CN110240888A - A kind of thermally conductive Silica hydrogel of two-component condensed type and preparation method thereof - Google Patents
A kind of thermally conductive Silica hydrogel of two-component condensed type and preparation method thereof Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/16—Halogen-containing compounds
- C08K2003/168—Zinc halides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Abstract
The present invention provides a kind of thermally conductive Silica hydrogel of two-component condensed type and preparation method thereof, the component including following parts by weight: component A: α, 35~60 parts of alpha, omega-dihydroxy polydimethyl siloxane；40~60 parts of silicon powder；0.5~5 part of zinc compound；0.03~0.1 part of catalyst；B component: 30~55 parts of alkoxy end-capped dimethyl silicone polymer；40~60 parts of silicon powder；2~10 parts of crosslinking agent；1~5 part of coupling agent.The present invention has used zinc compound in formula, realize the deep cure of Silica hydrogel, compared with addition water, precipitated silica and glycerol organic phosphate, comprehensive performance is more excellent, and, thermally conductive Silica hydrogel in the present invention is of less demanding to mixing apparatus measuring accuracy, easy to operate when in use, guarantees that mixed Silica hydrogel performance is stablized, is suitble to transfer matic continuous mass production.
Description
Technical field
The invention belongs to technical field of polymer materials more particularly to a kind of thermally conductive Silica hydrogel of two-component condensed type and its systems
Preparation Method.
Background technique
Silicon gel is a kind of lower jelly shape material of solid-liquid of crosslink density, has flexibility height, adhesion strength
By force, the advantages that impact absorbency is good, internal stress is very small is widely used for the neck such as electronic apparatus, medical treatment, sensor, automobile
Domain.
According to the curing mechanism of silicon gel, condensed type organic silicon gel and additional organosilicon gel can be classified as
Two classes.Currently, most of Silica hydrogel product is dual composition addition type in the market, this kind of Silica hydrogel product includes component A and B group
Point, mixed proportion is mass ratio 1:1；But the platinum catalyst as used in add-on type Silica hydrogel is to the organic matter containing N, P, S
It is easily poisoned with the compound containing heavy metal ion such as Sn, Ph, Hg, Bi, As, and there is certain limitation to the selection of coupling agent
Property, therefore, it can not be applied in certain occasions.The component A and B component mixed proportion of condensed type Silica hydrogel are mass ratio 10:1,
When with machine dispensing, due to gear pump or screw pump because by different pressure or different distance of advancing, to mixing
Equipment measuring accuracy requires high, and mixed proportion easily fluctuates, the quality of two components can not accurate match, and then cause silicon solidifying
The properties of glue are unstable, or even the phenomenon that not solidifying occur；Also, B component is mostly flammable liquid, to production, transport and
Storage causes biggish danger.
Summary of the invention
The purpose of the present invention is to provide a kind of thermally conductive Silica hydrogel of two-component condensed type and preparation method thereof, in the present invention
The thermally conductive two component mixed proportion of Silica hydrogel of two-component condensed type is adjusted to mass ratio 1:1, requires not mixing apparatus measuring accuracy
It is high, it is ensured that the performance of Silica hydrogel is stablized after mixing, is suitble to modern industry continuous mass production；And condensed type system is to coupling
There is no limit may be implemented the good bonding to wide variety of substrates for the selection of agent.
The present invention provides a kind of thermally conductive Silica hydrogel of two-component condensed type, the component including following parts by weight:
Component A:
B component:
The mass ratio of the component A and B component is 1:(0.9~1.1).
Preferably, the α, viscosity of the alpha, omega-dihydroxy polydimethyl siloxane at 25 DEG C are 500~1500mPas；
Viscosity of the alkoxy end-capped dimethyl silicone polymer at 25 DEG C is 1000~2000mPas.
Preferably, the partial size of the silicon powder in the component A is 5~20 μm；
The parts by weight of silicon powder in the component A are 40~50 parts.
Preferably, the zinc compound is one or more of zinc oxide, zinc carbonate, zinc sulfate and zinc chloride；
The parts by weight of the zinc compound are 1~3.5 part.
Preferably, the catalyst is dibutyl tin dilaurate, tin dilaurate dioctyl tin, stannous octoate, two acetic acid
One or more of dibutyl tin, two pungent capric acid stannous methides and dibutyl tin acetate；
The parts by weight of the catalyst are 0.05~0.07 part.
Preferably, the alkoxy end-capped dimethyl silicone polymer is α, ω-dimethoxy sealing end dimethyl silicone polymer,
α, ω-trimethoxy block dimethyl silicone polymer, α, and ω-diethoxy blocks dimethyl silicone polymer, α, ω-triethoxy
Block dimethyl silicone polymer, α, ω-trimethoxy silicon substrate ethyl capping dimethyl silicone polymer and α, ω-triethoxy silicon substrate
One or more of ethyl capping dimethyl silicone polymer；
The parts by weight of the alkoxy end-capped dimethyl silicone polymer are 40~50 parts.
Preferably, the partial size of the silicon powder in the B component is 5~20 μm；
The parts by weight of silicon powder in the B component are 45~55 parts.
Preferably, the crosslinking agent is methyl orthosilicate, ethyl orthosilicate, positive silicic acid propyl ester, tetraethoxysilane hydrolysis
Bis- (trimethoxy silicon substrate) ethane of object, 1,6-, bis- (trimethoxy silicon substrate) ethane of 1,6-, one in poly- methyltriethoxysilane
Kind is several；
The parts by weight of the crosslinking agent are 2~10 parts.
Preferably, the coupling agent be γ-aminopropyltrimethoxysilane, gamma-aminopropyl-triethoxy-silane, γ-(2,
3 the third oxygen of epoxy) propyl trimethoxy silicane, γ-(2,3 the third oxygen of epoxy) propyl-triethoxysilicane, N- (β-aminoethyl)-γ-
It is one or more of in aminopropyl trimethoxysilane and N- (β-aminoethyl)-gamma-aminopropyl-triethoxy-silane；
The parts by weight of the coupling agent are 1~3 part.
The present invention provides a kind of preparation method of thermally conductive Silica hydrogel of two-component condensed type, comprising the following steps:
The preparation of component A:
Based on parts by weight, by 35~60 parts of α, alpha, omega-dihydroxy polydimethyl siloxane and 40~60 parts of silicon powders are 100
It being stirred at~150 DEG C, keeps vacuum degree in 0.05~0.15MPa, revolving speed is 200~500r/min, stirring 30~
80min；
Temperature of charge is down to 50 DEG C hereinafter, 0.5~5 part of zinc compound of addition, is stirred under vacuum 5~20min；
0.03~0.1 part of catalyst is added, is stirred under vacuum 10~30min, obtains component A.
B component preparation:
Based on parts by weight, by 30~55 parts of alkoxy end-capped dimethyl silicone polymers and 40~60 parts of silicon powders 100
It being stirred at~150 DEG C, keeps vacuum degree in 0.05~0.15MPa, revolving speed is 200~500r/min, stirring 30~
80min；
Temperature of charge is down to 50 DEG C hereinafter, 2~10 parts of crosslinking agents of addition, are stirred under vacuum 5~20min；
1~5 part of coupling agent is added, is stirred under vacuum 10~30min, obtains B component；
The mass ratio of the component A and B component is 1:(0.9~1.1).
The present invention provides a kind of thermally conductive Silica hydrogel of two-component condensed type, the component including following parts by weight: component A:
α, 35~60 parts of alpha, omega-dihydroxy polydimethyl siloxane；40~60 parts of silicon powder；0.5~5 part of zinc compound；Catalyst
0.03~0.1 part；B component: 30~55 parts of alkoxy end-capped dimethyl silicone polymer；40~60 parts of silicon powder；Crosslinking agent 2~10
Part；1~5 part of coupling agent.The present invention has used zinc compound in formula, realizes the deep cure of Silica hydrogel, with addition water,
Precipitated silica is compared with glycerol organic phosphate, and comprehensive performance is more excellent, and (water can make decreasing insulating, white carbon black that can reduce stream
Levelling, glycerol organic phosphate easily disperse unevenness with siloxanes poor compatibility), also, the thermally conductive Silica hydrogel in the present invention makes
Used time is of less demanding to mixing apparatus measuring accuracy, easy to operate, guarantees that mixed Silica hydrogel performance is stablized, is suitble to transfer matic
Continuous mass production.
Specific embodiment
The present invention provides a kind of thermally conductive Silica hydrogel of two-component condensed type, the component including following parts by weight:
Component A:
B component:
The mass ratio of the component A and B component is 1:(0.9~1.1).
In the present invention, the α, viscosity of the alpha, omega-dihydroxy polydimethyl siloxane at 25 DEG C is preferably 500~
1500mPas, more preferably 800~1200mPas, most preferably 1000~1100mPas；The α, alpha, omega-dihydroxy are poly-
The parts by weight of dimethyl siloxane are preferably 35~60 parts, and more preferably 45~55 parts, specifically, can be 45 parts, 50 parts
Or 55 parts.
The partial size of silicon powder is preferably 5~20 μm in the component A, and more preferably 10~15 μm, specifically, can be 5 μ
M or 10 μm；The parts by weight of silicon powder are preferably 40~60 parts in the component A, and more preferably 40~50 parts, specifically, can
To be 43 parts, 45 parts or 50 parts.
The zinc compound is preferably one or more of zinc oxide, zinc carbonate, zinc sulfate and zinc chloride；It is described to contain
The parts by weight of zinc compound are preferably 0.5~5 part, more preferably 1~4 part, most preferably 2~3 parts, specifically, can be 1
Part, 3 parts or 5 parts.
The catalyst is preferably dibutyl tin dilaurate, tin dilaurate dioctyl tin, stannous octoate, two acetic acid, two fourth
One or more of Ji Xi, two pungent capric acid stannous methides and dibutyl tin acetate；The parts by weight of the catalyst are preferred
It is 0.03~0.1 part, more preferably 0.05~0.08 part, specifically, can be 0.05 part, 0.07 part or 0.1 part.
The alkoxy end-capped dimethyl silicone polymer is α, and ω-dimethoxy blocks dimethyl silicone polymer, α, ω-three
Methoxy group dimethyl silicone polymer, α, ω-diethoxy block dimethyl silicone polymer, α, and ω-triethoxy sealing end is poly-
Dimethyl siloxane, α, ω-trimethoxy silicon substrate ethyl capping dimethyl silicone polymer and α, ω-triethoxy silicon substrate ethyl envelope
Hold one or more of dimethyl silicone polymer；The parts by weight of the alkoxy end-capped dimethyl silicone polymer are preferably 30
~55 parts, more preferably 35~50 parts, most preferably 40~45 parts, specifically, can be 40 parts, 42 parts or 46 parts.
The partial size of silicon powder in the B component is preferably 5~20 μm, and more preferably 10~15 μm, specifically, can be
5 μm or 10 μm；The parts by weight of silicon powder are preferably 40~60 parts in the B component, and more preferably 45~55 parts, specifically,
It can be 46 parts, 51 parts or 55 parts.
The crosslinking agent be preferably methyl orthosilicate, ethyl orthosilicate, positive silicic acid propyl ester, tetraethoxysilane hydrolysate,
Bis- (trimethoxy silicon substrate) ethane of 1,6-, bis- (trimethoxy silicon substrate) ethane of 1,6-, poly- methyltriethoxysilane (3# waterproof
One or more of agent)；The parts by weight of the crosslinking agent are preferably 2~10 parts, and more preferably 2~8 parts.
The coupling agent is preferably γ-aminopropyltrimethoxysilane, gamma-aminopropyl-triethoxy-silane, γ-(2,3 rings
The third oxygen of oxygen) propyl trimethoxy silicane, γ-(2,3 the third oxygen of epoxy) propyl-triethoxysilicane, N- (β-aminoethyl)-γ-ammonia third
It is one or more of in base trimethoxy silane and N- (β-aminoethyl)-gamma-aminopropyl-triethoxy-silane；The weight of the coupling agent
Measuring number is preferably 1~3 part.
In the present invention, the mass ratio of the component A and B component is preferably 1:(0.9~1.1), more preferably 1:1.
The present invention also provides a kind of preparation methods of thermally conductive Silica hydrogel of two-component condensed type, comprising the following steps:
The preparation of component A:
Based on parts by weight, by 35~60 parts of α, alpha, omega-dihydroxy polydimethyl siloxane and 40~60 parts of silicon powders are 100
It being stirred at~150 DEG C, keeps vacuum degree in 0.05~0.15MPa, revolving speed is 200~500r/min, stirring 30~
80min；
Temperature of charge is down to 50 DEG C hereinafter, 0.5~5 part of zinc compound of addition, is stirred under vacuum 5~20min；
0.03~0.1 part of catalyst is added, is stirred under vacuum 10~30min, obtains component A.
B component preparation:
Based on parts by weight, by 30~55 parts of alkoxy end-capped dimethyl silicone polymers and 40~60 parts of silicon powders 100
It being stirred at~150 DEG C, keeps vacuum degree in 0.05~0.15MPa, revolving speed is 200~500r/min, stirring 30~
80min；
Temperature of charge is down to 50 DEG C hereinafter, 2~10 parts of crosslinking agents of addition, are stirred under vacuum 5~20min；
1~5 part of coupling agent is added, is stirred under vacuum 10~30min, obtains B component；
The mass ratio of the component A and B component is 1:(0.9~1.1).
Specifically, the component A can be prepared according to the following steps to obtain:
By α, alpha, omega-dihydroxy polydimethyl siloxane and silicon powder are stirred at 110~120 DEG C, keep vacuum degree
In 0.095MPa, revolving speed is 300~400r/min, stirs 50~60min；
Temperature of charge is down to 50 DEG C hereinafter, addition zinc compound, is stirred under vacuum 10~15min；
Catalyst is added, is stirred under vacuum 20~25min, obtains component A.
The α, alpha, omega-dihydroxy polydimethyl siloxane, silicon powder, zinc compound and catalyst type and dosage with
Above α, alpha, omega-dihydroxy polydimethyl siloxane, silicon powder, the type of zinc compound and catalyst are consistent with dosage,
This is repeated no more.
The B component can be prepared according to the following steps to obtain:
Based on parts by weight, alkoxy end-capped dimethyl silicone polymer and silicon powder are stirred at 110~120 DEG C
It mixes, keeps vacuum degree in 0.095MPa, revolving speed is 300~400r/min, stirs 50~60min；
Temperature of charge is down to 50 DEG C hereinafter, addition crosslinking agent, is stirred under vacuum 10~15min；
Coupling agent is added, is stirred under vacuum 20~25min, obtains B component；
The alkoxy end-capped dimethyl silicone polymer, silicon powder, the type and dosage of crosslinking agent and coupling agent and above
In alkoxy end-capped dimethyl silicone polymer, silicon powder, crosslinking agent and the type of coupling agent it is consistent with dosage, it is no longer superfluous herein
It states.
After obtaining component A and B component, when in use, by component A and B component 1:(0.9~1.1 in mass ratio) mixing
, preferably 1:1 mixing.
Compared with other existing A, B component proportion, in the present invention in the preparation of 1:1 ratio, it is notable that in A
At the beginning of prepared by component and B component, being both needed to heat up primary raw material is vacuumized, i.e., at 100~150 DEG C, vacuum degree is kept to exist
0.05~0.15MPa stirring, the moisture that its purpose is to be discharged in primary raw material, to improve the Storage period of product, because of A group
Divide if there is water, dialkyl polydimethylsiloxane may be made slowly to degrade under the catalytic action of catalyst, so that producing
Product curing rate is slack-off；B component can make crosslinking agent and coupling agent hydrolytic crosslinking if there is water, so that product can not be fully cured.
Both situations can seriously affect the Storage period and performance of product.
The present invention provides a kind of thermally conductive Silica hydrogel of two-component condensed type, the component including following parts by weight: component A:
α, 35~60 parts of alpha, omega-dihydroxy polydimethyl siloxane；40~60 parts of silicon powder；0.5~5 part of zinc compound；Catalyst
0.03~0.1 part；B component: 30~55 parts of alkoxy end-capped dimethyl silicone polymer；40~60 parts of silicon powder；Crosslinking agent 2~10
Part；1~5 part of coupling agent.The present invention has used zinc compound in formula, realizes the deep cure of Silica hydrogel, with addition water,
Precipitated silica is compared with glycerol organic phosphate, and comprehensive performance is more excellent, and (water can make decreasing insulating, white carbon black that can reduce stream
Levelling, glycerol organic phosphate easily disperse unevenness with siloxanes poor compatibility), also, the thermally conductive Silica hydrogel in the present invention makes
Used time is of less demanding to mixing apparatus measuring accuracy, easy to operate, guarantees that mixed Silica hydrogel performance is stablized, is suitble to transfer matic
Continuous mass production.
In order to further illustrate the present invention, thermally conductive to a kind of two-component condensed type provided by the invention with reference to embodiments
Silica hydrogel and preparation method thereof is described in detail, but cannot be understood as limiting the scope of the present invention.
Embodiment 1
Component A and B component are prepared respectively according to each raw material dosage in upper table；
The preparation of component A:
By α, in alpha, omega-dihydroxy polydimethyl siloxane and silicon powder investment high speed disperser, 110 DEG C is heated to, is kept
Vacuum degree stirs 60min in 0.095MPa, revolving speed 300r/min；
Temperature of charge is down to 50 DEG C hereinafter, addition zinc compound, is stirred under vacuum 10min；
Catalyst is added, is stirred under vacuum 20min, obtains component A.
B component preparation:
By in alkoxy end-capped dimethyl silicone polymer and silicon powder investment high speed disperser, 110 DEG C are heated to, keeps true
Reciprocal of duty cycle stirs 60min in 0.095MPa, revolving speed 300r/min；
Temperature of charge is down to 50 DEG C hereinafter, addition crosslinking agent, is stirred under vacuum 10min；
Coupling agent is added, is stirred under vacuum 20min, obtains B component.
In use, A, B component 1:1 in mass ratio are mixed.
Embodiment 2
Silica hydrogel is prepared using the raw material proportioning in the present embodiment according to the preparation method in embodiment 1.
Embodiment 3
Silica hydrogel is prepared using the raw material proportioning in the present embodiment according to the preparation method in embodiment 1.
Comparative example 1
Silica hydrogel is prepared using the raw material proportioning in this comparative example according to the preparation method in embodiment 1.
Comparative example 2
Silica hydrogel is prepared using the raw material proportioning in this comparative example according to the preparation method in embodiment 1.
Comparative example 3
Silica hydrogel is prepared using the raw material proportioning in this comparative example according to the preparation method in embodiment 1.By embodiment 1
~3 and the Silica hydrogel of comparative example 1~3 be tested for the property, the results are shown in Table 1.
The performance data of the Silica hydrogel of 1 embodiment of the present invention 1~3 of table and comparative example 1~3
Note 1: casting glue is poured into 4cm thickness in cup, in due course the interior item that about 1cm wide is cut off from side, and should
Item is pulled to bottom of a cup, and colloid will not be protruded without viscoplasticity and from side substantially, which is the deep cure time；
Note 2: taking the blend glue stuff of 20ml to squeeze on smooth glass plate, spreads its freely out rounded, uses after 60min
Ruler measures circular diameter, the superiority and inferiority of the size characterization levelability of diameters.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also answered
It is considered as protection scope of the present invention.
Claims (10)
1. a kind of thermally conductive Silica hydrogel of two-component condensed type, the component including following parts by weight:
Component A:
B component:
The mass ratio of the component A and B component is 1:(0.9~1.1).
2. the thermally conductive Silica hydrogel of two-component condensed type according to claim 1, which is characterized in that the α, alpha, omega-dihydroxy are poly-
Viscosity of the dimethyl siloxane at 25 DEG C is 500~1500mPas；
Viscosity of the alkoxy end-capped dimethyl silicone polymer at 25 DEG C is 1000~2000mPas.
3. the thermally conductive Silica hydrogel of two-component condensed type according to claim 1, which is characterized in that the silicon in the component A is micro-
The partial size of powder is 5~20 μm；
The parts by weight of silicon powder in the component A are 40~50 parts.
4. the thermally conductive Silica hydrogel of two-component condensed type according to claim 1, which is characterized in that the zinc compound is oxygen
Change one or more of zinc, zinc carbonate, zinc sulfate and zinc chloride；
The parts by weight of the zinc compound are 1~3.5 part.
5. the thermally conductive Silica hydrogel of two-component condensed type according to claim 1, which is characterized in that the catalyst is two laurels
Sour dibutyl tin, tin dilaurate dioctyl tin, stannous octoate, dibutyltin diacetate, two pungent capric acid stannous methides and dibutyl
One or more of oxalic acid tin；
The parts by weight of the catalyst are 0.05~0.07 part.
6. the thermally conductive Silica hydrogel of two-component condensed type according to claim 1, which is characterized in that described alkoxy end-capped poly- two
Methylsiloxane is α, ω-dimethoxy sealing end dimethyl silicone polymer, α, ω-trimethoxy sealing end dimethyl silicone polymer,
α, ω-diethoxy block dimethyl silicone polymer, α, and ω-triethoxy blocks dimethyl silicone polymer, α, ω-trimethoxy
Silicon substrate ethyl capping dimethyl silicone polymer and α, one of ω-triethoxy silicon substrate ethyl capping dimethyl silicone polymer or
It is several；
The parts by weight of the alkoxy end-capped dimethyl silicone polymer are 40~50 parts.
7. the thermally conductive Silica hydrogel of two-component condensed type according to claim 1, which is characterized in that the silicon in the B component is micro-
The partial size of powder is 5~20 μm；
The parts by weight of silicon powder in the B component are 45~55 parts.
8. the thermally conductive Silica hydrogel of two-component condensed type according to claim 1, which is characterized in that the crosslinking agent is positive silicic acid
Bis- (trimethoxy silicon substrate) ethane of methyl esters, ethyl orthosilicate, positive silicic acid propyl ester, tetraethoxysilane hydrolysate, 1,6-, 1,6- are bis-
One or more of (trimethoxy silicon substrate) ethane, poly- methyltriethoxysilane；
The parts by weight of the crosslinking agent are 2~10 parts.
9. the thermally conductive Silica hydrogel of two-component condensed type according to claim 1, which is characterized in that the coupling agent is γ-ammonia
Propyl trimethoxy silicane, gamma-aminopropyl-triethoxy-silane, γ-(2,3 the third oxygen of epoxy) propyl trimethoxy silicane, γ-
(2,3 the third oxygen of epoxy) propyl-triethoxysilicane, N- (β-aminoethyl)-γ-aminopropyltrimethoxysilane and N- (β-ammonia second
Base) it is one or more of in-gamma-aminopropyl-triethoxy-silane；
The parts by weight of the coupling agent are 1~3 part.
10. a kind of preparation method of the thermally conductive Silica hydrogel of two-component condensed type, comprising the following steps:
The preparation of component A:
Based on parts by weight, by 35~60 parts of α, alpha, omega-dihydroxy polydimethyl siloxane and 40~60 parts of silicon powders 100~
It is stirred at 150 DEG C, keeps vacuum degree in 0.05~0.15MPa, revolving speed is 200~500r/min, stirs 30~80min；
Temperature of charge is down to 50 DEG C hereinafter, 0.5~5 part of zinc compound of addition, is stirred under vacuum 5~20min；
0.03~0.1 part of catalyst is added, is stirred under vacuum 10~30min, obtains component A；
B component preparation:
Based on parts by weight, by 30~55 parts of alkoxy end-capped dimethyl silicone polymers and 40~60 parts of silicon powders 100~150
It is stirred at DEG C, keeps vacuum degree in 0.05~0.15MPa, revolving speed is 200~500r/min, stirs 30~80min；
Temperature of charge is down to 50 DEG C hereinafter, 2~10 parts of crosslinking agents of addition, are stirred under vacuum 5~20min；
1~5 part of coupling agent is added, is stirred under vacuum 10~30min, obtains B component；
The mass ratio of the component A and B component is 1:(0.9~1.1).
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110591638A (en) * | 2019-11-04 | 2019-12-20 | 镇江博慎新材料有限公司 | Low-proportion bi-component dealcoholized organosilicon sealant and preparation method and application thereof |
| CN111849367A (en) * | 2020-07-22 | 2020-10-30 | 三峡大学 | High-molecular strip-shaped sheet material for improving sealing and fitting performance of mask and preparation method thereof |
| CN112662370A (en) * | 2020-12-16 | 2021-04-16 | 江西晨光新材料股份有限公司 | Single-component dealcoholized silicone sealant and preparation method thereof |
| CN112724925A (en) * | 2020-12-29 | 2021-04-30 | 广州市白云化工实业有限公司 | Two-component organic silicon packaging adhesive and preparation method and application thereof |
| CN113493614A (en) * | 2021-08-03 | 2021-10-12 | 广东聚思新材料科技有限公司 | High-efficiency bonding bi-component room temperature vulcanized silicone rubber and preparation method thereof |
| CN114874744A (en) * | 2022-05-11 | 2022-08-09 | 福建省三棵树新材料有限公司 | Mildew-proof beauty glue for interior decoration and preparation method thereof |
| CN115678493A (en) * | 2022-11-25 | 2023-02-03 | 江西蓝星星火有机硅有限公司 | Equal-proportion two-component dealcoholized silicone rubber and preparation method thereof |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110591638A (en) * | 2019-11-04 | 2019-12-20 | 镇江博慎新材料有限公司 | Low-proportion bi-component dealcoholized organosilicon sealant and preparation method and application thereof |
| CN110591638B (en) * | 2019-11-04 | 2021-10-19 | 镇江博慎新材料有限公司 | Low-proportion bi-component dealcoholized organosilicon sealant and preparation method and application thereof |
| CN111849367A (en) * | 2020-07-22 | 2020-10-30 | 三峡大学 | High-molecular strip-shaped sheet material for improving sealing and fitting performance of mask and preparation method thereof |
| CN112662370A (en) * | 2020-12-16 | 2021-04-16 | 江西晨光新材料股份有限公司 | Single-component dealcoholized silicone sealant and preparation method thereof |
| CN112662370B (en) * | 2020-12-16 | 2022-10-28 | 江西晨光新材料股份有限公司 | Single-component dealcoholized silicone sealant and preparation method thereof |
| CN112724925A (en) * | 2020-12-29 | 2021-04-30 | 广州市白云化工实业有限公司 | Two-component organic silicon packaging adhesive and preparation method and application thereof |
| CN112724925B (en) * | 2020-12-29 | 2022-08-02 | 广州市白云化工实业有限公司 | Two-component organic silicon packaging adhesive and preparation method and application thereof |
| CN113493614A (en) * | 2021-08-03 | 2021-10-12 | 广东聚思新材料科技有限公司 | High-efficiency bonding bi-component room temperature vulcanized silicone rubber and preparation method thereof |
| CN113493614B (en) * | 2021-08-03 | 2022-08-19 | 广东聚思新材料科技有限公司 | High-efficiency bonding bi-component room temperature vulcanized silicone rubber and preparation method thereof |
| CN114874744A (en) * | 2022-05-11 | 2022-08-09 | 福建省三棵树新材料有限公司 | Mildew-proof beauty glue for interior decoration and preparation method thereof |
| CN115678493A (en) * | 2022-11-25 | 2023-02-03 | 江西蓝星星火有机硅有限公司 | Equal-proportion two-component dealcoholized silicone rubber and preparation method thereof |
| CN115678493B (en) * | 2022-11-25 | 2024-04-09 | 江西蓝星星火有机硅有限公司 | Equal-proportion double-component dealcoholized silicone rubber and preparation method thereof |
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