CN110247193A - A kind of flexible gradual change resistive film, preparation method and application - Google Patents
A kind of flexible gradual change resistive film, preparation method and application Download PDFInfo
- Publication number
- CN110247193A CN110247193A CN201910393845.4A CN201910393845A CN110247193A CN 110247193 A CN110247193 A CN 110247193A CN 201910393845 A CN201910393845 A CN 201910393845A CN 110247193 A CN110247193 A CN 110247193A
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- copper
- film
- gradual change
- flexible
- resistive film
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/003—Apparatus or processes specially adapted for manufacturing resistors using lithography, e.g. photolithography
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
- H01Q15/006—Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
- H01Q15/006—Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces
- H01Q15/0066—Selective devices having photonic band gap materials or materials of which the material properties are frequency dependent, e.g. perforated substrates, high-impedance surfaces said selective devices being reconfigurable, tunable or controllable, e.g. using switches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
- H01Q17/007—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems with means for controlling the absorption
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0086—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
Abstract
The invention belongs to flexible gradual change resistive film absorbing material fields, more particularly, to a kind of flexible gradual change resistive film, preparation method and application.The gradual change resistance film figure of setting is imprinted on light-sensitive surface, is then covered on flexible copper-clad plate, is successively exposed and develops；Flexible copper-clad plate after development is performed etching；To the surface coating slurry shape resistive film of the flexible copper-clad plate after etching, sintering solidifies the pulp-like resistive film；Then sintered flexible copper-clad plate is demoulded, sloughs light-sensitive surface and the resistive film on its surface, manifest the copper surface of the pattern of the gradual change resistive film of setting；Partial etching is carried out to the copper surface of the pattern for the gradual change resistive film for manifesting setting, remove the copper surface in part, the part for removing copper surface manifests copper-clad plate substrate surface, it does not etch and removes the part on copper surface and still show as copper surface, remaining region surface is resistive film, so obtains complete flexible gradual change resistive film.
Description
Technical field
The invention belongs to flexible gradual change resistive film absorbing material field, more particularly, to a kind of flexible gradual change resistive film,
Preparation method and application.
Background technique
Gradual change resistive film is a kind of unit size and period spacing with the array structure that position is in that functional relation changes, to entering
Radio magnetic wave has the function of reflection, absorbs or penetrate.Similar to frequency-selective surfaces (FSS:Frequency Selective
Surface)。
Gradual change resistive film can obtain the change of gradient of impedance operator by gradually changing the geometries of sequential cells,
Realize the smooth transition by metal impedance to free space impedance, thus reduce due to impedance discontinuity bring reflection problems,
It can be effectively reduced radar cross section.
Gradual change resistance film figure is made by processing copper-clad plate (FR4, polytetrafluoroethylene (PTFE) etc.).It is more when practical application
Applied to ENVIRONMENTS WITH CURVED SURFACES, the production of current gradual change resistive film flexible is only limitted to small area, is mainly used in ultra-wideband antenna and sets
On meter, for improving the beamwidth of antenna, side lobe radiation is reduced.
Therefore the production of flexible gradual change resistive film is most important, the especially preparation of large area flexible resistive film TPS.
Existing flexible gradual change resistive film generallys use silk-screen printing, EFI prints, coating method is prepared, and is prepared into
To resistive film in only only used a kind of material.The defects of specimen material is single, undersized is prepared, resistive film is limited
Using.
The preparation of conventional patch technology inhales wave covering and be easy to cause a large amount of folds, seam, leads to the curved profile of application structure
Period continuity be destroyed, increase the radar cross section of application structure, deteriorate the stealth effect of application structure.
Summary of the invention
Aiming at the above defects or improvement requirements of the prior art, the present invention provides a kind of flexible gradual change resistive films, its system
Preparation Method and application, it is flexible gradually by the production method and the preparation of improved method for printing screen that organically combine printed circuit board
Become resistive film, overcomes conventional patch technology and prepare fold and seam problems caused by sample, while solving legacy frequencies choosing
Select the problem of surface is difficult to realize impedance transition mechanism.
To achieve the above object, according to one aspect of the present invention, a kind of preparation side of flexible gradual change resistive film is provided
Method includes the following steps:
S1: the gradual change resistance film figure of setting is imprinted on light-sensitive surface, the light-sensitive surface for being printed on gradual change resistance film figure is obtained；
S2: the light-sensitive surface for being printed on gradual change resistance film figure being covered on flexible copper-clad plate, is successively exposed and develops,
Flexible copper-clad version after being developed, wherein not manifesting copper surface by the developed removal of photosensitive diaphragm area of illumination；By light
According to region light-sensitive surface retain, manifest the pattern of gradual change resistive film；
S3: performing etching the flexible copper-clad plate after development, the flexible copper-clad plate after being etched；The etching is to remove
The copper on copper surface manifests the copper-clad plate substrate surface, while retaining the light-sensitive surface being covered in copper-clad plate, and this is photosensitive
The pattern of the gradual change resistive film of setting is presented in film；
S4: in the surface coating slurry shape resistive film of the flexible copper-clad plate of acquisition, sintering keeps the pulp-like resistive film solid
Change；Then sintered flexible copper-clad plate is demoulded, sloughs light-sensitive surface and the resistive film on its surface, manifests setting
The copper surface of the pattern of gradual change resistive film；
S5: partial etching is carried out to the copper surface of the pattern for the gradual change resistive film for manifesting setting, it is copper to remove part
Surface, the part for removing copper surface manifest copper-clad plate substrate surface, do not etch and remove the part on copper surface and still show as
Copper surface, remaining region surface are resistive film, are obtained comprising copper surface, copper-clad plate substrate surface and resistance film surface
Flexible gradual change resistive film.
Preferably, it after the flexible copper-clad plate after step S3 is etched, is further comprised the steps of: between step S4
The light-sensitive surface being covered in copper-clad plate is sloughed, it is primary to repeat step S1 and S2.
Preferably, light-sensitive surface described in step S1 is photosensitive blue film or photoresists.
Preferably, step S1 specifically:
S101: the gradual change resistance film figure of setting is printed upon on film, and the film is transparent, and can spray printing inking；
S102: the pattern on film is transferred on light-sensitive surface, obtains the light-sensitive surface for being printed on gradual change resistance film figure.
Preferably, film described in step S101 is film film.
Preferably, the substrate layer of the copper-clad plate is glass fiber reinforced epoxy resin or polyimide film.
Preferably, the substrate layer of the copper-clad plate with a thickness of 0.025mm~0.8mm.
Preferably, the etching is chemical etching method.
Other side according to the invention provides the flexible gradual change resistance that preparation method described in one kind is prepared
Film, the flexible gradual change resistance film surface include three kinds of unlike materials, i.e., copper surface, copper-clad plate substrate surface and resistive film
Surface.
Other side according to the invention provides the application of flexible gradual change resistive film described in one kind, is used to prepare
Electromagnetic wave absorption device.
Other side according to the invention, provides a kind of electromagnetic wave absorption device, and functional layer includes the flexibility
Gradual change resistive film.
In general, through the invention it is contemplated above technical scheme is compared with the prior art, can obtain down and show
Beneficial effect:
(1) flexible gradual change resistive film of the present invention the preparation method comprises the following steps: flexible gradual change resistance film figure is first printed upon film
On, then by transfer modes pattern is transferred on flexible copper-clad plate, flexible copper-clad plate is exposed, develop and is etched,
The copper part on gradual period surface is obtained, then by coating resistive film, sintering and partial etching, is obtained while comprising copper
Three kinds of surface, resistance film surface and copper-clad plate substrate surface gradual period surface flexible gradual change resistive films.Manufacturing process combines
The some processes of printed circuit board and silk-screen printing, technical maturity is easy to operate, can make soft applied to the large area of curved surface
Property gradual change resistive film, has been successfully prepared the flexible gradual change resistive film of 600mm × 600mm.
(2) after the present invention is in order to avoid exposing for the first time, developing and etch, since light-sensitive surface occurs in etching process
Warpage, falling off causes subsequent resistance film coating effect bad, and then influences the preparation of gradual change resistive film, the preferred embodiment of the present invention
In by the way that the coating, sintering and partial etching of resistive film are carried out after secondary or multiple exposure, development, etching again, had
The flexible gradual change resistive film on three kinds of gradual period surfaces.
(3) flexible gradual change resistive film provided by the invention includes three kinds of gradual period surfaces, respectively copper surface, resistance
Membrane material surface and copper-clad plate etching remove the later substrate surface of copper, and a variety of surfaces combine, and can more preferably realize and inhale wave knot
The impedance of structure is smoothly transitted into free space impedance, reduces and increases since bring radar cross section is truncated in edge impedance suddenly
The problem of.
(4) the gradual change resistive film that the present invention is prepared on flexible copper-clad plate due to being operated, flexible copper-clad plate tool
The gradual change resistive film of flexible substrate, acquisition has flexibility, can solve flexible resistor film in the application skill on curved face object surface
Art problem is suitble to the preparation of absorbent structure.
(5) flexible gradual change resistive film provided by the invention is used as to the function suction wave layer for inhaling wave apparatus, due to including three kinds
Gradual period surface, by design can be realized from function inhale wave layer to free space impedance seamlessly transit, be effectively improved by
Bring radar cross section lifting problem is truncated in impedance suddenly when no gradual change resistive film, and the radar scattering for reducing structure is cut
Its stealth effect is improved in face.
(6) present invention combines the manufacture craft of printed circuit board with silk-screen printing manufacture craft, proposes the present invention
A kind of flexible gradual change resistive film preparation method, but the combination of two kinds of manufacture crafts is not any simple superposition, but is being tied
The sequence of conjunction is all adjusted in the design and selection of independent processing step when combining.Such as directly not first silk-screen printing,
But first pass through the transfer of printed circuit board, exposure, development, etching are obtained containing covering copper comprising substrate surface and light-sensitive surface
Plate, then whole again to brush resistive film, sintering curing resistive film demoulds later, decline etching obtain containing copper surface,
The gradual change resistive film on three kinds of surfaces of substrate surface and resistive film, and etch for the first time the substrate surface appeared only brush resistive film with
The resistance film surface for becoming final flexible gradual change resistive film afterwards, slough light-sensitive surface just regain after partial etching again it is copper
Surface and substrate surface；Wherein in order to obtain a variety of surfaces, patterned gradual change resistive film, silk is used with traditional silk-screen printing
Wire mark version brushes resistance slurry technique difference, and the present invention directly brushes on the copper-clad plate entire surface surface Jing Guo particular procedure technique
Resistive film is applied, rather than patterning screen printing forme is used to brush, flexible gradual change resistive film of the present invention is prepared as printed circuit board
The combination of method and improved method for printing screen.
Detailed description of the invention
Fig. 1 is flexible gradual change resistance membrane preparation method process flow chart of the present invention；
Fig. 2 is the pattern schematic diagram of flexible gradual change resistive film made from the embodiment of the present invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.As long as in addition, technical characteristic involved in the various embodiments of the present invention described below
Not constituting a conflict with each other can be combined with each other.
A kind of preparation method of flexible gradual change resistive film provided by the invention, the system by the way of similar printed circuit board
It is standby, specifically comprise the following steps:
S1: the gradual change resistance film figure of setting is imprinted on light-sensitive surface, the light-sensitive surface for being printed on gradual change resistance film figure is obtained；
S2: the light-sensitive surface for being printed on gradual change resistance film figure being covered on flexible copper-clad plate, is successively exposed and develops,
Flexible copper-clad version after being developed, wherein copper surface is not manifested, by light by the developed removal of photosensitive diaphragm area of illumination
According to region light-sensitive surface retain, manifest the pattern of gradual change resistive film；
S3: performing etching the flexible copper-clad plate after development, the flexible copper-clad plate after being etched；The etching is to remove
The copper on copper surface manifests the copper-clad plate substrate surface, while retaining the light-sensitive surface being covered in copper-clad plate, and this is photosensitive
The pattern of the gradual change resistive film of setting is presented in film；
S4: to the surface coating slurry shape resistive film of the flexible copper-clad plate of acquisition, sintering keeps the pulp-like resistive film solid
Change；Then sintered flexible copper-clad plate is demoulded, sloughs light-sensitive surface and the resistive film on its surface, manifests setting
The copper surface of the pattern of gradual change resistive film；
S5: partial etching is carried out to the copper surface of the pattern for the gradual change resistive film for manifesting setting, it is copper to remove part
Surface, the part for removing copper surface manifest copper-clad plate substrate surface, do not etch and remove the part on copper surface and still show as
Copper surface, remaining region surface are resistive film, so obtain complete flexible gradual change resistive film.
After only carrying out single exposure, development and etching, during wet etching light-sensitive surface be likely to occur part warpage or
It falls off, in order to avoid the coating and preparation of this phenomena impair subsequent resistance film, in some preferred embodiments, step S3 is carved
After flexible copper-clad plate after erosion, further comprised the steps of: between step S4
The light-sensitive surface being covered in copper-clad plate is sloughed, it is primary to repeat step S1 and S2.Then step S4 is directly carried out, in this way
Obtained light-sensitive surface pastes well.
Light-sensitive surface is sloughed in step S301 in some embodiments, the light-sensitive surface, lye ratio are generally washed away using lye dissolution
Such as sodium hydroxide solution.
The light-sensitive surface that the present invention uses can be various photosensitive diaphragms or film, similar to the effect of photoresist.It is some
In embodiment, light-sensitive surface described in step S1 is photosensitive blue film or photoresists.
In some embodiments, step S1 specifically:
S101: the gradual change resistance film figure of setting is printed upon on film, and the film is transparent, and can spray printing inking；
S102: the pattern on film is transferred on light-sensitive surface, obtains the light-sensitive surface for being printed on gradual change resistance film figure.
In some embodiments, film described in step S101 is film film.
The copper-clad plate that the present invention uses is flexible copper-clad plate, and it includes the copper layer of flexible substrate layer and surface, Yi Xieshi
Apply in example, which uses commercial FR4 or PI film, the copper layer with a thickness of 0.18mm.The copper-clad plate
Substrate layer is glass fiber reinforced epoxy resin flexible or polyimide film.
Can the substrate layer of copper-clad plate determine according to actual needs thickness.In some embodiments, the lining of the copper-clad plate
Bottom with a thickness of 0.025mm~0.8mm.
Conventional exposure and imaging technique may be selected in the exposure and imaging technique that step S2 of the present invention is used, for example uses and beat
The method of print is exposed, using wet etching skill using the film film with light-shielding pattern as mask plate with printer
Art is developed in sodium bicarbonate solution.
Lithographic method of the present invention is chemical etching method, including dry or wet etch, excellent in some embodiments
It is selected as wet etching.
The pulp-like resistive film that the present invention coats is the resistive ink routinely used in method for printing screen, the present invention
In embodiment, the ingredient of slurry is to be made of carbon based material, high resist, adhesive etc..Slurry passes through different ratio on demand
Carbon based material and high resist mix.
Step S5 of the present invention carries out partial etching to the copper surface of the pattern for the gradual change resistive film for manifesting setting, removes
The copper surface in part, the part for removing copper surface manifest copper-clad plate substrate surface, do not etch the part for removing copper surface
Copper surface is still shown as, remaining region surface is resistive film, so obtains complete flexible gradual change resistive film.Partial etching
When can need to carry out partial etching according to gradual change resistive film design, the smooth transition and gradually of impedance is better achieved
Become characteristic.
The present invention provides a kind of flexible gradual change resistive films, are prepared according to above-mentioned preparation method.The flexibility is gradually
Becoming resistive film can be used for preparing electromagnetic wave absorption device.
The present invention also provides a kind of electromagnetic wave absorption device, functional layer includes flexible gradual change resistance of the present invention
Film.
The flexible gradual change resistive film of the method for the present invention preparation can be directed to broad-band radar absorbers, prepare 600mm × 600mm very
To greater area of flexible gradual change resistive film.In practical engineering application, it can be directed to the suction wave demand of different frequency range, separately design system
Different resistance film figures is made, to show impedance transition in demand frequency range, reduces radar cross section.
According to different application sites, it is cleavable go out different gradual change resistive film sample profile, made according to use demand
Different shape specification, to meet plane patch and curved surface patch demand.
In engineering practice, it was found that copper-clad plate substrate layer is the glass fiber reinforced epoxy resin (abbreviation of 0.15mm thickness
FR4 when) or copper-clad plate substrate layer is polyimide film (the abbreviation PI film) of 0.025mm thickness, copper-clad plate can have both flexible and stress
Demand.
The method of the present invention realizes the processing of large area flexible resistive film TPS, can be applied to curved surface, guarantees low RCS
Characteristic has the stress demand for meeting and actually using.
In order to further illustrate this method, elaborate combined with specific embodiments below.
The following are embodiments:
Embodiment 1
A kind of gradual change resistive film as shown in Figure 2, pattern are the pattern that length is 600mm × 261mm multiplied by width.It is prepared
Method includes the following steps:
S1: being handled by AutoCAD, obtains the print pattern of gradual change resistive film in Fig. 2, by large-scale ink-jet printer,
The gradual change resistance film figure of setting is printed upon on film film；
S2: the FR4 copper-clad plate of the 0.15mm thickness slightly larger than Fig. 2 illustrated dimension is cut, is pasted on flexible copper-clad plate photosensitive
Blue film；
S3: the pattern on film is transferred on the flexible copper-clad plate for being covered with photosensitive blue film；
S4: it is exposed to figuratum flexible copper-clad plate is transferred with printer；
S5: configuration developer solution develops to the flexible copper-clad plate after exposure, wherein not by the photosensitive diaphragm area quilt of illumination
Development removal, manifests copper surface, is retained by the region light-sensitive surface of illumination, manifests the pattern of gradual change resistive film；
S6: performing etching the flexible copper-clad plate after development, demoulds to the flexible copper-clad plate after etching, to be set
The copper part of fixed gradual change resistance film figure, in this step, the method that chemical etching can be used is performed etching；
S7: due to having obscission at indigo plant film edge photosensitive in etching process, S2 is repeated to S5 step, to be set
The resistive film partial pattern of fixed gradual change resistive film；
S8: coating resistive film with applicator on flexible copper-clad plate after development, and the ingredient of resistive film slurry used is charcoal
Sill, high resist, adhesive etc., for the resistive film slurry routinely used.Slurry can pass through the charcoal of different ratio on demand
Sill and high resist mix；
S9: the flexible copper-clad plate of coating resistive film is sintered, to obtain the stable gradual change resistive film of performance；
S10: demoulding sintered flexible copper-clad plate, washes off the sense on non-resistance film figure with sodium hydroxide solution
Light indigo plant film；
S11: partial etching is carried out to the part copper part of the flexible copper-clad plate after demoulding, to remove extra copper portion
Point, obtain complete flexible gradual change resistive film.Obtained flexible gradual change resistive film includes three kinds of gradual period surfaces, respectively copper
Matter surface, resistive film material surface and copper-clad plate etching remove the later substrate surface of copper.
Flexible gradual change resistive film of the invention can be equipped on conformal absorbent structure, for solve edge it is discontinuous caused by
Electromagnetic scattering problem.
Embodiment 2
A kind of flexible gradual change resistive film, pattern are the pattern that length is 600mm × 261mm multiplied by width.Preparation method packet
Include following steps:
S1: being handled by AutoCAD, obtains the print pattern of gradual change resistive film, by large-scale ink-jet printer, will be set
Gradual change resistance film figure be printed upon on film film；
S2: the PI film copper-clad plate of the 0.025mm thickness slightly larger than Fig. 2 illustrated dimension is cut, sense is pasted on flexible copper-clad plate
Light indigo plant film；
S3: the pattern on film is transferred on the flexible copper-clad plate for being covered with photosensitive blue film；
S4: it is exposed to figuratum flexible copper-clad plate is transferred with printer；
S5: configuration developer solution, develop to the flexible copper-clad plate after exposure, with manifest gradual change resistive film without copper
Partial pattern；
S6: performing etching the flexible copper-clad plate after development, demoulds to the flexible copper-clad plate after etching, to be set
The copper part of fixed gradual change resistance film figure, in this step, the method that chemical etching can be used is performed etching；
S7: S2 is repeated to S5 step, after development, to obtain the resistive film partial pattern of the gradual change resistive film of setting；
S8: resistive film is coated with applicator on flexible copper-clad plate after development；
S9: the flexible copper-clad plate of coating resistive film is sintered, to obtain the stable gradual change resistive film of performance；
S10: demoulding sintered flexible copper-clad plate, washes off the sense on non-resistance film figure with sodium hydroxide solution
Light indigo plant film；
S11: partial etching is carried out to the part copper part of the flexible copper-clad plate after demoulding, to remove extra copper portion
Point, obtain complete flexible gradual change resistive film.Obtained flexible gradual change resistive film includes three kinds of gradual period surfaces, respectively copper
Matter surface, resistive film material surface and copper-clad plate etching remove the later substrate surface of copper.
Flexible gradual change resistive film of the invention can be equipped on conformal absorbent structure, for solve edge it is discontinuous caused by
Electromagnetic scattering problem.
It how to be difficult point of the invention on the same substrate by three kinds of unlike material surface preparations.In order to overcome this hardly possible
Point has attempted multiple technologies means during invention, is finally be combined with each other using screen printing technique-printed circuit board technology
Method, successfully preparing tool, there are three types of the gradual change resistive films of material surface.A variety of methods combine, and realization prepares non unitary material table
The target in face.
The method and step technological parameter that the present invention does not itemize can refer to the manufacture craft of prior art routine.Ability
The technical staff in domain is readily appreciated that the foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all
Made any modifications, equivalent replacements, and improvements etc. within the spirit and principles in the present invention should be included in guarantor of the invention
Within the scope of shield.
Claims (10)
1. a kind of preparation method of flexible gradual change resistive film, which comprises the steps of:
S1: the gradual change resistance film figure of setting is imprinted on light-sensitive surface, the light-sensitive surface for being printed on gradual change resistance film figure is obtained；
S2: the light-sensitive surface for being printed on gradual change resistance film figure is covered on flexible copper-clad plate, is successively exposed and develops, obtain
Flexible copper-clad version after development, wherein not manifesting copper surface by the developed removal of photosensitive diaphragm area of illumination；By illumination
Region light-sensitive surface retains, and manifests the pattern of gradual change resistive film；
S3: performing etching the flexible copper-clad plate after development, the flexible copper-clad plate after being etched；The etching is copper to remove
The copper on surface manifests the copper-clad plate substrate surface, while retaining the light-sensitive surface being covered in copper-clad plate, and the light-sensitive surface is in
The pattern of the gradual change resistive film now set；
S4: in the surface coating slurry shape resistive film of the flexible copper-clad plate of acquisition, sintering solidifies the pulp-like resistive film；So
Sintered flexible copper-clad plate is demoulded afterwards, light-sensitive surface and the resistive film on its surface is sloughed, manifests the gradual change of setting
The copper surface of the pattern of resistive film；
S5: carrying out partial etching to the copper surface of the pattern for the gradual change resistive film for manifesting setting, remove the copper surface in part,
The part for removing copper surface manifests copper-clad plate substrate surface, does not etch and removes the part on copper surface and still show as copper table
Face, remaining region surface are resistive film, obtain the flexibility comprising copper surface, copper-clad plate substrate surface and resistance film surface
Gradual change resistive film.
2. preparation method as described in claim 1, which is characterized in that step S3 etched after flexible copper-clad plate after,
It is further comprised the steps of: between step S4
The light-sensitive surface being covered in copper-clad plate is sloughed, it is primary to repeat step S1 and S2.
3. preparation method as described in claim 1, which is characterized in that light-sensitive surface described in step S1 is photosensitive blue film or photosensitive
Glue.
4. preparation method as described in claim 1, which is characterized in that step S1 specifically:
S101: the gradual change resistance film figure of setting is printed upon on film, and the film is transparent, and can spray printing inking；
S102: the pattern on film is transferred on light-sensitive surface, obtains the light-sensitive surface for being printed on gradual change resistance film figure.
5. preparation method as claimed in claim 4, which is characterized in that film described in step S101 is film film.
6. preparation method as described in claim 1, which is characterized in that the substrate layer of the copper-clad plate is glass fiber reinforced
Oxygen resin or polyimide film.
7. preparation method as claimed in claim 6, which is characterized in that the substrate layer of the copper-clad plate with a thickness of 0.025mm
~0.8mm.
8. the flexible gradual change resistive film that preparation method as described in any one of claim 1 to 7 is prepared, the flexible gradual change
Resistance film surface includes three kinds of unlike materials, i.e., copper surface, copper-clad plate substrate surface and resistance film surface.
9. the application of flexible gradual change resistive film as claimed in claim 8, which is characterized in that be used to prepare electromagnetic wave absorption device.
10. a kind of electromagnetic wave absorption device, which is characterized in that its functional layer includes flexible gradual change resistance as claimed in claim 8
Film.
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