CN110204999A - Epoxy coating of resistance to nuclear radiation and preparation method thereof - Google Patents
Epoxy coating of resistance to nuclear radiation and preparation method thereof Download PDFInfo
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- CN110204999A CN110204999A CN201910574478.8A CN201910574478A CN110204999A CN 110204999 A CN110204999 A CN 110204999A CN 201910574478 A CN201910574478 A CN 201910574478A CN 110204999 A CN110204999 A CN 110204999A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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Abstract
The present invention provides a kind of epoxy coating of resistance to nuclear radiation, its raw material components is by weight, comprising: 45-60 parts of 100 parts of bisphenol A-type liquid epoxy resin, the bisphenol-A of oligomerization, 2-5 parts of graphene microchip, 2-6 parts of alumina powder, 0.1-0.5 parts of catalyst, 0.5-1 parts of polyamide, 60-80 parts of n-butanol, 0.01-0.6 parts of glass fibre.The epoxy coating of resistance to nuclear radiation provided by the present application introduces graphene microchip from new angle, and the coating for the epoxy coating of resistance to nuclear radiation for keeping the function of shielding of coating more traditional is higher by 3 times or more, and coating is 1010It keeps stablizing under the nuclear radiation of mGy (rad).
Description
Technical field
The invention belongs to epoxy coating fields, are related to the formula and preparation method of a kind of spoke of resistance to core body epoxy coating.
Background technique
World's nuclear technology increases sharply in by leaps and bounds development and application, the nuclear power station utilization of capacity.Nuclear reactor and nuclear power station
In damage and pollution of the device facility vulnerable to radioactive elements such as axis, these places need the decoration protection of the spoke of resistance to core body coating.
Nuclear radiation-resistant coating refers to for protecting nuclear device and close to steel, concrete structure and other facilities of nuclear device
Special coating.Nuclear radiation-resistant coating formed coating should be capable of withstanding nuclear radiation, easily remove pollution, have excellent corrosion resistance,
Absorb radiation, prevent radioactive source ambient contamination etc..Nuclear radiation-resistant coating should meet following requirement:
1, there is excellent radiation resistance；
2, easy decontamination after coating is contaminated；
3, the anticorrosive property of coating is good.
The content of background technology part is only the technology that inventor is known, not the existing skill of natural representative this field
Art.
Summary of the invention
For the prior art there are one or more of problem, the present invention provides a kind of epoxy coating of resistance to nuclear radiation,
Raw material components are by weight, comprising: 45-60 parts of 100 parts of bisphenol A-type liquid epoxy resin, bisphenol-A, the graphene of oligomerization
2-5 parts of microplate, 2-6 parts of alumina powder, 0.1-0.5 parts of catalyst, 0.5-1 parts of polyamide, 60-80 parts of n-butanol, glass fibre
0.01-0.6 parts.
As a preferred embodiment, raw material components are by weight, comprising: the bisphenol A-type liquid epoxy tree of oligomerization
100 parts of rouge, 50 parts of bisphenol-A, 2-5 parts of graphene microchip, 3-4 parts of alumina powder, 0.3 part of catalyst, 0.6 part of polyamide, positive fourth
75 parts of alcohol, 0.1-0.2 parts of glass fibre.
According to an aspect of the present invention, the epoxide equivalent of the bisphenol A-type liquid epoxy resin of the oligomerization is 141-
160g/eq。
According to an aspect of the present invention, the catalyst is sodium hydroxide and triphenyl phosphorus according to (5-8): 1 mixture；
Preferably, the catalyst is sodium hydroxide and triphenyl phosphorus according to 6:1 mixture.
The present invention also provides a kind of preparation methods of above-mentioned epoxy coating of resistance to nuclear radiation, comprise the following steps:
1) bisphenol A-type liquid epoxy resin, bisphenol-A, graphene microchip, the alumina powder of oligomerization are uniformly mixed；
2) it is added into the bisphenol A-type liquid epoxy resin for the oligomerization for being mixed with bisphenol-A, graphene microchip and alumina powder
Catalyst is uniformly mixing to obtain mixed system A；
3) by mixed system at 60-80 DEG C low temperature polymerization 20-30min, then to be brought rapidly up at 150-200 DEG C high temperature poly-
Close 60-120min；
4) cold stopping heating, during slow cooling, n-butanol, glass fibers are sequentially added into the material of polymer
Peacekeeping polyamide.
According to an aspect of the present invention, the step 1) -4) carry out in a kettle.
According to an aspect of the present invention, in the step 1), using being stirred, the rate of stirring is 200-
300rpm；Preferably, mixing time 20-30min.
According to an aspect of the present invention, in the step 2), quickly stirring is lower is slowly added catalyst；Preferably,
The mixing speed quickly stirred is 1000-1200rpm, and the adding rate of the catalyst is 0.1-0.5kg/1min.
According to an aspect of the present invention, in the step 3), the heating rate being brought rapidly up be 10 DEG C/1min with
On, preferably 25 DEG C/1min.
According to an aspect of the present invention, in the step 4), mixing speed is using high when n-butanol, glass fibre is added
Speed stirring is lower to be carried out, and high-speed stirred speed is 1500rpm or more, preferably 2000-3000rpm；Using low when polyamide is added
Speed stirring is lower to be carried out, and stirring at low speed speed is 20-50rpm.
The medicine have the advantages that
The epoxy coating of resistance to nuclear radiation provided by the present application introduces graphene microchip from new angle, makes coating
The coating of the more traditional epoxy coating of resistance to nuclear radiation of function of shielding is higher by 3 times or more, and coating is 1010Under the nuclear radiation of mGy (rad)
It keeps stablizing.The preparation method of the epoxy coating of resistance to nuclear radiation provided by the present application, using the bisphenol A-type liquid epoxy tree of oligomerization
Rouge is first mixed with graphene and aluminium oxide point before further polymerization, and graphene and aluminium oxide is made to participate in oligomerization bisphenol A-type liquid
State epoxy resin into the polymerization process of high polymerizing bisphenol A type epoxy resin, participate in in-situ polymerization graphene and aluminium oxide with
High polymerizing bisphenol A type epoxy resin after polymerization realizes and adequately can uniformly disperse, and avoids graphene and aluminium oxide
Agglomeration traits in the epoxy.And by accurate control technological parameter, such as mixing speed, polymerization temperature and heating speed
Degree, increases the mixed volume in the epoxy resin of graphene and aluminium oxide, and keep stable.Graphene microchip, aluminium oxide and glass
The glass fiber reinforcement performance of the resistance to nuclear radiation of epoxy coating.
Specific embodiment
Hereinafter, certain exemplary embodiments are simply just described.As one skilled in the art will recognize that
Like that, without departing from the spirit or scope of the present invention, described embodiment can be modified by various different modes.
Hereinafter, preferred embodiments of the present invention will be described, it should be understood that preferred embodiment described herein is only used
In the description and interpretation present invention, it is not intended to limit the present invention.
As one embodiment of the present invention, a kind of epoxy coating of resistance to nuclear radiation is illustrated, raw material components are by weight
Part meter, comprising: 45-60 parts of 100 parts of bisphenol A-type liquid epoxy resin, the bisphenol-A of oligomerization, 2-5 parts of graphene microchip, oxidation
2-6 parts of aluminium powder, 0.1-0.5 parts of catalyst, 0.5-1 parts of polyamide, 60-80 parts of n-butanol, 0.01-0.6 parts of glass fibre.
As preferred embodiment, raw material components are by weight, comprising: the bisphenol A-type liquid epoxy of oligomerization
100 parts of resin, 50 parts of bisphenol-A, 2-5 parts of graphene microchip, 3-4 parts of alumina powder, 0.3 part of catalyst, 0.6 part of polyamide, just
75 parts of butanol, 0.1-0.2 parts of glass fibre.
The epoxide equivalent of the bisphenol A-type liquid epoxy resin of oligomerization is 141-160g/eq, such as: 141g/eq, 142g/
eq、143g/eq、144g/eq、145g/eq、146g/eq、147g/eq、148g/eq、149g/eq、150g/eq、151g/eq、
152g/eq, 153g/eq, 154g/eq, 155g/eq, 156g/eq, 157g/eq, 158g/eq, 159g/eq, 160g/eq, etc..
Catalyst is sodium hydroxide and triphenyl phosphorus according to (5-8): 1 mixture, mixed proportion can be 5:1,6:17:
18:1, etc..As preferred embodiment, catalyst is sodium hydroxide and triphenyl phosphorus according to 6:1 mixture.
As another embodiment of the invention, a kind of system of above embodiment epoxy coating of resistance to nuclear radiation is illustrated
Preparation Method comprises the following steps:
1) bisphenol A-type liquid epoxy resin, bisphenol-A, graphene microchip, the alumina powder of oligomerization are uniformly mixed；
2) it is added into the bisphenol A-type liquid epoxy resin for the oligomerization for being mixed with bisphenol-A, graphene microchip and alumina powder
Catalyst is uniformly mixing to obtain mixed system A；
3) by mixed system at 60-80 DEG C low temperature polymerization 20-30min, then to be brought rapidly up at 150-200 DEG C high temperature poly-
Close 60-120min；
4) cold stopping heating, during slow cooling, n-butanol, glass fibers are sequentially added into the material of polymer
Peacekeeping polyamide.
Step 1) -4) carry out in a kettle.
In step 1), using being stirred, the rate of stirring is 200-300rpm, such as: 200rpm, 210rpm,
220rpm, 230rpm, 240rpm, 250rpm, 260rpm, 270rpm, 280rpm, 290rpm, 300rpm, etc..Mixing time is
20-30min, such as: 20min, 21min, 22min, 23min, 24min, 25min, 26min, 27min, 28min, 29min,
30min, etc..
In step 2), quickly stirring is lower is slowly added catalyst.The mixing speed quickly stirred is 1000-1200rpm,
Such as: 1000rpm, 1020rpm, 1040rpm, 1050rpm, 1060rpm, 1080rpm, 1100rpm, 1120rpm, 1140rpm,
1150rpm, 1160rpm, 1180rpm, 1190rpm, 1200rpm, etc..The adding rate of the catalyst is 0.1-0.5kg/
1min, such as: 0.1kg/1min, 0.2kg/1min, 0.3kg/1min, 0.4kg/1min, 0.5kg/1min, etc..
In step 3), the heating rate that is brought rapidly up is 10 DEG C/1min or more, such as: 10 DEG C/1min, 11 DEG C/1min,
12℃/1min、14℃/1min、15℃/1min、18℃/1min、20℃/1min、22℃/1min、24℃/1min、25℃/
1min、28℃/1min、30℃/1min、32℃/1min、35℃/1min、40℃/1min、42℃/1min、45℃/1min、48
DEG C/1min, 50 DEG C/1min, etc..As preferred embodiment, the heating rate being brought rapidly up is 25 DEG C/1min.
Mixing speed uses in step 4), when n-butanol, glass fibre is added carries out under high-speed stirred, high-speed stirred speed
For 1500rpm or more, such as: 1500rpm, 1600rpm, 1700rpm, 1800rpm, 1900rpm, 2000rpm, 2200rpm,
2400rpm、2500rpm、2600rpm、2800rpm、3000rpm、3500rpm、4000rpm、4200rpm、4500rpm、
4800rpm, etc..As preferred embodiment, high-speed stirred speed is 2000-3000rpm, such as: 2000rpm,
2100rpm、2200rpm、2300rpm、2400rpm、2500rpm、2600rpm、2700rpm、2800rpm、2900rpm、
3000rpm, etc..Using lower progress is stirred at low speed when polyamide is added, stirring at low speed speed is 20-50rpm, such as: 20rpm,
22rpm、24rpm、25rpm、26rpm、28rpm、30rpm、32rpm、35rpm、37rpm、40rpm、42rpm、45rpm、
48rpm, 50rpm, etc..
Superiority of the invention is illustrated below by embodiment:
Embodiment 1:
Present embodiment illustrates a kind of preparation process of epoxy coating of resistance to nuclear radiation, raw material components are as follows:
Raw material components are by weight:
100 parts of the bisphenol A-type liquid epoxy resin of oligomerization
45 parts of bisphenol-A
2 parts of graphene microchip
2 parts of alumina powder
0.1 part of catalyst
0.5 part of polyamide
60 parts of n-butanol
0.01 part of glass fibre；
The specific steps of which are as follows:
Step 1): the bisphenol A-type liquid epoxy resin of oligomerization, bisphenol-A, graphene microchip, alumina powder are mixed and is stirred
It mixes uniformly, the rate of stirring is 200rpm, mixing time 30min.
Step 2) is into the bisphenol A-type liquid epoxy resin for the oligomerization for being mixed with bisphenol-A, graphene microchip and alumina powder
Catalyst is added, stirs evenly, stirring rate 1000rpm, the adding rate of catalyst is 0.01kg/1min, is mixed
System A.
Step 3) low temperature polymerization 20min at 80 DEG C by mixed system, then be brought rapidly up with the rate of 10 DEG C/1min
High temperature polymerization 60min at 200 DEG C.
The cold stopping heating of step 4), during slow cooling, into the material of polymer in the stirring speed of 1500rpm
N-butanol and glass fibre are added under rate, then polyamide is added under the stirring rate of 20rpm, obtains the epoxy of resistance to nuclear radiation painting
Material.
Embodiment 2:
Present embodiment illustrates a kind of preparation process of epoxy coating of resistance to nuclear radiation, raw material components are as follows:
Raw material components are by weight:
100 parts of the bisphenol A-type liquid epoxy resin of oligomerization
60 parts of bisphenol-A
5 parts of graphene microchip
6 parts of alumina powder
0.5 part of catalyst
1 part of polyamide
80 parts of n-butanol
0.6 part of glass fibre；
The specific steps of which are as follows:
Step 1): the bisphenol A-type liquid epoxy resin of oligomerization, bisphenol-A, graphene microchip, alumina powder are mixed and is stirred
It mixes uniformly, the rate of stirring is 300rpm, mixing time 20min.
Step 2) is into the bisphenol A-type liquid epoxy resin for the oligomerization for being mixed with bisphenol-A, graphene microchip and alumina powder
Catalyst is added, stirs evenly, stirring rate 1200rpm, the adding rate of catalyst is 0.05kg/1min, is mixed
System A.
Step 3) low temperature polymerization 25min at 60 DEG C by mixed system, then be brought rapidly up with the rate of 20 DEG C/1min
High temperature polymerization 90min at 180 DEG C.
The cold stopping heating of step 4), during slow cooling, into the material of polymer in the stirring speed of 3000rpm
N-butanol and glass fibre are added under rate, then polyamide is added under the stirring rate of 40rpm, obtains the epoxy of resistance to nuclear radiation painting
Material.
Embodiment 3:
Present embodiment illustrates a kind of preparation process of epoxy coating of resistance to nuclear radiation, raw material components are as follows:
Raw material components are by weight:
100 parts of the bisphenol A-type liquid epoxy resin of oligomerization
50 parts of bisphenol-A
4 parts of graphene microchip
3 parts of alumina powder
0.3 part of catalyst
0.6 part of polyamide
75 parts of n-butanol
0.1 part of glass fibre；
The specific steps of which are as follows:
Step 1): the bisphenol A-type liquid epoxy resin of oligomerization, bisphenol-A, graphene microchip, alumina powder are mixed and is stirred
It mixes uniformly, the rate of stirring is 250rpm, mixing time 25min.
Step 2) is into the bisphenol A-type liquid epoxy resin for the oligomerization for being mixed with bisphenol-A, graphene microchip and alumina powder
Catalyst is added, stirs evenly, stirring rate 1100rpm, the adding rate of catalyst is 0.03kg/1min, is mixed
System A.
Step 3) low temperature polymerization 20min at 75 DEG C by mixed system, then be brought rapidly up with the rate of 10 DEG C/1min
High temperature polymerization 60min at 200 DEG C.
The cold stopping heating of step 4), during slow cooling, into the material of polymer in the stirring speed of 1500rpm
N-butanol and glass fibre are added under rate, then polyamide is added under the stirring rate of 20rpm, obtains the epoxy of resistance to nuclear radiation painting
Material.
Embodiment 4:
Present embodiment illustrates a kind of preparation process of epoxy coating of resistance to nuclear radiation, raw material components are as follows:
Raw material components are by weight:
100 parts of the bisphenol A-type liquid epoxy resin of oligomerization
55 parts of bisphenol-A
3 parts of graphene microchip
4 parts of alumina powder
0.4 part of catalyst
0.8 part of polyamide
70 parts of n-butanol
0.2 part of glass fibre；
The specific steps of which are as follows:
Step 1): the bisphenol A-type liquid epoxy resin of oligomerization, bisphenol-A, graphene microchip, alumina powder are mixed and is stirred
It mixes uniformly, the rate of stirring is 280rpm, mixing time 22min.
Step 2) is into the bisphenol A-type liquid epoxy resin for the oligomerization for being mixed with bisphenol-A, graphene microchip and alumina powder
Catalyst is added, stirs evenly, stirring rate 1150rpm, the adding rate of catalyst is 0.02kg/1min, is mixed
System A.
Step 3) low temperature polymerization 28min at 65 DEG C by mixed system, then be brought rapidly up with the rate of 30 DEG C/1min
High temperature polymerization 100min at 160 DEG C.
The cold stopping heating of step 4), during slow cooling, into the material of polymer in the stirring speed of 2500rpm
N-butanol and glass fibre are added under rate, then polyamide is added under the stirring rate of 30rpm, obtains the epoxy of resistance to nuclear radiation painting
Material.
Embodiment 5:
Present embodiment illustrates a kind of preparation process of epoxy coating of resistance to nuclear radiation, raw material components are as follows:
Raw material components are by weight:
100 parts of the bisphenol A-type liquid epoxy resin of oligomerization
48 parts of bisphenol-A
5 parts of graphene microchip
5 parts of alumina powder
0.2 part of catalyst
0.7 part of polyamide
65 parts of n-butanol
0.4 part of glass fibre；
The specific steps of which are as follows:
Step 1): the bisphenol A-type liquid epoxy resin of oligomerization, bisphenol-A, graphene microchip, alumina powder are mixed and is stirred
It mixes uniformly, the rate of stirring is 240rpm, mixing time 27min.
Step 2) is into the bisphenol A-type liquid epoxy resin for the oligomerization for being mixed with bisphenol-A, graphene microchip and alumina powder
Catalyst is added, stirs evenly, stirring rate 1180rpm, the adding rate of catalyst is 0.04kg/1min, is mixed
System A.
Step 3) low temperature polymerization 25min at 68 DEG C by mixed system, then be brought rapidly up with the rate of 15 DEG C/1min
High temperature polymerization 800min at 170 DEG C.
The cold stopping heating of step 4), during slow cooling, into the material of polymer in the stirring speed of 2800rpm
N-butanol and glass fibre are added under rate, then polyamide is added under the stirring rate of 40rpm, obtains the epoxy of resistance to nuclear radiation painting
Material.
Finally, it should be noted that the foregoing is only a preferred embodiment of the present invention, it is not intended to restrict the invention,
Although the present invention is described in detail referring to the foregoing embodiments, for those skilled in the art, still may be used
To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features.
All within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in of the invention
Within protection scope.
Claims (10)
1. a kind of epoxy coating of resistance to nuclear radiation, which is characterized in that its raw material components is by weight, comprising: the bisphenol-A of oligomerization
100 parts of type liquid-state epoxy resin, 45-60 parts of bisphenol-A, 2-5 parts of graphene microchip, 2-6 parts of alumina powder, catalyst 0.1-0.5
Part, 0.5-1 parts of polyamide, 60-80 parts of n-butanol, 0.01-0.6 parts of glass fibre.
2. the epoxy coating of resistance to nuclear radiation according to claim 1, which is characterized in that its raw material components by weight, wraps
Include: 50 parts of 100 parts of bisphenol A-type liquid epoxy resin, the bisphenol-A of oligomerization, 2-5 parts of graphene microchip, 3-4 parts of alumina powder,
0.3 part of catalyst, 0.6 part of polyamide, 75 parts of n-butanol, 0.1-0.2 parts of glass fibre.
3. the epoxy coating of resistance to nuclear radiation according to claim 1 or 2, which is characterized in that the bisphenol A-type liquid of the oligomerization
The epoxide equivalent of state epoxy resin is 141-160g/eq.
4. the epoxy coating of resistance to nuclear radiation according to claim 1 or 2, which is characterized in that the catalyst is sodium hydroxide
With triphenyl phosphorus according to (5-8): 1 mixture；Preferably, the catalyst is that sodium hydroxide is mixed with triphenyl phosphorus according to 6:1
Object.
5. a kind of preparation method of any one of -4 epoxy coatings of resistance to nuclear radiation according to claim 1, which is characterized in that include
Following steps:
1) bisphenol A-type liquid epoxy resin, bisphenol-A, graphene microchip, the alumina powder of oligomerization are uniformly mixed；
2) catalysis is added into the bisphenol A-type liquid epoxy resin for the oligomerization for being mixed with bisphenol-A, graphene microchip and alumina powder
Agent is uniformly mixing to obtain mixed system A；
3) by mixed system at 60-80 DEG C low temperature polymerization 20-30min, then be brought rapidly up high temperature polymerization at 150-200 DEG C
60-120min；
4) cold stopping heating, during slow cooling, sequentially added into the material of polymer n-butanol, glass fibre and
Polyamide.
6. the epoxy coating of resistance to nuclear radiation according to claim 5, which is characterized in that the step 1) -4) in reaction kettle
Middle progress.
7. the epoxy coating of resistance to nuclear radiation according to claim 5, which is characterized in that mixed using stirring in the step 1)
It closes, the rate of stirring is 200-300rpm；Preferably, mixing time 20-30min.
8. the epoxy coating of resistance to nuclear radiation according to claim 5, which is characterized in that in the step 2), quickly under stirring
Catalyst is slowly added；Preferably, the mixing speed quickly stirred is 1000-1200rpm, the addition of the catalyst
Rate is 0.1-0.5kg/1min.
9. the epoxy coating of resistance to nuclear radiation according to claim 5, which is characterized in that in the step 3), the rapid liter
The heating rate of temperature is 10 DEG C/1min or more, preferably 25 DEG C/1min.
10. the epoxy coating of resistance to nuclear radiation according to claim 5, which is characterized in that in the step 4), positive fourth is added
Mixing speed uses when alcohol, glass fibre carries out under high-speed stirred, and high-speed stirred speed is 1500rpm or more, preferably 2000-
3000rpm；Using lower progress is stirred at low speed when polyamide is added, stirring at low speed speed is 20-50rpm.
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| CN201910574478.8A CN110204999A (en) | 2019-06-28 | 2019-06-28 | Epoxy coating of resistance to nuclear radiation and preparation method thereof |
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| CN201910574478.8A CN110204999A (en) | 2019-06-28 | 2019-06-28 | Epoxy coating of resistance to nuclear radiation and preparation method thereof |
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Application publication date: 20190906 |