CN110240829A - A kind of thin-film package ink - Google Patents

A kind of thin-film package ink Download PDF

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Publication number
CN110240829A
CN110240829A CN201910485930.3A CN201910485930A CN110240829A CN 110240829 A CN110240829 A CN 110240829A CN 201910485930 A CN201910485930 A CN 201910485930A CN 110240829 A CN110240829 A CN 110240829A
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CN
China
Prior art keywords
thin
film package
package ink
film
resin
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Pending
Application number
CN201910485930.3A
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Chinese (zh)
Inventor
王允军
方龙
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Suzhou Xingshuo Nanotech Co Ltd
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Suzhou Xingshuo Nanotech Co Ltd
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Priority to CN201910485930.3A priority Critical patent/CN110240829A/en
Publication of CN110240829A publication Critical patent/CN110240829A/en
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/02Printing inks
    • C09D11/03Printing inks characterised by features other than the chemical nature of the binder
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/30Inkjet printing inks
    • C09D11/38Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/50Sympathetic, colour changing or similar inks

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Packages (AREA)

Abstract

The invention discloses a kind of thin-film package ink, which includes light diffusing agent, monomer, resin, initiator and solvent, and by weight percentage, light diffusing agent accounts for 0.1~2wt% of thin-film package ink.The thin-film package ink of the application can realize light diffusion function while obstructing steam and oxygen.

Description

A kind of thin-film package ink
Technical field
The application belongs to field of nanometer material technology, in particular to a kind of thin-film package ink.
Background technique
Quantum dot has unique excellent optical property, can be widely applied to the fields such as display, illumination.By quantum dot material Material is used for display field, can be obviously improved the colour gamut of display.
Quanta point material is usually formulated as quantum dot ink, forms quantum dot by modes such as printing, transfer, spin coatings Film.But quanta point material is easy to be influenced by oxygen, steam and other factors in external environment, leads to its stability It is poor, it is unable to satisfy the requirement of display, lighting area to quantum dot membrane stability.The prior art encapsulates inorganic on quantum dot film And organic film, prevent steam and oxygen from penetrating on quantum dot film, to improve the stability of quantum dot film.However, this Packaging film will affect the light extraction efficiency of quantum dot film, limit the application of quantum dot film.
Summary of the invention
In view of the above technical problems, the application provides a kind of thin-film package ink, which can encapsulate hair Light film or luminescent device, especially quantum dot film, and light diffusion function is realized simultaneously.
This application provides a kind of thin-film package ink, including monomer, resin, initiator and solvent, thin-film package ink It further include light diffusing agent in water, the light diffusing agent is dispersed in the thin-film package ink.
Preferably, by weight percentage, the light diffusing agent accounts for the 0.1~2% of thin-film package ink.
Preferably, the light diffusing agent is inorganic light diffusing agent, and the inorganic light diffusing agent includes nano-titanium oxide, nanometer Aluminium oxide, nano barium sulfate, nanometer calcium carbonate, nano zircite, at least one of nano silica.
Preferably, by weight percentage, the monomer accounts for the 15~30% of the thin-film package ink, and the resin accounts for this The 15~30% of thin-film package ink, the initiator account for the 0.1~10% of the thin-film package ink, and the solvent accounts for the film Encapsulate the 50~65% of ink.
Preferably, the boiling point of the resin and the monomer is greater than 300 DEG C, and the boiling point of the solvent is less than 250 DEG C.
Preferably, the resin includes acrylic resin, epoxy resin, polyurethane, styrene resin, polyolefin resin, At least one of polyoxyalkylene resin.
It preferably, further include low polymer in the thin-film package ink, the boiling point of the low polymer is greater than 300 DEG C.
Preferably, the low polymer includes polyethylene glycol acrylate and its derivative, triethylene glycol diacrylate And its derivative, triethyleneglycol acrylate and its derivative, diethylene glycol diacrylate and its derivative, diethylene glycol third Olefin(e) acid ester and its derivative, at least one of alkyl methacrylate and its derivative.
It preferably, further include volatile monomers in the thin-film package ink, the boiling point of the volatile monomers is less than 250 ℃。
It preferably, further include crosslinking agent in the thin-film package ink.
The application is by being added light diffusing agent in thin-film package ink, so that packaging film has light diffusion function, and And light diffusing agent is dispersed in packaging film, further improve the ability of packaging film barrier steam and oxygen.Meanwhile Light diffusing agent is incorporated in packaging film, but also light diffusing agent is dispersed and protected well.
Specific embodiment
Below in conjunction with the application embodiment, technical solutions in the embodiments of the present application is described in detail.It answers It is noted that described embodiment is only a part of embodiment of the application, rather than whole embodiments.
In order to protect quantum dot film from the influence of water oxygen in external environment and other factors, the prior art will be organic thin Film encapsulation ink jet is printed upon on quantum dot film and is formed by curing packaging film, with blocking oxygen and steam, improves quantum dot The stability of film.
Certainly, thin-film package ink is not limited to the application of inkjet printing technology, can also pass through the modes such as transfer, spin coating Packaging film is formed on quantum dot film.The thin-film package ink of the application is not limited with application apparatus and application mode.For example, Organic film encapsulates ink can also be after first film-forming, then is adhered on quantum dot film by the modes such as being bonded or imprinting.
This application discloses a kind of thin-film package ink with light diffusion function.The thin-film package ink includes monomer, Resin, initiator and solvent further include light diffusing agent, and the light diffusing agent is dispersed in the thin-film package ink.By weight hundred Divide than meter, the light diffusing agent accounts for the 0.1~2% of thin-film package ink.
In a specific embodiment of the invention, the light diffusing agent is inorganic light diffusing agent, the inorganic light diffusing agent packet Include nano-titanium oxide, nano aluminium oxide, nano barium sulfate, nanometer calcium carbonate, nano zircite, in nano silica at least It is a kind of.
The application is by being added light diffusing agent in thin-film package ink, so that there is packaging film light to spread function Can, and light diffusing agent is dispersed in packaging film, further improves the ability of packaging film barrier steam and oxygen.And incite somebody to action Light diffusing agent is incorporated in packaging film, but also light diffusing agent is dispersed and protected well.
In addition, current thin film encapsulates ink in solidification process, since inkjet printing needs the regular hour, so that successively The ink cured degree of inkjet printing is different, and the solidification process of film is uncontrollable, so as to cause the packaging film eventually formed It is in uneven thickness, affect its overall structure and its optical property.
In a specific embodiment of the invention, a kind of thin-film package ink is also disclosed, which includes light Diffusant, monomer, resin, initiator and solvent, wherein by weight percentage, light diffusing agent accounts for the 0.1 of thin-film package ink ~2wt%, monomer account for 15~30wt% of thin-film package ink, and resin accounts for 15~30wt% of thin-film package ink, initiator 0.1~10wt% of thin-film package ink is accounted for, solvent accounts for 50~65wt% of thin-film package ink, wherein the resin and institute The boiling point for stating monomer is greater than 300 DEG C, and the boiling point of the solvent is less than 250 DEG C.
The thin-film package ink of the application includes that volatile component of the boiling point less than 250 DEG C and boiling point are greater than 300 DEG C Nonvolatile element, and make volatile component and nonvolatile element boiling point difference be greater than 50 DEG C, it is thus achieved that compared with Volatile component vapors away in short time and nonvolatile element block can remain very much, thus the thin-film package of front and back printing For ink in film forming, the thickness of film will not differ too big, convenient for the control of thin-film package ink film forming procedure.That is, the application Thin-film package ink after inkjet printing is complete, can film-forming in a short time be formed by thinner package and after this The thickness of film will not change too much, and the thickness change of film forming is small, keep stablizing.The packaging film that front and back prints as a result, Thickness is essentially identical, does not have too big fluctuation, thus the monitoring for packaging film print procedure of being more convenient for, and finally formed The thickness of packaging film is relatively uniform, and homogeneity is high.
On the contrary, the component for needing to vapor away such as solvent is waved if the component boiling point difference in thin-film package ink is closer Hair property monomer etc., the component, such as resin, non-volatile monomeric etc. that cannot be vapored away in the short time, and need to remain, again It cannot be deposited in short time, this will make the thickness of the packaging film of inkjet printing show over time not Stack pile is not easy to the monitoring of packaging film print procedure very much.And respectively not due to the thickness of the packaging film of front and back printing Identical, the thickness of finally formed packaging film can be very uneven, influences the overall structure and optical property of packaging film.
In brief, the volatility of current thin film encapsulation ink is difficult to control, and the thickness to form a film in print procedure cannot be protected It is fixed to keep steady.And the thin-film package ink of the application volatility within one section of unit time is controllable, the film shrinkage of ink is able to maintain Unanimously, to ensure that the homogeneity finally to form a film.
In the application, contain light diffusing agent in the thin-film package ink, so that packaging film has light diffusion function. It should be noted that the light diffusing agent is distributed in packaging film, can not obscure with the light diffusing agent in quantum dot film.In addition, Containing also not conflicting in light diffusing agent and quantum dot film containing light diffusing agent in the packaging film, the two can also be simultaneous total.Contain The packaging film is especially attached on quantum stippling film (CF) by the packaging film of light diffusing agent when being applied to display field Afterwards, the visible angle of display can be made to be greater than 135%, the high colour gamut feature of incorporating quantum stippling film, display is shown Show that effect is significantly improved.
In addition, the light diffusing agent in thin-film package ink is inorganic light diffusing agent.Since inorganic light diffusing agent is than organic light Diffusant more blocks water oxygen, by adding inorganic light diffusing agent in the ink, can be further improved packaging film barrier water The ability of vapour and oxygen.Also, it disperses the inorganic light diffusing agent in packaging film, by the fixation of packaging film, also makes Inorganic light diffusing agent is obtained to be dispersed and protected well.
In the specific embodiment of the application, the inorganic light diffusing agent in thin-film package ink may be selected to be nano oxidized Titanium, nano aluminium oxide, nano barium sulfate, nanometer calcium carbonate, nano zircite, or, nano silica etc..
In the specific embodiment of the application, thin-film package ink causes in addition to containing light diffusing agent, monomer, resin Except agent and solvent, also contain low polymer, the boiling point of the low polymer is greater than 300 DEG C.By adding in thin-film package ink Enter low polymer, the inconsistent problem of film shrinkage when can be further reduced ink dried film forming further increases ink Homogeneity when film forming.It should be noted that it has been generally acknowledged that more than dimerization, molecular weight 104Low polymer (oligomerisation is all cried below Object).Such as dimer (dimer), tripolymer (trimer), the tetramer (tetramer).Low polymer includes polyethylene glycol third Olefin(e) acid ester and its derivative, triethylene glycol diacrylate and its derivative, triethyleneglycol acrylate and its derivative, diethyl Omega-diol diacrylate and its derivative, diethylene glycol acrylate and its derivative, alkyl methacrylate and its derivative At least one of object.
In the specific embodiment of the application, thin-film package ink contains light diffusing agent, monomer, resin, initiator and Solvent, the solvent may be selected to be butyl glycol ether, dimethyl-imidazolinone, 2-Butoxyethyl acetate, diethylene glycol list first Ether, butyl, diethylene glycol ether, at least one of diethylene glycol ethylmethyl ether.
In the specific embodiment of the application, thin-film package ink causes in addition to containing light diffusing agent, monomer, resin Agent and solvent, also contain volatile monomers, and the boiling point of the volatile monomers is less than 250 DEG C.For example, the volatile monomers may be selected For 2-Propenoic acid, 2-methyl-, octyl ester, decyl-octyl methacrylate, 4- hydroxy butyl vinyl ether, hydroxy-ethyl acrylate, methacrylic acid hydroxypropyl Ester, Isooctyl acrylate monomer, hydroxypropyl acrylate, at least one of hydroxy propyl methacrylate.
In the specific embodiment of the application, thin-film package ink causes in addition to containing light diffusing agent, monomer, resin Agent and solvent further include crosslinking agent.For example, the crosslinking agent may be selected to be trimethylolpropane trimethacrylate, pentaerythrite three Acrylate, pentaerythritol tetraacrylate, Dipentaerythritol Pentaacrylate, in six pentaerythrites, six acrylate at least It is a kind of.
In the specific embodiment of the application, thin-film package ink contains light diffusing agent, monomer, resin, initiator and Solvent.The boiling point of the monomer and the resin is both greater than 300 DEG C.For example, the resin may be selected to be acrylic resin, epoxy resin, Styrene resin, polyolefin resin, polyoxyalkylene resin or their mixture.For example, the monomer may be selected to be acrylic acid Isobornyl thiocyanoacetate monomer (IBOA), isobornyl methacrylate (IBOMA), trimethylolpropane trimethacrylate (TMPTA), two Contracting tripropylene glycol diacrylate (TPGDA) etc..
It should be noted that containing initiator in the application thin-film package ink, which can be photoinitiator It can be thermal initiator, both may be used.For example, the initiator is photoinitiator, which is TPO (2,4,6- trimethyls Benzoyl-diphenyl phosphine oxide).
In the specific embodiment of the application, thin-film package ink contains light diffusing agent, monomer, resin, initiator and Solvent.Wherein, by weight percentage, light diffusing agent accounts for the 1wt% of thin-film package ink, and monomer accounts for thin-film package ink 20wt%, resin account for the 15wt% of thin-film package ink, and initiator accounts for the 4wt% of thin-film package ink, and solvent accounts for thin-film package The 60wt% of ink, wherein the boiling point of the resin and the monomer is greater than 300 DEG C, and the boiling point of the solvent is less than 250 DEG C.
In the specific embodiment of the application, thin-film package ink contains light diffusing agent, monomer, resin, initiator and Solvent.Wherein, by weight percentage, light diffusing agent accounts for the 1wt% of thin-film package ink, and monomer accounts for thin-film package ink 25wt%, resin account for the 15wt% of thin-film package ink, and initiator accounts for the 4wt% of thin-film package ink, and solvent accounts for thin-film package The 55wt% of ink, wherein the boiling point of the resin and the monomer is greater than 300 DEG C, and the boiling point of the solvent is less than 250 DEG C.
In the specific embodiment of the application, thin-film package ink includes light diffusing agent, monomer, resin, initiator and Solvent.Wherein, by weight percentage, light diffusing agent accounts for the 2wt% of thin-film package ink, and monomer accounts for thin-film package ink 25wt%, resin account for the 20wt% of thin-film package ink, and initiator accounts for the 3wt% of thin-film package ink, and solvent accounts for thin-film package The 50wt% of ink, wherein the boiling point of the resin and the monomer is greater than 300 DEG C, and the boiling point of the solvent is less than 250 DEG C.
In addition, it is necessary to explanation, the component of the application thin-film package ink can also be with the quantum of wanted barrier protection The ingredient of point film is close, i.e. the gel component of quantum dot film and the component of packaging film is identical or close, thus the envelope of being more convenient for Dress film fits with quantum dot film.Certainly, can also have inorganic encapsulated film between packaging film and quantum dot film, with Further increase the ability for the oxygen that blocks water.
To sum up, being waved in thin-film package ink in the application comprising easy volatile solvent and difficult vaporized monomers and resin Less than 250 DEG C, the boiling point of non-volatile resin, monomer and low polymer is greater than for the solvent of hair property and the boiling point of volatile monomers 300 DEG C, thus, it is possible to realize that volatile component is enabled to vapor away and nonvolatile element very block guarantor within many short time It stays, so that the thickness of film will not differ too big when the ink film forming of front and back printing, is convenient for thin-film package ink film forming procedure Control.
Also, by the way that light diffusing agent is added in thin-film package ink, it can make packaging film that there is light diffusion function, And the light diffusing agent is dispersed in packaging film, further improves the ability of packaging film barrier steam and oxygen.
Although inventor has done more detailed elaboration to the technical solution of the application and has enumerated, it should be understood that for For those skilled in the art, above-described embodiment is modified and/or the flexible or equivalent alternative solution of use is obvious , cannot all be detached from the essence of the application spirit, the term occurred in the application be used for elaboration to technical scheme and Understand, the limitation to the application can not be constituted.

Claims (10)

1. a kind of thin-film package ink, including monomer, resin, initiator and solvent, which is characterized in that the thin-film package ink In further include light diffusing agent, the light diffusing agent is dispersed in the thin-film package ink.
2. thin-film package ink according to claim 1, which is characterized in that by weight percentage, the light diffusing agent Account for the 0.1~2% of thin-film package ink.
3. thin-film package ink according to claim 1, which is characterized in that the light diffusing agent is inorganic light diffusing agent, The inorganic light diffusing agent includes nano-titanium oxide, nano aluminium oxide, nano barium sulfate, nanometer calcium carbonate, and nano zircite is received At least one of rice silica.
4. thin-film package ink according to claim 1, which is characterized in that by weight percentage,
The monomer accounts for the 15~30% of the thin-film package ink, and the resin accounts for the 15~30% of the thin-film package ink, institute Initiator accounts for the thin-film package ink 0.1~10% is stated, the solvent accounts for the 50~65% of the thin-film package ink.
5. thin-film package ink according to claim 1, which is characterized in that the boiling point of the resin and the monomer is greater than 300 DEG C, the boiling point of the solvent is less than 250 DEG C.
6. thin-film package ink according to claim 1, which is characterized in that the resin includes acrylic resin, epoxy Resin, polyurethane resin, styrene resin, polyolefin resin, at least one of polyoxyalkylene resin.
7. thin-film package ink according to claim 1, which is characterized in that further include oligomeric in the thin-film package ink Object is closed, the boiling point of the low polymer is greater than 300 DEG C.
8. thin-film package ink according to claim 7, which is characterized in that the low polymer includes polyethylene glycol propylene Acid esters and its derivative, triethylene glycol diacrylate and its derivative, triethyleneglycol acrylate and its derivative, diethyl two Alcohol diacrylate and its derivative, diethylene glycol acrylate and its derivative, alkyl methacrylate and its derivative At least one of.
9. thin-film package ink according to claim 1, which is characterized in that further include volatilization in the thin-film package ink Property monomer, the boiling point of the volatile monomers is less than 250 DEG C.
10. thin-film package ink according to claim 1, which is characterized in that further include handing in the thin-film package ink Join agent.
CN201910485930.3A 2019-06-05 2019-06-05 A kind of thin-film package ink Pending CN110240829A (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102057750A (en) * 2008-04-09 2011-05-11 新加坡科技研究局 Multilayer film for encapsulating oxygen and/or moisture sensitive electronic devices
CN102088048A (en) * 2010-12-21 2011-06-08 杭州杭科光电有限公司 Packaging technology of light-emitting diodes
CN103996799A (en) * 2013-02-14 2014-08-20 三星显示有限公司 Organic electroluminescent device having thin film encapsulation structure and method of fabricating the same
CN107245222A (en) * 2017-06-06 2017-10-13 明光市泰丰新材料有限公司 A kind of LED encapsulation material and preparation method thereof
CN109096823A (en) * 2018-06-28 2018-12-28 北京中科纳通电子技术有限公司 The preparation method of quantum dot film and its application in a liquid crystal display

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102057750A (en) * 2008-04-09 2011-05-11 新加坡科技研究局 Multilayer film for encapsulating oxygen and/or moisture sensitive electronic devices
CN102088048A (en) * 2010-12-21 2011-06-08 杭州杭科光电有限公司 Packaging technology of light-emitting diodes
CN103996799A (en) * 2013-02-14 2014-08-20 三星显示有限公司 Organic electroluminescent device having thin film encapsulation structure and method of fabricating the same
CN107245222A (en) * 2017-06-06 2017-10-13 明光市泰丰新材料有限公司 A kind of LED encapsulation material and preparation method thereof
CN109096823A (en) * 2018-06-28 2018-12-28 北京中科纳通电子技术有限公司 The preparation method of quantum dot film and its application in a liquid crystal display

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
王文广: "《十三五"普通高等教育本科规划教材 聚合物改性原理》", 31 March 2018, 中国轻工业出版社 *

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