CN110238999A - A kind of mobile mould mold core of light-conducting board mold - Google Patents
A kind of mobile mould mold core of light-conducting board mold Download PDFInfo
- Publication number
- CN110238999A CN110238999A CN201910466702.1A CN201910466702A CN110238999A CN 110238999 A CN110238999 A CN 110238999A CN 201910466702 A CN201910466702 A CN 201910466702A CN 110238999 A CN110238999 A CN 110238999A
- Authority
- CN
- China
- Prior art keywords
- groove
- mobile mould
- light
- mold core
- mould mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 36
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 18
- 230000001788 irregular Effects 0.000 abstract description 20
- 238000009792 diffusion process Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 5
- 229910003460 diamond Inorganic materials 0.000 description 5
- 239000010432 diamond Substances 0.000 description 5
- 238000005282 brightening Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/24—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass dies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
Abstract
The present invention provides a kind of mobile mould mold core of light-conducting board mold, including it is characterized by comprising mobile mould mold cores, the mobile mould mold core includes the forming surface for being coated with nickel layer, the forming surface for being coated with nickel layer is equipped with groove, the shape of the cross section of the groove includes arc-shaped, V-arrangement or trapezoidal, the both sides of edges of the mobile mould mold core forming surface groove is equipped with the chain-wales without the groove that width is N, and the range of N is 0.1mm-0.5mm, and the long side of the chain-wales is parallel with the groove.The mobile mould mold core of light-conducting board mold of the present invention is equipped with chain-wales, in mold formed light conductive plate, the chain-wales can form irregular U-shaped structure on light guide plate, B side wall, that is, burr of irregular U-shaped structure or the height of flash are equal to or less than its A Sidewall Height, that is, light guide plate height, when being assembled into backlight, the burr flash of light guide plate of the present invention would not withstand diffusion sheet, and not will lead to can not assemble in place between each accessory of backlight.
Description
Technical field
The present invention relates to a kind of mold core more particularly to a kind of mobile mould mold cores of light-conducting board mold.
Background technique
The structure and quality of light guide plate are mainly put to death in the structure and quality of the mobile mould mold core of light-conducting board mold.
The mobile mould mold core of existing light-conducting board mold generates abrasion in compressed action, what the light guide plate of production will appear
Burr flash, the height H of burr can exceed strip raised line and light-emitting surface height K.
In the manufacturing process of existing light guide plate, current existing light guide plate light-emitting surface optical microstructures, if Fig. 7, Fig. 8 institute
Show, arc-shaped, inverted V-shaped, it is trapezoidal be common three kinds of current light-emitting surface optical microstructures of use structure, such as Fig. 9, Figure 10, Figure 11
It is shown.
And wherein arc-shaped raised line is most, as shown in figure 9, we are illustrated for it, it is characterized in that: strip
Raised line circular arc optical microstructures are arranged along the width direction array of light conducting plate body, after arc radius size is decided,
Interval S is greater than the chord length M that its circular arc intersects with light guide plate, has a bit of platform among them and is separated by.
In addition light-guide edge face can be because there is in vertical exhaust clearance or manufacturing process forming part due to compressing mould
Tool movement generates abrasion and the burr flash of appearance, the height H of burr can exceed strip raised line and light-emitting surface height K, this has
Railway Project generates:
1) when being assembled into backlight, burr flash can withstand diffusion sheet, and causing can not between each accessory of backlight
In place, common treating method is exactly to increase acute edge polishing process but the expensive machinery of chamfered edge polishing process complexity for assembly.
2) simple burr does not meet client to the requirement of light guide plate product appearance.
3) it is possible to show as lousiness when edge burr is minimum, is possible to pollute light-emitting surface when taking out mold, it is guide-lighting
Panel products cause unqualified.
Summary of the invention
Based on the deficiencies of the prior art, it is an object of the present invention to a kind of mobile mould moulds of light-conducting board mold
Core is equipped with chain-wales, and in mold formed light conductive plate, the chain-wales can form irregular concave knot on light guide plate
Structure, irregular stepped ramp type structure perhaps the irregular U-shaped structure irregular concave structure, irregular stepped ramp type structure or
B side wall, that is, burr of irregular U-shaped structure or the height of flash are equal to or less than its A Sidewall Height, that is, light guide plate height,
That is the height of the burr flash height that is equal to or less than light guide plate, the height of the highest of burr flash without departing from light guide plate
0.02mm, when being assembled into backlight, the burr flash of light guide plate of the present invention would not withstand diffusion sheet, not will lead to backlight
Each accessory between can not assemble in place.
To achieve the goals above, the present invention provides a kind of mobile mould mold cores of light-conducting board mold, including its feature to exist
In: including mobile mould mold core, the mobile mould mold core includes the forming surface for being coated with nickel layer, and the forming surface for being coated with nickel layer is equipped with
Equipped with groove, the shape of the cross section of the groove includes arc-shaped, V-arrangement or trapezoidal, the mobile mould mold core forming surface groove
Both sides of edges be equipped with the chain-wales equipped with the groove that width is N, the range of N is 0.1mm-0.5mm, the chain-wales
Long side is parallel with the groove.
The improvement of mobile mould mold core as light-conducting board mold of the present invention, the mobile mould mold core of light-conducting board mold of the present invention
The cross section of the groove be it is arc-shaped, all radius R1 of the circular arc are equal or unequal, radius R1 range be 20 μm-
200 μm, it is connected or is not attached between the adjacent circular arc of the adjacent trenches, the chord length M of the circular arc is the same or different than two
Interval S 1 between the center of adjacent circular arc, S1 range are 5 μm -50 μm, and the highest point of the circular arc of the groove is lower than described
Chain-wales H1, H1 range is 15 μm -30 μm, and the crosspoint of two adjacent circular arcs to the minimum point height of arc groove is K1, K1 value
Range is 1 μm -15 μm.
The improvement of mobile mould mold core as light-conducting board mold of the present invention, the mobile mould mold core of light-conducting board mold of the present invention
The R1 range is 38.50 μm, and the S1 is 18 μm, and the H1 is 23.50 μm, and the K1 is 3.5 μm.
The improvement of mobile mould mold core as light-conducting board mold of the present invention, the mobile mould mold core of light-conducting board mold of the present invention
The cross section of the groove is V-arrangement, and the width S 2 of the V-arrangement is equal or unequal, and the maximum width S2 range of the V-arrangement is
5 μm -50 μm, the adjacent highest point of the adjacent V-arrangement of the adjacent trenches is connected or is not attached to, the V-arrangement highest of the groove
Point is lower than the chain-wales H2, and H2 value range is 15-30 μm, and the depth of the V-arrangement of the groove is K2, K2 value range
It is 1-15 μm.
The improvement of mobile mould mold core as light-conducting board mold of the present invention, the mobile mould mold core of light-conducting board mold of the present invention
The S2 is 35.58 μm, and the H2 is 23.55 μm, and the K1 range is 0.3-0.4 μm.
The improvement of mobile mould mold core as light-conducting board mold of the present invention, the mobile mould mold core of light-conducting board mold of the present invention
The cross section of the groove be it is trapezoidal, the trapezoidal maximum width S3 is equal or unequal, the trapezoidal maximum width
S3 width is 5 μm -50 μm, and the adjacent highest point of the adjacent trapezoidal of the adjacent trenches is connected or is not attached to, the institute of the groove
Trapezoidal highest point is stated lower than chain-wales H3, H3 value range is 15-30 μm, and the trapezoidal height of the groove is K3,
K3 value range is 1-15 μm.
The improvement of mobile mould mold core as light-conducting board mold of the present invention, the mobile mould mold core of light-conducting board mold of the present invention
The S3 is 33.60 μm, and the H3 is 22.75 μm, and the K3 is 3.37 μm.
Compared with prior art, the mobile mould mold core of light-conducting board mold of the present invention has the advantages that the present invention
The mobile mould mold core of light-conducting board mold is equipped with chain-wales, and in mold formed light conductive plate, the chain-wales can be on light guide plate
Irregular concave structure, irregular stepped ramp type structure or irregular U-shaped structure are formed, the irregular concave structure is not advised
Then the height of the B of stepped ramp type structure or irregular U-shaped structure side wall, that is, burr or flash is equal to or less than its A Sidewall Height
That is the height of light guide plate, the i.e. height of burr flash are equal to or less than the height of light guide plate, and the highest of burr flash will not surpass
The height 0.02mm of light guide plate out, when being assembled into backlight, the burr flash of light guide plate of the present invention would not withstand diffusion sheet,
Not will lead to can not assemble in place between each accessory of backlight.
Detailed description of the invention
Fig. 1 is the mobile mould mold core of light-conducting board mold in the mobile mould mold core preferred embodiment of light-conducting board mold of the present invention
Perspective view.
Fig. 2 is the mobile mould mold core of light-conducting board mold in the mobile mould mold core preferred embodiment of light-conducting board mold of the present invention
Main view.
Fig. 3 is the mobile mould mold core of light-conducting board mold in the mobile mould mold core preferred embodiment of light-conducting board mold of the present invention
A-A sectional view.
Fig. 4 is the mobile mould mold core of light-conducting board mold in the mobile mould mold core preferred embodiment of light-conducting board mold of the present invention
The partial enlarged view in the portion A in A-A sectional view.
Fig. 5 is the mobile mould mold core of light-conducting board mold in the mobile mould mold core other embodiments one of light-conducting board mold of the present invention
A-A sectional view in the portion A partial enlarged view.
Fig. 6 is the mobile mould mold core of light-conducting board mold in the mobile mould mold core other embodiments two of light-conducting board mold of the present invention
A-A sectional view in the portion A partial enlarged view.
Fig. 7 is the structural schematic diagram of light guide plate in the prior art.
Fig. 8 is the C-C sectional view of light guide plate in the prior art.
Fig. 9 is the partial enlargement Fig. 1 in the portion A in the C-C sectional view of light guide plate in the prior art.
Figure 10 is the partial enlargement Fig. 2 in the portion A in the C-C sectional view of light guide plate in the prior art.
Figure 11 is the partial enlargement Fig. 3 in the portion A in the C-C sectional view of light guide plate in the prior art.
Figure 12 is the light guide plate perspective view made using the mobile mould mold core of light-conducting board mold of the present invention.
Figure 13 is the C-C section of the perspective view of the light guide plate made using the mobile mould mold core of light-conducting board mold of the present invention
Figure.
Figure 14 is the C-C sectional view of the perspective view of the light guide plate made using the mobile mould mold core of light-conducting board mold of the present invention
Partial enlargement Fig. 1, h1 < h2 in the middle portion G.
Figure 15 is the structural schematic diagram of light guide plate in the prior art in the backlight.
Figure 16 is the partial enlarged view in the portion B in the structural schematic diagram of light guide plate in the prior art in the backlight.
Figure 17 is the structural schematic diagram of light guide plate of the present invention in the backlight.
Figure 18 is the partial enlarged view in the portion E in the structural schematic diagram of light guide plate of the present invention in the backlight.
Specific embodiment
The mobile mould mold core of light-conducting board mold of the present invention, which is suitable for making, various makees light guide plate.
With reference to Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5 and Fig. 6, the mobile mould mold core of the present invention is described in detail light-conducting board mold it is excellent
Select embodiment and other embodiments.
The present invention provides a kind of mobile mould mold core of light-conducting board mold, including it is characterized by comprising mobile mould mold core 1,
The mobile mould mold core 1 includes being coated with the forming surface 1.1 of nickel layer, described to be coated in the forming surface of nickel layer 1.1 and be equipped with groove
1.1.1, the shape of the cross section of the groove 1.1.1 includes arc-shaped, V-arrangement or trapezoidal, the mobile mould mold core forming surface ditch
The both sides of edges of slot is equipped with the fluted chain-wales 1.1.2 that sets that width is N, and the range of N is 0.1mm-0.5mm, described small flat
The long side of platform 1.1.2 is parallel with the groove 1.1.1.
In the present embodiment, the cross section of the groove 1.1.1 of the mobile mould mold core of light-conducting board mold of the present invention is circle
All radius R1 of arc, the circular arc are equal or unequal, and radius R1 range is 20 μm -200 μm, the adjacent trenches
1.1.1 it is connected or is not attached between adjacent circular arc, the chord length M of the circular arc is the same or different than the center of two adjacent circular arcs
Between interval S 1, S1 range is 5 μm -50 μm, and the highest point of the circular arc of the groove is lower than the chain-wales H1, H1 19
μm, the crosspoint of two adjacent circular arcs is K1 to the minimum point height of arc groove 1.1.1, and K1 range is 1 μm -15 μm.
In the present embodiment, the R1 range of the mobile mould mold core of light-conducting board mold of the present invention is 38.50 μm, the S1
It is 18 μm, the H1 is 23.50 μm, and the K1 is 3.5 μm.
In other embodiments, the cross section of the groove 1.1.1 of the mobile mould mold core of light-conducting board mold of the present invention is V
The width S 2 of shape, the V-arrangement is equal or unequal, and the maximum width S2 range of the V-arrangement is 5 μm -50 μm, the adjacent ditch
The adjacent highest point of the adjacent V-arrangement of slot 1.1.1 is connected or is not attached to, and the V-arrangement highest point of the groove 1.1.1 is lower than described
Chain-wales H2, H2 value range is 15-30 μm, and the depth of the V-arrangement of the groove 1.1.1 is K2, and K2 value range is 1-
15μm。
In other embodiments, the S2 of the mobile mould mold core of light-conducting board mold of the present invention is 35.58 μm, and the H2 is
23.55 μm, the K1 range is 3-4 μm.
In other embodiments, the cross section of the groove 1.1.1 of the mobile mould mold core of light-conducting board mold of the present invention is
Trapezoidal, the trapezoidal maximum width S3 is equal or unequal, and the trapezoidal maximum width S3 width is 5 μm -50 μm, institute
State the adjacent trapezoidal of adjacent trenches 1.1.1 adjacent highest point be connected or be not attached to, the groove 1.1.1 it is described it is trapezoidal most
High point is lower than chain-wales H3, and H3 value range is 15-30 μm, and the trapezoidal height of the groove 1.1.1 is K3, K3 value
Range is 1-15 μm.
In other embodiments, the S3 of the mobile mould mold core of light-conducting board mold of the present invention is 33.60 μm, and the H3 is
22.75 μm, the K3 is 3.37 μm.
As shown in figures 15-16, it is mounted on using the light guide plate that the mobile mould mold core of light-conducting board mold in the prior art makes
In backlight, reflector plate 11, light guide plate 13, diffusion sheet 14, lower brightening piece 15, upper brightening piece 16, photomask 17, is led at frame 12
The flash that the flash 18 and the long side injecting glue of light guide plate that the long side injecting glue of tabula rasa generates generate forces empty station rank 19, due to the long side note of light guide plate
The presence for the flash 18 that glue generates leads to occur the flash that the long side injecting glue of light guide plate generates and forces empty station rank 19, and photomask 17 can not be with
Frame 12 fits closely.
As shown in figs. 17-18, backlight is mounted on using the light guide plate that the mobile mould mold core of light-conducting board mold of the present invention makes
In source, reflector plate 11, frame 12, light guide plate 13, diffusion sheet 14, lower brightening piece 15, upper brightening piece 16, photomask 17, irregular U
The A side wall 8.1 of type structure 8 and irregular U-shaped structure 8, since the height h1 of the B side wall 8.2 is high less than the A side wall 8.1
H2 is spent, photomask 17 is fitted closely with frame 12.
In the present embodiment, the technique of the mobile mould mold core of light-conducting board mold of the present invention is made, which is characterized in that it includes
The following steps:
(1) mobile mould mold core 1 is made.
(2) nickel layer 1.1 is plated in the forming surface of mobile mould mold core.
(3) processing is carried out to the non-forming face of mobile mould mold core 1.1 for having plated nickel layer and reaches design size requirement.
(4) preparation of precision CNC and its auxiliary tool required for making mobile mould mold core 1.1 are carried out.
A, prepare the accurate CNC that especially restructures, precision is installed in the Z-direction of CNC special up to micron level
The base of tool 3 and process tool 4, the base of tool 3 and process tool 4 can be moved up and down with Z-direction.
B, adjust the base of tool 3 and process tool 4 arrive working condition, allow the point of a knife 4.1 of the process tool 4 with it is described
After the work top 2 of CNC is vertical, the base of tool 3 and process tool 4 in processing with the Z axis of accurate CNC according to requiring and
It is dynamic.
C, one piece of sucker clamp 5 is placed in 2 center of work top of the CNC, and 5 length and width dimensions of sucker clamp compare institute
It states that mobile 1 length and width dimensions of mould mold core are big, and the working face for correcting the sucker clamp 5 is vertical with Z axis, controls the sucker clamp
The flatness of 5 working face is at 0.2 μm or less.
(5) the mobile mould mold core 1 is placed in sucker clamp 5, length direction is placed along Y-direction, corrects mobile mould mould
Core length and width are parallel with the XY axis of workbench.
(6) first time processing being carried out to mobile mould mold core nickel layer forming surface 1.1, the cutter 4 used is the diamond tool of Ra,
Ra is 20mm, finishes processing program, makes the effect of its surface infinite approach plane.
(7) then replacement profiling diamond tool carries out second of processing, and the point of a knife 4.1 is arranged and first time completes the process
Being coated with 1.1 distance of forming surface of nickel layer described in afterwards is zero.
(8) according to design requirement, the starting point of the point of a knife, final position and the two of the mobile mould mold core forming surface groove
Two chain-wales are reserved between side edge, the width of described two reserved chain-wales is respectively 0.4mm, the highest point of the groove
Lower than described two reserved chain-wales 0.03mm, processing program is finished, the control system of CNC is input to.
(9) work top 2 of the CNC is moved along X-axis or Y direction by the program substep finished, in the movement
It is coated with plane Milling Machining in the forming surface 1.1 of nickel layer described in mould mold core 1 and goes out groove.
(10) after processing is completed according to the machined parameters of setting, the groove of nickel layer working face is cleaned.
In the present embodiment, make nickel layer described in the technique of the mobile mould mold core of light-conducting board mold of the present invention with a thickness of
0.13mm。
In the present embodiment, the technique profiling diamond tool for making the mobile mould mold core of light-conducting board mold of the present invention passes through
Lathe produces corresponding groove to the forming surface 1.1 for being coated with nickel layer described in the mobile mould mold core 1.
In the present embodiment, the technique of the mobile mould mold core of production light-conducting board mold of the present invention is with profiling diamond tool to institute
The forming surface 1.1 for being coated with nickel layer for stating mobile mould mold core 1 carries out dado plane milling work.
In the present embodiment, the work of the technique profiling diamond tool of the mobile mould mold core of light-conducting board mold of the present invention is made
Face and the groove of the forming surface 1.1 for being coated with nickel layer of the mobile mould mold core 1 are mutually perpendicular to.
Compared with prior art, the invention has the following advantages: the mobile mould mold core of light-conducting board mold of the present invention
Equipped with chain-wales, in mold formed light conductive plate, the chain-wales can form irregular concave structure on light guide plate, not advise
Then stepped ramp type the structure perhaps irregular U-shaped structure irregular concave structure, irregular stepped ramp type structure or irregular U
B side wall, that is, burr of type structure or the height of flash are equal to or less than its A Sidewall Height, that is, light guide plate height, i.e. burr hair
The height on side is equal to or less than the height of light guide plate, the highest of burr flash without departing from light guide plate height 0.02mm,
When being assembled into backlight, the burr flash of light guide plate of the present invention would not withstand diffusion sheet, not will lead to each of backlight and match
It can not be assembled in place between part.
Above disclosed is only presently preferred embodiments of the present invention, cannot limit the right of the present invention with this certainly
Range, therefore according to equivalent variations made by scope of the present invention patent, it is still within the scope of the present invention.
Claims (7)
1. a kind of mobile mould mold core of light-conducting board mold, including it is characterized by comprising mobile mould mold core, the mobile mould mold cores
Forming surface including being coated with nickel layer, the forming surface for being coated with nickel layer are equipped with groove, the shape of the cross section of the groove
Including arc-shaped, V-arrangement or trapezoidal, it is N without described that the both sides of edges of the mobile mould mold core forming surface groove, which is equipped with width,
The range of the chain-wales of groove, N is 0.1mm-0.5mm, and the long side of the chain-wales is parallel with the groove.
2. the mobile mould mold core of light-conducting board mold according to claim 1, it is characterised in that: the cross section of the groove is
Arc-shaped, all radius R1 of the circular arc are equal or unequal, and radius R1 range is 20 μm -200 μm, the adjacent trenches
Adjacent circular arc between be connected or be not attached to, the chord length M of the circular arc is the same or different than between the center of two adjacent circular arcs
Interval S 1, S1 range are 5 μm -50 μm, and the highest point of the circular arc of the groove is lower than the chain-wales H1, and H1 range is 15
μm -30 μm, the crosspoint of two adjacent circular arcs is K1 to the minimum point height of arc groove, and K1 value range is 1 μm -15 μm.
3. the mobile mould mold core of light-conducting board mold according to claim 2, it is characterised in that: the R1 range is 38.50 μ
M, the S1 are 18 μm, and the H1 is 23.50 μm, and the K1 is 3.5 μm.
4. the mobile mould mold core of light-conducting board mold according to claim 1, it is characterised in that: the cross section of the groove is
The width S 2 of V-arrangement, the V-arrangement is equal or unequal, and the maximum width S2 range of the V-arrangement is 5 μm -50 μm, described adjacent
The adjacent highest point of the adjacent V-arrangement of groove is connected or is not attached to, and the V-arrangement highest point of the groove is lower than the chain-wales
H2, H2 value range are 15-30 μm, and the depth of the V-arrangement of the groove is K2, and K2 value range is 1-15 μm.
5. the mobile mould mold core of light-conducting board mold according to claim 4, it is characterised in that: the S2 is 35.58 μm, institute
Stating H2 is 23.55 μm, and the K2 range is 3-4 μm.
6. the mobile mould mold core of light-conducting board mold according to claim 1, it is characterised in that: the cross section of the groove is
Trapezoidal, the trapezoidal maximum width S3 is equal or unequal, and the trapezoidal maximum width S3 width is 5 μm -50 μm, institute
The adjacent highest point for stating the adjacent trapezoidal of adjacent trenches is connected or is not attached to, and the trapezoidal highest point of the groove is lower than small
Platform H3, H3 value range is 15-30 μm, and the trapezoidal height of the groove is K3, and K3 value range is 1-15 μm.
7. the mobile mould mold core of light-conducting board mold according to claim 6, it is characterised in that: the S3 is 33.60 μm, institute
Stating H3 is 22.75 μm, and the K3 is 3.37 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910466702.1A CN110238999A (en) | 2019-05-30 | 2019-05-30 | A kind of mobile mould mold core of light-conducting board mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910466702.1A CN110238999A (en) | 2019-05-30 | 2019-05-30 | A kind of mobile mould mold core of light-conducting board mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110238999A true CN110238999A (en) | 2019-09-17 |
Family
ID=67885562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910466702.1A Pending CN110238999A (en) | 2019-05-30 | 2019-05-30 | A kind of mobile mould mold core of light-conducting board mold |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101444946A (en) * | 2007-11-29 | 2009-06-03 | 株式会社名机制作所 | Forming die for light guide plate |
| CN101524885A (en) * | 2008-03-04 | 2009-09-09 | 株式会社名机制作所 | Injection compression molding die for thin plate |
| CN104802340A (en) * | 2015-05-20 | 2015-07-29 | 深圳市汇晨电子有限公司 | Method for processing V-shaped groove of light guide plate |
| CN211221629U (en) * | 2019-05-30 | 2020-08-11 | 开平市盈光机电科技有限公司 | Movable mold core of light guide plate mold |
-
2019
- 2019-05-30 CN CN201910466702.1A patent/CN110238999A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101444946A (en) * | 2007-11-29 | 2009-06-03 | 株式会社名机制作所 | Forming die for light guide plate |
| CN101524885A (en) * | 2008-03-04 | 2009-09-09 | 株式会社名机制作所 | Injection compression molding die for thin plate |
| CN104802340A (en) * | 2015-05-20 | 2015-07-29 | 深圳市汇晨电子有限公司 | Method for processing V-shaped groove of light guide plate |
| CN211221629U (en) * | 2019-05-30 | 2020-08-11 | 开平市盈光机电科技有限公司 | Movable mold core of light guide plate mold |
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