CN110194940A - Hot melt pressure sensitive adhesive composition and preparation method thereof - Google Patents
Hot melt pressure sensitive adhesive composition and preparation method thereof Download PDFInfo
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- CN110194940A CN110194940A CN201810159453.7A CN201810159453A CN110194940A CN 110194940 A CN110194940 A CN 110194940A CN 201810159453 A CN201810159453 A CN 201810159453A CN 110194940 A CN110194940 A CN 110194940A
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- pressure sensitive
- melt pressure
- adhesive composition
- hot melt
- sensitive adhesive
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/16—Catalysts
- C08G18/18—Catalysts containing secondary or tertiary amines or salts thereof
- C08G18/20—Heterocyclic amines; Salts thereof
- C08G18/2081—Heterocyclic amines; Salts thereof containing at least two non-condensed heterocyclic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/64—Macromolecular compounds not provided for by groups C08G18/42 - C08G18/63
- C08G18/6492—Lignin containing materials; Wood resins; Wood tars; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
- C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
- C08G18/7664—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
- C08G18/7671—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups containing only one alkylene bisphenyl group
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J153/02—Vinyl aromatic monomers and conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0016—Plasticisers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
A kind of hot melt pressure sensitive adhesive composition, it includes isocyanate-terminated compound, plasticizer, thermoplastic polymer and tackifier.At least one of the plasticizer or tackifier are hydroxyl modifications.
Description
Technical field
This disclosure relates to hot-melt adhesive composition and forming method thereof.Particularly, this disclosure relates to hot-melt pressure sensitives
Adhesive composition and forming method thereof.
Background technique
Hot-melt adhesive composition is used for the various applications for needing for two kinds of substrates to be bonded together.Hotmelt combination
Object is usually applied with liquid or molten condition, and forms bonding in its cooling and consolidation.Hot-melt adhesive composition can pass through
At elevated temperatures by adhesive composition directly extrude on substrate to the temperature in adhesive composition is cooling when with
Another substrate forms structure bond and applies.
Hot-melt adhesive composition can be used for packaging applications (such as bonding cardboard and corrugated board), for non-woven fleece
Using (such as disposable product such as diaper), bookbinding and footwear manufacture etc..
In certain applications, it is desirable to the hotmelt with pressure-sensitive.In certain applications, it is desirable to have pressure-sensitive and
The hotmelt of bonding force is shown to the substrate of wide scope in the application of wide scope.In certain applications, it is desirable to have
Pressure-sensitive and the hotmelt for showing excellent retentivity at elevated temperatures.
Summary of the invention
The various aspects of present disclosure provide a kind of hot melt pressure sensitive adhesive composition.In the first aspect, described
Hot melt pressure sensitive adhesive includes isocyanate-terminated compound, plasticizer, thermoplastic polymer and tackifier.The plasticising
At least one of agent or tackifier include isocyanate-reactive group.In certain aspects, the melt pressure sensitive of first aspect
Adhesive composition further includes polyurethane curing catalyst.In certain aspects, the hot melt pressure sensitive adhesive composition
Further include non-reacted tackifier.
In certain aspects, the plasticizer and tackifier include hydroxyl.In certain aspects, the melt pressure sensitive is viscous
Mixture composite includes not by the second plasticizer of hydroxyl modification.
In certain aspects, the isocyanate-terminated compound, plasticizer, thermoplastic polymer and tackifier
Combination weight percentage is at least 90%, the total weight based on described adhesive composition.In certain aspects, the isocyanic acid
Ester terminated compound, plasticizer, thermoplastic polymer and tackifier combination weight percentage be at least 95%, be based on institute
State the total weight of adhesive composition.
In certain aspects, the tackifier be aliphatic hydrocarbon resin, aromatic hydrocarbon resin or aliphatic-aromatic hydrocarbon resin in extremely
Few one kind.In certain aspects, the tackifier are aliphatic resin, aromatic modified resins, alicyclic resin, hydroxyl modification resin
Or at least one of its hydrogenated form.In certain aspects, the tackifier are at least one of rosin or terpene resin.
In certain aspects, the thermoplastic polymer is at least one of block copolymer or polyolefin.Some
In aspect, the thermoplastic polymer is the polyolefin rich in propylene, the polyolefin rich in butylene or the polyolefin rich in ethylene
At least one of.In certain aspects, the thermoplastic polymer can be styrene block copolymer.In certain aspects,
The thermoplastic polymer is SIS block copolymer.
In certain aspects, the plasticizer is at least one of oil, liquid resin or liquid polymers.In some sides
In face, the plasticizer is polybutene.In certain aspects, the hot melt pressure sensitive adhesive composition comprising not hydroxyl and is
First plasticizer of at least one of oil, liquid resin or liquid polymers and the second plasticizer comprising hydroxyl.
In certain aspects, the isocyanate-terminated compound can be monomeric diisocyanate.In some respects
In, the isocyanate-terminated compound can be different for methylenediphenyl diisocyanates (MDI), methylene dibiphenylyl
Cyanate, hydrogenated methylene diphenyl isocyanates (HMDI), hexamethylene diisocyanate (HDI), two isocyanide of isophorone
Acid esters (IPDI), polymeric methylene diphenyl diisocyanate, toluene di-isocyanate(TDI) (TDI), polymethylene polyphenyl two are different
At least one of cyanate, naphthalene diisocyanate (NDI) or polymethylene multi-phenenyl isocyanate (PAPI).
In certain aspects, the hot melt pressure sensitive adhesive composition is sticky at room temperature.
In certain aspects, the isocyanate-terminated compound exists with the amount of about 20 weight % of about 1-, is based on
The total weight of the hot melt pressure sensitive adhesive composition.In certain aspects, the thermoplastic polymer is with about 70 weight of about 5-
The amount for measuring % exists, the total weight based on the hot melt pressure sensitive adhesive composition.In certain aspects, the tackifier are with big
Exist in the amount of 0.0 weight % to about 50 weight %, the total weight based on the hot melt pressure sensitive adhesive composition.In some sides
In face, the tackifier exist with the amount of about 30 weight % of about 5-, the total weight based on the hot melt pressure sensitive adhesive composition.
In certain aspects, the plasticizer exists with the amount greater than 0.0 weight % to about 50 weight %, viscous based on the melt pressure sensitive
The total weight of mixture composite.
In certain aspects, the hot melt pressure sensitive adhesive composition includes the isocyanic acid in an amount of from about about 20 weight % of 5-
Ester terminated compound, in an amount of from about the thermoplastic polymer of about 40 weight % of 15-, in an amount of from about about 50 weight %'s of 10-
Tackifier, the polyurethane curing catalyst of plasticizer and about 0.2 weight % in an amount of from about about 30 weight % of 15-, are all based on
The total weight of the hot melt pressure sensitive adhesive composition.
A kind of hot melt pressure sensitive adhesive composition is also disclosed in second aspect herein, it includes isocyanates chemical combination
The reaction product of object, plasticizer and tackifier;And thermoplastic polymer.At least one of the plasticizer or tackifier are hydroxyls
Base sealing end.
In certain aspects, the isocyanate compound is aromatic diisocyanates, aliphatic vulcabond or oligomeric
At least one of object;The thermoplastic polymer is styrene-ethylene-butylene-styrene (SEBS), styrene-isoamyl two
At least one of alkene-styrene (SIS) or s-B-S (SBS);The tackifier are rosin, terpenes tree
Rouge, phenolic resin or terpene phenolic resin;The plasticizer is at least one of mineral oil, resin or liquid polymers.
In certain aspects, the hot melt pressure sensitive adhesive composition of second aspect includes in an amount of from about about 20 weight %'s of 5-
Isocyanate compound, in an amount of from about the thermoplastic polymer of about 40 weight % of 15-, in an amount of from about the increasing of about 40 weight % of 10-
Stick, in an amount of from about the plasticizer of about 25 weight % of 15- and the polyurethane curing catalyst of about 0.2 weight %, be all based on institute
State the total weight of hot melt pressure sensitive adhesive composition.
In certain aspects, the tackifier have the softening point of about 160 DEG C of temperature of about 60-.In certain aspects, described
Tackifier have the softening point of about 160 DEG C of number-average molecular weight of about 100- about 1000, the OH value of about 1- about 400 or about 60- temperature
At least one of.
In certain aspects, the hot melt pressure sensitive adhesive composition has at least 5N/cm (13N/ inches) after hardening
180 ° of peel strengths.
In certain aspects, the hot melt pressure sensitive adhesive composition has at least 23N/cm after hardening2(150N/ English
It is very little2) shear strength.
In certain aspects, the hot melt pressure sensitive adhesive composition after hardening about one week higher than 40 DEG C at a temperature of
With the retention time (holding time) for being greater than 1 minute.
In certain aspects, the hot melt pressure sensitive adhesive composition is after hardening in the hot melt pressure sensitive adhesive composition
Each component between show crosslinking.
There is disclosed herein a kind of methods for forming hot melt pressure sensitive adhesive composition.In certain aspects, the method
Including combining thermoplastic polymer, plasticizer and tackifier to form the first mixture, and add into the first mixture different
Cyanate esters are to form hot melt pressure sensitive adhesive composition.In certain aspects, the thermoplastic polymer, plasticizer,
The combination weight percentage of tackifier and isocyanate compound is at least 90 weight %, is based on the hot melt pressure sensitive adhesive group
Close the total weight of object.At least one of the plasticizer or tackifier contain-OH group.In certain aspects, the method
It further comprise addition catalyst.
In certain aspects, the method includes by the thermoplastic polymer, plasticizer and containing during combination step
The tackifier of hydroxyl are kept at the first temperature, and implement addition step under the second temperature lower than the first temperature.One
In a little aspects, during combination step, the tackifier of the thermoplastic polymer, plasticizer and hydroxyl are in about 100- about
At a first temperature of 200 DEG C.In certain aspects, addition step carries out under about 130 DEG C of about 80- of second temperature.
In certain aspects, the method further includes the increasings in the thermoplastic polymer, plasticizer and hydroxyl
The pressure about 2- of atmospheric pressure is kept below on stick about 3 hours.In certain aspects, the method includes in the thermoplasticity
The pressure about 2- for being less than or equal to -1.0MPa relative to atmospheric pressure is kept on the tackifier of polymer, plasticizer and hydroxyl
About 3 hours.In certain aspects, addition step includes pressure about 0.5- about 2 hours for keeping below atmospheric pressure.In some sides
In face, the method includes the pressure relative to atmospheric pressure less than or equal to -1.0MPa is kept during adding step about
0.5- about 2 hours.
Although disclosing multiple embodiments, other embodiments of present disclosure are for those skilled in the art
For will become obvious by being detailed below for illustrative embodiment that present disclosure has shown and described.Therefore, attached
Figure and detailed description are considered illustrative rather than restrictive in itself.
Brief description
Fig. 1 is to show the figure of the thermal history vs. temperature experimental result of the various compositions of embodiment described herein,
In time of total thermal history indicate that dotted line is temperature line in figure with second (s), minute (min) and hour (h).
Specific embodiment
Disclosed herein is a kind of hot-melt adhesive compositions, show thermal stability, raw rubber adhesive strength (green
Bond strength), pot stability (pot stability), solidification adhesive strength, and can be used for producing and using
Extensive use in.The hot melt pressure sensitive adhesive composition divides it in the group of the hot melt pressure sensitive adhesive composition after hardening
Between show crosslinking.This crosslinking helps to provide hot melt pressure sensitive adhesive group at elevated temperatures with excellent retentivity
Close object.
Described adhesive composition has suitable green strength (green strength), to be formed initially with substrate
Bonding.Hot melt pressure sensitive adhesive composition disclosed herein shows adhesiveness to the substrate formed by the material of wide scope.
The hot melt pressure sensitive adhesive composition shows that some examples of the material of good adhesive property include but is not limited to poly- carbon to it
Acid esters (PC), polypropylene (PP), polyethylene (PE), polyethylene terephthalate (PET), acrylonitrile-butadiene-styrene (ABS)
(ABS), polyvinyl chloride (PVC) and polyamide (PA), however it is further contemplated that other materials.Melt pressure sensitive disclosed herein
Adhesive composition shows good viscosity, cohesive strength (cohesive to the substrate formed by material disclosed herein
Strength), peel strength and retentivity.
The hot melt pressure sensitive adhesive composition touches tacky at room temperature.It is used herein " pressure-sensitive " to refer to material in room
Tacky characteristic under temperature.The hot melt pressure sensitive adhesive may touch tacky after applying and being cooled to room temperature.In the heat
Before the solidification of melt pressure sensitive adhesive composition and after the solidification of described adhesive composition, which all may
It touches tacky.When the liquid adhesive composition from its apply temperature be cooled to room temperature (such as 25-35 DEG C) and at this it is viscous
When forming bonding between the component of mixture composite, which may occur to consolidate or solidify.Herein
" tacky " or " viscosity " used describes material (such as adhesive composition) and adheres on substrate after contacting with substrate
Characteristic.For example, the adhesive composition being arranged on first base material surface can be adhered to the second substrate (its with adhere to first
Adhesive material contact on substrate) on, so that the amount ratio of power needed for separating first base material and the second substrate is first
The power separated needed for them when adhesive material being not present between substrate and the second substrate is big.
The hot melt pressure sensitive adhesive composition is cooled to room temperature (about 35 DEG C of about 25-) at it and solidifies afterwards.After hardening, institute
Hot melt pressure sensitive adhesive composition is stated to show from about 3.9N/cm (10N/ inches), about 5.9N/cm (15N/ inches), about 7.9N/
Cm (20N/ inches) or about 9.8N/cm (25N/ inches) to about 21.7N/cm (55N/ inches), about 23.6N/cm (60N/ inches),
180 ° of peel strengths of about 25.6N/cm (65N/ inches) or about 27.6N/cm (70N/ inches), or in aforementioned value it is any
180 ° of peel strengths between.For example, the hot melt pressure sensitive adhesive composition keeps about one in CTH (constant temperature and humidity) room
180 ° of peel strengths between in aforementioned value any pair are shown after week.In some embodiments, the melt pressure sensitive
Adhesive composition has 180 ° of peel strengths greater than 10.2N/cm (26N/ inches) after hardening.In some embodiments
In, the hot melt pressure sensitive adhesive composition has 180 ° of peel strengths of at least 25.6N/cm (65N/ inches) after hardening.
The hot melt pressure sensitive adhesive composition has after hardening from about 10N/cm2(65N/ inches2), about 15N/cm2
(95N/ inches2), about 51.2N/cm2(330N/ inches2), about 52.7N/cm2(340N/ inches2), about 54.3N/cm2(350N/ English
It is very little2) or about 55.8N/cm2(360N/ inches2) to about 60.5N/cm2(390N/ inches2), about 62.0N/cm2(400N/ inches2)、
About 63.6N/cm2(410N/ inches2), about 75N/cm2(484N/ inches2) or about 100N/cm2(645N/ inches2) shearing it is strong
Degree, or the shear strength between in aforementioned value any pair.In some embodiments, the hot melt pressure sensitive adhesive group
Closing object has after hardening greater than 22.9N/cm2(148N/ inches2) shear strength.In some embodiments, the hot melt
Pressure-sensitive adhesive composition has at least 63.1N/cm after hardening2(407N/ inches2) shear strength.
The hot melt pressure sensitive adhesive composition shows thermal stability in wide temperature range.The melt pressure sensitive bonding
Display is greater than retention time of 1 (one) minute to agent composition at a temperature of 40 DEG C of about one Zhou Yue after the application.In some implementations
In scheme, the hot melt pressure sensitive adhesive composition solidify about after a week up to 60 ° at a temperature of show from about 1 (one)
Minute, about 10 minutes or about 20 minutes to about 30 minutes or about 40 minutes retention times, or in aforementioned value it is any right
Between time.In some embodiments, the hot melt pressure sensitive adhesive composition is in solidification about after a week at up to 75 DEG C
At a temperature of show from about 1 (one) minute, about 40 minutes or about 1 (one) hour to about 2 (two) hours, about 3 (three) hours or
The retention time of about 4 (four) hours, or the time between in aforementioned value any pair.In some embodiments, described
Hot melt pressure sensitive adhesive composition solidify about after a week about 60 DEG C at a temperature of show holding in greater than about 40 minutes when
Between.In some embodiments, the hot melt pressure sensitive adhesive composition solidify about after a week about 75 DEG C at a temperature of it is aobvious
Retention time greater than 4 hours is shown.In some embodiments, the hot melt pressure sensitive adhesive composition was in solidification about one week
Afterwards be up to about 100 DEG C at a temperature of show absolute retentivity.For example, described adhesive composition is bonded in solidification about one
After week up to 100 DEG C at a temperature of do not fail.In some embodiments, the hot melt pressure sensitive adhesive composition is in a system
Absolute retentivity is shown in column temperature range.For example, described adhesive composition is bonded in solidification about after a week up to
Kept at a temperature of 40 DEG C, then up to 60 DEG C at a temperature of keep, then up to 75 DEG C at a temperature of keep, then exist
It does not fail after being kept at a temperature of up to 100 DEG C.
The hot melt pressure sensitive adhesive composition shows viscosity stability in wide temperature range.For example, the bonding
Agent composition be up to about 120 DEG C, about 130 DEG C, about 140 DEG C or about 150 DEG C at a temperature of keep viscosity stability.In some realities
Apply in scheme, the hot melt pressure sensitive adhesive composition about 150 DEG C at a temperature of have no more than about 0.8%/hour, less
In about 0.9%/hour or no more than about the viscosity build of 1.0%/hour.In some embodiments, the melt pressure sensitive is viscous
Mixture composite about 150 DEG C at a temperature of have less than about 6%/hour viscosity build.In some cases, the hot melt
Pressure-sensitive adhesive composition about 150 DEG C at a temperature of have no more than about 21,000 centipoises (cp), no more than about 20,000cp,
No more than about 19,000cp, no more than about 8,000cp, no more than about 7,500cp, no more than about 7,000cp, be not greater than about 3,
000cp, no more than about 2,900cp or no more than about the viscosity of 2,800cp.
The hot melt pressure sensitive adhesive composition includes thermoplastic polymer, isocyanate compound, tackifier and plasticising
Agent.The hot melt pressure sensitive adhesive composition may include the reaction product of isocyanate compound and tackifier and/or plasticizer,
And with enough structural intergrities to provide the thermoplastic polymer of cohesive strength.In some embodiments, the heat
Melt pressure sensitive adhesive composition includes one or more each components.For example, described adhesive composition may include one or more
Isocyanate-terminated compound, one or more thermoplastic polymers, one or more tackifier and/or one or more
Plasticizer.In some embodiments, the hot melt pressure sensitive adhesive composition further includes other components, such as catalyst
And/or antioxidant.In some embodiments, the hot melt pressure sensitive adhesive includes no more than 15 weight %, is not more than 10
Weight %, no more than the polyester or polyether polyol of 5 weight %, or even be free of they.
Thermoplastic polymer
The hot melt pressure sensitive adhesive composition includes one or more thermoplastic polymers, with the adhesive composition
Remaining group subassembly, to provide initial green strength and solidification intensity for the adhesive composition.In some embodiments
In, the thermoplastic polymer is at least one of homopolymer, copolymer or more advanced polymer.For example, the thermoplasticity
Polymer can be block copolymer and/or terpolymer.The thermoplastic polymer can be elastomer.
In some embodiments, the thermoplastic polymer have from about 60 DEG C, about 70 DEG C, about 80 DEG C or about 90 DEG C to
The softening point of about 160 DEG C, about 170 DEG C, about 180 DEG C or about 190 DEG C temperature, or the temperature between in aforementioned value any pair
Softening point (pass through ASTM ring and ball softening point test measurement), however be contemplated that the thermoplasticity with other softening points polymerize
Object.
The suitable polymer that the thermoplastic polymer can be formed includes but is not limited to that block copolymer such as A-B diblock is total
Polymers, A-B-A triblock copolymer, radial direction A-B type block copolymer, segmented copolymer, Y block copolymer, linear A- (B-
A)nB block copolymer or amorphous or semicrystalline polyolefins polymer.
In some embodiments such as A-B-A block copolymer, radial direction A-B type block copolymer or linear A- (B-A)n- B is embedding
In section copolymer, component A may include polystyrene block, and B component may include diblock rubber (such as polyolefin block).It is other suitable
Component A include have aromatic monomer and the polymer of glassy end-blocks unit such as poly alpha methylstyrene with it is other similar
Polymer.Suitable B component includes but is not limited to the polymer or monomer that can produce rubber-like polymer block, such as isoamyl
Diene, butadiene and its mixture.Suitable B component may include hydrogenation and/or unhydrided polymer or monomer.Institute can be formed
The suitable block copolymers for stating thermoplastic polymer include styrene block copolymer, including but not limited to styrene-ethylene-fourth
Alkene-styrene (SEBS), styrene-isoprene-phenylethene (SIS), s-B-S (SBS), styrene-
Butadiene rubber (SBR) or hydrogenation SIS (SEPS) and combinations thereof.
The suitable block copolymers that the thermoplastic polymer can be formed include styrene block copolymer, the styrene
Block copolymer includes weight percent from about 10%, about 15% or about 20% to about 40%, about 45% or about 50%, or between
The styrene of weight percent in aforementioned value between any pair, the total weight based on the block copolymer.It can be formed described
The suitable example of the block copolymer of thermoplastic polymer includes number-average molecular weight from about 50,000, about 70,000 or about 90,000
To about 150,000, about 180,000, about 200,000 or about 500,000 and the total weight based on copolymer includes from about 10 weights
Measure the benzene second of the styrene of %, about 15 weight % or about 20 weight % to about 40 weight %, about 50 weight % or about 60 weight %
Alkene-isoprene styrene (SIS) block copolymer.Other conjunctions of the block copolymer of the thermoplastic polymer can be formed
Suitable example includes molecular weight from about 50,000, about 70,000 or about 90,000 to about 150,000, about 180,000 or about 200,
000 or about 500,000 and include from about 10 weight %, about 15 weight % or about 20 weight % to about 40 weight %, about 50 weights
Measure s-B-S (SBS) block copolymer of the styrene of % or about 60 weight %.The thermoplastic can be formed
Other suitable examples of the block copolymer of property polymer include molecular weight from about 30,000, about 50,000 or about 70,000 to
About 90,000, about 100,000 or about 120,000 or about 500,000 and include from about 10 weight %, about 15 weight % or about 20 weights
Measure styrene-hydrogenated butadiene-styrene block of the styrene of % to about 40 weight %, about 50 weight % or about 60 weight %
Copolymer (i.e. styrene-ethylene-butylene-styrene block copolymer), however it is contemplated that the other of other molecular weight and composition
Block copolymer.In some embodiments, the thermoplastic polymer may include having from 0.1:1, about 0.2:1, about 0.3:1
It is any to it to the diblock polymer and triblock polymer ratio of about 0.8:1, about 0.9:1 or 1:1 or in aforementioned value
Between ratio copolymer mixture.
Other examples of suitable thermoplastic polymer include polybutadiene, including its hydroxylated forms thereof, such as hydroxyl envelope
The polybutadiene at end.Other examples of other suitable thermoplastic polymers include polyolefin.For example, the thermoplastic polymer
It can be at least one of the polyolefin rich in propylene, the polyolefin rich in butylene or polyolefin rich in ethylene.It is conceivable
It is that in some embodiments, suitable thermoplastic polymer may include acrylate or acetic acid esters (such as EVA).
The example of suitable commercially available thermoplastic polymer includes styrene block copolymer, such as with ProductName SIS 1105
Or (the two is all obtained from the Guangzhou Tongshen Chemical positioned at GuangZhou, China city for those of sale of SIS 1124
Co.), KRATON D1126 or the other styrene block copolymers sold with trade name KRATON and KRATON G (are obtained from position
In Houston, the Kraton Corp. of TX).The example of suitable olefin block copolymers includes with trade name INFUSE sale
Those of (be obtained from be located at Midland, the The Dow Chemical Co. of MI).The example of the suitable polyolefin rich in propylene
Including VISTAMAXX 6202 (being obtained from Houston, the ExxonMobil Chemical Company of TX).
The thermoplastic polymer with the total weight based on the hot melt pressure sensitive adhesive composition from about 5 weight %, about
10 weight %, about 15 weight %, about 20 weight % or about 25 weight % to about 50 weight %, about 55 weight %, about 60 weight %,
The amount of about 65 weight % or about 70 weight % is present in the melt pressure sensitive with the amount between in aforementioned value any pair
In adhesive composition, however it is contemplated that other amounts.In there is the embodiment more than a kind of thermoplastic polymer, the heat
The total amount more than a kind of thermoplastic polymer in melt pressure sensitive adhesive composition can from about 5 weight %, about 10 weight %,
About 15 weight %, about 20 weight % or about 25 weight % are to about 50 weight %, about 55 weight %, about 60 weight %, about 65 weights
% or about 70 weight %, or the amount between in aforementioned value any pair are measured, is combined based on the hot melt pressure sensitive adhesive
The total weight of object, however it is contemplated that other amounts.
Isocyanate compound
The hot melt pressure sensitive adhesive composition includes one or more isocyanate compounds.The term as used herein
" isocyanate compound " indicates the compound with 2 or more-NCO group.The isocyanate compound can be different
The ester terminated compound of cyanic acid.The isocyanate compound can be selected from monomeric diisocyanate and isocyanate-terminated oligomeric
Object.
Some examples of suitable isocyanate compound include but is not limited to aromatic isocyanate such as aromatics diisocyanate
Ester, aliphatic isocyanate such as aliphatic vulcabond.In some instances, isocyanate compound can be used to be formed for institute
State the prepolymer composite in hot melt pressure sensitive adhesive.
The Suitable isocyanate compound that can be used to form the hot melt pressure sensitive adhesive composition includes isocyanates official
Energy degree is about 2 or higher aliphatic series and aromatic isocyanate compound.In some embodiments, the isocyanate compound
The aliphatic series or aromatic group replaced with 1-10 by isocyanate group.The isocyanate compound also may include other substitutions
Base, the substituent group do not negatively affect the viscosity of isocyanate prepolymer, the hot melt pressure sensitive adhesive composition substantially
Bond properties or during forming adhesive composition-reactivity of NCO group.The isocyanate compound may also include
The mixture of both aromatics and aliphatic isocyanate and the isocyanate compound for having both aliphatic series and aromatic character.
Suitable isocyanate compound includes methylene diphenyl isocyanate compound, such as diphenyl methane two is different
Cyanate (including its isomers), methylenediphenyl diisocyanates (MDI), carbodiimide modified MDI, hydrogenated methylene
Diphenylisocyanate (HMDI), hexamethylene diisocyanate (HDI), isophorone diisocyanate (IPDI), polymerization are sub-
Methyl diphenyl isocyanate, diphenyl methane -4,4'- diisocyanate, diphenyl methane -2,2'- diisocyanate, hexichol
Methylmethane -2,4'- diisocyanate and other low polymethylene isocyanates, tolunediisocyanate compound (TDI) (including
Its isomers), tetramethylxylene diisocyanate (TMXDI), the isomers of naphthalene diisocyanate, three isocyanide of triphenyl methane
The isomers and its mixture of acid esters, however it is further contemplated that other isocyanates.In some cases, aliphatic two isocyanides
Acid esters, triisocyanate and polyisocyanates are also suitable isocyanate compound, including such as Hydrogenated aromatic diisocyanate
Ester, aliphatic polyisocyanate or alicyclic polyisocyanates, however it is further contemplated that other isocyanates.
The isocyanate compound with the total weight based on the hot melt pressure sensitive adhesive composition from about 1 weight %,
About 2 weight %, about 4 weight %, about 6 weight % to about 14 weight %, about 16 weight %, about 18 weight % or about 20 weight %
Amount or the amount between in aforementioned value any pair are present in the hot melt pressure sensitive adhesive composition, however are contemplated that other
Value.In there is the embodiment more than a kind of isocyanate compound, it is present in the hot melt pressure sensitive adhesive composition
The total amount of isocyanate compound can be from about 1 weight %, about 2 weights based on the total weight of the hot melt pressure sensitive adhesive composition
Measure %, about 4 weight %, about 6 weight % to about 14 weight %, about 16 weight %, about 18 weight % or about 20 weight %, Huo Zhewei
Amount between in aforementioned value any pair, however it is contemplated that other values.In some embodiments, the isocyanates chemical combination
Object with the total weight based on the hot melt pressure sensitive adhesive composition is about 5 weight %, about 10 weight % or about 15 weight %
Amount is present in the hot melt pressure sensitive adhesive composition, however is contemplated that other amounts.
Tackifier
The hot melt pressure sensitive adhesive composition includes one or more tackifier.In some embodiments, it is used for institute
Stating suitable tackifiers in adhesive composition is containing can be anti-with the isocyanate component of the hot melt pressure sensitive adhesive composition
Those of isocyanate-reactive group (i.e. containing groups such as the groups of active hydrogen, such as hydroxyl, amine, sulfydryl) answered.Some
In embodiment, the hot melt pressure sensitive adhesive composition can further include one or more non-reacted tackifier.
The suitable tackifiers that can be used to form described adhesive composition include the softening with about 160 DEG C of temperature of about 60-
Those of point (tested and measured by ASTM ring and ball softening point).For example, suitable tackifier can have greater than 60 DEG C and be less than
About 160 DEG C, the softening point less than about 150 DEG C or less than about 140 DEG C.In some cases, suitable for forming described adhesive
The tackifier of composition have the softening from about 60 DEG C, about 80 DEG C, about 100 DEG C to about 120 DEG C, about 140 DEG C or about 160 DEG C temperature
Point, or with the softening point between in aforementioned temperature any pair, however it is further contemplated that other tackifier.
In some embodiments, the tackifier have from about 80, about 100 or about 120 to about 900, about 1000 or about
1100 number-average molecular weight, or with the molecular weight between in aforementioned value any pair, however it is contemplated that other molecular weight.
In some embodiments, the tackifier are hydroxyl modification tackifier (- OH modified tackifier), such as hydroxyl
The tackifier of sealing end.In some embodiments, the tackifier have from about 1, about 5, about 10, about 15, about 20, about 25, about
30, about 50 to about 100, about 140, about 160, about 200, about 250, about 300, about 380, about 400 or about 420 hydroxyl (OH) value,
Or with the OH value between in aforementioned value any pair.
The suitable tackifiers for being used to form the hot melt pressure sensitive adhesive composition include aromatics, aliphatic series and clicyclic hydrocarbon tree
Rouge mixes aromatics and aliphatic modified hydrocarbon resin, the resin of hydroxyl modification, aromatic modified aliphatic hydrocarbon resin, and its hydrogenation shape
Formula.Other suitable examples of tackifier include terpenes, modified terpene and its hydrogenated form.
In some embodiments, suitable tackifier include rosin, terpene resin, phenolic resin (such as terpenes phenolic aldehyde
The modified aromatic hydrocarbon resin etc. of resin, phenol) and its hydrogenated form.In some embodiments, suitable tackifier include natural
Rosin, modified rosin, rosin ester and its hydrogenated form;Low molecular weight, and combinations thereof.Suitable natural and modified rosin
Example include gum rosin, wood rosin, toll oil rosin, distillation rosin, hydrogenated rosin, dimerization colophonium and newtrex.Properly
The example of tackifier includes rosin ester, the methyl esters of glyceride, rosin, the glyceride of hydrogenated rosin, newtrex including rosin
Glyceride, natural and modified rosin pentaerythritol ester, the pentaerythrite of pentaerythritol ester, hydrogenated rosin including rosin
The modified pentalyn of ester, the pentaerythritol ester of toll oil rosin, phenol, and combinations thereof.
Other examples of suitable tackifiers include the copolymer and terpolymer of natural terpenes, such as styrene-terpenes,
α-methylstyrene-terpenes and vinyltoluene-terpenes, and combinations thereof.The reality of suitable aliphatic series and alicyclic petroleum hydrocarbon resin
Example includes aliphatic series and alicyclic petroleum hydrocarbon resin, its hydrogenated derivatives and combinations thereof.Suitable aliphatic series and alicyclic petroleum hydrocarbon tree
Rouge includes such as branching, unbranched and cyclic annular C5 resin, C9 resin and C10 resin.
The example that can be used to form the suitable commercial tackifier of the hot melt pressure sensitive adhesive composition includes with various quotient
Those of name of an article sale, including trade name ESCOREZTMIt is certain (obtained from positioned at Houston, the ExxonMobil of TX in series
Chemical Co.), including ESCOREZ 5400, ESCOREZ 5415, ESCOREZ 5600,5615 and of ESCOREZ
ESCOREZ 5690;Trade name EASTOTACTMSeries (is obtained from and is located at Kingsport, the Eastman Chemical Co. of TN),
Including EASTOTAC H-100R, EASTOTAC H-100L, EASTOTAC H130W and EASTOTAC H142;Trade nameSeries (is obtained from and is located at Exton, the Cray Valley HSC of PA), including WINGTACK 86,
WINGTACK EXTRA and WINGTACK 95;Trade name PICCOTAC series (being obtained from Eastman Chemical Co.), including
PICCOTAC 8095;Trade name ARKONTMSeries (obtained from the Arkawa Europe GmbH for being located at Germany), including ARKON P-
125;And with trade name REGALITETMThose of series sales (are obtained from Eastman Chemical Co.), including for example
REGALITE R1125。
The suitable tackifiers for being used to form the hot melt pressure sensitive adhesive composition include phenol-modified terpene resin, example
Such as with trade name SYLVARESTMThose of TP sale (being obtained from Houston, the KRATON Corp. of TX) and phenol-modified C9
Aromatic hydrocarbon resin, such as with those of trade name HIKOTACK P sale (obtained from the Kolon for being located at South Korea Kwacheon City
Chemical Company LTD).It can be used to form other suitable tackifier packets of the hot melt pressure sensitive adhesive composition
Modified aliphatic resin is included, such as with trade name LUHOREZTMThose of M90 sale is (obtained from the Zibo for being located at Chinese Zibo
Luha Hongjin New Material Co.,Ltd.)。
The tackifier are to be from about 1 weight %, about 5 weight %, about 10 weight % based on adhesive composition total weight
Or about 15 weight % to about 30 weight %, about 40 weight %, about 50 weight % or about 60 weight % amount, or between aforementioned
Amount in value between any pair is present in the hot melt pressure sensitive adhesive composition, however is contemplated that other values.In some realities
It applies in scheme, which is about 10 weights with the total weight based on the hot melt pressure sensitive adhesive composition
The amount of amount %, about 12 weight % or about 20 weight % are present in the hot melt pressure sensitive adhesive composition, however are contemplated that other
Weight percent.
Plasticizer
The hot melt pressure sensitive adhesive composition includes one or more plasticizer.In some embodiments, the increasing
Moulding agent is at least one of oil, liquid resin or liquid polymers.Liquid resin is included in room temperature (about 35 DEG C of for example, about 25-)
It is down the resin of liquid.
Be used to form the hot melt pressure sensitive adhesive composition suitable plasticizers include mineral oil, paraffin oil, naphthenic oil,
The synthetic fluid oligomer of polyolefin (such as polybutene and polypropylene), hydrocarbon fluid, vegetable oil and combinations thereof.In some embodiment party
In case, suitable plasticizer can have the number-average molecular weight (Mn) from about 1,000, about 2,000 to about 6,000 or about 10,000,
Or the molecular weight between in aforementioned value any pair.
In some embodiments, the plasticizer can be (- OH is modified) of hydroxyl modification or can be unmodified.?
In some embodiments, the hot melt pressure sensitive adhesive composition include hydroxyl modification the first plasticizer and not by hydroxyl modification
The second plasticizer.Suitable hydroxyl modification plasticizer include containing weight percent from about 0.5 weight %, about 1 weight % or
About 2 weight % to about 7 weight the % ,-OH of about 8 weight % or about 9 weight % or weight percent are any in aforementioned value
Those of-OH between, the total weight based on the plasticizer.In some embodiments, the plasticizer can be for institute
Isocyanate compound is stated with reactive hydroxylated compounds.
In some embodiments, the plasticizer can for hydroxyl modification or can unmodified liquid resin.Some
In embodiment, the plasticizer can be hydroxylated compound, such as the liquid tree of hydroxy-end capped polybutene, hydroxyl modification
Rouge or combinations thereof.
In some embodiments, suitable plasticizer can be liquid polybutene, be-OH modified or unmodified
, and be at room temperature liquid.Suitable plasticizer include about 35 DEG C of about 25- at a temperature of have from about 500 centipoises
(cp), about 2,000cp or about 6,000cp to about 10,000cp, the viscosity of about 50,000cp or about 70,000cp or between preceding
State the liquid polybutene of the viscosity in value between any pair.
Suitable commercially available plasticizer may include with trade nameThose of series sales are (obtained from being located at
The Nynas Corp. of Houston, TX), including such as NYFLEX 222B;Oil, such as with trade nameSale
Those of (be obtained from be located at Parsippany, the Sonneborn of NJ, LLC);Mineral oil, such as with trade name KRYSTOLTMSale
Those of, such as KRYSTOL550 (obtained from the Petrochem Carless Ltd. for being located at Britain Surrey);Oil, such as with quotient
Those of sale of name of an article CALSOL 550 (is obtained from and is located at Indianapolis, the Calumet Specialty Products of IN
Partners, LP.);Rubber oil, such as with those of ProductName KN401 sale (obtained from the Fuda for being located at Hangzhou China
Petrochemical Co., Ltd);And poly alpha olefin, such as with trade name SPECTRASYNTMThose of series sales (obtain
From positioned at Houston, the ExxonMobil Chemical Co. of TX), including such as SPECTRASYN 4 and 40.
Suitable plasticizer may include certain commercial liquid hydrocarbon resins, such as with trade name REGALITETMC8010 sale
Those of (be obtained from be located at Kingsport, the Eastman Chemical Co. of TN), and with trade name ESCOREZTMSale
The certain examples of those, such as ESCOREZ 5040 (be obtained from and be located at Houston, the ExxonMobil Chemical Co. of TX).
Other suitable-OH modified liquid the resins that can be used as plasticizer include with trade nameThose of sale
(it is obtained from GermanyGermany GmbH), including for exampleThose of in series, as LA,
LC, HA, TNA, CA or LS series.
Suitable plasticizer may include withThe liquid polybutene of the trade name sale of series (is obtained from Exton, PA
Cray Valley), such as130,142 or 150.Suitable polybutene can be for trade name
Those of series sales (INEOS obtained from London).Other suitable plasticizer include withSeries of pins
- the OH sold modified liquid polybutene (being obtained from Exton, the Cray Valley of PA), such asLBH-2000、
3000 or 5000.
The plasticizer with the total weight based on adhesive composition from 1 weight %, about 5 weight %, about 10 weight % or
The amount of about 15 weight % to about 30 weight %, about 40 weight % or about 50 weight %, or with any to it in aforementioned value
Between amount be present in the hot melt pressure sensitive adhesive composition, however be contemplated that other values.It is more than a kind of plasticizer having
Embodiment in, the total amount for being present in one of described hot melt pressure sensitive adhesive or a variety of plasticizer can be for from about 1 weight
Amount %, about 5 weight %, about 10 weight % or about 15 weight % to about 30 weight %, about 40 weight % or about 50 weight % (are based on
The total weight of described adhesive composition), or the amount between in aforementioned value any pair, however it is contemplated that other values.
Other components
In some embodiments, the hot melt pressure sensitive adhesive composition optionally includes one of various other components
Or it is a variety of, including for example stabilizer, antioxidant, adhesion promoter, UV light stabilizing agent, rheology modifier, biocide,
Corrosion inhibitor, dehydrating agent, colorant (such as pigment and dyestuff), filler, surfactant, fire retardant, wax, other polymerizations
Object and its mixture and combination.
In some embodiments, the hot melt pressure sensitive adhesive composition includes one or more antioxidants.One
In a little embodiments, suitable antioxidant include but is not limited to pentaerythrite four [3, (3,5- di-tert-butyl-hydroxy phenyl)
Propionic ester], 2,2'- di-2-ethylhexylphosphine oxides (4- methyl-6-tert-butylphenol), phosphite ester, including such as three (to nonyl phenyl) Asias
Phosphate (TNPP) and bis- (2,4- di-tert-butyl-phenyl) 4,4'- diphosphonites, distearyl -3,3'- are thio
Dipropionate (DSTDP), and combinations thereof.Available antioxidant can be commercially available with extensive stock name, including for example with quotient
The name of an articleSeries sales hindered phenol antioxidant (be obtained from BASF Corporation, Florham Park,
), including such as IRGANOX 1010, IRGANOX 565, IRGANOX 1076 NJ;With trade nameSale
Phosphite antioxidant, such as168 (BASF obtained from German Ludwigshafen) and with common name
The 4,4' methylene bis (2,6 di t butyl phenol) that Ethyl 702 is obtained.
In some embodiments, the hot melt pressure sensitive adhesive composition includes one or more catalyst.Some
In embodiment, suitable catalyst may be selected with improve the reaction of remaining component of the hot melt pressure sensitive adhesive composition,
It is formed and/or is solidified.For example, described adhesive composition may include curing catalysts, such as polyurethane curing catalyst.It can use
In the proper settings catalyst for forming the hot melt pressure sensitive adhesive composition include 2,2'- dimorpholino diethyl ether
(DMDEE), such as with trade nameThose of sale (it is obtained from and is located at The Woodland, TX's
Hunstman Performance Products)。
The method for forming hot melt pressure sensitive adhesive
In some embodiments, the method for forming the hot melt pressure sensitive adhesive composition includes by the thermoplastic poly
Object, plasticizer, tackifier and isocyanate compound combination are closed to form the hot melt pressure sensitive adhesive composition.
In some embodiments, the method for forming the hot melt pressure sensitive adhesive composition includes by the thermoplastic poly
Object, plasticizer, tackifier combination are closed, adds isocyanate compound then to form the hot melt pressure sensitive adhesive composition.
For example, the method for forming the hot melt pressure sensitive adhesive composition may include in the first step by the thermoplastic polymer with
Tackifier and plasticizer combinations are then the second step of addition isocyanate compound.In some embodiments, second
In step, catalyst is added in the tackifier and isocyanate compound of the thermoplastic polymer, plasticizer, hydroxyl
To help to form the hot melt pressure sensitive adhesive composition.
In some embodiments, in the first step, the thermoplastic polymer, plasticizer and tackifier are maintained at
At a temperature of first, while by these group of subassembly.In some embodiments, in the second step, by the isocyanation esterification
It closes object to be added in the component combined in the first step, and the component combined in the second step is maintained at can be higher than, is low
Under the second temperature of the first temperature.In preferred embodiments, second temperature is lower than the first temperature.For example, first
Temperature can be for from about 100 DEG C, about 120 DEG C or about 140 DEG C to about 160 DEG C, about 180 DEG C or about 200 DEG C, or between aforementioned value
In temperature between any pair, however be further contemplated that other temperature.In some embodiments, second temperature can be for from about
70 DEG C, about 80 DEG C, about 90 DEG C or about 100 DEG C to about 120 DEG C, about 130 DEG C or about 140 DEG C or in aforementioned value it is any to it
Between temperature, however be further contemplated that other temperature.
The component of the hot melt pressure sensitive adhesive composition can combine in the container of pressure controllable, such as can keep container
Internal pressure is higher than, equal to or less than the container of external container pressure such as atmospheric pressure.As example, the melt pressure sensitive bonding
The component of agent composition can combine in a reservoir, and in first step and/or second step, the inside of container is positively retained at
Under the pressure of subatmospheric power.In some embodiments, first step include by the thermoplastic polymer, plasticizer,
Tackifier group and about 1 hour, about 2 hours to about 3 hours, about 4 hours or about 5 hours in a reservoir, or in aforementioned value
Time between any pair, while will be under the pressure holding at a pressure below the atmospheric pressure inside container.In some embodiment party
In case, second step includes the component that will be combined in the first step and isocyanate compound and optional catalyst in container
Middle group and about 0.5 hour, about 1 hour to about 2 hours, about 3 hours or about 4 hours or between in aforementioned value any pair
Time, while will be under the pressure holding at a pressure below the atmospheric pressure inside container.In some embodiments, first step
And/or second step may include to keep the pressure in container relative to atmospheric pressure be about -0.5MPa, about -1.0MPa, about -
1.5MPa or about -2.0MPa.
It is used to form the sample program of hot melt pressure sensitive adhesive
In some embodiments, the method for being used to form hot melt pressure sensitive adhesive composition include: in the first step,
The thermoplastic polymer in an amount of from about about 70 weight % of 5- is added into container, in an amount of from from greater than 0.0 weight % to about 80 weights
The tackifier of % and the plasticizer in an amount of from about about 25 weight % of 15- are measured, the hot melt pressure sensitive adhesive composition is all based on
Final total weight.The component combined in first step can be mixed in a reservoir about 2-3 hours.Pressure inside container can phase
Atmospheric pressure is maintained under about -1.0MPa.During first step, the component of container is positively retained at about 200 DEG C of about 100-
At a temperature of.
It in some embodiments, in the second step, will be in an amount of from about the isocyanate compound of about 20 weight % of 1-
With catalyst (final total weight for the being all based on the hot melt pressure sensitive adhesive composition) addition in an amount of from about 0.2 weight %
Into the component combined in the first step.In some instances, the thermoplastic polymer, tackifier, plasticizer, isocyanic acid
The total weight percent of ester compounds and catalyst accounts at least 90 weights of the hot melt pressure sensitive adhesive composition final weight
Measure %.In some instances, the gross weight of the thermoplastic polymer, tackifier, plasticizer, isocyanate compound and catalyst
Amount percentage accounts for at least 95 weight % of the hot melt pressure sensitive adhesive composition final weight.It will can combine in the second step
Component mix about 0.5- about 2 hours in a reservoir to form the hot melt pressure sensitive adhesive composition.Pressure inside container
It can be maintained at relative to atmospheric pressure under about -1.0MPa.During second step, the component of container is positively retained at about 80- about 130
At a temperature of DEG C.
In preferred embodiments, the method for forming hot melt pressure sensitive adhesive composition includes in the first step to container
It is middle to be added in an amount of from about the thermoplastic polymer of about 40 weight % of 15-, in an amount of from about the tackifier and its amount of about 40 weight % of 10-
It is the plasticizer of about 25 weight % of about 20-, is all based on the final total weight of the hot melt pressure sensitive adhesive composition.It can be by
The component combined in one step mixes about 2-3 hours in a reservoir.Pressure inside container can be maintained at relative to atmospheric pressure
Under about -1.0MPa.During first step, the component of container is positively retained at a temperature of about 200 DEG C of about 100-.
It in some embodiments, in the second step, will be in an amount of from about the isocyanate compound of about 10 weight % of 5-
(the final of the hot melt pressure sensitive adhesive composition is all based on the polyurethane curing catalyst in an amount of from about 0.2 weight %
Total weight) it is added in the component combined in the first step.In some instances, the thermoplastic polymer, tackifier, increasing
The total weight percent of modeling agent, isocyanate compound and catalyst accounts for the hot melt pressure sensitive adhesive composition final weight
At least 90 weight %.In some instances, the thermoplastic polymer, tackifier, plasticizer, isocyanate compound and catalysis
The total weight percent of agent accounts for at least 95 weight % of the hot melt pressure sensitive adhesive composition final weight.It can will be in second step
The component combined in rapid mixes about 0.5- about 2 hours in a reservoir to form the hot melt pressure sensitive adhesive composition.In container
The pressure in portion can be maintained under about -1.0MPa relative to atmospheric pressure.During second step, the component of container is positively retained at about
At a temperature of about 130 DEG C of 80-.
Typically, use the block copolymer comprising lower glass transition temperatures (Tg) segment as in hotmelt
Polymer backbone can provide useful viscosity (tack) and adhesiveness (adhesion) is horizontal.In some cases, due to hot melt
The low molecular weight of certain materials (such as certain oil or tackifier), cohesive force (cohesion) under certain conditions in adhesive
It may be restricted with high-temperature behavior.In some cases, when forming hot melt pressure sensitive adhesive, it may be difficult to which preparation includes
The hotmelt of the isocyanate-terminated chemicals compatible with polyolefin or rubber or similar components.It has been found that some
In the case of, the cohesion that certain degree of cross linking between hot melt pressure sensitive adhesive component can help to improve the adhesive composition is strong
Spend and increase the base material range that adhesive can adhere to.In some cases, thermoplastic in hot melt pressure sensitive adhesive composition is adjusted
Property polymer content percentage can help to further adjust the material that cohesive force level and hotmelt can adhere to.
Additionally or alternatively, the hot-melt adhesive composition with certain pressure-sensitive character can be formed.For instance, it has been found that will
Hydroxy-containing compounds are added to the pressure-sensitive character that can be used to help to increase that hot-melt adhesive composition in hotmelt.It is some its
Its technology includes that addition helps to increase pressure-sensitive character, certain plasticizer and/or tackifier without damaging other required performances.
In some cases, the method that can be chosen for forming hot melt pressure sensitive adhesive, so that helping to assign adhesive with institute
The cohesive performance needed.For example, first mixing the thermoplastic polymer, tackifier and plasticizer, isocyanates is then added
Compound such as MDI, this can prepare pressure-sensitive hotmelt, can solidify and with reaction of moisture in air.
It has been found that in some cases, it is viscous to form melt pressure sensitive by selecting the component of hot melt pressure sensitive adhesive composition
Mixture composite, so that described adhesive composition shows adhesive composition group after adhesive composition solidification
/ crosslinking may be preferred.For instance, it has been found that certain form of tackifier (such as with those of hydroxyl) may
It is advantageous.As example, tackifier (such as resin with hydroxyl) can polymerize with isocyanate compound (such as MDI),
To form hot melt pressure sensitive adhesive composition.When hot melt pressure sensitive adhesive composition exposure in air when, can be by
Moisture (such as by ambient moisture in air) solidification, to form the solidification adhesive with certain degree of cross linking.In some realities
In example, addition can help to the friendship of adhesive composition component with the plasticizer of other component reactions of adhesive composition
Connection, and can help to improve cohesive force.For example, the cohesion of cured adhesive composition can be improved in the plasticizer that hydroxyl is added
Power.
It has been found that hot melt pressure sensitive adhesive composition disclosed herein is up to such as from about 150 DEG C of high temperature is all with good
Stability, such as viscosity stability and viscosity build rate stability.Good viscosity stability makes heat disclosed herein
Melt pressure sensitive adhesive composition can be used for the application of wide scope.It has been found that the MDI for controlling certain level can in some compositions
To adjust viscosity stability, this is adjustable adhesive composition to adapt to various manufacturing process.For example, the melt pressure sensitive bonding
Agent composition can for melting at a temperature of keep viscosity stability and making described adhesive composition under production conditions
For liquid application.
It has been found that hot melt pressure sensitive adhesive composition disclosed herein be suitable for bonding by such as PC, PE, PET, PVC, PP,
The substrate for the wide scope that a variety of materials such as ABS, PA are formed.It has been found that hot melt pressure sensitive adhesive composition disclosed herein has
Good viscosity, good cohesive strength, good peel strength and good retentivity.Melt pressure sensitive disclosed herein is viscous
Mixture composite at high temperature, such as room temperature to for example be up to 100 DEG C at a temperature of keep these characteristics.
It has been found that hot melt pressure sensitive adhesive composition disclosed herein also shows that after adhesive composition solidification
Pressure-sensitive character.(such as room temperature is extremely under room temperature (such as 25-35 DEG C) and in temperature above room temperature for described adhesive composition
100 DEG C of temperature) under but viscosity.Even if after hardening, described adhesive composition is also flexible.
In some instances, hot melt pressure sensitive adhesive composition disclosed herein can be used as liquid and be applied to first base material
On.Viscosity stability allow adhesive composition conveyed in the adhesive composition and when being applied in first base material (such as when
When adhesive composition is conveyed at high temperature through pipe and/or nozzle) remain liquid.It in some applications, can be by making
Two substrates contact with the adhesive composition having been applied in first base material and the second substrate are attached to first base material.For example,
The second substrate can be made to contact with first base material before or after adhesive composition solidifies.When adhesive composition solidification,
And/or after its solidification, pressure-sensitive character can help to the second substrate and position relative to first base material.The melt pressure sensitive bonding
The features and characteristics (including but not limited to those described herein) of agent composition for user provide wide scope application with
And the applicable a series of conditions of described adhesive composition.
In some instances, described adhesive composition can be for example applied in first base material as film, then bonded
After the solidification of agent composition, first base material is attached to the second substrate.In some cases, described adhesive composition can be used for
Form adhesive tape, such as removable adhesive tape.Described adhesive composition can be used for manufacturing the adhesive tape with high-temperature behavior, because of institute
Viscosity can be kept under high temperature (such as higher than room temperature) by stating adhesive composition.In some cases, though at high temperature, it is described
The crosslinking of adhesive composition component also contributes to improving and keeping the cohesive strength of the adhesive composition.For example, using this
The adhesive tape that hot-melt adhesive composition disclosed in text is formed can be applied on substrate at around room temperature, and be added in the adhesive tape
Its levels of adhesion is kept when heat to temperature above room temperature.
Hot melt pressure sensitive adhesive composition disclosed herein can be used for article of manufacture and/or for being adhered to by wide scope
Material made of on substrate, the material includes but is not limited to timber, cardboard, paper, metal, plastics, rubber, glass, nonwoven
Object and textile.Other examples include the consumer goods and special industrial application.The hot melt pressure sensitive adhesive composition is available
Market includes disposable product such as diaper or feminine hygiene articles, textile such as carpet and clothes, food packaging, footwear, consumption
Electronic product, building, furniture, automobile and aircraft.Various applications include but is not limited to be used for ship and automobile application, window, are used
In manufacture door (including entrance door, garage door etc.), for manufacturing building panel, for bonding the component such as headlamp of outside vehicle
Deng.
Hot melt pressure sensitive adhesive composition disclosed herein can be used for making product be bonded together as follows: will
Described adhesive composition is applied on the surface of the first product with liquid or melting form, is made the second product and is applied to first
Adhesive composition contact on product, and being in applied adhesive composition allows the adhesive composition cooling simultaneously
It is solidified under conditions of solid form.In some cases, it can be wrapped for cooling down and solidifying the condition of described adhesive composition
Include the environment containing ambient moisture, the moisture can be with the component reaction of adhesive composition so that the adhesive curing.
Described adhesive composition can be distributed and be stored in solid form, and be stored in the case where no moisture.
When described adhesive composition is ready in use, can solid binder composition be heated and be melted before application.
Embodiment
Each embodiment of present disclosure is further described including following non-limiting embodiment, is not intended to be limiting
Scope of the present disclosure.
Test method
Viscosity determining procedure
Viscosity is being heated to 150 DEG C using Brookfield DV2T viscosimeter and with No. 27 rotors that 5-10rpm rotates
It is measured on composition to be tested.
Viscosity stability is by being based on hour measurement viscosity simultaneously according to the viscosity determining procedure of ASTM D445 (ISO3104)
It is calculated with the percentage of initial viscosity and increases and measure.The aging in viscosimeter by sample.
Adhesion Test Method
Tacky or sticky test can be by the way that the sample of adhesive composition to be placed in first base material, and makes the second substrate
(such as a piece of paper, piece of plastic or finger) is contacted with adhesive composition sample and is carried out.Make the sample of adhesive composition
Form 0.15mm thickness, 2.5cm (1 inch) wide film.Sample 150 DEG C at a temperature of apply.Solidifying after a week, at 25 DEG C
At a temperature of measure sample.The amount that second substrate is removed to required power from adhesive composition do not increase will indicate that it is not tacky or
It is inviscid.If the second substrate is keeping former at the position of first base material (wherein the second substrate is contacted with adhesive composition)
Position, but can be separated with first base material without making adhesive composition sample deform with the smallest power, then it finds low tacky
Or low viscosity.If the second substrate contacts with adhesive composition and as the second substrate is separated with first base material, adhesive
The surface shape of composition changes, then can find medium tacky or moderate tack.It is medium it is tacky be found in such as natural gum or
In the substance of myron.When there is being partially separated for adhesive composition adhesive to be caused to combine the second substrate and first base material
The shape of object sample or the shape of first or second substrate change (including but do not require the first and/or second substrate send out
It is raw to destroy, such as be difficult to remove glued board or plastics, tear cardboard or paper surface, when removing finger from adhesive composition
Adhesive composition remains on finger skin) when, find high tacky or high viscosity.High viscosity is usually with household adhesive tape as packed
Adhesive tape or duct tape are suitable.
Shearing and peel test method
Shearing test by by polycarbonate (PC) substrate of the first 3mm thickness and adhesive composition layer pressure to form thickness
For 0.15mm adhesive composition film and carry out.Then, adhesive composition layer is being pressed on PC substrate about 5-20 minutes
Afterwards, applied adhesive composition is contacted with polycarbonate (PC) substrate of the 2nd 3mm thickness.Shearing test is in sample preparation
And it then keeps carrying out after a week in the thermostatic constant wet chamber for being set as 25 DEG C and 50% relative humidity.
Using with 1/2 inch2(3.23cm2) overlapping area and 0.005 inch (0.0127cm) interval the poly- carbonic acid of standard
Ester (PC) lap shear plate is cut into the test sample of shearing test, and wherein the size of each sample is 1 inch (2.54 centimetres)
× 4 inches (10.16 centimetres) and 3mm are thick.
The test specimens for peel sample are cut into using standard polycarbonate (PC) lap shear plate (lap-shear)
Product, the size of each sample are 1 inch (2.54 centimetres) × 4 inches (10.16 centimetres) and 3mm thick.Sample for peel test
It is combined by being formed with adhesive composition layer pressure polycarbonate (PC) substrate of 3mm thickness with a thickness of the adhesive of 0.15mm
Object film and formed.Then, adhesive composition layer is being depressed on PC substrate the adhesive combination for after about 5-20 minutes, making to apply
Object is contacted with polyethylene terephthalate (PET) film of 0.05mm thickness.In sample preparation and then peel test is being set
To keep carrying out after a week in the thermostatic constant wet chamber of 25 DEG C and 50% relative humidity.
The travel speed of shearing and electronic stripping tester is 50mm/ minutes.All data are under 25 DEG C and 60% humidity
Use is with trade name(model LEGEND 2369 is obtained from and is located at Norwood the testing machine of acquisition, MA's
Illinois Tool Works Inc.) measurement.
Keep force test method
Using with 1/2 inch2(3.23cm2) overlapping area and 0.005 inch (0.0127cm) interval the poly- carbonic acid of standard
Ester (PC) lap shear plate is cut into the test sample for retentivity test, and wherein the size of each sample is 1 inch (2.54 lis
Rice) × 4 inches (10.16 centimetres) and 3mm thickness.
Retentivity test by by the PC substrate of the first 3mm thickness and adhesive composition layer pressure to be formed with a thickness of 0.15mm
Adhesive composition film and carry out.Then, make applied adhesive composition in 5-20 minutes on being laminated to PC substrate
It is contacted with the PC substrate of the 2nd 3mm thickness.
Retentivity test is formed in sample and is then protected in the thermostatic constant wet chamber for being set as 25 DEG C and 50% relative humidity
Hold progress after a week after a week.
For test sample, in an oven by each sample vertical hanging.The top surface of each sample is fixed, and bottom surface then loads
1kg weight.Test sample was placed in baking oven for about 1 (one) hour so that adhesive composition is risen to test temperature.Record heating
Time when sample sagging (drop) to bear a heavy burden after to test temperature.
Embodiment 1
In the first exemplary sample, by SIS block copolymer, (SIS 1105 is obtained from ningbo of china in the first step
Grand Petrochemical Co., Ltd.), the first tackifier (SYLVARESTMTP 300 is obtained from KRATON Corp.,
The terpene phenolic resin of Houston, TX), the second tackifier (LUHOREZTMM90, the Luhua Hongjin obtained from Chinese Zibo
New Material Co.) and cycloalkanes oil form plasticizer (KN4010, obtained from be located at Hangzhou China Fuda
Petrochemical Co., Ltd) it combines in a reservoir.The component of the container combined in the first step is maintained at about 100-
At a temperature of about 200 DEG C, while subassembly will be organized.It when component mixes in a reservoir, is vacuumized inside container, and makes container
Interior pressure is maintained at less than or equal under -0.9MPa about 2-3 hours relative to atmospheric pressure.It, will at the end of first step
The component combined in the first step is cooled to about 130 DEG C of about 80- of temperature.
After the first step, in the second step by MDI (44C Fused is obtained from Germany
The Covestro of Leverkusen) and catalyst 2,2'- dimorpholino diethyl ether (DMDEE is obtained from
The HUNSTMAN of The Woodlands, TX) it is added in the component combined in a reservoir in the first step.In second step
The component of container in second step is maintained at a temperature of about 130 DEG C of about 80- by period.When component mixing, inside container
It vacuumizes, and the pressure in container is made to be maintained at less than or equal under -0.9MPa about 0.5- about 2 hours relative to atmospheric pressure.
At the end of second step, hot melt pressure sensitive adhesive is made.Table 1 shows the weight of the component of the first exemplary sample-sample A2
Measure (in gram, being listed in Table 1) and various test parameters.
The first contrast sample is prepared to be compared with sample A2.The component for being used to form the first comparative example is shown in
In table 1, and the entitled sample A1 of the sample.The usually used step identical as sample A2 is used to prepare prepares sample
A1.However, not adding MDI in step 2 to form sample A1.
Embodiment 2
In the second exemplary embodiment, come using the step identical as being used to be formed the hot melt pressure sensitive adhesive of sample A2
Prepare sample B2.However, SIS block copolymer (is obtained by the SIS copolymer obtained with ProductName SIS 1126 in sample B2
From the Grand Petrochemical Co., Ltd. of ningbo of china) it replaces, and the first tackifying resin is by with trade name
SYLVARESTMThe resin (being obtained from KRATON, Corp., Houston, TX) that TP 96 is obtained replaces.The amount of component in sample B2
It is shown in table 1 together with various test parameters.
The second contrast sample is prepared compared with sample B2.First comparative example is included in table 1, entitled sample
B1.Sample B1 is prepared using the step identical as being used to prepare sample B2.However, not adding MDI to form sample B1.For
The amount for preparing the component of sample B1 is included in table 1.
Embodiment 3
In third exemplary embodiment, step identical with being used to be formed the hot melt pressure sensitive adhesive of sample A2 and B2 is used
It is rapid to prepare sample C2.However, SIS block copolymer (is obtained by the SIS copolymer obtained with ProductName D1124 in sample C2
It is replaced from KRATON, Corp., Houston, TX), and the first tackifying resin is by with trade name SYLVARESTMTP 105 is obtained
Resin (be obtained from KRATON, Corp., Houston, TX) replace.The amount of component in sample C2 is aobvious together with various test parameters
Show in table 1.
Third contrast sample is prepared compared with sample C2.Third comparative example is included in table 1, entitled sample
C1.Sample C1 is prepared using the step identical as being used to prepare sample C2.However, not adding MDI to form sample C1.For
The amount for preparing the component of sample C1 is included in table 1.
As shown in table 1, by sample A2 compared with sample A1, by sample B2 compared with B1 and by sample C2 compared with C1,
The peel strength that MDI makes peel strength be increased to above the corresponding contrast sample without MDI is added.As shown,
In sample A2, peel strength is than the sample A1 high without MDI more than 6 times.Also show to be higher than in exemplary embodiment do not have
There is the shear strength of the corresponding contrast sample of MDI to increase.In some embodiments (such as sample B2 and sample C2), MDI is added
Shear strength is caused to increase about four times higher than the corresponding contrast sample without MDI.
Fig. 1 is the figure for showing the retention time of sample included in table 1 at various temperatures.As shown in Figure 1 and such as table 1
As indicating, at 40 DEG C, the retention time 2 of sample A1, the retention time 4 of sample B1 and sample C1 retention time 6
Respectively less than 1 minute.As shown in figure 1 and table 1, sample A2 is primarily exposed to temperature about 1 hour of about 40 DEG C.About 1 is small at 40 DEG C
Shi Hou, sample A2 do not fail, and temperature is then risen to 60 DEG C.After the thermal history, then about 60 DEG C at a temperature of, sample
The retention time 10 of A2 is about 40 minutes.As shown in figure 1 and table 1, sample C2 is primarily exposed to temperature about 1 hour of about 40 DEG C.
After about 1 hour, temperature is risen to 60 DEG C.At 60 DEG C after about 18 hours, sample C2 does not fail, be then exposed to 75 DEG C compared with
High-temperature.After thermal history before, at 75 DEG C, the retention time 12 of sample C2 is 10 minutes about 4 hours.Such as Fig. 1 and
Shown in table 1, temperature about 1 hour that sample B2 is exposed to about 40 DEG C is then exposed to about 60 DEG C of temperature about 18 hours, then
It is exposed to about 75 DEG C of temperature about 30 hours, is then exposed to about 85 DEG C of temperature about 70 hours, be then exposed to 100 DEG C of temperature
Degree, bonding are not failed.It is then 60 DEG C that is, sample B2 is exposed to 40 DEG C, is then 75 DEG C, is then 85 DEG C and 100 DEG C
Continue at raised temperature.Sample B2 total holding time 14 more than 145 hours after, the bonding of sample B2 is not failed.
As shown in table 1, the amount of the thermoplastic polymer of hot melt pressure sensitive adhesive composition is used to form by adjusting, it is adjustable
Save the tacky or levels of adhesion of adhesive composition before curing and later.It has been observed that working as thermoplastic polymer used
Amount relatively low (such as under about 17% or 18% weight percent) when, can get high viscosity.When melt pressure sensitive bonds
When thermoplastic polymer (such as styrene block copolymer) content higher (for example, about 42 weight %) in agent composition, viscosity
It is horizontal possible lower.For example, comparative sample A2 and C2, wherein C2 has the thermoplastic polymer content more than twice, in some feelings
Under condition, the levels of adhesion in adhesive composition is lower than the adhesive composition with higher amount thermoplastic polymer.Such as sample
Shown in C2, in the adhesive composition with higher amount thermoplastic polymer, adhesive composition solidify after levels of adhesion
It is likely lower than its level before curing.
Also as shown in table 1, by adjusting the amount of MDI in adhesive composition, cohesive strength can be about 3 times high.For example, reading
Shear strength shown in table 1 and peel strength, by comparing sample A2, B2 and C2, it is shown that influence of the MDI to these performances.
It has been generally acknowledged that larger amount of MDI provides higher levels of crosslinking, so that the polymeric web in entire adhesive composition
Network enhances and helps to adjust shearing and peel strength.In addition, when holding under levels of adhesion and raised temperature after solidifying
Between can also be adjusted to required value by finding proper amount of MDI.
The exemplary embodiment discussed can be carry out various modifications and addition is made without departing from the scope of the present invention.For example,
Although above-described embodiment is related to specific feature, the scope of the present invention further includes the embodiment that there is different characteristic to combine
It does not include the embodiment of all features described above.
Claims (20)
1. a kind of hot melt pressure sensitive adhesive composition, it includes:
Isocyanate-terminated compound;
Plasticizer;
Thermoplastic polymer;With
Tackifier,
Wherein at least one of the plasticizer or tackifier contain isocyanate-reactive group.
2. hot melt pressure sensitive adhesive composition according to claim 1, further includes polyurethane curing catalyst.
3. hot melt pressure sensitive adhesive composition according to claim 1 or 2, wherein the isocyanate-terminated chemical combination
Object, plasticizer, thermoplastic polymer and tackifier combination weight percentage be at least 90%, be based on described adhesive composition
Total weight.
4. hot melt pressure sensitive adhesive composition according to claim 1 or 2, wherein the isocyanate-terminated chemical combination
Object, plasticizer, thermoplastic polymer and tackifier combination weight percentage be at least 95%, be based on described adhesive composition
Total weight.
5. hot melt pressure sensitive adhesive composition according to claim 1-4, wherein the hot melt pressure sensitive adhesive
Composition contains not hydroxyl and is first plasticizer of at least one of oil, liquid resin or liquid polymers, and contains
There is the second plasticizer of hydroxyl.
6. hot melt pressure sensitive adhesive composition according to claim 1-5, wherein the plasticizer and tackifier
Contain hydroxyl.
7. hot melt pressure sensitive adhesive composition according to claim 1-6, wherein the tackifier are aliphatic series tree
At least one of rouge, aromatic modified resins, alicyclic resin, hydroxyl modification resin or its hydrogenated form.
8. any one of -7 hot melt pressure sensitive adhesive composition according to claim 1, wherein the thermoplastic polymer is
At least one of polyolefin rich in propylene, the polyolefin rich in butylene or polyolefin rich in ethylene.
9. hot melt pressure sensitive adhesive composition according to claim 1-7, wherein the thermoplastic polymer is
Styrene block copolymer.
10. -9 described in any item hot melt pressure sensitive adhesive compositions according to claim 1, wherein described isocyanate-terminated
Compound be monomeric diisocyanate.
11. -9 described in any item hot melt pressure sensitive adhesive compositions according to claim 1, wherein described isocyanate-terminated
Compound be methylenediphenyl diisocyanates (MDI), hydrogenated methylene diphenyl isocyanates (HMDI), hexa-methylene
Diisocyanate (HDI), isophorone diisocyanate (IPDI), polymeric methylene diphenyl diisocyanate, toluene two are different
Cyanate (TDI), polymethylene polyphenyl diisocyanate, naphthalene diisocyanate (NDI) or polymethylene polyphenyl isocyanic acid
At least one of ester (PAPI).
12. -11 described in any item hot melt pressure sensitive adhesive compositions according to claim 1, comprising in an amount of from about about 20 weight of 5-
Measure % isocyanate-terminated compound, in an amount of from about the thermoplastic polymer of about 40 weight % of 15-, in an amount of from about 10-
The tackifier of about 50 weight % are catalyzed in an amount of from about the plasticizer of about 30 weight % of 15- and the urethane cures of about 0.2 weight %
Agent is all based on the total weight of the hot melt pressure sensitive adhesive composition.
13. a kind of hot melt pressure sensitive adhesive composition, it includes:
The reaction product of following substance:
Isocyanate compound,
Plasticizer, and
Tackifier;And
Thermoplastic polymer,
Wherein at least one of the plasticizer or tackifier are hydroxy-end capped.
14. hot melt pressure sensitive adhesive composition according to claim 13, wherein the hot melt pressure sensitive adhesive composition
It is sticky at room temperature.
15. hot melt pressure sensitive adhesive composition described in 3 or 14 according to claim 1, wherein the tackifier and plasticizer are equal
It is hydroxyl modification, and wherein the hot melt pressure sensitive adhesive composition further includes not the second plasticising by hydroxyl modification
Agent.
16. the described in any item hot melt pressure sensitive adhesive compositions of 3-15 according to claim 1, wherein the melt pressure sensitive bonds
Agent composition about 150 DEG C at a temperature of show viscosity build less than 1%/hour.
17. the described in any item hot melt pressure sensitive adhesive compositions of 3-16 according to claim 1, wherein the melt pressure sensitive bonds
Agent composition has 180 ° of peel strengths of at least 5N/cm (13N/ inches) after hardening.
18. the described in any item hot melt pressure sensitive adhesive compositions of 3-17 according to claim 1, wherein the melt pressure sensitive bonds
Agent composition has at least 23N/cm after hardening2(150N/ inches2) shear strength.
19. the described in any item hot melt pressure sensitive adhesive compositions of 3-18 according to claim 1, wherein the melt pressure sensitive bonds
Agent composition after hardening about one week higher than 40 DEG C at a temperature of retention time be greater than 1 minute.
20. the described in any item hot melt pressure sensitive adhesive compositions of 3-19 according to claim 1, wherein the melt pressure sensitive bonds
Agent composition shows the crosslinking between the component of the hot melt pressure sensitive adhesive composition after hardening.
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Citations (3)
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CN1402743A (en) * | 1999-12-01 | 2003-03-12 | H.B.富勒许可和金融公司 | Improved reactive hot melt adhesive |
US20130284364A1 (en) * | 2010-10-25 | 2013-10-31 | Marysusan Couturier | Adhesives For Construction Materials Such As Tiles |
CN103627362A (en) * | 2013-11-29 | 2014-03-12 | 烟台德邦科技有限公司 | Reactive polyurethane hot melt adhesive and preparation method thereof |
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WO1998030648A1 (en) * | 1997-01-06 | 1998-07-16 | Shell Internationale Research Maatschappij B.V. | Pressure sensitive adhesives comprising thermoplastic polyurethanes |
US20060084755A1 (en) * | 2004-10-19 | 2006-04-20 | Good David J | Reactive hot melt adhesive with block acrylic copolymer |
DE102013004909A1 (en) * | 2013-03-22 | 2014-10-09 | Jowat Ag | New adhesive compositions based on renewable raw materials and their use |
US11530337B2 (en) * | 2015-09-29 | 2022-12-20 | Bando Chemical Industries, Ltd. | Optically transparent pressure-sensitive adhesive sheet, laminate, process for producing laminate, and display device with touch panel |
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CN1402743A (en) * | 1999-12-01 | 2003-03-12 | H.B.富勒许可和金融公司 | Improved reactive hot melt adhesive |
US20130284364A1 (en) * | 2010-10-25 | 2013-10-31 | Marysusan Couturier | Adhesives For Construction Materials Such As Tiles |
CN103627362A (en) * | 2013-11-29 | 2014-03-12 | 烟台德邦科技有限公司 | Reactive polyurethane hot melt adhesive and preparation method thereof |
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