CN110208367A - Plane capacitance-vortex dual-modality sensor detection system and method for determining defects - Google Patents
Plane capacitance-vortex dual-modality sensor detection system and method for determining defects Download PDFInfo
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- CN110208367A CN110208367A CN201910539634.7A CN201910539634A CN110208367A CN 110208367 A CN110208367 A CN 110208367A CN 201910539634 A CN201910539634 A CN 201910539634A CN 110208367 A CN110208367 A CN 110208367A
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/22—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance
- G01N27/24—Investigating the presence of flaws
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/72—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables
- G01N27/82—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws
- G01N27/90—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws using eddy currents
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Abstract
The present invention relates to plane capacitance-vortex dual-modality sensor detection system and the methods for carrying out determining defects using the system, and detection system includes plane capacitance-vortex dual-modality sensor, signal generator, detection pattern switching device, charge amplifier, voltage amplifier, lock-in amplifier, data collecting card, computer and signal processing module；Determination method is that excitation coil generates magnetic field and electric field via detection pattern switching device Fast transforms winding wiring mode above sample, conductor part in sample is set to generate vortex field using magnetic field, the changes of magnetic field of detection coil pickup conductor part vortex field, detection coil picks up electric field change simultaneously, the surface of conductive portion in sample is detected using electric field or is concealed defects, obtained detection signal combination data collecting card, computer and signal processing module, it can be quick, the defects detection and defect type for efficiently realizing the test button of surface cladding insulating layer are distinguished.
Description
Technical field
Present patent application is related to electromagnetic nondestructive testing field, especially a kind of plane capacitance-vortex bimodal sensing
Device detection system and method for determining defects.
Background technique
In electromagnetic nondestructive field, vortex imaging technology is detected for metallic conductor, and capacitance imaging technology is led for non-
Physical examination is surveyed, due to how fast and efficiently to realize surface currently without the technology that can realize vortex imaging and capacitance imaging simultaneously
The test button defects detection and defect type differentiation for coating insulating layer are a technical problems.
Summary of the invention
The technical problem to be solved by the invention is to provide a kind of novel plane capacitance-vortex dual-modality sensor detections
System and method of determining defects can fast and efficiently realize the test button defects detection and defect of surface cladding insulating layer
Type classification.
To solve the above-mentioned problems, the technical scheme adopted by the invention is that:
A kind of plane capacitance-vortex dual-modality sensor detection system, including the plane capacitance for detection-vortex bimodulus
State sensor, the signal generator being connect with plane capacitance-vortex dual-modality sensor input terminal and plane capacitance-vortex
The detection pattern switching device of the output end connection of dual-modality sensor, the charge amplifier being connect with detection pattern switching device
The lock-in amplifier that is all connected with voltage amplifier, by detection pattern switching device and charge amplifier and voltage amplifier,
The data collecting card connecting with lock-in amplifier, the computer and signal processing module that connect with data collecting card, signal occur
Device is also connected with lock-in amplifier, and data collecting card is also connected with detection pattern switching device；Plane capacitance-vortex dual-modality sensor
Probe in be equipped with the excitation coil and detection coil of corresponding matching, excitation coil and signal generator and detection pattern switching fill
It sets and is all connected with, detection coil is connect with detection pattern switching device.
Technical solution of the present invention further improvement lies in that: detection pattern switching device includes single-pole single-throw switch (SPST) I, hilted broadsword
Single-throw switch II, single-pole double-throw switch (SPDT) I, single-pole double-throw switch (SPDT) II, excitation coil one end and signal generator voltage output end connect
It connects, the port connection of the other end and single-pole single-throw switch (SPST) I；Detection coil one end connect with the port of single-pole single-throw switch (SPST) II, is another
One end is connect with the port one of single-pole double-throw switch (SPDT) I, the port two of single-pole double-throw switch (SPDT) I connect with voltage amplifier input terminal,
Port three is connect with charge amplifier input terminal；The port one of single-pole double-throw switch (SPDT) II connect with the output end of voltage amplifier,
Port two is connect with the output end of charge amplifier, port three is connect with the input port of lock-in amplifier；Signal generator
The connection of the reference signal input port of reference signal output port and lock-in amplifier, the output port of lock-in amplifier, data
Capture card and computer and signal processing module are sequentially connected；Data collecting card and single-pole single-throw switch (SPST) I, single-pole single-throw switch (SPST)
II, the corresponding ports connection of single-pole double-throw switch (SPDT) I, single-pole double-throw switch (SPDT) II.
Technical solution of the present invention further improvement lies in that: plane capacitance-vortex dual-modality sensor probe include pass
Sensor cartridge bottom is arranged in for fixing the fixation hole of PCB probe, being arranged on sensor cartridge and be used in sensor box body
Several through-holes of BNC connector are welded, excitation coil and detection coil are arranged in sensor box body.
Technical solution of the present invention further improvement lies in that: sensor cartridge is cuboid, and fixation hole is rectangle, through-hole
Quantity is 4 and shape is round.
Technical solution of the present invention further improvement lies in that: detection pattern switching device further include switching switch box body, set
Set the intracorporal bracket for fixed switching chip development plate of switching switch enclosure, be arranged on switching switch box body for drawing
The circular fairlead of line connection, single-pole single-throw switch (SPST) I, single-pole single-throw switch (SPST) II, single-pole double-throw switch (SPDT) I, single-pole double-throw switch (SPDT)
II, data collecting card passes through fairlead and connect with switching switch box body.
Technical solution of the present invention further improvement lies in that: switching switch tray interior bracket include four be correspondingly arranged
In the square set ontology for switching chip development board bottom portion, the I-shaped connection being arranged between adjacent square set ontology
Frame, the L-type fixed frame that remaining edge of square set ontology is set, single-pole single-throw switch (SPST) I, single-pole single-throw switch (SPST) II, hilted broadsword
Commutator I, single-pole double-throw switch (SPDT) II are arranged in square set ontology.
A kind of method of determining defects, is utilized above-mentioned plane capacitance-vortex dual-modality sensor detection system, and sample lacks
Fall into decision process are as follows: plane capacitance-vortex dual-modality sensor excitation coil, which switches above sample via detection pattern, to be filled
It sets Fast transforms winding wiring mode and generates magnetic field and electric field, magnetic field makes conductor part in sample generate vortex field, detection coil
The changes of magnetic field of conductor part vortex field is picked up, while detection coil picks up the electric field change of conductive portion, detection coil is picked up
The above-mentioned vortex field taken and electric field change signal are after the real time imagery and data processing of computer and signal processing module, directly
Sight detects sample defect shape, and has distinguished conductor and non-conductor defect, realizes the test button of surface cladding insulating layer
Middle surface or the detection and differentiation to conceal defects.
Technical solution of the present invention further improvement lies in that: surface coat insulating layer test button defect include covering
Metal layer crack defect sample with hole defect insulating layer of metal layer hole defect sample with hole defect insulating layer, covering,
Metal hides crack defect sample
By adopting the above-described technical solution, the technological progress achieved by the present invention is: in electromagnetic nondestructive field, vortex
Imaging technique is detected for metallic conductor, and capacitance imaging technology is detected for non-conductor, is produced using sensor probe driving electrodes
Raw electric field line is entered inside sample by air gap.Inside sample when existing defects, electric field perturbations can be caused, to change survey
Measure the quantity of electric charge on electrode.Metal layer is detected, electric field line passes through air gap and corrosion-inhibiting coating, and reaches the metal layer on surface, because
Metal is a conductor, and electric field line can not penetrate, and when nonmetallic surface or metal inside existing defects, will affect point of electric field line
Cloth, this variation detected detected pole plate.Capacitance measurement technique can not detect the internal flaw of conductor, EDDY CURRENT skill
Art can not detect idioelectric defect, therefore through the invention, so that the defect information of non-conductor and conductor detected simultaneously,
The test button defects detection and defect type that can be realized surface cladding insulating layer are distinguished.
Each part purposes used in the present invention is as follows:
Sensor probe: sensor probe includes spiral excitation coil and spiral detection coil, and excitation coil is for generating
Magnetic field and electric field, detection coil are used to extract the variation of magnetic field and electric field.
Detection pattern switching device: including 2 single-pole single-throw switch (SPST) (single-pole single-throw switch (SPST)s inside detection pattern switching device
I, single-pole single-throw switch (SPST) II) and 2 single-pole double-throw switch (SPDT)s (single-pole double-throw switch (SPDT) I, single-pole double-throw switch (SPDT) II), single-pole single-throw switch (SPST)
I and single-pole single-throw switch (SPST) II be used for switch two coils (spiral excitation coil and spiral detection coil) and ground connection, hilted broadsword
Commutator I is used for the connection of change detection coil and charge amplifier, voltage amplifier, and single-pole double-throw switch (SPDT) II is for switching
The connection of charge amplifier, voltage amplifier and lock-in amplifier.
Signal generator: pumping signal is generated.
Charge amplifier: for detecting the amplification of signal under capacitance mode, and voltage signal is converted by charge signal.
Voltage amplifier: for detecting the amplification of signal under vortex pattern.
Lock-in amplifier: the signal-to-noise ratio of detection signal is improved.
Data collecting card: for acquiring the signal after lock-in amplifier, and it is separately connected detection pattern switching device
In 22 single-pole single-throw switch (SPST)s (single-pole single-throw switch (SPST) I, single-pole single-throw switch (SPST) II) and 2 single-pole double-throw switch (SPDT) (single-pole double throws
Switch I, single-pole double-throw switch (SPDT) II) corresponding end, for switching switch switching signal is provided.
Computer and signal processing module: for showing and handling signal.
Detailed description of the invention
Fig. 1 is system flow chart of the invention；
Fig. 2 is the structural schematic diagram one of sample one of the present invention；
Fig. 3 is the structural schematic diagram two of sample one of the present invention；
Fig. 4 is the capacitance image of sample one of the present invention；
Fig. 5 is the vortex image of sample one of the present invention；
Fig. 6 is the structural schematic diagram one of sample two of the present invention；
Fig. 7 is the structural schematic diagram two of sample two of the present invention；
Fig. 8 is the structural schematic diagram three of sample two of the present invention；
Fig. 9 is the capacitance image of sample two of the present invention；
Figure 10 is the vortex image of sample two of the present invention；
Figure 11 is the structural schematic diagram one of sample three of the present invention；
Figure 12 is the structural schematic diagram two of sample three of the present invention；
Figure 13 is the structural schematic diagram three of sample three of the present invention；
Figure 14 is the vortex image of sample three of the present invention；
Figure 15 is plane capacitance of the present invention-vortex dual-modality sensor structural schematic diagram；
Figure 16 is the structural schematic diagram of the switching switch box body of detection pattern switching device of the present invention；
Wherein, 1, plane capacitance-vortex dual-modality sensor, 11, sensor cartridge, 12, PCB probe, 13, BNC connection
Head, 2, signal generator, 3, charge amplifier, 4, voltage amplifier, 5, lock-in amplifier, 6, data collecting card, 7, computer
And signal processing module, 8, switching switch box body, 81, square set ontology, 82, I-shaped connection frame, 83, L-type fixed frame,
84, single-pole single-throw switch (SPST) I, 85, single-pole single-throw switch (SPST) II, 86, single-pole double-throw switch (SPDT) I, 87, single-pole double-throw switch (SPDT) II, 88, switching
Chip development plate.
Specific embodiment
The present invention is described in further details below with reference to embodiment.
The invention discloses a kind of plane capacitance-vortex dual-modality sensor detection systems, including the plane for detection
Capacitor-vortex dual-modality sensor 1, the signal generator 2 being connect with plane capacitance-vortex dual-modality sensor 1 input terminal,
The detection pattern switching device and detection pattern switching device being connect with plane capacitance-vortex dual-modality sensor 1 output end
The charge amplifier 3 and voltage amplifier 4 of connection pass through detection pattern switching device and charge amplifier 3 and voltage amplifier 4
The lock-in amplifier 5 that is all connected with, the data collecting card 6 being connect with lock-in amplifier 5, the computer being connect with data collecting card 6
With signal processing module 7, signal generator 2 is also connected with lock-in amplifier 5, and data collecting card 6 is also connected with detection pattern switching dress
It sets；The excitation coil and detection coil of corresponding matching, excitation line are equipped in plane capacitance-vortex dual-modality sensor 1 probe
Circle is all connected with signal generator 2 and detection pattern switching device, and detection coil is connect with detection pattern switching device.
Detection pattern switching device include single-pole single-throw switch (SPST) I 84, single-pole single-throw switch (SPST) II 85, single-pole double-throw switch (SPDT) I 86,
Single-pole double-throw switch (SPDT) II 87, excitation coil and detection coil are spiral winding.
There are the port RF1, the port RF2, single-pole single-throw switch (SPST) II 85 with single-pole single-throw switch (SPST) I 84 and single-pole single-throw switch (SPST) II 85
For having the port RF1, the port RF2, the port RFC with single-pole double-throw switch (SPDT) I 86, specific connection type are as follows: excitation coil one end with
The port RF1 of the connection of 2 voltage output end of signal generator, the other end and single-pole single-throw switch (SPST) I 84 connects, single-pole single-throw switch (SPST) I
The port RF2 ground connection；Detection coil one end is connect with the port RF1 of single-pole single-throw switch (SPST) II 85, single-pole single-throw switch (SPST) II 85
The port RF2 ground connection, the detection coil other end are connect with the port RFC of single-pole double-throw switch (SPDT) I 86, the RF1 of single-pole double-throw switch (SPDT) I 86
Port is connect with 4 input terminal of voltage amplifier, the port RF2 is connect with 3 input terminal of charge amplifier；Single-pole double-throw switch (SPDT) II 87
The port RF1 is connect with the output end of voltage amplifier 4, the port RF2 is connect with the input terminal of charge amplifier 3, the port RFC and lock
The input port of phase amplifier 5 connects；The reference signal output port of signal generator 2 and the reference signal of lock-in amplifier 5
Input port connection, output port, data collecting card 6 and the computer and signal processing module 7 of lock-in amplifier 5 successively connect
It connects；Data collecting card 6 and single-pole single-throw switch (SPST) I 84, single-pole single-throw switch (SPST) II 85, single-pole double-throw switch (SPDT) I 86, single-pole double-throw switch (SPDT)
II 87 port CTRL connection.Excitation coil and detection coil are spiral coil.
Plane capacitance-vortex dual-modality sensor 1 probe includes sensor cartridge 11, is arranged at 11 bottom of sensor cartridge
Portion is used to fix the fixation hole of PCB probe 12, leading on sensor cartridge 11 for welding the several of BNC connector 13 is arranged in
Hole, excitation coil and detection coil are arranged in sensor cartridge 11.
Sensor cartridge 11 is plastic opaque sensor box body, and fixation hole is rectangle, and number of openings is 4 and shape is round
Shape.
Detection pattern switching device further includes switching switch box body 8, cutting in switching switch box body 8 for fixation is arranged in
The round fairlead for lead connection for changing the bracket of chip development plate 88, being arranged on switching switch box body 8, single-pole single-throw(SPST
Switch I 84, single-pole single-throw switch (SPST) II 85, single-pole double-throw switch (SPDT) I 86, single-pole double-throw switch (SPDT) II 87, data collecting card 6 are by drawing
String holes is connect with switching switch box body 8.
Bracket inside switching switch box body 8 includes four rectangular branch for being correspondingly arranged at switching 88 bottom of chip development plate
Frame ontology 81, is arranged in square set ontology 81 the I-shaped connection frame 82 being arranged between adjacent square set ontology 81
The L-type fixed frame 83 of remaining edge, single-pole single-throw switch (SPST) I 84, single-pole single-throw switch (SPST) II 85, single-pole double-throw switch (SPDT) I 86, hilted broadsword
Commutator II 87 is arranged in square set ontology 81.
Above-mentioned plane capacitance-vortex dual-modality sensor detection system, the judgement side is utilized in a kind of method of determining defects
The process that method determines the defect of sample are as follows: plane capacitance-vortex dual-modality sensor 1 excitation coil is above sample
Magnetic field and electric field are generated via detection pattern switching device Fast transforms winding wiring mode, magnetic field produces conductor part in sample
Raw vortex field, detection coil picks up the changes of magnetic field of conductor part vortex field, while detection coil picks up the electricity of conductive portion
Variation, above-mentioned vortex field that detection coil is picked up and electric field change signal are by the real-time of computer and signal processing module 7
After imaging and data processing, sample defect shape is visually detected, and distinguished conductor and non-conductor defect, realizes surface packet
Surface or the detection and differentiation that conceal defects in the test button of insulating layer coating.
The defect of the test button of surface cladding insulating layer includes the metal layer hole defect that covering has hole defect insulating layer
Sample, covering metal layer crack defect sample, metal with hole defect insulating layer hide crack defect sample.
The principle of the sample method of determining defects are as follows: plane capacitance-vortex dual-modality sensor 1 probe driving electrodes produce
Raw electric field line is entered inside sample by air gap, inside sample when existing defects, can cause electric field perturbations, to change survey
Measure the quantity of electric charge on electrode.Metal layer is detected, electric field line passes through air gap and corrosion-inhibiting coating, and reaches the metal layer on surface, because
Metal is a conductor, and electric field line can not penetrate.When nonmetallic surface or metal inside existing defects, point of electric field line will affect
Cloth, this variation come out detected Coil Detector.
According to Faraday's electromagnetic induction law, plane capacitance-vortex dual-modality sensor 1 probe leads to alternating current
Excitation coil can generate alternating magnetic field, it makes metal surface generate vortex, and the secondary magnetic field which generates can be with former magnetic field one
Rising influences detection coil, when metal surface or internal existing defects, vortex distortion can be made to come out to be detected Coil Detector.
Capacitance measurement technique can not detect the internal flaw of conductor, and eddy detection technology can not detect idioelectric defect,
Therefore through the invention, so that the defect information of non-conductor and conductor detected simultaneously.
Citing is described in detail below:
Sample one is aluminium-glass fibre mixed structure, structure-Fig. 3 referring to fig. 2, long 140 mm wide, 30 millimeters of aluminium sheet tables
Face processes the different flat round hole of four 5 millimeters deep diameters.The diameter in hole is respectively 10 millimeters, 8 millimeters, 6 millimeters and 4 millis
Rice.Three identical diameters (11 millimeters) of processing on 2 millimeters thick glass mats, and buried depth difference (2 millimeters, 1.5 millimeters, 1
Millimeter) hole, one is that through-hole other two is harboring holes, and glass mat is placed on aluminium sheet.Single sweep operation obtains capacitor
Image and vortex image, as shown in Figure 4, Figure 5.
From capacitance image (Fig. 4) as can be seen that all holes on aluminium sheet and glass mat are all detected.This be because
It is all very sensitive for feature of the probe field to conductive surface under non-conducting material and capacitance imaging mode.In vortex image (Fig. 5),
Four holes for only detecting surface of aluminum plate, may infer that the size portalled from image.
Sample two is also aluminium-glass fibre mixed structure, and referring to Fig. 6-Fig. 8, aluminium sheet has 45 millimeters of (length) × 7 milli
The crack of rice (depth) × 0.8 millimeter (width).Glass mat has two sets of holes.One group of hole is through-hole, diameter be respectively 11mm, 9mm,
7mm, 5mm, another group of hole is flat-bottom hole (deep 1.5mm), and diameter is respectively 11mm, 9mm, 7mm, 5mm.
Single sweep operation obtains capacitance image and vortex image, in capacitance image as shown in Figure 9, on glass mat
Through-hole and harboring holes all occur, but can't see crackle in capacitance image.In vortex image Figure 10, crackle is high-visible,
But the not feature of glass mat.
Sample three, structure are referring to Figure 11-Figure 13, in vortex imaging, can elongated shade in the middle part of Figure 14 as it can be seen that being judged as
Metal hides crackle, therefore judges that sample three hides crack defect sample for metal.
The result shows that capacitor-vortex dual-modality sensor can be identified accurately and classification chart profile image.Crackle,
Flat hole and hidden defects can be evaluated intuitively.Bimodal imaging sensor can be used to identify insulating layer and the lower conductive surface that insulate
Defect, be expected to be used in practical applications for insulation under etching problem.
Claims (8)
1. a kind of plane capacitance-vortex dual-modality sensor detection system, it is characterised in that: including the plane electricity for detection
Appearance-vortex dual-modality sensor (1), the signal generator being connect with plane capacitance-vortex dual-modality sensor (1) input terminal
(2), the detection pattern switching device that connect with plane capacitance-vortex dual-modality sensor (1) output end is cut with detection pattern
The charge amplifier (3) and voltage amplifier (4) of changing device connection pass through detection pattern switching device and charge amplifier (3)
The lock-in amplifier (5) being all connected with voltage amplifier (4), the data collecting card (6) and number that are connect with lock-in amplifier (5)
According to computer and signal processing module (7) that capture card (6) connect, signal generator (2) is also connected with lock-in amplifier (5), number
Detection pattern switching device is also connected with according to capture card (6)；It is equipped in plane capacitance-vortex dual-modality sensor (1) probe pair
The excitation coil and detection coil that should cooperate, excitation coil are all connected with signal generator (2) and detection pattern switching device, inspection
Test coil is connect with detection pattern switching device.
2. plane capacitance according to claim 1-vortex dual-modality sensor detection system, it is characterised in that: detection mould
Formula switching device includes single-pole single-throw switch (SPST) I (84), single-pole single-throw switch (SPST) II (85), single-pole double-throw switch (SPDT) I (86), single-pole double throw
Switch II (87), excitation coil one end connect with signal generator (2) voltage output end, the other end and single-pole single-throw switch (SPST) I
(84) port connection；Detection coil one end is connect with the port of single-pole single-throw switch (SPST) II (85), the other end and single-pole double throw are opened
The port one for closing I (86) connects, and the port two of single-pole double-throw switch (SPDT) I (86) connect with voltage amplifier (4) input terminal, port three
It is connect with charge amplifier (3) input terminal；The port one of single-pole double-throw switch (SPDT) II (87) and the output end of voltage amplifier (4) connect
It connects, port two is connect with the output end of charge amplifier (3), port three is connect with the input port of lock-in amplifier (5)；Signal
The reference signal output port of generator (2) is connect with the reference signal input port of lock-in amplifier (5), lock-in amplifier
(5) output port, data collecting card (6) and computer and signal processing module (7) is sequentially connected；Data collecting card (6) with
Single-pole single-throw switch (SPST) I (84), single-pole single-throw switch (SPST) II (85), single-pole double-throw switch (SPDT) I (86), single-pole double-throw switch (SPDT) II (87) pair
Port is answered to connect.
3. plane capacitance according to claim 2-vortex dual-modality sensor detection system, it is characterised in that: plane electricity
Appearance-vortex dual-modality sensor (1) probe includes sensor cartridge (11), is arranged in sensor cartridge (11) bottom for solid
Determine fixation hole, setting the leading on sensor cartridge (11) for welding the several of BNC connector (13) of PCB probe (12)
Hole, excitation coil and detection coil setting are in sensor cartridge (11).
4. plane capacitance according to claim 3-vortex dual-modality sensor detection system, it is characterised in that: sensor
Box body (11) is cuboid, and fixation hole is rectangle, and number of openings is 4 and shape is round.
5. plane capacitance according to claim 2-vortex dual-modality sensor detection system, it is characterised in that: detection mould
Formula switching device further includes switching switch box body (8), setting to be used for fixed switching chip development in switching switch box body (8)
Fairlead for lead connection of the bracket, setting of plate (88) on switching switch box body (8), single-pole single-throw switch (SPST) I (84),
Single-pole single-throw switch (SPST) II (85), single-pole double-throw switch (SPDT) I (86), single-pole double-throw switch (SPDT) II (87), data collecting card (6) are by drawing
String holes is connect with switching switch box body (8).
6. plane capacitance according to claim 5-vortex dual-modality sensor detection system, it is characterised in that: switching is opened
Closing box body (8) internal bracket includes four square set ontologies for being correspondingly arranged at switching chip development plate (88) bottom
(81), the I-shaped connection frame (82) between adjacent square set ontology (81) is set, is arranged in square set ontology
(81) the L-type fixed frame (83) of remaining edge, single-pole single-throw switch (SPST) I (84), single-pole single-throw switch (SPST) II (85), single-pole double throw are opened
Close I (86), single-pole double-throw switch (SPDT) II (87) is arranged in square set ontology (81).
7. a kind of method of determining defects, it is characterised in that: plane capacitance described in claim 1-vortex bimodal is utilized and passes
Sensor detection system, determining defects process are as follows: plane capacitance-vortex dual-modality sensor (1) excitation coil is above sample
Magnetic field and electric field are generated via detection pattern switching device Fast transforms winding wiring mode, magnetic field produces conductor part in sample
Raw vortex field, detection coil picks up the changes of magnetic field of conductor part vortex field, while detection coil picks up the electricity of conductive portion
The reality of computer and signal processing module (7) is passed through in field variation, above-mentioned vortex field and electric field change signal that detection coil is picked up
When imaging and data processing after, visually detect sample defect shape, and distinguished conductor and non-conductor defect, realization surface
Coat surface or the detection and differentiation that conceal defects in the test button of insulating layer.
8. method of determining defects according to claim 7, it is characterised in that: surface coats lacking for the test button of insulating layer
Fall into includes that covering has the metal layer hole defect sample of hole defect insulating layer, covers the metal layer crackle for having hole defect insulating layer
Defect sample, metal hide crack defect sample.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111289609A (en) * | 2019-10-11 | 2020-06-16 | 中国石油大学(华东) | External-penetrating type rotating magnetic field wellhead sucker rod detection system |
| CN112485326A (en) * | 2020-12-09 | 2021-03-12 | 中国石油大学(华东) | Dual-mode detection system utilizing planar spiral coil capacitance effect |
| CN115236145A (en) * | 2022-09-21 | 2022-10-25 | 中国石油大学(华东) | Device and method for evaluating curing state of glass fiber reinforced material matrix |
| CN115308497A (en) * | 2022-10-12 | 2022-11-08 | 中国矿业大学 | All-solid-state MEMS electric field sensor, preparation method and working method |
| CN116068045A (en) * | 2023-04-06 | 2023-05-05 | 中国石油大学(华东) | Composite structure defect identification method for inhibiting lift-off effect interference |
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| CN112485326B (en) * | 2020-12-09 | 2024-01-26 | 中国石油大学(华东) | Dual-mode detection system utilizing planar spiral coil capacitance effect |
| CN115236145A (en) * | 2022-09-21 | 2022-10-25 | 中国石油大学(华东) | Device and method for evaluating curing state of glass fiber reinforced material matrix |
| CN115308497A (en) * | 2022-10-12 | 2022-11-08 | 中国矿业大学 | All-solid-state MEMS electric field sensor, preparation method and working method |
| CN115308497B (en) * | 2022-10-12 | 2023-01-31 | 中国矿业大学 | All-solid-state MEMS electric field sensor, preparation method and working method |
| CN116068045A (en) * | 2023-04-06 | 2023-05-05 | 中国石油大学(华东) | Composite structure defect identification method for inhibiting lift-off effect interference |
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