CN110234303A - Buffering adhesive construction for wearable patch - Google Patents
Buffering adhesive construction for wearable patch Download PDFInfo
- Publication number
- CN110234303A CN110234303A CN201780085387.7A CN201780085387A CN110234303A CN 110234303 A CN110234303 A CN 110234303A CN 201780085387 A CN201780085387 A CN 201780085387A CN 110234303 A CN110234303 A CN 110234303A
- Authority
- CN
- China
- Prior art keywords
- layer
- adhesive
- skin
- buffer layer
- wearable device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
- A61F13/00—Bandages or dressings; Absorbent pads
- A61F13/00051—Accessories for dressings
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
- A61F13/00—Bandages or dressings; Absorbent pads
- A61F13/02—Adhesive bandages or dressings
- A61F13/0246—Adhesive bandages or dressings characterised by the skin-adhering layer
-
- G—PHYSICS
- G08—SIGNALLING
- G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
- G08C17/00—Arrangements for transmitting signals characterised by the use of a wireless electrical link
- G08C17/02—Arrangements for transmitting signals characterised by the use of a wireless electrical link using a radio link
Landscapes
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Vascular Medicine (AREA)
- Life Sciences & Earth Sciences (AREA)
- Veterinary Medicine (AREA)
- Public Health (AREA)
- Biomedical Technology (AREA)
- Heart & Thoracic Surgery (AREA)
- General Health & Medical Sciences (AREA)
- Animal Behavior & Ethology (AREA)
- General Physics & Mathematics (AREA)
- Computer Networks & Wireless Communication (AREA)
- Dermatology (AREA)
- Physics & Mathematics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Measuring And Recording Apparatus For Diagnosis (AREA)
Abstract
The present invention describes multi-layer adhesive structure, may be used as the adhesive being installed to wearable device on skin.The multi-layer adhesive structure may include the buffer layer being clipped between two adhesive phases, and first adhesive phase adheres to the multi-layer adhesive structure on the wearable device, and second adhesive phase adheres to the buffer layer on the skin.The wearable device is separated or is isolated with the skin by the buffer layer.By mechanically buffering the wearable device and the skin, the multi-layer adhesive structure allow the equipment install a very long time on the skin (such as, a few houres or several days) without causing skin injury relevant to moisture, such as erythema, soaking and stimulation or inflammation.
Description
Cross reference to related applications
This application claims any and all equity of legal provisions, including foundation 35U.S.C. § 119 (e) in 2016 years
The U.S. Provisional Application No.62/437 submitted December 21,162 equity, entire contents are incorporated herein by reference.
The statement of research is subsidized about federal government
It is not applicable.
With reference to microfiche appendix
It is not applicable.
Technical field
The present invention relates generally to a kind of buffering adhesive constructions for being installed to equipment on skin.
Background technique
Some wearable devices are fixed on skin using adhesive, and some equipment in these equipment have directly
Towards and be projected into the feature in skin, component or prominent element.For the people of the skin sensitivities such as children, these protrude special
Sign can leave the lasting marking on the skin of subject and cause skin irritatin, to limit the time that equipment can dress
Length.
Summary of the invention
The present invention relates to wearable devices, can be attached on skin by one or more adhesive phases.According to this
Invention some embodiments, adhesive phase may include multi-layer adhesive structure, the multi-layer adhesive structure include one or
Multiple buffer layers and provide improvement comfort and reduce wearable device to skin irritatin a possibility that.It is real according to the present invention
Apply scheme multi-layer adhesive structure can be used for by by one or more buffer layers (for example, tissue layer, layer of composite material
And/or natural material layer) be integrated in multi-layer adhesive structure and separate wearable device with skin.According to some embodiment party
Case is contacted by being detached from wearable device mechanically with the direct of skin, and adhesive construction allows equipment to dress on the skin
A very long time (for example, a few houres or several days) is without causing skin irritatin.
In one aspect, the present invention relates to a kind of wearable devices comprising the base with first surface and second surface
Bottom, and the integrated circuit being installed on the second surface of the substrate.Circuit trace may be mounted at substrate first surface,
On second surface or two surfaces.Multi-layer adhesive structure can adhere on the second surface of substrate.Multi-layer adhesive structure
It may include the buffer layer with first surface and second surface, the first surface of multi-layer adhesive structure adhered to wearable
First adhesive phase on the second surface of equipment, and the second surface of multi-layer adhesive structure is adhered to the skin of user
Second adhesive phase on skin.First adhesive phase and second adhesive phase may include biocompatible contact adhesive.Root
According to some embodiments of the invention, multi-layer adhesive structure can be removed from wearable device, and can be disposable
Or it is reusable.
Some embodiments according to the present invention, the buffer layer may include the tissue layer of felt, woven fabric and/
Or netted tissue layer.Some embodiments according to the present invention, the buffer layer may include microfibre, polymer and/or
The natural materials such as elastomeric material, and/or cotton, silk, hemp, bamboo, paper and/or natural rubber.It is according to the present invention
Some embodiments, the thickness of the buffer layer can be 15 μm~500 μm.Some embodiments according to the present invention, it is described
Buffer layer may include silk.
Some embodiments according to the present invention, wearable device can be selected from electronic equipment, photonic device, optoelectronic device
Or combinations thereof.
Buffer layer is completely covered in some embodiments according to the present invention, second adhesive phase.
Some embodiments according to the present invention, the second adhesive layer include surgical appliance adhesive, and the surgical appliance adhesive is selected from
Silica hydrogel adhesive, silicone pressure-sensitive adhesive, acrylic pressure-sensitive adhesive, natural or synthetic rubber adhesive, hydrocolloid are viscous
Mixture and hydrogel adhesive.
The thickness of some embodiments according to the present invention, the first adhesive layer can be in the range of about 15 μm~500 μm.
The thickness of some embodiments according to the present invention, the second adhesive layer can be in the range of about 15 μm~500 μm.
Some embodiments according to the present invention, the wearable device may include the day for allowing short-distance wireless communication
Line.In some embodiments, short-distance wireless communication includes near-field communication (NFC) or radio frequency identification (RFID).
Some embodiments according to the present invention, the substrate is by polyimides, silicone resin, PDMS poly terephthalic acid second
Diol ester, polyester, polyurethane, polycarbonate or combinations thereof are constituted.
Some embodiments according to the present invention, at least part of the structure are conformal.
On the other hand, the present invention relates to a kind of wearable devices, comprising: the substrate with the first side and second side；With
At least one becket on the first side or second side of the substrate is set.The wearable device further includes chip or collection
At circuit, it is arranged on the first side of the substrate and is electrically connected at least one described becket.It is described wearable to set
Standby further includes the buffer layer with first surface and second surface, adheres to the second surface and the buffer layer of the substrate
The first adhesive layer on first surface, and adhere on the second surface of the buffer layer and be suitable for the wearable device
Adhere to the second adhesive layer on the skin.Some embodiments according to the present invention, buffer layer can be from wearable devices
Upper removal, and can be disposable or reusable.
Some embodiments according to the present invention, the thickness of the becket can be 15 μm~500 μm.According to the present invention
Some embodiments, the becket can consist of metal, and the metal is selected from copper, aluminium, gold, platinum, silver, silver paste and has
The slurry of metal nanoparticle.
After reading the following drawings, specific embodiment and appended claims, it will be more fully understood of the invention
These and other abilities and the present invention itself.
Detailed description of the invention
The attached drawing being integrated in this specification shows one or more exemplary implementation schemes of the invention, and with tool
Body embodiment is used for the principle and application of these inventions of explanation and illustration together.The drawings and specific embodiments are illustrative
And not restrictive, and it can be adjusted and modify without departing from the scope and spirit of the present invention.
Figure 1A is to show the schematic diagram of the top view of the wearable device of some embodiments according to the present invention.
Figure 1B is to show the schematic diagram of the bottom view of wearable device shown in Figure 1A.
Fig. 2 shows the wearable devices of some embodiments according to the present invention and the section of multi-layer adhesive structure to decompose
Figure.
Fig. 3 shows the wearable device component including multi-layer adhesive structure of some embodiments according to the present invention
Cross-section diagram.
Fig. 4 shows the signal of the wearable device including multi-layer adhesive structure of some embodiments according to the present invention
Property cross-section diagram.
Fig. 5 is to show the schematic diagram of the operation of the flexible apparatus of some embodiments according to the present invention.
Fig. 6 shows the isometric exploded view of the multi-layer adhesive structure of some embodiments according to the present invention.
Fig. 7 shows the section of the wearable device of some embodiments being applied on skin surface according to the present invention
Figure.
Specific embodiment
The multi-layer adhesive structure with buffer layer that the present invention relates to a kind of, the buffer layer are provided wearable device and skin
Skin separates and isolated material.Multi-layer adhesive structure can be used for directly installing the wearable devices such as electronic equipment
It (for example, attaching on skin) or is installed indirectly on (for example, on skin) surface of the bodies such as human body or animal body
On to the surface of the bodies such as human body or animal body (for example, attaching on the coatings such as clothes, bandage).Therefore, lead to
Cross and be mechanically decoupled wearable device, the adhesive construction allow equipment install on the skin a very long time (for example, several small
When or several days) without causing skin injury, such as erythema, stimulation and inflammation.
Multi-layer adhesive structure can be used for adhering to wearable device on skin (or any organ), for indicating,
Label, tracking sensing, monitoring and/or diagnosis subject.Wearable device can be electronic equipment, optical device, optoelectronic device
Or any combination thereof.Multi-layer adhesive structure may include apply and/or adhere to buffer layer the first side surface at least
It first adhesive phase and application in a part and/or adheres on the surface of second side (opposite with the first side) of buffer layer
Second adhesive phase.First adhesive phase may include be specifically chosen as it is wearable for adhering to multi-layer adhesive structure
Adhesive material in equipment, and second adhesive phase may include being specifically chosen as making for adhering to wearable device
Adhesive material on the skin of user or the surface of object.
As non-limiting example, wearable device may include user's authentication component, mobile payment component and/
Or position tracking electronic component.Wearable device may include one or more accelerometers, temperature sensor, neural sensor
(for example, EEG), hydration sensor device, cardiac sensor (for example, ECG), motion sensor, flow sensor, pressure sensor,
Respiration transducer, skin conductance sensor or any combination thereof.Wearable device may include one or more treatments or physical therapy
Component comprising electricity or neurostimulation component, calorifics (for example, heat, radiation, cold or cold therapy/ablation etc.) treat delivery portion
Part, electromagnetic radiation (for example, visible light and black light, RF radiation, microwave) delivery member and audio (for example, ultrasound) stimulation unit
Part.Some embodiments according to the present invention, wearable device can be flat with such as smart phone, computer, set-top box, electronics
Plate (electronic pad) or the external equipments such as tablet computer and wrist-watch carry out wired or wireless communication.In some embodiments
In, multi-layer adhesive structure may include one or more flexible antennas for wirelessly communicating (for example, NFC or RFID).
Figure 1A shows the top view of the wearable device 100 of some embodiments according to the present invention, Figure 1B show from
The view that the opposite side or bottom side of same wearable device 100 are seen.Wearable device 100 may include substrate 110 and with concentric
Mode arrange and the multiple conductive (examples for forming flexible or stretchable antenna 120 on the first side of substrate 110 be set
Such as, metal) ring (for example, 2,3,4,5,6,7,8,9,10 or more).The quantity for changing becket can be used for adjusting antenna
Electrical characteristics, the mutual inductance such as inductance and with the antenna from read-out element.Some embodiments according to the present invention, becket it
Between space can be enough to avoid the short circuit during using and being bent or stretch.Some embodiments according to the present invention, antenna
120 becket can be equidistantly spaced the distance of micron dimension, for example, 5 μm~150 μm are spaced apart, 10 μm~120 μm,
10 μm~100 μm, 20 μm~80 μm, 30 μm, 40 μm, 50 μm, 60 μm, 75 μm or 90 μm.
Each of multiple beckets of antenna 120 can be electrically connected, to form induction coil and/or antenna.It
Multiple beckets of line 120 may include starting point 126 and terminal 128.In order to form becket 120, continuous metal trace can
To form multiple rings since starting point 126, and terminate at terminal 128.Some embodiments according to the present invention, starting point 126 with
The electrical connection of at least one through-hole (for example, through hole) 150.Through-hole allows antenna 120 to be electrically connected in second side of substrate 110
Chip or integrated circuit.Some embodiments according to the present invention, terminal 128 and at least one 152 electricity of through-hole (that is, through hole)
Connection.Some embodiments according to the present invention, starting point 126 can be electrically connected at least one pad, in order to be welded to core
Piece, integrated circuit or another electronic equipment.Some embodiments according to the present invention, terminal 128 can be at least one pads
Electrical connection, in order to be welded to chip, integrated circuit or another electronic equipment.
Some embodiments according to the present invention, substrate 110 can be made of polymer.Various polymer materials can fit
It is used to form substrate.Exemplary materials include but is not limited to polyimides, polyethylene terephthalate, poly- naphthalenedicarboxylic acid second
Diol ester, polyester, polyurethane, polycarbonate, polyether sulfone, cyclic olefin polymer, polyarylate or combinations thereof.Preferably,
It can be under the thickness that the material is specified herein flexible and/or stretchable.Some embodiments according to the present invention, substrate
It may be used as encapsulated layer.
According to some embodiments, substrate 110 can have the thickness no more than 300 μm.According to other embodiments, base
Bottom 110 may be thicker than 300 μm.In general, thin substrate is tended to more flexible, and in some embodiments, can save
Omit or remove substrate.In some embodiments of the present invention, the thickness of substrate 110 is not more than 250 μm, is not more than 200 μm, no
Greater than 150 μm, it is not more than 100 μm, is not more than 50 μm, or be not more than 25 μm.
Some embodiments according to the present invention, wearable device 100 can optionally include notch 130, wherein can be with
Remove a part of the substrate 110 inside most interior becket.For example, at least 5% of the base material inside most interior becket, extremely
Few 10%, at least 20%, at least 30%, at least 40%, at least 50%, at least 60%, at least 70%, at least 80% or at least
90% is removed.As it is used herein, term " most interior becket " refers to that the metal trace by starting point 126 is formed
The first becket.Notch 130 can have any geometry.For example, notch 130 can have the shape with antenna 120
Substantially similar shape.Notch 130 can have convenient for the scheduled shape of stacking and/or stored electrons equipment (for example, predetermined
Geometry or abstract shapes).
The lateral dimension of wearable device 100 can be millimeter magnitude, for example, in 5mm~45mm, 10mm~40mm or
In the range of 25mm~35mm.In addition, although wearable device 100 shown in Figure 1A~1B is shown as having round or positive round
Shape shape, but wearable device can be formed as other shapes, including square, rectangle, with the polygon of any amount side
Shape and irregular shape or symbol shape, such as face or head, hand, the heart, alphanumeric symbol and mark.In addition, wearable device
Size can be arbitrary dimension, for example, up to 100~200mm or cover body scheduled part it is larger wearable
A part of equipment, for example, as casting or supporting element are (for example, foot support, knee supporting element, wrist support, arm branch
Support member, shoulder support or neck support part).
As shown in Figure 1B, wearable device 100 may include second side of substrate 110, through-hole 150 and 152, the first pad
Or first electrode 160 and the second pad or second electrode 162.Through-hole 150 can be electrically connected with first electrode 160, through-hole 152
It can be electrically connected with second electrode 162.Chip or integrated circuit can be electrically connected (example with first electrode 160 and second electrode 162
Such as, pass through welding or closing line), allow antenna 120 to provide electric power and wireless signal to chip or integrated circuit 170.
Some embodiments according to the present invention, wearable device 100 can be clipped in flexible or stretchable encapsulated layer 140
Between (shown in Figure 1A) and flexible or stretchable multi-layer adhesive component 142 (shown in Figure 1B).According to the present invention one
A little embodiments, wearable device 100 can be embedded or encapsulated between two encapsulated layers, make encapsulated layer bending that will make wear
Wear the bending of equipment 100.Multi-layer adhesive component can link on (for example, adherency, bonding or fastening) one into encapsulated layer,
Such as bottom or lower part encapsulated layer.
Flexible or stretchable antenna 120 as described herein may be electrically connected on one or more chips or integrated circuit
170, to provide electric power and for short-distance wireless communication, such as near-field communication (NFC), bluetooth (Bluetooth), purple honeybee
(Zigbee), radio frequency identification (RFID) and WiFi etc..In some embodiments, Infrared Transmission can also be provided.Chip or collection
One or more functions can be executed at circuit.For example, chip or integrated circuit can produce for authenticate wearable device and
The signal of wearer's (for example, to provide the access to equipment or facility, or a part as payment system) is (for example, number
It is believed that number or analog signal).Therefore, one aspect of the present invention is related to a kind of flexible or stretchable equipment 100 comprising this
Flexible or stretchable antenna 120 described in text and the chip or integrated circuit 170 for being electrically connected to antenna 120.According to this hair
Other bright embodiments, flexible apparatus 100 may include multi-layer adhesive component 142.Multi-layer adhesive component 142 allow by
Flexible apparatus is fixed on the surfaces such as skin, equipment or fabric.Multi-layer adhesive component can also include release liner, with
Protect adhesive when not in use from pollution.Some embodiments according to the present invention, chip or integrated circuit 170 can be with
Adhesive phase contact.According to a further embodiment of the present invention, chip or integrated circuit 170 can with multi-layer adhesive portion
Encapsulated layer contact on the opposite side of part.Optionally, figure (for example, image and/or label) can be printed on encapsulated layer, bonding
On the surface of oxidant layer or the two or in insertion encapsulated layer, adhesive phase or the two.Some embodiments according to the present invention,
Figure may include fluorescence, phosphorescence, luminous (for example, floodlight in the dark) or other light or heat-sensitive material or component (example
Such as, change the material of one or more characteristics as exposure to light and/or heat).For example, being used for according to some embodiments
Apply figure at least part ink can according to be exposed to heat or light or other electromagnetic radiation exposure or duration and
Change color.
Some embodiments according to the present invention, flexible or stretchable wearable device may include two or more
Chip or integrated circuit can be electrically connected optionally by conducting wire or using wireless signal.Some implementations according to the present invention
Scheme, flexible or stretchable wearable device may include connect with chip or integrated circuit 170 airborne power supply (for example,
Battery, storage and/or photovoltaic cell).
Flexible electronic devices according to the present invention are configured without airborne power supply, so that flexible electronic devices is conformal
Degree greatly increases.Here flexible electronic devices can be configured with new form factor, which allows to create
Very thin and flexible or stretchable electronic equipment.As non-limiting example, the average thickness of flexible electronic devices can be
About 2.5mm or less, about 2mm or less, about 1.5mm or less, about 1mm or less, about 500 microns or less, about 100 microns or less, about 75
Micron or less, about 50 microns or less or about 25 microns or less.In example embodiment, at least part of electronic equipment can be with
It folds, or electronic equipment can be made to surround a part of irregular surface and conformal with it.At at least one of electronic equipment
Divide in the example being folded, the average thickness of electronic equipment can be about 5mm or less, about 4mm or less, about 3mm or less, about 2mm
Below, about 1mm or less, about 200 microns or less, about 150 microns or less, about 100 microns or less or about 50 microns or less.Lateral
Plane inside dimension can be changed based on required application.For example, lateral dimension can be centimetres or part centimetre.
In other examples, flexible or stretchable electronic equipment can be configured to other sizes, form factor and/or aspect ratio
(for example, thinner, thicker, wider, narrower or many other modifications).
Some embodiments according to the present invention, the antenna of wearable device are also possible to flexible or stretchable.Root
According to some embodiments of the invention, flexible antennas or the equipment including antenna can be applied with it (for example, in human body or
In the equipment of animal body or irregular shape) any surface is conformal.Some embodiments according to the present invention, flexible antennas or
Equipment including antenna can be substantially flat or flat in the stand-by state.Some embodiment party according to the present invention
Case, flexible antennas or the equipment including antenna can be bent in the stand-by state, for example, curved on the curved surfaces such as ball or handle
It is bent.
Fig. 2 shows the wearable devices 100 with multi-layer adhesive structure 200 of some embodiments according to the present invention
Schematic exploded cross-section diagram diagram.Wearable device can be configured to the form of multilayered structure.Top layer 140 (far from skin)
It can be encapsulated layer, increase protection to flexible printed circuit board 110 (curved PCB) and tube core, and be used as optional pattern
The base portion of printing 144.Middle layer may include being pasted with the curved PCB layer 110 of bare die (for example, NFC IC) (for example, having
One or more layers of conductive (such as copper) trace 120).Optional bottom package layer 146 can also be set, so as to for example when
The bottom surface of curved PCB layer 110 is protected when adhesive phase is removable.Bottom may include multi-layer adhesive structure 200,
It separates wearable device with skin area (wearable device is adhered on the skin area).Curved PCB 110 can
To include antenna 120 shown at least part of such as Figure 1A~1B across wearable device region.Top encapsulation layer 140
(and optional bottom package layer 146) can be bigger than curved PCB, and can be shaped as being contained in the graph image on top layer
And/or label print 144.Some embodiments according to the present invention, antenna 120 can be configured to have up to 6 circles or more
Circle, and there is the shape as flower, enable antenna 120 to be bent and/or stretch with the skin of wearer.Root
According to some embodiments of the invention, curved PCB 110 can be configured to follow the narrowband of flower shape.It is according to the present invention
The center portion in inner antenna of some embodiments, wearable device can leave a blank or may include one or more electricity
Subassembly.Some embodiments according to the present invention, antenna can have other shapes and other sizes.
Multi-layer adhesive structure 200 may include: first adhesive phase 202, for delaying multi-layer adhesive structure 200
Layer 210 is rushed to adhere on bottom package layer 146；With second adhesive phase (for example, skin adhesive layer) 204, it is used to be isolated
210 (and wearable device 100) of layer adhere on the skin of user.In some embodiments, it is convenient to omit bottom package
Layer 146, and first adhesive phase 202 can be directly adhered to the bottom of curved PCB layer 110.Buffer layer 210 can be soft
Property or stretchable, woven, felt or netted fabric, by the skin of wearable device and user separate with reduce
Skin irritatin.According to some embodiments, buffer layer 210 may include microfibre (for example, woven, felt or netted)
Fabric, silk (for example, woven, felt or netted) fabric.According to some embodiments, buffer layer 210 may include
The natural material such as the synthetic materials such as polymer or elastomeric material or silk, cotton, hemp, bamboo or other natural fabrics
Material.Fabric can be woven, felt or netted fabric, and can be the mixture of synthetic material and natural material.
Some embodiments according to the present invention, fabric may include synthetic material and/or natural micro fibre material.It is according to the present invention
Some embodiments, fabric may include combination or the mixture of two or more materials.
Similar to Fig. 2, Fig. 3 show some embodiments according to the present invention with multi-layer adhesive structure 200 can
The diagram of the assembling schematic cross-sectional view of wearable device 100.Wearable device 100 can be configured to the form of multilayered structure.Top
Layer 140 (far from skin) may include encapsulated layer, increase protection to flexible printed circuit board 110 (curved PCB) and tube core,
And it is used as the base portion of optional pattern printing 144.Middle layer may include be pasted with bare die (for example, NFC IC) curved
PCB layer 110.Optional bottom package layer 146 can also be set, to protect the bottom surface of curved PCB layer 110.Bottom can be with
Including multi-layer adhesive structure 200, wearable device is separated with skin.As shown in figure 3, curved PCB layer 110 is at least
A part 148 (conductive trace 120 including forming antenna) can make bottom from the bottom surface protrusion of curved PCB layer 110
Encapsulated layer 146 and multi-layer adhesive structure 200 deform.The protrusion may lead skin irritatin.As shown in figure 3, protruding portion 148
The top surface of multi-layer adhesive structure 200 can be made to extend and deform in the case where not protruding into skin, to reduce skin
A possibility that skin stimulates.
Fig. 4 shows the wearable device 400 with multi-layer adhesive structure of some embodiments according to the present invention
Cross-section diagram.Wearable device 400 may include first layer 430, the second layer 450 and third layer 460.First layer 430 may include
Top encapsulation layer 440, and other optional layers include the first lining 401 (for example, with protection packaging layer and very thin convenient for handling
Wearable device), graph layer 444 (for example, for print image and label) and first adhesive phase 406 be (for example, will push up
The bottom surface 440A of portion's encapsulated layer is fixed to the top surface 410A of curved PCB 410).Selectively, top encapsulation layer 440 can
To be from adherency, for example, making encapsulated layer be directly adhered to curved PCB by casting in position or heating
On 410 top surface.Top encapsulation layer 440 and optional first adhesive phase 406 can be used ventilative or porous material and carry out structure
It makes.Some embodiments according to the present invention, first adhesive phase 406 may include surgical appliance adhesive.According to the present invention one
A little embodiments, first adhesive phase may include acrylic, dextrin base and urethane based adhesives and it is natural and
Synthetic elastomer comprising such as amorphous polyolefin (e.g., including amorphous polypropylene), the conjunction of Kraton.RTM. brand
Elastomer-forming and natural rubber.Other exemplary skin adhesives include cyanoacrylate, hydrocolloid adhesives, water-setting gluing
Mixture and soft silicone adhesive.Some embodiments according to the present invention, surgical appliance adhesive may include FLEXCON
DERMAFLEX.TM.H-566.Some embodiments according to the present invention, adhesive can be it is reusable so that equipment
It can be removed and apply again or relocate and be applied on different surfaces.Some embodiments according to the present invention,
The thickness of first adhesive phase 406 can be in the range of 15 μm~500 μm.In some embodiments, first adhesive phase
406 with a thickness of about 25 μm.Similarly, the thickness of adhesive phase 202 and 204 can be 15 μm~500 μm, for example, 25 μm.
Graph layer 444 (for example, image and/or label) can be printed on the surface of first layer 440 or be embedded, tool
It adheres to body on the bottom surface 440A of encapsulated layer 440.Some embodiments according to the present invention, graph layer 444 may include
Fluorescence, phosphorescence, shine (for example, floodlight in the dark) or other light or heat-sensitive material or component (for example, as exposure to
Light and/or heat and change one or more characteristics).For example, according to some embodiments, for applying graph layer 444 at least
A part of ink can change color according to the exposure or duration for being exposed to heat or light or other electromagnetic radiation.Some
In embodiment, figure and UV layers of thickness can be about 5~50 μm.
Encapsulated layer 440 can provide multiple functions.It is protected for example, encapsulated layer 440 can provide the mechanical of curved PCB 410
The electric isolution of shield and/or the electronic component on curved PCB 410.Encapsulated layer 440 can provide protection, at the same for example using
PDMS and organic silicon substrate encapsulating material provide the flexibility and draftability of wide scope.In some embodiments, encapsulated layer 440 wraps
It includes or permeable layers, such as polyurethane coating (for example, 16 μ m-thicks).Encapsulated layer 440 is also used as providing mechanical protection
And/or the passivation layer on the top for the other materials and/or equipment being electrically isolated.Encapsulated layer 440 can also mitigate such as vulnerable to answering
Strain and stress on the electronic equipments such as the antenna of equipment that failure caused by becoming influences.Release liner 401 can be by having
The layer 405 of adhesive or other cohesive materials adheres on top encapsulation layer 440.Release liner 401 and top encapsulation layer 440 can
To have identical or different shape each independently, such as rectangle, circle, ellipse, oval, octagon, hexagon and polygon
Shape or irregular shape.It in some embodiments, 401 may include poly- terephthaldehyde in such as 100 μ m-thicks in upper gasket
The contact adhesive (PSA) of such as 4 μ m-thicks on the polymer films such as sour glycol ester (PET).
The second layer 450 may include substrate 410 and integrated circuit 470.The second layer 450 may include antenna 411 and 412
(antenna overline bridge (antenna overpass)).As described above, substrate 410 can have the thickness no more than 300 μm.Some
In embodiment, thin substrate is preferred, the reason is that they tend to it is more flexible, and in some embodiments, even
It can be omitted or remove substrate.In some embodiments, the thickness of substrate 410 can be no more than 250 μm, no more than 200 μ
M, no more than 150 μm, no more than 100 μm, no more than 50 μm or no more than 25 μm.Substrate 410 can be physically divided into multiple lists
The substrate (for example, 2,3,4,5,6,7,8,9,10 or more) of aization, wherein at least one becket (for example, antenna structure)
It is arranged on each individualized substrate.Furthermore, it is possible to which integrated circuit 470 is arranged for short-distance wireless communication, as near field is logical
Letter (NFC), bluetooth, purple honeybee, radio frequency identification (RFID) and Infrared Transmission etc..Chip or integrated circuit 470 can execute one or
Multiple functions.For example, chip or integrated circuit can produce the signal for certification.Therefore, one aspect of the present invention is related to
A kind of flexible apparatus comprising flexible antennas as described herein and the chip or integrated circuit that are electrically connected with antenna.In some realities
It applies in scheme, the thickness of NFC chip can be about 120 μm, for example, being projected into multi-layer adhesive structure 200.
Third layer 460 may include multi-layer adhesive structure 200 and the second release liner 405 (for example, to protect multilayer viscous
Mixture structure is when not in use from pollution).Multi-layer adhesive structure 200 may include second adhesive phase 202, buffer layer
210 and third adhesive phase 204.Third adhesive phase 204 can be the bottom being suitable for skin contact and bonding.Buffer layer
210 include the first surface 210A adhered on the second layer 450 by second adhesive phase 202 and by third adhesive phase
204 adhere to the second surface 210B in skin or other surfaces.In addition, third adhesive phase 204 may include adhering skin
Agent can be unsupported transfering adhesive or double coated adhesive.Any surgical appliance adhesive well known in the prior art is all
It can be used for adhesive according to the present invention.Suitable surgical appliance adhesive includes acrylic, siloxy group, hydrocolloid base, paste
Smart base and urethane based adhesives and natural and synthetic elastomer.Suitable example include amorphous polyolefin (for example,
Including amorphous polypropylene),The synthetic elastomer and natural rubber of brand.Other exemplary skin adhesives
Including acryloid cement, cyanoacrylate, hydrocolloid adhesives, hydrogel adhesive, soft silicone adhesive and organic
Silicon contact adhesive.Some embodiments according to the present invention, surgical appliance adhesive may include Silica hydrogel.According to the present invention one
A little embodiments, surgical appliance adhesive may include acrylic pressure-sensitive adhesive.Third adhesive phase 204 can also include such as increasing
The additives such as stick, antioxidant, processing oil (processing oils).In addition, third adhesive phase 204 can also include
Release liner 405, for example, the PET film of 100 μ m-thicks.
Buffer layer 210 enables the second layer 450 to attach in skin or other surfaces, and at the same time providing the second layer
450 feature separates with skin or surface or is isolated and isolated buffer, and provides more conforming contacts, to be reduced or avoided
Skin irritatin.In some embodiments, buffer layer is made of the screen fabric of 100 μ m-thicks.Some implementations according to the present invention
Scheme, the first surface 210A of buffer layer 210 can be attached to by second adhesive phase 202 wearable device 400 towards
In skin side or bottom side (for example, second adhesive phase 202 adheres in 210 the two of the second layer 450 and buffer layer).Buffer layer
210 second side 210B can be pressed onto third adhesive phase 204 with presheaf.Second adhesive phase 202 and third adhesive phase 204 are all
It may include the identical adhesive to skin safe.According to some embodiments, the size of buffer layer 210 can be customized to
The substrate 410 of the second layer 450 is covered, and encapsulated layer or first layer 440 and third adhesive phase 204 can be less than.According to one
A little embodiments, the size of buffer layer 210 can be customized to cover it is more than the substrate 410 of the second layer 450, and can be with
Encapsulated layer or first layer 440 are identical with the size of third adhesive phase 204 or be larger than.
Some embodiments according to the present invention, buffer layer 210 may include flexible or stretchable material, such as weave
, felt or netted fabric.The example of textile material includes but is not limited to hygroscopic fabric, silk, open celled foam and conduction
Nano fibrous membrane.Buffer layer 210 may include fabric felt, be knitted, woven and nonwoven.Buffer layer 210 can also
To be the mixture of different synthetic materials, synthesis and natural material or different natural material, including for example polyester, spandex, nylon,
Polyester, cotton, wool, silk, hemp and bamboo.Some embodiments according to the present invention, buffer layer 210 may include two layers or
The textile material of more layers, including the tissue layer to be kept together by adhesive, polymer or elastomeric material.According to this hair
Bright some embodiments, buffer layer 210 may include quilted fabric material.Some embodiments according to the present invention, buffering
The thickness of layer 210 can be in the range of 15 μm~500 μm.In some embodiments, the thickness of buffer layer 210 can be about
100μm。
Relatively small area of contact between third adhesive phase 204 and skin can promote the comfort of wearing and reduce wet
A possibility that gas (for example, sweat and skin oil) can be trapped between skin and third adhesive phase 204.In alternate embodiment
In, for example, third adhesive phase 204 may include at least one notch.The size of notch can be by ensuring third adhesive
There are enough bonding forces between layer 204 and skin to determine.Notch can have any shape, and condition is in third adhesive
There are enough bonding forces between layer 204 and skin.For example, notch can be round, oval, diamond shape, triangle, square,
The shape of opening in rectangle, polygon or substrate.Third adhesive phase 204 can be made to texture, to increase third adhesive
Bonding force between layer 204 and skin, while reducing contact area.
Standard coating well known by persons skilled in the art or laminating apparatus can be used to manufacture adhesive knot of the invention
Structure.Adhesive construction can be made into tape, gasket, patch or other rules or irregular shape with any shape or size
The form of the adhesive element of shape.
At least part of some embodiments according to the present invention, multi-layer adhesive structure 200 can be flexible.Example
Such as, the first adhesive layer 202 can be flexible or stretchable.Some embodiments according to the present invention, adhesive construction 200
It can be using the form of flexible double-sided adhesive construction or unsupported transfering adhesive.
Some embodiments according to the present invention, at least part of multi-layer adhesive structure 200 can be stretchable
Or it is flexible.For example, third adhesive phase 204 can be it is stretchable.Some embodiments according to the present invention, laminated
Agent structure 200 can be using stretchable double-sided adhesive structure or the form of unsupported transfering adhesive.
Some embodiments according to the present invention, at least part of multi-layer adhesive structure 200 can be conformal.Example
Such as, the first adhesive layer can be conformal.Some embodiments according to the present invention, multi-layer adhesive structure 202,204,210
It can be using conformal double-sided adhesive structure or the form of unsupported transfering adhesive.
In some embodiments of the present invention, providing use does not include power supply or the flexible electrical including lower wattage power supply
Sub- equipment carries out qualitative and/or quantitative analysis technology.As non-limiting example, lower wattage power supply can be to provide and be below about
The power supply of 25mAH, about 20mAH, about 15mAH, about 10mAH, about 5mAH or about 1mAH.In one example, lower wattage power supply can
To provide the peak point current for being below about 5mA, such as, but not limited to there is the hull cell lower than 5mA peak point current.Flexible electronic
Equipment can be configured for medical diagnosis, user's authentication, mobile payment and/or position tracking.
Fig. 5 shows the schematic diagram of the operation of the wearable device 510 of some embodiments according to the present invention.It is wearable to set
Standby 510 can be installed on the skin of people, for example, being installed on forearm, hand, chest, leg or foot.Calculating equipment 520 can be with
Be arranged at a certain distance from away from wearable device 510, be suitable for short-distance wireless communication (for example, NFC, RFID, bluetooth, WiFi,
Zigbee, Medical Telemetry).For example, NFC is one group of short distance wireless technical, it usually needs 10 centimetres or shorter of distance.It calculates
Equipment 520 can produce 510 receivable signal (for example, electromagnetic wave) of wearable device.Wearable device 510 may include can
To generate the antenna of electric current in response to signal.Then, electric current can be to the on one or more chips of wearable device 510 or integrated
Circuit power supply, to generate output signal, which can be received by identical calculating equipment 520 or different equipment.It is defeated
Signal can be used for executing one or more functions (including sensor data transmission, user's authentication, mobile payment out
And/or position tracking).
Some embodiments according to the present invention, wearable device 510 is when on the skin for be installed to people and in basis
The movement of skin can keep function while be bent and/or stretched.Some embodiments according to the present invention, it is wearable
At least part of equipment 510 can be ventilative, enable gas and steam away and towards skin flow, so that
Wearable device 510 can be dressed a very long time, about a few days, a few weeks or months, without causing skin irritatin.
Here wearable device 510 can be configured to disposable apparatus.For example, when equipment is located on the skin of user
When, which can keep function, but its function will be stopped by once removing it from skin, for example, the reason is that antenna
Becket intentionally destroyed.
Fig. 6 shows the exploded view of the multi-layer adhesive structure 600 of some embodiments according to the present invention.Structure 600
Multilayer laminated to can have equipment side 604, wherein equipment side 604 includes equipment adhesive phase 616, and being adapted and configured to will be more
Layer adhesive construction 600 adheres in wearable sensors equipment.The multilayer laminated of structure 600 can have skin side 602,
Middle skin side 602 includes skin adhesive layer 608, is adapted and configured to wearable sensors equipment adhering to subject's
On surface or skin.Some embodiments according to the present invention, multi-layer adhesive structure 600 may include equipment adhesive phase
616, buffer layer 614, optional supporting layer 612 and skin adhesive layer 608.Skin adhesive layer 608 may include towards skin
The surface 608a of skin and adhere to the device oriented surface 608b on optional supporting layer 612 or buffer layer 614.Supporting layer
612 may include the surface 612a towards skin adhered on skin adhesive layer 608 and adhere to the face on buffer layer 614
To the surface 612b of equipment.Buffer layer 614 may include the surface 614a towards skin adhered on supporting layer 612 and adherency
Device oriented surface 614b on to equipment adhesive phase 616.If omit supporting layer, buffer layer 614 towards skin
Surface 614a can adhere on skin adhesive layer 608.Equipment adhesive phase 616 may include adhering to buffer layer 614
On surface 616a towards skin and the device oriented surface 616b that is adapted to adhere in wearable sensors equipment.
Some embodiments according to the present invention, multi-layer adhesive structure 600 can be used for wearable sensors equipment
On the surfaces such as 704 (Fig. 7) stickup or the skin for adhering to subject.According to some embodiments, wearable sensors are set
Standby may include electrode 702A and 702B, can be used for detecting the biopotential from surface.For accommodate electrod, equipment is viscous
Mixture layer 616 and buffer layer 614 may include one or more notch, enable electrode with supporting layer 612 and by supporting
The hydrogel layer 610 of 612 support of layer contacts.According to some embodiments, it is permeable that supporting layer 612 can be hydrogel, and
And hydrogel layer 610 can directly be contacted with electrode 702A and 702B, so that when wearable sensors equipment is dressed on the skin
When, the hydrogel of hydrogel layer 610 conducts biopotential to electrode.Some embodiments according to the present invention, supporting layer 612
It can be conductive and electrode will be transmitted to from surface by hydrogel received signal and biopotential.It is according to the present invention
Some embodiments, skin adhesive layer 608 can also include one or more notch, which limits hydrogel layer 610 can
With the space being fitted into them.In addition, the thickness of hydrogel layer 610 can be essentially identical with the thickness of skin adhesive layer 608,
So that hydrogel layer 610 can come into full contact with surface, so that biopotential and other signals are transmitted to electrode.According to one
A little embodiments, hydrogel layer 610 can (for example, 0.1mm) slightly thicker than skin adhesive layer or slightly thin (for example, 0.1mm), with
Adapt to the expansion and compression during use.According to some embodiments, supporting layer 612 also may include one or more notch,
And hydrogel layer 610 is extended to contact with electrode 702A, 702B in supporting layer 612, so that electrode 702A and 702B
It is able to detect that signal and biopotential.Some embodiments according to the present invention, can be used conducting polymer etc. its
His conductive material replaces the hydrogel in hydrogel layer 610.
Some embodiments according to the present invention, wearable sensors equipment include electrode really, and can be from corresponding
Multi-layer adhesive structure 600 in omit supporting layer 612.Therefore, obtained multi-layer adhesive structure 600 may include in skin
Skin side 602 has the buffer layer 614 of equipment adhesive phase 616 with skin adhesive layer 608 and in equipment side 604.
Some embodiments according to the present invention, by making the surface 612a towards skin of permeable layers 612 contact skin
The device oriented surface 608b of skin adhesive phase 608 simultaneously attaches the surface 608a towards skin of skin adhesive layer 608
Supporting layer 612 can be attached on skin on to skin.Buffer layer 614 may include on the surface 614a towards skin
Adhesive.By contacting the adhesive on the surface 614a towards skin with the device oriented surface 612a of supporting layer 612
And buffer layer 614 can be adhered on supporting layer 612.By making the device oriented surface 616b of adhesive 616 and can wear
The surface (for example, surface towards skin) for wearing equipment contacts and makes the device oriented surface 614b and equipment of buffer layer 614
The surface 616a contact towards skin of adhesive phase 616 can paste the equipment adhesive phase 616 of multi-layer adhesive structure 600
It is attached on wearable device 704.Optionally, lamination also may include in multi-layer adhesive structure 600 towards in skin side 602
The first lining 606, for example, lining 606 can removedly attach to the surface towards skin of skin adhesive layer 608
On 608a.Lamination also may include the second lining 618 on the equipment oriented side 604 of structure 600, for example, lining 618 can be with
It removedly attaches on the device oriented surface 616b of equipment adhesive phase 616.
In multi-layer adhesive structure 600, skin adhesive layer 608, buffer layer 614 and equipment adhesive phase 616 can be with
Including notch.The periphery of notch in layer 608,614 and 616 is shown as 608c, 614c and 616c and is being schemed in Fig. 6
It is illustrated in 7 with section.Notch can have identical or different shape, and be used for when adhesive laminate 600 is assembled into
When its desired use, notch can be aligned along the Z direction.For " alignment ", it is to be understood that in layer 608 and 614 or 614
It is substantially heavy with 616 or 608 and 616 or the projection on an x-y plane of the notch in all three layers 608,614 and 616
It is folded.Substantially overlapping means that the region sketched the contours of by the projection of each periphery 608c, 614c and 616c is overlapped about 100%, extremely
Few about 95%, at least 90%, at least 80%, at least 50%, at least 10%.In some embodiments, shape is identical and again
Folded at least about 95%.In some embodiments, shape is different and is overlapped less than 50%.
Multi-layer adhesive structure 600 may include conductive material 610, can be setting, is formed or be contoured for putting
The layered material in the notch of first adhesive phase 608 is set (for example, conductive material 610 forms first adhesive phase at least
A part and extend in supporting layer 612).Conductive material 610 may include device oriented surface 610b and towards
The surface 610a of skin.At least part of supporting layer 612 is solidified at least up to conductive material can before solid-state or semisolid
With permeable to conductive material 610.Therefore, conductive material 610 can be flowed by the surface 612a towards skin of supporting layer 612
Into supporting layer 612, the device oriented surface 612b of supporting layer 612 is flowed to always.Some embodiments according to the present invention,
Conductive material 610 can be flowed into the one or more notch being formed in buffer layer 614 by device oriented surface 612b,
And it is contacted with the electrode in the notch for being projected into buffer layer 614.In some embodiments, conductive material 610 is once solidification
It is unable to transmission layer 612, once so that curing materials 612 solidify, the second layer 612 just forms the barrier of the flowing to curing materials.
Once removing the first lining 606, conductive material 610 may be selected by or be configured to surface 610a and skin by it towards skin
Skin contact.
Fig. 7 shows the cross-sectional view that the equipment 704 of skin surface 708 is attached to using multi-layer adhesive structure 600.Buffering
Notch in layer 614 and skin adhesive layer 616 can configure (for example, positioning and size customization), and at reception to adhere to multilayer viscous
A part of wearable device 704 on the equipment oriented side of mixture structure 600.For example, as shown in fig. 7, electricity in equipment 704
Pole 702A, 702B can be aligned with notch, and notch can be configured so that electrode 702A, 702B are extended in notch.Electricity
The electrode working surface 706 of pole can be configured to the device oriented surface 612b of the second permeable layers 612 of contact.Electrode work
Surface 706 can contact the conductive material 610 through supporting layer 612, thus electrode 702A may be positioned so that by also with skin
The conductive material 610 of contact and be electrically connected with skin.Some embodiments according to the present invention can replace leading with dielectric material
Electric material 610, and electrode may be used as capacitance electrode to receive signal from surface.
In some embodiments, the layer in adhesive laminate 600, for example, layer 612 and 616 cannot each other removedly
It attaches and/or cannot removedly attach on skin.For attaching non-removablely, imply that once these layers divide each other
From, separate with equipment or skin, which cannot reuse.For example, these layers are likely to be broken, such as warpage is polluted or is torn
It splits, so that their cisco unity malfunctions are (for example, equipment is fallen from wearer or signal is not from the skin of subject
It is correctly received in attached equipment).In some embodiments, multi-layer adhesive structure 600 can be pasted removedly
It is attached on wearable device and/or skin, wearable device is removed and attaches to skin again using structure 600
On more than once (for example, 2,3,4 times or more time) and as was expected works, and multi-layer adhesive structure 600
It can be removed and attach to again (for example, 2,3,4 or more times) and as expected more than once on wearable device 704
As work.
Layer in multi-layer adhesive structure 600 can be used any materials in material described herein and be made.Some
In embodiment, release liner 602 and 604 may include the polyethylene terephthalate coated with antiadhesion barrier
(Polyethylene Terephthalate) piece, such as 3 mils (Mil) thick (about 0.08mm) for being coated with silicone releaseFilm (Dupont, DE).In some embodiments, skin adhesive layer 608 may include that medical-grade acrylic is viscous
Mixture such as usesThe film of 4.5 mil thicks (about 0.11mm) of 3558B (Berry Plastics, MA).One
In a little embodiments, conductive material 610 may include to conductive materials such as the polyelectrolyte of skin safe.For example, one
In a little embodiments, conductive material 610 may include for the water-settings such as electrode stimulating and the low-adhesion hydrogel of monitoring
Glue, for example, the KM 50F hydrogel (Katecho Inc., IA) of 32 mil thicks (about 0.81mm).In some embodiments, it props up
Support layer 612 may include fabric, netted fabric, woven fabric, the fabric of entanglement or such as scrim or gauze of felt
Equal materials.The material may include any one or more of silk, cotton, microfibre, nylon, polyester, hemp and bamboo.Example
Such as, layer 612 may include being based onThe material layer of (polyester) Style 2004 (Fiberweb Inc., TN).One
In a little embodiments, buffer layer 614 may include polyimides, polyethylene terephthalate, polyester, polyurethane, poly- carbon
Any one or more of acid esters and polyolefin, and it is optionally formed as closed-cell foam.For example, buffer layer 614 can wrap
Include closed cell polyolefin foam.In one embodiment, layer 614 may include the expanded polyolefin of 34 mil thicks (about 0.86mm)
Band (Polyolefin Foam Tape) PN 1773 (3M Medical Specialties, MN).In some embodiments,
Equipment adhesive phase 616 may include double faced adhesive tape, as two sides be each coated with acryloid cement polyethylene film (for example,
Carrier).For example, layer 616 may include the medical adhesive tape of 13 mil thicks (about 0.33mm), such as 3M production number 1522H medical adhesive tape
(3M Medical Specialties, MN).
Term " flexibility " and " flexible " use synonymous in the present specification, and refer to material, structure, equipment or
Part of appliance is deformed into bending or curved shape, and without undergoing the significant strain of introducing, (such as characterization material, structure, equipment are set
The strain etc. of the failpoint of standby component) deformation ability.In an exemplary embodiment, it flexible material, structure, equipment or sets
Standby component can be deformed into the strain that curved shape is greater than or equal to 5% without introducing in strain sensitive region, for one
A little applications will not introduce the strain more than or equal to 1%, and will not introduce answering more than or equal to 0.5% for other application
Become.As it is used herein, some flexible structures but be not necessarily all flexible structures be also possible to it is stretchable.Various property
Flexible structure (for example, part of appliance) of the invention can be provided, which includes such as low modulus, bending stiffness and bending resistance
The material properties such as rigidity；Such as small average thickness (for example, less than 100 microns, optionally less than 10 microns, optionally less than 1
Micron) etc. the equipment geometry such as physical sizes and film and netted geometry.
As it is used herein, " stretchable " refers to material, structure, equipment or part of appliance in the feelings not being broken
The ability of strain (for example, elongation) under condition.In an exemplary embodiment, stretchable material, structure, equipment or part of appliance
Can be subjected to it is not broken greater than 0.5% strain, some applications can be subjected to it is not broken greater than 1% strain, it is right
It can be subjected in other application not broken greater than 3% strain.As it is used herein, many stretchable structures are also soft
Property.Some stretchable structures (for example, part of appliance) are designed to through compressed, elongation and/or distortion, so as to energy
It is enough to be deformed in the case where not broken.Stretchable structure includes: membrane structure comprising the stretchable material such as elastomer
Material；It is able to carry out the warp architecture (for example, spring, serpentine configuration and buckling structure) of elongation, compression and/or torsional motion；With
Structure with island bridge geometry.Stretchable part of appliance includes having stretchable electrical interconnection etc. stretchable
The structure of interconnection piece.
As it is used herein, term " conformal " refers to that equipment, material or substrate have sufficiently low bending stiffness to permit
Perhaps equipment, material or substrate are using desired appearance profile (for example, allowing suitable with the surface with embossing pattern or recess feature
The appearance profile of shape contact).In certain embodiments, desired appearance profile is the tissue or organ (example in biotic environment
Such as, skin) surface.
As it is used herein, term " conforming contact " refers to that establishes between wearable device and receiving surface connects
Touching, the receiving surface for example can be the destination organization in biotic environment.In one aspect, conforming contact is related to wearable device
One or more surfaces (for example, contact surface) macroscopic view of the global shape of tissue surface is adapted to.On the other hand, conformal
Contact is related to microcosmic adaptation of the one or more surfaces (for example, contact surface) of wearable device to tissue surface, produces
It there is no the close contact in gap.In some embodiments, conforming contact is related to the contact surface of wearable device
Be fitted to the receiving surface of tissue, be in close contact with realizing, for example, wherein the contact surface of wearable device less than 20%
Surface region is not physically contacted with receiving surface, or optionally, the contact surface less than 10% of wearable device not with connect
Surface physics contact is received, or optionally, the contact surface less than 5% of equipment is not physically contacted with receiving surface.Some
In embodiment, tissue is skin histology.Some embodiments according to the present invention, conforming contact is in wearable device and skin
Or adequately contact is provided between other surfaces, so that wearable device can as was expected works, for example, that can wear
Wear in the case that equipment includes sensor, sensor is able to detect that the signal from skin, regardless of skin be it is fixed, move
It is dynamic, stretching or curved.
The embodiment of various aspects described herein can be illustrated by the paragraph of following number.
1. a kind of wearable device for being configured to adhere on skin, comprising:
Substrate, the substrate have first surface and second surface；
Integrated circuit, the integrated circuit are installed on the second surface of the substrate；
Buffer layer, the buffer layer have first surface and second surface；
First adhesive layer, first adhesive layer adhere to first with the buffer layer on the second surface of the substrate
On surface；With
Second adhesive layer, second adhesive layer adhere on the second surface of the buffer layer and are suitable for wearing described
Equipment is worn to adhere on the skin.
2. the wearable device as described in paragraph 1, wherein the buffer layer includes woven tissue layer.
3. the wearable device as described in paragraph 1 or 2, wherein the buffer layer includes the tissue layer of felt.
4. the wearable device as described in any one in paragraph 1~3, wherein the buffer layer includes netted fabric
Layer.
5. the wearable device as described in any one in paragraph 1~4, wherein the thickness of the buffer layer is not more than 100 μ
m。
6. the wearable device as described in any one in paragraph 1~5, wherein the thickness of the substrate is not more than 100 μm.
7. the wearable device as described in any one in paragraph 1~6, wherein the integrated circuit further include be configured to
The conformal antenna of the skin.
8. the wearable device as described in paragraph 7, wherein the antenna allows short-distance wireless communication.
9. the wearable device as described in paragraph 8, wherein the short-distance wireless communication is near-field communication (NFC) or radio frequency
It identifies (RFID).
10. the wearable device as described in any one in paragraph 1~9, wherein the substrate is by polyimides, poly- to benzene
Naphthalate, polyester, polyurethane, polycarbonate or combinations thereof are constituted.
11. the wearable device as described in any one in paragraph 1~10, wherein the buffer layer include silk, it is cotton, micro-
At least one of fiber, nylon, polyester, hemp and bamboo.
12. a kind of suitable for attaching to the flexible apparatus on skin, the flexible apparatus includes:
Antenna, the antenna provide short-distance wireless communication, and the antenna includes:
Substrate, the substrate have first surface and second surface；With
At least one becket, at least one becket setting is on the substrate；
Chip or integrated circuit, the chip or integrated circuit are electrically connected at least one described becket；
Buffer layer, the buffer layer have first surface and second surface；
First adhesive phase, the first adhesive phase adheres on the second surface of the substrate and the buffer layer
On first surface；With
Second adhesive phase, the second adhesive phase are suitable for the second surface of the buffer layer adhering to the skin
On.
13. the flexible apparatus as described in paragraph 12, wherein the antenna and the integrated circuit make the flexible apparatus
Near-field communication (NFC) is able to use to be communicated.
14. the flexible apparatus as described in paragraph 12 or 13, wherein the buffer layer includes woven tissue layer.
15. the flexible apparatus as described in any one in paragraph 12~14, wherein the buffer layer includes the fabric of felt
Layer.
16. the flexible apparatus as described in any one in paragraph 12~15, wherein the thickness of the buffer layer is not more than 100
μm。
17. the flexible apparatus as described in any one in paragraph 12~16, wherein the thickness of the substrate is not more than 100 μ
m。
18. the flexible apparatus as described in any one in paragraph 12~17, wherein the thickness of at least one becket
No more than 100 μm.
19. the flexible apparatus as described in any one in paragraph 12~18, wherein the antenna is flexible or stretchable
, the surface that the flexible apparatus is applied with it is conformal.
20. the flexible apparatus as described in any one in paragraph 12~19, wherein at least one described becket is by metal
It constitutes, the metal is selected from copper, tin, aluminium, gold, platinum, silver, silver paste and the slurry with metal nanoparticle.
21. the flexible apparatus as described in any one in paragraph 12~20, wherein the substrate is by polyimides, poly- to benzene
Naphthalate, polyester, polyurethane, polycarbonate or combinations thereof are constituted.
22. the flexible apparatus as described in any one in paragraph 12~21, wherein the buffer layer include silk, it is cotton, micro-
At least one of fiber, nylon, polyester, hemp and bamboo.
23. the flexible apparatus as described in any one in paragraph 12~22, wherein the chip or integrated circuit are installed to
On the first surface of the substrate.
24. the flexible apparatus as described in any one in paragraph 12~23, wherein the chip or integrated circuit are installed to
On the second surface of the substrate.
It is used herein to be expressed as all of component or reaction condition other than in operation example or except being otherwise noted
Number is interpreted as being modified by term " about " in all cases.What term " about " may refer to when being used in combination with percentage
It is ± the 1% of referenced value.For example, about 100 indicate from 99 to 101.
Unless the context is clearly stated, otherwise singular references " one ", "one" and "the" include plural referents.Class
As, unless the context is clearly stated, otherwise word "or" is intended to include "and".
Although similar or equivalent method and material can be used in the disclosure with those described herein method and material
In practice or test, but suitable method and material are described below.Term "comprising" indicates " comprising ".Abbreviation " e.g. " is spread out
It is born from Latin language example (exempli gratia), and is used herein to mean that non-limiting example.Therefore, it abridges
" e.g. " is synonymous with term " such as (for example) ".
Although preferred embodiment is had been described in and illustrates herein, for those skilled in the relevant art
Speech it is readily apparent that various modifications can be carried out without departing from the spirit of the invention, addition, replacement etc., and because
This thinks in the scope of the present invention that they are limited in the following claims.In addition, in the degree not yet shown at present,
Those skilled in the art will appreciate that any one of various embodiments described and illustrated herein can be into one
Step is modified as combining feature shown in any one of other embodiments disclosed herein.
What is quoted in entire the application includes bibliography, announced patent, the patent application announced and common
All patents of pending patent application and other publication contents are expressly incorporated into herein, for describing and disclosing
Such as the method described in these publications that can be used in combination with the techniques described herein.There is provided these publications only
It is because they are disclosed before the filing date of the present application.Any content in this respect is all not necessarily to be construed as by formerly hair
It is bright or recognize that inventor haves no right earlier than these disclosures due to any other.The elaboration on all about date is literary about these
The statement of part content is based on information obtained by applicant, does not constitute to the correctness on the date or content of these files
It is any to recognize.
It is that the description of the embodiment of the disclosure is not intended to exhaustion or the disclosure is limited to disclosed accurate shape
Formula.Although describing the specific embodiment and example of the disclosure for illustrative purpose herein, such as related fields
Technical staff will be recognized, can carry out various equivalent modifications within the scope of this disclosure.Although for example, with given sequence
Method and step or function are presented, but alternate embodiment can be executed in different order function or function can be with base
It is simultaneously performed in sheet.The introduction of the disclosure provided herein can be suitably applied to other processes or method.This paper institute
State various embodiments can be combined to provide further embodiment.If desired, all aspects of this disclosure can repair
It is changed to composition, function and the concept using above-mentioned bibliography and application, thus other embodiments of the disclosure are provided.
The key element of any one embodiment in foregoing embodiments can be combined or be substituted in other embodiments
Element.Although in addition, having been described in the context of these embodiments related to certain embodiments of the disclosure
The advantages of connection, but the advantage that other embodiments can also be shown, and and not all embodiment all must table
Reveal these advantages to fall within the scope of the disclosure.
Claims (24)
1. a kind of wearable device for being configured to adhere on skin, comprising:
Substrate, the substrate have first surface and second surface；
Integrated circuit, the integrated circuit are installed on the second surface of the substrate；
Buffer layer, the buffer layer have first surface and second surface；
First adhesive layer, first adhesive layer adheres on the second surface of the substrate and the first surface of the buffer layer
On；With
Second adhesive layer, second adhesive layer adhere on the second surface of the buffer layer and are suitable for wearable setting described
It is standby to adhere on the skin.
2. wearable device as described in claim 1, wherein the buffer layer includes woven tissue layer.
3. wearable device as described in claim 1, wherein the buffer layer includes the tissue layer of felt.
4. wearable device as described in claim 1, wherein the buffer layer includes netted tissue layer.
5. wearable device as described in claim 1, wherein the thickness of the buffer layer is not more than 100 μm.
6. wearable device as described in claim 1, wherein the thickness of the substrate is not more than 100 μm.
7. wearable device as described in claim 1, wherein integrated circuit further includes being configured to the day conformal with the skin
Line.
8. wearable device as claimed in claim 7, wherein the antenna allows short-distance wireless communication.
9. wearable device as claimed in claim 8, wherein the short-distance wireless communication is near-field communication (NFC) or radio frequency
It identifies (RFID).
10. wearable device as described in claim 1, wherein the substrate is by polyimides, polyethylene terephthalate
Ester, polyester, polyurethane, polycarbonate or combinations thereof are constituted.
11. wearable device as described in claim 1, wherein the buffer layer includes silk, cotton, microfibre, nylon, gathers
At least one of ester, hemp and bamboo.
12. a kind of suitable for attaching to the flexible apparatus on skin, the flexible apparatus includes:
Antenna, the antenna provide short-distance wireless communication, and the antenna includes:
Substrate, the substrate have first surface and second surface；With
At least one becket, at least one becket setting is on the substrate；
Chip or integrated circuit, the chip or integrated circuit are electrically connected at least one described becket；
Buffer layer, the buffer layer have first surface and second surface；
First adhesive phase, the first adhesive phase adhere to first with the buffer layer on the second surface of the substrate
On surface；With
Second adhesive phase, the second adhesive phase are suitable for adhering to the second surface of the buffer layer on the skin.
13. flexible apparatus as claimed in claim 12, wherein the antenna and the integrated circuit make the flexible apparatus
Near-field communication (NFC) is able to use to be communicated.
14. flexible apparatus as claimed in claim 12, wherein the buffer layer includes woven tissue layer.
15. flexible apparatus as claimed in claim 12, wherein the buffer layer includes the tissue layer of felt.
16. flexible apparatus as claimed in claim 12, wherein the thickness of the buffer layer is not more than 100 μm.
17. flexible apparatus as claimed in claim 12, wherein the thickness of the substrate is not more than 100 μm.
18. flexible apparatus as claimed in claim 12, wherein the thickness of at least one becket is not more than 100 μm.
19. flexible apparatus as claimed in claim 12, wherein the antenna is flexible or stretchable, so that the flexibility
The surface that equipment can be applied with it is conformal.
20. flexible apparatus as claimed in claim 12, wherein at least one described becket consists of metal, the metal choosing
From copper, tin, aluminium, gold, platinum, silver, silver paste and with the slurry of metal nanoparticle.
21. flexible apparatus as claimed in claim 12, wherein the substrate is by polyimides, polyethylene terephthalate
Ester, polyester, polyurethane, polycarbonate or combinations thereof are constituted.
22. flexible apparatus as claimed in claim 12, wherein the buffer layer include silk, cotton, microfibre, nylon, polyester,
At least one of hemp and bamboo.
23. flexible apparatus as claimed in claim 12, wherein the chip or integrated circuit are installed to the first of the substrate
On surface.
24. flexible apparatus as claimed in claim 12, wherein the chip or integrated circuit are installed to the second of the substrate
On surface.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662437162P | 2016-12-21 | 2016-12-21 | |
| US62/437,162 | 2016-12-21 | ||
| PCT/US2017/067818 WO2018119193A1 (en) | 2016-12-21 | 2017-12-21 | Buffered adhesive structures for wearable patches |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110234303A true CN110234303A (en) | 2019-09-13 |
Family
ID=62627794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780085387.7A Pending CN110234303A (en) | 2016-12-21 | 2017-12-21 | Buffering adhesive construction for wearable patch |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP3558187A4 (en) |
| CN (1) | CN110234303A (en) |
| WO (1) | WO2018119193A1 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8389862B2 (en) | 2008-10-07 | 2013-03-05 | Mc10, Inc. | Extremely stretchable electronics |
| WO2014058473A1 (en) | 2012-10-09 | 2014-04-17 | Mc10, Inc. | Conformal electronics integrated with apparel |
| EP3258837A4 (en) | 2015-02-20 | 2018-10-10 | Mc10, Inc. | Automated detection and configuration of wearable devices based on on-body status, location, and/or orientation |
| US10277386B2 (en) | 2016-02-22 | 2019-04-30 | Mc10, Inc. | System, devices, and method for on-body data and power transmission |
| WO2017184705A1 (en) | 2016-04-19 | 2017-10-26 | Mc10, Inc. | Method and system for measuring perspiration |
| US10447347B2 (en) | 2016-08-12 | 2019-10-15 | Mc10, Inc. | Wireless charger and high speed data off-loader |
| US20210236028A1 (en) * | 2018-05-17 | 2021-08-05 | Abbott Diabetes Care Inc. | Analyte sensor antimicrobial configurations and adhesives |
| CN115697187A (en) * | 2020-05-22 | 2023-02-03 | 吉温成像有限公司 | Medical patch |
| CN114464096B (en) * | 2022-03-23 | 2023-11-24 | 京东方科技集团股份有限公司 | electronic skin |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070179373A1 (en) * | 2005-12-22 | 2007-08-02 | Provex Technologies, Llc. | Integrated patch and assay device with visual detection means |
| US20110270049A1 (en) * | 2009-10-22 | 2011-11-03 | Corventis, Inc. | Method and Apparatus for Remote Detection and Monitoring of Functional Chronotropic Incompetence |
| WO2012094264A2 (en) * | 2011-01-05 | 2012-07-12 | Jenny Buettner | Adhesively attachable material and method for fabrication thereof |
| EP2910224A1 (en) * | 2014-02-19 | 2015-08-26 | Swiss VX Venentherapie und Forschung GmbH | Adhesive film bandage for medical compression |
| CN105050495A (en) * | 2013-01-23 | 2015-11-11 | 艾利丹尼森公司 | Wireless sensor patches and methods of manufacturing |
| US20160006123A1 (en) * | 2014-07-01 | 2016-01-07 | Mc10, Inc. | Conformal electronic devices |
| CN105592830A (en) * | 2013-10-10 | 2016-05-18 | 豪夫迈·罗氏有限公司 | Carrier system for an object worn on the body and method of production |
| CN205494156U (en) * | 2015-12-25 | 2016-08-24 | 北京光辉世纪工贸有限公司 | Ventilative bandage |
| US20160338646A1 (en) * | 2015-05-20 | 2016-11-24 | Mc10, Inc. | Ultra-thin wearable sensing device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9084530B2 (en) * | 2012-04-12 | 2015-07-21 | Elwha Llc | Computational methods and systems for reporting information regarding appurtenances to wound dressings |
| EP2914167B1 (en) * | 2012-11-01 | 2021-08-04 | Blue Spark Technologies, Inc. | Body temperature logging patch |
| CA2917532A1 (en) * | 2013-06-17 | 2014-12-31 | Guy SIMAN | Implant unit delivery tool |
| US9275322B2 (en) * | 2013-11-25 | 2016-03-01 | VivaLnk Limited (Cayman Islands) | Stretchable multi-layer wearable tag capable of wireless communications |
-
2017
- 2017-12-21 WO PCT/US2017/067818 patent/WO2018119193A1/en unknown
- 2017-12-21 CN CN201780085387.7A patent/CN110234303A/en active Pending
- 2017-12-21 EP EP17884178.9A patent/EP3558187A4/en not_active Withdrawn
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070179373A1 (en) * | 2005-12-22 | 2007-08-02 | Provex Technologies, Llc. | Integrated patch and assay device with visual detection means |
| US20110270049A1 (en) * | 2009-10-22 | 2011-11-03 | Corventis, Inc. | Method and Apparatus for Remote Detection and Monitoring of Functional Chronotropic Incompetence |
| WO2012094264A2 (en) * | 2011-01-05 | 2012-07-12 | Jenny Buettner | Adhesively attachable material and method for fabrication thereof |
| CN105050495A (en) * | 2013-01-23 | 2015-11-11 | 艾利丹尼森公司 | Wireless sensor patches and methods of manufacturing |
| CN105592830A (en) * | 2013-10-10 | 2016-05-18 | 豪夫迈·罗氏有限公司 | Carrier system for an object worn on the body and method of production |
| EP2910224A1 (en) * | 2014-02-19 | 2015-08-26 | Swiss VX Venentherapie und Forschung GmbH | Adhesive film bandage for medical compression |
| US20160006123A1 (en) * | 2014-07-01 | 2016-01-07 | Mc10, Inc. | Conformal electronic devices |
| US20160338646A1 (en) * | 2015-05-20 | 2016-11-24 | Mc10, Inc. | Ultra-thin wearable sensing device |
| CN205494156U (en) * | 2015-12-25 | 2016-08-24 | 北京光辉世纪工贸有限公司 | Ventilative bandage |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3558187A4 (en) | 2021-03-10 |
| WO2018119193A1 (en) | 2018-06-28 |
| EP3558187A1 (en) | 2019-10-30 |
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Effective date of registration: 20210907 Address after: USA New York Applicant after: Midida solutions Address before: Massachusetts, USA Applicant before: MC10, Inc. |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190913 |