CN110224085B - Manufacturing method of lateral air-barrier packaging structure - Google Patents
Manufacturing method of lateral air-barrier packaging structure Download PDFInfo
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- CN110224085B CN110224085B CN201910655184.8A CN201910655184A CN110224085B CN 110224085 B CN110224085 B CN 110224085B CN 201910655184 A CN201910655184 A CN 201910655184A CN 110224085 B CN110224085 B CN 110224085B
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- liquid optical
- gas barrier
- substrate
- barrier layer
- electrostatic
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The invention provides a manufacturing method of a lateral gas barrier packaging structure, which comprises the steps of coating polarized liquid optical cement on a substrate, enabling a gas barrier precursor to be adsorbed and fixed on the surface of the liquid optical cement around the substrate through an electrostatic disk in an electrostatic adsorption mode, changing the appearance of the liquid optical cement, enabling the gas barrier precursor to be combined above the liquid optical cement, forming a lateral gas barrier layer through precuring, then covering a barrier layer, and performing post-curing to achieve complete sealing so as to complete packaging. The manufacturing method omits the conventional yellow light process, is beneficial to realizing a one-stop packaging process, can effectively block air, can shorten the processing time and can reduce the production cost.
Description
Technical Field
The present invention relates to a gas barrier film packaging technology, and more particularly, to a method for manufacturing a lateral gas barrier packaging structure without a photolithography process.
Background
In order to meet the added value of light weight, flexibility, impact resistance and portability required by modern consumers for electronic products, the technology development trend on display materials in recent years has gradually replaced the traditional glass substrate with a plastic substrate.
For an Organic Light Emitting Diode (OLED) display, although highly reliable, the glass substrate is not flexible, is not light enough, and is difficult to satisfy various requirements of a flexible display. Referring to fig. 1, in the basic structure of the conventional flexible OLED display, the plastic substrate 10 is used to replace the glass substrate in the rigid OLED display, which can provide characteristics of being light, thin, flexible and impact-resistant, but the plastic substrate 10 has poor insulation against moisture and oxygen in the external environment, which causes the OLED device 20 to be easily damaged, and therefore a lateral gas Barrier structure (Side Wall Barrier)30 needs to be added to ensure the function and the service life of the OLED device 20.
However, as shown in fig. 2 to 4, in the packaging process of the OLED display using the lateral gas barrier structure 30 in the prior art, a bump 31 (see fig. 2) with a height of about 200 nanometers (nm) is formed around the lateral gas barrier structure 30 by a photolithography process, a gas barrier precursor 32 (see fig. 3) is coated on the bump, and the lateral gas barrier structure 30 is obtained by baking and sealed by using a low outgassing sheet-like glue material as a barrier layer 40 (see fig. 4).
The conventional packaging process is complicated, and requires a screen printing process after a yellow light process, and requires moving to different process sites, which not only limits the production speed, but also causes difficulty in increasing the production efficiency and reduces the production cost. Therefore, there is a need to find an optimized process for the lateral gas barrier package structure.
Disclosure of Invention
Accordingly, the present invention is directed to a method for manufacturing a lateral gas barrier package structure, which forms a lateral gas barrier layer by electrostatic adsorption, so as to effectively block gas and facilitate a one-stop package process, thereby simplifying the process, reducing the time and cost, and completely solving the above-mentioned drawbacks of the prior art.
Therefore, in order to achieve the above object, the present invention provides a method for manufacturing a lateral gas barrier package structure, which comprises coating a polarized liquid optical glue on a substrate, and coating a gas barrier precursor on the periphery of an adsorption surface of an electrostatic disk, wherein an electrostatic adsorption force exists between the gas barrier precursor and the adsorption surface. Then, the adsorption surface of the electrostatic disk is close to the substrate, so that the gas barrier precursor contacts the liquid optical cement around the substrate, and simultaneously, the appearance of the liquid optical cement around the substrate is changed by the electrostatic adsorption force. And releasing the electrostatic adsorption force, removing the electrostatic disk, leaving the gas barrier precursor to cover the liquid optical adhesive, and performing pre-curing to form the lateral gas barrier layer. Finally, the barrier layer is covered on the substrate by the lateral gas barrier layer, and then post-curing is carried out to complete the packaging.
According to an embodiment of the present invention, the polarized liquid optical adhesive is obtained by applying a voltage to generate a polarization charge on a surface of the liquid optical adhesive.
According to an embodiment of the present invention, the substrate may be a glass substrate or a plastic substrate.
According to an embodiment of the present invention, the plastic substrate may be Polyimide (PI), Polycarbonate (PC), Polyethersulfone (PES), Polyacrylate (PA), Polynorbornene (PNB), polyethylene terephthalate (PET), Polyetheretherketone (PEEK), polyethylene naphthalate (PEN), or Polyetherimide (PEI).
According to an embodiment of the present invention, the height of the lateral gas barrier layer is 100 to 200 nanometers (nm).
According to an embodiment of the present invention, the gas barrier precursor is coated on the liquid optical adhesive around the substrate to a height of 20 to 50 nanometers (nm).
According to an embodiment of the present invention, the substrate is provided with a light emitting device, and the lateral gas barrier layer is located around the light emitting device; preferably, the light emitting element may be an active organic light emitting diode (AMOLED) or a Micro light emitting diode (Micro LED).
According to an embodiment of the present invention, the liquid optical adhesive may be a thermal curing type liquid optical adhesive or an ultraviolet curing type liquid optical adhesive.
According to an embodiment of the present invention, the barrier layer may be selected from at least one of silicon oxide, silicon nitride, silicon oxynitride and aluminum oxide.
According to an embodiment of the present invention, the electrostatic disk may be square, circular or triangular.
Compared with the prior art, the manufacturing method of the lateral gas barrier packaging structure provided by the invention omits a yellow light process, adsorbs and fixes the gas barrier precursor on the polarized liquid optical cement in an electrostatic adsorption mode, and changes the appearance of the liquid optical cement, so that the gas barrier precursor and the liquid optical cement can form a lateral gas barrier layer after being cured, thereby achieving the purpose of effective gas barrier packaging. Therefore, the present invention has a one-stop packaging process, so as to greatly reduce the manufacturing cost and the production time.
The purpose, technical content, features and effects of the present invention will be more readily understood by the following detailed description of the embodiments taken in conjunction with the accompanying drawings.
Drawings
FIG. 1 shows a basic structure of a conventional flexible OLED display.
FIGS. 2 to 4 illustrate a conventional packaging process of an OLED display using a lateral gas barrier structure.
Fig. 5 is a flowchart of a method for manufacturing a lateral gas barrier package structure according to an embodiment of the invention.
Fig. 6 to 11 are schematic structural views of steps corresponding to the manufacturing method of the lateral gas barrier packaging structure according to the embodiment of the invention.
FIG. 12 is an enlarged cross-sectional view of a lateral gas barrier layer according to an embodiment of the present invention.
Fig. 13 is a schematic view of a lateral gas barrier package structure according to an embodiment of the invention.
Figures 14 and 15 are schematic views of electrostatic disks using different shapes in embodiments of the present invention.
Reference numerals:
10 Plastic substrate
20 OLED element
30 side direction choke structure
31 bump
32 gas barrier precursor
40 barrier layer
110 substrate
111 glass carrier plate
112 polyimide film
120 liquid optical cement
130 electrostatic disk
130A circular electrostatic disk
130B triangle electrostatic disk
131 adsorption surface
140 gas barrier precursor
150 side gas barrier
160 barrier layer
170 light emitting element
Detailed Description
The invention discloses a manufacturing method of a lateral gas barrier packaging structure, which is applied to packaging of a light-emitting element in a display and used for blocking water or gas from entering.
Please refer to fig. 5, which illustrates a flowchart of a method for manufacturing a lateral gas barrier package structure according to an embodiment of the present invention; meanwhile, please refer to fig. 6 to 11, which are schematic structural diagrams corresponding to steps in the manufacturing method of the lateral gas barrier package structure according to the embodiment of the present invention.
First, in step S10, as shown in fig. 6, a polarized liquid optical adhesive (LOCA) 120 is provided, and the liquid optical adhesive 120 is coated on the substrate 110.
In this embodiment, the polarized liquid optical adhesive 120 is provided by applying a voltage to the liquid optical adhesive to generate a polarization charge on the surface of the liquid optical adhesive, and is coated on the substrate 110 by a coater. The liquid optical adhesive 120 may be a thermosetting liquid optical adhesive or an ultraviolet curing liquid optical adhesive. In addition, the operating conditions of the polarization treatment include: the polarization voltage is 0.5-5 kilovolts (kV), and the polarization time is 3-8 seconds.
In this embodiment, a Polyimide (PI) film 112 is coated on a glass carrier 111 in advance to form a substrate 110. In practical applications, the substrate 110 of the present invention may be a glass substrate or a plastic substrate, and the material of the plastic substrate may be Polyimide (PI), Polycarbonate (PC), Polyethersulfone (PES), Polyacrylate (PA), Polynorbornene (PNB), polyethylene terephthalate (PET), Polyetheretherketone (PEEK), polyethylene naphthalate (PEN), or Polyetherimide (PEI).
In step S20, as shown in fig. 7, an electrostatic chuck 130 is provided, and as shown in fig. 8, the gas barrier precursor 140 is coated around the adsorption surface 131 under the electrostatic chuck 130, so that an electrostatic attraction force is formed between the gas barrier precursor 140 and the adsorption surface 131.
Then, in step S30, as shown in fig. 9, the adsorption surface 131 of the electrostatic chuck 130 is placed close to the substrate 110, so that the gas barrier precursor 140 just contacts the surface of the liquid optical adhesive 120 around the substrate 110, and the liquid optical adhesive 120 around the substrate 110 can change its morphology by electrostatic adsorption.
Then, in step S40, as shown in fig. 10, the electrostatic chuck 130 is removed to leave the liquid optical adhesive 120 and the gas barrier precursor 140 on the substrate 110, and the gas barrier precursor 140 covers the liquid optical adhesive 120 around the substrate 110, and the liquid optical adhesive 120 and the gas barrier precursor 140 on the substrate 110 are pre-cured to form a lateral gas barrier layer 150.
In the present embodiment, the height D of the lateral gas barrier layer 150 is about 100 to 200 nanometers (nm), and the height D of the gas barrier precursor 140 covering the liquid optical adhesive 120 around the substrate 110 is about 20 to 50 nanometers (nm), as shown in FIG. 12.
Finally, in step S50, as shown in fig. 11, the barrier layer 160 is covered on the substrate 110 by the lateral gas barrier layer 150, and then post-curing is performed to complete the package.
In this embodiment, the material of the barrier layer 160 can be selected from at least one of silicon oxide, silicon nitride, silicon oxynitride and aluminum oxide.
Fig. 13 is a schematic view showing a usage of the lateral gas barrier package structure according to the embodiment of the invention.
In the lateral gas barrier package structure of the present embodiment, a light emitting device 170 may be disposed on the substrate 110, and the lateral gas barrier layer 150 is located around the light emitting device 170, so that a closed space is formed between the barrier layer 160 and the substrate 110 by the gas barrier function of the lateral gas barrier layer 150 to close the light emitting device 170, thereby preventing moisture and oxygen in the external environment from entering the closed space, and ensuring the performance and the service life of the light emitting device 170. The present invention can be applied to any display architecture requiring packaging, and is particularly applicable to the flexible display currently in use, and the light emitting element 170 can be, for example, an active organic light emitting diode (AMOLED) or a Micro light emitting diode (Micro LED).
In addition, the above embodiment uses the frame-shaped electrostatic disk 130, which is of a square frame shape, to coat the gas barrier precursor 140 (see fig. 8) that is surrounded in a square frame shape; in practice, the frame-shaped electrostatic chuck 130 can be designed according to different shapes of package structures, and can also present any package boundary patterns such as circular, triangular, etc. besides the square frame-shaped electrostatic chuck. As shown in fig. 14 and 15, a circular electrostatic disk 130A and a triangular electrostatic disk 130B are shown, respectively.
In summary, according to the manufacturing method of the lateral gas barrier package structure disclosed in the present invention, the gas barrier precursor is fixed on the surface of the polarized liquid optical adhesive by electrostatic adsorption, and the shape of the liquid optical adhesive is changed by static electricity, so that the gas barrier precursor is left to cover the liquid optical adhesive after the electrostatic adsorption force is eliminated, thereby obtaining the lateral gas barrier layer with gas barrier capability. Compared with the prior art, the invention omits the prior yellow light process, does not need to adopt expensive equipment and complex steps, does not need to move to different process stations, is beneficial to realizing a one-stop packaging process, and greatly reduces the manufacturing cost and the production time.
The above-mentioned embodiments are merely illustrative of the technical spirit and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the content of the present invention and to implement the same, so that the scope of the present invention should not be limited by the above-mentioned embodiments, and all equivalent changes and modifications made in the spirit of the present invention should be covered by the scope of the present invention.
Claims (10)
1. A method for manufacturing a lateral gas barrier packaging structure is characterized by comprising the following steps:
coating a polarized liquid optical cement on a substrate, wherein the polarized liquid optical cement is provided by applying voltage to the liquid optical cement to generate polarization charges on the surface of the liquid optical cement;
coating a gas-barrier precursor on a peripheral area on an adsorption surface of an electrostatic disk, wherein an electrostatic adsorption force exists between the gas-barrier precursor and the adsorption surface;
pressing the adsorption surface of the electrostatic disk close to the substrate to make the gas-barrier precursor contact the liquid optical adhesive in the peripheral area on the substrate, and changing the appearance of the liquid optical adhesive in the peripheral area on the substrate by the electrostatic adsorption force;
removing the electrostatic adsorption force, leaving the gas barrier precursor to cover the liquid optical adhesive, and performing pre-curing to form a lateral gas barrier layer; and
covering a barrier layer on the substrate by the lateral gas barrier layer, and performing post-curing to complete the package.
2. The method of claim 1, wherein the substrate is a glass substrate or a plastic substrate.
3. The method of claim 2, wherein the plastic substrate is selected from the group consisting of polyimide, polycarbonate, polyethersulfone, polyacrylate, polynorbornene, polyethylene terephthalate, polyetheretherketone, polyethylene naphthalate, and polyetherimide.
4. The method of claim 1, wherein the lateral gas barrier layer has a height of 100 to 200 nm.
5. The method of claim 1, wherein the gas barrier precursor is coated on the liquid optical glue around the substrate to a height of 20-50 nm.
6. The method of claim 1, wherein a light-emitting device is disposed on the substrate, and the lateral gas barrier layer is disposed around the light-emitting device.
7. The method of claim 6, wherein the light-emitting device is an active organic light-emitting diode or a micro-light-emitting diode.
8. The method of claim 1, wherein the liquid optical adhesive is a thermosetting liquid optical adhesive or an ultraviolet curable liquid optical adhesive.
9. The method of claim 1, wherein the barrier layer is at least one of silicon oxide, silicon nitride, silicon oxynitride, and aluminum oxide.
10. The method of claim 1, wherein the electrostatic plate is square, circular or triangular.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910655184.8A CN110224085B (en) | 2019-07-19 | 2019-07-19 | Manufacturing method of lateral air-barrier packaging structure |
| TW108126213A TWI695532B (en) | 2019-07-19 | 2019-07-24 | Method for manufacturing side wall barrier package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201910655184.8A CN110224085B (en) | 2019-07-19 | 2019-07-19 | Manufacturing method of lateral air-barrier packaging structure |
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| CN110224085A CN110224085A (en) | 2019-09-10 |
| CN110224085B true CN110224085B (en) | 2021-06-11 |
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| TW517356B (en) * | 2001-10-09 | 2003-01-11 | Delta Optoelectronics Inc | Package structure of display device and its packaging method |
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| KR20140061095A (en) * | 2012-11-13 | 2014-05-21 | 삼성디스플레이 주식회사 | Organic light emitting display apparatus and method of manufacturing the same |
| CN107046104A (en) * | 2017-01-10 | 2017-08-15 | 广东欧珀移动通信有限公司 | OLED encapsulating structures and preparation method thereof |
| CN108987608B (en) * | 2018-07-24 | 2021-01-05 | 京东方科技集团股份有限公司 | OLED display panel, manufacturing method thereof and display device |
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- 2019-07-24 TW TW108126213A patent/TWI695532B/en active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US6612888B1 (en) * | 2000-03-30 | 2003-09-02 | Delta Optoelectronics, Inc. | Packaging method of electroluminescence devices |
| TWI501441B (en) * | 2012-08-24 | 2015-09-21 | Ind Tech Res Inst | Discontinuous compound barrier layer, method for forming the same and package using the same |
| CN104619485A (en) * | 2012-09-28 | 2015-05-13 | 日本瑞翁株式会社 | Composite gas barrier laminate and method for producing same, and composite electrode |
| TW201422441A (en) * | 2012-12-06 | 2014-06-16 | Ind Tech Res Inst | Environmental sensitive electronic device package and manufaturing method thereof |
| TW201434653A (en) * | 2013-03-15 | 2014-09-16 | Au Optronics Corp | An electronic device and fabricating method thereof |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI695532B (en) | 2020-06-01 |
| TW202105794A (en) | 2021-02-01 |
| CN110224085A (en) | 2019-09-10 |
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