CN110199002A - Abrasive product and forming method thereof - Google Patents

Abrasive product and forming method thereof Download PDF

Info

Publication number
CN110199002A
CN110199002A CN201780083370.8A CN201780083370A CN110199002A CN 110199002 A CN110199002 A CN 110199002A CN 201780083370 A CN201780083370 A CN 201780083370A CN 110199002 A CN110199002 A CN 110199002A
Authority
CN
China
Prior art keywords
abrasive
siloxanes
covalently bonded
main body
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201780083370.8A
Other languages
Chinese (zh)
Inventor
G·M·哈拉勒
S·P·科马斯
J·桑卡拉纳拉亚南
N·拉梅什
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Saint Gobain Abrasifs SA
Saint Gobain Abrasives Inc
Original Assignee
Saint Gobain Abrasives Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint Gobain Abrasives Inc filed Critical Saint Gobain Abrasives Inc
Publication of CN110199002A publication Critical patent/CN110199002A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28Resins or natural or synthetic macromolecular compounds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/02Wheels in one piece

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

The present invention provides a kind of abrasive product, the abrasive product may include main body, and the main body includes binding material and includes abrasive grain in the binding material.The binding material may include the silicone functionalities covalently bonded to multiple phenyl ring.In one embodiment, the binding material may include at least one silicone functionalities covalently bonded to phenoxy group.In a particular embodiment, the binding material may include the dimethyl silicone polymer covalently bonded to phenoxy group.The main body may include improved wet strength, this can be showed by wet buckle stress conservation rate.In one embodiment, the main body includes at least 52% wet buckle stress conservation rate.

Description

Abrasive product and forming method thereof
Technical field
The present invention relates to abrasive products and the method for forming abrasive product.
Background technique
The abrasive product of such as abrasive material wheel can be used to remove material from workpiece and the not phase may be left on workpiece The scratch of prestige.In wet-grinding technology and relative device, abrasive wheel and workpiece are cooled down and lubricate using fluid to remove clast and improve grinding effect Rate.The wet holding capacity of abrasive wheel influences the stability of wheel performance.The industry persistently requires improved abrasive product.
Brief Description Of Drawings
By reference to attached drawing, the present invention may be better understood, and allow numerous feature and advantage of the invention for this The technical staff in field is apparent.The drawings are not necessarily drawn to scale.
Fig. 1 includes the flow chart for being used to form abrasive product.
Fig. 2 includes the figure of conventional adhesive precursor material and the FTIR reading according to the bonding precursor material of one embodiment.
Fig. 3 includes conventional abrasive articles, according to the abrasive product sample of one embodiment and according to the viscous of one embodiment Tie the figure of the FTIR reading of precursor material.
Fig. 4 includes the figure of the FTIR reading of representative abrasive product.
Fig. 5 includes the curve graph of the content of siloxane in the binding material of FTIR absorption intensity and representative abrasive product.
Fig. 6 includes that the scratch of one group of wheel sample counts the curve graph with scratch size.
Fig. 7 includes that the scratch of another group of wheel sample counts the curve graph with scratch size.
It will be appreciated by the skilled person that element in attached drawing for simplicity and clarity for the sake of show, be not necessarily drawn to scale.Example Such as, the size of some elements can be amplified relative to other elements in figure, to help to promote the understanding to the embodiment of the present invention.
Specific embodiment
Being described below to help to understand teachings disclosed herein in conjunction with attached drawing is provided.Following discussion will focus on The specific embodiment and embodiment of this teaching content.The emphasis is provided and is to help description teaching content, and should not It is construed as the limitation to the range or applicability of this teaching content.However, other religions can of course be used in this application Lead content.
As used herein, term " including/include (comprises/comprising/includes/including) ", " with (has/having) " or its any other modification be intended to cover nonexcludability include.E.g., including feature list Method, product or device be not necessarily limited to those features, but may include not expressly listed or this method, product Or other features that device is intrinsic.In addition, otherwise "or" refers to inclusive or and non-exclusive unless there are specific opposite explanation Property or.For example, following any one can meet condition A or B:A true (or existing) and B is false (or being not present), A is False (or be not present) and B is that true (or existing) and both A and B are true (or existing).
Moreover, describing element and component as described herein using "one" or "an".It does so and is intended merely to conveniently For the sake of and provide to the general understanding of the scope of the invention.Unless it is obvious that it is meant otherwise, otherwise this description should be understood Including one or at least one, and odd number also includes plural number, or vice versa.For example, when single item is described herein, it can Single item is replaced using more than one item.Similarly, this document describes more than one item, single item can be taken For more than one item.
Unless otherwise defined, all technical terms used herein and scientific and technical terminology all with it is of the art The normally understood meaning of those of ordinary skill is identical.Material, method and example are merely exemplary and not restrictive.About not The aspect of certain details of the related certain material and processing behavior of description, such details may include conventional method, It can find in the textbook of manufacturing field and other sources.
Embodiment disclosed herein is related to abrasive product, and the abrasive product includes main body, which includes being included in glue Tie the abrasive grain in material.Abrasive product can have improved performance and increased service life.Representative abrasive product can Including compared with conventional abrasive wheel, with improved wet strength conservation rate and can on workpiece forming quantity reduction scratch Abrasive wheel.
Other embodiment is related to the abrasive product with the main body including specific binding material.In one embodiment, Binding material may include the silicone functionalities (- Si-O-Si-) covalently bonded to main polymer chain, which includes Pass through the aromatic ring of methylene bridges.In another embodiment, binding material can be in 1258cm-1To 1265cm-1In range (such as in 1259cm- at wavelength1Or 1261cm-1Place) there is FTIR characteristic peak.In a particular embodiment, binding material can Including polymer, which includes the dimethyl silicone polymer covalently bonded to phenoxy group.More specifically, binding material can wrap Multiple phenoxy groups are included, each of multiple phenoxy group is all covalently bonded to dimethyl silicone polymer.Multiple phenoxy groups can lead to Methylene bridge is crossed to be covalently bonded to one another.
Additional embodiment relates to the use of the method that bonding precursor material forms abrasive product.According to one embodiment, bonding Precursor material can be in 1257cm-1To 1261cm-1There is FTIR characteristic peak at wavelength in range.For example, bonding precursor material can In 1257cm-1Place has FTIR characteristic peak.Bonding precursor material may include chemical modification resin.In one embodiment, resin It may include phenolic resin, and chemical modification may include the covalent bond between phenolic resin and silicone functionalities.In a spy Determine in embodiment, chemical modification resin may include by the novolac resin of dimethyl silicone polymer chemical modification.Chemical modification The use of phenolic resin allows the abrasive product of Formation and characteristics and performance improvement, and such as wet holding capacity improves and stays in workpiece On scratch amount reduce.
Fig. 1 includes the flow chart according to the method for the formation abrasive product of one embodiment.At step 101, it can prepare Mixture comprising bonding precursor material and abrasive grain.The mixture also may include one or more optional additives, packet It includes such as secondary abrasive grain, filler, reinforcing material.
According to one embodiment, bonding precursor material can centainly content be present in mixture, which can be conducive to The abrasive product of Formation and characteristics and performance improvement.For example, mixture may include at least 2.5wt.% for accounting for the total weight of mixture, Such as at least 3wt.%, at least 5wt.%, at least 8wt.%, or the bonding precursor material of at least 12wt.%.In another example In, mixture may include the at most 25wt.% for accounting for the total weight of mixture, such as at most 22wt.%, at most 20wt.%, or extremely The binding material of more 18wt.%.In another embodiment, it includes any minimum disclosed herein that mixture, which may include content, The binding material of percentage and largest percentage.For example, bonding precursor material can account for the 2.5wt.% of the total weight of mixture Amount to 25wt.% is present in mixture.
According to one embodiment, bonding precursor material may include organic material, and such as natural organic or synthesis are organic Material.Exemplary organic material may include resin, such as phenolic resin, epoxy resin, polyester resin, polyurethane, polyester, polyamides Imines, polybenzimidazoles, aromatic polyamides, phenol-formaldehyde resin modified (the epoxy-modified or phenolic resin being such as blended with plasticizer Deng) etc. and their any combination.According at least one embodiment, bonding precursor material may include phenolic resin, the phenol Urea formaldehyde includes novolac resin, resol or their any combination.
According to another embodiment, bonding precursor material may include chemical modification resin.Chemical modification may include resin with Covalent bond between particular functional group, the particular functional group are different from the functional group of resin.Particular functional group can be molecular cell, And resin can be chemically bonded to the molecule with functional group.For example, property modifying functional group can be directly or indirectly covalently bonded to tree Rouge.
According to one embodiment, chemical modification resin may include chemical modification phenolic resin.According to another embodiment, show Example property property modifying functional group may include silicone functionalities (- Si-O-Si-).In a particular embodiment, chemical modification resin can It is substantially made of chemical modification phenolic resin, which includes at least one silicone functionalities.Another In one specific embodiment, bonding precursor material may include the phenolic aldehyde tree modified by the molecular chemistry comprising silicone functionalities Rouge.Specifically, chemical modification phenolic resin may include the phenolic resin covalently bonded to the molecule comprising silicone functionalities.Point Son may include monomer, oligomer, polymer or their combination.In another embodiment, molecule may include multiple siloxanes Functional group, such as duplicate silicone functionalities.According to another embodiment, chemical modification phenolic resin may include chemical modification Novolac resin, chemical modification resol or their combination.According to a specific embodiment, chemical modification phenol Urea formaldehyde may include chemical modification novolac resin.More specifically, chemical modification phenolic resin can be substantially by chemical modification Novolac resin composition.
According to a specific embodiment, chemical modification novolac resin may include covalently bonded to comprising at least one silicon The novolac resin of the oligomer of Yang Wan functional group, covalently bonded to the polymer comprising at least one silicone functionalities Novolac resin or their combination.
According to one embodiment, the example molecule suitable for carrying out chemical modification to resin may include being expressed from the next Oligomer or polymer.As used herein, term siloxanes refers to the molecule being expressed from the next.
R may include methyl or phenyl, and X and Y may be the same or different and independently represent hydrogen atom, alkyl or alkoxy, And n can be at least 1 and be at most 500 or higher.X, Y or both can and resin reaction between resin and molecule formed altogether Valence link, to form chemical modification resin.For example, X, Y or both can be reacted with novolac resin, so that molecule can covalent bond It is bonded to novolac resin.In at least one embodiment, molecule can have the molecular weight of at least 500 dalton.At another In embodiment, at least one of R, X and Y can be-CH3.In a particular embodiment, molecular weight can have at least 500 The molecular weight that you pause, and each of R, X and Y can be-CH3.
According to one embodiment, X, Y or both can with the functional group reactions of resin, to form covalent bond.For example, X, Y Or both can all react to the hydroxyl of phenolic resin.In another embodiment, duplicate silicone functionalities can pass through Methylene bridge is bonded to phenolic resin.Specifically, the methylene at X or Y location can be bound directly to the oxygen atom of resin.Another In one embodiment, chemical modification resin may include the dimethyl silicone polymer gathered covalently bonded to novolac resin.For example, Modified novolac resin may include the covalent bond between methylene bridge and phenoxy group, and wherein methyl bridge can be covalently bonded to silicon oxygen Groups.In a particular embodiment, modified resin may include being bound directly to the oxygen atom of phenyl ring and being bonded to siloxanes Direct covalent bonds between the methylene of group.
In another embodiment, bonding precursor material may include resin and chemical modification resin.For example, bonding precursor material Material may include phenolic resin and the phenolic resin by silicone functionalities chemical modification.Specifically, bonding precursor material may include Phenolic resin and chemical modification novolac resin.More specifically, bonding precursor material may include phenolic resin, such as phenolic aldehyde is clear Coating resins, resol or their combination, and the novolac resin by silicone functionalities chemical modification.One In a specific embodiment, bonding precursor material may include novolac resin, siloxanes chemistry modified novolac resin, first rank Phenolic resin or their any combination.In another particular embodiment, phenolic resin may include resol and change Learn modified novolac resin.
According to one embodiment, which may include the chemical modification resin of certain content, this can advantageously form spy The abrasive product of property and performance improvement.For example, chemical modification resin can account for at least 1wt.% of the total weight of mixture, such as At least 2wt.%, or at least 3.5wt.%, or at least 5wt.%, or at least 6.5wt.%, or the content of at least 7.5wt.% are deposited It is in mixture.In another example, chemical modification resin can account for the at most 20wt.% of the total weight of mixture, such as At most 18wt.%, or at most 14wt.%, or at most 12wt.%, or the content of at most 10wt.% are present in mixture.? In another embodiment, the content of chemical modification resin can include any minimum percent and largest percentage being mentioned herein In the range of, such as in the range of at least 1wt.% at most 20wt.%.In a particular embodiment, chemical modification tree Rouge may include siloxanes chemistry modified novolac resin, and therefore, siloxanes chemistry modified novolac resin can have herein Any content mentioned.
According to one embodiment, bonding precursor material may include the novolaks tree covalently bonded to dimethyl silicone polymer Rouge.In a particular embodiment, chemical modification resin can be substantially by the novolaks of dimethyl silicone polymer chemical modification Resin composition.For example, chemical modification novolac resin may include the dimethyl silicone polymer covalently bonded to phenoxy group.At this In open, examined using the Perkin Elmer Frontier Model FTIR with Diamond/ZnSe Tip ATR probe Survey dimethyl silicone polymer.The tree of powder type of the Diamond/ZnSe Tip ATR probe analysis immediately below probe can be used Rouge sample.The spectroscopic data of sample is compared with the data from the library omniscient informatics ATR/IR, to determine the every of spectrum A peak represents anything.
Fig. 2 includes Conventional phenol-formaldehyde varnish gum, silicone resin and dimethyl silicone polymer chemical modification novolaks tree The FTIR spectrum of rouge (SMR resin).As shown in Fig. 2, silicone resin is in 1259cm-1Place shows characteristic peak, and SMR resin exists 1257cm-1Place shows characteristic peak.Usual resins are in 1259cm-1Or 1257cm-1Place does not show appearance.
According to one embodiment, bonding precursor material may include chemical modification resin, and content can advantageously form performance Improved abrasive product.In one non-limiting embodiment, chemical modification resin can have relative to bonding precursor material Total weight at least 60wt.% such as accounts for at least 70wt.% of the total weight of bonding precursor material, or at least 75wt.%, or extremely Few 80wt.%, or the content of even at least 85wt.%.In another non-limiting embodiment, chemical modification resin can account for viscous That ties precursor material total weight is not more than 95wt.%, such as no more than 90wt.%, or is not more than 88wt.%.It should be appreciated that changing The content for learning modified resin may include any minimum percent and largest percentage disclosed herein.In another embodiment In, chemical modification resin may include the novolac resin covalently bonded to silicone functionalities.Specifically, chemical modification resin It may include the novolac resin covalently bonded to siloxanes, or more specifically, can be substantially by siloxanes chemistry modified phenolic Varnish gum composition.Therefore, the content of siloxanes chemistry modified resin may include any content mentioned with chemical modification resin. In a particular embodiment, siloxanes chemistry modified resin may include dimethyl silicone polymer chemical modification novolaks tree Rouge, or more specifically, can be substantially made of dimethyl silicone polymer chemical modification novolac resin.It is particularly real at one It applies in example, bonding precursor material may include the dimethyl silicone polymer chemical modification for any content mentioned with chemical modification resin Novolac resin.
In one non-limiting embodiment, bonding precursor material may include the silicon covalently bonded to the certain content of resin Oxygen alkane.In one embodiment, bonding precursor material may include being total to for at least 1wt.% for the total weight for accounting for bonding precursor material The siloxanes that valence link closes, such as accounts for at least 1.5wt.% of the total weight of bonding precursor material, or at least 2wt.%, or at least 2.5wt.%, or at least 3wt.%, or at least 3.5wt.%, or at least 4wt.%, or at least 4.5wt.%, or at least 5wt.%, or at least 5.5wt.%, or at least 6wt.%, or at least 6.5wt.%, or at least 7wt.%, or at least 7.5wt.%, or at least 8wt.%, or at least 8.5wt.%, or at least 9wt.%, or at least 9.5wt.%, or at least 10wt.%, or at least 11wt.%, or at least 12wt.%, or at least 12.5wt.%, or at least 13wt.%, or at least The siloxanes of the covalent bonding of 13.5wt.%.Alternatively or in addition to this, bonding precursor material may include accounting for bonding precursor material Total weight the at most covalent bonding of 30wt.% siloxanes, such as account for the total weight of bonding precursor material at most 29wt.%, or at most 28wt.%, or at most 27wt.%, or at most 26wt.%, or at most 25wt.%, or at most 24wt.%, or at most 23wt.%, or at most 22wt.%, or at most 21wt.%, or at most 20wt.%, or at most 19.5wt.%, or at most 19wt.%, or at most 18.5wt.%, or at most 18wt.% covalent bonding siloxanes.In addition, The content of the siloxanes of covalent bonding can be in the range of including any minimum value and maximum value being mentioned herein.For example, bonding Precursor material may include the siloxanes that content range includes at least 1wt.% and the covalent bonding of at most 30wt.%.In a spy Determine in embodiment, the siloxanes of covalent bonding may include dimethyl silicone polymer, or more specifically, can be substantially by poly dimethyl Siloxanes composition.Therefore, bonding precursor material may include the poly dimethyl for any content mentioned with the siloxanes of covalent bonding Siloxanes.
According to one embodiment, bonding precursor material may also include usual resins, such as phenolic resin, and content can be advantageous In the abrasive product that forming properties improve.For example, resin can account for the at most 40wt.% of the total weight of bonding precursor material, or At most 30wt.%, or at most 20wt.%, or the content of even up to 15wt.% are present in bonding precursor material.Another In a embodiment, resin can account for at least 5wt.% of the total weight of bonding precursor material, or at least 10wt.%, or at least The amount of 12wt.% exists.It should be appreciated that the content of usual resins may include any minimum percent and maximum disclosed herein Percentage.In another embodiment, phenolic resin can be liquid form.
In one embodiment, bonding precursor material can be powder or liquid form, or including their combination.For example, Bonding precursor material may include powdered phenolic resin and liquid phenolic resin.In another embodiment, powder bond materials can Including chemical modification novolac resin, such as siloxanes chemistry modified novolac resin, and liquid bonding material can wrap Include resol.Bonding precursor material can be formed as to the finally formed binding material of abrasive product by solidifying.
In another embodiment, bonding precursor material may include curing agent or crosslinking agent.Curing agent or crosslinking agent can wrap It is amine-containing.Exemplary amines may include ethylenediamine, ethylenetriamine, methylamine etc..In a particular embodiment, curing agent or crosslinking agent It may include hexa.More than about 90 DEG C at a temperature of, some examples of hexa can be formed crosslinking with shape At the methylene and dimethylene amino bridge for facilitating solidified resin.Hexa may be uniformly dispersed in resin.More Specifically, hexa may be uniformly dispersed in resin area as crosslinking agent.In a more specific embodiment, it glues Knot material may include the phenolic resin modified with curing agent or crosslinking agent.In a particular embodiment, binding material may include With the modified novolac resin of curing agent such as hexa.In a more specific embodiment, hexa Content can account for novolac resin total weight 5wt.% to 15wt.%.Even more specifically, phenolic resin can contain tool There is the resin area of the cross-linked domain of sub-micron average-size.
As disclosed herein, other than binding material, mixture also may include abrasive grain.The content of abrasive grain can Account for the 55wt.% to 99wt.% of the total weight of mixture.In one embodiment, abrasive grain may include such as oxide, carbon Compound, nitride, boride, carbon-based material (for example, diamond), oxycarbide, nitrogen oxides, boron oxide compound and combinations thereof Material.According to one embodiment, abrasive grain may include super hard abrasive.Abrasive grain may include selected from the group being made of following item Material: silica, silicon carbide, aluminium oxide, zirconium oxide, flint, garnet, diamond dust, rare earth oxide, material containing rare earth Material, cerium oxide, the particle of sol-gel method preparation, gypsum, iron oxide, particle containing glass and combinations thereof.In another example In, abrasive grain may also include the gel abrasives of silicon carbide, brown aloxite (AI2O3), white alumina plus crystal seed, have addition Sintered alumina, molding and the aluminium oxide of sintering of agent, pink aluminium oxide, ruby aluminium oxide, electric smelting signle crystal alumina, oxidation Aluminium zirconia squeezes bauxite, sintered bauxite, cubic boron nitride, diamond, aluminium oxynitride, sintered alumina, extruding Aluminium oxide or their any combination.According to a specific embodiment, abrasive grain can be substantially made of silicon carbide.According to another One specific embodiment, abrasive grain can be substantially made of aluminium oxide such as alpha-aluminium oxide.According to another specific embodiment, Abrasive grain can be substantially made of nanometer alumina particles.Abrasive grain can have at least 7, such as at least 8, or even extremely Few 9 Mohs' hardness.
Abrasive grain can have other special characteristics.For example, abrasive grain can be shaped abrasive particle.According at least one Embodiment, abrasive grain may include two-dimensional shapes, 3D shape or their combination.Example two dimensional shape includes that rule is more Side shape, irregular polygon, irregular shape, triangle, the triangle being partially recessed into, quadrangle, rectangle, trapezoidal, pentagon, Hexagon, heptagon, octagon, ellipse, Greek characters, Latin alphabet character, Russian alphabetic character and their group It closes.According to one embodiment, abrasive grain can be made of any two-dimensional shapes mentioned above.Exemplary three dimensional shape may include Polyhedron, cone, ellipsoid, sphere, prism, cylindrical body, cone, tetrahedron, cube, cuboid, rhombohedron, frustum Body, truncated ellipsoid, truncated spherical, truncated cone, pentahedron, hexahedron, heptahedron, octahedron, enneahedron, decahedron, Greek alphabet, Latin alphabet character, Russion letter character, chinese character, complex polygon shape, irregular shape profile, fire Chevron shape, monostable shape and their combination.Monostable shape can be for the single shape for stablizing resting position.According to Another embodiment, abrasive grain can be made of any 3D shape mentioned above.In a particular embodiment, forming mill Expect that particle may include triangle two-dimensional shapes.In another particular embodiment, shaped abrasive particle may include being partially recessed into Triangle two-dimensional shapes.Shaped abrasive particle and manufacturing process can be in the US2013/0236725A1 of Doruk O.Yener et al. It finds in the US 2012/0167481 of Doruk O.Yener et al., is both incorporated herein by reference in their entirety.
In a particular embodiment, abrasive grain can have elongated shape.In another embodiment, abrasive grain can It is length: the aspect ratio of width ratio at least about definition of 1:1, wherein length is the longest dimension of particle and width is Second long size (or diameter) of grain, perpendicular to the size of length.In other embodiments, the aspect ratio of abrasive grain can be At least about 2:1, such as at least about 2.5:1, at least about 3:1, at least about 4:1, at least about 5:1 or even at least about 10:1.One In a non-limiting embodiment, abrasive grain can have the aspect ratio no more than about 5000:1.
According to another specific embodiment, at least part of abrasive grain may include shaped abrasive particle, such as example exist 2015/0291866 and of US of US 2015/0291865, the Christoher Arcona of Kristin Brender et al. et al. Disclosed in the US 2015/0291867 of Kristin Brender et al., all these documents all pass through reference and are integrally incorporated this Text.Shaped abrasive particle is formed so that the shaped abrasive particle for two-dimensional shapes having the same and 3D shape, each Particle all has substantially the same relative to each other surface and edge arrangement.Accordingly, with respect to two-dimensional shapes having the same With other shaped abrasive particles of the group of 3D shape, shaped abrasive particle can have high shape in surface and edge arrangement Fidelity and stability.On the contrary, non-shaped abrasive grain can be formed by different processes and have different shape attributes. For example, usually forming non-shaped abrasive grain by disintegrating process, wherein forming lot of materials, then it is crushed and sieves and is certain to obtain The abrasive grain of size.However, non-shaped abrasive grain is by the general random arrangement with surface and edge, and usually enclosing Lack any identifiable two-dimensional shapes or 3D shape in the surface of main body and edge arrangement.In addition, identical group or identical The non-shaped abrasive grain of batch usually relative to lacking consistent shape each other so that when each other compared to when, surface and edge Randomly arrange.Therefore, compared with shaped abrasive particle, there is significant lower shape to protect for non-shaped crystal grain or Broken Crystal True degree.
In at least one embodiment, abrasive grain may include crystal grain (that is, crystallite), and can be completely made of crystal grain Polycrystalline material composition.In particular instances, abrasive grain may include the crystal grain that median grain size is not more than 1.2 microns.At it In his example, median grain size can be not more than 1 micron, such as no more than 0.9 micron or no more than 0.8 micron, or even not Greater than 0.7 micron.However, nanometer alumina particles can have no more than 0.15 micron, such as no more than 0.14 micron, less In 0.13 micron, or even no greater than 0.12 micron of average crystallite size.According to a non-limiting embodiment, abrasive grain Median grain size can be at least 0.01 micron, such as at least 0.05 micron, or at least 0.1 micron, or at least 0.2 micron, Or even at least 0.4 micron.It should be appreciated that the median grain size of abrasive grain can in any minimum value mentioned above and most Between big value.Median grain size is measured by uncorrected intercept method by SEM micrograph.
According to one embodiment, abrasive grain can have such as at least about 100 microns of full-size (that is, length) measurement Average particle size.In fact, abrasive grain can have at least about 150 microns, such as at least about 200 microns, at least about 300 micro- Rice, at least about 400 microns, at least about 500 microns, at least about 600 microns, at least about 700 microns, at least about 800 microns, or very To at least about 900 microns of average particle size.However, the abrasive grain of embodiment herein can have no more than about 5mm, such as No more than about 3mm, no more than about the average particle size of 2mm or even no greater than about 1.5mm.It should be appreciated that abrasive grain can have Average particle size between any minimum value mentioned above and maximum value.
According to one embodiment, mixture and gained abrasive product may include the blend of abrasive grain.Abrasive grain Blend may include the abrasive grain of the first kind and the abrasive grain of Second Type, and the abrasive grain of the Second Type is at least It is different from the abrasive grain of the first kind, such as granularity, crystallite dimension, composition, shape, hardness, fragility, toughness on one side Deng.For example, in one embodiment, the abrasive grain of the first kind may include high-quality abrasive grain (for example, aloxite (AI2O3), Aluminium oxide-zirconium oxide plus sol-gel alumina, the shaped abrasive particle of crystal seed etc.), and the abrasive grain of Second Type can wrap Include diluent abrasive grain.According to a non-limiting embodiment, secondary abrasive grain may include aluminium oxide, silicon carbide, cube Boron nitride, diamond, flint and garnet crystal grain and their any combination.In other non-limiting embodiments, blend It may include the abrasive grain of third type, the abrasive grain of the third type may include Conventional abrasives particle or shaped abrasive Grain.The abrasive grain of third type may include the abrasive grain with the diluent type of irregular shape, this can pass through routine Broken and crushing technology realize.The abrasive grain of third type can disclosed in composition or embodiment hereof it is any its He is different from the abrasive grain of the first kind and the abrasive grain of Second Type at aspect.
The blend of abrasive grain may include with the abrasive grain of the first kind existing for the first content (C1), this first contains Amount is represented by percentage (for example, weight %) of the abrasive grain of the first kind compared with the total particle content of blend.Example Such as, under certain examples, blend may be formed such that the first content (C1) can be no more than the 90% of the total content of blend.? In another embodiment, the first content can be less, such as no more than 85%, or is not more than 80%, or be not more than 75%.However, In one non-limiting embodiment, the first content of the abrasive grain of the first kind can be with the total content of blend at least 10% exists, such as at least 15%, at least 20%, at least 25%, at least 30%, at least 35%, at least 40%, at least 45%, Or at least 50%.It should be appreciated that the first content (C1) can be between any minimum value mentioned above and maximum value In the presence of.
In addition, the blend of abrasive grain may include the abrasive grain of the Second Type of the second content (C2), this second contains Amount is expressed as the percentage (for example, weight %) of the abrasive grain of Second Type relative to the total weight of blend.Second content It can be identical or different with the first content.For example, the second content (C2) can be no more than the 55% of the total content of blend, such as less In 50%, such as no more than 40%, no more than 35%, no more than 30%, or it is not more than 25%.However, non-limiting at one In embodiment, the second content (C2) can exist with the amount of at least about the 1% of the total content of blend.For example, the second content can be At least 5%, such as at least 8%, at least 10%, or at least 12%.It should be appreciated that the second content (C2) can be at mentioned above Between what minimum percent and largest percentage.
In some embodiments, the blend of abrasive grain may include the abrasive material of the third type of third content (C3) Grain, the third content be expressed as the abrasive grain of third type relative to the total weight of blend percentage (for example, weight Measure %).Third content can be identical or different with the first content, the second content or both.For example, third content (C3) can be not more than The 50% of the total content of blend, such as no more than 45%, such as no more than 40%, no more than 35%, no more than 30%, less In 25%, or it is not more than 20%.However, in one non-limiting embodiment, third content (C3) can always containing with blend At least about 1% amount of amount exists.For example, third content can be at least 3%, such as at least 5%, at least 8%, or at least 10%.It should be appreciated that third content (C3) can be in the range between any minimum percent mentioned above and largest percentage It is interior.
It as described herein, may include other materials, such as filler in mixture.Filler is likely to be present in or may be not present In finally formed abrasive product.Exemplary filler may include powder, particulate material, sphere, fiber, pore creating material, hollow particle, And their combination.Filler may include the material selected from the group being made of following item: sand, alumina hollow ball, chromite, magnet Mine, dolomite, mullite hollow spheres, boride, titanium dioxide, carbon products, silicon carbide, wood powder, clay, talcum, six sides nitridation Boron, molybdenum disulfide, feldspar, nepheline syenite, glass marble, glass fibre, CaF2、KBF4, ice crystal (Na3AlF6), elpasolite (K3AlF6), pyrite, zinc sulphide, copper sulfide, mineral oil, fluoride, wollastonite, mullite, steel, iron, copper, brass, bronze, Tin, aluminium, kyanite, andalusite, garnet, quartz, fluoride, mica, nepheline syenite, sulfate (for example, barium sulfate), carbon Hydrochlorate (for example, calcium carbonate), titanate (for example, potassium titanate fibre), rock wool, clay, sepiolite, iron sulfide (for example, Fe2S3、FeS2Or combinations thereof), potassium fluoborate (KBF4), zinc borate, borax, boric acid, thin schmigel, P15A, cork, glass marble, Silica gel microball (Z- light), silver, SaranTMResin, paracide, oxalic acid, alkali halide, organohalogen compounds, attapulgite, carbonic acid Salt, calcium carbonate, Saran, phenoxy resin, CaO, K2SO4, mineral wool, MnCl2, KCl and their combination.According to another implementation Example, filler may include the material selected from the group being made of following item: antistatic agent, lubricant, porosity inducer, colorant, And their combination.In the particular instance that wherein filler is granular materials, filler can be different from abrasive grain, average grain Size is significantly less than abrasive grain.
According to a specific embodiment, mixture may include filler, which includes barium sulfate.According to another specific reality Example is applied, mixture may include filler, which includes ice crystal.According to another specific embodiment, mixture may include filler, The filler includes at least one of barium sulfate and ice crystal and one of any other filler disclosed herein or more Kind.
After forming the mixture with desired component and shaping mixture in desired process equipment, this method Step 102 can be proceeded to form finally formed abrasive product by processing mixture.Some suitable processing examples It may include heating, solidification, polymerization, compacting and their combination.It can be solidified in the case where there is heat.For example, can will mix It closes object and is keeping the period such as between 6 hours and 48 hours, 10 hours to 36 hours, Huo Zhezhi under final solidification temperature Until mixture reaches crosslinking temperature or obtains desired density.The selection of solidification temperature depends on binding material for example used Type, desired intensity, hardness and grind performance factor.According to some embodiments, solidification temperature can include at least 150 DEG C to no more than in the range of 250 DEG C.In using the more specific embodiment for having switch, solidification temperature can include at least 150 DEG C to no more than in the range of 230 DEG C.Can include at least 110 DEG C and be not more than 225 DEG C in the range of at a temperature of benzene occurs The polymerization of phenol resin.Resol can include at least 140 DEG C and be not more than 225 DEG C in the range of at a temperature of gather It closes.The certain novolac resins for being applicable in embodiment in this article can be in the range including at least 130 DEG C and no more than 195 DEG C It polymerize at a temperature of interior.
After completing treatment process, form abrasive product, the abrasive product include include abrasive material in binding material Particle.In a particular embodiment, abrasive product can be bonded abrasive article.Bonded abrasive article may include main body, the master Body include include abrasive grain in the three dimensional matrix of binding material.Main body is formed as any conjunction well known by persons skilled in the art Suitable shape, including but not limited to abrasive material wheel, bullet, grinding stone, cup, flange pulley, beaker flask, section, installation point tool, sand Wheel, thin wheel, Large Diameter Slicing wheel etc..
According to one embodiment, bonded abrasive may include main body, which has the certain of the total volume relative to main body The binding material of content, this formation and/or the performance of abrasive product that can be conducive to improve abrasive product.For example, binding material Content can account for main body total volume at least 5vol%, such as at least 10vol%, at least 20vol%, at least 30vol%, extremely Few 35vol%, or at least 40vol%.In another example the content of binding material can be not more than 55vol%, such as no more than 50vol%, or be not more than 45vol%, be not more than 40vol%, or be not more than 35vol%, be not more than 30vol%, or be not more than 25vol%.It should be appreciated that the content of binding material can include any minimum percent being mentioned herein and largest percentage In range.For example, the content of main intracorporal binding material can in the range of 5vol% to 55vol%, or 10vol% extremely In the range of 35vol%.
According to one embodiment, binding material may include polymer, which includes the siloxanes function of covalent bonding Group.According to another embodiment, polymer may include the duplicate silicone functionalities covalently bonded to oxygen atom.At another In embodiment, binding material may include multiple oxygen atoms, and each of multiple oxygen atom is all bonded to silicone functionalities. In another embodiment, binding material may include polymer, which includes the duplicate silicon covalently bonded to phenoxy group Yang Wan functional group.In a further embodiment, binding material may include polymer, which includes passing through methylene bridge each other Multiple phenoxy groups of covalent bonding, wherein at least one of phenoxy group is by the oxygen atom of phenoxy group covalently bonded to siloxanes Group.In yet another embodiment, binding material may include polymer, which includes covalently and being bound directly to phenoxy group Oxygen atom dimethyl silicone polymer.In a particular embodiment, polymer may include between methylene and oxygen atom Direct covalent bonds, methylene is directly and covalently bonded to one in duplicate siloxane group, and oxygen atom is direct And covalently bonded to phenyl ring, and more specifically, polymer may include multiple direct covalent bonds.In another particular embodiment, Binding material may include polymer, which includes the repetition phenyl ring being covalently bonded to one another by methylene bridge, and multiple Each of phenyl ring is repeated all covalently bonded to oxygen atom, and the oxygen atom is by methylene bridge covalently bonded to siloxy group Group, and more specifically, methylene bridge directly and covalently bonded to one in duplicate silicone functionalities.In a specific reality It applies in example, polymer may include multiple phenoxy groups, and each of multiple phenoxy group is all covalently bonded to polydimethylsiloxanes Alkane.
According to one embodiment, binding material may include polymer, which includes poly- two covalently bonded to phenyl ring Methylsiloxane.According to another embodiment, dimethyl silicone polymer can be covalently bonded to phenoxy group.In a specific embodiment In, polymer may include the phenyl ring being covalently bonded to one another by methylene bridge, and at least some of phenyl ring can pass through bonding To phenyl ring oxygen atom covalently bonded to dimethyl silicone polymer.
In the disclosure, using the Perkin Elmer Frontier with Diamond/ZnSe Tip ATR probe Model FTIR detects the dimethyl silicone polymer in abrasive product.Some section of abrasive product can be removed for FTIR points Analysis.Can be by sample broke, and 10 grams of broken powder can be sieved to remove abrasive grain.It can 50mg immediately below analysis probe Screening powder.Spectroscopic data can be compared with the data from the library omniscient informatics ATR/IR, to determine spectrum Each peak represents anything.
Binding material can have FTIR characteristic peak.In one embodiment, characteristic peak can be in 1258cm-1To 1275cm-1Model Occur at wavelength in enclosing.In another embodiment, characteristic peak can be in 1258cm-1To 1265cm-1Go out at wavelength in range It is existing.Fig. 3 includes the conventional wheel C1 (RMR wheel) formed by rubber modified resin, representative wheel (SMR wheel) and is used to form representativeness The FTIR spectrum of the siloxanes chemistry modified resin (SMR resin) of wheel.As shown in the figure, SMR takes turns sample in 1259cm-1Place's display The characteristic peak of dimethyl silicone polymer out, and RMR sample is in 1259cm-1Place does not show appearance.Fig. 4 includes being formed by binding material Wheel FTIR spectrum, the binding material includes the dimethyl silicone polymer of the covalent bonding of different content.Characteristic peak is located at 1261cm-1Place.
According to one embodiment, binding material may include the siloxanes of the covalent bonding of certain content, this can be conducive to change The formation of kind abrasive product and the performance of abrasive product.In one embodiment, binding material may include account for binding material total The siloxanes of at least covalent bonding of 1wt.% of weight, such as accounts for at least 1.5wt.% of the total weight of binding material, or extremely Few 2wt.%, or at least 2.5wt.%, or at least 3wt.%, or at least 3.5wt.%, or at least 4wt.%, or at least 4.5wt.%, or at least 5wt.%, or at least 5.5wt.%, or at least 6wt.%, or at least 6.5wt.%, or at least 7wt.%, or at least 7.5wt.%, or at least 8wt.%, or at least 8.5wt.%, or at least 9wt.%, or at least 9.5wt.%, or at least 10wt.%, or at least 11wt.%, or at least 12wt.%, or at least 12.5wt.%, or at least 13wt.%, or at least 13.5wt.% covalent bonding siloxanes.Alternatively or in addition to this, binding material may include account for it is viscous The siloxanes for tying the at most covalent bonding of 30wt.% of the total weight of material, such as accounts for the total weight of binding material at most 29wt.%, or at most 28wt.%, or at most 27wt.%, or at most 26wt.%, or at most 25wt.%, or at most 24wt.%, or at most 23wt.%, or at most 22wt.%, or at most 21wt.%, or at most 20wt.%, or at most 19.5wt.%, or at most 19wt.%, or at most 18.5wt.%, or at most 18wt.% covalent bonding siloxanes.In addition, The content of the siloxanes of covalent bonding can be in the range of including any minimum value and maximum value being mentioned herein.For example, bonding Material may include the siloxanes that content range includes at least 1wt.% and the covalent bonding of at most 30wt.%.In a specific reality It applies in example, the siloxanes of covalent bonding may include dimethyl silicone polymer, or more specifically, can be substantially by polydimethylsiloxanes Alkane composition.Therefore, binding material may include the polydimethylsiloxanes for any content mentioned herein with the siloxanes of covalent bonding Alkane.Referring to Fig. 5, show in 1261cm-1Total weight of the absorption intensity and dimethyl silicone polymer at place relative to binding material Content between linear dependence.
According to one embodiment, the bonding main body of abrasive product may include the abrasive grain of certain content, this can be conducive to Improve the formation of abrasive product and/or the performance of abrasive product.For example, the content of abrasive grain can be at least 8vol%, such as At least 10vol%, at least 12vol%, at least 14vol%, at least 16vol%, at least 18vol%, at least 20vol%, at least 25vol%, at least 30vol%, or even at least 35vol%.In another example, bonded abrasive master intracorporal abrasive grain Content can be not more than 65vol%, such as no more than 64vol%, no more than 62vol%, no more than 60vol%, be not more than 58vol%, no more than 56vol%, no more than 54vol%, no more than 52vol%, no more than 50vol%, be not more than 48vol%, no more than 46vol%, no more than 44vol%, no more than 42vol%, no more than 40vol%, be not more than 38vol%, it is not more than 36vol%, is not more than 34vol%, is not more than 32vol%, is not more than 30vol%, or is not more than 28vol%, or it is not more than 26vol.It should be appreciated that the content of abrasive grain can include any minimum percent being mentioned herein In the range of largest percentage.For example, the content of the abrasive grain in main body can in the range of 8vol% to 65vol%, In the range of 12vol% to 62vol%, in the range of 20vol% to 58vol%, or in 26vol% to 52vol%'s In range.
The main body of abrasive product may be formed to have certain porosity.In one embodiment, porosity can based on Total volume at least 1vol%.For example, porosity can be at least 3vol%, or at least 5vol%, or at least 8vol%, at least 10vol%, at least 12vol%, at least 14vol%, at least 16vol%, at least 18vol%, at least 20vol%, at least 25vol%, at least 30vol%, or at least 40vol.In another embodiment, the porosity of main body can be not more than 60vol%. For example, porosity can be not more than 55vol%, it is not more than 50vol%, is not more than 45vol%, or be not more than 40vol%.It should manage The porosity of solution, main body can be in the range of including any minimum percent mentioned above and largest percentage.For example, main body Porosity can in the range of 5vol% to 60vol%, in the range of 8vol% to 55vol%, or 10vol% extremely In the range of 40vol%.
The porosity of main body can be various forms.It for example, porosity can be closure, opening, or may include closure Porosity and open porosity.In one embodiment, porosity may include the porosity class selected from the group being made of following item Type: closure porosity, open porosity and their combination.In another embodiment, most of porosity may include opening Porosity.In a particular embodiment, all porositys can be substantially all as open porosity.And in another embodiment In, most of porosity may include closure porosity.For example, all porositys can be substantially all to be closed porosity.
Main body may include having the hole of certain average pore size.In one embodiment, average pore size can be micro- no more than 500 Rice, such as no more than 450 microns, no more than 400 microns, no more than 350 microns, no more than 300 microns, no more than 250 microns, No more than 200 microns, be not more than 150 microns, or be not more than 100 microns.In another embodiment, average pore size can be at least 0.01 micron, at least 0.1 micron, or at least 1 micron.It should be appreciated that it is including any minimum mentioned above that main body, which can have, Average pore size in the range of value and maximum value.For example, the average pore size of main body can be in 0.01 micron to 500 microns of range It is interior, in the range of 0.1 micron to 350 microns, or in the range of 1 micron to 250 microns.
According to one embodiment, bonded abrasive may include the main body that wet strength conservation rate improves.In at least one embodiment In, wet strength conservation rate can be indicated by wet buckle stress conservation rate.The main body of bonded abrasive article may include at least 52%, Such as at least 53%, at least 54%, at least 55%, at least 56%, at least 57%, at least 58%, or at least 59% wet buckle Stress conservation rate.In at least one other embodiment, main body may include no more than 65%, such as no more than 64%, be not more than 63%, such as no more than 62%, no more than 61%, the wet buckle stress such as no more than 60%, or no more than 59.5% is kept Rate.It should be appreciated that main body can have in the range of including any minimum percent and largest percentage referred to herein Wet buckle stress conservation rate.For example, main body can have wet buckle in the range of including at least 52% and being not more than 65% to answer It tries hard to keep holdup.
Formula WR=(MOR can be usedIt is wet/MORIt is dry) x100% measures wet buckle stress conservation rate, wherein WR indicates wet buckle Stress conservation rate, MORIt is wetFor the rupture modulus (MOR) of sample after wet process, and MORIt is dryFor the MOR of sample before wet process.It can make Disclosed in following paragraphs test method determines MORIt is dryAnd MORIt is wet
The MOR of abrasive product is tested according to three-point bending method.It is somebody's turn to do on 100kN Cell Instron testing machine Test, the rate of displacement of (for example, 15 DEG C to 25 DEG C) is 1mm/min at room temperature.Sample can be a part of abrasive product And the size with 25mmx25mmx100mm, the section such as cut down from abrasive wheel.It is tested in the case where no wet process The MOR of drying sampleIt is dry.2 hours will be immersed in boiling water from other samples that same abrasive product is cut down with drying sample, so It is cooled to room temperature before MOR test afterwards, obtains MORIt is wet
According to one embodiment, it is made from different bonding precursor materials but identical in other respects and in identical item The corresponding conventional abrasive articles tested under part are compared, and the bonded abrasive article of embodiment herein can ground The scratch of quantity reduction is generated in mill test on workpiece.Grinding examination is carried out on the forged steel of the Cr with 3wt.% to 5wt.% It tests.It is by width Wheel be mounted on and ground on motor-driven CNC cylindrical grinder by 5.5kW, and And wheel speed is 33m/s.Grinding mode is lateral, and the target zone of volume removal rate is 1.8 to 9mm3/s/mm.With work The surface smoothness of part and the variation power that real-time measurement is drawn during grinding together of diameter of work.
In the disclosure, the length of the scratch on workpiece and counting are determined as follows.By blue paste ( Prussian blue#80038) it is applied to the facet of workpiece.Under white light, scratch becomes as it can be seen that because blue paste can be filled out It is charged to the depths of scratch.The region 10mm x 10mm on surface is marked, and shoots the region under Olympus stereoscope Picture.The Essentials software provided by Olympus stereoscope handles the image.To the scratch meter in marked region It counts, and measures the length of these scratches by software.
In one embodiment, compared with corresponding conventional abrasive articles, under the same test conditions, bonded abrasive system Product can produce reduce at least 30% scratch, such as reduce at least 40% or 50%.By distinguish scratch tale with Difference between the tale of corresponding conventional wheel determines the reduction amount of scratch.In another embodiment, reduction amount can be At most 50%.
Many different aspect and embodiment are all possible.This document describes some in these aspect and embodiment. After reading this description, it will be understood by those within the art that those aspects and embodiment are merely illustrative, and it is unlimited The scope of the present invention processed.Each embodiment can be according to any one or more embodiments being listed below.
A kind of bonded abrasive article of embodiment 1., comprising:
Main body, the main body include include abrasive grain in binding material,
Wherein the binding material includes polymer, which includes the multiple aromatic rings being covalently bonded to one another and at least one A silicone functionalities covalently bonded to the multiple aromatic ring.
A kind of bonded abrasive article of embodiment 2., comprising:
Main body, the main body include include abrasive grain in binding material,
Wherein the main body includes at least 52% wet buckle stress conservation rate.
A kind of bonded abrasive article of embodiment 3., comprising:
Main body, the main body include include abrasive grain in binding material,
Wherein the binding material is in 1258cm-1To 1275cm-1Wavelength at have FTIR characteristic peak.
The bonded abrasive article according to any one of embodiment 1 to embodiment 3 of embodiment 4., wherein the bonding material Material includes polymer, which includes the siloxanes covalently bonded to multiple phenyl ring, and wherein the siloxanes is expressed from the next:
Wherein R includes methyl or phenyl, and X and Y independently represent hydrogen atom, alkyl or alkoxy, and n is at least 1.
The bonded abrasive article according to any one of embodiment 1 to embodiment 4 of embodiment 5., wherein the bonding material Material includes polymer, which includes the dimethyl silicone polymer covalently bonded to phenoxy group.
The bonded abrasive article according to any one of embodiment 1 to embodiment 5 of embodiment 6., wherein the bonding material Material includes the dimethyl silicone polymer covalently bonded to oxygen atom, and wherein the oxygen atom is directly and covalently bonded to phenyl ring.
The bonded abrasive article according to any one of embodiment 1 to embodiment 6 of embodiment 7., wherein the bonding material Material includes polymer, which includes the dimethyl silicone polymer covalently bonded to main chain, which includes passing through methylene The phenyl ring that bridge is covalently bonded to one another.
The bonded abrasive article according to any one of embodiment 1 to 7 of embodiment 8., wherein the main body includes at least 52%, at least 53%, at least 54%, at least 55%, at least 56%, or at least 57%, and it is not more than 80% wet buckle stress Conservation rate.
The bonded abrasive article according to any one of embodiment 1 to embodiment 8 of embodiment 9., wherein the main body packet Include content range account for the main body total volume 5vol% to 55vol% the binding material.
The bonded abrasive article according to any one of embodiment 1 to embodiment 9 of embodiment 10., wherein the main body The abrasive grain of the 8vol% to 65vol% of the total volume of the main body is accounted for including content range.
The abrasive product according to any one of embodiment 1 to embodiment 10 of embodiment 11., wherein the main body includes Range accounts for the porosity of the 5vol% to 60vol% of the total volume of the main body.
The abrasive product according to any one of embodiment 1 to embodiment 11 of embodiment 12., wherein the main body includes Filler, the filler include barium sulfate, ice crystal or any combination of them.
A kind of method for forming abrasive product of embodiment 13., comprising:
Green compact are formed by the mixture comprising abrasive grain and bonding precursor material,
Wherein the bonding precursor material is included in 1257cm-1To 1261cm-1Locate the resin with FTIR characteristic peak.
The method according to embodiment 13 of embodiment 14., wherein the bonding precursor material includes covalently bonded to silicon The phenolic resin of Yang Wan functional group.
The method according to any one of embodiment 12 to embodiment 14 of embodiment 15., wherein the bonding precursor material Material includes the dimethyl silicone polymer covalently bonded to phenoxy group.
The method according to any one of embodiment 13 to embodiment 15 of embodiment 16., wherein the mixture includes Content accounts for the abrasive grain of the 55wt.% to 99wt.% of the total weight of the mixture.
The method according to any one of embodiment 13 to embodiment 16 of embodiment 17., wherein the mixture includes Content accounts for the bonding precursor material of the 2.5wt.% to 25wt.% of the total weight of the mixture.
The method according to any one of embodiment 13 to embodiment 17 of embodiment 18., wherein the mixture includes Content accounts for the resin of the 1wt.% to 20wt.% of the total weight of the mixture.
The method according to any one of embodiment 13 to embodiment 18 of embodiment 19., wherein the mixture includes Filler, the filler include barium sulfate, ice crystal or their combination.
The method according to any one of embodiment 13 to embodiment 19 of embodiment 20., wherein the mixture includes Content accounts for the filler of the 0.1wt.% to 20wt.% of the total weight of the binding material.
The method according to any one of embodiment 13 to embodiment 20 of embodiment 21., wherein the bonding precursor material Material includes at least 1wt.% at most 30wt.% for the total weight that content accounts for the bonding precursor material covalently bonded to aromatic ring Siloxanes.
The method according to any one of embodiment 13 to embodiment 21 of embodiment 22., wherein the bonding precursor material Material include content account for the bonding precursor material total weight at least 1wt.% at most 30wt.% covalently bonded to benzene oxygen from By the dimethyl silicone polymer of base.
The bonded abrasive article according to any one of embodiment 1 to embodiment 12 of embodiment 23., wherein the bonding Material includes the silicon covalently bonded to aromatic ring of at least 1wt.% at most 30wt.% for the total weight that content accounts for the binding material Oxygen alkane.
The bonded abrasive article according to embodiment 1 to any one of embodiment 12 and embodiment 23 of embodiment 24., Described in binding material include at least 1wt.% for the total weight that content accounts for the binding material to the at most covalent bonding of 30wt.% To the dimethyl silicone polymer of benzene oxygen radical.
The bonding according to any one of embodiment 1 to embodiment 12 and embodiment 22 to embodiment 24 of embodiment 25. Abrasive product, wherein the binding material is in 1259cm-1Wavelength at include FTIR characteristic peak.
The bonding according to any one of embodiment 1 to embodiment 12 and embodiment 22 to embodiment 24 of embodiment 26. Abrasive product, wherein the binding material is in 1261cm-1Wavelength at include FTIR characteristic peak.
Example
Example 1
Form representativeness bonded abrasive lap material wheel S1 and conventional wheel C1.First by abrasive grain and liquid phenol-formaldehyde resin in mixing bowl Middle stirring 2 to 7 minutes, or until all crystal grains are all wet and coated by liquid phenol-formaldehyde resin.Then by wet-milling Grain is mixed with remaining binding material.The mixture of each sample is poured into mold, and is cold-pressed.Then by sample from mold It takes out and is treated with heat such that binding material solidifies in 160 DEG C of furnace.Wheel S1 is disclosed in following Tables 1 and 2 respectively It is formed with the mixture of C1.Take turns the binding material of each of S1 and the C1 all abrasive grain comprising 85wt.%, 10wt.% With the hole of 5vol%.
As described below, wheel S1 and C1 is prepared using identical composition, the difference is that conventional acrylonitrile butadiene rubber modified phenolic aldehyde is clear Coating resins (RMR) are used to form C1, and the novolac resin (SMR) of siloxanes chemical modification is used to prepare S1.Taking turns S1 includes Account for the siloxanes of the 13.5wt.% of the total weight of binding material.The size of all wheels is all 350mm (diameter) x127mm (Kong Zhi Diameter) x24mm (thickness), and cut under the section having a size of 25mm x 25mm x 100mm and test as disclosed herein it is wet Holding capacity.
The mixture of 1 sample S1 of table forms
The mixture of 2 sample C1 of table forms
According to embodiment disclosed herein, the MOR of S1 and C1 sample before and after wet process is testedIt is dryAnd MORIt is wet.In table 3 The average value of MOR including one group of 3 S1 sample and one group of 3 C1 sample.Compared with C1 sample, sample S1 is before wet process There is higher MOR later.S1 sample also shows higher wet strength conservation rate, and wet strength holding is answered by wet buckle Holdup try hard to keep to indicate.
3 wet buckle stress conservation rate of table
Measure the water absorption rate of sample S1 and C1.The weight of each sample is before and after measurement wet process to determine that weight becomes Change.Water absorption rate: W is measured using following formulaU=[(WIt is wet-WIt is dry)/WIt is dry] x100%.WUIndicate water absorption rate, WIt is drySample before expression wet process Weight, and WIt is wetThe weight of same sample after expression wet process.Every group of three samples are tested, every group of water absorption rate average value includes In table 4.Compared with C1 sample, S1 sample has lower mean water absorption rate, is 7.03%, and the mean water absorption rate of C1 sample It is 14.231%.
4 water absorption rate of table
Sample WIt is dry(g) WIt is wet(g) Weight change (g) Water absorption rate (%)
S1 113.7 122.3 8.6 7.03
C1 100.65 117.35 16.7 14.231
Example 2
With with example 1 disclosed in similar mode form other wheel sample.Grinding test is carried out to sample, and such as this The counting and length of scratch are determined as disclosed in literary.Representativeness wheel sample S2 mixture composition include in table 5, and Conventional wheel sample C2 is formed with the mixture of S2 same composition with having, the difference is that with traditional rubber modified resin instead of silicon Siloxane modified resin.
The composition of 5 S2 of table
The mixture composition of representativeness wheel sample S3 is included in table 6, and with the mixture with A48 same composition Conventional wheel sample C3 is formed, the difference is that with traditional rubber modified resin instead of siloxane-modified resins.The bonding of S2 and S3 Each in material all includes the siloxanes for accounting for the 13.5wt.% of total weight of corresponding binding material.
The composition of 6 S3 of table
Fig. 6 includes the scratch number of sample C2 and S2 and the curve graph of size.Wheel C2 produces 93 length and arrives for 300 microns 1200 microns of scratch, and take turns S2 and produce the identical scratch of 44 length ranges.Fig. 5 include sample S3 and C3 scratch number with The curve graph of size.In 300 microns to 1500 microns of length range, wheel C3 produces 94 scratches, and S3 is then produced 63.
Example 3
With with example 1 disclosed in similar mode form other wheel sample.Taking turns sample includes the covalent of different content The dimethyl silicone polymer of bonding, as shown in table 7 below.As described in this disclosure, the section of sample is cut, prepared and is analyzed To obtain FTIR spectrum.Fig. 4 includes the diagram of the FTIR spectrum of sample S4 to S7, in 1261cm-1Place shows characteristic peak.
Table 7
Sample The content of dimethyl silicone polymer
S4 1.5wt.%
S5 7.5wt.%
S6 11.25wt.%
S7 13.75wt.%
The embodiment of the present invention represents the difference with the prior art.It is worth noting that, the mill of embodiment hereof Material products may include binding material, which includes the dimethyl silicone polymer covalently bonded to phenoxy group.Unexpectedly , the abrasive product of embodiment hereof can have improved performance, the wet strength such as improved, this can it is expected to improve wheel grinding Consistency of the performance in longer period, and reduce the scratch on workpiece.Improved wet holding can make the mill of embodiment hereof Material products are more suitable for organic wet-milling.
It may be noted that and the behavior in not all above-mentioned general remark or example be all it is required, may be not necessarily required to have A part of body behavior, and in addition to those of description behavior, it can also carry out one or more further behaviors.In addition, column Movable order, which is not necessarily, out executes movable order.
Benefit, other advantages and solution to the problem are described by reference to specific embodiment above.However, benefit, Advantage, solution to the problem and any benefit, advantage or solution can be made to be conceived or become more significant any spy Sign is not to be regarded as crucial, the required or necessary feature of any or all claim.Many different aspects and implementation Example is all possible.This document describes some in these aspect and embodiment.After reading this description, the skill of this field Art personnel do not limit the scope of the invention it will be appreciated that those aspects and embodiment are merely illustrative.In addition, this field skill Art personnel will be understood that digital circuit can be similarly used to realize in some embodiments including analog circuit, and vice versa.
The specification and diagram of embodiment as described herein are intended to provide the general understanding of the structure to various embodiments.It says Bright book and diagram are not intended to be used as to all elements for the device and system for having used structure or method as described herein and spy The detailed and comprehensive description of sign.Individual embodiment can also provide in combination in a single embodiment, and phase Instead, for simplicity and the various features described in the context of single embodiment can also be provided separately, or with any The mode of sub-portfolio provides.In addition, including each value and all values within the scope of this to the reference with the value of Range Representation. Only after reading this description, many other embodiments are only obviously technical staff.By in the disclosure Appearance can use and obtain other embodiments, so that can carry out without departing from the scope of the disclosure structure replacement, patrol Collect replacement or other changes.Therefore, the disclosure should be considered as it is illustrative and not restrictive.Above by reference to specific implementation Example describes benefit, other advantages and solution to the problem.However, benefit, advantage, solution to the problem and can make any Benefit, advantage or solution, which are conceived or become more significant any feature and be not to be regarded as any or all right, to be wanted Crucial, the required or necessary feature asked.
Abstract of description is provided and is intended to abide by Patent Law, and understands that it will not be used to interpret or limit right when submitting It is required that range or meaning.In addition, for the purpose of the simplification disclosure, can be incited somebody to action in the above-mentioned specific embodiment of attached drawing Various features are combined or are described in a single embodiment.The disclosure should not be construed as embodying such intention: by right The embodiment of claim protection requires more features than clearly enumerating in each claim.But such as following right It is required that reflected, subject matter can be related to all features of any one less than disclosed embodiment of this invention.Therefore, will Appended claims are incorporated into the specific embodiment of attached drawing, wherein such as independent claimed theme of each claim that Sample is individually present.

Claims (15)

1. a kind of bonded abrasive article, comprising:
Main body, the main body include include abrasive grain in binding material,
Wherein the binding material includes polymer, and the polymer includes the multiple phenyl ring being covalently bonded to one another and at least one Covalently bonded to the silicone functionalities of the multiple phenyl ring.
2. a kind of bonded abrasive article, comprising:
Main body, the main body include include abrasive grain in binding material,
Wherein the binding material has FTIR characteristic peak at the wavelength of 1258cm-1 to 1275cm-1.
3. according to claim 1 or bonded abrasive article as claimed in claim 2, wherein the main body include at least 52% it is wet Bending stress conservation rate.
4. according to claim 1 or bonded abrasive article as claimed in claim 2, wherein the binding material includes covalent bonding To the siloxanes of the multiple phenyl ring, wherein the siloxanes is indicated by Formulas I:
Wherein R includes methyl or phenyl, and X and Y independently indicate hydrogen atom, alkyl or alkoxy, and n is at least 1.
5. bonded abrasive article according to claim 4, wherein the siloxanes is covalently bonded to oxygen atom, wherein described Oxygen atom is directly and covalently bonded to one in the multiple phenyl ring.
6. bonded abrasive article according to claim 4, wherein the siloxanes includes dimethyl silicone polymer, and its Described in multiple phenyl ring be covalently bonded to one another by methylene bridge.
7. according to claim 1 to the bonded abrasive article described in any one of claim 6, wherein in the multiple phenyl ring Each is covalently bonded to oxygen atom, and the oxygen atom is covalently bonded at least one silicone functionalities.
8. the abrasive product according to any one of claim 4 to claim 7, wherein the institute that the binding material includes The content range for stating siloxanes is at least 1wt.% at most 30wt.% for the total weight for accounting for the jointing material.
9. abrasive product according to claim 8, wherein the siloxanes includes polymethyl siloxane, wherein the bonding The content range for the polymethyl siloxane that material includes is at least 1wt.% for the total weight for accounting for the jointing material to extremely More 30wt.%.
10. according to claim 1 to the abrasive product described in any one of claim 9, wherein the main body includes filler, institute Stating filler includes barium sulfate, ice crystal or any combination of them.
11. a kind of method for forming abrasive product, comprising:
Green compact are formed by the mixture comprising abrasive grain and bonding precursor material, the bonding precursor material includes covalent bonding To the phenolic resin of at least one silicone functionalities.
12. according to the method for claim 11, wherein the resin has at the wavelength of 1257cm-1 to 1261cm-1 FTIR characteristic peak.
13. according to claim 11 or claim 12 described in method, wherein the phenolic resin is covalently bonded to by Formulas I table The siloxanes shown:
Wherein R includes methyl or phenyl, and X and Y independently represent hydrogen atom, alkyl or alkoxy, and n is at least 1.
14. according to the method for claim 13, wherein the siloxanes includes dimethyl silicone polymer, wherein described poly- two Methylsiloxane is directly and covalently bonded to the oxygen atom of the phenolic resin.
15. according to the method for claim 13, wherein the bonding precursor material includes that content accounts for the bonding precursor material The siloxanes of at least 1wt.% at most 30wt.% of the total weight of material.
CN201780083370.8A 2016-12-22 2017-12-19 Abrasive product and forming method thereof Pending CN110199002A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IN201641043918 2016-12-22
IN201641043918 2016-12-22
PCT/US2017/067373 WO2018118961A1 (en) 2016-12-22 2017-12-19 Abrasive articles and methods for forming same

Publications (1)

Publication Number Publication Date
CN110199002A true CN110199002A (en) 2019-09-03

Family

ID=62625896

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780083370.8A Pending CN110199002A (en) 2016-12-22 2017-12-19 Abrasive product and forming method thereof

Country Status (3)

Country Link
US (1) US20180178349A1 (en)
CN (1) CN110199002A (en)
WO (1) WO2018118961A1 (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3041156A (en) * 1959-07-22 1962-06-26 Norton Co Phenolic resin bonded grinding wheels
US5736619A (en) * 1995-04-21 1998-04-07 Ameron International Corporation Phenolic resin compositions with improved impact resistance
CN1187836A (en) * 1995-04-21 1998-07-15 阿迈隆国际公司 Phenolic resin compositions with improved impact resistance
CN1968798A (en) * 2004-05-20 2007-05-23 3M创新有限公司 Method of making an injection-moulded abrasive article
CN102275400A (en) * 2011-05-31 2011-12-14 张继杨 Special colored hot-press label of resin grinding wheel
CN102675647A (en) * 2012-05-08 2012-09-19 浙江大学 Organic silicon modifier and preparation method and application thereof
TW201300199A (en) * 2011-06-30 2013-01-01 Saint Gobain Abrasives Inc Abrasive article and method of making
CN103639911A (en) * 2013-12-05 2014-03-19 江苏三菱磨料磨具有限公司 Preparation method of abrasive belt of coated abrasive tool for stainless steel surface decorative line processing

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4802896A (en) * 1987-12-08 1989-02-07 Minnesota Mining And Manufacturing Company Modified resins and abrasive articles made with the same as a bond system
DE19508695B4 (en) * 1995-03-02 2004-03-25 Wago Verwaltungsgesellschaft Mbh transformer terminal
MX9708204A (en) * 1995-04-28 1997-12-31 Minnesota Mining & Mfg Abrasive article having a bond system comprising a polysiloxane.
US6949129B2 (en) * 2002-01-30 2005-09-27 Saint-Gobain Abrasives, Inc. Method for making resin bonded abrasive tools
US8287611B2 (en) * 2005-01-28 2012-10-16 Saint-Gobain Abrasives, Inc. Abrasive articles and methods for making same

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3041156A (en) * 1959-07-22 1962-06-26 Norton Co Phenolic resin bonded grinding wheels
US5736619A (en) * 1995-04-21 1998-04-07 Ameron International Corporation Phenolic resin compositions with improved impact resistance
CN1187836A (en) * 1995-04-21 1998-07-15 阿迈隆国际公司 Phenolic resin compositions with improved impact resistance
CN1968798A (en) * 2004-05-20 2007-05-23 3M创新有限公司 Method of making an injection-moulded abrasive article
CN102275400A (en) * 2011-05-31 2011-12-14 张继杨 Special colored hot-press label of resin grinding wheel
TW201300199A (en) * 2011-06-30 2013-01-01 Saint Gobain Abrasives Inc Abrasive article and method of making
CN102675647A (en) * 2012-05-08 2012-09-19 浙江大学 Organic silicon modifier and preparation method and application thereof
CN103639911A (en) * 2013-12-05 2014-03-19 江苏三菱磨料磨具有限公司 Preparation method of abrasive belt of coated abrasive tool for stainless steel surface decorative line processing

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
刘成林 等: ""有机硅改性酚醛树脂的研究进展"", 《有机硅材料》 *
董炎明: "《高分子分析手册》", 31 March 2004, 北京:中国石化出版社 *
贾谊 等: ""低聚端羟基聚硅氧烷接枝增韧酚醛树脂的制备及性能"", 《应用化学》 *

Also Published As

Publication number Publication date
WO2018118961A1 (en) 2018-06-28
US20180178349A1 (en) 2018-06-28

Similar Documents

Publication Publication Date Title
EP3532246B1 (en) Shaped vitrified abrasive agglomerate with shaped abrasive particles, abrasive articles, and related methods
RU2586181C2 (en) Abrasive machining of billet
CN110087832A (en) Abrasive product and preparation method thereof
CN103764349B (en) Liquid phase sintering silicon carbide abrasive grains
CN102762341B (en) Bonded abrasive wheel
CN102245352B (en) Bonded abrasive tool and method of forming
CN105592982B (en) Bonded abrasive article and method
EP2830829B1 (en) Abrasive products having fibrillated fibers
CN102046332B (en) Hydrophilic and hydrophobic silane surface modification of abrasive grains
Linke Life cycle and sustainability of abrasive tools
CA2672243A1 (en) Low corrosion abrasive articles and methods for forming same
CN103747919B (en) Microfiber reinforcement for abrasive tools
JP2007532334A (en) Abrasive article, composition, and method for producing the same
JP5456535B2 (en) Resin bond grinding wheel
CN103442851B (en) Abrasive article for high speed grinding operation
CN110199002A (en) Abrasive product and forming method thereof
CN107107314A (en) Abrasive article and forming method thereof
WO2022077030A1 (en) Abrasive particles including coating, abrasive article including the abrasive particles, and method of forming
EP4041840A1 (en) Abrasive particle including coating, abrasive article including the abrasive particles, and method of forming
EP3455033B1 (en) Abrasive articles and methods for forming same
US20220134510A1 (en) Abrasive article and method of forming
ES2712274T3 (en) Abrasive tools and methods of forming them
JPH083539A (en) Abrasive material
JPH07100768A (en) Tool for cutting or grinding, and glass bonding agent used for manufacture thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
CB02 Change of applicant information

Address after: Massachusetts, USA

Applicant after: Saint Gobain Abrasives Inc

Applicant after: Saint Gobain Abrasifs SA

Address before: Massachusetts, USA

Applicant before: Saint-Gobain Abrasives Co., Ltd.

Applicant before: Saint-Gobain Abrasives

CB02 Change of applicant information
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination