CN110246755A - The array of Micro-LED substrate arranges transfer method, transfer device, display device - Google Patents

The array of Micro-LED substrate arranges transfer method, transfer device, display device Download PDF

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Publication number
CN110246755A
CN110246755A CN201910555823.3A CN201910555823A CN110246755A CN 110246755 A CN110246755 A CN 110246755A CN 201910555823 A CN201910555823 A CN 201910555823A CN 110246755 A CN110246755 A CN 110246755A
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micro
led
substrate
transfer
ultrasonic wavelength
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陈新
雷君君
程峰
纪轩荣
袁懋诞
陈燕
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Guangdong University of Technology
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Guangdong University of Technology
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

This application discloses a kind of arrangement of the array of Micro-LED substrate and transfer methods, comprising: according to the diameter of Micro-LED, the ultrasonic wavelength of two-dimensional ultrasound stationary field is determined using the < of λ/4 D≤λ/2;According to the position of four energy converters of ultrasonic wavelength and the size adjusting of substrate, and orthogonal two-dimensional ultrasound stationary field is formed above substrate;The interstitial content of acoustic pressure node is determined according to size and ultrasonic wavelength;The Micro-LED that discharging device places preset number is controlled according to interstitial content, so that Micro-LED is diffused under the action of acoustic radiation force, extra Micro-LED is fallen from substrate.As it can be seen that the application is diffused Micro-LED under the action of the acoustic radiation force of two-dimensional ultrasound stationary field, it is ranked up, so that each Micro-LED occupies an acoustic pressure node, array arrangement and flood tide transfer are realized, it is easy to operate, transfer efficiency is improved, is reduced costs.The application additionally provides transfer device and Micro-LED display device simultaneously, all has above-mentioned beneficial effect.

Description

The array of Micro-LED substrate arranges transfer method, transfer device, display device
Technical field
This application involves technical field of semiconductors, in particular to a kind of Micro-LED substrate (hereinafter referred to as Micro-LED) Array arrange transfer method, the transfer device of Micro-LED substrate, Micro-LED display device.
Background technique
Micro-LED is a kind of by LED structure microminiaturization and matrixing, is operated alone to each pixel and addressing controls Display technology.Micro-led brightness, service life, contrast, reaction time, energy consumption, visible angle and resolution ratio etc. Various indexs are superior to LCD and OLED technology, are considered as that the display technology of new generation of OLED and tradition LED can be surmounted, still, by The extreme efficiency in encapsulation process, 99.9999% yields and it is 0.5 μm positive and negative within shift precision needs;And Micro-LED It is tens of thousands of to millions of that component size, which is approximately less than 50 μm and number, therefore is still needed in Micro-LED industrialization process The core technology problem overcome is exactly the flood tide transfer techniques of Micro-LED component, for modern Ultra-precision Turning skill For art, flood tide transfer is tens of thousands of to hundreds of thousands Micro-LED to substrate from wafer, huge challenge in itself, Processing efficiency, yields and transfer precision not can guarantee more, to hinder the popularization of micro-led technology and make With.
The flood tide transfer method of Micro-LED at present, using groove carrier completion method, by providing intensive arrangement loading chute Loading mold then generate negative pressure using aspirating hole pumping after slot by vibration and blowing so that Micro-LED is fallen into slot Absorption, to realize that flood tide shifts.But it is only shifted to the asymmetrical LED of upper lower edge, it is necessary to using being pre-designed Mold, and the key of the method is intensively to arrange the loading film tool of loading chute, for processing fine order of accuarcy from it, The processing cost of mold will not be too low;A large amount of transfer head matrix absorption migrations are either utilized, it is a large amount of precise and tiny although feasible The production of transfer head matrix or cost are high.In conclusion the flood tide transfer method of Micro-LED and device need greatly at present It measures transfer head matrix or microflute matrix mold realizes the flood tide transfer of Micro-LED, but the production of these Key Molds must Production cost can so be improved.
Therefore, how to provide a kind of scheme of solution above-mentioned technical problem is that those skilled in the art need to solve at present Problem.
Summary of the invention
The array that the purpose of the application is to provide a kind of Micro-LED substrate arranges and transfer method, Micro-LED substrate Transfer device, Micro-LED display device, it is easy to operate, improve transfer efficiency, reduce costs.Its concrete scheme is such as Under:
The array that the application provides a kind of Micro-LED substrate arranges and transfer method, comprising:
According to the diameter of Micro-LED, the ultrasonic wave wave of orthogonal two-dimensional ultrasound stationary field is determined using the < of λ/4 D≤λ/2 It is long;Wherein, λ is the ultrasonic wavelength, and D is the diameter of the Micro-LED;
According to the position of four energy converters of the ultrasonic wavelength and the size adjusting of substrate, and it is rectangular on the substrate The two-dimensional ultrasound stationary field being orthogonal, so that the substrate is in the two-dimensional ultrasound stationary field;
The interstitial content of acoustic pressure node is determined according to the size and the ultrasonic wavelength;
The Micro-LED that discharging device places preset number is controlled according to the interstitial content, so as to described Micro-LED is diffused under the action of acoustic radiation force, and the extra Micro-LED is fallen from the substrate.
Optionally, it according to the position of four energy converters of the ultrasonic wavelength and the size adjusting of substrate, and is formed orthogonal The two-dimensional ultrasound stationary field after, further includes:
The Micro-LED for placing initial number on the substrate, adjusts each energy converter and the substrate Relative altitude, when being in acoustic pressure node so as to the center of the Micro-LED, the center to the upper surface of base plate away from From the thickness for being approximately the Micro-LED.
Optionally, the Micro-LED that discharging device places preset number is controlled according to the interstitial content, with toilet Micro-LED is stated to be diffused under the action of acoustic radiation force, after the extra Micro-LED is fallen from the substrate, Further include:
Control accumulator tank collects the extra Micro-LED, and is transported to the discharging device.
Optionally, control accumulator tank collects the extra Micro-LED, and is transported to after the discharging device, also Include:
The signal for disconnecting each energy converter changes described in control when the Micro-LED stablizes on the substrate Energy device is mobile, and controls the substrate and carry the Micro-LED along guide rail removal;
It controls new substrate to slide into along track, and controls each energy converter and reset, and execute described according to the section The step of point number control discharging device places the Micro-LED of preset number.
The application provides a kind of transfer device of Micro-LED substrate, comprising:
Four energy converters, for forming orthogonal two-dimensional ultrasound stationary field according to the size of ultrasonic wavelength and substrate, with It is in the substrate in the two-dimensional ultrasound stationary field;Wherein, the ultrasonic wavelength is the diameter according to Micro-LED, Utilize the ultrasonic wavelength of the < of λ/4 D≤λ/2 two-dimensional ultrasound stationary field determined;Wherein, λ is the ultrasonic wavelength, D It is the diameter of the Micro-LED;
Discharging device, for placing the Micro-LED of preset number, so that the Micro-LED is in acoustic radiation force Under the action of be diffused, the extra Micro-LED is fallen from the substrate, wherein the preset number is according to section The number that point number obtains, the interstitial content are the numbers that acoustic pressure node is determined according to the size and the ultrasonic wavelength Mesh;
Console, for controlling the energy converter and the discharging device.
Optionally, further includes:
Transducer mount, for placing the energy converter.
Optionally, further includes:
Accumulator tank, for collecting the extra Micro-LED;
Transport device is recycled, for the extra Micro-LED to be transported to the discharging device.
Optionally, further includes:
Guide rail, for conveying the substrate.
The application provides a kind of Micro-LED display device, using such as above-mentioned Micro-LED substrate array arrangement and Transfer method realizes array arrangement and flood tide transfer.
The array that the application provides a kind of Micro-LED substrate arranges and transfer method, comprising: according to Micro-LED's Diameter determines the ultrasonic wavelength of two-dimensional ultrasound stationary field using the < of λ/4 D≤λ/2;According to the size of ultrasonic wavelength and substrate The position of four energy converters is adjusted, and forms orthogonal two-dimensional ultrasound stationary field above substrate, so that substrate is in two dimension and surpasses In sound standing wave field;The interstitial content of acoustic pressure node is determined according to size and ultrasonic wavelength;Discharging dress is controlled according to interstitial content The Micro-LED of placement location preset number is extra so that Micro-LED is diffused under the action of acoustic radiation force Micro-LED is fallen from substrate.
As it can be seen that the application determines two-dimensional ultrasound stationary field by the diameter according to Micro-LED, using the < of λ/4 D≤λ/2 Ultrasonic wavelength;According to the position of four energy converters of ultrasonic wavelength and the size adjusting of substrate, and formed above substrate Orthogonal two-dimensional ultrasound stationary field, so that substrate is in two-dimensional ultrasound stationary field;Sound is determined according to size and ultrasonic wavelength Press the interstitial content of node;The Micro-LED that discharging device places preset number is controlled according to interstitial content, at this point, Micro- LED is diffused under the action of the acoustic radiation force of two-dimensional ultrasound stationary field, is ranked up, so that each Micro-LED is occupied One acoustic pressure node, extra Micro-LED are fallen from substrate, are realized the flood tide transfer of Micro-LED, are avoided related skill Need a large amount of transfer head matrixes or microflute matrix mold that can realize the high cost of flood tide transfer of Micro-LED in art, It is easy to operate, transfer efficiency is improved, is reduced costs.The application additionally provides a kind of transfer of Micro-LED substrate simultaneously Device, Micro-LED display device, all have above-mentioned beneficial effect, details are not described herein.
Detailed description of the invention
In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, to embodiment or will show below There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this The embodiment of application for those of ordinary skill in the art without creative efforts, can also basis The attached drawing of offer obtains other attached drawings.
Fig. 1 is a kind of process of the array arrangement and transfer method of Micro-LED substrate provided by the embodiment of the present application Figure;
Fig. 2 is a kind of schematic diagram of the Micro-LED provided by the embodiments of the present application in one-dimensional space matrix arrangement;
Fig. 3 is a kind of schematic diagram that Micro-LED is arranged in two dimensional matrix provided by the embodiments of the present application;
Fig. 4 is a kind of structural schematic diagram of the transfer device of Micro-LED substrate provided by the embodiments of the present application;
Fig. 5 is the structural schematic diagram of the transfer device of another kind Micro-LED substrate provided by the embodiments of the present application.
Specific embodiment
To keep the purposes, technical schemes and advantages of the embodiment of the present application clearer, below in conjunction with the embodiment of the present application In attached drawing, the technical scheme in the embodiment of the application is clearly and completely described, it is clear that described embodiment is Some embodiments of the present application, instead of all the embodiments.Based on the embodiment in the application, those of ordinary skill in the art Every other embodiment obtained without making creative work, shall fall in the protection scope of this application.
The flood tide transfer method of Micro-LED and device need a large amount of transfer head matrixes or microflute matrix mold real at present The flood tide transfer of existing Micro-LED, but the production of these Key Molds will necessarily improve production cost.It is asked based on above-mentioned technology Topic, the present embodiment provides a kind of arrangement of the array of Micro-LED substrate and transfer methods, by the diameter according to Micro-LED, The ultrasonic wavelength of two-dimensional ultrasound stationary field is determined using the < of λ/4 D≤λ/2;According to the size adjusting of ultrasonic wavelength and substrate The position of four energy converters, and orthogonal two-dimensional ultrasound stationary field is formed above substrate, so that substrate is stayed in two-dimensional ultrasound In wave field;
The interstitial content of acoustic pressure node is determined according to size and ultrasonic wavelength;Discharging device is controlled according to interstitial content to put The Micro-LED (abbreviation that Micro-LED is Micro-LED substrate) of preset number is set, at this point, Micro-LED is super in two dimension It is diffused, is ranked up under the action of the acoustic radiation force of sound standing wave field, so that each Micro-LED occupies an acoustic pressure section Point, extra Micro-LED are fallen from substrate, are realized the flood tide transfer of Micro-LED, are avoided and need in the related technology greatly Amount transfer head matrix or microflute matrix mold can realize the high cost of the flood tide transfer of Micro-LED, easy to operate, mention High transfer efficiency, reduces costs, specific referring to FIG. 1, Fig. 1 is a kind of Micro-LED provided by the embodiment of the present application The flow chart of the array arrangement and transfer method of substrate, specifically includes:
S101, the diameter according to Micro-LED determine the ultrasonic wave wave of two-dimensional ultrasound stationary field using the < of λ/4 D≤λ/2 It is long.
Wherein, λ is ultrasonic wavelength, and D is the diameter of Micro-LED.
In order to guarantee that Micro-LED is quickly arranged in two-dimensional ultrasound stationary field, guarantee that each acoustic pressure node has and only has One Micro-LED, and wherein the crucial diameter for being two-dimensional ultrasound stationary field and Micro-LED and ultrasonic wavelength are closed System determines.According to relationship λ=c/f of ultrasonic wavelength λ and frequency f, and velocity of wave c is constant in mounting medium, as long as adjusting simultaneously Ultrasonic wavelength caused by energy converter is then adjusted, so that the two complete phases of beam wave frequency rate amplitude in the frequency of the energy converter of face Deng, stable acoustic pressure node will be generated at this time, and the Micro-LED in two-dimensional ultrasound stationary field is because by acoustic radiation force at this time It is uneven and be moved to acoustic pressure node location.
To ensure each one and only one Micro-LED of acoustic pressure node, it is necessary to determine the diameter of Micro-LED and surpass Relationship between wave length of sound.Due to Micro-LED the movement of two-dimensional ultrasound stationary field be all acoustic radiation force effect under with Machine toward nearest acoustic pressure node motion, if so ensure, when some Micro-LED is moved into some acoustic pressure node, Distance than other Micro-LED around it to other acoustic pressure nodes is closer, so other Micro-LED then will not be after next This acoustic pressure node, to ensure that each acoustic pressure node only has a Micro-LED.
It is had been established in two-dimensional ultrasound stationary field, ultrasonic wavelength is fixed, and changes the diameter of Micro-LED by analysis to divide Analyse the relationship of the diameter D and ultrasonic wavelength λ of Micro-LED:
1. as D < < λ, it is evident that single acoustic pressure node has many Micro-LED aggregations.2. as D≤λ/4, Same single acoustic pressure node has multiple Micro-LED aggregations, two Micro-LED disaccord an acoustic pressure node the case where it is very general Time, and since gap existing between Micro-LED is too big, it is sufficient to allow the two neighboring Micro-LED in acoustic pressure node it Between hold another Micro-LED, so can only guarantee that each acoustic pressure node has a Micro-LED, and cannot be guaranteed only one Micro-LED.3. gap is appropriate between Micro-LED as the < of λ/4 D≤λ/2, when two Micro-LED disaccord an acoustic pressure When node, there must be other Micro-LED to interfere, under acoustic radiation force interference, Micro-LED is moved to the small side of stress. When two-dimensional ultrasound stationary field is bigger than the substrate for carrying Micro-LED, the Micro-LED of substrate surrounding is in acoustic radiation force Interference is lower to be continued to border movement to fall down substrate, and the extra Micro-LED in substrate centre successively " is transmitted " outward to be arranged one by one Out, so that each acoustic pressure node has and only one Micro-LED on substrate.And as D=λ/2, it is above situation A kind of special circumstances, same reason just one Micro-LED of what a acoustic pressure node, and it is compact between adjacent Micro-LED Gapless, this is a kind of more satisfactory situation certainly.4. as D > λ/2, by upper analysis it is found that Micro-LED diameter mistake Greatly, it directly results in and fails to lay down Micro-LED because position is inadequate at many acoustic pressure nodes, there is no assurance that each node Have.To sum up, in two-dimensional ultrasound stationary field, the condition for meeting each acoustic pressure node one and only one Micro-LED is: λ/4 D≤λ/2 <.
Since general D is determined, and ultrasonic wavelength λ should be adjusted, i.e. the condition that λ should meet is: 2D≤λ < 4D.Specifically The obtained ultrasonic wavelength of two-dimensional ultrasound stationary field of determination, as long as user can be according to reality within the scope of 2D≤λ < 4D Border demand is configured, as long as can satisfy the purpose of the present embodiment, it is preferred to use small λ.
S102, according to the position of four energy converters of ultrasonic wavelength and the size adjusting of substrate, and form orthogonal two dimension Ultrasonic standing wave field, so that substrate is in two-dimensional ultrasound stationary field.
Specifically, the position of four energy converters includes the phase between mutual alignment, energy converter and substrate between energy converter To position, according to the position of ultrasonic wavelength and the size adjusting energy converter of substrate, it is super that orthogonal two dimension is formed using energy converter Sound standing wave field, so as to realize the transfer of Micro-LED.Adjust the distance between energy converter so that energy converter and substrate it Between gap Micro-LED can be made to fall, the size the present embodiment in the gap between specific energy converter and substrate no longer into Row limits, as long as can be realized the purpose of the present embodiment, at least more than the diameter of a Micro-LED.It is noticeable It is that, due to the property of two-dimensional ultrasound stationary field, the distance between energy converter should be the integral multiple of ultrasonic wavelength.Four energy converters Be equal amplitudes, etc. the ultrasonic wavelengths such as frequencies, generations, in pairs, the ultrasonic wave of every group of generation is orthogonal for four energy converters, Orthogonal two-dimensional ultrasound stationary field can be generated.
Further, it according to the position of four energy converters of ultrasonic wavelength and the size adjusting of substrate, and is formed orthogonal After two-dimensional ultrasound stationary field, further includes: the Micro-LED for placing initial number on substrate adjusts each energy converter and base The relative altitude of plate, when being in acoustic pressure node so as to the center of Micro-LED, the distance at center to upper surface of base plate is approximately The thickness of Micro-LED.Specifically, the purpose of this step is the specific position of determining energy converter, accurately to control transducing Micro-LED efficiency is improved in the position of device.
S103, the interstitial content that acoustic pressure node is determined according to size and ultrasonic wavelength.
In general, after substrate size determination, and after ultrasonic wavelength determination, the number of nodes of the acoustic pressure node on each substrate Mesh is certain.The present embodiment is no longer repeated.
S104, the Micro-LED that discharging device places preset number is controlled according to interstitial content, so that Micro-LED exists It is diffused under the action of acoustic radiation force, extra Micro-LED is fallen from substrate.
The Micro-LED that discharging device places preset number is controlled according to interstitial content, specifically, the present embodiment is not to pre- If number is defined, general in order to guarantee the evenly distributed Micro-LED of matrix on entire substrate, preset number is more than node Number can be any multiple in 1.2 times, 1.5 times, 2 times or 5 times of interstitial content, naturally it is also possible to and it is other multiples, As long as being that by the purpose of the present embodiment.Discharging device is about the top of substrate center, and the present embodiment is not to out The position of material device is defined, as long as being that by the purpose of the present embodiment, is preferably provided in substrate center Surface.Micro-LED is diffused under the action of acoustic radiation force, more since excessive Micro-LED is placed The Micro-LED in domain is fallen from the edge of substrate, ensure that the Micro-LED matrix on substrate is evenly distributed, each acoustic pressure section Point only has a Micro-LED.
Fig. 2 and Fig. 3 are specifically please referred to, Fig. 2 is a kind of Micro-LED provided by the embodiments of the present application in one-dimensional space matrix The schematic diagram of arrangement, Fig. 3 are a kind of schematic diagram that Micro-LED is arranged in two dimensional matrix provided by the embodiments of the present application. In Fig. 2, energy converter 1 (Ultrasonic transducer 1), energy converter 2 (Ultrasonic transducer 2), Micro-LED, acoustic pressure node (Acoustic pressure node).In Fig. 3,1 (Ultrasonic of energy converter Transducer 1), energy converter 2 (Ultrasonic transducer 2), (the Ultrasonic transducer of energy converter 3 3), energy converter 4 (Ultrasonic transducer 4), Micro-LED, acoustic pressure node (Acoustic pressure node)。
Three-dimensional can be seen in the figure, and be added in the distribution of the One-Dimensional Ultrasonic stationary field Micro-LED of x-axis direction.In x-axis direction In One-Dimensional Ultrasonic stationary field, Micro-LED is moved under acoustic radiation force along the positive negative direction of x-axis, and extra Micro-LED is extruded Substrate drops out ultrasonic standing wave field.Since the direction y adds ultrasonic standing wave field not yet, so Micro-LED is freely distributed in the direction y. Keep Micro-LED arranged in arrays, then also needs to add the one of the frequencies such as an equal amplitudes and the intersection of acoustic pressure node in y-axis direction Sound field is tieed up, i.e., adds one group of energy converter in y-axis direction again, establishes a same ultrasonic standing wave field, is made in this ultrasonic standing wave field Under, the Micro-LED in y-axis direction tries again one dimensional arrangement, the equally active force in acoustic radiation force and adjacent Micro-LED Under extra Micro-LED be extruded substrate, to set up the two dimensional matrix arrangement of Micro-LED, and guarantee each One and only one Micro-LED of a node.
Further, control accumulator tank collects extra Micro-LED, and is transported to after discharging device, further includes: disconnected The signal for opening each energy converter, when Micro-LED stablizes on substrate, control energy converter is mobile, and control base board carries Micro-LED is removed along guide rail;It controls new substrate to slide into along track, and controls each energy converter and reset, and execute according to section The step of point number control discharging device places the Micro-LED of preset number.Specifically, by the signal for disconnecting energy converter, It is mobile to control energy converter, is removed so that substrate carries Micro-LED along guide rail, new substrate is slided into along track, and energy converter resets, Realize the flood tide transfer that Micro-LED is executed on new substrate.It is easy to operate to can be seen that this method by above-mentioned means, It can efficiently realize the transfer of Micro-LED.
Based on the above-mentioned technical proposal, the present embodiment is determined by the diameter according to Micro-LED using the < of λ/4 D≤λ/2 The ultrasonic wavelength of two-dimensional ultrasound stationary field;According to the position of four energy converters of ultrasonic wavelength and the size adjusting of substrate, and Orthogonal two-dimensional ultrasound stationary field is formed above substrate, so that substrate is in two-dimensional ultrasound stationary field;According to size and surpass Wave length of sound determines the interstitial content of acoustic pressure node;The Micro- that discharging device places preset number is controlled according to interstitial content LED is ranked up at this point, Micro-LED is diffused under the action of the acoustic radiation force of two-dimensional ultrasound stationary field, so that often A Micro-LED occupies an acoustic pressure node, and extra Micro-LED is fallen from substrate, and the flood tide for realizing Micro-LED turns It moves, avoids and need a large amount of transfer head matrixes or microflute matrix mold that can realize that Micro-LED's is huge in the related technology The high cost of transfer is measured, it is easy to operate, transfer efficiency is improved, is reduced costs.
A kind of transfer device of Micro-LED substrate provided by the embodiments of the present application is introduced below, is described below Micro-LED substrate transfer device and above-described Micro-LED substrate array arrangement and transfer method can be mutual To should refer to, with reference to Fig. 4, Fig. 4 is that a kind of structure of the transfer device of Micro-LED substrate provided by the embodiment of the present application is shown It is intended to, comprising:
Four energy converters 100, for forming orthogonal two-dimensional ultrasound stationary field according to the size of ultrasonic wavelength and substrate, So that substrate is in two-dimensional ultrasound stationary field;Wherein, ultrasonic wavelength is the diameter according to Micro-LED, utilizes the < of λ/4 D The ultrasonic wavelength for the two-dimensional ultrasound stationary field that≤λ/2 is determined;Wherein, λ is ultrasonic wavelength, and D is the diameter of Micro-LED. The present embodiment is not defined 100 energy converters, and user can voluntarily choose.Meanwhile according to actual needs, settable ultrasonic transduction Device phased array.
Discharging device 200, for placing the Micro-LED of preset number, so that Micro-LED is in the effect of acoustic radiation force Under be diffused, extra Micro-LED is fallen from substrate, wherein preset number is the number obtained according to interstitial content, section Point number is that the number of acoustic pressure node is determined according to size and ultrasonic wavelength.Specifically, the present embodiment is not to discharging device Shape, material are defined, as long as being that by the purpose of the present embodiment, the cross-sectional area of discharging device 200 can be with It is circle, triangle, polygon or irregular shape, as long as Micro-LED can be placed.Meanwhile according to practical need It asks, settable two or more discharging devices.
Console 300, for controlling energy converter 100 and discharging device 200.
Further, referring to FIG. 5, the transfer that Fig. 5 is another kind Micro-LED substrate provided by the embodiments of the present application fills The structural schematic diagram set.
In some specific embodiments, the transfer device of Micro-LED substrate further include: transducer mount 400 is used for Place energy converter 100.To ensure the fixation of energy converter 100, energy converter 100 caused by avoiding when shaking is mobile and then makes At the generation of the mistake of Micro-LED transfer.The shape of transducer mount and material user can customize setting.As long as can be real The purpose of existing fixing of energy converter.
In some specific embodiments, the transfer device of Micro-LED substrate further include: accumulator tank is more for collecting Remaining Micro-LED;Transport device is recycled, for extra Micro-LED to be transported to discharging device.Specific accumulator tank The structure user of structure and recycling transport device can customize setting.
In some specific embodiments, the transfer device of Micro-LED substrate further include: guide rail 500, for conveying base Plate.The transfer of the efficient Micro-LED of more batches is realized for transmitting substrate.
Due to the embodiment of the transfer device part of Micro-LED substrate and the array arrangement of Micro-LED substrate and turn The embodiment of shifting method part corresponds to each other, therefore the embodiment of the transfer device part of Micro-LED substrate refers to The description of the embodiment of the array arrangement and transfer method part of Micro-LED substrate, wouldn't repeat here.
A kind of Micro-LED display device provided by the embodiments of the present application is introduced below, it is described below Micro-LED display device can correspond to each other reference with the arrangement of the array of above-described Micro-LED substrate and transfer method,
A kind of Micro-LED display device, it is real using the array arrangement of such as above-mentioned Micro-LED substrate and transfer method Existing array arrangement and flood tide transfer.
Due to the embodiment of Micro-LED display device part and the array arrangement of Micro-LED substrate and transfer method Partial embodiment corresponds to each other, therefore the embodiment of Micro-LED display device part refers to the battle array of Micro-LED substrate The description of the embodiment of column arrangement and transfer method part, wouldn't repeat here.
Each embodiment is described in a progressive manner in specification, the highlights of each of the examples are with other realities The difference of example is applied, the same or similar parts in each embodiment may refer to each other.For device disclosed in embodiment Speech, since it is corresponded to the methods disclosed in the examples, so being described relatively simple, related place is referring to method part illustration ?.
Professional further appreciates that, unit described in conjunction with the examples disclosed in the embodiments of the present disclosure And algorithm steps, can be realized with electronic hardware, computer software, or a combination of the two, in order to clearly demonstrate hardware and The interchangeability of software generally describes each exemplary composition and step according to function in the above description.These Function is implemented in hardware or software actually, the specific application and design constraint depending on technical solution.Profession Technical staff can use different methods to achieve the described function each specific application, but this realization is not answered Think beyond scope of the present application.
The step of method described in conjunction with the examples disclosed in this document or algorithm, can directly be held with hardware, processor The combination of capable software module or the two is implemented.Software module can be placed in random access memory (RAM), memory, read-only deposit Reservoir (ROM), electrically programmable ROM, electrically erasable ROM, register, hard disk, moveable magnetic disc, CD-ROM or technology In any other form of storage medium well known in field.
A kind of array arrangement of Micro-LED substrate provided herein and transfer method, Micro-LED are served as a contrast above The transfer device at bottom, Micro-LED display device are described in detail.Original of the specific case to the application used herein Reason and embodiment are expounded, and the present processes that the above embodiments are only used to help understand and its core are thought Think.It should be pointed out that for those skilled in the art, under the premise of not departing from the application principle, may be used also With to the application, some improvement and modification can also be carried out, these improvement and modification are also fallen into the protection scope of the claim of this application.

Claims (9)

1. a kind of array of Micro-LED substrate arranges and transfer method characterized by comprising
According to the diameter of Micro-LED, the ultrasonic wavelength of orthogonal two-dimensional ultrasound stationary field is determined using the < of λ/4 D≤λ/2; Wherein, λ is the ultrasonic wavelength, and D is the diameter of the Micro-LED;
It is rectangular at just according to the position of four energy converters of the ultrasonic wavelength and the size adjusting of substrate, and on the substrate The two-dimensional ultrasound stationary field handed over, so that the substrate is in the two-dimensional ultrasound stationary field;
The interstitial content of acoustic pressure node is determined according to the size and the ultrasonic wavelength;
The Micro-LED that discharging device places preset number is controlled according to the interstitial content, so as to the Micro-LED It is diffused under the action of acoustic radiation force, the extra Micro-LED is fallen from the substrate.
2. the array of Micro-LED substrate according to claim 1 arranges and transfer method, which is characterized in that according to institute State the position of four energy converters of size adjusting of ultrasonic wavelength and substrate, and formed the orthogonal two-dimensional ultrasound stationary field it Afterwards, further includes:
The Micro-LED for placing initial number on the substrate, adjusts the phase of each energy converter and the substrate To height, when being in acoustic pressure node so as to the center of the Micro-LED, the distance at the center to the upper surface of base plate is about It is the thickness of the Micro-LED.
3. the array of Micro-LED substrate according to claim 1 arranges and transfer method, which is characterized in that according to institute The Micro-LED that interstitial content control discharging device places preset number is stated, so that the Micro-LED is in acoustic radiation force Under the action of be diffused, after the extra Micro-LED is fallen from the substrate, further includes:
Control accumulator tank collects the extra Micro-LED, and is transported to the discharging device.
4. the array of Micro-LED substrate according to claim 3 arranges and transfer method, which is characterized in that control back It receives slot and collects the extra Micro-LED, and be transported to after the discharging device, further includes:
The signal for disconnecting each energy converter controls the energy converter when the Micro-LED stablizes on the substrate It is mobile, and control the substrate and carry the Micro-LED along guide rail removal;
It controls new substrate to slide into along track, and controls each energy converter and reset, and execute described according to the number of nodes Mesh controls the step of discharging device places the Micro-LED of preset number.
5. a kind of transfer device of Micro-LED substrate characterized by comprising
Four energy converters, for forming orthogonal two-dimensional ultrasound stationary field according to the size of ultrasonic wavelength and substrate, so that institute Substrate is stated to be in the two-dimensional ultrasound stationary field;Wherein, the ultrasonic wavelength is the diameter according to Micro-LED, is utilized The ultrasonic wavelength for the two-dimensional ultrasound stationary field that the < of λ/4 D≤λ/2 is determined;Wherein, λ is the ultrasonic wavelength, and D is institute State the diameter of Micro-LED;
Discharging device, for placing the Micro-LED of preset number, so that the Micro-LED is in the work of acoustic radiation force It is diffused under, the extra Micro-LED is fallen from the substrate, wherein the preset number is according to number of nodes The number that mesh obtains, the interstitial content are the numbers that acoustic pressure node is determined according to the size and the ultrasonic wavelength;
Console, for controlling the energy converter and the discharging device.
6. the transfer device of Micro-LED substrate according to claim 5, which is characterized in that further include:
Transducer mount, for placing the energy converter.
7. the transfer device of Micro-LED substrate according to claim 5, which is characterized in that further include:
Accumulator tank, for collecting the extra Micro-LED;
Transport device is recycled, for the extra Micro-LED to be transported to the discharging device.
8. the transfer device of Micro-LED substrate according to claim 7, which is characterized in that further include:
Guide rail, for conveying the substrate.
9. a kind of Micro-LED display device, which is characterized in that use the described in any item Micro-LED of Claims 1-4 The array arrangement of substrate and transfer method realize array arrangement and flood tide transfer.
CN201910555823.3A 2019-06-25 2019-06-25 The array of Micro-LED substrate arranges transfer method, transfer device, display device Pending CN110246755A (en)

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