CN110184582A - Mask plate and preparation method thereof and display device - Google Patents
Mask plate and preparation method thereof and display device Download PDFInfo
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- CN110184582A CN110184582A CN201810154770.XA CN201810154770A CN110184582A CN 110184582 A CN110184582 A CN 110184582A CN 201810154770 A CN201810154770 A CN 201810154770A CN 110184582 A CN110184582 A CN 110184582A
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- Prior art keywords
- mask strip
- mask
- welding
- layer
- protective coating
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
- C23C16/042—Coating on selected surface areas, e.g. using masks using masks
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The present invention provides a kind of mask plate and preparation method thereof and display device, which includes: the multiple mask strips of frame and welding on said frame；Each mask strip includes mask strip ontology; the surface of the mask strip ontology includes welding region and non-solder region; the non-solder region is provided with the first protective coating; the first protective coating that non-solder region is arranged in being capable of direct bombardment of the barrier plasma to mask strip body surface; the performance for improving the bombardment of mask strip anti-plasma, extends the service life of mask strip.Simultaneously; welding region is not provided with the first protective coating; to avoid due to the first protective coating heat-conductive characteristic it is poor; the problem of leading to mask strip the welding is not firm; so that mask strip ontology-mask strip ontology in welding; and mask strip ontology-frame directly contacts, and is conducive to heat transfer, improves weld strength.
Description
Technical field
The present invention relates to field of display technology more particularly to a kind of mask plate and preparation method thereof and display devices.
Background technique
Since Organic Light Emitting Diode (Organic Light-Emitting Diode, abbreviation OLED) display unit is easy
By water, oxygen erosion and deteriorate, lead to display device service life reduction.Therefore, it is necessary to improve display device by packaging technology
To the barrier property of extraneous water oxygen.For large scale OLED display, method commonplace at present is to show list in OLED
One layer of inorganic layer is made using chemical vapor deposition (Chemical Vapor Deposition, abbreviation CVD) technique in member, it
Metal or glass cover-plate are fitted on inorganic layer with glue material afterwards, Lai Shixian packaging effect.For the inorganic layer of fabricating patterned,
It is generally necessary to use metal mask platemaking technology.The metal mask version of the prior art is the exposure mask for making invar (Invar) alloy
(sheet) item is stretched on frame (frame) with screen-tensioning machine, and finally mask strip is welded on frame with laser and is made.?
In CVD technique, mask strip can gradually form damage simultaneously due to being chronically exposed under plasma environment, by plasma bombardment
Gradually expand, is not grown so as to cause the service life of mask strip, the equipment for carrying out scale of mass production, the defect meeting in mask strip service life
Dramatically increasing for cost is caused, and seriously affects the production capacity of equipment.Therefore, extend the mask strip service life be one need as early as possible
It solves the problems, such as.
Summary of the invention
In view of this, the present invention provides a kind of mask plate and preparation method thereof and display device, for solving existing cover
Film version leads to damage easy to form because needing to be exposed under plasma environment for a long time, service life low problem.
In order to solve the above technical problems, the present invention provides a kind of mask plate, comprising:
The multiple mask strips of frame and welding on said frame；
Each mask strip includes mask strip ontology, and the surface of the mask strip ontology includes welding region and non-solder
Region, the non-solder region are provided with the first protective coating, and the welding region is not provided with first protective coating.
It preferably, include multiple solder joints on the mask strip ontology, the solder joint is from the mask strip ontology to recessed
Falling into the upper surface formed is the structure that groove lower surface is protrusion, and the welding region includes the groove of the solder joint of the upper surface
At least one of surface and the welding contact surface of lower surface.
Preferably, include the upper layer mask strip and lower layer's mask strip that weld together in the multiple mask strip, it is described on
The groove of the solder joint of the upper surface of the lower surface protrusion and lower layer's mask strip of the solder joint of layer mask strip corresponds；
The welding region of the upper layer mask strip includes: the groove surfaces of the solder joint of upper surface, and, lower surface with
The welding contact surface of lower layer's mask strip contact；
The welding region of lower layer's mask strip includes: the welding contact table of upper surface contacted with upper layer mask strip
Face.
It preferably, include the mask strip of welding on said frame in the multiple mask strip, it is described to be welded on the frame
The welding region of mask strip on frame includes:
The welding contact surface of the solder joint of lower surface and the contact therewith；Alternatively,
Groove surfaces between the convex surfaces and protrusion of the solder joint of lower surface.
Preferably, it is provided with filled layer in the groove of the solder joint of the upper surface of the upper layer mask strip, the filled layer is adopted
With can be melted by burning, and reflectivity is lower than and the material of the reflectivity of the mask strip ontology is formed.
Preferably, the filled layer is formed using metal oxide.
Preferably, the upper table of the first protective coating of the upper surface of the filled layer and the upper surface of the upper layer mask strip
Face maintains an equal level.
Preferably, other regions in addition to welding contact surface of the lower surface of the mask strip are provided with the second guarantor
Coating is protected, the surface roughness of second protective coating is lower than the surface roughness of first protective coating.
Preferably, second protective coating is made of (per) fluoropolymer.
The present invention also provides a kind of production methods of mask plate, comprising:
Frame for making the mask plate and multiple mask strips are provided；
The first protective coating is formed on the surface of the mask strip ontology, the surface of the mask strip ontology includes welding section
Domain and non-solder region；
Remove first protective coating of the welding region；
The mask strip is welded.
Preferably, first protective coating of the welding region is removed using photoetching process.
Preferably, before the step of surface in mask strip ontology forms the first protective coating, further includes:
Multiple solder joints are formed on the mask strip ontology, the solder joint is to be recessed downwards to be formed by the mask strip ontology
Upper surface be groove lower surface be protrusion structure, the welding region include the solder joint of the upper surface groove surfaces and
At least one of welding contact surface of lower surface.
Preferably, the solder joint is to be formed to the mask strip ontology using mechanical force compacting or laser irradiation.
It preferably, include the upper layer mask strip and lower layer's mask strip for needing to weld together, institute in the multiple mask strip
The upper surface groove of the lower surface protrusion and lower layer's mask strip of stating the solder joint of upper layer mask strip corresponds；
The welding region of the upper layer mask strip includes: the groove surfaces of the solder joint of upper surface, and, the need of lower surface
The welding contact surface to be contacted with lower layer's mask strip；
The welding region of lower layer's mask strip includes: that the welding that contacts with upper layer mask strip of the needs of upper surface connects
Touch surface.
It preferably, include needing to weld mask strip on said frame in the multiple mask strip, it is described to need to weld
The welding region of mask strip on said frame includes:
The welding contact surface of the solder joint of lower surface and the contact therewith；Alternatively,
Groove surfaces between the convex surfaces and protrusion of the solder joint of lower surface.
Preferably, after the step of first protective coating of the removal welding region, to the mask strip
Before the step of being welded, further includes:
Filled layer is formed in the groove surfaces of the solder joint of the upper surface of the upper layer mask strip, the filled layer uses energy
Enough materials by the absorptance that laser burning is melted and absorptance is greater than the mask strip ontology are formed.
Preferably, the upper table of the first protective coating of the upper surface of the filled layer and the upper surface of the upper layer mask strip
Face maintains an equal level.
Preferably, after the step of first protective coating of the removal welding region, to the mask strip
Before the step of being welded, further includes:
The second protective coating, institute are formed in other regions in addition to welding contact surface of the lower surface of the mask strip
The surface roughness for stating the second protective coating is lower than the surface roughness of first protective coating.
The present invention also provides a kind of display devices, including the film layer formed using above-mentioned mask plate.
Preferably, the display device is organic LED display panel, and the film layer is in thin-film encapsulation layer
Inorganic layer.
The advantageous effects of the above technical solutions of the present invention are as follows:
The first protective coating is set in the non-solder region on the surface of mask strip ontology, for protecting to mask strip ontology
Shield, direct bombardment of the barrier plasma to mask strip body surface are prolonged with improving the performance of mask strip anti-plasma bombardment
The service life of long mask strip.Meanwhile the welding region on the surface of mask strip ontology is not provided with the first protective coating, to avoid by
It is poor in the first protective coating heat-conductive characteristic, the problem of leading to mask strip the welding is not firm, so that the mask strip ontology-in welding
Mask strip ontology and mask strip ontology-frame directly contact, and are conducive to heat transfer, improve weld strength.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below by institute in the description to the embodiment of the present invention
Attached drawing to be used is needed to be briefly described, it should be apparent that, the accompanying drawings in the following description is only some implementations of the invention
Example, for those of ordinary skill in the art, without any creative labor, can also be according to these attached drawings
Obtain other attached drawings.
Fig. 1 is the top view of the mask plate of one embodiment of the invention；
Fig. 2 is the cross-sectional view of the mask strip of one embodiment of the invention；
Fig. 3 is the flow diagram of the production method of the mask strip of one embodiment of the invention；
Fig. 4 a- Fig. 4 i is the schematic diagram of manufacturing method of the mask strip of the embodiment of the present invention one；
Fig. 5 a- Fig. 5 c is the schematic diagram of manufacturing method of the mask strip of the embodiment of the present invention two.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
Attached drawing, the technical solution of the embodiment of the present invention is clearly and completely described.Obviously, described embodiment is this hair
Bright a part of the embodiment, instead of all the embodiments.Based on described the embodiment of the present invention, ordinary skill
Personnel's every other embodiment obtained, shall fall within the protection scope of the present invention.
For the existing mask plate of solution because needs are exposed under plasma environment for a long time, lead to damage easy to form,
Service life low problem, as depicted in figs. 1 and 2, the embodiment of the invention provides a kind of mask plates, comprising: frame 101 and welding
Multiple mask strips 102 on the frame 101；Each mask strip 102 includes mask strip ontology 1021, the mask strip
The surface of ontology 1021 includes welding region and non-solder region, and the non-solder region is provided with the first protective coating 1022,
The welding region is not provided with first protective coating 1022.
Referring to FIG. 2, on the surface (including upper and lower surfaces) of the mask strip ontology 1021, being provided in Fig. 2
The region of first protective coating 1022 is non-solder region, and the region of not set first protective coating 1022 is welding region, weldering
Connecing region is for mask strip and the welding of other mask strips or mask strip and frame welding.
In the embodiment of the present invention, first protective coating is set in the non-solder region on the surface of mask strip ontology 1021
1022, for being protected to mask strip ontology 1021, direct bombardment of the barrier plasma to mask strip body surface, to change
The performance of kind mask strip anti-plasma bombardment, extends the service life of mask strip.Meanwhile the surface of mask strip ontology 1021
Welding region is not provided with the first protective coating, to avoid due to the first protective coating heat-conductive characteristic it is poor, cause mask strip to be welded
Unstable problem has so that mask strip ontology-mask strip ontology and mask strip ontology-frame directly contact in welding
Conducive to heat transfer, weld strength is improved.
It is found through experiments that, if the welding region in mask strip ontology is also provided with the first protective coating, i.e. mask strip sheet
The first protective coating is all arranged in the surface of body, when being welded after mask strip is completed to stretch, due to the first protective coating
Heat-conductive characteristic it is poor, the welding contact surface of the welding contact surface and mask strip and frame that lead to mask strip and mask strip welds
Connect insufficient, solder joint can be destroyed under lesser pulling force, the problem of not prison welding occur.In order to avoid the problem,
In the embodiment of the present invention, the first protective coating only is set in the non-solder region of mask strip, is not set in the welding region of mask strip
Set the first protective coating, when welding, mask strip ontology directly with mask strip body contacts and mask strip ontology directly and frame
Contact is conducive to sufficient heat transfer when welding, while improving the performance of mask strip anti-plasma bombardment, improves exposure mask
Welding strong degree between item-mask strip and mask strip-frame.
In the embodiment of the present invention, mask strip ontology 1021 can be made of metal or metal alloy, such as invar alloy.
In the embodiment of the present invention, first protective coating 1022 can be nickel-phosphorus alloy (Ni-P) coating, pass through experiment
It proves, Ni-P coating can significantly improve the corrosion resisting property of mask strip ontology.Certainly, first protective coating 1022 can also be with
For other kinds of coating, such as coating of organic material etc..
In the embodiment of the present invention, the frame 101 can be made of metal or metal alloy material.
It in the embodiment of the present invention, in order to weld, needs to include solder joint on mask strip ontology, the number of solder joint is usually more
It is a, to improve the firmness of welding, in addition, multiple solder joints are usually in matrix-style arrangement, to improve the performance of welding.It please join
Embodiment shown in Fig. 1 and 2 is examined, includes multiple solder joints 10211 on mask strip ontology 1021, multiple solder joint 10211 is in 4 rows 4
The matrix-style of column is arranged.
In the embodiment of the present invention, carrying out welding to the mask strip may include following several situations:
Mask strip-two layers of frame welding；And/or
Mask strip-two layers of mask strip welding；And/or
Mask strip-three layers of mask strip-frame welding.
When mask strip and mask strip are welded (including mask strip and two layers of mask strip welding and/or mask strip, mask strip with
Three layers of frame welding), in order to increase the bonding area of mask strip and mask strip, increases weld strength, please refer to Fig. 4 d and Fig. 4 e,
In the embodiment of the present invention, the solder joint 10211 on mask strip ontology 1021 can be set to from the mask strip ontology 1021 to
The upper surface that lower recess is formed is the structure that groove lower surface is protrusion.Fig. 4 d is two welded together of the embodiment of the present invention
The cross-sectional view of upper layer mask strip in a mask strip, Fig. 4 e are in two welded together the mask strip of the embodiment of the present invention
The cross-sectional view of lower layer's mask strip.In the embodiment of the present invention, one in weld together two mask strips is known as upper layer and is covered
Film item (when welding, the mask strip of laser irradiation is upper layer mask strip), another is known as lower layer's mask strip, upper layer mask strip 102a
Solder joint lower surface protrusion and lower layer's mask strip 102b upper surface solder joint groove surfaces correspond, upper layer mask strip
102a and lower layer mask strip 102b are connected together by solder joint.The solder joint of this kind of structure can increase upper layer mask strip under
Bonding area between layer mask strip, while can also the positioning and fixation for mask strip in welding.
It is another to cover with the mask strip that is irradiated with a laser upper when mask strip and mask strip are welded in the embodiment of the present invention
Film item is illustrated for lower, certainly, in some other embodiment of the invention, is also not excluded for, in mask strip and exposure mask
When item welds, the mask strip being irradiated with a laser is under, situation of another mask strip under.Thus, occur in the embodiment of the present invention
Upper layer mask strip, lower layer's mask strip, upper and lower surfaces are for facilitating explanation, but are not limited thereto.
In some other embodiment of the invention, when mask strip and frame welding (including mask strip and two layers of frame
Welding and/or mask strip, mask strip and three layers of frame welding), in order to increase the bonding area of mask strip and frame, to increase weldering
Intensity is connect, the upper surface for the formation that can also set the solder joint on mask strip ontology to being recessed downwards by the mask strip ontology is
Groove lower surface is the structure of protrusion, in addition, can also simultaneously include: to be recessed downwards to be formed by the frame body on frame
Upper surface is the welding spot structure that groove lower surface is protrusion, the weldering of the upper surface of the lower surface protrusion and frame of the solder joint of mask strip
The groove surfaces of point correspond.
In the embodiment of the present invention, when mask strip and when frame welding, with mask strip upper, frame is said for lower
It is bright, it certainly, in some other embodiment of the invention, is also not excluded for, in mask strip and when frame welding, frame is covered upper
Situation of the film item under.Thus, upper layer mask strip, the lower layer's mask strip, upper and lower surfaces occurred in the embodiment of the present invention
It is for facilitating explanation, but is not limited thereto.
It in some embodiments of the invention, may include that the upper layer welded together is covered in multiple mask strips of mask plate
Film item and lower layer's mask strip, protrusion and the upper surface of lower layer's mask strip of the lower surface of the solder joint of the upper layer mask strip
Groove corresponds.
Fig. 4 d is please referred to, the welding region of the upper layer mask strip 102a includes: the recessed of the solder joint 10211 of upper surface
Rooved face, and, (in Fig. 4 d, straight dashed line indicates mask strip to the welding contact surface of lower surface contacted with lower layer mask strip 102b
The line of demarcation with the overlapping region of lower layer mask strip 102b of the lower surface of ontology 1021).
Please refer to Fig. 4 e, the welding region of lower layer's mask strip 102b include: upper surface with upper layer mask strip
102a contact welding contact surface (in Fig. 4 e, straight dashed line indicate mask strip ontology 1021 upper surface with upper layer mask strip
The line of demarcation of the overlapping region of 102a).
From Fig. 4 d, Fig. 4 e as can be seen that since the welding region of upper layer mask strip 102a and lower layer mask strip 102b are equal
Not set first protection figure layer 1022, thus when welding, the mask strip ontology and lower layer mask strip 102b of upper layer mask strip 102a
Mask strip ontology can directly contact, be conducive to sufficient heat transfer, to improve weld strength.In addition, upper layer mask strip
The upper surface groove of the solder joint 10211 of 102a is also not provided with the first protective coating 1022, so that the burning for being conducive to solder joint is melted, into one
Step improves weld strength.
It in some embodiments of the invention, may include welding on said frame in multiple mask strips of mask plate
Mask strip, the welding region of the welding mask strip on said frame include: solder joint lower surface and the frame
Welding contact surface；Alternatively, the groove surfaces between the convex surfaces and protrusion of the solder joint of lower surface.That is, exposure mask
Not set first protective coating of welding contact surface with frame of item, when welding, mask strip ontology can directly be connect with frame
Touching, is conducive to sufficient heat transfer, to improve weld strength.
Still it is illustrated by taking the lower layer mask strip 102b in Fig. 4 e as an example.Lower layer mask strip 102b in Fig. 4 e needs and frame
Frame welding, between the convex surfaces and protrusion of the solder joint 10211 for the lower surface that can be seen that lower layer's mask strip in Fig. 4 e
Groove surfaces, not set first protective coating 1022, when welding, the mask strip ontology of lower layer mask strip 102b can directly with
Contact therewith is conducive to sufficient heat transfer, to improve weld strength.
Please referring to Fig. 5 a, Fig. 5 a is the cross-sectional view of lower layer's mask strip in another embodiment of the present invention, in the embodiment, under
Layer mask strip 102b needs and frame welding, it can be seen from Fig. 5a that, on the lower surface of lower layer mask strip 102b, only solder joint
10211 are not provided with the first protective coating 1022 with the welding contact surface of frame, and other positions are respectively provided with the first protective coating, should
Kind structure can preferably protect mask strip.
Please refer to Fig. 4 f, in some embodiments of the present invention, the upper surface of the solder joint 10211 of the upper layer mask strip 102a
Filled layer 1023 is additionally provided in groove, filled layer described in the filled layer 1023, which uses to be burnt by laser, melt, and absorptance
Material greater than the absorptance of the mask strip ontology 1021 is formed.Since the absorptance of filled layer 1023 is high, thus extinction energy
Power is strong, can farthest absorb and be converted to heat for the laser being radiated on mask strip solder joint, avoid due to mask strip
Body surface reflects and makes energy loss, is conducive to the melting and welding of the solder joint of mask strip.
In the embodiment of the present invention, it is preferable that the filled layer 1023 is formed using metal oxide, and metal oxide can
Melted by laser burning, and absorptance is excellent.Metal oxide can be vanadium oxide, tungsten oxide, iron oxide, tellurium oxide, bismuth oxide, oxygen
Change one of zirconium and zinc oxide or a variety of combinations.
In the embodiment of the present invention, it is preferable that the upper surface of the upper surface of the filled layer 1023 and the upper layer mask strip
The first protective coating upper surface maintain an equal level so that the upper surface of upper layer mask strip 102a is more smooth.
In the embodiment of the present invention, after the first protective coating is made in mask strip, the material based on the first protective coating
Limitation, the roughness on mask strip surface are not effectively improved, and the risk for scratching film layer on substrate still remains.In order to gram
The problem is taken, in the embodiment of the present invention, it is preferable that other areas in addition to welding contact surface of the lower surface of the mask strip
Domain is provided with the second protective coating, and the surface roughness of second protective coating is lower than the surface of first protective coating
Roughness.
It should be noted that welding contact surface described in the embodiment of the present invention refers to the area directly contacted when welding
Domain.
Fig. 4 f is please referred to, other regions in addition to welding contact surface of the upper layer lower surface mask strip 102a are provided with
Two protective coatings 1024, in the lower surface of upper layer mask strip 102a, the region of the second protective coating 1024 covering and the first protection
The region that coating 1022 covers is identical, since the surface roughness of the second protective coating is lower, thus upper layer exposure mask can be improved
The smoothness of the lower surface of 102a, avoids causing the scratch to the film layer on substrate because of mask strip rough surface.
Fig. 4 g is please referred to, other regions in addition to welding contact surface of the lower surface lower layer mask strip 102b are provided with
Two protective coatings 1024, the lower surface of the second protective coating 1024 and the lower surface of solder joint 10211 maintain an equal level.Since the second protection applies
The surface roughness of layer is lower, thus the smoothness of the lower surface of lower layer mask strip 102b can be improved, and avoids because of mask strip table
Face is coarse and causes the scratch to the film layer on substrate.
In the embodiment of the present invention, it is preferable that second protective coating is made of (per) fluoropolymer, (per) fluoropolymer system
At coating have smooth surface.The (per) fluoropolymer can be polytetrafluoroethylene (PTFE), perfluoroalkoxy resin, perfluor (2,2-
Dimethyl) in -1,3- dioxole, poly- hexafluoro-isobutene, polyhexafluoropropylene and tetrafluoraoethylene-hexafluoropropylene copolymer
One or more of combinations.
The embodiment of the present invention also provides a kind of display device, including what is formed using the mask plate in any of the above-described embodiment
Film layer.
In some currently preferred embodiments of the present invention, the display device is organic LED display panel, described
Film layer is the inorganic layer in thin-film encapsulation layer.
Based on the same inventive concept, referring to FIG. 3, the embodiment of the present invention also provides a kind of production method of mask plate, packet
It includes:
Step 11: the frame for making the mask plate and multiple mask strips are provided；
Step 12: forming the first protective coating, the surface packet of the mask strip ontology on the surface of the mask strip ontology
Include welding region and non-solder region；
Step 13: removing first protective coating of the welding region；
Step 14: the mask strip is welded.
In above-mentioned steps 12, first can be formed on the surface of the mask strip ontology using coating (Coating) technique
Protective coating.
In above-mentioned steps 13, first protective coating of the welding region can be removed using photoetching process.
In above-mentioned steps 14, carrying out welding to the mask strip may include following several situations:
Mask strip-two layers of frame welding；And/or
Mask strip-two layers of mask strip welding；And/or
Mask strip-three layers of mask strip-frame welding.
In the embodiment of the present invention, before the step of surface in mask strip ontology forms the first protective coating, may be used also
To include: to form multiple solder joints on the mask strip ontology, the solder joint is to be recessed downwards to be formed by the mask strip ontology
Upper surface be groove lower surface be protrusion structure, the welding region include the solder joint of the upper surface groove surfaces and
At least one of welding contact surface of lower surface.
Preferably, the solder joint is to be formed to the mask strip ontology using mechanical force compacting or laser irradiation.
It in some embodiments of the invention, include the upper layer mask strip for needing to weld together in the multiple mask strip
With lower layer's mask strip, the upper surface groove of the lower surface protrusion of the solder joint of the upper layer mask strip and lower layer's mask strip is one by one
It is corresponding；
The welding region of the upper layer mask strip includes: the groove surfaces of the solder joint of upper surface, and, mask strip ontology
Lower surface the welding contact surface that is contacted with lower layer mask strip of needs；
The welding region of lower layer's mask strip includes: the needs and upper layer mask strip of the upper surface of mask strip ontology
The welding contact surface of contact.
It in some embodiments of the invention, include needing to weld exposure mask on said frame in the multiple mask strip
Item, the welding region for needing the mask strip of welding on said frame include:
The welding contact surface of the needs and the contact therewith of the lower surface of solder joint；Alternatively,
The lower surface protrusion of solder joint, and, the groove between the protrusion of the solder joint of lower surface.
In some embodiments of the invention, the step of first protective coating of the removal welding region it
It afterwards, before the step of being welded to the mask strip, can be with further include: the solder joint in the upper surface of the upper layer mask strip
Filled layer is formed in groove surfaces, the filled layer, which uses, to be melted by laser burning and absorptance is greater than the mask strip ontology
The material of absorptance is formed.
Preferably, the filled layer is formed using metal oxide.
Preferably, the upper table of the first protective coating of the upper surface of the filled layer and the upper surface of the upper layer mask strip
Face maintains an equal level.
It, can be using silk-screen, inkjet printing or dispensing (Dispenser) technique in upper layer mask strip in the embodiment of the present invention
Upper surface solder joint groove surfaces in make filled layer.
In some embodiments of the invention, the step of first protective coating of the removal welding region it
Afterwards, before the step of being welded to the mask strip, further includes: in the lower surface of the mask strip except welding contact surface
Except other regions form the second protective coating, the surface roughness of second protective coating is applied lower than first protection
The surface roughness of layer.
In the embodiment of the present invention, the second protective coating can be formed using techniques such as coating, inkjet printings.
Combined with specific embodiments below, the production method of the mask plate of the embodiment of the present invention is described in detail.
Embodiment one:
In the embodiment of the present invention, by taking mask strip-three layers of mask strip-frame welding as an example, to covering in the embodiment of the present invention
The production method of film version is illustrated, the production method the following steps are included:
Step 21: please referring to Fig. 4 a and 4b, suppressed using mechanical force or use laser irradiation, in mask strip ontology 1021
The multiple solder joints 10211 of upper production, multiple solder joints 10211 are arranged in matrix-style, solder joint 10211 for from the mask strip ontology to
The upper surface that lower recess is formed is groove, and lower surface is the structure of protrusion.
Mask strip in this step includes upper layer mask strip and lower layer's mask strip.
Step 22: please referring to Fig. 4 c, make the first protective coating in the upper and lower surfaces of mask strip ontology 1021
1022；
First protective coating 1022 can be Ni-P coating, and Ni-P coating can use nickel sulfate, sodium hypophosphite
And other auxiliary elements prepare suitable concentration chemical plating fluid, using plated film technique mask strip body surface deposit and
At.
Step 23: by photoetching process, the first protective coating 1022 of the welding region of mask strip being removed.
It please refers to Fig. 4 d and removes the welding of protective coating when mask strip being welding positioned at the upper layer mask strip 42a on upper layer
Region include: upper surface solder joint groove surfaces and lower surface welding when the welding contact table that needs to contact with lower layer mask strip
Face；
It please refers to Fig. 4 e and removes the welding of protective coating when mask strip being welding positioned at the lower layer mask strip 42b of lower layer
The welding contact surface for needing to contact with upper layer mask strip when region includes: the welding of upper surface, and, the solder joint of lower surface
Groove surfaces between convex surfaces and protrusion.
Step 24: Fig. 4 f is please referred to, using one of silk-screen, inkjet printing or gluing process, in upper layer mask strip 42a
Solder joint groove in the strong filled layer 1023 of production light absorptive.Filled layer 1023 can be made of metal oxide, filled layer
1023 upper surface keeps maintaining an equal level with the upper surface of the film layer outside solder joint groove.
Step 25: using InkJet printing processes mask strip lower surface make the second protective coating 1024, described second
Protective coating 1024 can be formed using (per) fluoropolymer.
Fig. 4 f is please referred to, when mask strip being welding positioned at the upper layer mask strip 42a on upper layer, the mask strip 42a on upper layer
Other regions in addition to the welding contact area contacted with lower layer mask strip 42b of lower surface form the second protective coating.That is,
The edge of second protective coating of the lower surface of upper layer mask strip 42a is overlapping with upper layer mask strip 42a's and lower layer mask strip 42b
The boundary in region is consistent, i.e., covers in overlapping region without the second protective coating.
Fig. 4 g is please referred to, when mask strip being welding positioned at the lower layer mask strip 42b of lower layer, lower layer mask strip 42b's
Other regions in addition to the welding contact area with contact therewith of lower surface form the second protective coating.That is, lower layer's exposure mask
The lower surface of 42b, other than the welding contact area with contact therewith, other regions cover the second protective coating, and
The film thickness of second protective coating is consistent with the height of protrusion of solder joint.
Step 26: please referring to Fig. 4 h and 4i, stretched the mask strip for completing above-mentioned technique with screen-tensioning machine, from the bottom up
Stack gradually frame (frame) (not shown go out), lower layer mask strip 42b and upper layer mask strip 42a.Wherein, upper layer mask strip 42a
The lower surface protrusion of solder joint be bonded with the close contact of the upper surface groove part of the solder joint of lower layer mask strip.It is shone with laser light source
Solder joint is penetrated, by solder joint melting, welding.
Fig. 4 h is the cross-sectional view of lower layer's mask strip 42b and the upper layer overlapping region mask strip 42a, and Fig. 4 i is that mask strip is not weighing
The cross-sectional view in folded region.
The mask plate of production method production provided in an embodiment of the present invention, has the advantage that
(1) metal part of frame, lower layer's mask strip and upper layer mask strip can be contacted directly, be conducive to heat transfer, and
Material of the same race can form stronger welding；
(2) the strong metal oxide of absorbing ability is filled in the solder joint groove of upper layer mask strip, can will be radiated at exposure mask
Laser on solder joint is converted to heat to the greatest extent, avoids due to mask strip surface reflection and loss of energy；
(3) contact of the groove of solder joint with bulge-structure can increase the bonding area between upper layer and lower layer mask strip, from
And increase weld strength；
(4) mask strip lower surface makes perfluoropolymer, can form smooth surface, avoid due to mask strip surface
It is coarse and cause the scratch to substrate surface film layer.
Embodiment two:
In the embodiment of the present invention, still by taking mask strip-three layers of mask strip-frame welding as an example, in the embodiment of the present invention
The production method of mask plate is illustrated, the production method the following steps are included:
Step 31: can equally please refer to Fig. 4 a and 4b, be suppressed using mechanical force or use laser irradiation, in mask strip sheet
Multiple solder joints 10211 are made on body 1021, multiple solder joints 10211 are arranged in matrix-style, and solder joint 10211 is by the mask strip
The be recessed downwards upper surface of formation of ontology is groove, and lower surface is the structure of protrusion.
Mask strip in this step includes upper layer mask strip and lower layer's mask strip.
Step 32: please referring to Fig. 4 c, make the first protective coating in the upper and lower surfaces of mask strip ontology 1021
1022；
First protective coating 1022 can be Ni-P coating, and Ni-P coating can use nickel sulfate, sodium hypophosphite
And other auxiliary elements prepare suitable concentration chemical plating fluid, using plated film technique mask strip body surface deposit and
At.
Step 33: by photoetching process, the first protective coating 1022 of the welding region of mask strip being removed.
It please refers to Fig. 4 d and removes the welding of protective coating when mask strip being welding positioned at the upper layer mask strip 42a on upper layer
Region include: upper surface solder joint groove surfaces and lower surface welding when the welding contact table that needs to contact with lower layer mask strip
Face；
It please refers to Fig. 5 a and removes the welding of protective coating when mask strip being welding positioned at the lower layer mask strip 42b of lower layer
The welding contact surface that contacts with upper layer mask strip is needed when region includes: the welding of upper surface, and, when the welding of lower surface
It needs and the welding contact surface of contact therewith (this puts different with embodiment one).
Step 34: Fig. 4 f is please referred to, using one of silk-screen, inkjet printing or gluing process, in upper layer mask strip 42a
Solder joint groove in the strong filled layer 1023 of production light absorptive.Filled layer 1023 can be made of metal oxide, filled layer
1023 upper surface keeps maintaining an equal level with the upper surface of the film layer outside solder joint groove.
Step 25: making the second protective coating, second protection in the lower surface of mask strip using InkJet printing processes
Coating can be formed using (per) fluoropolymer.
Fig. 4 f is please referred to, when mask strip being welding positioned at the upper layer mask strip 42a on upper layer, the mask strip 42a on upper layer
Other regions in addition to the welding contact area contacted with lower layer mask strip 42b of lower surface form the second protective coating.That is,
The edge of second protective coating of the lower surface of upper layer mask strip 42a is overlapping with upper layer mask strip 42a's and lower layer mask strip 42b
The boundary in region is consistent, i.e., covers in overlapping region without the second protective coating.
Fig. 5 b is please referred to, when mask strip being welding positioned at the lower layer mask strip 42b of lower layer, lower layer mask strip 42b's
Other regions in addition to the welding contact area with contact therewith of lower surface form the second protective coating.That is, lower layer's exposure mask
The lower surface of 42b, other than the welding contact area with contact therewith, other regions cover the second protective coating, and
The film thickness of second protective coating is consistent with the height of protrusion of solder joint.
Step 36: please referring to Fig. 5 c, stretched the mask strip for completing above-mentioned technique with screen-tensioning machine, from the bottom up successively
Stack frame (frame) (not shown go out), lower layer mask strip 42b and upper layer mask strip 42a.Wherein, the weldering of upper layer mask strip 42a
The upper surface groove part of the solder joint of the lower surface protrusion and lower layer mask strip of point, which is in close contact, to be bonded.It is irradiated and is welded with laser light source
Point, by solder joint melting, welding.
Fig. 5 c is the cross-sectional view of lower layer's mask strip 42b and the upper layer overlapping region mask strip 42a, and mask strip is in underlapped region
Cross-sectional view please refer to Fig. 4 i.
Unless otherwise defined, technical term or scientific term used in the present invention are should be in fields of the present invention
The ordinary meaning that personage with general technical ability is understood." first ", " second " used in the present invention and similar word
It is not offered as any sequence, quantity or importance, and is used only to distinguish different component parts.Equally, "one" or
The similar word such as " one " does not indicate that quantity limits yet, but indicates that there are at least one." connection " or " connected " etc. are similar
Word is not limited to physics or mechanical connection, but may include electrical connection, it is either direct or between
It connects."upper", "lower", "left", "right" etc. are only used for indicating relative positional relationship, when the absolute position for being described object changes
Afterwards, then the relative positional relationship also correspondingly changes.
The above is a preferred embodiment of the present invention, it is noted that for those skilled in the art
For, without departing from the principles of the present invention, it can also make several improvements and retouch, these improvements and modifications
It should be regarded as protection scope of the present invention.
Claims (20)
1. a kind of mask plate characterized by comprising
The multiple mask strips of frame and welding on said frame；
Each mask strip includes mask strip ontology, and the surface of the mask strip ontology includes welding region and non-solder area
Domain, the non-solder region are provided with the first protective coating, and the welding region is not provided with first protective coating.
2. mask plate according to claim 1, which is characterized in that it include multiple solder joints on the mask strip ontology, it is described
Solder joint be by the mask strip ontology be recessed downwards formation upper surface be groove lower surface be protrusion structure, the welding section
Domain includes at least one of the groove surfaces of the solder joint of the upper surface and the welding contact surface of lower surface.
3. mask plate according to claim 2, which is characterized in that
It include the upper layer mask strip and lower layer's mask strip welded together, the weldering of the upper layer mask strip in the multiple mask strip
The groove of the solder joint of the upper surface of the lower surface protrusion and lower layer's mask strip of point corresponds；
The welding region of the upper layer mask strip includes: the groove surfaces of the solder joint of upper surface, and, lower surface and lower layer
The welding contact surface of mask strip contact；
The welding region of lower layer's mask strip includes: the welding contact surface of upper surface contacted with upper layer mask strip.
4. mask plate according to claim 2 or 3, which is characterized in that
It include the mask strip of welding on said frame, the mask strip of the welding on said frame in the multiple mask strip
The welding region include:
The welding contact surface of the solder joint of lower surface and the contact therewith；Alternatively,
Groove surfaces between the convex surfaces and protrusion of the solder joint of lower surface.
5. mask plate according to claim 3, which is characterized in that
Filled layer is provided in the groove of the solder joint of the upper surface of the upper layer mask strip, the filled layer, which uses, to be burnt
Melt, and reflectivity is lower than and the material of the reflectivity of the mask strip ontology is formed.
6. mask plate according to claim 5, which is characterized in that the filled layer is formed using metal oxide.
7. mask plate according to claim 5, which is characterized in that the upper surface of the filled layer and the upper layer mask strip
Upper surface the first protective coating upper surface maintain an equal level.
8. mask plate according to claim 1, which is characterized in that
Other regions in addition to welding contact surface of the lower surface of the mask strip are provided with the second protective coating, described
The surface roughness of second protective coating is lower than the surface roughness of first protective coating.
9. mask plate according to claim 8, which is characterized in that second protective coating uses (per) fluoropolymer system
At.
10. a kind of production method of mask plate characterized by comprising
Frame for making the mask plate and multiple mask strips are provided；
The mask strip ontology surface formed the first protective coating, the surface of the mask strip ontology include welding region and
Non-solder region；
Remove first protective coating of the welding region；
The mask strip is welded.
11. the production method of mask plate according to claim 10, which is characterized in that remove the weldering using photoetching process
Connect first protective coating in region.
12. the production method of mask plate according to claim 10, which is characterized in that the surface in mask strip ontology
Before the step of forming the first protective coating, further includes:
Multiple solder joints are formed on the mask strip ontology, the solder joint is the upper of formation that be recessed downwards by the mask strip ontology
Surface is the structure that groove lower surface is protrusion, and the welding region includes the groove surfaces and following table of the solder joint of the upper surface
At least one of the welding contact surface in face.
13. the production method of mask plate according to claim 12, which is characterized in that the solder joint is to the mask strip
Ontology is suppressed using mechanical force or laser irradiation is formed.
14. the production method of mask plate according to claim 12, which is characterized in that
It include the upper layer mask strip and lower layer's mask strip for needing to weld together, the upper layer mask strip in the multiple mask strip
Solder joint lower surface protrusion and lower layer's mask strip upper surface groove correspond；
The welding region of the upper layer mask strip includes: the groove surfaces of the solder joint of upper surface, and, the needs of lower surface with
The welding contact surface of lower layer's mask strip contact；
The welding region of lower layer's mask strip includes: the welding contact table that the needs of upper surface are contacted with upper layer mask strip
Face.
15. the production method of mask plate described in 2 or 14 according to claim 1, which is characterized in that
It include needing to weld mask strip on said frame in the multiple mask strip, the needs welding is on said frame
The welding region of mask strip include:
The welding contact surface of the solder joint of lower surface and the contact therewith；Alternatively,
Groove surfaces between the convex surfaces and protrusion of the solder joint of lower surface.
16. the production method of mask plate according to claim 14, which is characterized in that the removal welding region
After the step of first protective coating, before the step of being welded to the mask strip, further includes:
Filled layer is formed in the groove of the solder joint of the upper surface of the upper layer mask strip, the filled layer uses can be by laser
The material for the absorptance that burning is melted and absorptance is greater than the mask strip ontology is formed.
17. the production method of mask plate according to claim 16, which is characterized in that the upper surface of the filled layer and institute
The upper surface for stating the first protective coating of the upper surface of upper layer mask strip maintains an equal level.
18. the production method of mask plate according to claim 10, which is characterized in that the removal welding region
After the step of first protective coating, before the step of being welded to the mask strip, further includes:
The second protective coating is formed in other regions of the lower surface of the mask strip in addition to weld contact surface, described the
The surface roughness of two protective coatings is lower than the surface roughness of first protective coating.
19. a kind of display device, which is characterized in that including using as the described in any item mask plates of claim 1-9 are formed
Film layer.
20. display device according to claim 19, which is characterized in that the display device is aobvious for Organic Light Emitting Diode
Show panel, the film layer is the inorganic layer in thin-film encapsulation layer.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810154770.XA CN110184582B (en) | 2018-02-23 | 2018-02-23 | Mask plate, manufacturing method thereof and display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810154770.XA CN110184582B (en) | 2018-02-23 | 2018-02-23 | Mask plate, manufacturing method thereof and display device |
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| CN110184582B CN110184582B (en) | 2021-09-14 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104894534A (en) * | 2015-06-26 | 2015-09-09 | 京东方科技集团股份有限公司 | Vapor deposition equipment |
| CN105839051A (en) * | 2016-05-09 | 2016-08-10 | 京东方科技集团股份有限公司 | Masking plate, manufacturing method thereof, OLED display substrate and display device |
| US20160369392A1 (en) * | 2015-06-19 | 2016-12-22 | Samsung Display Co., Ltd. | Mask frame assembly and method of manufacturing the same |
| CN205856592U (en) * | 2016-08-08 | 2017-01-04 | 合肥鑫晟光电科技有限公司 | Mask plate and evaporation coating device |
| JP6256000B2 (en) * | 2013-12-27 | 2018-01-10 | 大日本印刷株式会社 | Method for manufacturing vapor deposition mask device |
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2018
- 2018-02-23 CN CN201810154770.XA patent/CN110184582B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6256000B2 (en) * | 2013-12-27 | 2018-01-10 | 大日本印刷株式会社 | Method for manufacturing vapor deposition mask device |
| US20160369392A1 (en) * | 2015-06-19 | 2016-12-22 | Samsung Display Co., Ltd. | Mask frame assembly and method of manufacturing the same |
| CN104894534A (en) * | 2015-06-26 | 2015-09-09 | 京东方科技集团股份有限公司 | Vapor deposition equipment |
| CN105839051A (en) * | 2016-05-09 | 2016-08-10 | 京东方科技集团股份有限公司 | Masking plate, manufacturing method thereof, OLED display substrate and display device |
| CN205856592U (en) * | 2016-08-08 | 2017-01-04 | 合肥鑫晟光电科技有限公司 | Mask plate and evaporation coating device |
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