection in resonator in the uniform situation of energy density in the material
Beam profile is formed in vibration device, is gaussian-shape, cylinder or the mixing shape of different collimations.Specific beam profile is specific
It may be advantageous in.
In addition, light emergence face is particularly with can be relative to the longitudinal axis perpendicular to laser medium for polygonal shape
Cross section is not identical and/or with different, particularly lesser amount of corner in geometrical aspects, especially non-circular
In the case where cross section.In other words it could dictate that, the shape of light emergence face and the cross section of laser medium cannot pass through similar diagram
As being transformed into each other.It is such feelings that this, which is for example when laser bar has rectangular cross section and light emergence face is rectangular or round,
Condition.
Therefore, in the feelings of the laser bar with rotational symmetry cross section or the laser bar of the geometry with cuboid
Under condition, can also be given at be different from geometry in region not corresponding with light emergence face perpendicular to laser medium
The light emergence face of the cross section of longitudinal axis.
In one embodiment of the invention, light emergence face is circular and has limiting unit, and the limiting unit is by ring
Around chamfering or groove limit.Therefore, circular light emergence face can especially be limited by circular chamfering or groove.Here
Being generally understood round is that light emergence face does not have corner.
In addition, light emergence face is also possible to polygon, especially rectangle, and have by multiple, particularly three
Or the limiting unit that four chamferings or groove limit.Therefore, the light emergence face of polygon, particularly rectangle can also be by multiple, special
It is not that three or four chamferings or groove limit.Therefore, light emergence face can be especially rectangle, wherein the height of rectangle and
Width is different.
It is that light emergence face especially can be round or ellipse and limited by taper chamfering.Taper chamfering is interpreted as chamfering
It is described by the surface in cone.The axis of cone can especially be especially parallel in the case where round light emergence face herein
Extend in the longitudinal axis of laser medium, or the longitudinal axis especially in the case where ellipse-shaped light outgoing plane about laser medium
Obliquely extend.Therefore, this chamfering is referred to as taper chamfering sometimes.Chamfering can also be described with elliptical cone.
In the preferred embodiment of the present invention, light emergence face is flat, in particular perpendicular to laser medium
Longitudinal axis and/or the second end face alignment for being parallel to laser bar.
Laser medium or laser bar preferably include material of main part and the laser active material that is embedded for being excited
Emit photon, wherein material of main part includes glass or crystal (such as phosphate glass, silicate glass, YAG (yttroalumite pomegranate
Stone) or sapphire) and/or laser active material, for example including ytterbium ion and/or erbium ion (for example, being produced by SCHOTT AG
Glass in LG960, LG950 and LG940), neodymium ion (such as Nd:YAG, SCHOTT glass APG1, APG760, LG680,
LG750, LG760, LG770), titanium ion (such as titanium: sapphire), chromium ion and/or cobalt ions.
Suitable phosphate glass preferably has at least 50 parts by weight %, more preferably at least 55 parts by weight % and/or preferably
The at most P of 85 parts by weight %, more preferably up to 80 parts by weight %2O5Content.In addition, may include in glass content preferably extremely
The Al of few 1 parts by weight %, more preferably at least 2 parts by weight % and/or preferably up to 20 parts by weight %2O3.As other optional
Component phosphate glass may include fluorine (preferably 0 to 20 parts by weight %), one or more alkali metal oxide (Li, Na, K, always
Count preferably 0 to 20 parts by weight %), alkaline-earth metal (Mg, Ca, Ba, Sr, amount to be preferably 0 to 20 parts by weight %) and element B,
The oxide of Zn, La, Gd, Nb, Y, Bi, Ge and/or Pb.For example, in US 2017/0217828, US 5526369, US
5032315, this glass is described in US 5173456 and US 4929387, the disclosure of which will be considered as being entirely incorporated into this theory
In bright book.
Although phosphate glass shows excellent optical property for use as active laser material, such as since its is excellent
Pumping and emitting performance, but heat and mechanical parameter have very unfavorable value.Therefore, the heat biography of laser crystal, such as Nd:YAG
It leads and Resisting fractre intensity is all respectively than more preferable and high an order of magnitude of phosphate glass, thermal expansion coefficient average specific phosphate glass
The low about one third of glass, 5-6 times of Young's modulus mean height.Therefore, with the identical phosphate glass laser of geometry
Significantly stronger Temperature Distribution and thermal lens are formd in operational process, and since temperature gradient or thermal shock material more may be used
It can be broken.Therefore, the maximum possible of the size of active laser glass component reduces, and installs from volume available to outside
The heat transfer of radiator be necessary.
Other than heat and the shortcomings that mechanical performance, phosphate glass seems to be also not suitable for as material of main part, because it
Also have hygroscopicity and water solubility.In addition, they are frangible and easily scrape, and soft surface.
It is surprising that it has been found that very small ruler can be achieved in the case where phosphate glass is as material of main part
Very little laser bar, and even if be also required to reduce the size of laser bar as much as possible in a particular application for calorifics reason.?
In the case where cylindrical laser stick, diameter is smaller than 6mm, preferably smaller than 5mm, particularly preferably less than 4mm, is less than 3mm, is even small
In 2mm.The laser bar that diameter is, for example, 1.5,1.2,1.0 or 0.9mm can be even produced by phosphate glass.Particularly,
Phosphorus glass LG960, LG950 and LG940 doped with laser active material can be used thus.Certainly, the above-mentioned size of laser bar
It is also applied for other similar geometry, such as the laser bar with polygonal crosssection.
Since the surface of phosphate glass, especially phosphate glass component parts is very sensitive to water and lesser
Component has biggish surface relative to total volume, it is therefore assumed that very small phosphate glass laser bar is unpractical.It enables
People surprisingly it has been found that, he is sealed by being quick installed at corresponding shell with seldom operational process and less additional separate part
In dress, the production and preservation of the quality of laser bar are possible.Light can be advantageously improved in the laser bar with the size
The aperture of beam characteristic must have the specific the smallest geometric accuracy about shape, cross sectional dimensions and positioning at this time.Such as
It works then by chamfering or groove advantageously, chamfering or groove size and position precision in the stick of the size in fruit aperture
At least 0.1mm, preferably at least 0.05mm, particularly preferably at least 0.02mm, very particularly preferably at least 0.01mm.
It is unconspicuous to those skilled in the art to be, it can be assumed that even if in the very small size of feelings of laser bar
Also this soft, the water-soluble, hygroscopic materials by having polishing or even anti-reflection coating surface can be used under condition
Chamfering according to the present invention or groove are produced with necessary precision between the group of composition.
However, usually but with being not limited to above-mentioned preferred embodiment, laser active material may include ytterbium ion, erbium ion,
Neodymium ion, praseodymium ion, samarium ion, europium ion, gadolinium ion, terbium ion, dysprosium ion, holmium ion, thulium ion, cerium ion, chromium ion,
Cobalt ions, vanadium ion, nickel ion, molybdenum ion and/or titanium ion.
Solid based on erbium ion is particularly conducive to generate so-called " eye safety " laser medium.The laser medium for example with
In medical treatment and military field.Therefore, optical activity ion can be erbium ion (Er3+), for example it is embedded in phosphate glass,
And emit laser at about 1535 to 1550nm.Pumping can pass through ytterbium (Yb3+, diode pumping, with 950nm) or chromium
(Cr3+) and ytterbium (flashing light pumping, it is seen that light and near infrared spectrum) completion indirectly.
The concentration of ytterbium ion is preferably in 5x1020cm-3To 30x1020cm-3In the range of, the concentration of erbium ion exists
0.1x1020cm-3To 2x1020cm-3In the range of, the concentration range of chromium ion is 0.01x1020cm-3To 0.2x1020cm-3With/
Or the concentration range of neodymium ion is 0.1x1020cm-3To 10x1020cm-3。
Thus, for example ion concentration (dopant) is by setting of such as getting off:
Diode pumping: Yb3+:15*1020cm-3
Er3+:0.5*1020cm-3
Or: Yb3+:20*1020cm-3
Er3+:0.2*1020cm
Flashing light pumping: Yb3+:23*1020cm-3
Er3+:0.2*1020cm-3
Cr3+:0.05*1020cm-3。
In one embodiment of the invention, laser medium may include the coating of part reflection, which is applied
Onto light emergence face, especially in first end face.
Therefore, the coating of the part reflection on light emergence face may be used as the output coupling mirror of resonator.In this way,
Other than aperture diaphragm, another component for Optical Maser System can also be saved, so as to reduce cost and can be with
Convenient for assembling.
On the other hand, the coating (that is, close to 100% reflectivity) of high reflection can also be provided, end face, outer is applied to
On circumferential surface and/or at least one chamfering or groove (that is, in chamfering or groove surface).It is applied to opposite with light emergence face and sets
Laser medium face on the coating of high reflection be particularly useful as the end mirror of resonator.This is but also can be with saving member simultaneously
Therefore cost is saved.
Coating on laser medium can especially be applied by atom layer deposition process.Therefore it may further specify that, swash
Optical wand, particularly small laser bar are entirely encapsulated, wherein can provide the opening for pump light when necessary.
Laser medium preferably has at least one pumping smooth surface for being coupled into pump light.Laser bar can for example lead to
It crosses side or outer peripheral surface is pumped.In other words, at least one side of laser medium may be constructed such that pumping smooth surface.Herein
It can be stated that only from a direction, i.e., pumped from side, wherein opposite with pumping smooth surface and apply mirror on the side set
Picture can especially apply the coating of high reflection, pump light is reflected back inside stick.It may thereby be ensured that pump is more effective
Energy yields.
Herein it can be stated that from light emergence face to the transition part at least one side for being configured to pumping smooth surface only by one
A seamed edge is formed, and wherein transition angle is preferably 90 degree.In other words, may have depending on the geometry of laser and characteristic
Benefit, side that the chamfering or groove of limiting aperture are only attached to not pumped by it (or it is with light emergence face
Seamed edge), and pump side face does not have chamfering.Reversal concentration and energy density are directly maximum on this side, and therefore, it is desirable to abundant
Utilize the volume range of active laser medium.
Pumping smooth surface for example can also be formed only by the part face of side.Such as it can be in the mirror image coating for forming pumping smooth surface
Within, opening is set within the coating of especially high reflection.Such opening can for example be configured to channel opening.With it is opposite and set
Mirror image together, can improve pumping efficiency again.Furthermore it is possible to reduce the heating to other components of Optical Maser System.It is all
Side can also be equipped with such mirror image and only one channel opening can be opened for pumping.
Mirror image, i.e. coating may be, for example, multilayer dielectric system, or can also apply for the metal reflected in corresponding SPECTRAL REGION
Layer, such as the coating with gold, copper, silver or aluminium.
In an embodiment of the invention, the length that laser medium longitudinally has is at least 1 millimeter, preferably extremely
It is 5 millimeters and/or at most 1000 millimeters, preferably up to 500 millimeters few, according to preferably up to 50 millimeters of specific embodiment.Laser
The cross-sectional area perpendicular to the longitudinal axis that medium further preferably has is at least 0.25mm2And at most 10000mm2, preferably up to
1000mm2, according to specific embodiment preferably up to 100mm2。
Thus, for example can provide the laser bar of the most 100mm of diameter and length maximum 700mm.
The geometry of laser bar for example may is that
The square cross section that 20 millimeters of -1.5x 1.5x,
The rectangular cross section that 10 millimeters of -2x 5x,
-The circular cross section of 1.8x 25mm,
Wherein the stick is respectively provided at least one chamfering, which serves not only as aperture diaphragm and can be also used for dropping
The risk of low fracture.For example, pole can have rounded corners, which increase Resisting fractre intensity.Can also reduce seamed edge fracture,
Potentially even may scratch surface risk.
The laser bar of rotational symmetry as laser medium is obtained in following table 1 illustratively as modification 1 and 2
Embodiment, list preferably with particularly preferred size.Other preferred sizes are given with preferred size 1,2 and 3
Out.Two kinds of particularly preferred sizes of laser bar according to the present invention are indicated with title example 1 and example 2.According to these of table 1
The laser bar of rotational symmetry size 1,2 or 3 or preferably includes above-mentioned phosphate according to example 1 or 2 that is, according to modification 1 or 2
Glass, glass LG960, LG950 and the LG940 especially produced by SCHOTTAG.
Table 1: the preferred size of the laser bar of the cross section with rotational symmetry
For the laser bar of the cuboid as laser medium, illustratively provide in following table 2 as 1 He of modification
2 embodiment lists preferred and particularly preferred size.Other preferred sizes are given with preferred size 1,2 and 3
Out.Two kinds of particularly preferred sizes of laser bar according to the present invention are indicated with title example 1 and example 2.According to these of table 2
The laser bar of cuboid preferably comprises above-mentioned phosphate glass according to modification 1 or 2, size 1,2 or 3 or according to example 1 or 2
Glass, glass LG960, LG950 and the LG940 especially produced by SCHOTTAG.
Table 2: the preferred size of the laser bar of the geometry with cuboid
For the present invention, surface to volume ratio (" A/V ratio ") plays central role, because one side small size swashs
Optical medium be substantially be evaluated as it is advantageous because small size is relatively easily introduced into corresponding radiator and can be by
Volume pumped heat dissipation.However on the other hand, certain length is needed most preferably to swash using desired together with laser beam
Optical medium optical characteristics.
Therefore, the value of A/V ratio is at least 0.8, more preferably at least 1, especially preferably at least 2.Meanwhile A/V ratio should not be big
In 10, preferably no greater than 8, especially preferably no more than 7.Therefore, have phosphate glass as main body for according to the present invention
The laser medium of material, the surface-to-volume ratio of laser medium between 0.8 to 10, preferably between 1 to 8, particularly preferably
In range between 2 to 7.
In this small parts, the adjusting and alignment of additional aperture parts are very expensive therefore according to the present invention
It is very useful to have the effect of that the limiting unit of the light emergence face of at least one chamfering or groove has.
The invention further relates to one kind to have laser medium according to the present invention, for pump light to be introduced into laser medium
Pumping source and the resonator for multiple reflections photon laser aid, wherein the resonator includes especially anti-by part
The output coupling mirror that the coating penetrated is formed or the end mirror especially formed by the coating of high reflection.The coating of part or high reflection
The coating alternatively referred to as reflected.Herein it can be stated that limiting the chamfering or groove of the limiting unit of the light emergence face of laser medium,
That is, realize aperture chamfering or groove mirror image, non-mirror image or on two sides.
Finally, the present invention relates to a kind of methods for manufacturing laser medium, wherein
The laser medium with light emergence face and at least one seamed edge is provided, which is formed in light emergence face and laser
Transition part between the outer peripheral surface of medium, and
At least one seamed edge is chamfered, especially by grinding, polishing and/or milling seamed edge.
Term " chamfering " is interpreted as particularly relating to process seamed edge in this way, that is, forms two seamed edges, therefore, no
It should exclude placement medium altitude groove or radius etc..Such chamfering can for example be realized manually or with CNC machine.Furthermore
More than two seamed edge can be set, especially by folding or groove etc..
In the case where very small and soft component according to the present invention, grinding or polishing process can be used, due to
Polishing particles material and size and be ground considerably lessly, and only very slowly remove material.In general, the throwing of ceria
Light particle is used for polished glass, because they connect well with glass, to realize high removal rate.When setting chamfering or
This is undesirable when groove.Therefore, for manufacture laser medium method for, polishing particles be more suitable for and laser material into
The weaker covalent bonding of row, such as Al2O3、SiO2Or diamond.In order to obtain good precision, chamfering or groove through being ground
Surface roughness and polishing particles cannot be too big.Advantageously this quality or higher for corresponding to Grit 400.It can be with to this
Particle processing unbonded particle (" slurries ") or combined.Advantageously, moreover very small amount of material is being removed by the technique
Purport is not removed in the material in size or the center of location specification when material.But so many material is only removed so that close
Tolerance limit process and is more likely to success when can remove other materials if necessary in this way.When in this material
Expect that the component is no longer complies with requirement, because cannot add any material later in removal process when being lower than lower variation of tolerance.This
Outside, it is advantageous to the chamfer dimesion to be worked in the successive ignition for removing and measuring feedback loop particularly with extremely narrow specification into
Row work.Chamfering or groove size can be measured with measuring microscope.Diameter having less than 2mm can be set in this way
The laser bar of chamfering, dimensional accuracy is less than 10 microns or even these laser bars are made of soft water sensitivity phosphate glass
Or including this phosphate glass.
In a specific embodiment, the laser bar with rectangular cross section passes through side by optically pumping.Due to pumping
It is to be carried out by absorbing, therefore the intensity of pump light exponentially reduces with away from the distance for passing through its surface pumped.
Highest energy density directly obtains on corresponding side.In this case, it is cut through down by the chamfering on seamed edge
The laser beam at angle is unfavorable, the chamfering and the injection of pump face formation laser or incidence surface.In order to form hole in an advantageous manner
Diameter, chamfering be arranged in laser project or the other three seamed edge of incidence surface in one it is upper and pump the holding of the seamed edge on face
There is no chamfering.
In similar embodiment and for a similar reason, the aperture of the circle or rectangle that are limited by chamfering can
It is arranged to side that is asymmetrical, and being pumped closer to laser bar by its.
Detailed description of the invention
Below according to attached drawing detailed description of the present invention embodiment, wherein consistent appended drawing reference corresponds to identical or phase
As element.Wherein:
Fig. 1 a-1b shows the laser aid with laser bar, pumping source resonator,
Fig. 2 a-2c is shown with the square laser stick for being arranged in intermediate rectangular aperture and 45 degree of chamferings,
Fig. 3 a-3c is shown with the square laser stick for being arranged in intermediate rectangular aperture and different angle chamfering,
Fig. 4 a-4c is shown with the square laser stick for being arranged in intermediate circular aperture and taper chamfering, wherein laser
Stick is identical with the axis of symmetry of chamfering,
Fig. 5 a-5c is shown with the square laser stick relative to the intermediate bit circular aperture arranged and taper chamfering,
Wherein, laser bar is parallel with the axis of symmetry of chamfering,
Fig. 6 a-6c shows the square laser stick with oval aperture and taper chamfering, wherein laser bar and chamfering
The axis of symmetry inclines towards each other extension,
Fig. 7a-7c is shown with the square laser stick for being arranged in intermediate oval aperture and 45 degree of chamferings,
Fig. 8 a-8b shows with the circular aperture for being arranged in centre and is configured to the rectangular sharp of the groove (ladder) folded
Optical wand, wherein laser bar is identical with the axis of symmetry of ladder,
Fig. 9 a-9b is shown with the round laser bar for being arranged in intermediate circular aperture and cascade groove (folding),
Wherein laser bar is identical with the axis of symmetry of folding,
Figure 10 a-10b shows the round laser with the non-circular aperture being centrally arranged and cascade groove (folding)
The axis of symmetry of stick, medium rod and folding is parallel,
Figure 11 a-11c is shown with the round laser for being arranged in intermediate circular aperture and cascade groove (folding)
The axis of symmetry of stick, medium rod and folding is identical, and wherein, is extraly equipped with safety at the seamed edge of adjacent outer peripheral surface and falls
Angle,
Figure 12 a-12b is shown with the round laser for being arranged in intermediate circular aperture and cascade groove (folding)
The axis of symmetry of stick, medium rod and folding is identical, and wherein all seamed edges are extraly equipped with and are configured to the safety of radius and fall
Angle,
Figure 13 a-13b is shown with the round laser bar for being arranged in intermediate octagon aperture,
Figure 14 a-14b is shown to be swashed with the circle for being arranged in intermediate circular aperture and slit-like recesses (circular recess)
The axis of symmetry of optical wand, medium rod and recess portion is identical,
Figure 15 a-15b is shown to be swashed with the circle for being arranged in intermediate circular aperture and slit-like recesses (circular recess)
The axis of symmetry of optical wand, medium rod and recess portion is identical, and is provided with additional (not playing aperturing) safe chamfering,
Figure 16 a-16c shows the length of the chamfering on three with rectangular aperture and in four sides of light emergence face
Cube shape laser bar, so that it abuts directly against one of side,
Figure 17 a-17c shows the length of the chamfering on three with rectangular aperture and in four sides of light emergence face
Cube shape laser bar, so that it abuts directly against one of side, and wherein the side is to pump smooth surface and other side
Face is reflected,
Figure 18 a-18b is shown with the laser bar relative to the intermediate bit circular aperture arranged and taper chamfering,
Medium rod is parallel with the axis of symmetry of chamfering and aperture is mobile towards longitudinal seamed edge (seamed edge for being parallel to the longitudinal axis of laser medium),
And in the longitudinal direction seamed edge upthrow optical pumping light incident surface, and four sides are coated with the reflecting layer for reflected pump light,
Figure 19 a-19b shows the square laser stick with the chamfering for being placed on intermediate rectangular aperture and different angle,
Wherein, the other side of side (partly) reflection and laser bar through chamfering of (a) laser bar is coated with anti-reflection coating, or
(b) side through chamfering of laser bar is coated with the other side (partly) reflection of anti-reflection coating and laser bar,
Figure 20 a-20c shows with the rectangular aperture for being placed on centre and has on the side that the opposite of laser bar is set
There are two the square laser sticks of chamfering pair, are directed to 45 degree of chamfering.
Specific embodiment
With reference to Fig. 1 a, laser aid 2 that is illustrative and significantly simplifying includes laser medium 10, has end mirror 12
With opposite and the resonator of output coupling mirror 14 set and the pump light source 16 for generating pump light 18.By pump light 18
Population inversion (Besetzungsinversion) can be generated in laser medium 10.
In the case where multiple Optical Maser Systems, there are other elements within cavity, such as in pulsed laser system
In saturable absorbent as Q-switch (Q-Switch) (such as being made of cobalt spinel).
In the same example obviously simplified shown in Fig. 1 b, laser medium 10 is equipped with coating 15, and floating coat 15 is portion
Divide the coating of reflection, to enable light decoupling.The coating and end mirror 12 of part reflection are used as resonator.Such as technical staff
Know, the mode that may be reversed makes the coating of high reflection be used as resonator together with end mirror.
With reference to two examples of Fig. 1 a and Fig. 1 b, the laser active material in laser medium is passed through by induced emission photon
Material and by the multiple reflections of photon in resonator zlasing mode 22 along optical axial starting of oscillation.
In the illustrated example, laser medium 10 has chamfering 21.Chamfering 21 such as (as shown) can prevent zlasing mode
In being formed with being positioned parallel to optical axial where chamfering 21.On the other hand, chamfering 21 can influence the mould in laser medium 10
Formula distribution and/or energy density, targetedly influence their (being not shown herein) especially on laterally or diagonally direction.
Chamfering 21 is also especially used as aperture diaphragm, so that realizing the sky of laser especially in the plane perpendicular to optical axial
Between select.Therefore, chamfering 21 limits the light emergence face 20 for being used as aperture, and photon can leave laser medium by aperture.Therefore it produces
It is raw to pass through the molding laser beam 24 of chamfering 21.
The various exemplary that the laser medium at least one chamfering or groove is described in Fig. 2 a to Figure 20 c is implemented
Mode.The embodiment shown should not be construed as exhausted.
Fig. 2 a-2c shows the side view (Fig. 2 a), top view (Fig. 2 b) and court for being configured to the laser medium 10 of laser bar
To the main view (Fig. 2 c) of light emergence face 20.
Laser medium 10 have rectangle, herein be rectangular cross section, as Fig. 2 c is visible.Light emergence face 20 comprehensively leads to
Chamfering 21,23,25,27 is crossed to limit, chamfering is used as aperture diaphragm together.
Chamfering is respectively formed to the transition part of the outer peripheral surface 50 of laser medium.Chamfering 27 is formed to the side of outer peripheral surface 50 32
Transition part, and chamfering 25 formed to the side of outer peripheral surface 50 30 transition part, it is such as visible in the side view of Fig. 2 a.It is similar
Ground, chamfering 23 is formed to the transition part of the side of outer peripheral surface 50 42, and chamfering 21 is formed to the mistake of the side of outer peripheral surface 50 40
Portion is crossed, it is such as visible in the top view of Fig. 2 b.
In the illustrated example, the light emergence face 20 as aperture is configured to rectangle, and wherein width B and height H have
Different length.Therefore, laser medium 10 is that rectangular cross section is different from light emergence face on geometry herein.
Light emergence face 20 is medially arranged about the longitudinal axis of laser medium 10 in this example.In other words, light emission goes out
The midpoint in face 20 is on optical axial.Or in other words without the lateral shift of light emergence face 20.
Angle between light emergence face 20 and fillet surface 21,23,25,27 can be identical, especially obtuse angle, be respectively herein
135 degree.The supplementary angle at 180 degree complementary with 135 degree is 45 degree, therefore also referred to as with 45 degree of chamfering.Fillet surface 21,23,
25,27 angle between adjacent side 40,42,30,32 is all 135 degree equal of angle herein.
With reference to Fig. 3 a-3c, as in Fig. 2 a-2c, between fillet surface and light emergence face and in fillet surface and periphery
Between face institute it is angled be all obtuse angle.Laser bar has square cross section and rectangular aperture placed in the middle again.
But relative to the example in Fig. 2 a-2c, angle between light emergence face 20 and fillet surface 21,23,25,27 not phase
Together.Angle between fillet surface 21,23,25,27 and outer peripheral surface 50 is not also identical.Therefore chamfering has different inclination angles.
Usually, it is not limited to the example, one or more chamferings there can be different angles in different directions.Due to herein not
Same angle (laser medium 10 relative to Fig. 2 a-2c), chamfering of the laser medium 10 on the direction of its longitudinal axis and restriction light
The chamfering 21,23,25,27 of outgoing plane is identical.
With reference to Fig. 4 a to Fig. 7 c, the laser medium with non-circular cross sections (for example, with rectangular or square cross section)
It can such as light emergence face 20 (aperture) with round or ellipse.The part of conical surface can for example be passed through to this fillet surface
Face describes.This is also referred to as taper chamfering.
Fig. 4 a-4c shows the side view (Fig. 4 a), perspective view (Fig. 4 b) and court for being configured to the laser medium 10 of laser bar
To the main view (Fig. 4 c) of light emergence face 20.
Laser bar have polygon, herein rectangular cross section and circle, round light emergence face 20 herein.At this
Light emergence face 20 is placed in the middle about the axis of symmetry of stick in example.
Chamfering 21 can be described as taper chamfering, in this example alternatively referred to as conical chamfering because fillet surface can by
Surface in standard cones is described.The axis of symmetry of circular cone is identical as the longitudinal axis of laser medium 10 herein.In other words,
The axis of symmetry of chamfering or fillet surface is identical as the axis of symmetry of stick.
The angular aperture of cone is 90 degree herein.Thus 45 degree of chamfering is generated.Usual cone can have almost any open
Bicker, the angular aperture is for obtaining desired chamfer angle.
In the example of Fig. 4 a-4c, the diameter (aperture) of light emergence face is about the 80% of lateral edges.It is not limited to the example,
Light emergence face can especially have between 10% to the 99% of the cross section perpendicular to its longitudinal axis of laser medium 10, preferably exist
Between 20% to 95%, particularly preferably between 30% to 90%.
With reference to Fig. 5 a-5c, the axis of symmetry (longitudinal axis of the axis of symmetry of the description fillet surface 21 of (circle) cone relative to stick
Line) offset, but it is for example in parallel.In other words, the axis of symmetry of chamfering can be transverse to stick about the optical axial of stick
Longitudinal axis a direction or both direction on it is identical or differently mobile, so that light emergence face 20 (aperture) is not placed in the middle
's.
For the embodiment it is of particular importance that not all side 30,40,32,42 all equably will with pump light
Energy is pumped into laser medium, and center of the laser beam due to energy density distribution without being formed in laser bar.Scheming
Therefore the asymmetric moulding of laser medium 10 shown in 5a-5c can match the asymmetric energy density in laser medium.For
This matched parameter can also be for example modified by computer simulation.
With reference to Fig. 6 a-6c, longitudinal axis of the axis of symmetry of (circle) cone of fillet surface 21 relative to laser medium 10 is described
Inclination extends.Therefore, it especially can get the light emergence face 20 of ellipse according to the principle of taper profile.This is especially in light emergence face
20 perpendicular to stick longitudinal axis when be such case.
In other words, the axis of symmetry of taper chamfering has the angle being not zero relative to the optical axial of laser medium 10
Degree.
The asymmetric geometry due to stick can be compensated in a particularly advantageous manner by oval aperture (light emergence face 20)
The notch of structure (such as rectangle) or the rotational symmetry as caused by pumping.
Fig. 7a-7c shows the side view (Fig. 7 a), top view (Fig. 7 b) and court for being configured to the laser medium 10 of laser bar
To the main view (Fig. 7 c) of light emergence face 20.Laser medium has in all identical situation of chamfer angle (at this 45 degree) of surrounding
There is elliptical light emergence face 20.
Therefore when chamfering has equal angular always, the aperture of ellipse can also be realized at this time.Therefore fillet surface can also
There are two the axis of symmetry for tool.
In addition, chamfering can have different angles in different directions, especially in the elliptical cone of description fillet surface.
The cone section of the first end face with laser medium 10 realizes ellipse at this time, corresponds to light emergence face 20.
In addition the case where optical axial that this axis of symmetry for being also applied for cone is parallel to stick extends.
With reference to Fig. 8 a to Figure 12 b, laser medium 10 can have the groove 21 ' of at least one edge side, in other words, be rank
Ladder folds.Equally as chamfering, groove 21 ' can prevent from being formed in parallel with swashing for optical axial in the region of groove 21 '
Optical mode.Therefore groove 21 ' (and chamfering) defines the limiting unit in aperture, that is, is especially used as aperture diaphragm.
Fig. 8 a to Figure 12 b respectively illustrates side view (Fig. 8 a to 12a) and court for being configured to the laser medium 10 of laser bar
To the main view (Fig. 8 b to Figure 12 b) of light emergence face 20.Laser bar shown in Fig. 8 has a rectangular cross section, and Fig. 9 a extremely
Laser bar shown in Figure 12 b has the cross section of circle, more accurate positive round.
With reference to Figure 11 a-11b and Figure 12 a-12b, especially in limiting the groove 21 ' for the limiting unit of light emergence face 20
It could dictate that, make one or more edge chamferings of groove, that is, be equipped with chamfering 26, wherein the term of chamfering should not also exclude rounding
Or medium altitude groove etc..Chamfering 26 especially may be configured to safe chamfering, that is, improve breaking strength of the laser bar at corresponding seamed edge.
In other words, chamfering 26 can be set at a seamed edge, especially at a seamed edge of groove 21 ', to improve the disconnected of laser medium
Resistance to spalling.
With reference to Figure 11 a-11b, this chamfering 26 for being configured to safe chamfering is not necessarily to carry out for the limiting unit of light emergence face
It limits.But safe chamfering can also play aperturing: for example limit the limitation of light emergence face 20 by a dotted line in Figure 12 a-12b
Portion.Safe chamfering can also furthermore be applied in mode distribution.
The laser medium 10 shown in Figure 13 a-13b has the light emergence face 20 of polygon, has comprehensive limitation
Portion, limiting unit are limited by multiple chamferings 21 of adjacent light emergence face 20.Comprehensive limiting unit, the i.e. closure of light emergence face 20
Edge includes multiple straight limiting units, is herein eight edge sections, so that light emergence face 20 is configured to octagon.
With reference to Figure 14 a-14b and Figure 15 a-15b, the limiting unit of light emergence face 20, which can also pass through groove 21, " limits, does not have
Adjacent light emergence face.In this example, groove 21 " also referred to as circular recess portion.Groove 21 is " usually relative to the light of laser medium
It learns axis or tangentially or is extended transversely with relative to longitudinal axis.Groove 21 " position along optical axial arranged so that
In the groove 21 for being parallel to optical axial " region in inhibit zlasing mode formation.Therefore groove 21 " is used as aperture, that is, will
Aperture is limited on light emergence face 20.
Therefore in this case, light emergence face 20 is limited not over seamed edge.But the end face of laser medium includes light
Outgoing plane 20 is used as part face.In other words, light emergence face 20 is flatly transitioned into the dead point region 20 ' of the end face of laser medium
In.
In addition, with reference to the settable chamfering 26 for being configured to safe chamfering of Figure 15 a-15b.Safe chamfering point in this case
Not Wei Yu laser bar end face dead point region 20 ' in, and be therefore not used as aperture.
Figure 16 a-16c and Figure 17 a-17c respectively illustrate side view (Figure 16 a for being configured to the laser medium 10 of laser bar
With Figure 17 a), top view (Figure 16 b and Figure 17 b) and towards the main view (Figure 16 c and Figure 17 c) of light emergence face 20.
With reference to Figure 16 a-16c, side 30 only can be transitioned into light emergence face 20 via a seamed edge.In other words, which exists
Chamfering or groove are not provided between side 30 and light emergence face 20.
Therefore it usually could dictate that, the first limiting unit (being herein the straight edge section on right side) of light emergence face 20 is logical
The side 30 for crossing laser medium limits, that is, be not by laser medium or in, at such as side 30 or in chamfering or recessed
Slot limits.
Preferably, meanwhile, at least one of limiting unit of light emergence face 20 or other limiting units pass through chamfering (herein
For chamfering 21,23,27) or groove limits (being herein top, left side and lower part edge section), other limiting units with
First limiting unit together defines the comprehensive limiting unit of light emergence face 20.
Therefore, the side 32 that side 30 is set than opposite is bigger.This is advantageous particularly with pump light is introduced.Therefore,
Side 30 is preferably configured as pumping smooth surface or including pumping smooth surface.
In addition, being configured to the chamfering 26 of safe chamfering can be arranged along the longitudinal axis of laser medium, it is strong to improve fracture
Degree.Therefore the outer peripheral surface of laser medium 10 includes the side 30 for being used as pumping smooth surface, side 32,40,42 in addition and falls herein
Angle 26.
Furthermore it could dictate that, laser medium is mirror-symmetrical about the plane perpendicular to longitudinal axis.Particularly, what is shown swashs
Optical medium 10 is respectively provided with light emergence face 20 or 20b two end sides, wherein (the i.e. restriction light emission of aperturing has been respectively set
The chamfering for the limiting unit appeared) chamfering 21,23,27 or 21b, 23b, 27b.
Figure 17 a-17c shows the laser medium 10 in Figure 16 a-16c, wherein other than pumping smooth surface outer peripheral surface 50 to
It is configured with mirror surface (Verspiegelung) 60 less.Therefore pump light 18 can be coupled into laser from pump light source 16 via side 30
In medium 10.As previously mentioned, improving the efficiency of pumping by mirror surface.
Figure 18 a-18b shows the side view (Figure 18 a) for being configured to the laser medium 10 of laser bar and towards light emergence face
20 main view (Figure 18 b), wherein laser medium 10 has the chamfering 21 (being similar to Fig. 5 a-5c) of taper.Outer peripheral surface 50 in addition to
It is equipped with mirror surface 60 other than pumping smooth surface, wherein mirror surface 60 is not shown in Figure 18 a in order to clear.
It could dictate that herein about manufacture, mirror surface 60 be applied to first at least part of laser medium 10, be for example outer
In at least part of circumferential surface 50, pumping smooth surface is then generated, that is, all portions of a part of mirror surface, especially laser medium 10
Divide and is removed again.Furthermore it could dictate that, at least one chamfering generated after applying mirror surface 60, is herein taper chamfering 21.
Pumping smooth surface for example generates and longitudinal seamed edge of the laser medium 10 to mirror surface carries out chamfering herein.
Therefore be configured to the laser medium 10 of laser bar herein and have pentagonal cross section and five sides 30,31,32,
40,42, wherein side 31 is configured to pumping smooth surface.
Light emergence face 20 as herein can lateral shift so that compared to one or other circumferential surface of laser medium 10, light emission
Appear 20 closer to pumping smooth surface arrangement.This can be advantageous, because energy density is generally up near pumping smooth surface.
Figure 19 a and Figure 19 b respectively illustrate the side view (left side) for being configured to the laser medium 10 of laser bar and towards light emissions
Appear 20 main view (right side).
Laser bar shown in Figure 19 a has the coating 15 ' of reflection on its end side through chamfering, wherein the coating reflected can
It is configured to the coating of part reflection or high reflection.In other words, the end side through chamfering of laser bar is by partial mirror processing or mirror
Surface treatment.When coating 15 ' is the coating of part reflection, usually the end face on the end side through chamfering of laser bar is configured to
Light emergence face.The end face opposite with the end side through chamfering and setting of laser bar has anti-reflection coating 13.
On the contrary, the laser bar shown in Figure 19 b has anti-reflection coating 13 on its end side through chamfering and opposite
And the coating (Beschichtung) 15 ' with (part) reflection on the end face set.In the coating that coating 15 ' is part reflection
When, end face that is opposite with the end side of chamfering and setting generally includes light emergence face (as part face).
In other words, have by mirror surface treatment or partial mirror processing end face (and non-coating or it is for example anti-
Reflectance coating opposite and the end face set) laser bar in, at least one chamfering (or groove) can be located at an end of laser bar
On side and another side.
Especially chamfering (or groove) can also be disposed simultaneously on two end sides with reference to Figure 20 a-20c, so that light emergence face 20
Limiting unit limited jointly by the chamfering (or groove) for the chamfering (or groove) being placed on two end sides.Show what is shown
In example, chamfering 21,23 is located on end side and chamfering 25,27 is located in another side, two of them chamfering to relative to
90 degree of ground mutually rotating arrangement.
The laser bar shown in embodiment in the case where cylindrical geometry, such as Fig. 9 a-9b, 10a-10b,
Shown in 11a-11c, 12a-12b or 13a-13b, the cylinder height of body diameter and 60mm with 4mm.It as described above can also
Generate the cylindrical laser stick that may be significantly smaller, for example, with body diameter be only 1mm, even only 0.7mm and cylinder
Height is 10mm, even only 5mm.
In cuboid laser bar as laser medium, such as in Fig. 2 a-2c, 3a-3c, 4a-4c or 5a-5c, 6a-6c, 7a-
In the case of shown in 7c or 8a-8b, the rectangular body length that laser bar has is 30mm, cuboid width is 5mm and rectangular
Body height is 5mm.The cuboid laser bar that can also be may be significantly smaller as described above is possible, for example, with cuboid it is long
Degree is 4mm, cuboid width is 2mm and cuboid height is 1mm or rectangular body length is 3mm, cuboid width is 0.7mm
And cuboid height is 0.7mm.A/V ratio is between 0.8 and 10, preferably between 1 and 8, particularly preferably between 2 and 7
Range in.
The typically larger than described embodiment can also be possible.Thus the length of such as laser medium can up to 250mm or
It is bigger, and the length can also be up to about 500mm in other implementations.Furthermore the cross section of laser medium and/or preceding
Side length can be greater than it is aforementioned, such as until 25.4mm or more, in other embodiments until 50mm.
But it is of particular importance that manufacture has the laser medium of the laser bar based on phosphate glass, with above-mentioned
The smaller size referred to.
Claims (22)
1. the laser medium for generating laser, wherein the laser medium is configured to solid, and wherein, the laser is situated between
Matter includes light emergence face, and the laser described in laser operation is projected from the laser medium by the light emergence face,
Described in light emergence face there is limiting unit, the limiting unit limited by least one chamfering or groove.
2. laser medium according to claim 1, wherein the surface area of the laser medium and the ratio of volume 0.8 to
In range between 10, preferably between 1 to 8, particularly preferably between 2 to 7.
3. laser medium according to any one of the preceding claims, wherein the light emergence face all has in all sides
Limiting unit, the limiting unit are limited by least one chamfering or groove.
4. laser medium according to any one of the preceding claims, wherein the light emergence face in laser operation
As aperture, and at least one described chamfering or groove are used as aperture diaphragm, to form specific beam profile.
5. laser medium according to any one of the preceding claims, wherein laser operation when described at least one
Chamfering or groove are used for the Effect Mode distribution in a limiting fashion during laser operation, to generate the particular beam of laser
Characteristic and/or the beam quality for improving laser.
6. laser medium according to any one of the preceding claims, wherein the laser medium has longitudinal axis, outstanding
It is configured with swashing for first end face including light emergence face, and the second end face set opposite with first end face and outer peripheral surface
Optical wand.
7. laser medium according to claim 6, it is characterised in that kept in most of length of the laser medium
Constant, particularly polygon, preferably rectangular or round, preferably round cross section, perpendicular to the vertical of the laser medium
Axis.
8. laser medium according to any one of the preceding claims, wherein with the longitudinal axis perpendicular to the laser medium
The cross section of line is compared, and the light emergence face is smaller, horizontally offset, not identical and/or especially in geometrical aspects
There is different, particularly lesser amount of corner in the case of non-circular cross-section.
9. laser medium according to any one of the preceding claims, wherein the light emergence face is circle and has
Limiting unit, the limiting unit are limited by circular chamfering or groove.
10. laser medium according to any one of claim 1 to 7, wherein the light emergence face is polygon, special
It is not rectangle, and there is the limiting unit limited by multiple, particularly three or four chamferings or groove.
11. laser medium according to any one of claim 1 to 8, wherein the light emergence face is circular or ellipse
Shape, and limited by the chamfering of taper, especially limited by this method, so that the chamfering is obtained by the surface in cone
With description, the axis of the cone extends parallel or inclinedly about the longitudinal axis of the laser medium.
12. laser medium according to any one of the preceding claims, wherein the light emergence face is flat, and
Longitudinal axis especially perpendicular to the laser medium and/or the second end face for being parallel to the laser bar extend.
13. laser medium according to any one of the preceding claims, wherein the light emergence face is in geometrical aspects
It is dissimilar with the cross section of the longitudinal axis perpendicular to the laser medium.
14. laser medium according to any one of the preceding claims, which includes material of main part and is embedded in it
In laser active material be used for stimulated emission photon, wherein the material of main part includes glass or crystal.
15. laser medium according to any one of the preceding claims, wherein the material of main part is selected from phosphate glass
Glass comprising the phosphate glass with entitled LG960, LG950 and LG940.
16. laser medium according to any one of the preceding claims, wherein the laser active material include ytterbium from
Son, erbium ion, neodymium ion, praseodymium ion, samarium ion, europium ion, gadolinium ion, terbium ion, dysprosium ion, holmium ion, thulium ion, cerium from
Son, chromium ion, cobalt ions, vanadium ion, nickel ion, molybdenum ion and/or titanium ion.
17. laser medium according to claim 16, wherein the concentration of the ytterbium ion is in 5x1020cm-3Extremely
30x1020cm-3In the range of, the concentration of the erbium ion is in 0.1x1020cm-3To 2x1020cm-3In the range of, the chromium ion
Concentration range be 0x1020cm-3To 0.2x1020cm-3And/or the concentration range of the neodymium ion is 0.1x1020cm-3Extremely
10x1020cm-3。
18. laser medium according to any one of the preceding claims, which includes the coating of part reflection, should
Coating is applied on the light emergence face, in the especially described first end face.
19. laser medium according to any one of the preceding claims, which includes the coating of high reflection, the painting
Layer is applied in the second end face, on the outer peripheral surface and/or at least one described chamfering or groove.
20. laser medium according to any one of the preceding claims, wherein the laser medium has longitudinally
Length be at least 1 millimeter, preferably at least 5 millimeters, and/or at most 1000 millimeters, preferably up to 500 millimeters, according to specific reality
It applies preferably up to 50 millimeters of mode and/or the cross-sectional area perpendicular to longitudinal axis that the laser medium has is at least
0.25mm2And at most 10000mm2, preferably up to 1000mm2, according to specific embodiment preferably up to 100mm2。
21. there is laser medium according to any one of the preceding claims, for pump light to be introduced into the laser
The laser aid of pumping source in medium and the resonator for multiple reflections photon, wherein the resonator includes especially logical
Cross the output coupling mirror of the coating formation of part reflection or the end mirror of the coating formation particularly by high reflection.
22. it is used to manufacture laser medium, in particular according to the method for laser medium described in any one of claims 1 to 16, it should
Method has follow steps:
There is provided have light emergence face and at least one seamed edge laser medium, the seamed edge formed the light emergence face with it is described
Transition part between the outer peripheral surface of laser medium,
Make at least one described edge chamfering particularly by seamed edge described in grinding, polishing and/or milling.
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DE102017101004.1A DE102017101004A1 (en) | 2017-01-19 | 2017-01-19 | Laser medium for solid-state lasers |
PCT/EP2018/051300 WO2018134350A1 (en) | 2017-01-19 | 2018-01-19 | Laser medium for a solid-state laser |
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EP (1) | EP3571745A1 (en) |
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US20190341735A1 (en) | 2019-11-07 |
DE102017101004A1 (en) | 2018-07-19 |
RU2019125744A3 (en) | 2021-04-27 |
WO2018134350A1 (en) | 2018-07-26 |
RU2761418C2 (en) | 2021-12-08 |
RU2019125744A (en) | 2021-02-19 |
EP3571745A1 (en) | 2019-11-27 |
IL268027B2 (en) | 2023-11-01 |
IL268027B1 (en) | 2023-07-01 |
IL268027A (en) | 2019-09-26 |
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