CN110206097A - A kind of recuperation of heat air water vessel based on semiconductor refrigerating - Google Patents
A kind of recuperation of heat air water vessel based on semiconductor refrigerating Download PDFInfo
- Publication number
- CN110206097A CN110206097A CN201910406249.5A CN201910406249A CN110206097A CN 110206097 A CN110206097 A CN 110206097A CN 201910406249 A CN201910406249 A CN 201910406249A CN 110206097 A CN110206097 A CN 110206097A
- Authority
- CN
- China
- Prior art keywords
- water
- heat
- air
- hot
- trapping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 220
- 239000004065 semiconductor Substances 0.000 title claims abstract description 85
- 238000001816 cooling Methods 0.000 claims abstract description 51
- 238000009833 condensation Methods 0.000 claims abstract description 46
- 230000005494 condensation Effects 0.000 claims abstract description 46
- 239000007788 liquid Substances 0.000 claims abstract description 10
- 239000000203 mixture Substances 0.000 claims abstract description 4
- 238000000746 purification Methods 0.000 claims abstract description 3
- 239000000463 material Substances 0.000 claims description 24
- 239000011810 insulating material Substances 0.000 claims description 23
- 238000006116 polymerization reaction Methods 0.000 claims description 21
- 230000009471 action Effects 0.000 claims description 17
- 230000017525 heat dissipation Effects 0.000 claims description 15
- 229920000742 Cotton Polymers 0.000 claims description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 9
- 230000000694 effects Effects 0.000 claims description 8
- 238000001914 filtration Methods 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 238000012856 packing Methods 0.000 claims description 5
- 238000011084 recovery Methods 0.000 claims description 5
- 125000006850 spacer group Chemical group 0.000 claims description 5
- 238000012546 transfer Methods 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 230000008859 change Effects 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 102000016938 Catalase Human genes 0.000 claims description 3
- 108010053835 Catalase Proteins 0.000 claims description 3
- 235000012241 calcium silicate Nutrition 0.000 claims description 3
- 239000000428 dust Substances 0.000 claims description 3
- 239000011381 foam concrete Substances 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 238000005057 refrigeration Methods 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000012224 working solution Substances 0.000 claims description 3
- 239000005030 aluminium foil Substances 0.000 claims description 2
- 230000000845 anti-microbial effect Effects 0.000 claims description 2
- 230000035622 drinking Effects 0.000 claims description 2
- 239000006260 foam Substances 0.000 claims description 2
- 230000008676 import Effects 0.000 claims description 2
- 238000009434 installation Methods 0.000 claims description 2
- SOQBVABWOPYFQZ-UHFFFAOYSA-N oxygen(2-);titanium(4+) Chemical compound [O-2].[O-2].[Ti+4] SOQBVABWOPYFQZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 239000002918 waste heat Substances 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 238000005338 heat storage Methods 0.000 claims 1
- 239000008236 heating water Substances 0.000 claims 1
- 239000012212 insulator Substances 0.000 claims 1
- 239000003507 refrigerant Substances 0.000 abstract description 5
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 238000003912 environmental pollution Methods 0.000 abstract 1
- 239000012535 impurity Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 3
- 230000005679 Peltier effect Effects 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- 239000003610 charcoal Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 241000238631 Hexapoda Species 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000000844 anti-bacterial effect Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000035900 sweating Effects 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000002463 transducing effect Effects 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Classifications
-
- E—FIXED CONSTRUCTIONS
- E03—WATER SUPPLY; SEWERAGE
- E03B—INSTALLATIONS OR METHODS FOR OBTAINING, COLLECTING, OR DISTRIBUTING WATER
- E03B3/00—Methods or installations for obtaining or collecting drinking water or tap water
- E03B3/28—Methods or installations for obtaining or collecting drinking water or tap water from humid air
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0251—Removal of heat by a gas
Landscapes
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Hydrology & Water Resources (AREA)
- Public Health (AREA)
- Water Supply & Treatment (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Drying Of Gases (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
A kind of recuperation of heat air water vessel based on semiconductor refrigerating.The water vessel includes water-trapping system, pretreatment system, cooling system and collects water storage system composition.Wherein, water-trapping system is connected with pretreatment system, water storage system, and cooling system is present in semiconductor system in water storage system；The preprocessed system purification removal of impurities of outside air, under the guidance of inlet fans and small fan, water section is caught into semiconductor system, heat pipe is flowed through to take away partial heat and enter semiconductor fin water-trapping system, it is condensed into small water droplet rapidly on condensation wing in water-trapping system, falls to and collects in holding tank.The present invention does not need refrigerant, can continuous work, no liquid, gaseous working medium, thus environmental protection it is free from environmental pollution.
Description
Technical field
The present invention relates to semiconductor refrigerating technologies, and in particular to a kind of recuperation of heat air based on semiconductor refrigerating catches water
Device.
Background technique
Semiconductor chilling plate (TE) be also thermoelectric module, is a kind of heat pump.As a hot tool for transmitting, it is not slided
Dynamic component, high reliablity are suitably applied in space and are restricted, the occasion technology of no refrigerant pollution.Semiconductor chip technology benefit
Made of Peltier effect with semiconductor material, one piece of N-type semiconductor material and one piece of p-type semiconductor material are coupled to electricity
When couple, after leading to direct current in this circuit, electric current absorbs heat by the connector that N-type element flows to p-type element, becomes cold
End；Heat is discharged by the connector that p-type element flows to N-type element, becomes hot end, the purpose freezed or heated may be implemented.But work as
Hot and cold side has reached certain temperature difference, has an equalization point, and the temperature of hot and cold side will not change again when equalization point,
It is lost the effect of refrigeration.
Heat pipe is a kind of heat transfer element that heat transfer is realized by therein Working fluid phase changing.One end of heat pipe connects fever
Component, the other end connect radiator, and when heat generating components one end of connection is heated to a certain extent, the liquid refrigerant in pipe will
Gasified, and mobile toward the other end under the action of overpressure difference, takes away heat, and vaporized working medium is lower in temperature
The other end can be liquefied again again, discharge heat, heat is transmitted in air under the heat exchange of radiating fin and cold wind, liquefies
Working medium tube core capillary force under the action of be returned to one end of connection heat generating components, such continuous reciprocation cycle realizes heat
Transmitting, achieve the purpose that heat dissipation.
Summary of the invention
In order to overcome the above shortcoming and deficiency of the existing technology, it is based on partly leading the purpose of the present invention is to provide one kind
The cold recuperation of heat air water vessel of system.The performance that can freeze but also heat the invention comprehensively utilizes semiconductor, Er Qiewu
The i.e. continuous type advantage of refrigerant, the draws water from air are needed, environment protecting and power-saving has sustainability.
The purpose of the present invention is realized by the following technical solution: a kind of this recuperation of heat air based on semiconductor refrigerating is caught
Hydrophone, it is characterised in that: including pretreatment system, water-trapping system, cooling system, water storage system.
Preferably, the pretreatment system includes hot air inlet, big fan, Combination filter element, filter plate with holes and filtering wind
Road.Under the action of outside air enters the wind big fan at the top of the pretreatment system, by the air inlet of the pretreatment system
Strainer enters the pretreatment system, is admitting air into hot-flow flue through filter plate with holes after Combination filter element sufficiently filters.
Preferably, the air inlet prefiltering net is the nanometer silver antimicrobial strainer of high density mesh aperture；Filter core by
Internal core and outer two layers cotton yarn composition, self-filtering filter core have two layers；The filter plate with holes is filtered for aluminium alloy with holes
Plate.
Preferably, the Combination filter element, layer choosing honeycomb type high-efficiency catalytic activity layer of charcoal；Two layer choosing nano-silicas
Change titanium light catalase and decompose strainer, wherein space is filled with mandruka, any in optional wood-fibred sponge, polyurethane sponge
Kind.
Preferably, the water-trapping system includes six drilled base plates, three groups of condensation wings, three drainage small fans, partly leads
Body piece, three capillary surfaces, three cold polywater holes, three hot polymerization water holes.The water-trapping system includes three groups of condensation wings, and every group
Condensation wing two sides are all connected to apertured partition, and top is heat-insulating shield, and heat-insulating shield contains there are three being open, and are fixed with one in each opening
Small fan is drained, bottom connects there are three capillary surface；Semiconductor chip utilizes the Peltier effect of semiconductor material, works as direct current
When the galvanic couple being connected by two kinds of semiconductors, the both ends of galvanic couple are i.e. absorbable and release heat, so that the condensation wing
Temperature declines 15 DEG C or so.It is small by drainage of the purified air of pretreatment system at the top of the water-trapping system
Under the action of fan, the water-trapping system is entered by the filtering air duct of the pretreatment system；Air catches water in described
In system, the condensation wing being connected by the cold end with semiconductor chip is condensed into droplet；The capillary of the water-trapping system bottom
Condensed droplet is collected to water guide groove by face.Water in the water guide groove flow to cold polywater hole and hot polymerization water respectively
Hole.
Preferably, the condensation wing is the hydrophilic aluminium foil piece of specially treated；The heat-insulating shield is by heat-insulating material
Manufactured hexagon bottom plate；The semiconductor chip is made of semiconductor thermoelectric refrigeration material, and its hot end and cooling system
Heat pipe heat be connected directly, and connect radiating fin, cold end is directly connected to condensation wing, while being that it accesses rated power supply.
Preferably, any one of glass fibre, silicate can be selected in the heat-insulating material.
Preferably, the heat exchanger channels are to be surrounded by the stainless steel hexagonal prisms hollow out of heat-insulating material by outer layer to form；It is described
Cold water tank, be made of heat-insulating material；The hot water tank, is made of heat-insulating material；The cooling system is led
Water groove, is made of heat-insulating material.
Preferably, the heat-radiation loop, water guide groove, hot water tank, cold water tank, it is characterised in that: described is exhausted
One of heat-insulating materials such as foam concrete, calcium silicates can be selected in hot material.
Preferably, the cooling system is made of heat dissipation heat pipe heat, radiating fin group；The heat pipe heat that radiates is dissipated through entire
Hot systems and water-trapping system；Semiconductor hot end and the hot end of heat pipe are closely coupled, by the heat transfer on semiconductor chip to heat dissipation
Heat pipe, and heat is pulled away rapidly under the action of radiating fin；The effect of big fan at the top of the pretreatment system
Under, the air after processing, which enters in hot-flow flue, takes away semiconductor heat end part heat；At the top of the pretreatment system
Under the action of small fan, the cold wind in cold air duct leaves body by the controlled direction of outlet fan.
Preferably, separate tube material is copper, and wherein working solution is methanol, and heat pipe is through entire cooling system, radiating fin wing
Piece is made of copper sheet, is connected with heat pipe and closely coupled with the hot end of semiconductor chip.
The present invention has the advantage that compared with the existing technology
1, the present invention does not need refrigerant, can continuous work, no liquid, gaseous working medium, thus environmental protection do not pollute ring
Border.
2, present invention utilizes semiconductor refrigerating chip size is small, the manufactured compact-sized area occupied of water vessel is small, saves
Space, and when water vessel works, is not shaken, noise etc. influences,
3, the present invention use semiconductor chilling plate two kinds of functions, can not only freeze, but also can heat, and heat recovery efficiency compared with
Height effective and reasonable can utilize energy.
4, semiconductor chilling plate thermal inertia of the present invention is very small, and the cooling and warming period is short, has good heat radiating system in hot end
In the case where system and cold end zero load, cooling piece can reach maximum temperature difference within a short period of time, and cooling parameters are not by space side
To and gravity influence.
5, semiconductor chilling plate is electric current transducing matrix part, by the control to input current, it can be achieved that high-precision temperature
Degree control, adds temperature measurement and control means, it is easy to remote control, program-controlled, computer control is realized, convenient for the automatic control of composition
System processed.
6, the present invention utilize cold side outlet air flowing, to the dust insect on the strainer of water vessel pretreatment system into
Row cleaning reaches resource recycling, convenient effect ease in use.
7, the present invention runs through cooling system structure using heat pipe, and the thermal energy using semiconductor chip hot end adds condensed water
Heat reaches recycling thermal energy, the effect of reasonable energy utilization.
8, the present invention is improved using Honeycomb-type activated carbon slab and nano silver strainer etc. to the preliminary adsorption treatment of carry out of entrance
The quality of captured water.
9, the present invention utilizes the combination of heat pipe and radiating fin, so that heat dissipation effect is excellent, can allow semiconductor chip hot end in time
Cooling guarantees the refrigerating efficiency of semiconductor chip cold end.
10, the present invention guarantees semiconductor cold end by radiating using outside air opposite heat tube, and using the heat of hot-air
Will not frosting, reduce condensation efficiency.
Detailed description of the invention
Fig. 1 is a kind of recuperation of heat air water vessel system arrangement schematic diagram based on semiconductor refrigerating of the invention.
Fig. 2 is a kind of recuperation of heat air water vessel overall structure diagram based on semiconductor refrigerating of the invention.
Fig. 3 is the structural schematic diagram of pretreatment system of the invention.
Fig. 4 is the isometric side structure schematic view of water-trapping system of the invention.
Fig. 5 is the bottom substance schematic diagram of water-trapping system of the invention.
Fig. 6 is W type water collection sheet structural schematic diagram of the invention.
Fig. 7 is cooling system diagrammatic cross-section of the invention.
Fig. 8 is cooling system schematical top view of the invention.
Fig. 9 is cooling system connection dual temperature water storage system fragmentary cross-sectional view of the invention.
Figure 10 is the sectional view in hot polymerization water hole and hot polymerization water hole lid of the invention.
Figure 11 is the structural schematic diagram figure of condensation wing of the invention.
Wherein, pretreatment system 1, water-trapping system 2, cooling system 3, water storage system 4, outlet fan 101, air inlet pre-filtering
Net 102, inlet fans 103, Combination filter element 104, drilled base plate 105, small fan 106, outlet air duct 107, condensation wing 201, heat
Pipe group 202, hexagon inner panel 204, radiating fin 205, semiconductor chip 206, spacer block 207, water outlet 208, is led at W type water collection sheet 203
Water groove 301, hot polymerization water hole 302, hot polymerization water hole liquid packing 303, heat-radiation loop 304, Intelligent temperature controller 305, hot water tank
401 and cold water tank 402, intelligent temperature control outlet valve 403.
Specific embodiment
Present invention will be further explained below with reference to the attached drawings and examples.
Such as Fig. 1, a kind of recuperation of heat air water vessel based on semiconductor refrigerating, including water-trapping system, pretreatment system, storage
Water system, cooling system, and cooling system is through the center of water-trapping system, water storage system.
Such as Fig. 2, under the action of inlet fans, outside air leads to prefiltering net and enters pretreatment system, by pretreatment
After the pretreatment of two layering of system, water-trapping system is entered under the action of draining small fan, passed through radiating fin, and lead to
Behind superheater tube gap, the condensation wing of semiconductor cold end in cold air duct, with water-trapping system is entered under the small fan drainage of top
After condensation by contact, body is left by exporting fan.
Such as Fig. 3, outside air enters the Combination filter element at pretreatment system center by entering the wind prefiltering net, Combination filter element
Each space of a whole page is made of the double-deck cotton yarn, and full mandruka is filled in inside.Air passes through after Combination filter element is sufficiently cleaned
Small fan on drilled base plate leaves pretreatment system.
Such as Fig. 4, treated for preprocessed system after air enters water-trapping system, by small fan enter water-trapping system with
Radiating fin contact, radiating fin are connect with heat pipe, and heat pipe and semiconductor hot end directly carry out heat exchange；
Such as Fig. 5, air carries out secondary heat exchange with heat pipe from heat pipe gap, in top exit wind after radiating fin
Under the action of fan, by condensation wing is cold be condensed out droplet after, residual gas leaves body along cold air duct, by exporting fan.
Such as Fig. 6, condensed water is collected in water guide groove by inclined W type water collection sheet, is entered by the water guide mouth of fluid-tight
Lower layer's cooling system.
Such as Fig. 7, condensed water enters cooling system lower layer by nine hot polymerization mouths of a river, and heat dissipation is passed through in the opening outflow in center
Circuit and heat pipe carry out secondary heat exchange, enter water storage system from the outflow of external smart water outlet.
Such as Fig. 9, water storage system inside is a cold storage tank and a thermal storage tank, is connected respectively with two intelligent water outlets
It connects, without the heat of cooling system from the water of recovery system, cold storage tank is entered by cold water outlet；By the heat of cooling system
The water heated from recovery system, enters thermal storage tank by hot water outlet.
In the present embodiment, model: the intelligent temperature control instrument of XH-W3001, article No. W323 is can be selected in the Intelligent temperature controller
Or other it is similar have watertight transducer, intelligent temperature adjust control, temperature control range in 0 DEG C -100 DEG C of temperature regulating device one
Kind；Radio remote control electric valve is connected on intelligent temperature control instrument, forms Intelligent temperature controller control switch water valve, wireless remote control electricity
Movable valve selects Shenzhen peace to create good model: the electric valve controller of JXS-03.The intelligent temperature control outlet valve can automatically adjust
Cold and hot water flow, balancing water pressure accurately control water temperature using high-sensitivity thermosensitive material, and the limited public affairs of Shanghai Mondeo bathroom can be selected
Take charge of one of model 1700,1806,1807 or same type intelligent temperature control outlet valve.
A kind of recuperation of heat air water vessel based on semiconductor refrigerating, including pretreatment system 1, water-trapping system 2, heat dissipation system
System 3 and water storage system 4；
The inlet end of the water-trapping system 2 is connected with pretreatment system 1；206 hot end of semiconductor of the water-trapping system 2 with
Cooling system 3 is connected；The cooling system 3 is connected with the hot water tank 401 of water storage system 4 and cold water tank 402；Outside air
After the pretreatment system 1 purification is capable of direct drinking to the water condensed, under the action of small fan 106, it is into heat dissipation
System 3 carries out heat exchange with radiating fin, then by heat dissipation 202 gap of heat pipe, into the semiconductor cold end of the water-trapping system 2,
Condensation wing 201 in the water-trapping system 2 is condensed into rapidly droplet；The water-trapping system 2W type drainage plate 203 will be cold
Droplet after solidifying is pooled to water guide groove 301 through drainage；The condensed water of a part in the water guide groove 301 contacts heat
Pipe carries out first time heat dissipation, and the hot polymerization water hole 302 of 2 bottom of water-trapping system imports the heat-radiation loop 304 of cooling system 3,
After carrying out a heat exchange with heat pipe again, the water storage system 4 is finally respectively enterd under the control of Intelligent temperature controller 305
Hot water tank 401 and cold water tank 402；Heat pipe heat 202 through water-trapping system 2 is connected with cooling system 3, and bottom is connected to storage
Heat recovery is used to heat water made of condensation wing condensation by water system 4；In the 2 top entry fan 103 of water-trapping system
Under effect, cold air enters after water-trapping system 2 and passes through semi-conductor condensation wing for water from both sides cold air duct after superheater tube hot-flow flue
Body is smoothly discharged after devaporation, and under the action of exporting fan 101, clears up dust on filter screen.The pretreatment system 1
Including outlet fan 101, air inlet prefiltering net 102, inlet fans 103, Combination filter element 104, drilled base plate 105 and small fan
106；The center of top of the pretreatment system 1 offers air intake vent, and the inlet air discharge surface is air inlet prefiltering net 102, interior
Portion is provided with inlet fans 103；The top two sides of the pretreatment system 1 offer outlet air air port, internal installation outlet fan
101；The pretreatment system 1 is positive hexa-prism structure, connect with water-trapping system 2, and combination filter is provided in pretreatment system 1
Core 104, Combination filter element 104 combine cotton yarn by two filters and form；The each side of the regular hexagonal prism drilled base plate 105 is provided with
Outlet air duct 107, small fan 106 is equipped on the outlet air duct 107, and outside air is pre- by inlet fans 103 and air inlet
Filter screen 102 enter the pretreatment system 1 inside, air by Combination filter element 104 sufficiently filtering after, in six small wind
Under the action of fan 106, enter water-trapping system 2 through drilled base plate 105；
The water-trapping system 2 include a condensation wing 201, heat pipe heat 202, W type water collection sheet 203, hexagon inner panel 204,
Radiating fin 205, semiconductor chip 206, spacer block 207 and water outlet 208；The water-trapping system 2 is in the double-deck hexa-prism；It is described to catch water
The top of system 2 is heat-insulating shield, and heat-insulating shield is hexagon, and each rib is provided with a hole, fixes one in each hole
A small fan 106；The small fan 106 is located at the top of the radiating fin 205 of water-trapping system 2；The water-trapping system 2 is bilayer six
Prism-shaped, connection condensation wing 201 between hexagon inner panel 204 and outer surface hexagon shell, and in 204 wall surface of hexagon inner panel
Inlay semiconductor chip 206；Contain six groups of condensation wings 201, the condensation wing 201 and semiconductor chip 206 in the water-trapping system 2
Cold end connection, every group of 201 two sides of condensation wing are all connected to spacer block 207；Contain six groups of heat pipe heats 202, the heat in the water-trapping system 2
Pipe group 202 and the hot end of semiconductor chip 206 are directly connected to；Contain six groups of radiating fins 205, the radiating fin in the water-trapping system 2
205 are directly connected to heat pipe heat 202；One piece of N-type semiconductor material and one piece of p-type semiconductor material are coupled to galvanic couple clock synchronization,
After leading to direct current in this circuit, electric current absorbs heat by the connector that N-type element flows to p-type element, becomes cold end；By p-type member
Part flows to the connector release heat of N-type element, becomes hot end, after semiconductor chip 206 is powered, the temperature of the condensation wing 201
12 DEG C or so of degree decline, air is by the purified small fan at 2 top of water-trapping system of the pretreatment system 1
Under the action of 106, the water-trapping system 2 is entered by the drilled base plate 105 of the pretreatment system 1；When equipment operation,
Air is entered in the water-trapping system 2 by pretreatment system 1, first and the connected heat pipe 202 in the hot end of semiconductor chip 206 and
Radiating fin 205 carry out a heat exchange, using circuit with and semiconductor chip 206 cold end be connected condensation wing 201 contact it is cold
Droplet is congealed into, is flowed out from the water outlet 208 under condensation wing；Condensed droplet is collected to water guide groove by W type water collection sheet 203
301；Water in the water guide groove 208 flows into hot polymerization water hole 302 after liquid level has certain altitude and enters collection water storage system；
The cooling system 3 includes water guide groove 301, hot polymerization water hole 302, hot polymerization water hole liquid packing 303, heat-radiation loop
304 and Intelligent temperature controller 305；The cooling system 3 is two layers of hexagonal structure, is converged in the water that water guide groove 301 is collected into
Gather in internal hexagon, via a side outlet, carry out secondary heat exchange into external cooling circuit 304 and heat pipe heat 202,
Under the control of Intelligent temperature controller 305, by being opened and closed the water outlet different in heat-radiation loop the right and left, water enters collection storage
Hot water tank 401 and cold water tank 402 in water system 4；The cooling system 3 through water-trapping system 2 and is stored up using heat pipe
In water system 4；The hot end of semiconductor chip 206 and heat pipe heat 202 are closely coupled, and 204 upper half of semiconductor chip hexagon inner panel is led
The heat transfer of body piece to heat pipe, waste heat is transferred to radiating fin again, is once radiated by the cold air entered to it；In the storage
In water system 1, in water guide groove 301, condensation droplet and the secondary heat dissipation of heat pipe contact, water is entered by hot polymerization water hole 302 to be dissipated
Heat exchange is carried out again with heat pipe heat 202 after hot loop 304, makes semiconductor hot end 206 and heat pipe heat 202 in cooling system 4
All sufficiently cooled down；The hot polymerization water hole 302 is with hot polymerization water hole liquid packing 303 to be weldingly connected；
The water storage system 4 includes hot water tank 401 and cold water tank 402, intelligent temperature control outlet valve 403；The heat
Water tank 401 and cold water tank 402 are connected with the heat-radiation loop 304 of the cooling system 3；Condensed water is by water guide groove 301
Into heat-radiation loop 304, heat exchange is carried out by heat-radiation loop 304 and heat pipe heat, under the control of Intelligent temperature controller 305,
Part water enters hot water tank, and part water enters cold water tank；The intelligent temperature control outlet valve 403 is external in water storage system 4
And be connected with hot and cold water tank, after hot and cold water enters intelligent temperature control valve 403, adjusts by the inside temperature-sensitive element of water valve, finally go out
Coolant-temperature gage is set temperature.Air inlet prefiltering net 202 described in pretreatment system 1 is the nano silver of high density mesh aperture
Antibacterial filter screen；Filter core 103 is made of internal core and outer two layers cotton yarn, and internal combination filter core 104 has two layers；It is described
Drilled base plate 105, be foam filter plate with holes.104 internal structure of Combination filter element forms one by upper layer of material and subsurface material
Hollow structure；Upper layer of material selects honeycomb type high-efficiency catalytic activity layer of charcoal；Subsurface material selects nano-titanium dioxide light catalase
Strainer is decomposed, intermediate space is filled with mandruka, and the mandruka includes wood-fibred sponge, any in polyurethane sponge
Kind, two layers of cotton yarn is enclosed with outside internal structure.Condensation wing 201 in the water-trapping system 2 is the hydrophilic aluminium of specially treated
Paillon；The heat-insulating shield is the hexagon bottom plate made of heat-insulating material；The semiconductor chip 206 is by semiconductor thermoelectric
Refrigerating material is made, and the heat pipe heat 202 of its hot end and cooling system is connected directly, and connects radiating fin 205, and cold end is direct
Connection condensation wing 201, while rated power supply is accessed for it.It collects in water storage system, the heat-radiation loop 304 is by outer layer packet
There is the stainless steel hexagonal prisms hollow out of heat-insulating material to form；The cold water tank 402 of hot water tank 401, is by heat-insulating material group
At；The cold water tank 402, is made of heat-insulating material；The 2 water guide groove 301 of cooling system is by heat-insulating material group
At.Heat-radiation loop 304, water guide groove 301, hot water tank 401, cold water tank 402 select heat-insulating material, the heat-insulating material
For one of heat-insulating materials such as foam concrete, calcium silicates.202 material of separate tube is copper, and wherein working solution is methanol, heat
Pipe is made through entire water-trapping system 2 and cooling system 3, radiating fin fin 205 of copper sheet, be connected with heat pipe and with partly lead
The hot end of body piece 206 is closely coupled.202 every groups of numbers of the heat pipe heat are 4.
A kind of this course of work of the recuperation of heat air water vessel based on semiconductor refrigerating is as follows: outside air is entering one's intention as revealed in what one says
Under the action of fan, enter the filtering space of a whole page inside pretreatment system by entering the wind filter plate；Two layers of filter each space of a whole page by
The double-deck cotton yarn is constituted, and full mandruka is filled in inside；After Combination filter element sufficiently filters, air is small on drilled base plate
Fan drainage enters water-trapping system；Air is contacted from pretreatment system is rear out with radiating fin, is carried out simple for the first time hot
Exchange carries out second of heat exchange by heat pipe gap and heat pipe, enters cold air duct under the drainage of top small fan, and with it is cold
Solidifying wing condensation by contact sweating；
The condensed water of cohesion is pooled in water guide groove by gradient W type water collection sheet；Condensed water passes through fluid-tight water guide
By intelligent water outlet after mouth inflow cooling system lower layer, with heat pipe progress heat exchange, when temperature control is opened, hot water passes through thermal conductivity water
Pipe flows into hot water tank；When temperature control is closed, condensed water enters cold water tank by cold water guide mouth；
Preprocessed system treated air leaves machine from cold air duct by outlet fan after condensation wing condensation
Body is simultaneously used as filter screen cleaning, blows away surface particles bigger molecule.
Above-mentioned specific embodiment is the preferred embodiment of the present invention, can not be limited the invention, and others are appointed
The change or other equivalent substitute modes what is made without departing from technical solution of the present invention, are included in protection of the invention
Within the scope of.
Claims (9)
1. a kind of recuperation of heat air water vessel based on semiconductor refrigerating, it is characterised in that: including pretreatment system (1), catch water
System (2), cooling system (3) and water storage system (4)；
The inlet end of the water-trapping system (2) is connected with pretreatment system (1)；Semiconductor (206) heat of the water-trapping system (2)
End is connected with cooling system (3)；The hot water tank (401) and cold water tank of the cooling system (3) and water storage system (4)
(402) it is connected；Outside air is after the pretreatment system (1) purification is capable of direct drinking to the water condensed, in small fan
(106) under the action of, heat exchange is carried out into cooling system (3) and radiating fin, then pass through heat dissipation heat pipe (202) gap, into
The semiconductor cold end for entering the water-trapping system (2), the condensation wing (201) in the water-trapping system (2) are condensed into rapidly water
Pearl；Condensed droplet is pooled to water guide groove (301) through drainage by water-trapping system (2) the W type drainage plate (203)；Institute
The condensed water of a part in water guide groove (301) stated contacts heat pipe, carries out first time heat dissipation, the water-trapping system (2)
The hot polymerization water hole (302) of bottom imports the heat-radiation loop (304) of cooling system (3), then after carrying out a heat exchange with heat pipe,
The hot water tank (401) and cold water tank of the water storage system (4) are finally respectively enterd under the control of Intelligent temperature controller (305)
(402)；Heat pipe heat (202) through water-trapping system (2) is connected with cooling system (3), and bottom is connected to water storage system (4), will
Heat recovery is for heating water made of condensation wing condensation；In the effect of the water-trapping system (2) top entry fan (103)
Under, cold air enters water-trapping system (2) and steams water from both sides cold air duct by semi-conductor condensation wing by after superheater tube hot-flow flue
Body is smoothly discharged after airsetting knot, and under the action of exporting fan (101), clears up dust on filter screen.
2. the recuperation of heat air water vessel based on semiconductor refrigerating according to claim 1, it is characterised in that:
The pretreatment system (1) includes outlet fan (101), air inlet prefiltering net (102), inlet fans (103), combination
Filter core (104), drilled base plate (105) and small fan (106)；The center of top of the pretreatment system (1) offers air intake vent,
The inlet air discharge surface is air inlet prefiltering net (102), is internally provided with inlet fans (103)；The pretreatment system (1)
Top two sides offer outlet air air port, internal installation outlet fan (101)；The pretreatment system (1) is positive hexa-prism knot
Structure is connect with water-trapping system (2), is provided in pretreatment system (1) Combination filter element (104), and Combination filter element (104) is by two mistakes
Filter disc combination cotton yarn forms；The each side of the regular hexagonal prism drilled base plate (105) is provided with outlet air duct (107), the outlet air
It is equipped on duct (107) small fan (106), outside air is entered by inlet fans (103) and air inlet prefiltering net (102)
The pretreatment system (1) is internal, and air by Combination filter element (104) after sufficiently filtering, in six small fans (106)
Under effect, enter water-trapping system (2) through drilled base plate (105)；
The water-trapping system (2) includes a condensation wing (201), heat pipe heat (202), W type water collection sheet (203), hexagon inner panel
(204), radiating fin (205), semiconductor chip (206), spacer block (207) and water outlet (208)；The water-trapping system (2) is in bilayer
Hexa-prism；The top of the water-trapping system (2) is heat-insulating shield, and heat-insulating shield is hexagon, and each rib is provided with a hole
A small fan (106) is fixed in each hole in hole；The small fan (106) is located at the radiating fin (205) of water-trapping system (2)
Top；The water-trapping system (2) is the double-deck hexa-prism, is connected between hexagon inner panel (204) and outer surface hexagon shell
It condenses wing (201), and inlays semiconductor chip (206) in hexagon inner panel (204) wall surface；Contain in the water-trapping system (2)
Six groups of condensation wings (201), condensation wing (201) connect with the cold end of semiconductor chip (206), every group of condensation wing (201) two sides
All it is connected to spacer block (207)；Contain six groups of heat pipe heats (202), the heat pipe heat (202) and semiconductor chip in the water-trapping system (2)
(206) hot end is directly connected to；Contain six groups of radiating fins (205), the radiating fin (205) and heat pipe in the water-trapping system (2)
Group (202) is directly connected to；One piece of N-type semiconductor material and one piece of p-type semiconductor material are coupled to galvanic couple clock synchronization, in this circuit
In lead to direct current after, electric current by N-type element flow to p-type element connector absorb heat, become cold end；N-type is flowed to by p-type element
The connector of element discharges heat, becomes hot end, and after semiconductor chip (206) are powered, the temperature of the condensation wing (201) declines
12 DEG C or so, air passes through the purified small fan at the top of the water-trapping system (2) of pretreatment system (1)
(106) under the action of, the water-trapping system (2) is entered by the drilled base plate (105) of the pretreatment system (1)；When setting
When received shipment row, air is entered in the water-trapping system (2) by pretreatment system (1), first and semiconductor chip (206) hot ends
Connected heat pipe (202) and radiating fin (205) carry out a heat exchange, using circuit with and semiconductor chip (206) cold end
Connected condensation wing (201) condensation by contact is at droplet, from water outlet (208) outflow under condensation wing；Condensed droplet passes through W
Type water collection sheet (203) is collected to water guide groove (301)；Water in the water guide groove (208) is after liquid level has certain altitude
It flows into hot polymerization water hole (302) and enters collection water storage system；
The cooling system (3) includes water guide groove (301), hot polymerization water hole (302), hot polymerization water hole liquid packing (303), heat dissipation
Circuit (304) and Intelligent temperature controller (305)；The cooling system (3) is two layers of hexagonal structure, in water guide groove (301)
The water being collected into converges in internal hexagon, via a side outlet, into external cooling circuit (304) and heat pipe heat
(202) carry out secondary heat exchange, under the control of Intelligent temperature controller (305), by opening and closing heat-radiation loop the right and left not
Same water outlet, water enter the hot water tank (401) and cold water tank (402) collected in water storage system (4)；The cooling system
(3) using heat pipe through in water-trapping system (2) and water storage system (4)；The hot end and heat pipe heat (202) of semiconductor chip (206)
Closely coupled, by the heat transfer of semiconductor chip hexagon inner panel (204) semiconductor-on-insulator piece to heat pipe, waste heat is transferred to heat dissipation again
Wing once radiates to it by the cold air entered；In the water storage system (1), in water guide groove (301), condensed water
Pearl and the secondary heat dissipation of heat pipe contact, water by hot polymerization water hole (302) enter heat-radiation loop (304) afterwards with heat pipe heat (202) again
Heat exchange is carried out, semiconductor hot end (206) and heat pipe heat (202) in cooling system (4) is made all sufficiently to be cooled down；Described
Hot polymerization water hole (302) is with hot polymerization water hole liquid packing (303) to be weldingly connected；
The water storage system (4) includes hot water tank (401) and cold water tank (402), intelligent temperature control outlet valve (403)；Institute
Hot water tank (401) and cold water tank (402) is stated to be connected with the heat-radiation loop (304) of the cooling system (3)；Condensed water by
Water guide groove (301) enters heat-radiation loop (304), heat exchange is carried out by heat-radiation loop (304) and heat pipe heat, in intelligent temperature control
Under the control of device (305), part water enters hot water tank (401), and part water enters cold water tank (402)；The intelligence
Temperature control outlet valve (403) is external in water storage system (4) and is connected with hot and cold water tank, after hot and cold water enters intelligent temperature control valve (403),
It is adjusted by the inside temperature-sensitive element of water valve, final outflow water temperature is set temperature.
3. the recuperation of heat air water vessel based on semiconductor refrigerating according to claim 2, it is characterised in that: pretreatment system
(1) the air inlet prefiltering net (202) described in is the nanometer silver antimicrobial strainer of high density mesh aperture；Filter core (103) by
Internal core and outer two layers cotton yarn composition, internal combination filter core (104) have two layers；The drilled base plate (105) is band
Hole foam filter plate.
4. the recuperation of heat air water vessel based on semiconductor refrigerating according to claim 2, it is characterised in that: Combination filter element
(104) internal structure forms a hollow structure by upper layer of material and subsurface material；Upper layer of material selects honeycomb type efficiently to urge
Change active carbon layer；Subsurface material selects nano-titanium dioxide light catalase to decompose strainer, and intermediate space is filled with mandruka, described more
Hole sponge includes any one of wood-fibred sponge, polyurethane sponge, and two layers of cotton yarn is enclosed with outside internal structure.
5. the recuperation of heat air water vessel based on semiconductor refrigerating according to claim 2, it is characterised in that: described to catch water system
Condensation wing (201) in system (2) is the hydrophilic aluminium foil piece of specially treated；The heat-insulating shield is the hexagonal made of heat-insulating material
Shape bottom plate；The semiconductor chip (206) is made of semiconductor thermoelectric refrigeration material, and the heat pipe in its hot end and cooling system
Group (202) is connected directly, and connects radiating fin (205), and cold end is directly connected to condensation wing (201), while specified for its access
Power supply.
6. the recuperation of heat air water vessel based on semiconductor refrigerating according to claim 5, it is characterised in that: collect water storage system
In system, the heat-radiation loop (304) is to be surrounded by the stainless steel hexagonal prisms hollow out of heat-insulating material by outer layer to form；The heat storage
Water tank (401) cold water tank (402), is made of heat-insulating material；The cold water tank (402), is made of heat-insulating material；
Cooling system (2) the water guide groove (301) is made of heat-insulating material.
7. the recuperation of heat air water vessel based on semiconductor refrigerating according to claim 2, it is characterised in that: heat-radiation loop
(304), water guide groove (301), hot water tank (401), cold water tank (402), select heat-insulating material, and the heat-insulating material is bubble
One of heat-insulating materials such as foam concrete, calcium silicates.
8. the recuperation of heat air water vessel based on semiconductor refrigerating according to claim 2, it is characterised in that: the separate tube
(202) material is copper, and wherein working solution is methanol, and heat pipe is through entire water-trapping system (2) and cooling system (3), radiating fin
Fin (205) is made of copper sheet, is connected with heat pipe and closely coupled with the hot end of semiconductor chip (206).
9. the recuperation of heat air water vessel based on semiconductor refrigerating according to claim 2, it is characterised in that: the heat pipe heat
(202) every group of number is 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910406249.5A CN110206097B (en) | 2019-05-16 | 2019-05-16 | Heat recovery air water catcher based on semiconductor refrigeration |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910406249.5A CN110206097B (en) | 2019-05-16 | 2019-05-16 | Heat recovery air water catcher based on semiconductor refrigeration |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110206097A true CN110206097A (en) | 2019-09-06 |
| CN110206097B CN110206097B (en) | 2023-11-24 |
Family
ID=67787406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910406249.5A Active CN110206097B (en) | 2019-05-16 | 2019-05-16 | Heat recovery air water catcher based on semiconductor refrigeration |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110206097B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112095712A (en) * | 2020-08-19 | 2020-12-18 | 吉林建筑大学 | Water taking system for condensed air |
| CN113819677A (en) * | 2021-10-22 | 2021-12-21 | 西安热工研究院有限公司 | Temperature control system suitable for online fluid monitoring |
| CN113863431A (en) * | 2021-09-10 | 2021-12-31 | 重庆交通大学 | Condensation water taking device based on semiconductor refrigeration |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2169032C1 (en) * | 1999-11-09 | 2001-06-20 | Цивинский Станислав Викторович | Device for effective preparation of fresh water by condensation of water vapor from air |
| JP2009005683A (en) * | 2007-06-01 | 2009-01-15 | Denso Corp | Apparatus and method for producing water drop |
| CN106120961A (en) * | 2016-08-28 | 2016-11-16 | 中国计量大学 | The quasiconductor dew point condensing air water fetching device of Driven by Solar Energy |
| CN205857290U (en) * | 2016-07-28 | 2017-01-04 | 大连海事大学 | A kind of solar air water generator for lifeboat |
| CN108562060A (en) * | 2018-04-23 | 2018-09-21 | 华南理工大学 | A kind of dual temperature formula water vessel based on semiconductor refrigerating |
| CN210797723U (en) * | 2019-05-16 | 2020-06-19 | 华南理工大学 | Heat pipe recovered heat energy semiconductor refrigeration air water catcher |
-
2019
- 2019-05-16 CN CN201910406249.5A patent/CN110206097B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2169032C1 (en) * | 1999-11-09 | 2001-06-20 | Цивинский Станислав Викторович | Device for effective preparation of fresh water by condensation of water vapor from air |
| JP2009005683A (en) * | 2007-06-01 | 2009-01-15 | Denso Corp | Apparatus and method for producing water drop |
| CN205857290U (en) * | 2016-07-28 | 2017-01-04 | 大连海事大学 | A kind of solar air water generator for lifeboat |
| CN106120961A (en) * | 2016-08-28 | 2016-11-16 | 中国计量大学 | The quasiconductor dew point condensing air water fetching device of Driven by Solar Energy |
| CN108562060A (en) * | 2018-04-23 | 2018-09-21 | 华南理工大学 | A kind of dual temperature formula water vessel based on semiconductor refrigerating |
| CN210797723U (en) * | 2019-05-16 | 2020-06-19 | 华南理工大学 | Heat pipe recovered heat energy semiconductor refrigeration air water catcher |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112095712A (en) * | 2020-08-19 | 2020-12-18 | 吉林建筑大学 | Water taking system for condensed air |
| CN113863431A (en) * | 2021-09-10 | 2021-12-31 | 重庆交通大学 | Condensation water taking device based on semiconductor refrigeration |
| CN113819677A (en) * | 2021-10-22 | 2021-12-21 | 西安热工研究院有限公司 | Temperature control system suitable for online fluid monitoring |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110206097B (en) | 2023-11-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110206097A (en) | A kind of recuperation of heat air water vessel based on semiconductor refrigerating | |
| JP3808466B2 (en) | Solar collector panel for heating ventilation air | |
| CN104735959B (en) | The cooling system of rack | |
| JP2018155487A (en) | Solar air heating/cooling system | |
| US20140083120A1 (en) | Renewable energy-based atmospheric water generator | |
| CN205857290U (en) | A kind of solar air water generator for lifeboat | |
| CN105910190B (en) | A kind of heat of adsorption pond coupled film solution dehumidifying air-conditioning system of Driven by Solar Energy | |
| EP0142536A1 (en) | A solar energy powered system for the production of cold | |
| CN103363822A (en) | Sewage heat exchanger for sewage source heat pump unit | |
| CN106788237B (en) | A kind of Novel photo modification high-efficiency photovoltaic system | |
| CN113605494B (en) | Solar regeneration adsorption type air water taking device and using method thereof | |
| CN210797723U (en) | Heat pipe recovered heat energy semiconductor refrigeration air water catcher | |
| CN103090481A (en) | Energy conversion and ventilation device for building | |
| CN206988163U (en) | A kind of multi-functional electric fan | |
| CN210463662U (en) | Water dispenser heat exchanger based on vortex tube | |
| CN217092842U (en) | Dehumidification device is used in laboratory | |
| CN207487479U (en) | A kind of hot water quickly cooling module and device based on phase-change material | |
| CN113983860B (en) | Intelligent control system and control method for cooling tower | |
| CN110762840A (en) | Domestic solar energy warm-air machine | |
| CN109747377A (en) | A kind of vehicle air conditioning waste water utilization system and vehicle | |
| CN108562060A (en) | A kind of dual temperature formula water vessel based on semiconductor refrigerating | |
| CN105146805A (en) | Cold-warm air-conditioning garment | |
| CN110207287A (en) | A kind of needle beamforming back-heating type heat exchange air purification dehumidifier based on thermoelectric cooling | |
| CN113668647A (en) | Solar-driven adsorption type portable air water taking bottle and using method thereof | |
| CN210801535U (en) | Heat collecting and utilizing device for improving energy utilization rate and semiconductor air conditioner |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |