CN110229586A - Composition epoxy resin and its processing method for protecting Metal Substrate PCB - Google Patents
Composition epoxy resin and its processing method for protecting Metal Substrate PCB Download PDFInfo
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- CN110229586A CN110229586A CN201910542882.7A CN201910542882A CN110229586A CN 110229586 A CN110229586 A CN 110229586A CN 201910542882 A CN201910542882 A CN 201910542882A CN 110229586 A CN110229586 A CN 110229586A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/222—Magnesia, i.e. magnesium oxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
Processing method the present invention relates to composition epoxy resin and its for protecting Metal Substrate PCB；Wherein, composition epoxy resin, it calculates by weight comprising component and its parts by weight are as follows: 10-30 parts of polyfunctional epoxy resin, 5-30 parts of liquid epoxies, 5-15 parts of thermoplastic resin, 1-25 parts of curing agent, 10-25 parts of solvent, 0.5-2 parts of promotor, 2-5 parts of additive and 20-30 parts of filler.Composition epoxy resin of the invention, to be liquid, after hot setting; the hardness of solidfied material; antiacid alkaline etching, heat-resisting quantity, by way of composition epoxy resin is heating and curing roller coating and vertically; a protective layer is formed in metal basal plane; after completing PCB processing procedure, the step of protective layer is removed by the way of grinding, substitutes artificial dyestripping; whole set process can realize automation, improve production efficiency.
Description
Technical field
The present invention relates to printed wiring board technical fields, more specifically refer to a kind of composition epoxy resin and its are used for
The processing method for protecting Metal Substrate PCB.
Background technique
Metal-based copper-clad plate is one of copper-clad laminate, is widely used in because it is with good heat dissipation performance
LED and high power module field.General common Metal Substrate is aluminium or copper, is the stronger metal material of activity, equal with acid, alkali
It can chemically react, therefore, the PCB processing of metal-based copper-clad plate at present is needed to attach on metal covering (non-thread road surface) and be protected
Film, to protect it in PCB processing, the corrosion such as acid, alkali for not being accessed.
Existing tradition film coating process needs manually then per minute may be used to metal mask using current automatic film applicator
2-3 piece is pasted, efficiency is lower；And aluminium sheet is unprocessed, little particle metal fillings impurity etc. can remain between film and metal covering, into
When row PCB is processed, aluminium face being scratched by pressure or scratches protective film, aluminium face is destroyed by acid, alkali.In patent CN201720586751
In, a kind of aluminum substrate film sticking apparatus is devised, dust suction cleaning is carried out to surface of aluminum plate, to reduce the risk that protective film is destroyed,
But which and traditional artificial pad pasting have no too many differences, merely by compressed air purging, destatic and carry out to metal covering
Cleaning, the cleaning effect not as good as the polishing of horizontal pretreatment line, oil removing and washing is good, and still can not solve film coating process efficiency
Low disadvantage；In addition, the protective film used is usually thermoplastic PE or PVC film, heat resistance itself is not high, while needing to lean on
One layer of glue of protection film surface coating is adhered to, and in tin spray process, high-temperature time is too long, that is, will cause thawing, the glue of film
The inharmonious of layer falls off, and influences the production of subsequent workshop section；And protective film is softer, is easy to be frayed in production process, causes aluminium face quilt
Acid, caustic corrosion form very deep corrosion trace, and needing to polish relatively could remove deeply；And the unit price of protective film is higher, produces in the market
The quality of product is irregular.And after metal substrate completes PCB processing procedure, it needing largely manually to remove dyestripping, the adhesiveness of film is very strong,
It can not tear easily, efficiency is lower, if reducing the adhesiveness of film, Metal Substrate edge easily penetrates into etching solution, causes edge rotten
Erosion.In patent CN201720122769, a kind of automatic dyestripping machine is devised, automatic stripping and winding may be implemented, more manually
Dyestripping efficiency has certain promotion, but in actual use, easily causes bending deformation for relatively thin metal substrate；If protective film
Viscosity is larger, and removing, which can also exist, to be not thorough.
Therefore, current film coating process is artificial and material cost is high, and efficiency is lower, and the technique automatic metaplasia relatively difficult to achieve
It produces.
Summary of the invention
It is an object of the invention to overcome the deficiencies of existing technologies, composition epoxy resin is provided and its for protecting metal
The processing method of base PCB.
To achieve the above object, the present invention is used in lower technical solution:
Composition epoxy resin calculates by weight comprising component and its parts by weight are as follows: polyfunctional epoxy resin
10-30 parts, 5-30 parts of liquid epoxies, 5-15 parts of thermoplastic resin, 1-25 parts of curing agent, 10-25 parts of solvent, promotor
0.5-2 parts, 2-5 parts of additive and 20-30 parts of filler.
Its further technical solution are as follows: the polyfunctional epoxy resin is more phenolic tetraglycidel ether epoxy resins, comprising:
Phenol type epoxy novolac, o-cresol type epoxy novolac, resorcinol formaldehyde epoxy, bisphenol A-type epoxy novolac, four phenolic group ethane four
Diglycidyl ether epoxy, triphenol methylmethane triglycidyl ether epoxy, 1,3,5-trihydroxybenzene triglycidyl ether epoxy or tetrafunctional ring
Oxygen resin.
Its further technical solution are as follows: the liquid epoxies be bisphenol A type epoxy resin, bisphenol f type epoxy resin,
Bisphenol-A D-ring oxygen resin, bisphenol-s epoxy resin or resorcinol type epoxy resin.
Its further technical solution are as follows: the thermoplastic resin is polyphenylene oxide, Noryl, polyamide resin
Rouge, polyether sulfone, polysulfones, polyether-ketone, polyether-ether-ketone, polyetherimide, polymethyl methacrylate, polycarbonate or aromatic series
Type polyamide.
Its further technical solution are as follows: the curing agent is polyamines or Novolca linear phenolic resin；It is described more
Amine substance includes: diethylenetriamine, triethylene tetramine, diaminodiphenylmethane, diaminodiphenylsulfone or dicyandiamide；It is described
Novolca linear phenolic resin includes phenol type phenolic resin, biphenyl type phenolic resin or BPA type phenolic resin.
Its further technical solution are as follows: the solvent is organic solvent, comprising: ethyl acetate, acetic acid ester, benzene, toluene,
Acetone, butanone, ethyl alcohol, butanol or propylene glycol monomethyl ether.
Its further technical solution are as follows: the promotor is imidazoles, comprising: 2-methylimidazole, 2- ethyl imidazol(e), 2- first
- 4 ethyl imidazol(e) of base, 2- phenylimidazole or 2- heptadecyl imidazole.
Its further technical solution are as follows: the additive is organosilicon alkanes thickener, levelling agent or defoaming agent.
Its further technical solution are as follows: the filler is platy talc, preparing spherical SiO 2, boron nitride, aluminium oxide, hydrogen
Aluminium oxide, boehmite, zinc oxide or magnesia.
The processing method that composition epoxy resin is used to protect Metal Substrate PCB, comprising the following steps:
Deploy composition epoxy resin；
Cleaning treatment is carried out to Metal Substrate PCB surface；
Composition epoxy resin is coated on Metal Substrate PCB surface；
Baking-curing is carried out to Metal Substrate PCB；
Carry out PCB technology processing；
Sanding and polishing is carried out to Metal Substrate PCB；
Into subsequent handling.
Compared with the prior art, the invention has the advantages that: the composition epoxy resin mixed, to be liquid, through height
After temperature solidification, the hardness of solidfied material, antiacid alkaline etching, heat-resisting quantity, the adhesiveness with metallic substrate surfaces is better than biography
The protective film of system by way of composition epoxy resin is heating and curing roller coating and vertically, forms one layer of protection in metal basal plane
Layer the step of instead of artificial pad pasting, realizes automation, improves production efficiency；By removing to metallic substrate surfaces pre-treatment
Little particle impurity and greasy dirt are removed, reduces and wipes flower risk, while the metal for improving the binding force of epoxy layer and metal covering, while designing
Basal plane protective layer can be used the grinding of automatic grinding printed line and remove, substitutes artificial dyestripping, efficiency and the degree of automation are all higher, more
Meet production requirement well.
The invention will be further described in the following with reference to the drawings and specific embodiments.
Detailed description of the invention
Fig. 1 is the flow chart for the processing method that composition epoxy resin of the present invention is used to protect Metal Substrate PCB；
Fig. 2 is the schematic diagram of painting work.
Specific embodiment
In order to more fully understand technology contents of the invention, combined with specific embodiments below to technical solution of the present invention into
One step introduction and explanation, but not limited to this.
Such as Fig. 1 to specific embodiment shown in Fig. 2, wherein as shown in Figure 1, the invention discloses a kind of epoxy resin groups
Object is closed, is calculated by weight comprising component and its parts by weight are as follows: 10-30 parts of polyfunctional epoxy resin, liquid epoxies
5-30 parts, 5-15 parts of thermoplastic resin, 1-25 parts of curing agent, 10-25 parts of solvent, 0.5-2 parts of promotor, 2-5 parts of additive, with
And 20-30 parts of filler.
Wherein, the polyfunctional epoxy resin is more phenolic tetraglycidel ether epoxy resins, comprising: phenol type phenolic aldehyde ring
Oxygen, o-cresol type epoxy novolac, resorcinol formaldehyde epoxy, bisphenol A-type epoxy novolac, four phenolic group ethane, four glycidol ether ring
Oxygen, triphenol methylmethane triglycidyl ether epoxy, 1,3,5-trihydroxybenzene triglycidyl ether epoxy or tetrafunctional epoxy resin etc., root
It is selected according to actual needs.
Wherein, the liquid epoxies is bisphenol A type epoxy resin, bisphenol f type epoxy resin, bisphenol-A D-ring oxygen tree
Rouge, bisphenol-s epoxy resin or resorcinol type epoxy resin etc., are selected according to actual needs.
Wherein, the thermoplastic resin is polyphenylene oxide, Noryl, polyamide, polyether sulfone, gathers
Sulfone, polyether-ketone, polyether-ether-ketone, polyetherimide, polymethyl methacrylate, polycarbonate or aromatic type polyamide
Deng being selected according to actual needs.
Further, in the present embodiment, the curing agent is polyamines, comprising: diethylenetriamine, triethylene four
Amine, diaminodiphenylmethane, diaminodiphenylsulfone or dicyandiamide.In other embodiments, curing agent can also be for known to disclosure
Epoxy hardener or various structures line style Novolca phenolic resin, such as phenol type phenolic resin, biphenyl type phenolic aldehyde tree
Rouge, BPA type phenolic resin etc..
Wherein, the solvent is organic solvent, comprising: ethyl acetate, acetic acid ester, benzene, toluene, acetone, butanone, second
Alcohol, butanol or propylene glycol monomethyl ether；According to actual needs, it is used cooperatively using the different solvent of volatility.
Wherein, the promotor is imidazoles, comprising: 2-methylimidazole, 2- ethyl imidazol(e), -4 ethyl imidazol(e) of 2- methyl, 2-
Phenylimidazole or 2- heptadecyl imidazole etc., are selected according to actual needs.
Wherein, the additive is organosilicon alkanes thickener, levelling agent or defoaming agent etc., is carried out according to actual needs
Selection.
Wherein, the filler be platy talc, preparing spherical SiO 2, boron nitride, aluminium oxide, aluminium hydroxide, boehmite,
Zinc oxide or magnesia etc., partial size is at 3-5 μm.
Wherein, the processing method the invention also discloses composition epoxy resin for protecting Metal Substrate PCB, including it is following
Step:
Deploy composition epoxy resin；
Cleaning treatment is carried out to Metal Substrate PCB surface；
Composition epoxy resin is coated on Metal Substrate PCB surface；
Baking-curing is carried out to Metal Substrate PCB；
Carry out PCB technology processing；
Sanding and polishing is carried out to Metal Substrate PCB；
Into subsequent handling.
Wherein, composition epoxy resin of the invention has the following characteristics that solidification rapidly, can be under the conditions of 180 DEG C, 10 points
Clock solidification, curing degree are greater than 95%；Cured product acid-proof alkaline is excellent, and heat resistance is good, and surface hardness is greater than 7H, resists
Scratch ability is strong；Partial filler is added, grinding efficiency can be improved, shortens grinding number；Composition epoxy resin presses formula rate
Different components and mixing are weighed, using high shear agitation 1 hour, dispersion mixing is carried out, is handled through standing and defoaming, institute is made
The composition epoxy resin needed, viscosity are 3500-5500cps or so.
During carrying out cleaning treatment to Metal Substrate PCB surface, the metal substrate for needing to protect overlay film carries out edging
Chamfered carries out polishing to metal primary surface through horizontal pretreatment line and oil removing is handled well most afterwards after washing and drying
Metal substrate.
As shown in Fig. 2, obtained composition epoxy resin to be coated uniformly on to the metal base table that need to be protected with coating machine
Face, coating thickness is controlled at 15 ± 1 μm or so, without special standing or precuring, by the vertical baking tunnel of backrest type, if
Fixed baking section temperature is 180 DEG C, and walking speed is set according to tunnel furnace length, controls baking time at 8-10 minutes or so, consolidate
To change product, forms one layer of hard protective layer in metal surface, the metal substrate with matcoveredn carries out subsequent PCB processing procedure,
After completing whole processing procedures, polished 4-8 times using 240 mesh ceramics brushes protective layer, 600 mesh nonwoven fabrics are to protective layer sanding and polishing 1
It is secondary, the protective layer is removed, through washing and drying, obtains finished product plate, subsequent production technique can be entered.
Wherein, composition epoxy resin of the invention can design different proportion formula, realize different embodiments, as follows
Shown in table:
| Component | Embodiment one | Embodiment two | Embodiment three | Example IV | Comparative example one | Comparative example two |
| Multi-functional epoxy | 20 | 20 | 20 | 25 | 20 | 20 |
| Liquid epoxy | 15 | 15 | 20 | 15 | 15 | 15 |
| Thermoplastic resin | 10 | 10 | 10 | 10 | 10 | 10 |
| Curing agent | 5 | 5 | 5 | 5 | 5 | 5 |
| Solvent | 10 | 10 | 15 | 10 | 10 | 10 |
| Promotor | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 |
| Levelling agent | 1 | 1 | 1 | 1 | 1 | 0 |
| Defoaming agent | 1 | 1 | 1 | 1 | 1 | 1 |
| Thickener | 1 | 1 | 1 | 1 | 1 | 0 |
| Filler | 20 | 30 | 20 | 20 | 20 | 20 |
Wherein, comparison one is identical as one component of embodiment, the difference is that shortening the baking-curing time is 5 minutes, drop
Low curing degree, to improve the efficiency of grinding；And comparative example two and embodiment one the difference is that, thickener and stream are not added
Flat agent.
It is directed to above-mentioned different proportion formula, is tested for the property: using rotational viscometer, epoxy resin after test mixing
Composition viscosity；Using pencil hardometer, solidfied material surface hardness is tested；Using infrared spectrometer, be all-trans emission mode, and test is simultaneously
Calculate epoxy resin composition degree；Using PCB circuit etching line, simulated production process tests the antiacid alkaline etching of protective film
Quarter ability；Using ceramic polish-brush, test grinds off number needed for protective layer；Its performance test results is as follows:
| Performance | Embodiment one | Embodiment two | Embodiment three | Example IV | Comparative example one | Comparative example two |
| Gelatin viscosity | 4300cps | 5200cps | 3700cps | 4500cps | 4300cps | 4000cps |
| Solidfied material hardness | 6H | 5H | 5H | 7H | 4H | 6H |
| Curing degree | 94.6% | 93.2% | 92.7 | 95.8% | 90.3% | 93.9% |
| Antiacid alkaline etching | It is qualified | It is qualified | It is unqualified | It is qualified | It is unqualified | It is unqualified |
| Grind number | 6 times | 7 times | 6 times | 8 times | 4 times | 7 times |
Wherein, levelling agent is not added for comparative example two, and coating surface can not form burnishing surface after coating, and thickener is not added,
In vertical baking process, sagging phenomenon is produced, causes coating part height different, local resin layer is excessively thin, can not be complete
Cover metal surface；The many factors such as comprehensive coating process, condensate performance and grinding cost, it is real for selecting composition ratio
Ratio employed in example one is applied, the composition viscosity is suitable for coating, and solidfied material surface is smooth, and hardness and resistance to acid and alkali are excellent
Different, simultaneous grinding number is moderate, is easier to remove.
Composition epoxy resin of the invention substitutes thermoplasticity protective film, can solve poor heat resistance, and hardness is inadequate, is easy quilt
The problem of scratching also reduces production cost, while not needing artificial film coating process, solves the problems, such as low efficiency；Using
Surface of aluminum plate pre-treatment removes remained on surface particle and greasy dirt, reduces the risk that protective layer cracky causes metal covering to corrode,
After completing PCB processing procedure, artificial dyestripping process can be eliminated, solves the problems, such as low efficiency；It can also be achieved automated production, reduce personnel
Operation, improves product quality.
It is above-mentioned that technology contents of the invention are only further illustrated with embodiment, in order to which reader is easier to understand, but not
It represents embodiments of the present invention and is only limitted to this, any technology done according to the present invention extends or recreation, by of the invention
Protection.Protection scope of the present invention is subject to claims.
Claims (10)
1. composition epoxy resin, which is characterized in that calculate by weight comprising component and its parts by weight are as follows: multifunctional
10-30 parts of epoxy resin, 5-30 parts of liquid epoxies, 5-15 parts of thermoplastic resin, 1-25 parts of curing agent, 10-25 parts of solvent,
0.5-2 parts of promotor, 2-5 parts of additive and 20-30 parts of filler.
2. composition epoxy resin according to claim 1, which is characterized in that the polyfunctional epoxy resin is polyphenol type
Tetraglycidel ether epoxy resin, comprising: phenol type epoxy novolac, o-cresol type epoxy novolac, resorcinol formaldehyde epoxy, bis-phenol
A type epoxy novolac, four phenolic group ethane, four diglycidyl ether epoxy, triphenol methylmethane triglycidyl ether epoxy, 1,3,5-trihydroxybenzene three
Diglycidyl ether epoxy or tetrafunctional epoxy resin.
3. composition epoxy resin according to claim 1, which is characterized in that the liquid epoxies is bisphenol A-type
Epoxy resin, bisphenol f type epoxy resin, bisphenol-A D-ring oxygen resin, bisphenol-s epoxy resin or resorcinol type asphalt mixtures modified by epoxy resin
Rouge.
4. composition epoxy resin according to claim 1, which is characterized in that the thermoplastic resin is polyphenylene oxygen
Compound, Noryl, polyamide, polyether sulfone, polysulfones, polyether-ketone, polyether-ether-ketone, polyetherimide, polymethyl
Sour methyl esters, polycarbonate or aromatic type polyamide.
5. composition epoxy resin according to claim 1, which is characterized in that the curing agent be polyamines or
Novolca linear phenolic resin；The polyamines include: diethylenetriamine, triethylene tetramine, diaminodiphenylmethane,
Diaminodiphenylsulfone or dicyandiamide；The Novolca linear phenolic resin includes phenol type phenolic resin, biphenyl type phenolic aldehyde tree
Rouge or BPA type phenolic resin.
6. composition epoxy resin according to claim 1, which is characterized in that the solvent is organic solvent, comprising: second
Acetoacetic ester, acetic acid ester, benzene, toluene, acetone, butanone, ethyl alcohol, butanol or propylene glycol monomethyl ether.
7. composition epoxy resin according to claim 1, which is characterized in that the promotor is imidazoles, comprising: 2- first
Base imidazoles, 2- ethyl imidazol(e), -4 ethyl imidazol(e) of 2- methyl, 2- phenylimidazole or 2- heptadecyl imidazole.
8. composition epoxy resin according to claim 1, which is characterized in that the additive is the thickening of organosilicon alkanes
Agent, levelling agent or defoaming agent.
9. composition epoxy resin according to claim 1, which is characterized in that the filler is platy talc, spherical shape
Silica, boron nitride, aluminium oxide, aluminium hydroxide, boehmite, zinc oxide or magnesia.
10. the processing method that composition epoxy resin is used to protect Metal Substrate PCB, which comprises the following steps:
Deploy composition epoxy resin；
Cleaning treatment is carried out to Metal Substrate PCB surface；
Composition epoxy resin is coated on Metal Substrate PCB surface；
Baking-curing is carried out to Metal Substrate PCB；
Carry out PCB technology processing；
Sanding and polishing is carried out to Metal Substrate PCB；
Into subsequent handling.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910542882.7A CN110229586A (en) | 2019-06-21 | 2019-06-21 | Composition epoxy resin and its processing method for protecting Metal Substrate PCB |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910542882.7A CN110229586A (en) | 2019-06-21 | 2019-06-21 | Composition epoxy resin and its processing method for protecting Metal Substrate PCB |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114561117A (en) * | 2022-01-24 | 2022-05-31 | 苏州市汉宜化学有限公司 | Anticorrosive paint, preparation method and application thereof |
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| CN116162391A (en) * | 2022-12-28 | 2023-05-26 | 河南省科学院化学研究所 | Photo-thermal driving limited solid-liquid transition self-repairing anti-corrosion coating material and preparation method thereof |
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